CN115863658A - Current collector, electrode plate, energy storage device and electric equipment - Google Patents
Current collector, electrode plate, energy storage device and electric equipment Download PDFInfo
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- CN115863658A CN115863658A CN202211512015.7A CN202211512015A CN115863658A CN 115863658 A CN115863658 A CN 115863658A CN 202211512015 A CN202211512015 A CN 202211512015A CN 115863658 A CN115863658 A CN 115863658A
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Abstract
The application discloses mass flow body, electrode slice, energy memory and consumer relates to battery technology field. The current collector comprises: the metal coating is arranged on at least one of two opposite surfaces of the isolating layer in the thickness direction; the isolation layer has a first resistance at a first temperature and a second resistance at a second temperature, the first resistance is less than or equal to 1.2 milliohms, and a ratio of the second resistance to the first resistance is greater than or equal to 2; the thickness of the metal plating layer is greater than or equal to 0.5 micrometer and less than or equal to 2 micrometers. In the embodiment of the application, when the temperature of the isolation layer is at the first temperature, the on-resistance of the isolation layer is smaller, so that the conductivity of the isolation layer is ensured; and when the isolation layer rose to the second temperature by first temperature, the on-resistance of isolation layer was great for the isolation layer approximately presents the block state, in order to alleviate the intensity of the short circuit of the battery that uses this mass flow body, has reduced the potential safety hazard.
Description
Technical Field
The application relates to the technical field of batteries, in particular to a current collector, an electrode plate, an energy storage device and electric equipment.
Background
The manufacturing process of a battery generally includes: the electrode slurry containing an active material is coated on a current collector, dried and rolled to manufacture electrode sheets, and then two electrode sheets of different polarities and an insulating separator are alternately stacked to form an electrode assembly in a winding or stacking manner, and the electrode assembly is built in a case together with a dielectric. Wherein the current collector of one electrode sheet is used to receive electrons from the active material and transfer them to the current collector of the other electrode sheet. Due to the fact that the active materials are high in activity, the electrode plates are in thermal runaway risk in certain environments, and therefore potential safety hazards of the battery are increased.
Disclosure of Invention
One of the main objects of the present application is to provide a current collector, an electrode plate, an energy storage device and an electric device, which can improve the safety of the battery in use while ensuring the electrical performance of the battery.
In order to achieve the purpose of the application, the following technical scheme is adopted in the application:
according to an aspect of the present application, there is provided a current collector comprising: the metal coating is arranged on at least one of two opposite surfaces of the isolating layer in the thickness direction;
the isolation layer has a first resistance at a first temperature and a second resistance at a second temperature, the first resistance is less than or equal to 1.2 milliohms, and a ratio of the second resistance to the first resistance is greater than or equal to 2;
the thickness of the metal coating is greater than or equal to 0.5 micrometer and less than or equal to 2 micrometers, and the metal coatings are made of the same material;
wherein the first temperature is less than the second temperature.
In the embodiment of the application, when the isolation layer is at the first temperature, the resistance of the isolation layer is smaller, namely the on-resistance of the isolation layer is smaller, so that the conductive performance of the isolation layer is ensured; and when the temperature that the isolation layer was located rose to the second temperature by first temperature, the on-resistance of isolation layer is great for the isolation layer approximately presents the block state, in order to alleviate the intensity of the short circuit of the battery that uses this mass flow body, has reduced the potential safety hazard (has reduced the risk that the battery catches fire, explodes). In addition, the thickness of the metal coating is more than or equal to 0.5 micrometer and less than or equal to 2 micrometers, so that metal materials are saved, the overall thickness of the current collector is reduced, the weight of the current collector is reduced, and the energy density is improved.
According to an embodiment of the present application, at least one recess is formed on the surface of the isolation layer having the metal plating layer, and the metal plating layer fills the recess.
In the embodiment of the application, through sunken setting, the barrier layer surface area has been increased to when the surface metallization cladding of isolation layer, the metal coating can have bigger area, thereby has increased the area of overflowing of mass flow body. In addition, the weight of the isolation layer can be reduced through the concave arrangement, so that the weight of the current collector is reduced conveniently.
