CN115851080B - Epoxy plastic package chip protection film and preparation method thereof - Google Patents
Epoxy plastic package chip protection film and preparation method thereof Download PDFInfo
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- CN115851080B CN115851080B CN202211662014.0A CN202211662014A CN115851080B CN 115851080 B CN115851080 B CN 115851080B CN 202211662014 A CN202211662014 A CN 202211662014A CN 115851080 B CN115851080 B CN 115851080B
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Abstract
The application relates to an epoxy plastic package material chip protection film and a preparation method thereof, and relates to the field of electronic chip protection films, wherein the film comprises the following components: epoxy resin and carbon black, the shading L value of the carbon black is 36-40. The film takes epoxy resin as main resin, so that the chip protection film has the characteristics of the film: if the carbon black has extensibility, toughness, viscosity and the like, the glossiness of the carbon black is improved by the carbon black with the brightness L value of 36-40, the carbon black with the L value has the characteristics of high blackness and high reflectivity, and the carbon black has good leveling property and dispersibility, and can improve the mirror effect of the film material, thereby improving the glossiness.
Description
Technical Field
The application relates to the field of electronic chip protection films, in particular to an epoxy plastic package chip protection film and a preparation method thereof.
Background
In order to ensure that the electronic chip has certain strength, a layer of protective film is required to be adhered to the back of the chip with a circuit on the surface, and laser engraving is required to be carried out on the layer of protective film for product tracing and unified management of models and trademarks. However, the traditional chip protection film has lower glossiness, characters engraved by laser are dull and dull under the microscope light field, the contrast ratio of a dark background and a black font is poor, and the engraved characters are unclear, so that the equipment is difficult to effectively recognize the characters.
Disclosure of Invention
The application provides an epoxy plastic package material chip protection film and a preparation method thereof, which are used for solving the problem of low glossiness of the traditional chip protection film.
In a first aspect, the present application provides an epoxy molding compound chip protection film, the film includes the following components: epoxy resin and carbon black, the shading L value of the carbon black is 36-40.
Further, the particle diameter of the carbon black is 20nm-25nm.
Further, the carbon black is carbon black S160 and/or carbon black 808A.
Further, the composition of the film further comprises: spherical silica and a curing agent.
Further, the D50 particle size of the spherical silica is 0.2-0.4 μm.
Further, the epoxy resin includes bisphenol a type epoxy resin and bisphenol F type epoxy resin; the mass ratio of the bisphenol A type epoxy resin to the bisphenol F type epoxy resin is 1.5-2.5: 1.
further, the curing agent is naphthol curing agent.
Further, the mass ratio of the epoxy resin, the spherical silicon dioxide, the curing agent and the carbon black is (35-40):
(33～37)：(24～26)：(1～3)。
further, the components of the film also comprise phosphine curing accelerators.
In a second aspect, the present application provides a method for preparing an epoxy molding compound chip protection film, which is used for preparing the epoxy molding compound chip protection film in the first aspect, and the preparation method includes:
mixing the raw materials to obtain slurry;
placing the slurry in an environment with a set vacuum degree to defoam until the slurry has no bubbles;
and coating the defoamed sizing agent on a release film coated with silicone oil, and then drying.
Compared with the prior art, the technical scheme provided by the embodiment of the application has the following advantages:
the epoxy plastic package material chip protection film provided by the embodiment of the application comprises the following components: epoxy resin and carbon black, the shading L value of the carbon black is 36-40. The film takes epoxy resin as main resin, so that the chip protection film has the characteristics of the film: if the carbon black has extensibility, toughness, viscosity and the like, the glossiness of the carbon black is improved by the carbon black with the brightness L value of 36-40, the carbon black with the L value has the characteristics of high blackness and high reflectivity, and the carbon black has good leveling property and dispersibility, and can improve the mirror effect of the film material, thereby improving the glossiness.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the application and together with the description, serve to explain the principles of the application.
In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings that are required to be used in the description of the embodiments or the prior art will be briefly described below, and it will be obvious to those skilled in the art that other drawings can be obtained from these drawings without inventive effort.
