CN115863050A - Small-size ceramic dielectric capacitor for space navigation and production method thereof - Google Patents
Small-size ceramic dielectric capacitor for space navigation and production method thereof Download PDFInfo
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- 239000003990 capacitor Substances 0.000 title claims abstract description 111
- 239000000919 ceramic Substances 0.000 title claims abstract description 65
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 17
- 238000000034 method Methods 0.000 claims abstract description 70
- 230000008569 process Effects 0.000 claims abstract description 43
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims abstract description 36
- 229910052709 silver Inorganic materials 0.000 claims abstract description 36
- 239000004332 silver Substances 0.000 claims abstract description 36
- 239000011267 electrode slurry Substances 0.000 claims abstract description 33
- 229910052573 porcelain Inorganic materials 0.000 claims abstract description 28
- 238000005245 sintering Methods 0.000 claims abstract description 17
- 238000005520 cutting process Methods 0.000 claims abstract description 5
- 238000003475 lamination Methods 0.000 claims abstract description 5
- 238000007650 screen-printing Methods 0.000 claims abstract description 5
- 239000000047 product Substances 0.000 claims description 89
- 238000012360 testing method Methods 0.000 claims description 37
- SWELZOZIOHGSPA-UHFFFAOYSA-N palladium silver Chemical compound [Pd].[Ag] SWELZOZIOHGSPA-UHFFFAOYSA-N 0.000 claims description 34
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 20
- 238000000576 coating method Methods 0.000 claims description 19
- 238000012545 processing Methods 0.000 claims description 18
- 239000011248 coating agent Substances 0.000 claims description 17
- 238000012956 testing procedure Methods 0.000 claims description 17
- 210000001161 mammalian embryo Anatomy 0.000 claims description 14
- 239000002002 slurry Substances 0.000 claims description 13
- LQBJWKCYZGMFEV-UHFFFAOYSA-N lead tin Chemical compound [Sn].[Pb] LQBJWKCYZGMFEV-UHFFFAOYSA-N 0.000 claims description 11
- 239000012528 membrane Substances 0.000 claims description 10
- 229910052759 nickel Inorganic materials 0.000 claims description 10
- 238000001035 drying Methods 0.000 claims description 9
- 238000009713 electroplating Methods 0.000 claims description 9
- 238000010030 laminating Methods 0.000 claims description 8
- 238000012216 screening Methods 0.000 claims description 8
- 238000007639 printing Methods 0.000 claims description 7
- 238000010304 firing Methods 0.000 claims description 6
- 239000011265 semifinished product Substances 0.000 claims description 6
- 238000000462 isostatic pressing Methods 0.000 claims description 5
- 238000005266 casting Methods 0.000 claims description 4
- GMCQKNRRUKXMDO-UHFFFAOYSA-N [Sn].[Pb].[Ni].[Ag] Chemical compound [Sn].[Pb].[Ni].[Ag] GMCQKNRRUKXMDO-UHFFFAOYSA-N 0.000 claims description 3
- 239000000853 adhesive Substances 0.000 claims description 3
- 230000001070 adhesive effect Effects 0.000 claims description 3
- 238000000498 ball milling Methods 0.000 claims description 3
- 238000002156 mixing Methods 0.000 claims description 3
- 239000003960 organic solvent Substances 0.000 claims description 3
- 239000000843 powder Substances 0.000 claims description 3
- 238000002360 preparation method Methods 0.000 claims description 3
- 238000005507 spraying Methods 0.000 claims description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 3
- 238000009736 wetting Methods 0.000 claims description 3
- 238000004321 preservation Methods 0.000 claims description 2
- 238000004891 communication Methods 0.000 claims 1
- 239000002184 metal Substances 0.000 abstract description 2
- 229910052751 metal Inorganic materials 0.000 abstract description 2
- 239000002609 medium Substances 0.000 description 8
- 239000000463 material Substances 0.000 description 5
- 238000011161 development Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000000227 grinding Methods 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 238000009659 non-destructive testing Methods 0.000 description 2
- 239000012466 permeate Substances 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 239000003985 ceramic capacitor Substances 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000012526 feed medium Substances 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000005416 organic matter Substances 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
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Abstract
The invention discloses a small-size ceramic dielectric capacitor for aerospace and a production method thereof, wherein the small-size ceramic dielectric capacitor comprises a capacitor ceramic body, capacitor internal electrodes and capacitor terminal electrodes, the capacitor internal electrodes are distributed in the capacitor ceramic body in a multi-layer manner, and a dielectric layer is arranged between the adjacent capacitor internal electrodes; two capacitor end electrodes are distributed at two ends of the capacitor porcelain body and are communicated with the capacitor inner electrode; the plurality of first inner electrodes are connected with the first end electrode, the plurality of second inner electrodes are connected with the second end electrode, so that the parallel connection of the first inner electrodes and the parallel connection of the second inner electrodes are realized, and the function of a capacitor is realized through the multilayer distributed capacitor inner electrodes; according to the invention, through a screen printing process, metal inner electrode slurry is printed on a ceramic diaphragm, the ceramic diaphragm is subjected to staggered lamination, cutting, row adhesion and high-temperature sintering to form a ceramic chip, end silver electrodes are packaged at two ends of the ceramic chip to form a multilayer structure capacitor, and the practical use requirement can be met on a small size.
