CN115847275B - Semiconductor raw material grinding equipment - Google Patents
Semiconductor raw material grinding equipment Download PDFInfo
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- CN115847275B CN115847275B CN202211738770.7A CN202211738770A CN115847275B CN 115847275 B CN115847275 B CN 115847275B CN 202211738770 A CN202211738770 A CN 202211738770A CN 115847275 B CN115847275 B CN 115847275B
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 51
- 239000002994 raw material Substances 0.000 title claims abstract description 44
- 239000007787 solid Substances 0.000 claims 4
- 238000009434 installation Methods 0.000 claims 2
- 235000019580 granularity Nutrition 0.000 description 10
- 238000005096 rolling process Methods 0.000 description 8
- 239000000463 material Substances 0.000 description 5
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 4
- 230000009286 beneficial effect Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 230000002349 favourable effect Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 229910052732 germanium Inorganic materials 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
Classifications
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/10—Greenhouse gas [GHG] capture, material saving, heat recovery or other energy efficient measures, e.g. motor control, characterised by manufacturing processes, e.g. for rolling metal or metal working
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- Grinding Of Cylindrical And Plane Surfaces (AREA)
Abstract
The invention discloses semiconductor raw material grinding equipment which comprises a grinding assembly and a locking assembly, wherein the grinding assembly comprises a mounting plate, a first fixed pipe, a rotating shaft and a grinding wheel, the outer side of the mounting plate is fixedly connected with the outer wall of the first fixed pipe, the inner wall of the first fixed pipe is rotatably connected with the rotating shaft, and the bottom wall of the rotating shaft is fixedly connected with the grinding wheel; the locking assembly comprises a main shaft, a clamping plate, a connecting plate and a first telescopic rod, and the bottom end of the main shaft is fixedly connected with the upper surface of the mounting plate. The limiting groove on the clamping plate can be clamped on the square rod section, the angle of the square rod section is limited, the angle of the square rod section or the main shaft is guaranteed to be 90 degrees, when the mounting plate is rotated by 90 degrees, the next grinding wheel is moved to the position for grinding the semiconductor raw material, the grinding precision is further improved, and the influence of deviation of the positions of the new grinding wheel and the old grinding wheel on the surface precision of the semiconductor raw material is avoided.
Description
Technical Field
The invention relates to the technical field of grinding, in particular to semiconductor raw material grinding equipment.
Background
Semiconductors refer to materials with conductivity between conductors and insulators at normal temperature, and are widely used in the fields of consumer electronics, communication systems, medical instruments and the like, for example, diodes are devices made of semiconductors, the importance of which is very great from the technical or economic development point of view, and most of electronic products such as core units in computers, mobile phones or digital recorders are very closely related to semiconductors, and common semiconductor materials include silicon, germanium, gallium arsenide and the like, while silicon is the most influential in commercial applications among various semiconductor materials
In the processing process of semiconductor raw materials such as silicon chips, the surface of the semiconductor raw materials is required to be ground, grinding wheels with different granularities are required to be used in the grinding process, grinding wheels with different granularities are required to be replaced, old grinding wheels are required to be removed during replacement, new grinding wheels are installed, replacement is not convenient enough, working efficiency is affected, deviation exists in the positions of the new grinding wheels and the old grinding wheels, and the surface precision of the semiconductor raw materials is affected.
Disclosure of Invention
The technical problems to be solved by the invention are as follows: the grinding wheels with different granularities are used for grinding, the grinding wheels with different granularities need to be replaced, the old grinding wheels need to be taken down during replacement, then new grinding wheels are installed, replacement is not convenient enough, working efficiency is affected, deviation exists in the positions of the new grinding wheels and the old grinding wheels, and the surface precision of the semiconductor raw materials is affected.
In order to solve the technical problems, the invention provides the following technical scheme: the semiconductor raw material grinding equipment comprises a grinding assembly and a locking assembly, wherein the grinding assembly comprises a mounting plate, a first fixed pipe, a rotating shaft and a grinding wheel, the outer side of the mounting plate is fixedly connected with the outer wall of the first fixed pipe, the inner wall of the first fixed pipe is rotationally connected with the rotating shaft, and the bottom wall of the rotating shaft is fixedly connected with the grinding wheel; the locking assembly comprises a main shaft, clamping plates, connecting plates and first telescopic rods, wherein the bottom end of the main shaft is fixedly connected with the upper surface of the mounting plate, one section of the main shaft is provided with a square rod section, a limit groove is formed in the position corresponding to the square rod section on one side of the clamping plates, the connecting plates are fixedly connected to the other side of the clamping plates, one side of the clamping plates is symmetrically arranged on two sides of the square rod section, and the connecting plates are fixedly connected to the two ends of the first telescopic rods respectively.
