CN115851188A - Solvent type nail-free glue and preparation method and application thereof - Google Patents

Solvent type nail-free glue and preparation method and application thereof Download PDF

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Publication number
CN115851188A
CN115851188A CN202211456937.0A CN202211456937A CN115851188A CN 115851188 A CN115851188 A CN 115851188A CN 202211456937 A CN202211456937 A CN 202211456937A CN 115851188 A CN115851188 A CN 115851188A
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solvent
percent
nail
free glue
resin
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Inventor
张兵
苗永志
郭明杰
陈梓东
方明华
刘碧云
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Guangzhou Nippon Paint Co Ltd
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Guangzhou Nippon Paint Co Ltd
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Abstract

The invention discloses a solvent type nail-free adhesive and a preparation method and application thereof, belonging to the field of adhesives. The solvent type nail-free glue comprises the following components in percentage by mass: 2 to 30 percent of thermoplastic rubber, 2 to 35 percent of tackifying resin, 5 to 50 percent of solvent, 0.05 to 5 percent of thixotropic agent, 0 to 60 percent of filler and 0 to 2 percent of auxiliary agent; the solvent comprises at least one of tetrachloroethylene, monofluorodichloroethane and methyl acetate, and the solvent is not methyl acetate alone. The solvent type nail-free glue is prepared by selecting a solvent system and regulating and controlling the distribution ratio of each component. The solvent system used in the invention has good dissolubility for rubber, the shear strength of the prepared solvent type nail-free glue is more than or equal to 3.5MPa, the mechanical property is good, the flash point in a closed cup experiment exceeds 70 ℃, the nail-free glue has non-inflammability, is a non-dangerous product, can be transported according to common goods on roads, and has great advantages in the aspects of transportation, storage and the like.

Description

Solvent type nail-free glue and preparation method and application thereof
Technical Field
The invention belongs to the field of adhesives, and particularly relates to a solvent type nail-free adhesive as well as a preparation method and application thereof.
Background
The nail-free glue is also called a liquid nail, is a multifunctional decorative adhesive with strong adhesive force, and can replace a nail to realize non-nail hole bonding. The nail-free glue has the characteristics of high curing speed, high bonding strength, wide application range, convenience in use and the like, and is widely applied to industries of decoration, furniture manufacture, artware manufacture and the like. Non-flammable liquid means that the product has a flash point in the closed cup test of over 60 deg.C, or a flash point in the open cup test of over 65.6 deg.C, or a flash point of over 35 deg.C and does not burn continuously. The traditional solvent type nail-free glue is prepared by dissolving thermoplastic rubber, tackifying resin and the like by a solvent A, and due to the use of the solvent A, a product is a highly flammable liquid and is classified according to related regulations, the traditional nail-free glue is dangerous goods, and transportation management and control are required according to dangerous goods during transportation. With the increasing importance of the country on safety production, the disadvantages of the traditional nail-free glue in the aspects of transportation, storage and the like are gradually highlighted.
Conventional solvent-based nail-free adhesives are classified as dangerous goods and are limited in transportation and storage. In order to solve the problem, most manufacturers replace the traditional solvent type nail-free glue with MS nail-free glue or develop water-based nail-free glue. However, the MS nail-free glue is expensive, so that the application of the MS nail-free glue is limited; the water-based nail-free glue product requires at least one base material as an absorption surface, and has strict requirements on the base material.
The traditional solvent type nail-free glue is environment-friendly, has high cost performance and still has a wide market, but most of the solvent type nail-free glue on the market is dangerous goods, and the application of the solvent type nail-free glue is limited because the solvent type nail-free glue needs to be stored and transported in a specific mode. In other words, there is a great need in the market for a non-flammable solvent-based nail-free adhesive.
Disclosure of Invention
In order to overcome the problem that the solvent type nail-free glue in the prior art is flammable, the invention aims to provide the solvent type nail-free glue, and the solvent type nail-free glue has non-flammability, is a non-hazardous article, can be transported according to common goods on roads, and has great advantages in the aspects of transportation, storage and the like.
The second purpose of the present invention is to provide a preparation method of the solvent type nail-free glue.
