CN115851080A - Epoxy plastic packaging material chip protection film and preparation method thereof - Google Patents
Epoxy plastic packaging material chip protection film and preparation method thereof Download PDFInfo
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- CN115851080A CN115851080A CN202211662014.0A CN202211662014A CN115851080A CN 115851080 A CN115851080 A CN 115851080A CN 202211662014 A CN202211662014 A CN 202211662014A CN 115851080 A CN115851080 A CN 115851080A
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- carbon black
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- protection film
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Abstract
The application relates to an epoxy plastic packaging material chip protection film and a preparation method thereof, relating to the field of electronic chip protection films, wherein the film comprises the following components: epoxy resin and carbon black, wherein the light shade L value of the carbon black is 36-40. The film takes epoxy resin as main resin, so that the chip protection film has the characteristics of the film: for example, the black has extensibility, toughness, viscosity and the like, and the glossiness is improved by the carbon black with the lightness L value of 36-40, the carbon black with the lightness L value has the characteristics of high blackness and high reflectivity, and the leveling property and the dispersibility are good, so that the mirror effect of the film material can be improved, and the glossiness is improved.
Description
Technical Field
The application relates to the field of electronic chip protection films, in particular to an epoxy plastic packaging material chip protection film and a preparation method thereof.
Background
In order to ensure that the electronic chip has certain strength, a layer of protective film is adhered to the back of the chip with a circuit on the surface, and laser lettering needs to be carried out on the layer of protective film for product tracing and unified management of models and trademarks. However, the traditional chip protection film has low glossiness, characters engraved by laser are dim and dull in a bright field of a microscope, the contrast ratio of dark background and black characters is poor, and the engraved characters are unclear, so that the characters are difficult to effectively recognize by equipment.
Disclosure of Invention
The application provides an epoxy plastic packaging material chip protection film and a preparation method thereof, which aim to solve the problem of low glossiness of the traditional chip protection film.
In a first aspect, the present application provides an epoxy molding compound chip protection film, which comprises the following components: epoxy resin and carbon black, wherein the light shade L value of the carbon black is 36-40.
Further, the particle size of the carbon black is 20nm-25nm.
Further, the carbon black is carbon black S160 and/or carbon black 808A.
Further, the composition of the film also includes: spherical silica and a curing agent.
Further, the spherical silica has a D50 particle diameter of 0.2 to 0.4. Mu.m.
Further, the epoxy resin includes bisphenol a type epoxy resin and bisphenol F type epoxy resin; the mass ratio of the bisphenol A type epoxy resin to the bisphenol F type epoxy resin is 1.5-2.5: 1.
further, the curing agent is a naphthol curing agent.
Further, the mass ratio of the epoxy resin, the spherical silica, the curing agent and the carbon black is (35-40):
(33～37)：(24～26)：(1～3)。
further, the composition of the film also comprises a phosphine curing accelerator.
In a second aspect, the present application provides a method for preparing an epoxy molding compound chip protection film, for preparing the epoxy molding compound chip protection film of the first aspect, the method comprises:
mixing the raw materials to obtain slurry;
placing the slurry in an environment with a set vacuum degree for defoaming until the slurry has no bubbles;
and coating the defoamed slurry on a release film coated with silicone oil, and drying.
Compared with the prior art, the technical scheme provided by the embodiment of the application has the following advantages:
the epoxy molding compound chip protection film provided by the embodiment of the application comprises the following components: epoxy resin and carbon black, wherein the light shade L value of the carbon black is 36-40. The film takes epoxy resin as main resin, so that the chip protection film has the characteristics of the film: for example, the black coating has extensibility, toughness, viscosity and the like, and the glossiness of the black coating is improved by the carbon black with the light and dark degree L value of 36-40, the carbon black with the L value has the characteristics of high blackness and high reflectivity, and the leveling property and the dispersity of the carbon black are good, so that the mirror effect of a film material can be improved, and the glossiness is improved.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present application and together with the description, serve to explain the principles of the application.
In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, and it is obvious for those skilled in the art to obtain other drawings without inventive exercise.