According to an embodiment of the present application, both surfaces of the isolation layer opposite to each other in the thickness direction have the metal plating layer;
the surface of the first side in the thickness direction of the isolation layer is provided with a plurality of first recesses, the surface of the second side is provided with a plurality of second recesses, and the first recesses and the second recesses do not have overlapping areas in the thickness direction of the isolation layer.
In this application embodiment, through injecing first sunken, the second is sunken not to have the coincidence region on the thickness direction of isolation layer, avoid isolation layer local area thinner for the metal coating at both sides is the condition nearer apart from, and then avoids the condition that the metal coating at both sides switches on easily when the isolation layer is in the second temperature.
According to an embodiment of the present application, the recess extends in a width direction of the current collector, and the plurality of recesses are distributed in a length direction of the current collector.
In this application embodiment, through the extending direction and the mode of arranging of injecing the recess for the isolation layer can have better toughness, thereby to the electrode slice including this mass flow body, can have better toughness, avoids appearing the phenomenon of crack when electrode slice is convoluteed or is buckled.
According to an embodiment of the present application, a thickness of the isolation layer is greater than or equal to 2 micrometers and less than or equal to 5 micrometers.
In the embodiment of this application, through the thickness of injecing the isolation layer, further reduce the thickness of mass flow body, alleviate the weight of mass flow body, improve energy density.
According to an embodiment of the present application, wherein the isolation layer includes an insulating base material and a conductive material mixed in the insulating base material, an expansion coefficient of the insulating base material is larger than an expansion coefficient of the conductive material.
According to an embodiment of the present application, a ratio of the expansion coefficient of the insulating base material to the expansion coefficient of the conductive material is greater than or equal to 3 and less than or equal to 80.
According to an embodiment of the present application, a ratio of the expansion coefficient of the insulating substrate to the expansion coefficient of the conductive material is greater than or equal to 20 and less than or equal to 60.
In the embodiment of the application, the conductive material is mixed, so that the isolation layer can have better conductive performance at the first temperature; because the expansion coefficient of insulating substrate is greater than conducting material's expansion coefficient to when the isolation layer is in the second temperature, destroy the conductive network that conducting material formed through the expansion of insulating substrate, and then make the isolation layer have certain insulating properties.
According to an embodiment of the present application, a mass ratio of the conductive material to the insulating base material is greater than or equal to 0.1% and less than or equal to 50%.
In the embodiment of the application, the isolation layer is prevented from containing less conductive materials, and the isolation layer is ensured to have enough conductive performance at the first temperature; meanwhile, the isolation layer is prevented from containing more conductive materials, and the isolation layer is guaranteed to have enough insulating property when being at the second temperature.
According to an embodiment of the present application, wherein the isolation layer includes an insulating substrate and a PTC material mixed in the insulating substrate.
In the embodiment of the application, the PTC material is mixed, so that the isolating layer can have certain conductive performance at the first temperature; and when the isolation layer is at the second temperature, the resistance of the PTC material is increased, so that the isolation layer has better insulating property.
According to an embodiment of the present application, wherein a mass ratio of the PTC material to the insulating base material is greater than or equal to 0.1%.
According to an embodiment of the present application, wherein a mass ratio of the PTC material to the insulating base material is 6% or more.
In this application embodiment, avoid among the isolation layer PTC material less for the isolation layer is in the great condition of the first resistance under the first temperature, thereby guarantees that the isolation layer has sufficient electric conductive property when being in first temperature.
According to an embodiment of the application, wherein the material of the metal plating is selected from at least one of copper and aluminum.
In the embodiment of the application, the applicability of the current collector is improved by limiting the material of the metal coating.
According to an aspect of the present application, there is provided an electrode sheet including the current collector of the above aspect, and an electrode paste applied to a surface of the current collector.