As a preferable mode of the semiconductor raw material grinding apparatus of the present invention, wherein: still including switching the subassembly, the switching subassembly includes fixed disk, rolling disc, fixture block and clamp plate, fixed disk fixed connection main shaft outer wall is provided with the draw-in groove on the fixed disk, and fixture block is connected to draw-in groove inner wall block, fixture block fixed connection clamp plate, the first axis of rotation of clamp plate fixed connection, and the fixed block is connected in the rotation of first axis of rotation bottom, and fixed block fixed connection rolling disc one side, the rolling disc rotates and connects the main shaft outer wall.
As a preferable mode of the semiconductor raw material grinding apparatus of the present invention, wherein: the switching assembly further comprises a fixed plate and a first spring, the fixed plate is fixedly connected with the fixed block, the first spring is arranged between the fixed plate and the pressing plate, and two ends of the first spring are respectively and fixedly connected with the fixed plate and the pressing plate.
As a preferable mode of the semiconductor raw material grinding apparatus of the present invention, wherein: the switching assembly further comprises a second telescopic rod, a supporting frame and a mounting shaft, wherein the outer wall of the second telescopic rod is fixedly connected with the inner wall of the supporting frame, the outer wall of the supporting frame is fixedly connected with a sleeve, the inner wall of the sleeve is rotationally connected with one end of the mounting shaft, one end of the second telescopic rod is fixedly connected with the outer wall of a second fixed pipe, the inner wall of the second fixed pipe is rotationally connected with a second rotating shaft, a movable groove is formed in the fixed block, the second rotating shaft penetrates through the movable groove on the fixed block, and the inner wall of the movable groove is slidingly connected with two ends of the second fixed pipe.
As a preferable mode of the semiconductor raw material grinding apparatus of the present invention, wherein: the second telescopic rod comprises a fixed cylinder, a movable rod and a first piston head, wherein the outer wall of the fixed cylinder is fixedly connected with the inner wall of the supporting frame, the inner wall of the fixed cylinder is slidably connected with the first piston head and the movable rod, the first piston head is fixedly connected with one end of the movable rod, and the other end of the movable rod is fixedly connected with the outer wall of the second fixed pipe.
As a preferable mode of the semiconductor raw material grinding apparatus of the present invention, wherein: the main shaft outer wall fixedly connected with first limiting plate and second limiting plate to first limiting plate and second limiting plate set up in square pole section both sides, and first limiting plate and second limiting plate be close to side sliding connection cardboard or connecting plate relatively.
As a preferable mode of the semiconductor raw material grinding apparatus of the present invention, wherein: the motor is arranged on the motor seat, and the motor is connected with the rotating shaft.
As a preferable mode of the semiconductor raw material grinding apparatus of the present invention, wherein: the outer wall of the rotating shaft is connected with the inner wall of the belt ring.
As a preferable mode of the semiconductor raw material grinding apparatus of the present invention, wherein: the locking assembly further comprises a fixed ring, a movable ring and a movable block, the lower surface of the top plate is fixedly connected with the fixed ring, the main shaft penetrates through the fixed ring and is connected with the inner wall of the fixed ring in a penetrating mode, the movable ring is fixedly connected with the main shaft and is located below the fixed ring, the movable ring is provided with a containing groove, the inner end wall of the containing groove is fixedly connected with one end of a second spring, the other end of the second spring is fixedly connected with the movable block, the movable block is slidably connected with the inner wall of the containing groove, and a groove is formed in the fixed ring corresponding to the movable block.
As a preferable mode of the semiconductor raw material grinding apparatus of the present invention, wherein: the upper surface of the supporting component is fixedly connected with a driving pipe, one end of the driving pipe is provided with an air inlet pipe, the inner end wall of the driving pipe is provided with a third spring, the third spring is connected with a second piston head, the second piston head is slidably connected with the inner wall of the driving pipe, the inside of the driving pipe is communicated with one end of a first connecting pipe and one end of a second connecting pipe, the other end of the first connecting pipe is communicated with a first telescopic rod, the other end of the second connecting pipe is communicated with a fixed cylinder, and an electric pressure relief valve is arranged on the fixed cylinder.
The invention has the beneficial effects that: the grinding wheel with different granularities is more convenient and quick to replace, so that the replacement time is saved, and the grinding efficiency is improved; when the first telescopic rod is contracted, the clamping plate is driven to move towards the square rod section through the connecting plate, the limiting groove on the clamping plate can be clamped on the square rod section, the rotating angle of the square rod section is limited, the rotating angle of the square rod section or the main shaft is guaranteed to be 90 degrees, when the mounting plate is rotated by 90 degrees, the precision of the position of the next grinding wheel for grinding the semiconductor raw material is improved, the grinding precision is further improved, and the influence caused by the deviation of the positions of the new grinding wheel and the old grinding wheel and the surface precision of the semiconductor raw material is avoided; and can accomplish the automatic locking and unblock to main shaft 201, prevent when grinding the semiconductor raw materials, grinding accuracy is improved to the offset that appears in grinding wheel 104.
