CN115874080B - Copper-based alloy material and preparation method and application thereof - Google Patents
Copper-based alloy material and preparation method and application thereof Download PDFInfo
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- 239000000956 alloy Substances 0.000 title claims abstract description 191
- 239000010949 copper Substances 0.000 title claims abstract description 113
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 86
- 229910052802 copper Inorganic materials 0.000 title claims abstract description 86
- 238000002360 preparation method Methods 0.000 title claims abstract description 20
- 229910045601 alloy Inorganic materials 0.000 claims abstract description 154
- 239000006104 solid solution Substances 0.000 claims abstract description 76
- 238000011282 treatment Methods 0.000 claims abstract description 74
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical group [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims abstract description 71
- 230000032683 aging Effects 0.000 claims abstract description 66
- 239000011135 tin Substances 0.000 claims abstract description 61
- 239000011651 chromium Substances 0.000 claims abstract description 58
- 239000010936 titanium Substances 0.000 claims abstract description 51
- 239000012535 impurity Substances 0.000 claims abstract description 46
- 239000011159 matrix material Substances 0.000 claims abstract description 36
- 229910052718 tin Inorganic materials 0.000 claims abstract description 31
- 229910052719 titanium Inorganic materials 0.000 claims abstract description 24
- 229910052804 chromium Inorganic materials 0.000 claims abstract description 17
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 16
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims abstract description 14
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 14
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims abstract description 9
- 230000003014 reinforcing effect Effects 0.000 claims abstract description 5
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 claims description 54
- 238000003723 Smelting Methods 0.000 claims description 44
- 238000005097 cold rolling Methods 0.000 claims description 39
- 238000000137 annealing Methods 0.000 claims description 32
- 238000000034 method Methods 0.000 claims description 29
- 229910052786 argon Inorganic materials 0.000 claims description 27
- 239000002994 raw material Substances 0.000 claims description 25
- 230000008569 process Effects 0.000 claims description 23
- 230000006698 induction Effects 0.000 claims description 15
- 239000011261 inert gas Substances 0.000 claims description 14
- 229910000881 Cu alloy Inorganic materials 0.000 abstract description 26
- 239000013078 crystal Substances 0.000 abstract description 21
- 150000001875 compounds Chemical class 0.000 abstract description 2
- 229910000599 Cr alloy Inorganic materials 0.000 description 30
- 239000000243 solution Substances 0.000 description 25
- 238000010438 heat treatment Methods 0.000 description 21
- 238000012360 testing method Methods 0.000 description 21
- 238000005204 segregation Methods 0.000 description 20
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 18
- 238000001816 cooling Methods 0.000 description 18
- 238000005728 strengthening Methods 0.000 description 17
- 239000000463 material Substances 0.000 description 15
- 239000000203 mixture Substances 0.000 description 15
- 238000001556 precipitation Methods 0.000 description 12
- 230000000694 effects Effects 0.000 description 11
- 238000005266 casting Methods 0.000 description 10
- 238000005259 measurement Methods 0.000 description 10
- 239000000126 substance Substances 0.000 description 10
- 239000004615 ingredient Substances 0.000 description 9
- 238000000465 moulding Methods 0.000 description 9
- 229910052757 nitrogen Inorganic materials 0.000 description 9
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 9
- 238000010079 rubber tapping Methods 0.000 description 6
- 238000003917 TEM image Methods 0.000 description 4
- 238000009792 diffusion process Methods 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 3
- 230000007423 decrease Effects 0.000 description 3
- 238000007599 discharging Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 229910000831 Steel Inorganic materials 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 229910001209 Low-carbon steel Inorganic materials 0.000 description 1
- 229910001069 Ti alloy Inorganic materials 0.000 description 1
- 238000005275 alloying Methods 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000011362 coarse particle Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- IUYOGGFTLHZHEG-UHFFFAOYSA-N copper titanium Chemical compound [Ti].[Cu] IUYOGGFTLHZHEG-UHFFFAOYSA-N 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 238000007405 data analysis Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000006356 dehydrogenation reaction Methods 0.000 description 1
- 210000001787 dendrite Anatomy 0.000 description 1
- 230000002431 foraging effect Effects 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 229910001092 metal group alloy Inorganic materials 0.000 description 1
- 238000010310 metallurgical process Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 238000012216 screening Methods 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 238000005482 strain hardening Methods 0.000 description 1
- 230000035882 stress Effects 0.000 description 1
- 230000002195 synergetic effect Effects 0.000 description 1
- 239000011573 trace mineral Substances 0.000 description 1
- 235000013619 trace mineral Nutrition 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
Abstract
The invention discloses a copper-based alloy material, a preparation method and application thereof, wherein the matrix phase is copper; the reinforcing phase is nickel, tin, chromium and titanium; the titanium content is 0.35-0.75% and the ratio of nickel, tin and chromium is 10:9:3; cr is more than or equal to 0.3 percent and Sn is more than or equal to 0 percent and Ni is more than or equal to 1 percent; specifically, the alloy comprises, by mass, 1% of Ni,0.9% of Sn,0.35% -0.75% of Ti,0.3% of Cr, and the balance of Cu and unavoidable impurities; according to the invention, one or more other alloy elements are added into a copper matrix in a solid solution mode to form a supersaturated solid solution, the alloy elements dissolved in the copper matrix are combined with the matrix through aging treatment and are separated out in a compound mode, so that the copper matrix is reinforced, and the strength and the conductivity of the copper alloy are improved through dislocation and crystal boundaries.
Description
Technical Field
The invention belongs to the technical field of metal alloy materials, and particularly relates to a copper-based alloy material, a preparation method and application thereof.
Background
The copper alloy has high electrical conductivity and thermal conductivity, excellent corrosion resistance and good mechanical properties, and is widely applied to the fields of machinery, electronic industry, electromagnetic relay, lead frame and the like. The high-strength copper alloy is mainly used for manufacturing various precise instruments and meters and mechanical manufactured articles, and is widely applied to the fields of automobiles, aviation, aerospace, instruments and meters, electric power and the like.