The invention also aims to provide application of the solvent type nail-free adhesive in the fields of decoration, furniture manufacture and artware manufacture.
In order to achieve the purpose, the technical scheme adopted by the invention is as follows:
the invention provides a solvent type nail-free glue, which comprises the following components in percentage by mass: 2-30% of thermoplastic rubber, 2-35% of tackifying resin, 5-50% of solvent, 0.05-5% of thixotropic agent, 0-60% of filler and 0-2% of auxiliary agent, wherein the solvent comprises at least one of tetrachloroethylene, monofluorodichloroethane and methyl acetate, and the solvent is not methyl acetate alone.
Preferably, in the solvent type nail-free glue, the mass percent of the solvent is 10-40%; further preferably, in the solvent type nail-free glue, the mass percentage of the solvent is 15-35%; more preferably, in the solvent type nail-free glue, the mass percentage of the solvent is 20-35%.
Preferably, the solvent comprises the following components in percentage by mass: 0-85% of tetrachloroethylene, 0-95% of monofluorodichloroethane and 0-40% of methyl acetate, wherein the mass percentages of at least any two components in the solvent are not 0 at the same time.
Preferably, the solvent comprises the following components in percentage by mass: 30 to 60 percent of tetrachloroethylene and 40 to 70 percent of monofluorodichloroethane; further preferably, the solvent comprises the following components in percentage by mass: 35 to 55 percent of tetrachloroethylene and 45 to 65 percent of monofluorodichloroethane; still further preferably, the solvent comprises the following components in percentage by mass: 40 to 50 percent of tetrachloroethylene and 50 to 60 percent of monofluorodichloroethane.
Preferably, the solvent comprises the following components in percentage by mass: 50-85% of tetrachloroethylene and 15-50% of methyl acetate; further preferably, the solvent comprises the following components in percentage by mass: 55 to 80 percent of tetrachloroethylene and 20 to 45 percent of methyl acetate; still further preferably, the solvent comprises the following components in percentage by mass: 60 to 75 percent of tetrachloroethylene and 25 to 40 percent of methyl acetate.
Preferably, the solvent comprises the following components in percentage by mass: 60-95% of monofluorodichloroethane and 5-40% of methyl acetate; further preferably, the solvent comprises the following components in percentage by mass: 65-90% of monofluorodichloroethane, 10-35% of methyl acetate; still further preferably, the solvent comprises the following components in percentage by mass: 70-85% of monofluorodichloroethane and 15-30% of methyl acetate.
Preferably, the solvent comprises the following components in percentage by mass: 30 to 65 percent of tetrachloroethylene, 20 to 60 percent of monofluoro-dichloroethane, and 5 to 30 percent of methyl acetate; further preferably, the solvent comprises the following components in percentage by mass: 35 to 60 percent of tetrachloroethylene, 25 to 55 percent of monofluoro dichloroethane and 8 to 25 percent of methyl acetate; still further preferably, the solvent comprises the following components in percentage by mass: 40 to 55 percent of tetrachloroethylene, 30 to 50 percent of monofluoro dichloroethane and 10 to 20 percent of methyl acetate.
The methyl acetate is added to improve the dissolving capacity of the mixed solvent to materials such as rubber, resin and the like, and meanwhile, the corrosion to a base material due to too high polarity of the mixed solvent can be avoided by regulating and controlling the adding amount of the methyl acetate.
Preferably, in the solvent type nail-free glue, the solvent also comprises an auxiliary solvent; preferably, in the solvent type nail-free glue, the solvent also comprises 1-15% of auxiliary solvent by mass percent; more preferably, in the solvent type nail-free glue, the solvent further comprises an auxiliary solvent with the mass percentage of 5-10%.
Preferably, in the solvent, the auxiliary solvent comprises at least one of 6# solvent oil, 120# solvent oil, methylcyclopentane, cyclohexane, ethyl acetate, acetone and dimethyl carbonate; further preferably, in the solvent, the auxiliary solvent comprises at least one of # 6 solvent oil, # 120 solvent oil, ethyl acetate, acetone and dimethyl carbonate; still more preferably, the auxiliary solvent in the solvent comprises at least one of ethyl acetate, acetone and dimethyl carbonate.