Drawings
Fig. 1 is a schematic diagram of an overall structure in an embodiment of the present disclosure.
Fig. 2 is a schematic diagram of a switching component structure in an embodiment of the disclosure.
Fig. 3 is a schematic diagram of a locking assembly in an embodiment of the present disclosure.
Fig. 4 is an enlarged schematic view at B in fig. 2 in an embodiment of the present disclosure.
Fig. 5 is an enlarged schematic view at a in fig. 2 in an embodiment of the present disclosure.
Fig. 6 is a cross-sectional view of a second telescoping rod in an embodiment of the present disclosure.
Fig. 7 is a cross-sectional view of a mounting plate in an embodiment of the present disclosure.
Fig. 8 is a bottom view of a retaining ring in an embodiment of the present disclosure.
Fig. 9 is an enlarged schematic view at C in fig. 7 in an embodiment of the disclosure.
Fig. 10 is a cross-sectional view of a drive tube in an embodiment of the present disclosure.
Reference numerals: the grinding assembly 10, the mounting plate 101, the first stationary tube 102, the rotating shaft 103, the belt ring 103a, the grinding wheel 104, the locking assembly 200, the spindle 201, the square rod section 201a, the clamping plate 202, the limit groove 202a, the connecting plate 203, the first telescopic rod 204, the first limit plate 205, the second limit plate 206, the stationary ring 207, the groove 207a, the movable ring 208, the accommodating groove 208a, the second spring 208b, the movable block 209, the switching assembly 300, the stationary plate 301, the clamping groove 301a, the rotating plate 302, the stationary block 302a, the movable groove 302a-1, the clamping block 303, the pressing plate 304, the first rotating shaft 304a, the stationary plate 305, the first spring 306, the second telescopic rod 307a, the second stationary tube 307a, the second rotating shaft 307b, the stationary cylinder 307c, the electric relief valve 307c-1, the movable rod 307d, the first piston head 307e, the support frame 308, the sleeve 308a, the mounting shaft 309, the support assembly 400, the top plate 401, the seat 402, the motor 403, the driving tube 404, the air inlet tube 405, the third spring 406, the third spring 407, the second connecting tube 408, the first connecting tube 408, and the piston head 409.
Description of the embodiments
In order that the above-recited objects, features and advantages of the present invention will become more readily apparent, a more particular description of the invention will be rendered by reference to specific embodiments thereof which are illustrated in the appended drawings.
Examples
Referring to fig. 1 to 3, the embodiment provides a semiconductor raw material grinding apparatus, which includes a grinding assembly 100 and a locking assembly 200, wherein the grinding assembly 100 includes a mounting plate 101, a first fixing tube 102, a rotating shaft 103 and a grinding wheel 104, the outer side of the mounting plate 101 is fixedly connected with the outer wall of the first fixing tube 102, the inner wall of the first fixing tube 102 is rotatably connected with the rotating shaft 103, and the bottom wall of the rotating shaft 103 is fixedly connected with the grinding wheel 104.
In this embodiment, preferably, four first fixing pipes 102 are preferably disposed outside the mounting plate 101, and the first fixing pipes 102 are circumferentially arranged outside the mounting plate 101, the rotating shaft 103 may rotate on the inner wall of the first fixing pipe 102, four rotating shafts 103 are disposed corresponding to the first fixing pipes 102, grinding wheels 104 are disposed at the bottom of the rotating shaft 103, and grinding wheels 104 without granularity may be used for the grinding wheels 104, so as to facilitate grinding processing on the surfaces of semiconductor raw materials such as silicon chips.
The locking assembly 200 comprises a main shaft 201, a clamping plate 202, connecting plates 203 and first telescopic rods 204, wherein the bottom end of the main shaft 201 is fixedly connected with the upper surface of the mounting plate 101, one section of the main shaft 201 is provided with a square rod section 201a, a limit groove 202a is formed in the position corresponding to the square rod section 201a on one side of the clamping plate 202, the connecting plates 203 are fixedly connected to the other side of the clamping plate 202, the clamping plate 202 and the connecting plates 203 are symmetrically arranged on two sides of the square rod section 201a, and the connecting plates 203 are fixedly connected to two ends of the first telescopic rods 204 respectively.