Although pure copper has good conductivity, the pure copper has too low hardness and strength to be directly used as a material of precise instruments and/or precise mechanical parts. Therefore, the alloy is formed by adding certain trace elements to achieve the performance required by the materials of precise instruments and meters and/or precise mechanical parts, and the strengthening mechanism of the copper alloy mainly comprises solid solution strengthening, fine crystal strengthening, deformation strengthening and precipitation strengthening. However, the copper-based alloy material prepared at present still can not meet the requirements of conductivity and high strength at the same time, and the application of the copper-based alloy material is limited.
Disclosure of Invention
In view of the above, the invention provides a copper-based alloy material, a preparation method and application thereof, which improve the performance of the copper alloy by adding alloy elements and performing solution aging treatment, and finally lead the alloy to have high strength and higher conductivity.
The invention adopts the following technical proposal to achieve the technical purpose:
first aspect:
a copper-based alloy material, the matrix phase of which is copper; the reinforcing phase is nickel, tin, chromium and titanium; the titanium content is 0.35-0.75% and the sum of the nickel, tin and chromium content is 2.2%; and Cr is more than or equal to 0.3 percent and Sn is more than or equal to 0 percent and Ni is more than or equal to 1 percent. The inventors found that when the ratio of nickel, tin and chromium is 10:9:3, and 0.3% Cr < Sn < Ni < 1%, the alloy strength is highest, and below or above this value, the mechanical properties are reduced, probably due to the fact that the three elements of nickel, tin and chromium have a certain synergistic effect in improving the alloy strength.
As a further preferred, it comprises, in mass%, 1% Ni,0.9% Sn,0.35% to 0.75% Ti,0.3% Cr, and the balance Cu and unavoidable impurities.
As a further preferred, it comprises, in mass%, 1% Ni,0.9% Sn,0.5% Ti,0.3% Cr, the balance Cu and unavoidable impurities. At this ratio of elemental composition, the alloy of the present invention has the most excellent combination of properties.
Second aspect:
a preparation process of a copper-based alloy material comprises the following process steps: preparing raw materials according to a proportion, and then smelting, homogenizing annealing, solid solution, cold rolling and time-efficient treatment are carried out on the raw materials;
the solid solution process is carried out under the protection of inert gas, and the temperature is kept at 960 ℃ for 90min; the aging treatment is carried out under the protection of inert gas, the temperature is firstly increased to 400-550 ℃, then the temperature is kept for 10-120 min, and finally the temperature is cooled to the room temperature along with the furnace.
As a further preference, the smelting is vacuum smelting, and the induction furnace is pumped to a vacuum degree of 6.67 multiplied by 10 -3 Pa, argon is introduced to 0.6atm.
As a further preference, the homogenizing annealing is carried out in a shaft or box resistance furnace.
As a further preferable mode, the raw materials are 99% standard electrolytic copper, pure Ni, pure Sn, cu-33% Ti master alloy and pure Cr.
As a further preferred aspect, the inert gas in the solid solution process is argon; and the inert gas in the aging treatment process is argon.
Third aspect:
the invention provides application of the copper-based alloy material in preparing precise instruments and meters and/or precise mechanical parts.
The term "solution treatment" as used herein refers to a process in which equilibrium transformation is suppressed upon solidification of a solid solution, resulting in a metastable supersaturated solid solution single-phase structure.
The term "homogenizing annealing" as used in the present invention refers to "diffusion annealing" which is an annealing performed in order to improve or eliminate the component non-uniformity formed in the metallurgical process. Diffusion annealing is a process in which the material is kept warm at a suitable heating temperature for a long period of time and then cooled slowly to room temperature. The diffusion annealing is called dehydrogenation annealing in which the harmful gases (mainly hydrogen) that are dissolved in the steel at high temperature are desorbed. Diffusion annealing also allows metals and their alloys to be heated to higher temperatures near or below solidus for long periods of time and cooled at rates that improve or eliminate dendrite segregation in the casting, banding segregation in the rolled stock.
The term "aging treatment" used in the present invention refers to a heat treatment process in which a metal or alloy workpiece (e.g., low carbon steel, etc.) is subjected to solution treatment, quenched from a high temperature or subjected to a certain degree of cold working deformation, and then left at a higher temperature or room temperature to maintain its shape, size, and properties which change with time. Generally, over time, the hardness and strength increase and the plastic toughness and internal stress decrease.
The invention discloses the following technical effects:
the invention aims to improve the strength and the conductivity of copper-based alloys in the prior art. Although the addition of alloying elements is known to theoretically enhance the performance of the alloy in some ways, it is often not desirable due to the combination of factors that may be present during actual production.
The invention takes copper as a matrix element, and the reinforcing phase is nickel, tin, chromium and titanium; according to the invention, through a single factor test and an orthogonal test, data analysis shows that the strength and the conductivity of the copper-based alloy can be improved when the titanium content is 0.35-0.75% and the content ratio of nickel, tin and chromium is 10:9:3, and Cr is more than or equal to 0.3% and less than Sn and less than or equal to 1%. According to the invention, one or more other alloy elements are added into a copper matrix in a solid solution mode to form a supersaturated solid solution, the alloy elements dissolved in the copper matrix are combined with the matrix through aging treatment and are separated out in a compound mode, so that the copper matrix is reinforced, and the mechanical properties of the copper alloy are improved through dislocation and crystal boundaries.
According to the invention, the Ti element is added into the Cu matrix to refine grains and improve alloy strength, the trace Cr element is added to refine a structure and improve high-temperature stability of the alloy, a certain amount of Sn is added to strengthen the dislocation movement resistance of the alloy and improve alloy strength, and the proper Ni element is added to easily form a precipitation phase with Sn and Ti elements to play a role in precipitation strengthening, so that the mechanical property of the alloy is improved. Various metal elements and copper elements are melted, and then annealed and solution treated to obtain a saturated solid solution alloy, wherein lattice distortion can be generated in the process of forming the solid solution to block dislocation movement, so that the alloy has a strengthening effect. According to the invention, factors in various aspects are comprehensively researched, and the properties of the copper alloy are improved by adding alloy elements and performing solution aging treatment through screening and combining the factors, so that the alloy has high strength and high conductivity.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings that are needed in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a flow chart of a preparation method of a Cu-Ni-Sn-Ti-Cr alloy material in an embodiment of the invention;
FIG. 2 is a metallographic microstructure of Cu-Ni-Sn-Ti-Cr alloy in solid solution and aged state according to example 3 of the present invention, wherein (a) is a solid solution state diagram and (b) is an aged state diagram;
FIG. 3 is a TEM image of the Cu-Ni-Sn-Ti-Cr alloy material prepared in example 3 of the present invention; wherein (a) is a TEM image (1 μm) of a Cu-Ni-Sn-Ti-Cr alloy material; (b) Is a TEM image (500 nm) of a Cu-Ni-Sn-Ti-Cr alloy material.