In the embodiment of the application, the current collector is combined, so that the overall thickness of the electrode plate can be reduced, the weight of the electrode plate can be reduced, or a large amount of electrode slurry can be coated, and the electrical property of the electrode plate can be improved; in addition, through the setting of isolation layer to and sunken setting on the isolation layer, can improve the toughness of this electrode slice, guarantee the security of using.
According to an aspect of the present application, there is provided an energy storage device including the electrode sheet of the above aspect. In the embodiment of the application, the battery is combined, and the safety of the energy storage device is improved under the condition that the battery has better safety.
According to an aspect of the present application, there is provided a powered device including the energy storage apparatus of the above aspect. In the embodiment of the application, the energy storage device is combined, and the safety of the electric equipment is improved under the condition that the energy storage device has better safety.
It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the application.
Drawings
The above and other features and advantages of the present application will become more apparent by describing in detail exemplary embodiments thereof with reference to the attached drawings.
Fig. 1 is a schematic cross-sectional view of a current collector shown according to an exemplary embodiment.
Fig. 2 is a schematic cross-sectional view of another current collector shown in accordance with an exemplary embodiment.
Fig. 3 is a schematic cross-sectional view of yet another current collector shown in accordance with an exemplary embodiment.
FIG. 4 is a schematic diagram illustrating a top view structure of an isolation layer, according to an exemplary embodiment.
Fig. 5 is a schematic cross-sectional structure diagram illustrating an electrode sheet according to an exemplary embodiment.
Wherein the reference numerals are as follows:
10. an electrode sheet;
1. a current collector; 2. electrode paste;
11. an isolation layer; 12. a metal plating layer;
111. recessing;
1111. a first recess; 1112. a second recess;
121. and (5) intermediate metal plating.
Detailed Description
Example embodiments will now be described more fully with reference to the accompanying drawings. Example embodiments may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the concept of example embodiments to those skilled in the art. The same reference numerals in the drawings denote the same or similar structures, and thus their detailed description will be omitted.
Fig. 1 illustrates a schematic structural diagram of a current collector 1 provided in an embodiment of the present application. As shown in fig. 1, the current collector 1 includes: a barrier layer 11 and a metal plating layer 12.
At least one of two opposite surfaces in the thickness direction of the isolation layer 11 has a metal plating layer 12. Illustratively, as shown in fig. 1, both surfaces of the separation layer 11 opposing each other in the thickness direction have the metal plating layer 12.
The isolation layer 11 has a first resistance at a first temperature and a second resistance at a second temperature, the first resistance is less than or equal to 1.2 milliohms, and the ratio of the second resistance to the first resistance is greater than or equal to 2; the thickness d of the metal plating layer 12 is greater than or equal to 0.5 micrometer and less than or equal to 2 micrometers, and the materials of the metal plating layers 12 are the same; the first temperature is less than the second temperature.
In the embodiment of the application, by adjusting the electrical property of the isolation layer 11, when the isolation layer 11 is at the first temperature, the resistance of the isolation layer 11 is less than or equal to 1.2 milliohms, so that the electrical conductivity of the isolation layer 11 is ensured, and the electrical property of a battery using the current collector 1 is further ensured; and when the temperature that isolation layer 11 is located rose to the second temperature by first temperature, isolation layer 11 second resistance under the second temperature rose to 2 times that is not less than first resistance, and the on resistance of isolation layer 11 is great this moment to isolation layer 11 is nearly to present the barrier state (blockking the circulation of electron promptly), in order to alleviate the acutely degree of the short circuit of the battery that uses this mass flow body 1, has reduced the potential safety hazard (has reduced the risk that the battery catches fire, explodes). In addition, the thickness of the metal plating layer 12 is greater than or equal to 0.5 micrometer and less than or equal to 2 micrometers, so that metal materials are saved, the overall thickness of the current collector 1 is reduced, the weight of the current collector 1 is reduced, and the energy density is improved.
The metal plating layer 12 may be formed on the surface of the isolation layer 11 by magnetron sputtering or vapor deposition. Of course, the metal plating layer 12 may be formed in other manners, which is not limited in the embodiment of the present application.