In this embodiment, preferably, when the spindle 201 rotates, the mounting plate 101 can be driven to rotate, the mounting plate 101 drives the first fixing tube 102, the rotating shaft 103 and the grinding wheel 104 to rotate, when the mounting plate 101 rotates by 90 degrees, the next grinding wheel 104 can be moved to the position for grinding the semiconductor raw material, the grinding wheels 104 without granularity can be installed at the bottom of each rotating shaft 103 according to the sequence from large to small, so that the grinding wheels 104 with different granularities can be conveniently replaced, the semiconductor raw material can be ground, and the replacement of the grinding wheels 104 with different granularities is more convenient and quicker, thereby being beneficial to saving the replacement time and improving the grinding efficiency. The first telescopic rod 204 can drive the connecting plate 203 to move when being telescopic, and the connecting plate 203 drives the clamping plate 202 to move. When the first telescopic rod 204 contracts, the clamping plate 202 is driven to move towards the square rod section 201a through the connecting plate 203, the limiting groove 202a on the clamping plate 202 can be clamped on the square rod section 201a, the rotating angle of the square rod section 201a is limited, the rotating angle of the square rod section 201a or the main shaft 201 is guaranteed to be 90 degrees, when the mounting plate 101 rotates by 90 degrees, the precision of the position of the next grinding wheel 104 for grinding the semiconductor raw material is improved, the grinding precision is further improved, and the influence caused by the deviation of the positions of new grinding wheels and old grinding wheels on the surface precision of the semiconductor raw material is avoided.
Examples
Referring to fig. 1 to 10, this embodiment is based on the previous embodiment, and differs from the previous embodiment in that. Still including switching assembly 300, switching assembly 300 includes fixed disk 301, rolling disc 302, fixture block 303 and clamp plate 304, and fixed disk 301 fixed connection main shaft 201 outer wall is provided with draw-in groove 301a on the fixed disk 301, and fixture block 303 is connected to the inner wall block of draw-in groove 301a, fixture block 303 fixed connection clamp plate 304, clamp plate 304 fixed connection first rolling shaft 304a, and fixed block 302a is connected in the rotation of first rolling shaft 304a bottom, and fixed block 302a fixed connection rolling disc 302 one side, rolling disc 302 rotate and connect main shaft 201 outer wall.
In this embodiment, preferably, the rotation of the fixed disk 301 can drive the spindle 201 to rotate, and the outer wall of the spindle 201 can rotate relative to the inner side of the rotating disk 302. The fixed block 302a drives the rotating disc 302 to rotate on the outer wall of the main shaft 201, the rotating disc 302 can play a limiting role on the fixed block 302a, so that the fixed block 302a rotates around the main shaft 201, when the clamping block 303 rotates along the clamping groove 301a, the clamping block 303 slides out of the clamping groove 301a and then slides relative to the outer wall of the fixed disc 301, and the fixed disc 301 cannot be driven to rotate; when the clamping block 303 rotates against the clamping groove 301a, the clamping block will clamp the inner wall of the clamping groove 301a, and the fixing disc 301 is shifted to rotate, and the fixing disc 301 drives the spindle 201 to rotate. The platen 304 is rotatable about a first rotational axis 304 a.
Referring to fig. 4, the switching assembly 300 further includes a fixing plate 305 and a first spring 306, the fixing plate 305 is fixedly connected with the fixing block 302a, the first spring 306 is disposed between the fixing plate 305 and the pressing plate 304, and two ends of the first spring 306 are respectively fixedly connected with the fixing plate 305 and the pressing plate 304.
In this embodiment, preferably, the fixing block 302a can play a role in fixing and supporting the fixing plate 305, and under the action of the elastic force of the first spring 306, the pressing plate 304 can be pressed against the fixing plate 301, so as to ensure the contact between the clamping block 303 and the outer side of the fixing plate 301.
Referring to fig. 2 and 4, the switching assembly 300 further includes a second telescopic rod 307, a supporting frame 308 and a mounting shaft 309, wherein an outer wall of the second telescopic rod 307 is fixedly connected with an inner wall of the supporting frame 308, an outer wall of the supporting frame 308 is fixedly connected with a sleeve 308a, an inner wall of the sleeve 308a is rotatably connected with one end of the mounting shaft 309, one end of the second telescopic rod 307 is fixedly connected with an outer wall of the second fixed pipe 307a, an inner wall of the second fixed pipe 307a is rotatably connected with a second rotating shaft 307b, a movable groove 302a-1 is formed in the fixed block 302a, a second rotating shaft 307c penetrates through a movable groove 302a-1 formed in the fixed block 302a, and an inner wall of the movable groove 302a-1 is slidably connected with two ends of the second fixed pipe 307 b.