Detailed Description
Various exemplary embodiments of the invention will now be described in detail, which should not be considered as limiting the invention, but rather as more detailed descriptions of certain aspects, features and embodiments of the invention. It is to be understood that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention.
In addition, for numerical ranges in this disclosure, it is understood that each intermediate value between the upper and lower limits of the ranges is also specifically disclosed. Every smaller range between any stated value or stated range, and any other stated value or intermediate value within the stated range, is also encompassed within the invention. The upper and lower limits of these smaller ranges may independently be included or excluded in the range.
Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. Although only preferred methods and materials are described herein, any methods and materials similar or equivalent to those described herein can be used in the practice or testing of the present invention. All documents mentioned in this specification are incorporated by reference for the purpose of disclosing and describing the methods and/or materials associated with the documents. In case of conflict with any incorporated document, the present specification will control.
It will be apparent to those skilled in the art that various modifications and variations can be made in the specific embodiments of the invention described herein without departing from the scope or spirit of the invention. Other embodiments will be apparent to those skilled in the art from consideration of the specification of the present invention. The specification and examples of the present invention are exemplary only.
As used herein, the terms "comprising," "including," "having," "containing," and the like are intended to be inclusive and mean an inclusion, but not limited to.
A copper-based alloy material, the matrix phase of which is copper; the reinforcing phase is nickel, tin, chromium and titanium; the titanium content is 0.35-0.75% and the ratio of nickel, tin and chromium is 10:9:3; and Cr is more than or equal to 0.3 percent and Sn is more than or equal to 0 percent and Ni is more than or equal to 1 percent.
As some embodiments of the invention, the alloy comprises, by mass, 1% of Ni,0.9% of Sn,0.35% -0.75% of Ti,0.3% of Cr, and the balance of Cu and unavoidable impurities (the total content of impurities is less than or equal to 0.06%).
As a further preferred embodiment of the present invention, it comprises, in mass%, 1% of Ni,0.9% of Sn,0.5% of Ti,0.3% of Cr, and the balance Cu and unavoidable impurities (total content of impurities. Ltoreq.0.06%).
A preparation process of a copper-based alloy material comprises the following process steps: preparing raw materials according to a proportion, and then smelting, homogenizing annealing, solid solution, cold rolling and time-efficient treatment are carried out on the raw materials;
the solid solution process is carried out under the protection of inert gas, and the temperature is kept at 960 ℃ for 90min; the aging treatment is carried out under the protection of inert gas, the temperature is firstly increased to 400-550 ℃, then the temperature is kept for 10-120 min, and finally the temperature is cooled to the room temperature along with the furnace.
As some preferred embodiments of the invention, the smelting is vacuum smelting, and the induction furnace is pumped to a vacuum degree of 6.67 multiplied by 10 -3 Pa, argon is introduced to 0.6atm.
As some preferred embodiments of the present invention, the homogenizing annealing and the destressing annealing are performed in a well-type resistance furnace or a box-type resistance furnace.
As some preferred embodiments of the invention, the raw materials are 99% standard electrolytic copper, pure Ni, pure Sn, cu-33% Ti master alloy, pure Cr. In principle, the invention is not particularly limited in the kind of inert gas, as long as the inert gas can be used as a gas which plays a protective role in the solid solution and aging treatment process, and as some preferred embodiments of the invention, the inert gas in the solid solution process is argon; and the inert gas in the aging treatment process is argon.
All the raw materials of the following examples of the present invention are not particularly limited in their sources, and may be purchased on the market or prepared according to conventional methods well known to those skilled in the art.
The technical indexes of the raw materials used in the embodiment of the invention are as follows: copper is standard electrolytic copper with the purity of 99%; nickel blocks with a Ni purity of 99.9%; tin nuggets with a Sn purity of 99.9%; cu-33% Ti master alloy (i.e., a copper-titanium alloy with a Ti content of 33 wt.%); cr has a purity of 99.9% in chromium blocks.
The apparatus used in the embodiment of the invention is as follows:
vacuum intermediate frequency induction furnace: ZG-0.01-40-4;
vacuum heat treatment furnace: KJ-V1200-12LW;
vacuum tube furnace: model number KSS-1200.
Example 1
The chemical composition of the copper alloy provided in this example is: 1% by weight of Ni,0.9% by weight of Sn,0.5% by weight of Ti,0.3% by weight of Cr, and the balance of Cu and unavoidable impurities (total impurity content is not more than 0.06%).
The preparation method of the high-strength high-conductivity Cu-Ni-Sn-Ti-Cr alloy material provided by the embodiment comprises the following steps:
(1) Proportioning materials
The ingredients are mixed according to the following weight proportion: 1% by weight of Ni,0.9% by weight of Sn,0.5% by weight of Ti,0.3% by weight of Cr, and the balance of Cu and unavoidable impurities (the total content of impurities is less than or equal to 0.06%); the raw materials used are: 99% standard electrolytic copper, pure Ni, pure Sn, cu-33% Ti master alloy and pure Cr.
(2) Smelting
Vacuum smelting to vacuum degree of 6.67×10 -3 Pa, adding the raw materials into a vacuum intermediate frequency induction furnace, smelting in the atmosphere of 0.6atm of nitrogen, and discharging at 1300-1350 ℃. After smelting, putting the molten steel into a water-cooled copper crucibleAnd (5) casting and molding to obtain alloy ingots.
(3) Homogenizing annealing
Annealing at 950 ℃ for 4 hours in order to reduce segregation of alloy components; the riser and scale are then machined away.
(4) Solid solution
Solution treatment at a suitable temperature is a key process for obtaining good properties of the alloy. The solid solution temperature is selected on the premise that coarse grains are not generated in the alloy. In order to obtain a good precipitation strengthening effect, and at the same time, the internal segregation of the alloy can be further eliminated, and a proper solid solution temperature is required to be selected. Solid solution test and water cooling are carried out in a vacuum heat treatment furnace at 960 ℃ for 90min, and argon is introduced for protection.