Description
Technical Field
The invention relates to the field of electronic components, in particular to a small-size ceramic dielectric capacitor for aerospace and a production method thereof.
Background
The capacitor belongs to one of three passive devices, and is large in using amount and wide in using range. The multilayer ceramic dielectric capacitor (MLCC) has the characteristics of high reliability, good frequency characteristic, no polarity and the like, and is widely applied to electronic circuits for coupling, blocking, filtering, tuning and other purposes.
With the trend of miniaturization development of electronic equipment, large-size high-reliability ceramic dielectric capacitors cannot meet the actual use requirements, and small-size high-reliability ceramic dielectric capacitors become the development trend in the future.
Disclosure of Invention
The invention aims to solve the technical problem that a large-size ceramic dielectric capacitor cannot meet the actual requirement, and aims to provide a small-size ceramic dielectric capacitor for space navigation and a production method thereof to obtain the small-size ceramic dielectric capacitor.
The invention is realized by the following technical scheme:
a small-sized ceramic dielectric capacitor for aerospace use, comprising:
a capacitor ceramic body;
the capacitor inner electrodes are distributed in the capacitor porcelain body in a multi-layer mode, and a dielectric layer is arranged between every two adjacent capacitor inner electrodes;
the two capacitor end electrodes are distributed at two ends of the capacitor porcelain body and are communicated with the capacitor internal electrode;
the capacitor internal electrode is a first internal electrode and is communicated with the second end electrode, the first internal electrode is not communicated with the second internal electrode, and the first internal electrode is arranged in parallel through the first end electrode, and the second internal electrodes are arranged in parallel through the second end electrode.
Specifically, a first end of the first internal electrode is communicated with the first end electrode, and a lap joint margin is arranged between the first internal electrode and the second end electrode;
a second end of the second inner electrode is communicated with the second end electrode, and a lap joint margin is arranged between the second inner electrode and the first end electrode;
and a stacking reserved edge is arranged between the side edges of the first inner electrode and the second inner electrode and the side edge of the capacitor porcelain body.
Optionally, the structure of the capacitor inner electrode is a CC structure or a BB structure;
the capacitor terminal electrode is in a form of a three-layer terminal electrode or a palladium-silver terminal electrode;
the three-layer end electrodes are sequentially as follows from inside to outside: the lead-out end bottom silver layer, the lead-out end nickel layer and the lead-out end tin-lead layer;
the palladium-silver end motor comprises a lead-out end palladium-silver layer.