Fig. 1 is a engraved image of an epoxy molding compound chip protection film provided in embodiment 1 of the present application;
fig. 2 is a engraved image of an epoxy molding compound chip protection film provided in embodiment 2 of the present application;
fig. 3 is a engraved image of an epoxy molding compound chip protection film provided in comparative example 1 of the present application;
fig. 4 is a engraved image of an epoxy molding compound chip protection film provided in comparative example 2 of the present application;
fig. 5 is a engraved image of an epoxy molding compound chip protection film provided in comparative example 3 of the present application.
Detailed Description
For the purposes of making the objects, technical solutions and advantages of the embodiments of the present application more clear, the technical solutions of the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is apparent that the described embodiments are some embodiments of the present application, but not all embodiments. All other embodiments, which can be made by one of ordinary skill in the art without undue burden from the present disclosure, are within the scope of the present application based on the embodiments herein.
Unless specifically indicated otherwise, the various raw materials, reagents, instruments, equipment, and the like used in this application are commercially available or may be prepared by existing methods.
In a first aspect, an embodiment of the present application provides an epoxy molding compound chip protection film, where the film includes the following components: epoxy resin and carbon black, the shading L value of the carbon black is 36-40.
The epoxy plastic package material chip protection film provided by the embodiment of the application comprises the following components: epoxy resin and carbon black, the shading L value of the carbon black is 36-40. The film takes epoxy resin as main resin, so that the chip protection film has the characteristics of the film: if the carbon black has extensibility, toughness, viscosity and the like, the glossiness of the carbon black is improved by the carbon black with the brightness L value of 36-40, the carbon black with the L value has the characteristics of high blackness and high reflectivity, and the carbon black has good leveling property and dispersibility, and can improve the mirror effect of the film material, thereby improving the glossiness.
The darkness L value in the application is L value in Lab values, which are Lab values measured by a color difference meter, and represent three latitudes of color measurement.
In some embodiments, the carbon black can have a shade L value of 36, 37, 38, 39, 40, etc.
As an embodiment of the present invention, the carbon black has a particle diameter of 20nm to 25nm.
In the application, the carbon black with the particle size has better dispersing effect and leveling property.
In some embodiments, the carbon black can have a particle size of 20nm, 21nm, 22nm, 23nm, 24nm, 25nm, and the like.
As an embodiment of the present examples, the carbon black is carbon black S160 and/or carbon black 808A.
As an implementation of the embodiment of the present invention, the components of the film further include: spherical silica and a curing agent.
In the present application, spherical silica is a filler, and has the effect of dispersing an epoxy resin and increasing the glass transition temperature. The curing agent can react with the epoxy resin at a specific temperature to crosslink the epoxy resin, so that the film can be cured on the surface of the chip.
As an embodiment of the present invention, the spherical silica has a D50 particle size of 0.2 to 0.4. Mu.m.
In some embodiments, the D50 particle size of the spherical silica may be 0.2 μm, 0.25 μm, 0.3 μm, 0.35 μm, 0.4 μm, etc.
As an embodiment of the present embodiment, the epoxy resin includes bisphenol a type epoxy resin and bisphenol F type epoxy resin; the mass ratio of the bisphenol A type epoxy resin to the bisphenol F type epoxy resin is 1.5-2.5: 1.
in the application, the bisphenol A epoxy resin has strong adhesive force to metal, strong chemical corrosion resistance, high mechanical strength, good electrical insulation and corrosion resistance; bisphenol F type epoxy resin is characterized by low viscosity. The epoxy resin in the proportion has the characteristics of bisphenol A type and bisphenol F type resin, and the viscosity of the resin in the proportion is more favorable for improving the uniformity and the stability of the epoxy resin in the whole process.
In some embodiments, the bisphenol a type epoxy resin and bisphenol F type epoxy resin may have a mass ratio of 1.5: 1. 1.6: 1. 1.7: 1. 1.8: 1. 1.9: 1. 2: 1. 2.1: 1. 2.2: 1. 2.3: 1. 2.4: 1. 2.8:1, etc.