(5) Cold rolling
The cold rolling treatment is carried out, the cold rolling deformation is 60%, the deformation is strengthened to strengthen the matrix, and the oxide skin on the surface of the sample is removed before the cold rolling treatment.
(6) Aging
The aging treatment generally adopts low-solid-solubility alloy elements to dissolve into a copper matrix, and the alloy elements form supersaturated solid solutions in copper through high-temperature solution treatment, so that copper crystal lattices are severely distorted, the strength is improved, and the conductivity is reduced. After aging treatment, most of the alloy elements are separated out from the solid solution to form dispersed precipitated phases, so that the conductivity of the alloy is quickly recovered, and the dispersed phases effectively prevent the sliding of crystal boundaries and dislocation, so that the copper alloy still has higher strength. And (3) carrying out an aging test in a vacuum tube furnace (model: KSS-1200), introducing argon for protection in the whole aging process, heating to 500 ℃, then preserving heat for 10min, and finally cooling to room temperature along with the furnace to obtain the high-strength conductive Cu-Ni-Sn-Ti-Cr alloy.
FIG. 1 is a flow chart of the preparation of Cu-Ni-Sn-Ti-Cr alloy material, and the manufacturing process of the high-strength conductive Cu-Ni-Sn-Ti-Cr alloy material can be clearly seen.
The alloy microhardness, conductivity and strength of this example 1 were measured, and the measurement results are shown in table 1.
Example 2
The chemical composition of the copper alloy provided in this example is: 1% by weight of Ni,0.9% by weight of Sn,0.5% by weight of Ti,0.3% by weight of Cr, and the balance of Cu and unavoidable impurities (total impurity content is not more than 0.06%).
The preparation method of the high-strength conductive Cu-Ni-Sn-Ti-Cr alloy material provided by the embodiment comprises the following steps:
(1) Proportioning materials
The ingredients are mixed according to the following weight proportion: 1% by weight of Ni,0.9% by weight of Sn,0.5% by weight of Ti,0.3% by weight of Cr, and the balance of Cu and unavoidable impurities (total impurity content is not more than 0.06%). The raw materials are 99% standard electrolytic copper, pure Ni, pure Sn, cu-33% Ti intermediate alloy and pure Cr.
(2) Smelting
Vacuum smelting to vacuum degree of 6.67×10 -3 Pa, adding the raw materials into a vacuum intermediate frequency induction furnace, smelting in the atmosphere of 0.6atm of nitrogen, and discharging at 1300-1350 ℃. And after smelting, placing the alloy ingot into a water-cooled copper crucible for casting molding, and obtaining an alloy ingot.
(3) Homogenizing annealing
In order to reduce segregation of alloy components, annealing is carried out for 4 hours at 950 ℃; the riser and scale are then machined away.
(4) Solid solution
Solution treatment at a suitable temperature is a key process for obtaining good properties of the alloy. The solid solution temperature is selected on the premise that coarse grains are not generated in the alloy. In order to obtain a good precipitation strengthening effect, and at the same time, the internal segregation of the alloy can be further eliminated, and a proper solid solution temperature is required to be selected. Solid solution test and water cooling are carried out in a vacuum heat treatment furnace at 960 ℃ for 90min, and argon is introduced for protection.
(5) Cold rolling
The cold rolling treatment is carried out, the cold rolling deformation is 60%, the deformation is strengthened to strengthen the matrix, and the oxide skin on the surface of the sample is removed before the cold rolling treatment.
(6) Aging
The aging treatment generally adopts low-solid-solubility alloy elements to dissolve into a copper matrix, and the alloy elements form supersaturated solid solutions in copper through high-temperature solution treatment, so that copper crystal lattices are severely distorted, the strength is improved, and the conductivity is reduced. After aging treatment, most of the alloy elements are separated out from the solid solution to form dispersed precipitated phases, so that the conductivity of the alloy is quickly recovered, and the dispersed phases effectively prevent the sliding of crystal boundaries and dislocation, so that the copper alloy still has higher strength. And (3) carrying out an aging test in a vacuum tube furnace (model: KSS-1200), introducing argon for protection in the whole aging process, heating to 500 ℃, then preserving heat for 30min, and finally cooling to room temperature along with the furnace to obtain the high-strength conductive Cu-Ni-Sn-Ti-Cr alloy.
The alloy microhardness, conductivity and strength of this example 2 were measured, and the measurement results are shown in table 1.
Example 3
The chemical composition of the copper alloy provided in this example is: 1% by weight of Ni,0.9% by weight of Sn,0.5% by weight of Ti,0.3% by weight of Cr, and the balance of Cu and unavoidable impurities (total impurity content is not more than 0.06%).
The preparation method of the high-strength Cu-Ni-Sn-Ti-Cr alloy material provided by the embodiment comprises the following steps:
(1) Proportioning materials
The ingredients are mixed according to the following weight proportion: 1% by weight of Ni,0.9% by weight of Sn,0.5% by weight of Ti,0.3% by weight of Cr, and the balance of Cu and unavoidable impurities (the total content of impurities is less than or equal to 0.06%); the raw materials used are: 99% standard electrolytic copper, pure Ni, pure Sn, cu-33% Ti master alloy and pure Cr.
(2) Smelting
Vacuum smelting to vacuum degree of 6.67×10 -3 Pa, the raw materials are added into a vacuum intermediate frequency induction furnace, smelting is carried out in the atmosphere of 0.6atm of nitrogen, and the tapping temperature is generally 1300-1350 ℃. And after smelting, placing the alloy ingot into a water-cooled copper crucible for casting molding, and obtaining an alloy ingot.
(3) Homogenizing annealing
In order to reduce segregation of alloy components, annealing is carried out for 4 hours at 950 ℃; the riser and scale are then machined away.
(4) Solid solution
Solution treatment at a suitable temperature is a key process for obtaining good properties of the alloy. The solid solution temperature is selected on the premise that coarse grains are not generated in the alloy. In order to obtain a good precipitation strengthening effect, and at the same time, the internal segregation of the alloy can be further eliminated, and a proper solid solution temperature is required to be selected. Solid solution test and water cooling are carried out in a vacuum heat treatment furnace at 960 ℃ for 90min, and argon is introduced for protection.