A method for producing a small-size ceramic dielectric capacitor for aerospace, which is used for producing the small-size ceramic dielectric capacitor for aerospace, comprises the following steps:
determining product parameters, wherein the product parameters comprise product overall dimension, a capacitor inner electrode structure, dielectric layer thickness (F), a lap joint margin (E), a stack margin (G), an end electrode structure and flanging dimension (L);
a slurry preparation process: mixing and proportioning the porcelain powder, the organic adhesive and the organic solvent, and preparing porcelain slurry with certain viscosity by adopting a ball milling process;
a casting process: spraying the porcelain slurry on a PET carrier tape, and drying to obtain a blank porcelain film tape;
silver printing: printing palladium-silver slurry on a blank ceramic membrane strip through a screen printing process, and drying to obtain the ceramic membrane strip printed with the internal electrode slurry;
film laminating step: carrying out dislocation and film lamination on the ceramic film belt printed with the internal electrode slurry on a film laminating machine according to the internal electrode structure of the capacitor to obtain a multilayer structure block;
a dicing procedure: cutting the blocks according to product parameters to obtain product green bodies;
a treatment process: processing the product green embryo into a product mature embryo, and leading out the capacitor internal electrodes at two ends;
a terminal electrode process: coating silver terminal electrode slurry or palladium-silver terminal electrode slurry on two ends of the product blank according to the terminal electrode form, and finishing the processing of the terminal electrode to obtain the capacitor;
a testing procedure: the capacitor was tested.
Further, a warm isostatic pressing process is arranged between the film laminating process and the dicing process, and the warm isostatic pressing process comprises the following steps: vacuumizing the multi-layer structure block, putting the multi-layer structure block into water, and keeping a certain temperature and pressure.
Optionally, the treatment process specifically includes:
a row sticking procedure: treating the product green blank with a certain temperature curve to remove organic matters;
and (3) a sintering process: sintering the product green blank in an air atmosphere to obtain a product mature blank;
chamfering: and (3) performing high-speed barreling on the product blank to eliminate corner stress and lead out the capacitor inner electrode.
Optionally, if the terminal electrode is in the form of a three-layer terminal electrode, the terminal electrode process includes:
end coating procedure: coating silver end electrode slurry on two ends of the product mature embryo;
silver firing procedure: sintering the product green body coated with the silver terminal electrode slurry at high temperature to obtain a product green body of the bottom silver layer of the terminal electrode;
electroplating process: electroplating nickel on the bottom silver layer of the terminal electrode to obtain a lead-out terminal nickel layer, and electroplating a tin-lead layer to obtain a lead-out terminal tin-lead layer to obtain a silver-nickel-tin-lead three-layer terminal electrode;
wherein, when the end coating process is carried out, the size of the flanging is 0.2 +/-0.1 mm.
Optionally, if the terminal electrode is in the form of a palladium-silver terminal electrode, the terminal electrode process comprises:
end coating procedure: coating palladium-silver end electrode slurry on two ends of the product mature blank;
silver firing procedure: and (4) sintering the product mature blank coated with the palladium-silver terminal electrode slurry at high temperature to obtain the product mature blank with the palladium-silver terminal electrode.
Optionally, the testing procedure comprises a semi-finished product processing procedure testing procedure and a finished product processing procedure screening testing procedure;
and a semi-finished product processing flow testing procedure: placing the product mature embryo under the conditions that the temperature is a first temperature and the relative humidity is a first humidity, keeping the first test time for wetting, and testing the reliability of the product mature embryo;
finished product processing flow screening and testing procedure: performing temperature impact, voltage treatment, electrical property test, ultrasonic nondestructive test and appearance and weldability test on the product mature blank to obtain a finished product;
wherein the first temperature, the first humidity and the first test time are set values;
wherein, the screening test procedure of the finished product processing flow specifically comprises:
a temperature impact procedure: switching between the second temperature and the third temperature, and circulating for N times, wherein the heat preservation time at the two temperatures is the second test time, and the switching time is less than the third test time;
a voltage treatment process: applying n times of rated voltage at a third temperature, and keeping a fourth test time;
and (3) an electrical property testing procedure: when the withstand voltage is tested, applying m times of rated voltage;
and the second temperature, the third temperature, the second test time, the third test time, the fourth test piece, N, N and m are set values.
Compared with the prior art, the invention has the following advantages and beneficial effects:
the plurality of first inner electrodes are connected with the first end electrode, the plurality of second inner electrodes are connected with the second end electrode, so that the parallel connection of the first inner electrodes and the parallel connection of the second inner electrodes are realized, and the function of a capacitor is realized through the multilayer distributed capacitor inner electrodes;
according to the invention, through a screen printing process, metal inner electrode slurry is printed on a ceramic diaphragm, the ceramic diaphragm is subjected to staggered lamination, cutting, row adhesion and high-temperature sintering to form a ceramic chip, end silver electrodes are packaged at two ends of the ceramic chip to form a multilayer structure capacitor, and the practical use requirement can be met on a small size.