The current collector 1 of the present application may be used as a current collector of not only the positive electrode sheet 10 but also the negative electrode sheet 10. When the current collector 1 is used for the positive electrode sheet 10, the material of the metal plating layer 12 may be, for example, aluminum, and when the current collector 1 is used for the negative electrode sheet 10, the material of the metal plating layer 12 may be, for example, copper.
In the present application, the number of the isolation layers 11 and the number of the metal plating layers 12 may be equal. Illustratively, the isolation layer 11 and the metal plating layer 12 are both one layer, or the isolation layer 11 and the metal plating layer 12 are both two layers, in which case the two isolation layers 11 and the two metal plating layers 12 are alternately stacked; or the number of the isolation layers 11 is one less than that of the metal coatings 12, after the isolation layers 11 and the metal coatings 12 are alternately stacked, the outermost sides of the two sides of the current collector 1 in the thickness direction are the metal coatings 12, and two adjacent metal coatings 12 have one isolation layer 11. Illustratively, as shown in fig. 1, the current collector 1 includes a separation layer 11 and two metal plating layers 12, where the separation layer 11 is located between the two metal plating layers 12; as shown in fig. 2, the current collector 1 includes two separation layers 11 and three metal plating layers 12, and the three metal plating layers 12 and the two separation layers 11 are alternately stacked.
Alternatively, as shown in fig. 2, for the intermediate metal plating layer 121 between two isolation layers 11, the intermediate metal plating layer 121 may be plated on one isolation layer 11 and bonded with the other isolation layer 11 by a conductive adhesive; or the intermediate metal plating layer 121 includes a first sub-plating layer and a second sub-plating layer, the first sub-plating layer is plated on one isolation layer 11, the second sub-plating layer is plated on the other isolation layer 11, and then the first sub-plating layer and the second sub-plating layer are bonded by a conductive adhesive.
In some embodiments, the surface of the isolation layer 11 having the metal plating layer 12 has a plurality of recesses 111, and the metal plating layer 12 fills the recesses 111. Illustratively, as shown in fig. 3, both sides of the isolation layer 11 have a plurality of recesses 111.
Like this, through sunken 111 setting on the isolation layer 11, increased isolation layer 11 surface area to when the surface plating metal coating 12 of isolation layer 11, metal coating 12 can have bigger area, thereby increased the area of overflowing of mass flow body 1. In addition, the weight of separator 11 can also be reduced by the provision of recess 111, thereby facilitating the reduction in weight of current collector 1.
Of course, for the arrangement of increasing the surface of the isolation layer 11, besides the above-mentioned case of arranging the recess 111, a protrusion may be arranged on the surface of the isolation layer 11, or both the recess 111 and the protrusion may be arranged on the surface of the isolation layer 11, which is not limited in the embodiment of the present application.
Explanation will be given next taking an example in which the surface of the isolation layer 11 has the recesses 111, and for the case in which the surface of the isolation layer 11 has the projections, reference may be made to the arrangement of the recesses 111.
The plurality of recesses 111 on the surface of the isolation layer 11 may be distributed in an array to facilitate the subsequent processing of the plurality of recesses 111. Of course, the plurality of recesses 111 may be distributed arbitrarily, which is not limited in the embodiment of the present application.
The recess 111 may be a segment-shaped groove, or as shown in fig. 4, the recess 111 is an arc groove extending with a certain length. In addition, in the case where the recess 111 is formed on the surface of the isolation layer 11, the recess 111 is also formed on the metal plating layer 12, and when the electrode paste 2 is subsequently applied on the metal plating layer 12, in order to ensure the coating effect (for example, uniformity of the coating thickness) of the electrode paste 2, the recess 111 on the surface of the isolation layer 11 cannot be too deep, and may be determined according to the coating process of the electrode paste 2, as long as the coating effect of the electrode paste 2 can be ensured, which is not limited in the embodiment of the present invention.
Alternatively, the notch edge of the recess 111 has a rounded chamfer, so that when the surface of the isolation layer 11 is plated with the metal plating layer 12, the phenomenon that the metal plating layer 12 breaks at the notch edge due to stress concentration can be avoided.