Fig. 1 is a lettering picture of a chip protection film of an epoxy molding compound provided in embodiment 1 of the present application;
fig. 2 is a lettering picture of a chip protection film of an epoxy molding compound provided in embodiment 2 of the present application;
FIG. 3 is a lettering picture of a chip protection film of an epoxy molding compound provided in comparative example 1 of the present application;
FIG. 4 is a lettering picture of a chip protection film of an epoxy molding compound provided in comparative example 2 of the present application;
FIG. 5 is a lettering picture of a chip protection film of an epoxy molding compound provided in comparative example 3 of the present application.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are some embodiments of the present application, but not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
Unless otherwise specifically stated, various raw materials, reagents, instruments, equipment and the like used in the present application are commercially available or can be prepared by an existing method.
In a first aspect, an embodiment of the present application provides an epoxy molding compound chip protection film, where the film includes the following components: epoxy resin and carbon black, wherein the light shade L value of the carbon black is 36-40.
The epoxy molding compound chip protection film provided by the embodiment of the application comprises the following components: epoxy resin and carbon black, wherein the light shade L value of the carbon black is 36-40. The film takes epoxy resin as main resin, so that the chip protection film has the characteristics of the film: for example, the black has extensibility, toughness, viscosity and the like, and the glossiness is improved by the carbon black with the lightness L value of 36-40, the carbon black with the lightness L value has the characteristics of high blackness and high reflectivity, and the leveling property and the dispersibility are good, so that the mirror effect of the film material can be improved, and the glossiness is improved.
It should be noted that the lightness L value in this application is the L value in the Lab value, i.e. the Lab value measured by the color difference meter, which indicates the three latitudes of color measurement.
In some embodiments, the carbon black can have a lightness L value of 36, 37, 38, 39, 40, and the like.
As an embodiment of the present invention, the particle size of the carbon black is 20nm to 25nm.
In the application, the carbon black with the particle size has a good dispersion effect and leveling property.
In some embodiments, the carbon black may have a particle size of 20nm, 21nm, 22nm, 23nm, 24nm, 25nm, and the like.
In one embodiment of the present invention, the carbon black is carbon black S160 and/or carbon black 808A.
As an implementation of the embodiment of the present invention, the composition of the film further includes: spherical silica and a curing agent.
In the present application, the spherical silica is a filler and has an effect of dispersing the epoxy resin and raising the glass transition temperature. The curing agent can react with the epoxy resin at a specific temperature to crosslink the epoxy resin, so that the film can be cured on the surface of the chip.
As an embodiment of the inventive example, the spherical silica has a D50 particle size of 0.2 to 0.4 μm.
In some embodiments, the spherical silica may have a D50 particle size of 0.2 μm, 0.25 μm, 0.3 μm, 0.35 μm, 0.4 μm, and the like.
As an embodiment of the present invention, the epoxy resin includes bisphenol a type epoxy resin and bisphenol F type epoxy resin; the mass ratio of the bisphenol A type epoxy resin to the bisphenol F type epoxy resin is 1.5-2.5: 1.
in the application, the bisphenol A type epoxy resin has strong adhesion to metal, strong chemical corrosion resistance, high mechanical strength, good electrical insulation and corrosion resistance; bisphenol F epoxy resins are characterized by low viscosity. The epoxy resin in the proportion has the characteristics of bisphenol A type resin and bisphenol F type resin, and the resin viscosity in the proportion is more favorable for improving the uniformity and stability of the epoxy resin in the whole process.
In some embodiments, the mass ratio of the bisphenol a-type epoxy resin and the bisphenol F-type epoxy resin may be 1.5: 1. 1.6: 1. 1.7: 1. 1.8: 1. 1.9: 1. 2: 1. 2.1: 1. 2.2: 1. 2.3: 1. 2.4: 1. 2.8:1, etc.
In one embodiment of the present invention, the curing agent is a naphthol curing agent.
In the application, the curing agent is mild, can be subjected to curing reaction with resin at a high temperature, and has small curing reaction shrinkage.
In one embodiment of the present invention, the mass ratio of the epoxy resin, the spherical silica, the curing agent and the carbon black is (35 to 40): (33 to 37): (24-26): (1-3).