Drawings
The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate exemplary embodiments of the invention and together with the description serve to explain the principles of the invention.
Fig. 1 is a schematic structural diagram of a small-sized ceramic dielectric capacitor for aerospace according to the present invention, wherein the terminal electrode is a three-layer terminal electrode.
Fig. 2 is a schematic structural view of a small-sized ceramic dielectric capacitor for aerospace according to the present invention, wherein the terminal electrode is a palladium-silver terminal electrode.
FIG. 3 is a side view of a small-sized ceramic dielectric capacitor for aerospace according to the present invention, in which the internal electrode structure is BB.
Fig. 4 is an end view of a small-sized ceramic dielectric capacitor for aerospace according to the present invention, in which the internal electrode structure is a BB structure.
Fig. 5 is a side view of a small-sized ceramic dielectric capacitor for aerospace according to the present invention, in which an internal electrode structure is a CC structure.
Fig. 6 is an end view of a small-sized ceramic capacitor for aerospace according to the present invention, in which the internal electrode structure is a CC structure.
Fig. 7 is a schematic view of an inner electrode wire mesh according to the present invention.
Fig. 8 is a schematic flow chart of a production method of a small-size ceramic dielectric capacitor for aerospace according to the invention.
FIG. 9 is a schematic view of the end electrode flanging of the product cooked embryo according to the invention.
Reference numerals: 1-a capacitor porcelain body, 2-a capacitor inner electrode, 3-a dielectric layer, 4-a lead-out end bottom silver layer, 5-a lead-out end nickel layer, 6-a lead-out end tin-lead layer and 7-a lead-out end palladium-silver layer;
e-overlap edge, F-medium thickness, G-stack edge and L-flanging size.
Detailed description of the preferred embodiments
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention will be further described in detail with reference to the accompanying drawings and embodiments. It is to be understood that the specific embodiments described herein are for purposes of illustration only and are not to be construed as limitations of the invention.
It should be noted that, for convenience of description, only the portions related to the present invention are shown in the drawings.
Embodiments of the present invention and features of the embodiments may be combined with each other without conflict. The present invention will be described in detail below with reference to the accompanying drawings in conjunction with embodiments.
Example one
As shown in fig. 1 and 2, the present embodiment provides a small-sized ceramic dielectric capacitor for aerospace use, comprising a capacitor ceramic body 1, a capacitor internal electrode 2 and a capacitor terminal electrode.
The capacitor porcelain body 1 is a ceramic structure which is used as a medium of a capacitor. The capacitor internal electrodes 2 are distributed in the capacitor ceramic body 1 in a multi-layer mode, a dielectric layer 3 is arranged between every two adjacent capacitor internal electrodes 2, and the dielectric layer 3 is one part of the capacitor ceramic body 1. Two capacitor terminal electrodes are distributed at two ends of the capacitor porcelain body 1 and are communicated with the capacitor inner electrode 2.
For convenience of description, the capacitor terminal electrodes are set as the first terminal electrode and the second terminal electrode. The capacitor terminal electrode is in the form of a three-layer terminal electrode or a palladium-silver terminal electrode. FIG. 1 shows a three-layer terminal electrode, and FIG. 2 shows a palladium-silver terminal electrode.
The three layers of end electrodes are sequentially as follows from inside to outside: the lead-out terminal comprises a lead-out terminal bottom silver layer 4, a lead-out terminal nickel layer 5 and a lead-out terminal tin-lead layer 6, wherein the lead content of the lead-out terminal lead-tin layer is more than or equal to 4%; the palladium-silver end motor comprises a lead-out palladium-silver layer 7.
The capacitor internal electrode 2 communicating with the first terminal electrode is set as a first internal electrode, the second internal electrode of the capacitor internal electrode 2 communicating with the second terminal electrode is set,
the first internal electrodes are not communicated with the second internal electrodes, the first internal electrodes are arranged in parallel through the first end electrodes, and the second internal electrodes are arranged in parallel through the second end electrodes.