Taking the recess 111 on the surface of the isolation layer 11 as a groove extending a certain length as an example, as shown in fig. 4, the recess 111 extends in the width direction O1 of the current collector 1, and the plurality of recesses 111 are distributed in the length direction O2 of the current collector 1. In this way, the formed isolation layer 11 can have better bending toughness, so that the electrode sheet 10 comprising the current collector 1 can have better toughness, and the phenomenon of cracking when the electrode sheet 10 is wound or bent is avoided.
In some embodiments, as shown in fig. 3, two opposite surfaces in the thickness direction of the isolation layer 11 each have the metal plating layer 12, a surface on a first side in the thickness direction of the isolation layer 11 has a plurality of first recesses 1111, a surface on a second side has a plurality of second recesses 1112, and there is no overlapping region between the first recesses 1111 and the second recesses 1112 in the thickness direction of the isolation layer 11.
Like this, through injecing first sunken 1111, the sunken 1112 of second in the thickness direction of isolation layer 11 does not have the coincidence zone to avoid isolation layer 11 local area to be thinner, make the condition that the metal coating 12 distance of both sides is nearer, and then avoid isolation layer 11 the condition that the metal coating 12 of both sides switches on easily when the second temperature.
In some embodiments, the thickness of the spacer layer 11 is greater than or equal to 2 microns and less than or equal to 5 microns. Thus, by limiting the thickness of the isolation layer 11, the thickness of the current collector 1 is further reduced, the weight of the current collector 1 is reduced, and the energy density is improved.
The insulating material included for the isolation layer 11 may be a polymer plastic, such as polyamide, polyester terephthalate, polyimide, polyethylene, polypropylene, polystyrene, polyvinyl chloride, acrylonitrile-butadiene-styrene copolymer, polybutylene terephthalate, poly (p-phenylene terephthalamide), polypropylene, polyoxymethylene, epoxy resin, phenol resin, polytetrafluoroethylene, polyvinylidene fluoride, silicone rubber, polycarbonate, or the like.
In some embodiments, the isolation layer 11 includes an insulating substrate and a conductive material mixed in the insulating substrate, the insulating substrate having a coefficient of expansion greater than a coefficient of expansion of the conductive material.
For the conductive material mixed in the insulating base material, when the isolation layer 11 is at the first temperature, the conductive material can form a conductive net, so that the conductive performance of the isolation layer 11 at the first temperature is ensured, the overcurrent capacity of the current collector is improved, and the internal resistance is reduced; when the isolation layer 11 is heated from the first temperature to the second temperature, the expansion coefficient of the insulating base material is greater than that of the conductive material, and the expansion degree of the insulating base material is inevitably greater than that of the conductive material, so that the conductive mesh formed by the conductive material is damaged by the insulating base material including the conductive material, and the resistance of the isolation layer 11 is increased; in addition, when the temperature of the isolation layer 11 is increased from the first temperature to the second temperature, the insulating substrate absorbs heat and melts to form an insulating film with a compact structure, so as to further increase the resistance of the isolation layer 11, and further enable the isolation layer 11 to have a certain insulating property.
The conductive material may be at least one of graphene, fullerene, carbon nanotube, graphite, carbon black, acetylene black, ketjen black, carbon fiber (e.g., vapor grown carbon fiber), and the like.
Optionally, the ratio of the coefficient of expansion of the insulating substrate to the coefficient of expansion of the conductive material is greater than or equal to 3 and less than or equal to 80. Further, the ratio of the coefficient of expansion of the insulating base material to the coefficient of expansion of the conductive material is greater than or equal to 10 and less than or equal to 50. Therefore, the expansion coefficient of the insulating base material is limited to be far larger than that of the conductive material, so that the conductive net of the conductive material can be effectively damaged when the insulating base material expands.