In this embodiment, preferably, the second telescopic rod 307 is disposed in parallel with the tangential direction of the rotating disc 302, the supporting frame 308 and the second telescopic rod 307 can rotate around the mounting shaft 309 through the sleeve 308a, and the second fixed tube 307a can rotate around the second rotating shaft 307b, at which time the rotation angle is approximately 90 °. When the second telescopic rod 307 stretches, the second rotating shaft 307b, the fixed block 302a and the rotating disc 302 can be driven to rotate on the outer wall of the main shaft 201 through the second fixed pipe 307 a.
Referring to fig. 6, the second telescopic rod 307 includes a fixed cylinder 307c, a movable rod 307d and a first piston head 307e, the outer wall of the fixed cylinder 307c is fixedly connected to the inner wall of the supporting frame 308, the inner wall of the fixed cylinder 307c is slidably connected to the first piston head 307e and the movable rod 307d, the first piston head 307e is fixedly connected to one end of the movable rod 307d, and the other end of the movable rod 307d is fixedly connected to the outer wall of the second fixed tube 307 a.
In this embodiment, preferably, when the air pressure near the first piston head 307e and the movable rod 307d in the fixed cylinder 307c increases, the air pressure pushes the first piston head 307e to move, the first piston head 307e drives the movable rod 307d to retract into the fixed cylinder 307c, at this time, the second telescopic rod 307 contracts, the second telescopic rod 307 drives the second rotating shaft 307b and the fixed block 302a and the rotating disc 302 to rotate on the outer wall of the spindle 201 through the second fixed pipe 307a, at this time, the clamping block 303 rotates against the clamping groove 301a, and then is clamped on the inner wall of the clamping groove 301a, the fixed disc 301 is stirred to rotate, and the fixed disc 301 drives the spindle 201 to rotate, at this time, the rotating angle is approximately 90 °.
Referring to fig. 3, the outer wall of the spindle 201 is fixedly connected with a first limiting plate 205 and a second limiting plate 206, and the first limiting plate 205 and the second limiting plate 206 are disposed on two sides of the square rod section 201a, and the first limiting plate 205 and the second limiting plate 206 are relatively close to the side sliding connection clamping plate 202 or the connecting plate 203.
In this embodiment, preferably, the clamping plate 202 or the connecting plate 203 can slide near the first limiting plate 205 and the second limiting plate 206, which is beneficial to improving the stability of driving the connecting plate 203 to move and the clamping plate 202 to move when the first telescopic rod 204 stretches. The first telescopic link 204 preferably adopts the double-end cylinder, and with the relative near side of first limiting plate 205 of first telescopic link 204 interlude outer wall fixed connection and second limiting plate 206, the flexible end of first telescopic link 204 link, stretch out or shrink simultaneously, be favorable to improving the synchronism that connecting plate 203 and cardboard 202 at first telescopic link 204 both ends removed.
Referring to fig. 1, the motor support device further comprises a support assembly 400, wherein the support assembly 400 comprises a top plate 401, a motor base 402 and a motor 403, the top end of the main shaft 201 is rotatably connected with the top plate 401, the top plate 401 is fixedly connected with the other end of the mounting shaft 309, the lower surface of the top plate 401 is fixedly connected with the motor base 402, the motor 403 is mounted on the motor base 402, and the motor 403 is connected with the rotating shaft 103.
In this embodiment, the top plate 401 may be disposed above the semiconductor material in use, and then the grinding wheel 104 is located at the grinding position of the semiconductor material. The top plate 401 can fix the height of the mounting shaft 309, and limit rings can be arranged on the mounting shafts 309 on two sides of the top plate 401 so as to improve the stability of the mounting shaft 309 during rotation, and meanwhile, the top plate 401 can fix the mounting shaft 309. Can connect fixed backup pad at roof 401 lower surface, then backup pad bottom fixed connection spout sets up the slider at the connecting plate 203 both ends, make the slider slide at the spout inner wall, can prevent that connecting plate 203 from rotating along with main shaft 201 rotates, be favorable to improving the stability that connecting plate 203 removed, and then the spacing groove 202a on improving cardboard 202 carries out spacingly to square pole section 201a pivoted angle, guarantee square pole section 201a or main shaft 201 pivoted angle to be 90, when in order to improve mounting panel 101 rotation 90, remove the precision of grinding the position of semiconductor raw materials with next grinding wheel 104, further improve the precision of grinding, avoid because there is the deviation in the position of new and old grinding wheel, semiconductor raw materials surface accuracy causes the influence. The top plate 401 can be mounted and fixed to the motor 403 through the motor mount 402.
Referring to fig. 1 and 2, the outer wall of the rotating shaft 103 is connected to the inner wall of the belt ring 103 a.