As shown in fig. 3 and 4, the first end of the first internal electrode communicates with the first terminal electrode, and a lap margin E is provided between the first internal electrode and the second terminal electrode.
A second end of the second internal electrode is communicated with the second end electrode, and a lap joint margin E is arranged between the second internal electrode and the first end electrode;
the first inner electrode and the second inner electrode are not communicated and are provided with a medium layer 3, and the thickness of the medium layer 3 is larger than 10 mu m.
As shown in fig. 5 and 6, a stacking margin G is provided between the side edges of the first and second internal electrodes and the side edge of the capacitor porcelain body 1.
The structure of the capacitor inner electrode 2 is a CC structure or a BB structure; the structure shown in fig. 3 is a CC structure, and the structure shown in fig. 4 is a BB structure.
The CC structure is characterized in that a first end of a first electrode sheet is communicated with a first end electrode, and a gap is formed between a second end of the first end electrode and a second end electrode, so that the first electrode sheet is connected with the first end electrode and is not connected with the second end electrode.
The BB structure is characterized in that the first end of the first electrode plate is communicated with the first end electrode, the third electrode plate and the first electrode plate are positioned on the same horizontal plane, the first end of the third electrode plate is connected with the second end electrode, and a gap is formed between the second end of the first electrode plate and the second end of the third electrode plate.
Example two
The present embodiment provides a method for producing a small-sized ceramic dielectric capacitor for aerospace use in the first embodiment, as shown in fig. 8, the method comprising:
determining product parameters, wherein the product parameters comprise the product overall dimension, the structure (BB or CC structure) of an electrode 2 in the capacitor, the medium thickness F, the overlap edge E, the stack edge G, the end electrode form (three layers of end electrodes or palladium-silver end electrodes) and the flanging width L of the end electrode; the structure of the silk screen is shown in fig. 7, the overall dimension of the product is determined through the design of screen parameters A, B, C, D and dislocation quantity, the length is 1.0 +/-0.1 mm, the width is 0.5 +/-0.1 mm, the overlap margin E is not less than 40 mu m, the stacking margin G is not less than 50 mu m, and the structure of the electrode 2 in the product is determined. By determining the thickness of the casting ceramic film and the number of laminated film layers, the medium thickness F of the product can be determined to be not less than 10 mu m, and the thickness of the capacitor meets 0.4-0.6mm. And determining that the structure of the terminal electrode and the width L of the flanging of the terminal electrode meet 0.2 +/-0.1 mm by determining the end coating process parameters.
A slurry preparation procedure: mixing and proportioning the porcelain powder, the organic adhesive, the organic solvent and other materials, and preparing the porcelain slurry with certain viscosity by adopting a ball milling process.
A casting process: and spraying the porcelain slurry onto a PET carrier tape, and drying at a certain speed and temperature to obtain the blank porcelain film tape.
Silver printing: printing the palladium-silver slurry on a blank ceramic membrane strip by a screen printing process, drying at a certain strip speed, and obtaining the ceramic membrane strip printed with the internal electrode slurry after drying.
Film laminating step: carrying out dislocation and lamination on the ceramic film belt printed with the internal electrode slurry on a laminating machine according to the structure of the capacitor internal electrode 2 to obtain a multilayer structure block; namely, a plurality of ceramic membrane belts printed with inner electrode slurry are obtained after the silver printing process, and the upper layer ceramic membrane belt and the lower layer ceramic membrane belt are arranged in a staggered mode according to the structure of the inner electrode silk screen on the ceramic membrane belts.
A warm isostatic pressing procedure: vacuumizing the multi-layer structure bar block, putting the bar block into water, and keeping a certain temperature and pressure to further compact the bar block.
A dicing procedure: cutting the blocks according to product parameters to obtain product green bodies; when the films are laminated, different dislocation modes are set as required, and the internal electrode patterns of the product can be prepared into a 'BB' internal electrode structure or a 'CC' internal electrode structure, as shown in fig. 3, 4, 5 and 6.
A row sticking procedure: treating the product green blank with a certain temperature curve to remove organic matters; most of organic matters in the green body are removed through the treatment of a certain temperature curve, namely the organic matters added in the batching procedure and the organic matters in the inner electrode slurry are removed, so that the influence on subsequent sintering to form porcelain is avoided.