For example, the insulating substrate may be PVDF and has a coefficient of expansion of (100-250). Times.10 -6 The conductive material can be graphite, and the expansion coefficient is (5-6) multiplied by 10 -6 /° c; the insulation substrate can be PP, and the expansion coefficient is (80-120) multiplied by 10 -6 The conductive material can be graphite, and the expansion coefficient is (3-6) multiplied by 10 -6 /℃。
Optionally, the mass ratio of the conductive material to the insulating base material is greater than or equal to 0.1% and less than or equal to 50%. Thus, the situation that the isolating layer 11 has a large first resistance at the first temperature due to the fact that the isolating layer 11 contains less conductive materials is avoided, and therefore the isolating layer 11 is ensured to have sufficient conductive performance at the first temperature; meanwhile, the situation that the second resistance of the isolation layer 11 at the second temperature is small due to the fact that more conducting materials exist in the isolation layer 11 is avoided, and therefore the isolation layer 11 is guaranteed to have enough insulating performance when the isolation layer is at the second temperature.
Further, the mass ratio of the conductive material to the insulating base material is greater than or equal to 5% and less than or equal to 10%. In this way, the content of the conductive material in the isolation layer 11 is further limited, so as to ensure the conductive performance of the isolation layer 11 at the first temperature and the insulating performance at the second temperature.
For example, when the conductive material is graphene and the mass ratio of the conductive material to the insulating substrate is 6%, the first resistance of the isolation layer 11 is 0.9 milliohm when the first temperature is 25 ℃; the second resistance of the isolation layer 11 is 1.9 milliohms when the second temperature is 120 ℃.
In other embodiments, the insulation layer 11 includes an insulation substrate and a PTC material mixed in the insulation substrate.
As for the PTC material mixed in the insulating base material, since the resistance of the PTC material increases with the increase of temperature (the resistance rapidly increases when the temperature exceeds the curie temperature of the PTC material), when the isolation layer 11 is at the first temperature, the resistance of the PTC material is smaller, and at this time, the conductive mesh formed by the PTC material can ensure the conductivity of the isolation layer 11 at the first temperature; when the isolating layer 11 is increased from the first temperature to the second temperature, the expansion process of the insulating base material destroys the conductive net formed by the PTC material, and the resistance of the PTC material is increased, so that the resistance of the isolating layer 11 is increased; in addition, when the temperature of the isolation layer 11 is increased from the first temperature to the second temperature, the insulating substrate absorbs heat and melts to form an insulating film with a compact structure, so as to further increase the resistance of the isolation layer 11, and further enable the isolation layer 11 to have better insulating performance.
The PTC material may be a ceramic PTC material (e.g., baTiO 3-based ceramic PTC material, V2O 3-based ceramic PTC material), or a polymer PTC material (e.g., a polymer PTC material).
Optionally, the mass ratio of the PTC material to the insulating substrate is greater than or equal to 0.1%. So, avoid among the isolation layer 11 PTC material less for the isolation layer 11 is in the great condition of the first resistance under the first temperature, thereby guarantees that isolation layer 11 has sufficient electric conductive property when being in the first temperature.
Further, the mass ratio of the PTC material to the insulating base material is 6% or more. In this way, the content of the conductive material in the isolation layer 11 is further limited, thereby ensuring the conductivity of the isolation layer 11 at the first temperature.
Illustratively, taking the PTC material as a BaTiO 3-based PTC material and the mass ratio of the PTC material to the insulating substrate as 6%, the first resistance of the separator 11 is 1.05 milliohms when the first temperature is 25 ℃; the second resistance of the isolation layer 11 is 3.5 milliohms when the second temperature is 120 ℃.
In still other embodiments, the isolation layer 11 includes an insulating substrate, and a conductive material and a PTC material mixed in the insulating substrate.
In this way, when the isolation layer 11 is at the first temperature, the conductive performance of the isolation layer 11 is ensured by the conductive mesh formed by the conductive material and the PTC material; when the isolation layer 11 is heated to the second temperature, the expansion of the insulating substrate not only destroys the conductive mesh formed by the conductive material and the PTC material, but also increases the temperature of the PTC material itself and increases the resistance of the melted insulating substrate, so that the resistance of the isolation layer 11 can be greatly increased.