Preferably, in the solvent type nail-free glue, the mass percentage of the filler is not 0; more preferably, in the solvent type nail-free glue, the mass percentage of the filler is 10-45%; more preferably, in the solvent type nail-free glue, the mass percentage of the filler is 30-45%.
Preferably, the filler comprises at least one of aluminum hydroxide, calcium carbonate, kaolin, magnesium hydroxide and hydrotalcite; further preferably, the filler comprises at least one of aluminum hydroxide, calcium carbonate and kaolin.
Preferably, in the solvent type nail-free glue, the mass percent of the thermoplastic rubber is 5-25%; more preferably, in the solvent type nail-free glue, the mass percentage of the thermoplastic rubber is 10-20%; more preferably, in the solvent type nail-free glue, the mass percentage of the thermoplastic rubber is 10-17%.
Preferably, the thermoplastic rubber includes at least one of styrene-butadiene-styrene block copolymer (SBS), styrene-pentadiene-styrene block copolymer (SIS), thermoplastic polyurethane rubber (TPU), thermoplastic polyolefin rubber (TPO), thermoplastic polyvinyl chloride rubber (TPVC); further preferably, the thermoplastic rubber comprises at least one of styrene-butadiene-styrene block copolymer (SBS), styrene-pentadiene-styrene block copolymer (SIS), thermoplastic polyurethane rubber (TPU); still further preferably, the thermoplastic rubber comprises styrene-butadiene-styrene block copolymer (SBS).
Preferably, the SBS rubber is linear SBS rubber, star SBS rubber, or a combination thereof; further preferably, the SBS rubber is a mixture consisting of linear SBS rubber and star SBS rubber; more preferably, the SBS rubber is prepared from (3-8) by mass: 1 linear SBS rubber and star SBS rubber.
Preferably, in the solvent type nail-free glue, the mass percent of the tackifying resin is 5-30%; more preferably, in the solvent type nail-free glue, the mass percentage of the tackifying resin is 10-25%; still more preferably, in the solvent type nail-free glue, the mass percentage of the tackifying resin is 11 to 20%.
Preferably, the tackifying resin comprises at least one of hydrogenated rosin resin, hydrogenated C9 resin, hydrogenated C5 resin, poly α -methylstyrene resin, rosin resin, petroleum resin, terpene resin; further preferably, the tackifier resin includes at least one of hydrogenated rosin resin, poly α -methylstyrene resin, rosin resin, petroleum resin, and terpene resin.
Preferably, the tackifying resin comprises rosin resin and petroleum resin; further preferably, the tackifying resin comprises, by mass, 1: (0.5-2) rosin resins and petroleum resins; still further preferably, the tackifying resin comprises, by mass, 1: (0.8-1.5) rosin resin and petroleum resin.
Preferably, the tackifying resin comprises a poly α -methylstyrene resin and a terpene resin; further preferably, the tackifying resin comprises, by mass, 1: (0.1-2) a poly α -methylstyrene resin and a terpene resin; still further preferably, the tackifying resin comprises, by mass, 1: (0.2-1) a poly alpha-methylstyrene resin and a terpene resin.
Preferably, the tackifying resin comprises a petroleum resin and a hydrogenated rosin resin; further preferably, the tackifying resin comprises, by mass, 1: (0.8 to 3) petroleum resin and hydrogenated rosin resin; still more preferably, the tackifying resin comprises, by mass, 1: (1.2-2) Petroleum resins and hydrogenated rosin resins.
Preferably, the tackifying resin comprises rosin resin and hydrogenated rosin resin; further preferably, the tackifying resin comprises, by mass, 1: (0.8 to 3) rosin resins and hydrogenated rosin resins; still further preferably, the tackifying resin comprises, by mass, 1: the rosin resin and the hydrogenated rosin resin of (1) to (2).
Preferably, in the solvent type nail-free glue, the mass percent of the thixotropic agent is 0.1-4%; more preferably, in the solvent type nail-free glue, the mass percent of the thixotropic agent is 0.5-2.5%; more preferably, in the solvent type nail-free glue, the mass percentage of the thixotropic agent is 1-1.5%.