In the application, the film prepared by the process under the proportion can meet the characteristics of high Tg, high elongation, high modulus, high strength, low expansion coefficient, high silicon wafer adhesion and the like of the chip protective film.
In some embodiments, the mass ratio of the epoxy resin, the spherical silica, the curing agent, and the carbon black may be 35:33:24: 1. 36:34:24: 1. 37:35:25: 2. 38:35:25: 2. 39:36:26: 3. 40:37:26:3, etc.
As an embodiment of the present invention, the composition of the film further comprises a phosphine-based curing accelerator.
In the application, the phosphine curing agent can increase the flame retardant property, the transparency, the mechanical property and the thermal stability of the film.
In a second aspect, the present application provides a method for preparing an epoxy molding compound chip protection film, for preparing the epoxy molding compound chip protection film of the first aspect, the method comprises:
mixing the raw materials to obtain slurry;
placing the slurry in an environment with a set vacuum degree for defoaming until the slurry has no bubbles;
and coating the defoamed slurry on a release film coated with silicone oil, and drying.
The present application is further illustrated below with reference to specific examples. It should be understood that these examples are for illustrative purposes only and are not intended to limit the scope of the present application. The experimental methods of the following examples, which are not specified under specific conditions, are generally determined according to national standards. If there is no corresponding national standard, it is carried out according to the usual international standards, to the conventional conditions or to the conditions recommended by the manufacturer.
Example 1
An epoxy plastic packaging material chip protection film and a preparation method thereof are disclosed, which specifically comprise the following steps:
(1) Selecting raw materials: 25 parts of bisphenol A epoxy resin, 12 parts of bisphenol F epoxy resin, 25 parts of naphthol curing agent (Kenmett material science and technology Co., ltd., brand SN-395), 1 part of triphenylphosphine, 1 part of carbon black S160 (particle size: 20nm, brightness L value of 39.17) and 35 parts of spherical silica (D50 particle size: 0.3 mu m) are taken according to the parts by mass;
(2) Preparation: stirring epoxy resin in a planetary mixer at 85 ℃ for 220min, adding spherical silicon dioxide and carbon black at 105 ℃ and stirring for 120min, adding a curing agent at 30 ℃ and stirring for 40min to obtain slurry;
vacuumizing the slurry to-0.097 MPa, and defoaming until the slurry has no bubbles;
and (3) coating the defoamed slurry on a release film coated with silicone oil, and drying to obtain the epoxy plastic packaging material chip protective film (the obtained epoxy plastic packaging material chip protective film is shown in figure 1).
Example 2
An epoxy plastic packaging material chip protection film and a preparation method thereof are disclosed, which specifically comprise the following steps:
(1) Selecting raw materials: according to the mass parts, 21 parts of bisphenol A type epoxy resin, 14 parts of bisphenol F type epoxy resin, 24 parts of naphthol curing agent (Kenmett material science and technology Co., ltd., brand SN-395), 1 part of triphenylphosphine, 808A 1 part of carbon black (the particle diameter is 22nm, the light and dark degree L value is 36.99) and 33 parts of spherical silicon dioxide (the D50 particle diameter is 0.2 mu m) are taken;
(2) Preparation: stirring epoxy resin in a planetary mixer at 75 ℃ for 240min, adding spherical silicon dioxide and carbon black at 95 ℃ and stirring for 150min, adding a curing agent at 35 ℃ and stirring for 60min to obtain slurry;
vacuumizing the slurry to-0.09 MPa, and defoaming until the slurry has no bubbles;
and (3) coating the defoamed slurry on a release film coated with silicone oil, and drying to obtain the epoxy plastic packaging material chip protective film (the obtained epoxy plastic packaging material chip protective film is shown in figure 2).