As an implementation mode of the embodiment of the invention, the curing agent is naphthol curing agent.
In the application, the curing agent is mild, can be subjected to curing reaction with resin at a higher temperature, and has small curing reaction shrinkage.
As an implementation mode of the embodiment of the invention, the mass ratio of the epoxy resin, the spherical silica, the curing agent and the carbon black is (35-40): (33-37): (24-26): (1-3).
In the application, the film manufactured in the proportion can meet the characteristics of high Tg, high elongation, high modulus, high strength, low expansion coefficient, high silicon wafer adhesion and the like of the chip protection film.
In some embodiments, the mass ratio of the epoxy resin, spherical silica, curing agent, and carbon black may be 35:33:24: 1. 36:34:24: 1. 37:35:25: 2. 38:35:25: 2. 39:36:26: 3. 40:37:26:3, etc.
As an implementation of the embodiment of the present invention, the components of the film further include a phosphine-based curing accelerator.
In the application, the phosphine curing agent can increase the flame retardant property, transparency, mechanical property and thermal stability of the film.
In a second aspect, the present application provides a method for preparing an epoxy molding compound chip protection film, which is used for preparing the epoxy molding compound chip protection film in the first aspect, and the preparation method includes:
mixing the raw materials to obtain slurry;
placing the slurry in an environment with a set vacuum degree to defoam until the slurry has no bubbles;
and coating the defoamed sizing agent on a release film coated with silicone oil, and then drying.
The present application is further illustrated below in conjunction with specific examples. It should be understood that these examples are illustrative only of the present application and are not intended to limit the scope of the present application. The experimental procedures, which are not specified in the following examples, are generally determined according to national standards. If the corresponding national standard does not exist, the method is carried out according to the general international standard, the conventional condition or the condition recommended by the manufacturer.
Example 1
An epoxy plastic package chip protection film and a preparation method thereof specifically comprise the following steps:
(1) Raw material selection: taking 25 parts of bisphenol A type epoxy resin, 12 parts of bisphenol F type epoxy resin, 25 parts of naphthol curing agent (Kenmet materials science and technology Co., ltd., brand SN-395), 1 part of triphenylphosphine, 160 parts of carbon black S1 part (particle size: 20nm, brightness L value: 39.17) and 35 parts of spherical silica (D50 particle size: 0.3 μm) according to parts by mass;
(2) Preparation: stirring epoxy resin in a planetary stirrer at 85 ℃ for 220min, adding spherical silicon dioxide and carbon black at 105 ℃ and stirring for 120min, adding a curing agent at 30 ℃ and stirring for 40min to obtain slurry;
vacuumizing the slurry to-0.097 MPa, and defoaming until the slurry has no bubbles;
and coating the defoamed slurry on a release film coated with silicone oil, and drying to obtain the epoxy plastic package chip protection film (the obtained epoxy plastic package chip protection film is shown in figure 1).
Example 2
An epoxy plastic package chip protection film and a preparation method thereof specifically comprise the following steps:
(1) Raw material selection: 21 parts of bisphenol A type epoxy resin, 14 parts of bisphenol F type epoxy resin, 24 parts of naphthol curing agent (Kenmet materials science and technology Co., ltd., brand SN-395), 1 part of triphenylphosphine, 1 part of carbon black 178A (particle size: 22nm, brightness L value: 36.99) and 33 parts of spherical silica (D50 particle size: 0.2 μm) are taken according to parts by mass;
(2) Preparation: stirring epoxy resin in a planetary stirrer at 75 ℃ for 240min, adding spherical silicon dioxide and carbon black at 95 ℃ and stirring for 150min, adding a curing agent at 35 ℃ and stirring for 60min to obtain slurry;
vacuumizing the slurry to-0.09 MPa, and defoaming until the slurry is bubble-free;
and coating the defoamed slurry on a release film coated with silicone oil, and drying to obtain the epoxy plastic package chip protection film (the obtained epoxy plastic package chip protection film is shown in figure 2).