In this embodiment, preferably, the motor 403 is capable of driving one of the rotating shafts 103 to rotate when in operation, and driving the remaining rotating shaft 103 to rotate through the belt ring 103a when one of the rotating shafts 103 rotates, so as to drive the grinding wheel 104 corresponding to the rotating shaft 103 to rotate, so that when the grinding wheel 104 is replaced, after the next grinding wheel 104 moves to the position for grinding the semiconductor raw material, the grinding wheel 104 grinds the semiconductor raw material.
Referring to fig. 7 to 9, the locking assembly 200 further includes a fixing ring 207, a movable ring 208 and a movable block 209, the lower surface of the top plate 401 is fixedly connected with the fixing ring 207, the spindle 201 passes through the fixing ring 207, and the spindle 201 passes through the inner wall of the rotating connection fixing ring 207, the movable ring 208 is fixedly connected to the spindle 201, and the movable ring 208 is located below the fixing ring 207, a receiving slot 208a is formed in the movable ring 208, one end of a second spring 208b is fixedly connected to the inner end wall of the receiving slot 208a, the other end of the second spring 208b is fixedly connected with the movable block 209, the movable block 209 is slidably connected with the inner wall of the receiving slot 208a, and a groove 207a is formed in the fixing ring 207 corresponding to the movable block 209.
In this embodiment, preferably, the top plate 401 can fix the fixing ring 207, when the spindle 201 rotates, the movable ring 208 is driven to rotate, under the action of the second spring 208b, the top of the movable block 209 is inserted into the groove 207a, the top of the movable block 209 is set to be an inclined plane, when the movable ring 208 rotates along the inclined plane of the top of the movable block 209, the movable ring 208 can rotate, and when the movable ring 208 rotates against the inclined plane of the top of the movable block 209, the movable ring 208 cannot rotate, so that the movable ring 208 and the spindle 201 can only rotate unidirectionally. The grooves 207a are preferably provided in four numbers, and are circumferentially arranged at the bottom of the fixing ring 207.
Referring to fig. 10, the upper surface of the support assembly 400 is fixedly connected with a driving tube 404, one end of the driving tube 404 is provided with an air inlet tube 405, an inner end wall of the driving tube 404 is provided with a third spring 406, the third spring 406 is connected with a second piston head 407, the second piston head 407 is slidably connected with the inner wall of the driving tube 404, the inside of the driving tube 404 is communicated with one end of a first connecting tube 408 and one end of a second connecting tube 409, the other end of the first connecting tube 408 is communicated with the first telescopic rod 204, the other end of the second connecting tube 409 is communicated with a fixed cylinder 307c, and an electric pressure relief valve 307c-1 is arranged on the fixed cylinder 307 c.
In this embodiment, preferably, an existing air pump may be communicated with the air inlet pipe 405, and the existing air pump may pump air into the driving pipe 404 through the air inlet pipe 405, and air in the driving pipe 404 may enter the first telescopic rod 204 and the fixed cylinder 307c through the first connecting pipe 408 or the second connecting pipe 409, respectively, to control the expansion and contraction of the first telescopic rod 204 or the second telescopic rod 307. The gas inside the fixed cylinder 307c can be discharged through the electric pressure release valve 307c-1.
When the air pump is used, the existing air pump is required to be communicated with the air inlet pipe 405, the existing air pump pumps air into the driving pipe 404 through the air inlet pipe 405, the air in the driving pipe 404 enters the first telescopic rod 204 through the first connecting pipe 408, at the moment, the second connecting pipe 409 is blocked by the second piston head 407, and at the moment, the air cannot enter the second connecting pipe 409. After the gas enters the first telescopic rod 204, the first telescopic rod 204 stretches, the first telescopic rod 204 drives the clamping plate 202 to move through the connecting plate 203, the limiting groove 202a is separated from the square rod section 201a, at the moment, the square rod section 201a is not locked any more, and the square rod section 201a or the main shaft 201 can rotate.
When the air pump continuously pumps air into the driving tube 404 through the air inlet pipe 405, when the first telescopic rod 204 stretches to the limit length, the first telescopic rod 204 does not stretch any more, at this time, the air pressure in the driving tube 404 increases, under the action of the air pressure, the second piston head 407 is pushed to slide, when the second connecting pipe 409 is exposed, the air in the driving tube 404 enters one side, close to the first piston head 307e and the movable rod 307d, of the fixed tube 307c through the second connecting pipe 409, the air pressure in one side, close to the first piston head 307e and the movable rod 307d, of the fixed tube 307c pushes the first piston head 307e to move, the first piston head 307e drives the movable rod 307d to retract into the fixed tube 307c, at this time, the second telescopic rod 307 contracts, the second rotating shaft 307b and the fixed block 302a are driven to rotate on the outer wall of the main shaft 201 through the second fixed tube 307a, at this time, the second rotating shaft 307b is driven to rotate against the clamping groove 301a, the fixed disk 301 rotates, the main shaft 301 rotates, at this time, the rotating angle of the clamping block 209 is approximately 90 °, the moving ring 208 is driven to rotate, and the top of the movable block 209 is inserted into the inclined surface 209 a.