Example 3
An epoxy plastic packaging material chip protection film and a preparation method thereof are disclosed, which specifically comprise the following steps:
(1) Selecting raw materials: 28 parts of bisphenol A type epoxy resin, 12 parts of bisphenol F type epoxy resin, 26 parts of naphthol curing agent (Kenmett materials science and technology Co., ltd., brand SN-395), 1 part of triphenylphosphine, 3 parts of carbon black S160 (particle diameter: 25nm, brightness L value of 39.17) and 37 parts of spherical silicon dioxide (D50 particle diameter: 0.4 mu m);
(2) Preparation: stirring epoxy resin in a planetary mixer at 95 ℃ for 200min, adding spherical silicon dioxide and carbon black at 115 ℃ and stirring for 100min, adding a curing agent at 38 ℃ and stirring for 30min to obtain slurry;
vacuumizing the slurry to-0.095 MPa, and defoaming until the slurry has no bubbles;
and coating the defoamed slurry on a release film coated with silicone oil, and drying to obtain the epoxy plastic packaging material chip protective film.
Example 4
The same as in example 1 was repeated except that 2 parts of carbon black S160 in example 1 was used.
Example 5
The same procedure as in example 1 was repeated except that 3 parts of carbon black S160 in example 1 was used.
Example 6
The same as example 2 was repeated except that 2 parts of carbon black 808A in example 2 was used.
Example 7
The same as in example 2 was repeated except that 3 parts of carbon black 808A in example 2 was used.
Comparative example 1
The carbon black S160 in example 1 was changed to carbon black 2500 (the value of L of the lightness of darkness was 35.41), and the rest was the same as in example 1 (the obtained epoxy molding compound chip protection film is shown in FIG. 3).
Comparative example 2
The same procedure as in example 1 was repeated except that carbon black S160 in example 1 was changed to carbon black 3500 (value of lightness L: 34.22) (the obtained epoxy molding compound chip protection film was as shown in FIG. 4).
Comparative example 3
The same procedure as in example 1 was repeated except that carbon black S160 in example 1 was changed to carbon black 505 (the value of lightness L was 32.67), and the epoxy molding compound chip protective film obtained was as shown in FIG. 5.
The films obtained in the examples and comparative examples were subjected to a gloss test as follows: the gloss (angle 60 degrees) was measured by a gloss meter and the results are shown in Table 1.
TABLE 1 film gloss test results
The test method of the L value of the carbon black in the application comprises the following steps: the powder is placed into a thin regular container and fully paved, and is covered by a glass sheet, after the calibration of the spectrocolorimeter is completed, a measurement mode is entered, a measurement window is covered and pressed on the glass sheet, the pressing is guaranteed to be tight, the glass sheet is not crushed, the measurement is started by clicking, the measurement is waited for, and the chrominance data are read.
Various embodiments of the present application may exist in a range of forms; it is to be understood that the description in range format is merely for convenience and brevity and should not be construed as an inflexible limitation on the scope of the application; accordingly, the described range descriptions should be considered to have specifically disclosed all the possible sub-ranges as well as individual numerical values within that range. For example, it is contemplated that the description of a range from 1 to 6 has specifically disclosed sub-ranges, such as from 1 to 3, from 1 to 4, from 1 to 5, from 2 to 4, from 2 to 6, from 3 to 6, etc., as well as single numbers within the stated range, such as 1, 2, 3, 4, 5, and 6, as applicable regardless of the range. In addition, whenever a numerical range is indicated herein, it is meant to include any number (fractional or integer) recited within the range so indicated.
In the present application, unless otherwise specified, the use of directional words such as "upper" and "lower" specifically refer to the orientation of the figures in the drawings. In addition, in the description of the present specification, the terms "include", "includes" and the like mean "including but not limited to". In this document, relational terms such as "first" and "second," and the like, may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Herein, "and/or" describes an association relationship of associated objects, meaning that there may be three relationships, e.g., a and/or B, may mean: a is present alone, A and B are present simultaneously, and B is present alone. Wherein A and B can be singular or plural. As used herein, "at least one" means one or more, "a plurality" means two or more. "at least one," "at least one of the following," or similar expressions, refer to any combination of these items, including any combination of the singular or plural items. For example, "at least one (a), b, or c", or "at least one (a), b, and c", may each represent: a, b, c, a-b (i.e., a and b), a-c, b-c, or a-b-c, wherein a, b, and c may be single or plural, respectively.
The above description is merely exemplary of the present application and is presented to enable those skilled in the art to understand and practice the present application. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the application. Thus, the present application is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims (10)
1. The epoxy plastic packaging material chip protection film is characterized by comprising the following components: epoxy resin and carbon black, wherein the light shade L value of the carbon black is 36-40.