Preferably, the thixotropic agent comprises at least one of castor oil, fumed silica, precipitated silica, polyamide wax powder and bentonite; further preferably, the thixotropic agent comprises at least one of castor oil, fumed silica, precipitated silica, and polyamide wax powder; still further preferably, the thixotropic agent comprises at least one of castor oil, fumed silica, precipitated silica.
Preferably, in the nail-free glue, the mass percentage of the auxiliary agent is not 0; preferably, in the nail-free glue, the mass percent of the auxiliary agent is 0.1-1.5%; more preferably, in the nail-free glue, the mass percentage of the auxiliary agent is 0.15-1%.
Preferably, the auxiliary agent comprises at least one of an antioxidant, a plasticizer, a coupling agent and a colorant.
Preferably, the antioxidant is at least one of antioxidant 1010, antioxidant 1076, antioxidant 168, antioxidant 626, antioxidant 264 and antioxidant DLTDP; more preferably, the antioxidant is at least one of antioxidant 1010, antioxidant 1076, antioxidant 168 and antioxidant 264; more preferably, the antioxidant is at least one of antioxidant 1010 and antioxidant 264.
Preferably, the plasticizer is at least one of dioctyl phthalate, diisodecyl phthalate, diisononyl phthalate, dibutyl phthalate, dioctyl adipate, diisodecyl adipate, dioctyl sebacate, diisooctyl sebacate, diphenyl monooctyl phosphate, diphenyl phosphate and polypropylene glycol; more preferably, the plasticizer is at least one of dioctyl phthalate, diisodecyl phthalate, diisononyl phthalate, dibutyl phthalate, dioctyl adipate, diisodecyl adipate, dioctyl sebacate and diisooctyl sebacate; still more preferably, the plasticizer is at least one of dioctyl phthalate, dioctyl adipate and dioctyl sebacate.
Preferably, the coupling agent is at least one of a silane coupling agent, a titanate coupling agent and a titanium complex; further preferably, the coupling agent is at least one of a silane coupling agent and a titanate coupling agent; still more preferably, the coupling agent is a silane coupling agent.
Preferably, the colorant is at least one of red iron oxide, yellow iron oxide, carbon black, ultramarine, iron yellow, phthalocyanine blue and phthalocyanine green.
Preferably, the solvent type nail-free glue comprises the following components in percentage by mass: 5 to 25 percent of thermoplastic rubber, 5 to 30 percent of tackifying resin, 10 to 40 percent of solvent, 0.1 to 4 percent of thixotropic agent and 5 to 60 percent of filler;
further preferably, the solvent-based nail-free glue comprises the following components in percentage by mass: 10 to 20 percent of thermoplastic rubber, 10 to 25 percent of tackifying resin, 15 to 35 percent of solvent, 0.5 to 2.5 percent of thixotropic agent and 10 to 45 percent of filler;
still further preferably, the solvent-based nail-free glue comprises the following components in percentage by mass: 10 to 20 percent of thermoplastic rubber, 10 to 25 percent of tackifying resin, 15 to 35 percent of solvent, 0.5 to 2.5 percent of thixotropic agent, 10 to 45 percent of filler and 0.1 to 2 percent of auxiliary agent.
The second aspect of the present invention provides a preparation method of the solvent type nail free glue according to the first aspect of the present invention, comprising the following steps: and mixing the components to obtain the solvent type nail-free glue.
Preferably, the solvent, the thermoplastic rubber and the tackifying resin are mixed firstly, then the thixotropic agent and the auxiliary agent are added for mixing, and finally the flame-retardant filler is added for mixing to prepare the solvent type nail-free adhesive.
Preferably, the mixing is carried out in a high speed dispersion power mixer.
Preferably, the mixing time of the solvent, the thermoplastic rubber and the tackifying resin is 1 to 5 hours; more preferably, the mixing time of the solvent, the thermoplastic rubber and the tackifier resin is 2 to 4 hours.
Preferably, the mixing rotating speed after the thixotropic agent and the antioxidant are added is 800-1200 r/min; further preferably, the mixing speed after the thixotropic agent and the antioxidant are added is 900 to 1100r/min.