The contents of the conductive material and the PTC material in the isolation layer 11 can refer to the mass ratio of the conductive material to the insulating substrate and the mass ratio of the PTC material to the insulating substrate described in the above embodiments, which are not limited in the embodiments of the present application.
For example, taking graphene as a conductive material, a BaTiO3 PTC material as a PTC material, and a mass ratio of the conductive material to the insulating base material of 3%, and a mass ratio of the PTC material to the insulating base material of 3%, when the first temperature is 25 ℃, the first resistance of the isolation layer 11 is 0.98 milliohm; the second resistance of the isolation layer 11 is 2.4 milliohms when the second temperature is 120 ℃.
In the constitution of the spacer layer 11 according to the above two embodiments, the method for manufacturing the spacer layer 11 includes: (1) Obtaining a certain amount of insulating base material and additive according to the proportion, wherein the additive is a conductive material or PTC material; (2) Adding the additive into the molten insulating base material or the insulating base material solvent and fully stirring to obtain a spacer with the additive uniformly dispersed; and (3) casting the sheet based on the separator to obtain the isolating layer 11.
In combination with the above-mentioned case that the surface of the separation layer 11 has the recesses 111, after the separation layer 11 is obtained by casting, the obtained separation layer 11 may be subjected to secondary processing by a roller having the protrusions and/or recesses 111 to obtain the separation layer 11 having the protrusions and/or recesses 111.
The steps (2) and (3) in the method for manufacturing the isolation layer 11 and the process for performing the secondary processing on the isolation layer 11 refer to related technologies, which are not limited in the embodiments of the present application. In addition, in the case that the additive is the PTC material, when the PTC material is added to the insulating base material in a molten state and stirred in the step (2), in order to ensure that the PTC material can be uniformly dispersed in the insulating base material and avoid the PTC material from caking and the like, optionally, the mass ratio of the PTC material to the insulating base material is less than or equal to 60%. In this way, the uniformity of the electrical conductivity of the isolation layer 11 at the first temperature is ensured.
The present embodiment also provides an electrode sheet 10, as shown in fig. 5, including the current collector 1 according to the above embodiment, and electrode slurry 2 coated on the surface of the current collector 1. By combining the current collector 1, the overall thickness of the electrode plate 10 can be reduced, the weight of the electrode plate 10 can be reduced, or a large amount of electrode slurry 2 can be coated, so that the electrical property of the electrode plate 10 can be improved; in addition, through the arrangement of the isolation layer 11 and the arrangement of the recess 111 on the isolation layer 11, the toughness of the electrode plate 10 can be improved, and the use safety can be ensured.
The embodiment of the present application further provides an energy storage device, including the electrode sheet described in the above embodiment, the energy storage device may include, but is not limited to, a single battery, a battery module, a battery pack, a battery system, and the like. When the energy storage device is a single battery, the energy storage device can be a square battery or a cylindrical battery. The battery has better safety, and the safety of the energy storage device is improved.
The embodiment of the application also provides electric equipment, which comprises the energy storage device in the embodiment, and the electric equipment can be energy storage equipment, vehicles, energy storage containers and the like. By combining the energy storage device, the safety of the electric equipment is improved under the condition that the energy storage device has better safety.
In the application examples, the terms "first", "second", "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance; the term "plurality" means two or more unless expressly limited otherwise. The terms "mounted," "connected," "fixed," and the like are used broadly and should be construed to include, for example, "connected" may be a fixed connection, a detachable connection, or an integral connection; "connected" may be directly connected or indirectly connected through an intermediate. The specific meanings of the above terms in the examples of the application can be understood by those skilled in the art according to specific situations.
In the description of the embodiments of the present application, it is to be understood that the terms "upper", "lower", "left", "right", "front", "rear", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience in describing the embodiments of the present application and simplifying the description, but do not indicate or imply that the referred devices or units must have a specific direction, be configured and operated in a specific orientation, and thus, should not be construed as limiting the embodiments of the present application.