Example 3
An epoxy plastic package chip protection film and a preparation method thereof specifically comprise the following steps:
(1) Raw material selection: 28 parts of bisphenol A type epoxy resin, 12 parts of bisphenol F type epoxy resin, 26 parts of naphthol curing agent (Kenmet materials science and technology Co., ltd., brand SN-395), 1 part of triphenylphosphine, 160 parts of carbon black S3 parts (particle size: 25nm, brightness L value: 39.17) and 37 parts of spherical silica (D50 particle size: 0.4 μm) are taken according to the parts by mass;
(2) Preparation: stirring epoxy resin in a planetary stirrer at 95 ℃ for 200min, adding spherical silicon dioxide and carbon black at 115 ℃ and stirring for 100min, adding a curing agent at 38 ℃ and stirring for 30min to obtain slurry;
vacuumizing the slurry to-0.095 MPa, and defoaming until the slurry has no bubbles;
and coating the defoamed sizing agent on a release film coated with silicone oil, and drying to obtain the epoxy plastic package chip protection film.
Example 4
The procedure of example 1 was repeated except that the carbon black S160 in example 1 was changed to 2 parts.
Example 5
The procedure of example 1 was repeated except that the carbon black S160 in example 1 was changed to 3 parts.
Example 6
Carbon black 808A in example 2 was changed to 2 parts, and the rest was the same as in example 2.
Example 7
Carbon black 808A in example 2 was changed to 3 parts, and the rest was the same as in example 2.
Comparative example 1
The procedure of example 1 was repeated except that the carbon black S160 in example 1 was changed to carbon black 2500 (the light-shade value L was 35.41) and the same as in example 1 (the obtained epoxy molding compound chip protection film was shown in FIG. 3).
Comparative example 2
The procedure of example 1 was repeated except that the carbon black S160 in example 1 was changed to carbon black 3500 (the light-dark degree L value: 34.22), and the resultant epoxy molding compound chip protecting film was the same as that of example 1 (FIG. 4).
Comparative example 3
The procedure of example 1 was repeated except that the carbon black S160 in example 1 was changed to carbon black 505 (the light-dark degree L value: 32.67) and the procedure was repeated except that the protective film for the epoxy molding compound chip was formed as shown in FIG. 5.
The films prepared in the examples and comparative examples were subjected to gloss testing as follows: the gloss (angle 60 degrees) was measured with a gloss meter and the results are shown in table 1.
Table 1 results of gloss testing of films
The test method of the L value of the carbon black in the application comprises the following steps: putting the powder into a thinner regular container, fully spreading the powder, covering the powder with a glass sheet, entering a measurement mode after the calibration of a spectrocolorimeter is completed, pressing a measurement window cover on the glass sheet, ensuring that the pressing is tight and the glass sheet is not crushed, clicking to start measurement, waiting for the end of measurement and reading chromaticity data.
Various embodiments of the present application may exist in a range format; it should be understood that the description in a range format is merely for convenience and brevity and should not be interpreted as a rigid limitation on the scope of the application. It is therefore to be understood that the range description has specifically disclosed all possible sub-ranges and individual values within that range. For example, it should be considered that a description of a range from 1 to 6 has specifically disclosed sub-ranges, such as from 1 to 3, from 1 to 4, from 1 to 5, from 2 to 4, from 2 to 6, from 3 to 6, etc., as well as single numbers within the range, such as 1, 2, 3, 4, 5, and 6, wherever applicable. In addition, whenever a numerical range is referred to herein, it is meant to include any reference number (fractional or integer) within the indicated range.