Then control air pump no longer pumps into gas, discharge the inside gas of drive pipe 404 through the air pump pressure release, first telescopic link 204 shrink this moment, drive cardboard 202 to square pole section 201a through connecting plate 203 and remove, spacing groove 202a card on the cardboard 202 is on square pole section 201a, the angle of square pole section 201a pivoted carries out spacingly, guarantee square pole section 201a or main shaft 201 pivoted angle is 90, when in order to improve mounting panel 101 rotation 90, remove the precision of grinding the position of semiconductor raw materials with next grinding wheel 104, further improve the precision of grinding, avoid because there is the deviation in the position of new and old grinding wheel, semiconductor raw materials surface accuracy causes the influence.
Meanwhile, the electric pressure relief valve 307c-1 is controlled to discharge air in the fixed cylinder 307c, air pressure in the fixed cylinder 307c, which is close to the first piston head 307e and one side of the movable rod 307d, is reduced, at the moment, the second telescopic rod 307 is extended, the clamping block 303 rotates along the clamping groove 301a, at the moment, the clamping block 303 slides out of the clamping groove 301a and then slides relative to the outer wall of the fixed disc 301, the fixed disc 301 cannot be driven to rotate, when the movable ring 208 rotates against the inclined surface at the top of the movable block 209, the movable ring 208 and the main shaft 201 cannot rotate, the movable ring 208 and the main shaft 201 can only rotate in one direction, namely, air in the driving tube 404 is discharged through pressure relief of the air pump, and the electric pressure relief valve 307c-1 is controlled to discharge air in the fixed cylinder 307c, so that the time for replacing the grinding wheel 104 can be reduced, and the working efficiency is improved.
After the pressure is completely relieved, the second telescopic rod 307 and the second piston head 407 are reset, then the new grinding wheel 104 with smaller granularity can be used for grinding the semiconductor raw materials, the replacement of the grinding wheel 104 is controlled to be more convenient and quicker, the automatic locking and unlocking of the main shaft 201 can be completed, the deviation of the grinding wheel 104 is prevented when the semiconductor raw materials are ground, and the grinding precision is improved.
Claims (7)
1. A semiconductor raw material grinding device is characterized in that: comprising
The grinding assembly (100), the grinding assembly (100) comprises a mounting plate (101), a first fixed pipe (102), a rotating shaft (103) and a grinding wheel (104), wherein the outer side of the mounting plate (101) is fixedly connected with the outer wall of the first fixed pipe (102), the inner wall of the first fixed pipe (102) is rotationally connected with the rotating shaft (103), and the bottom wall of the rotating shaft (103) is fixedly connected with the grinding wheel (104);
the locking assembly (200), the locking assembly (200) comprises a main shaft (201), a clamping plate (202), a connecting plate (203) and a first telescopic rod (204), wherein the bottom end of the main shaft (201) is fixedly connected with the upper surface of the mounting plate (101), one section of the main shaft (201) is provided with a square rod section (201 a), a limit groove (202 a) is formed in the position corresponding to the square rod section (201 a) on one side of the clamping plate (202), the connecting plate (203) is fixedly connected to the other side of the clamping plate (202), the clamping plate (202) and the connecting plate (203) are symmetrically arranged on two sides of the square rod section (201 a), and the two ends of the first telescopic rod (204) are fixedly connected with the connecting plate (203) respectively;
the switching assembly (300), the switching assembly (300) comprises a fixed disc (301), a rotating disc (302), a clamping block (303), a pressing plate (304), a fixed plate (305), a first spring (306), a second telescopic rod (307), a supporting frame (308) and a mounting shaft (309), wherein the fixed disc (301) is fixedly connected with the outer wall of the main shaft (201), a clamping groove (301 a) is formed in the fixed disc (301), the clamping block (303) is connected with the inner wall of the clamping groove (301 a) in a clamping manner, the clamping block (303) is fixedly connected with the pressing plate (304), the pressing plate (304) is fixedly connected with a first rotating shaft (304 a), the bottom of the first rotating shaft (304 a) is rotationally connected with the fixed block (302 a), the fixed block (302 a) is fixedly connected with one side of the rotating disc (302), and the rotating disc (302) is rotationally connected with the outer wall of the main shaft (201);
the fixing plate (305) is fixedly connected with the fixing block (302 a), a first spring (306) is arranged between the fixing plate (305) and the pressing plate (304), and two ends of the first spring (306) are respectively and fixedly connected with the fixing plate (305) and the pressing plate (304);
the outer wall of the second telescopic rod (307) is fixedly connected with the inner wall of the supporting frame (308), the outer wall of the supporting frame (308) is fixedly connected with the sleeve (308 a), the inner wall of the sleeve (308 a) is rotationally connected with one end of the installation shaft (309), one end of the second telescopic rod (307) is fixedly connected with the outer wall of the second fixed pipe (307 a), the inner wall of the second fixed pipe (307 a) is rotationally connected with the second rotating shaft (307 b), the fixed block (302 a) is provided with a movable groove (302 a-1), the second rotating shaft (307 c) penetrates through the movable groove (302 a-1) on the fixed block (302 a), and the inner wall of the movable groove (302 a-1) is slidingly connected with two ends of the second fixed pipe (307 b).