(5) Cold rolling
The cold rolling treatment is carried out, the cold rolling deformation is 60%, the deformation is strengthened to strengthen the matrix, and the oxide skin on the surface of the sample is removed before the cold rolling treatment.
(6) Aging
The aging treatment generally adopts low-solid-solubility alloy elements to dissolve into a copper matrix, and the alloy elements form supersaturated solid solutions in copper through high-temperature solution treatment, so that copper crystal lattices are severely distorted, the strength is improved, and the conductivity is reduced. After aging treatment, most of the alloy elements are separated out from the solid solution to form dispersed precipitated phases, so that the conductivity of the alloy is quickly recovered, and the dispersed phases effectively prevent the sliding of crystal boundaries and dislocation, so that the copper alloy still has higher strength. And (3) carrying out an aging test in a vacuum tube furnace (model: KSS-1200), introducing argon for protection in the whole aging process, heating to 500 ℃, then preserving heat for 60min, and finally cooling to room temperature along with the furnace to obtain the high-strength conductive Cu-Ni-Sn-Ti-Cr alloy.
The alloy microhardness, conductivity and strength of this example 3 were measured, and the measurement results are shown in table 1.
Example 4
The chemical composition of the copper alloy provided in this example is: 1% by weight of Ni,0.9% by weight of Sn,0.5% by weight of Ti,0.3% by weight of Cr, and the balance of Cu and unavoidable impurities (total impurity content is not more than 0.06%).
The preparation method of the high-strength Cu-Ni-Sn-Ti-Cr alloy material provided by the embodiment comprises the following steps:
(1) Proportioning materials
The ingredients are mixed according to the following weight proportion: 1% by weight of Ni,0.9% by weight of Sn,0.5% by weight of Ti,0.3% by weight of Cr, and the balance of Cu and unavoidable impurities (the total content of impurities is less than or equal to 0.06%); the raw materials used are: 99% standard electrolytic copper, pure Ni, pure Sn, cu-33% Ti master alloy and pure Cr.
(2) Smelting
Vacuum smelting to vacuum degree of 6.67×10 -3 Pa, the raw materials are added into a vacuum intermediate frequency induction furnace, smelting is carried out in the atmosphere of 0.6atm of nitrogen, and the tapping temperature is generally 1300-1350 ℃. And after smelting, placing the alloy ingot into a water-cooled copper crucible for casting molding, and obtaining an alloy ingot.
(3) Homogenizing annealing
In order to reduce segregation of alloy components, annealing is carried out for 4 hours at 950 ℃; the riser and scale are then machined away.
(4) Solid solution
Solution treatment at a suitable temperature is a key process for obtaining good properties of the alloy. The solid solution temperature is selected on the premise that coarse grains are not generated in the alloy. In order to obtain a good precipitation strengthening effect, and at the same time, the internal segregation of the alloy can be further eliminated, and a proper solid solution temperature is required to be selected. Solid solution test and water cooling are carried out in a vacuum heat treatment furnace at 960 ℃ for 90min, and argon is introduced for protection.
(5) Cold rolling
The cold rolling treatment is carried out, the cold rolling deformation is 60%, the deformation is strengthened to strengthen the matrix, and the oxide skin on the surface of the sample is removed before the cold rolling treatment.
(6) Aging
The aging treatment generally adopts low-solid-solubility alloy elements to dissolve into a copper matrix, and the alloy elements form supersaturated solid solutions in copper through high-temperature solution treatment, so that copper crystal lattices are severely distorted, the strength is improved, and the conductivity is reduced. After aging treatment, most of the alloy elements are separated out from the solid solution to form dispersed precipitated phases, so that the conductivity of the alloy is quickly recovered, and the dispersed phases effectively prevent the sliding of crystal boundaries and dislocation, so that the copper alloy still has higher strength. And (3) carrying out an aging test in a vacuum tube furnace (model: KSS-1200), introducing argon for protection in the whole aging process, heating to 500 ℃, then preserving heat for 120min, and finally cooling to room temperature along with the furnace to obtain the high-strength conductive Cu-Ni-Sn-Ti-Cr alloy.
The alloy microhardness, conductivity and strength of this example 4 were measured, and the measurement results are shown in table 1.
Example 5
The chemical composition of the copper alloy provided in this example is: 1% by weight of Ni,0.9% by weight of Sn,0.5% by weight of Ti,0.3% by weight of Cr, and the balance of Cu and unavoidable impurities (total impurity content is not more than 0.06%).
The preparation method of the high-strength Cu-Ni-Sn-Ti-Cr alloy material provided by the embodiment comprises the following steps:
(1) Proportioning materials
The ingredients are mixed according to the following weight proportion: 1% by weight of Ni,0.9% by weight of Sn,0.5% by weight of Ti,0.3% by weight of Cr, and the balance of Cu and unavoidable impurities (total impurity content is not more than 0.06%). Raw materials: 99% standard electrolytic copper, pure Ni, pure Sn, cu-33% Ti master alloy and pure Cr.
(2) Smelting
Vacuum smelting to vacuum degree of 6.67×10 -3 Pa, the raw materials are added into a vacuum intermediate frequency induction furnace, smelting is carried out in the atmosphere of 0.6atm of nitrogen, and the tapping temperature is generally 1300-1350 ℃. And after smelting, placing the alloy ingot into a water-cooled copper crucible for casting molding, and obtaining an alloy ingot.
(3) Homogenizing annealing
Annealing at 950 ℃ for 4-10 h in order to reduce segregation of alloy components; the riser and scale are then machined away.
(4) Solid solution
Solution treatment at a suitable temperature is a key process for obtaining good properties of the alloy. The solid solution temperature is selected on the premise that the alloy does not generate coarse and coarse particles. In order to obtain a good precipitation strengthening effect, and at the same time, the internal segregation of the alloy can be further eliminated, and a proper solid solution temperature is required to be selected. In the embodiment, solid solution test and water cooling are carried out in a vacuum heat treatment furnace at 960 ℃ for 90min, and argon is introduced for protection.