And (3) a sintering process: sintering the product green blank in an air atmosphere to obtain a product mature blank; chamfering: and (3) eliminating corner stress by high-speed barreling of the product blank, and leading out the capacitor inner electrode 2. In the chamfering equipment, the corners of the chip are barreled smoothly under the grinding action by high-speed barreling with a grinding medium, so that the corner stress is eliminated, and the inner electrode is led out at the same time.
A terminal electrode process: coating silver terminal electrode slurry or palladium-silver terminal electrode slurry on two ends of the product blank according to the terminal electrode form, and finishing the processing of the terminal electrode to obtain the capacitor;
and (3) a testing procedure: testing the capacitor, including a semi-finished product processing flow testing procedure and a finished product processing flow screening testing procedure;
and a semi-finished product processing flow testing procedure: placing the product mature embryo at a first temperature (40 +/-2 ℃ in the embodiment) and a first relative humidity (95 +/-3 percent in the embodiment) for a first test time (48 hours in the embodiment) for wetting, and testing the reliability of the product mature embryo; after being affected with damp, if the porcelain body has cracks, moisture enters to cause electrical property abnormity, and the electric property is tested to pass withstand voltage (n times of rated voltage is applied, n =3.5 in the embodiment), insulation resistance and capacity loss. Products with unqualified electrical properties are removed, and the requirement of high-reliability products is met.
Finished product processing flow screening and testing procedure: and (3) carrying out temperature impact, voltage treatment, electrical property test, ultrasonic nondestructive test and appearance and weldability test on the product mature blank to obtain a finished product.
The temperature impact and voltage treatment is to apply temperature and electric stress to the product and remove the defective products which fail in the early stage. The requirement of a high-reliability product is met.
A temperature impact process: the temperature is switched between the second temperature (in the embodiment, the temperature is-55 ℃) and the third temperature (in the embodiment, the temperature is 125 ℃) and the cycle is N (in the embodiment, the temperature is N = 10), the holding time at the two temperatures is the second test time (in the embodiment, the temperature is 30 min), and the switching time is shorter than the third test time (in the embodiment, the temperature is 1 min).
A voltage treatment process: at 125 ℃, n times the nominal voltage (n =3 is chosen in this example) is applied for a fourth test time (50 h is chosen in this example).
After temperature shock and voltage treatment, products with unqualified electrical property are removed by testing the withstand voltage (applying 3.5 times of rated voltage), the insulation resistance and the capacity loss again, and the requirement of high-reliability products is met.
Ultrasonic nondestructive testing: and eliminating air defects inside the capacitor through ultrasonic nondestructive testing. The requirement of a high-reliability product is met.
And (3) an inspection process: and (5) inspecting the appearance, the electrical property, the weldability and the like of the product and then warehousing.
In addition, the terminal electrode process includes the following two methods depending on the terminal electrode form:
first, if the terminal electrode form is a three-layer terminal electrode, the terminal electrode process includes:
end coating procedure: coating silver end electrode slurry on two ends of the product mature embryo; in the end coating production process, the flanging size L is controlled to be 0.2 +/-0.1 mm, as shown in figure 9, and good adhesion between the end electrode and the capacitor porcelain body 1 is ensured. And drying the product blank coated with the termination electrode to form a solidified lead-out end bottom silver layer 4.
Silver firing procedure: sintering the product green body coated with the silver terminal electrode slurry at high temperature to obtain a product green body with a bottom silver layer 4 at the leading-out end; through high-temperature sintering, glass material and conductive medium in the silver terminal electrode slurry permeate into the porcelain body, organic matter in the silver terminal electrode slurry volatilizes, and the product mature blank and the silver terminal electrode slurry are tightly combined, so that the lead-out terminal bottom silver layer 4 is formed.
Electroplating process: electroplating nickel on the bottom silver layer 4 of the leading end to obtain a leading end nickel layer 5, and electroplating a tin-lead layer to obtain a leading end tin-lead layer 6, so as to obtain the silver-nickel-tin-lead three-layer terminal electrode.