2. The epoxy molding compound chip protection film according to claim 1, wherein the carbon black has a particle size of 20nm to 25nm.
3. The epoxy molding compound chip protection film according to claim 1, wherein the carbon black is carbon black S160 and/or carbon black 808A.
4. The epoxy molding compound chip protection film according to claim 1, wherein the composition of the film further comprises: spherical silica and a curing agent.
5. The epoxy molding compound chip protection film according to claim 4, wherein the spherical silica has a D50 particle size of 0.2-0.4 μm.
6. The epoxy molding compound chip protection film according to claim 4, wherein the epoxy resin includes bisphenol A type epoxy resin and bisphenol F type epoxy resin;
the mass ratio of the bisphenol A type epoxy resin to the bisphenol F type epoxy resin is 1.5-2.5: 1.
7. the epoxy molding compound chip protection film according to claim 4, wherein the curing agent is a naphthol curing agent.
8. The epoxy molding compound chip protection film according to claim 4, wherein the mass ratio of the epoxy resin, the spherical silica, the curing agent and the carbon black is (35-40): (33 to 37): (24-26): (1-3).
9. The epoxy molding compound chip protection film according to claim 4, wherein the composition of the film further comprises a phosphine-based curing accelerator.
10. A method for preparing an epoxy molding compound chip protection film, which is used for preparing the epoxy molding compound chip protection film of any one of claims 1 to 9, the method comprising:
mixing the raw materials to obtain slurry;
placing the slurry in an environment with a set vacuum degree for defoaming until the slurry has no bubbles;
and coating the defoamed slurry on a release film coated with silicone oil, and drying.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202211662014.0A CN115851080B (en) | 2022-12-23 | 2022-12-23 | Epoxy plastic package chip protection film and preparation method thereof |
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| CN202211662014.0A CN115851080B (en) | 2022-12-23 | 2022-12-23 | Epoxy plastic package chip protection film and preparation method thereof |
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| CN115851080B CN115851080B (en) | 2023-07-28 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117004297A (en) * | 2023-10-07 | 2023-11-07 | 武汉市三选科技有限公司 | Preparation method of high-performance chip protection film and chip |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CA2201233A1 (en) * | 1995-09-22 | 1998-09-27 | Michihiro Ikeda | Molded product of carbon black |
| JP2004285140A (en) * | 2003-03-20 | 2004-10-14 | Toyo Ink Mfg Co Ltd | Carbon black composition |
| US20060214153A1 (en) * | 2003-04-07 | 2006-09-28 | Ryoichi Ikezawa | Epoxy resin molding material for sealing use and semiconductor device |
| KR20070057019A (en) * | 2005-11-30 | 2007-06-04 | 도요 잉키 세이조 가부시끼가이샤 | Black composition and production method thereof |
| CN112210193A (en) * | 2020-11-26 | 2021-01-12 | 武汉市三选科技有限公司 | High-glossiness epoxy plastic packaging material chip protection film and preparation method thereof |
-
2022
- 2022-12-23 CN CN202211662014.0A patent/CN115851080B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CA2201233A1 (en) * | 1995-09-22 | 1998-09-27 | Michihiro Ikeda | Molded product of carbon black |
| JP2004285140A (en) * | 2003-03-20 | 2004-10-14 | Toyo Ink Mfg Co Ltd | Carbon black composition |
| US20060214153A1 (en) * | 2003-04-07 | 2006-09-28 | Ryoichi Ikezawa | Epoxy resin molding material for sealing use and semiconductor device |
| KR20070057019A (en) * | 2005-11-30 | 2007-06-04 | 도요 잉키 세이조 가부시끼가이샤 | Black composition and production method thereof |
| CN112210193A (en) * | 2020-11-26 | 2021-01-12 | 武汉市三选科技有限公司 | High-glossiness epoxy plastic packaging material chip protection film and preparation method thereof |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117004297A (en) * | 2023-10-07 | 2023-11-07 | 武汉市三选科技有限公司 | Preparation method of high-performance chip protection film and chip |
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