(5) Cold rolling
The cold rolling treatment is carried out, the cold rolling deformation is 60%, the deformation is strengthened to strengthen the matrix, and the oxide skin on the surface of the sample is removed before the cold rolling treatment.
(6) Aging
The aging treatment generally adopts low-solid-solubility alloy elements to dissolve into a copper matrix, and the alloy elements form supersaturated solid solutions in copper through high-temperature solution treatment, so that copper crystal lattices are severely distorted, the strength is improved, and the conductivity is reduced. After aging treatment, most of the alloy elements are separated out from the solid solution to form dispersed precipitated phases, so that the conductivity of the alloy is quickly recovered, and the dispersed phases effectively prevent the sliding of crystal boundaries and dislocation, so that the copper alloy still has higher strength. And (3) carrying out an aging test in a vacuum tube furnace (model: KSS-1200), introducing argon for protection in the whole aging process, heating to 400 ℃, then preserving heat for 60min, and finally cooling to room temperature along with the furnace to obtain the high-strength conductive Cu-Ni-Sn-Ti-Cr alloy.
The alloy microhardness, conductivity and strength of this example 5 were measured, and the measurement results are shown in table 1.
Example 6
The chemical composition of the copper alloy provided in this example is: 1% by weight of Ni,0.9% by weight of Sn,0.5% by weight of Ti,0.3% by weight of Cr, and the balance of Cu and unavoidable impurities (total impurity content is not more than 0.06%).
The preparation method of the high-strength Cu-Ni-Sn-Ti-Cr alloy material provided by the embodiment comprises the following steps:
(1) Proportioning materials
The ingredients are mixed according to the following weight proportion: 1% by weight of Ni,0.9% by weight of Sn,0.5% by weight of Ti,0.3% by weight of Cr, and the balance of Cu and unavoidable impurities (total impurity content is not more than 0.06%). Raw materials: 99% standard electrolytic copper, pure Ni, pure Sn, cu-33% Ti master alloy and pure Cr.
(2) Smelting
Vacuum smelting to vacuum degree of 6.67×10 -3 Pa, adding the mixture into a vacuum intermediate frequency induction furnace, smelting in the atmosphere of 0.6atm of nitrogen, and discharging at 1300-1350 ℃. And after smelting, placing the alloy ingot into a water-cooled copper crucible for casting molding, and obtaining an alloy ingot.
(3) Homogenizing annealing
Annealing at 950 ℃ for 4 hours in order to reduce segregation of alloy components; the riser and scale are then machined away.
(4) Solid solution
Solution treatment at a suitable temperature is a key process for obtaining good properties of the alloy. The solid solution temperature is selected on the premise that coarse grains are not generated in the alloy. In order to obtain a good precipitation strengthening effect, and at the same time, the internal segregation of the alloy can be further eliminated, and a proper solid solution temperature is required to be selected. Solid solution test and water cooling are carried out in a vacuum heat treatment furnace at 960 ℃ for 90min, and argon is introduced for protection.
(5) Cold rolling
The cold rolling treatment is carried out, the cold rolling deformation is 60%, the deformation is strengthened to strengthen the matrix, and the oxide skin on the surface of the sample is removed before the cold rolling treatment.
(6) Aging
The aging treatment generally adopts low-solid-solubility alloy elements to dissolve into a copper matrix, and the alloy elements form supersaturated solid solutions in copper through high-temperature solution treatment, so that copper crystal lattices are severely distorted, the strength is improved, and the conductivity is reduced. After aging treatment, most of the alloy elements are separated out from the solid solution to form dispersed precipitated phases, so that the conductivity of the alloy is quickly recovered, and the dispersed phases effectively prevent the sliding of crystal boundaries and dislocation, so that the copper alloy still has higher strength. And (3) carrying out an aging test in a vacuum tube furnace (model: KSS-1200), introducing argon for protection in the whole aging process, heating to 450 ℃, then preserving heat for 60min, and finally cooling to room temperature along with the furnace to obtain the high-strength conductive Cu-Ni-Sn-Ti-Cr alloy.
The alloy microhardness, conductivity and strength of this example 6 were measured, and the measurement results are shown in table 1.
Example 7
The chemical composition of the copper alloy provided in this example is: 1% by weight of Ni,0.9% by weight of Sn,0.5% by weight of Ti,0.3% by weight of Cr, and the balance of Cu and unavoidable impurities (total impurity content is not more than 0.06%).
The preparation method of the high-strength Cu-Ni-Sn-Ti-Cr alloy material provided by the embodiment comprises the following steps:
(1) Proportioning materials
The ingredients are mixed according to the following weight proportion: 1% by weight of Ni,0.9% by weight of Sn, 0.75% by weight of Ti,0.3% by weight of Cr, and the balance of Cu and unavoidable impurities (the total content of impurities is less than or equal to 0.06%); the raw materials used are: 99% standard electrolytic copper, pure Ni, pure Sn, cu-33% Ti master alloy and pure Cr.
(2) Smelting
Vacuum smelting to vacuum degree of 6.67×10 -3 Pa, the mixture is added into a vacuum intermediate frequency induction furnace and is smelted in an atmosphere of 0.6atm of nitrogen, and the tapping temperature is generally 1300-1350 ℃. And after smelting, placing the alloy ingot into a water-cooled copper crucible for casting molding, and obtaining an alloy ingot.
(3) Homogenizing annealing
In order to reduce segregation of alloy components, annealing is carried out for 4 hours at 950 ℃; the riser and scale are then machined away.
(4) Solid solution
Solution treatment at a suitable temperature is a key process for obtaining good properties of the alloy. The solid solution temperature is selected on the premise that coarse grains are not generated in the alloy. In order to obtain a good precipitation strengthening effect, and at the same time, the internal segregation of the alloy can be further eliminated, and a proper solid solution temperature is required to be selected. Solid solution test and water cooling are carried out in a vacuum heat treatment furnace at 960 ℃ for 90min, and argon is introduced for protection.
(5) Cold rolling
The cold rolling treatment is carried out, the cold rolling deformation is 60%, the deformation is strengthened to strengthen the matrix, and the oxide skin on the surface of the sample is removed before the cold rolling treatment.