Secondly, if the terminal electrode is a palladium-silver terminal electrode, the terminal electrode process comprises:
end coating procedure: coating palladium-silver terminal electrode slurry on two ends of a product mature blank; in the end coating production process, the flanging size L is controlled to be 0.2 +/-0.1 mm, as shown in figure 9, and good adhesion between the end electrode and the capacitor porcelain body 1 is ensured. And drying the product blank coated with the termination electrode to form a cured termination electrode.
Silver firing procedure: and (3) sintering the product mature blank coated with the palladium-silver terminal electrode slurry at high temperature to obtain a product mature blank with a lead-out terminal palladium-silver layer 7. Through high-temperature sintering, the glass material and the conductive medium in the palladium-silver terminal electrode slurry permeate into the ceramic body, organic matters in the palladium-silver terminal electrode slurry volatilize, and the ceramic body and the terminal slurry are tightly combined, so that the palladium-silver terminal electrode is formed.
In the description herein, reference to the description of the terms "one embodiment/mode," "some embodiments/modes," "example," "specific example," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment/mode or example is included in at least one embodiment/mode or example of the application. In this specification, the schematic representations of the terms used above are not necessarily intended to be the same embodiment/mode or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments/modes or examples. Furthermore, the various embodiments/aspects or examples and features of the various embodiments/aspects or examples described in this specification can be combined and combined by one skilled in the art without conflicting therewith.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present application, "plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise.
It will be understood by those skilled in the art that the foregoing embodiments are merely for clarity of description and are not intended to limit the scope of the invention. It will be apparent to those skilled in the art that other variations or modifications may be made on the above invention and still be within the scope of the invention.
Claims (10)
1. A small-size ceramic dielectric capacitor for aerospace, characterized by comprising:
a capacitor porcelain body (1);
the capacitor internal electrodes (2) are distributed in the capacitor ceramic body (1) in a multi-layer mode, and a dielectric layer (3) is arranged between every two adjacent capacitor internal electrodes (2);
the two capacitor end electrodes are distributed at two ends of the capacitor porcelain body (1) and are communicated with the capacitor internal electrode (2);
wherein, set for the condenser end electrode is first end electrode and second end electrode, establish with first end electrode intercommunication condenser inner electrode (2) be first inner electrode, establish with second end electrode intercommunication the second inner electrode of condenser inner electrode (2), first inner electrode with the second inner electrode does not communicate, and is a plurality of first inner electrode passes through first end electrode parallel arrangement, and a plurality of second inner electrodes pass through second end electrode parallel arrangement.
2. The small-size ceramic dielectric capacitor for aerospace as claimed in claim 1, wherein a first end of the first internal electrode is in communication with the first terminal electrode, and a lap joint margin (E) is provided between the first internal electrode and the second terminal electrode;
a second end of the second inner electrode is communicated with the second end electrode, and a lap joint margin (E) is arranged between the second inner electrode and the first end electrode;
and a stacking reserved edge (G) is arranged between the side edges of the first inner electrode and the second inner electrode and the side edge of the capacitor porcelain body (1).
3. The small-sized ceramic dielectric capacitor for aerospace use according to claim 2, wherein the structure of the capacitor internal electrode (2) is CC structure or BB structure;
the capacitor terminal electrode is in a form of a three-layer terminal electrode or a palladium-silver terminal electrode;
the three-layer end electrodes are sequentially as follows from inside to outside: a lead-out end bottom silver layer (4), a lead-out end nickel layer (5) and a lead-out end tin-lead layer (6);
the palladium-silver terminal electrode comprises a lead-out palladium-silver layer (7).