In the description of the present specification, the description of "one embodiment," "some embodiments," "specific embodiments," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the embodiments. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
The above description is only a preferred embodiment of the claimed embodiments and is not intended to limit the claimed embodiments, and various modifications and changes may be made to the claimed embodiments by those skilled in the art. Any modification, equivalent replacement, improvement and the like made within the spirit and principle of the applied embodiment shall be included in the protection scope of the applied embodiment.
Claims (16)
1. The current collector is characterized by comprising an isolating layer and a metal coating, wherein the metal coating is arranged on at least one of two opposite surfaces in the thickness direction of the isolating layer;
the isolation layer has a first resistance at a first temperature and a second resistance at a second temperature, the first resistance is less than or equal to 1.2 milliohms, and a ratio of the second resistance to the first resistance is greater than or equal to 2;
the thickness of the metal coating is greater than or equal to 0.5 micrometer and less than or equal to 2 micrometers, and the metal coatings are made of the same material;
wherein the first temperature is less than the second temperature.
2. The current collector of claim 1, wherein a surface of the separator layer having the metal plating is formed with at least one depression, and the metal plating fills the depression.
3. The current collector of claim 2, wherein both surfaces of the isolation layer opposite in a thickness direction have the metal plating layer;
the surface of the first side in the thickness direction of the isolation layer is provided with a plurality of first recesses, the surface of the second side is provided with a plurality of second recesses, and the projections of the first recesses and the second recesses in the thickness direction of the isolation layer do not have an overlapping region.
4. The current collector of claim 2, wherein the recesses extend in a width direction of the current collector, and a plurality of the recesses are distributed in a length direction of the current collector.
5. The current collector of claim 1, wherein the separator layer has a thickness greater than or equal to 2 microns and less than or equal to 5 microns.
6. The current collector of any one of claims 1 to 5, wherein the separator layer comprises an insulating substrate and a conductive material mixed in the insulating substrate, wherein the insulating substrate has a coefficient of expansion greater than a coefficient of expansion of the conductive material.
7. The current collector of claim 6, wherein a ratio of the coefficient of expansion of the insulating substrate to the coefficient of expansion of the conductive material is greater than or equal to 3 and less than or equal to 80.
8. The current collector of claim 7, wherein the ratio of the coefficient of expansion of the insulating substrate to the coefficient of expansion of the conductive material is greater than or equal to 10 and less than or equal to 50.
9. The current collector of claim 6, wherein a mass ratio of the conductive material to the insulating substrate is greater than or equal to 0.1% and less than or equal to 50%.
10. The current collector of any of claims 1 to 5, wherein the isolation layer comprises an insulating substrate and a PTC material mixed in the insulating substrate.
11. The current collector of claim 10, wherein a mass ratio of the PTC material to the insulating substrate is greater than or equal to 0.1%.
12. The current collector of claim 11, wherein a mass ratio of the PTC material to the insulating substrate is greater than or equal to 6%.
13. The current collector of any one of claims 1 to 5, wherein the metal plating is selected from at least one of copper and aluminum.
14. An electrode sheet comprising the current collector as claimed in any one of claims 1 to 13, and an electrode slurry applied to a surface of the current collector.
15. An energy storage device comprising the electrode sheet according to claim 14.
16. An electrical consumer comprising the energy storage device of claim 15.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211512015.7A CN115863658A (en) | 2022-11-29 | 2022-11-29 | Current collector, electrode plate, energy storage device and electric equipment |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211512015.7A CN115863658A (en) | 2022-11-29 | 2022-11-29 | Current collector, electrode plate, energy storage device and electric equipment |
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| CN115863658A true CN115863658A (en) | 2023-03-28 |
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| CN202211512015.7A Withdrawn CN115863658A (en) | 2022-11-29 | 2022-11-29 | Current collector, electrode plate, energy storage device and electric equipment |
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| Country | Link |
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| CN (1) | CN115863658A (en) |
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- 2022-11-29 CN CN202211512015.7A patent/CN115863658A/en not_active Withdrawn
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Application publication date: 20230328 |