(6) Aging
The aging treatment generally adopts low-solid-solubility alloy elements to dissolve into a copper matrix, and the alloy elements form supersaturated solid solutions in copper through high-temperature solution treatment, so that copper crystal lattices are severely distorted, the strength is improved, and the conductivity is reduced. After aging treatment, most of the alloy elements are separated out from the solid solution to form dispersed precipitated phases, so that the conductivity of the alloy is quickly recovered, and the dispersed phases effectively prevent the sliding of crystal boundaries and dislocation, so that the copper alloy still has higher strength. And (3) carrying out an aging test in a vacuum tube furnace (model: KSS-1200), introducing argon for protection in the whole aging process, heating to 550 ℃, then preserving heat for 60min, and finally cooling to room temperature along with the furnace to obtain the high-strength conductive Cu-Ni-Sn-Ti-Cr alloy.
The alloy microhardness, conductivity and strength of this example 7 were measured, and the measurement results are shown in table 1.
Example 8
The chemical composition of the copper alloy provided in this example is: 1% by weight of Ni,0.9% by weight of Sn,0.35% by weight of Ti,0.3% by weight of Cr, and the balance of Cu and unavoidable impurities (total impurity content is not more than 0.06%).
The preparation method of the high-strength Cu-Ni-Sn-Ti-Cr alloy material provided by the embodiment comprises the following steps:
(1) Proportioning materials
The ingredients are mixed according to the following weight proportion: 1% by weight of Ni,0.9% by weight of Sn,0.35% by weight of Ti,0.3% by weight of Cr, and the balance of Cu and unavoidable impurities (the total content of impurities is less than or equal to 0.06%); the raw materials used are: 99% standard electrolytic copper, pure Ni, pure Sn, cu-33% Ti master alloy and pure Cr.
(2) Smelting
The induction furnace is pumped to a vacuum degree of 6.67'10 < -3 > Pa by adopting a vacuum smelting mode, the vacuum intermediate frequency induction furnace is added, smelting is carried out in the atmosphere of 0.6atm of nitrogen, and the tapping temperature is generally 1300-1350 ℃. And after smelting, placing the alloy ingot into a water-cooled copper crucible for casting molding, and obtaining an alloy ingot.
(3) Homogenizing annealing
In order to reduce segregation of alloy components, annealing is carried out for 4 hours at 950 ℃; the riser and scale are then machined away.
(4) Solid solution
Solution treatment at a suitable temperature is a key process for obtaining good properties of the alloy. The solid solution temperature is selected on the premise that coarse grains are not generated in the alloy. In order to obtain a good precipitation strengthening effect, and at the same time, the internal segregation of the alloy can be further eliminated, and a proper solid solution temperature is required to be selected. Solid solution test and water cooling are carried out in a vacuum heat treatment furnace at 960 ℃ for 90min, and argon is introduced for protection.
(5) Cold rolling
The cold rolling treatment is carried out, the cold rolling deformation is 60%, the deformation is strengthened to strengthen the matrix, and the oxide skin on the surface of the sample is removed before the cold rolling treatment.
(6) Aging
The aging treatment generally adopts low-solid-solubility alloy elements to dissolve into a copper matrix, and the alloy elements form supersaturated solid solutions in copper through high-temperature solution treatment, so that copper crystal lattices are severely distorted, the strength is improved, and the conductivity is reduced. After aging treatment, most of the alloy elements are separated out from the solid solution to form dispersed precipitated phases, so that the conductivity of the alloy is quickly recovered, and the dispersed phases effectively prevent the sliding of crystal boundaries and dislocation, so that the copper alloy still has higher strength. And (3) carrying out an aging test in a vacuum tube furnace (model: KSS-1200), introducing argon for protection in the whole aging process, heating to 500 ℃, then preserving heat for 60min, and finally cooling to room temperature along with the furnace to obtain the high-strength conductive Cu-Ni-Sn-Ti-Cr alloy.
The alloy microhardness, conductivity and strength of this example 8 were measured, and the measurement results are shown in table 1.
Example 9
The chemical composition of the copper alloy provided in this example is: 1% by weight of Ni,0.9% by weight of Sn, 0.75% by weight of Ti,0.3% by weight of Cr, and the balance of Cu and unavoidable impurities (total impurity content is not more than 0.06%).
The preparation method of the high-strength Cu-Ni-Sn-Ti-Cr alloy material provided by the embodiment comprises the following steps:
(1) Proportioning materials
The ingredients are mixed according to the following weight proportion: 1% by weight of Ni,0.9% by weight of Sn, 0.75% by weight of Ti,0.3% by weight of Cr, and the balance of Cu and unavoidable impurities (the total content of impurities is less than or equal to 0.06%); the raw materials used are: 99% standard electrolytic copper, pure Ni, pure Sn, cu-33% Ti master alloy and pure Cr.
(2) Smelting
The induction furnace is pumped to a vacuum degree of 6.67'10 < -3 > Pa by adopting a vacuum smelting mode, the vacuum intermediate frequency induction furnace is added, smelting is carried out in the atmosphere of 0.6atm of nitrogen, and the tapping temperature is generally 1300-1350 ℃. And after smelting, placing the alloy ingot into a water-cooled copper crucible for casting molding, and obtaining an alloy ingot.
(3) Homogenizing annealing
In order to reduce segregation of alloy components, annealing is carried out for 4 hours at 950 ℃; the riser and scale are then machined away.
(4) Solid solution
Solution treatment at a suitable temperature is a key process for obtaining good properties of the alloy. The solid solution temperature is selected on the premise that coarse grains are not generated in the alloy. In order to obtain a good precipitation strengthening effect, and at the same time, the internal segregation of the alloy can be further eliminated, and a proper solid solution temperature is required to be selected. Solid solution test and water cooling are carried out in a vacuum heat treatment furnace at 960 ℃ for 90min, and argon is introduced for protection.
(5) Cold rolling
The cold rolling treatment is carried out, the cold rolling deformation is 60%, the deformation is strengthened to strengthen the matrix, and the oxide skin on the surface of the sample is removed before the cold rolling treatment.