4. A method for producing a small-sized ceramic dielectric capacitor for aerospace, characterized by producing a small-sized ceramic dielectric capacitor for aerospace as claimed in claim 3, said method comprising:
determining product parameters, wherein the product parameters comprise product overall dimension, capacitor inner electrode (2) structure, medium thickness (F), overlap margin (E), stack margin (G), end electrode structure and flanging dimension (L);
a slurry preparation process: mixing and proportioning the porcelain powder, the organic adhesive and the organic solvent, and preparing porcelain slurry with certain viscosity by adopting a ball milling process;
a casting process: spraying the porcelain slurry on a PET carrier tape, and drying to obtain a blank porcelain film tape;
silver printing: printing palladium-silver slurry on a blank ceramic membrane strip through a screen printing process, and drying to obtain the ceramic membrane strip printed with the internal electrode slurry;
film laminating step: carrying out dislocation and lamination on the ceramic film belt printed with the internal electrode slurry on a laminating machine according to the structure of the capacitor internal electrode (2) to obtain a multi-layer structure block;
a dicing procedure: cutting the blocks according to product parameters to obtain product green bodies;
a treatment process: processing the product green embryo into a product mature embryo, and leading out the capacitor internal electrodes (2) at two ends;
a terminal electrode process: coating silver terminal electrode slurry or palladium-silver terminal electrode slurry on two ends of the product blank according to the terminal electrode form, and finishing the processing of the terminal electrode to obtain the capacitor;
and (3) a testing procedure: the capacitor was tested.
5. The method for producing a small-sized ceramic dielectric capacitor for aerospace as claimed in claim 4, wherein a warm isostatic pressing step is provided between the laminating step and the dicing step, and the warm isostatic pressing step is: vacuumizing the multi-layer structure block, putting the multi-layer structure block into water, and keeping a certain temperature and pressure.
6. The method for producing a small-sized ceramic dielectric capacitor for aerospace as claimed in claim 4, wherein the processing steps specifically include:
a row sticking procedure: treating the product green blank with a certain temperature curve to remove organic matters;
and (3) a sintering process: sintering the product green blank in an air atmosphere to obtain a product mature blank;
chamfering: and (3) performing high-speed barreling on the product blank to eliminate corner stress and lead out the capacitor inner electrode (2).
7. The method for producing a small-sized ceramic dielectric capacitor for aerospace use as claimed in claim 4, wherein, if the terminal electrode is in the form of a three-layered terminal electrode, the terminal electrode process comprises:
end coating procedure: coating silver end electrode slurry on two ends of the product mature embryo;
silver firing procedure: sintering the product green body coated with the silver terminal electrode slurry at high temperature to obtain a product green body with a lead-out terminal bottom silver layer (4);
electroplating process: electroplating nickel on the bottom silver layer (4) of the leading-out end to obtain a leading-out end nickel layer (5), and electroplating a tin-lead layer to obtain a leading-out end tin-lead layer (6) to obtain the silver-nickel-tin-lead three-layer end electrode.
8. The method for producing a small-sized ceramic dielectric capacitor for aerospace use as claimed in claim 4, wherein, if the terminal electrode is in the form of a palladium-silver terminal electrode, the terminal electrode process comprises:
end coating procedure: coating palladium-silver end electrode slurry on two ends of the product mature blank;
silver firing procedure: and (3) sintering the product mature blank coated with the palladium-silver terminal electrode slurry at high temperature to obtain the product mature blank with the lead-out terminal palladium-silver layer (7).
9. The method for producing a small-sized ceramic dielectric capacitor for aerospace use as claimed in claim 4, wherein the testing process comprises a semi-finished product process flow testing process and a finished product process flow screening testing process;
and a semi-finished product processing flow testing procedure: placing the product mature embryo under the conditions that the temperature is a first temperature and the relative humidity is a first humidity, keeping the first test time for wetting, and testing the reliability of the product mature embryo;
screening and testing procedures of a finished product processing flow: carrying out temperature impact, voltage treatment, electrical property test, ultrasonic nondestructive test and appearance and weldability test on the product mature blank to obtain a finished product;
wherein the first temperature, the first humidity and the first test time are set values.
10. The method for producing a small-sized ceramic dielectric capacitor for aerospace according to claim 9, wherein the screening and testing procedures of the finished product processing flow specifically include:
a temperature impact process: switching between the second temperature and the third temperature, and circulating for N times, wherein the heat preservation time at the two temperatures is the second test time, and the switching time is less than the third test time;
a voltage treatment process: applying n times of rated voltage at a third temperature, and keeping a fourth test time;
and (3) an electrical property testing procedure: when the withstand voltage is tested, applying m times of rated voltage;
and the second temperature, the third temperature, the second test time, the third test time, the fourth test piece, N, N and m are set values.
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