In this application, unless otherwise indicated, terms of orientation such as "upper" and "lower" are used specifically to refer to the orientation of the drawing in the figures. In addition, in the description of the present application, the terms "include", "comprise", "comprising" and the like mean "including but not limited to". Relational terms such as "first" and "second", and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Herein, "and/or" describing an association relationship of an association object means that there may be three relationships, for example, a and/or B, may mean: a alone, a and B together, and B alone. Wherein A, B may be singular or plural. Herein, "at least one" means one or more, and "a plurality" means two or more. "at least one", "at least one" or the like refer to any combination of these items, including any combination of single item(s) or plural items(s). For example, "at least one (individual) of a, b, or c," or "at least one (individual) of a, b, and c," may each represent: a, b, c, a-b (i.e., a and b), a-c, b-c, or a-b-c, wherein a, b, c may be single or multiple, respectively.
The foregoing is merely a specific embodiment of the application to enable one skilled in the art to understand or practice the application. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the application. Thus, the present application is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims (2)
1. The epoxy plastic package chip protection film is characterized by comprising the following components: epoxy resin and carbon black, wherein the brightness L value of the carbon black is 36-40;
the particle size of the carbon black is 20nm-25nm;
the carbon black is carbon black 808A;
the composition of the film further comprises: spherical silica and a curing agent;
the D50 particle size of the spherical silicon dioxide is 0.2-0.4 mu m;
the epoxy resin comprises bisphenol A type epoxy resin and bisphenol F type epoxy resin;
the mass ratio of the bisphenol A type epoxy resin to the bisphenol F type epoxy resin is 1.5-2.5: 1, a step of;
the curing agent is naphthol curing agent;
the mass ratio of the epoxy resin to the spherical silicon dioxide to the curing agent to the carbon black is (35-40): (33-37): (24-26): (1-3);
the components of the film also comprise phosphine curing accelerator.
2. A method for preparing an epoxy molding compound chip protection film, which is characterized by being used for preparing the epoxy molding compound chip protection film according to claim 1, and comprising the following steps: mixing the raw materials to obtain slurry; placing the slurry in an environment with a set vacuum degree to defoam until the slurry has no bubbles; and coating the defoamed sizing agent on a release film coated with silicone oil, and then drying.
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| CN202211662014.0A CN115851080B (en) | 2022-12-23 | 2022-12-23 | Epoxy plastic package chip protection film and preparation method thereof |
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| CN202211662014.0A CN115851080B (en) | 2022-12-23 | 2022-12-23 | Epoxy plastic package chip protection film and preparation method thereof |
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| CN115851080B true CN115851080B (en) | 2023-07-28 |
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| CN117004297A (en) * | 2023-10-07 | 2023-11-07 | 武汉市三选科技有限公司 | Preparation method of high-performance chip protection film and chip |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CA2201233A1 (en) * | 1995-09-22 | 1998-09-27 | Michihiro Ikeda | Molded product of carbon black |
| JP2004285140A (en) * | 2003-03-20 | 2004-10-14 | Toyo Ink Mfg Co Ltd | Carbon black composition |
| KR20070057019A (en) * | 2005-11-30 | 2007-06-04 | 도요 잉키 세이조 가부시끼가이샤 | Black composition and production method thereof |
| CN112210193A (en) * | 2020-11-26 | 2021-01-12 | 武汉市三选科技有限公司 | High-glossiness epoxy plastic packaging material chip protection film and preparation method thereof |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2004090033A1 (en) * | 2003-04-07 | 2004-10-21 | Hitachi Chemical Co., Ltd. | Epoxy resin molding material for sealing use and semiconductor device |
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2022
- 2022-12-23 CN CN202211662014.0A patent/CN115851080B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CA2201233A1 (en) * | 1995-09-22 | 1998-09-27 | Michihiro Ikeda | Molded product of carbon black |
| JP2004285140A (en) * | 2003-03-20 | 2004-10-14 | Toyo Ink Mfg Co Ltd | Carbon black composition |
| KR20070057019A (en) * | 2005-11-30 | 2007-06-04 | 도요 잉키 세이조 가부시끼가이샤 | Black composition and production method thereof |
| CN112210193A (en) * | 2020-11-26 | 2021-01-12 | 武汉市三选科技有限公司 | High-glossiness epoxy plastic packaging material chip protection film and preparation method thereof |
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