(6) Aging
The aging treatment generally adopts low-solid-solubility alloy elements to dissolve into a copper matrix, and the alloy elements form supersaturated solid solutions in copper through high-temperature solution treatment, so that copper crystal lattices are severely distorted, the strength is improved, and the conductivity is reduced. After aging treatment, most of the alloy elements are separated out from the solid solution to form dispersed precipitated phases, so that the conductivity of the alloy is quickly recovered, and the dispersed phases effectively prevent the sliding of crystal boundaries and dislocation, so that the copper alloy still has higher strength. And (3) carrying out an aging test in a vacuum tube furnace (model: KSS-1200), introducing argon for protection in the whole aging process, heating to 500 ℃, then preserving heat for 60min, and finally cooling to room temperature along with the furnace to obtain the high-strength conductive Cu-Ni-Sn-Ti-Cr alloy.
The alloy microhardness, conductivity and strength of this example 9 were measured, and the measurement results are shown in table 1.
Example 10
This example differs from example 3 only in that the chemical composition of the copper alloy provided is: 0.8% by weight of Ni,0.9% by weight of Sn,0.5% by weight of Ti, 0.5% by weight of Cr, and the balance of Cu and unavoidable impurities (total impurity content is not more than 0.06%).
The alloy microhardness, conductivity and strength of this example were measured, and the measurement results are shown in table 1.
Table 1 comparison of performance parameters for various embodiments
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As can be seen from Table 1, according to comparative examples 1 to 4, when the aging temperature of the Cu-1.0Ni-0.9Sn-0.5Ti-0.3Cr alloy is constant, the electrical conductivity increases with the increase of the aging time, the hardness and strength increase and decrease with the increase of the aging time, and at the aging time of 60min, the hardness and strength of the alloy have maximum values of 220.5HV and 606.9MPa, respectively. As can be seen from comparative examples 3, 5, 6, and 7, the Cu-1.0Ni-0.9Sn-0.5Ti-0.3Cr alloy was aged at 400-550 ℃ for a certain time, the conductivity increased with increasing aging temperature, the hardness and strength increased and then decreased with increasing aging temperature, and the peak value occurred at 500 ℃ for aging temperature. As can be seen from examples 1 to 7, the Cu-1.0Ni-0.9Sn-0.5Ti-0.3Cr alloy, after aging at 500℃for 60 minutes, achieved excellent overall properties of tensile strength 606.9MPa, microhardness 220.5HV and electrical conductivity 45.2% IACS, i.e., example 3 was the best example. The alloy performance of example 3 was further verified by the present invention, and FIG. 2 shows the metallographic microstructure of the Cu-Ni-Sn-Ti-Cr alloy of example 3 in the solid solution state and the aged state. As can be seen from FIG. 2, the Cu-Ni-Sn-Ti-Cr alloy is subjected to solution treatment, so that the second phase in the alloy is dissolved back into the Cu matrix, and the cold processing performance of the alloy is improved. After aging treatment, the Cu-Ni-Sn-Ti-Cr alloy precipitates a second phase in the alloy, purifies a matrix to improve the conductivity of the alloy, and plays a role in strengthening to improve the strength and the hardness of the alloy. FIG. 3 is a TEM image of the Cu-Ni-Sn-Ti-Cr alloy material according to example 3 of the present invention, showing that many large-sized and many fine precipitated phases are distributed in the alloy matrix, and the precipitated phases exist in the matrix, so that dislocation movement is hindered, and alloy deformation is difficult, thereby improving the strength of the alloy.
It can be seen from examples 3, 8, and 9 that the electrical conductivity of the Cu-Ni-Sn-Ti-Cr alloy decreases with increasing Ti content in the alloy compositions, and that the hardness and strength increase with increasing Ti content in the alloy compositions. From the comparative experimental data of example 3 and example 10, it can be found that when the ratio of the contents of nickel, tin and chromium is 8:9:5; and when Cr is more than or equal to 0.3% and less than or equal to 1% and Sn is more than or equal to 0%, the comprehensive performance of the alloy is reduced. It can be seen that the ratio of nickel, tin to chromium is 10:9:3; and Cr is more than or equal to 0.3% and Sn is more than or equal to 1%.
In the foregoing, the protection scope of the present invention is not limited to the preferred embodiments, and any person skilled in the art, within the scope of the present invention, should be covered by the protection scope of the present invention by equally replacing or changing the technical scheme and the inventive concept thereof.
Claims (7)
1. A copper-based alloy material is characterized in that a matrix phase is copper; the reinforcing phase is nickel, tin, chromium and titanium; comprises, by mass, 1% of Ni,0.9% of Sn,0.5% of Ti,0.3% of Cr, and the balance of Cu and unavoidable impurities;
the preparation method of the copper-based alloy material comprises the following process steps: preparing raw materials according to a proportion, and then smelting, homogenizing annealing, solid solution, cold rolling and time-efficient treatment are carried out on the raw materials;
the solid solution process is carried out under the protection of inert gas, and the temperature is kept at 960 ℃ for 90min; the aging treatment is carried out under the protection of inert gas, the temperature is firstly increased to 500 ℃, then the temperature is kept for 60 minutes, and finally the temperature is cooled to the room temperature along with the furnace.
2. The copper-based alloy material according to claim 1, wherein the number of aging treatments is 2.
3. The copper-based alloy material according to claim 1, wherein the smelting is vacuum smelting, and the induction furnace is evacuated to a vacuum degree of 6.67 x 10 -3 Pa, argon is introduced to 0.6atm.
4. The copper-based alloy material according to claim 1, wherein the homogenizing annealing is performed in a well-type resistance furnace or a box-type resistance furnace.
5. The copper-based alloy material according to claim 1, wherein the raw materials are 99% standard electrolytic copper, pure Ni, pure Sn, cu-33% ti master alloy, pure Cr.
6. The copper-based alloy material according to claim 1, wherein the inert gas in the solid solution process is argon; and the inert gas in the aging treatment process is argon.
7. Use of a copper-based alloy material according to any one of claims 1 to 6 for the preparation of precision instruments and/or precision mechanical parts.
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| CN114774733A (en) * | 2022-04-28 | 2022-07-22 | 郑州大学 | High-performance copper-based alloy material for casting roll sleeve and preparation method thereof |
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| GB2070057A (en) * | 1979-12-05 | 1981-09-03 | Wieland Werke Ag | Copper-tin alloy, and its manufacture |
| JPS60181250A (en) * | 1984-02-28 | 1985-09-14 | Mitsubishi Metal Corp | Copper alloy for material of lead for semiconductor apparatus |
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