Preferably, the mixing time after the thixotropic agent and the antioxidant are added is 5-60 min; further preferably, the mixing time after the thixotropic agent and the antioxidant are added is 10 to 40min.
Preferably, the mixing rotating speed after the flame-retardant filler is added is 800-1200 r/min; further preferably, the mixing speed after adding the flame-retardant filler is 900-1100 r/min.
Preferably, the mixing time after adding the flame-retardant filler is 30-150 min; further preferably, the mixing time after the flame retardant filler is added is 60 to 120min.
In a third aspect, the invention provides an application of the solvent type nail-free glue in the fields of decoration, furniture manufacturing or artware manufacturing.
The invention has the beneficial effects that:
the solvent type nail-free glue is prepared by selecting a solvent system and regulating and controlling the distribution ratio of each component. The solvent system used in the invention has good dissolubility for rubber, the shear strength of the prepared solvent type nail-free glue is more than or equal to 3.5MPa, the mechanical property is good, the flash point in a closed cup experiment exceeds 70 ℃, the nail-free glue has non-inflammability, is a non-dangerous product, can be transported according to common goods on roads, and has great advantages in the aspects of transportation, storage and the like.
Detailed Description
The present invention will be described in further detail with reference to specific examples. It will also be understood that the following examples are included merely for purposes of further illustrating the invention and are not to be construed as limiting the scope of the invention, as the invention extends to insubstantial modifications and adaptations of the invention following in the light of the principles set forth herein. The specific process parameters and the like of the following examples are also only one example of suitable ranges, and the skilled person can make a selection within the suitable ranges through the description herein, and are not limited to the specific data of the following examples. The starting materials, reagents or equipment used in the examples are, unless otherwise specified, either conventionally commercially available or may be obtained by methods known in the art.
The invention is described in detail below by referring to examples and comparative examples, the components of the solvent type nail free glue of each example and comparative example are shown in table 1 below, and the component usage units in table 1 are mass percentages:
TABLE 1 Components and amounts of solvent-based tack-free adhesives of examples 1-4 and comparative example 1
Figure BDA0003953692010000061
Figure BDA0003953692010000071
The solvent type nail free adhesives of examples 1-4 and comparative example 1 were prepared according to the components and amounts in table 1 and the following preparation method:
1) Putting the solvent into a high-speed dispersion power mixer, starting stirring, sequentially adding the thermoplastic rubber and the tackifying resin, and stirring for 1-2 hours until the materials are uniformly dispersed;
2) Adding thixotropic agent and antioxidant, stirring for 10-30 min at 1000 + -50 r/min until the material is dispersed uniformly;
3) Adding flame-retardant filler, and stirring at the rotating speed of 1000 +/-50 r/min for 60-90 min until the materials are uniformly dispersed to obtain the solvent type nail-free adhesive.
Testing the closed cup flash points of the solvent type nail-free glue of the examples 1-4 and the comparative example 1 according to the JT/T617-2018 standard; the solvent type nail free glue of examples 1-4 and comparative example 1 was tested for shear strength according to JC/T2186-2013 standard, and the substrate was beech-aluminum sheet. The test results are reported in table 2.
TABLE 2 nail free glue test results for examples 1-4 and comparative example 1
Example 1 Example 2 Example 3 Example 4 Comparative example 1
Closed cup flash point Above 70 ℃ Above 70 ℃ Above 70 deg.C Above 70 ℃ -17℃
Shear strength/MPa 4.2 4.0 3.5 3.8 4.1
The solvent type nail-free glue prepared in the embodiments 1-4 is tested according to JT/T617-2018 standard, and through a closed cup flash point test, the solvent type nail-free glue does not flash at 70 ℃, which indicates that the goods do not belong to class 3 flammable liquid. The solvent type nail-free glue prepared by the comparative example 1 without adding two solvents of tetrachloroethylene and monofluorodichloroethane has a closed cup flash point of-17 ℃ and is easy to burn through a closed cup flash point test; the boiling point of the product is 53 ℃ through a boiling point determination experiment. It can be seen that, compared with comparative example 1, the solvent type nail-free glue prepared in examples 1 to 4 has non-inflammability, is a non-hazardous article, can be transported by roads according to common goods, and has great advantages in transportation, storage and the like.