2. The semiconductor raw material grinding apparatus as claimed in claim 1, wherein: the second telescopic rod (307) comprises a fixed cylinder (307 c), a movable rod (307 d) and a first piston head (307 e), wherein the outer wall of the fixed cylinder (307 c) is fixedly connected with the inner wall of a supporting frame (308), the inner wall of the fixed cylinder (307 c) is slidably connected with the first piston head (307 e) and the movable rod (307 d), the first piston head (307 e) is fixedly connected with one end of the movable rod (307 d), and the other end of the movable rod (307 d) is fixedly connected with the outer wall of the second fixed pipe (307 a).
3. The semiconductor raw material grinding apparatus as claimed in claim 2, wherein: the outer wall of the main shaft (201) is fixedly connected with a first limiting plate (205) and a second limiting plate (206), the first limiting plate (205) and the second limiting plate (206) are arranged on two sides of the square rod section (201 a), and the first limiting plate (205) and the second limiting plate (206) are relatively close to the side sliding connection clamping plate (202) or the connecting plate (203).
4. The semiconductor raw material grinding apparatus as claimed in claim 1, wherein: still include supporting component (400), supporting component (400) include roof (401), motor cabinet (402) and motor (403), roof (401) are connected in rotation of main shaft (201) top, roof (401) fixed connection installation axle (309) other end, roof (401) lower surface fixed connection motor cabinet (402), install motor (403) on motor cabinet (402), pivot (103) are connected to motor (403).
5. The semiconductor raw material grinding apparatus as claimed in claim 1, wherein: the outer wall of the rotating shaft (103) is connected with the inner wall of the belt ring (103 a).
6. The semiconductor raw material grinding apparatus as claimed in claim 4, wherein: locking assembly (200) still includes solid fixed ring (207) and expansion ring (208) and movable block (209), fixed ring (207) of fixed surface connection under roof (401), main shaft (201) pass solid fixed ring (207) to main shaft (201) pass and rotate fixed ring (207) inner wall, fixed connection expansion ring (208) on main shaft (201), and expansion ring (208) are located solid fixed ring (207) below, holding tank (208 a) have been seted up on expansion ring (208), holding tank (208 a) inner wall fixed connection second spring (208 b) one end, second spring (208 b) other end fixed connection movable block (209), movable block (209) sliding connection holding tank (208 a) inner wall, and corresponding movable block (209) are provided with recess (207 a) on solid fixed ring (207).
7. The semiconductor raw material grinding apparatus as claimed in claim 6, wherein: the support assembly is characterized in that the upper surface of the support assembly (400) is fixedly connected with the driving pipe (404), one end of the driving pipe (404) is provided with the air inlet pipe (405), the inner end wall of the driving pipe (404) is provided with the third spring (406), the third spring (406) is connected with the second piston head (407), the second piston head (407) is slidably connected with the inner wall of the driving pipe (404), the inside of the driving pipe (404) is communicated with one end of the first connecting pipe (408) and one end of the second connecting pipe (409), the other end of the first connecting pipe (408) is communicated with the first telescopic rod (204), the other end of the second connecting pipe (409) is communicated with the fixed cylinder (307 c), and the fixed cylinder (307 c) is provided with the electric pressure release valve (307 c-1).
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| Application Number | Priority Date | Filing Date | Title |
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| CN202211738770.7A CN115847275B (en) | 2022-12-31 | 2022-12-31 | Semiconductor raw material grinding equipment |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211738770.7A CN115847275B (en) | 2022-12-31 | 2022-12-31 | Semiconductor raw material grinding equipment |
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| CN115847275A CN115847275A (en) | 2023-03-28 |
| CN115847275B true CN115847275B (en) | 2023-10-27 |
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| CN115847275A (en) | 2023-03-28 |
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