Claims (10)

1. The solvent type nail-free glue is characterized by comprising the following components in percentage by mass: 2 to 30 percent of thermoplastic rubber, 2 to 35 percent of tackifying resin, 5 to 50 percent of solvent, 0.05 to 5 percent of thixotropic agent, 0 to 60 percent of filler and 0 to 2 percent of auxiliary agent; the solvent comprises at least one of tetrachloroethylene, monofluorodichloroethane and methyl acetate, and the solvent is not methyl acetate alone.
2. The solvent-based nail-free glue according to claim 1, wherein the solvent-based nail-free glue comprises the following components in percentage by mass: 5 to 25 percent of thermoplastic rubber, 5 to 30 percent of tackifying resin, 10 to 40 percent of solvent, 0.1 to 4 percent of thixotropic agent, 5 to 60 percent of filler and 0.1 to 2 percent of auxiliary agent.
3. The solvent-based nail free glue according to claim 1 or 2, wherein the solvent comprises the following components in percentage by mass: 0-85% of tetrachloroethylene, 0-95% of monofluorodichloroethane and 0-40% of methyl acetate, wherein the mass percentages of at least any two components in the solvent are not 0 at the same time.
4. The solvent-based nail free adhesive according to claim 1 or 2, wherein the solvent further comprises an auxiliary solvent comprising at least one of # 6 solvent oil, # 120 solvent oil, methylcyclopentane, cyclohexane, ethyl acetate, acetone, and dimethyl carbonate.
5. The solvent-based nailer of claim 1 or 2, wherein said filler comprises at least one of aluminum hydroxide, calcium carbonate, kaolin, magnesium hydroxide, hydrotalcite.
6. The solvent-based type nail free adhesive according to claim 1 or 2, wherein the thermoplastic rubber comprises at least one of styrene-butadiene-styrene block copolymer, styrene-pentadiene-styrene block copolymer, thermoplastic polyurethane rubber, thermoplastic polyolefin rubber, thermoplastic polyvinyl chloride rubber.
7. The solvent-based nail free adhesive according to claim 1 or 2, wherein the tackifier resin comprises at least one of hydrogenated rosin resin, hydrogenated C9 resin, hydrogenated C5 resin, poly α -methylstyrene resin, rosin resin, petroleum resin, terpene resin.
8. The solvent-based nailer according to claim 1 or 2, wherein said auxiliary agent comprises at least one of an antioxidant, a plasticizer, a coupling agent, and a colorant.
9. The preparation method of the solvent type nail-free glue according to any one of claims 1 to 8, which is characterized by comprising the following steps:
and mixing the components to obtain the solvent type nail-free glue.
10. Use of the solvent-based nail-free adhesive according to any one of claims 1 to 8 in the fields of decoration, furniture manufacturing or artware manufacturing.
CN202211456937.0A 2022-11-21 2022-11-21 Solvent type nail-free glue and preparation method and application thereof Pending CN115851188A (en)

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104293244A (en) * 2014-10-27 2015-01-21 广东三和化工科技有限公司 Transparent nail-free glue and preparation method thereof
DE202015107078U1 (en) * 2015-12-23 2016-01-20 Polyone Corporation Thermoplastic elastomer composition
CN108048002A (en) * 2017-11-19 2018-05-18 朱呈利 A kind of timber special environment protection adhesive
CN111320954A (en) * 2020-03-20 2020-06-23 哥俩好新材料股份有限公司 Special nail-free glue for environment-friendly advertising words and preparation method thereof

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104293244A (en) * 2014-10-27 2015-01-21 广东三和化工科技有限公司 Transparent nail-free glue and preparation method thereof
DE202015107078U1 (en) * 2015-12-23 2016-01-20 Polyone Corporation Thermoplastic elastomer composition
CN108048002A (en) * 2017-11-19 2018-05-18 朱呈利 A kind of timber special environment protection adhesive
CN111320954A (en) * 2020-03-20 2020-06-23 哥俩好新材料股份有限公司 Special nail-free glue for environment-friendly advertising words and preparation method thereof

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