CN115846912A - Brain electrode chip punching method and device, electronic equipment and laser punching equipment - Google Patents
Brain electrode chip punching method and device, electronic equipment and laser punching equipment Download PDFInfo
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Abstract
The application belongs to the technical field of manufacturing of photoelectric integrated chips and discloses a method and a device for punching a brain electrode chip, electronic equipment and laser punching equipment, wherein the method comprises the steps of obtaining the hole diameter and the position of each to-be-punched hole of the brain electrode chip; determining the punching energy of each hole to be punched according to the hole diameter of each hole to be punched; determining the energy coefficient of each hole to be punched according to the hole diameter of each hole to be punched; based on a preset laser drilling function, calculating the drilling time of each hole to be drilled according to the energy coefficient and the drilling energy of each hole to be drilled; controlling a laser puncher to sequentially punch holes at positions to be punched along a punching path by using laser with corresponding energy intensity and corresponding punching time according to the energy coefficients to be punched; thereby improving the punching efficiency and reducing the punching position deviation.
Description
Technical Field
The application relates to the technical field of manufacturing of photoelectric integrated chips, in particular to a method and a device for punching a brain electrode chip, electronic equipment and laser punching equipment.
Background
The brain electrode chip is used in brain electrodes, has the characteristics of small surface area, small thickness, high pin number density, low thermal impedance, excellent electrical performance and the like, and can better meet the requirements of brain electrode users on signal transmission and signal processing. In the process of customizing brain electrode chips, holes (with different hole diameters) need to be punched on the surfaces of the brain electrode chips according to a designed circuit diagram according to the actual use requirements of the brain electrodes, so that the interconnection among different brain electrode chips can be realized, and the information of the brain electrode chips and upper computer software can be quickly and stably transmitted in the actual use process.
Because the number of holes to be punched on the surface of a brain electrode chip is huge, and the hole diameters of holes of the same brain electrode chip are often different, the conventional punching technology adopts laser to circularly punch the chip according to different hole diameters on the surface of the chip (for example, when a certain brain electrode chip comprises holes with the hole diameters of 5mm and 4mm, the energy of the laser is set firstly, then the holes with the hole diameters of 5mm on the surface of the chip are punched in sequence according to punching time and coordinates, after all the holes are punched, the energy of the laser is reduced, the holes with the hole diameters of 4mm on the surface of the chip are punched in sequence according to the punching time and coordinates, if the holes with other hole diameters are also included on the surface of the brain electrode chip, the circulation is carried out according to the punching time and coordinates).
Disclosure of Invention
The application aims to provide a method and a device for punching a brain electrode chip, electronic equipment and laser punching equipment, which can improve punching efficiency and reduce punching position deviation.
In a first aspect, the application provides a method for punching a brain electrode chip, which is applied to laser punching equipment, wherein the laser punching equipment comprises a laser puncher, a laser probe array consisting of a plurality of laser probes is arranged at the lower end of the laser puncher, the laser probes are used for emitting laser, and the laser energy intensity of the laser puncher can be adjusted by adjusting the number of the started laser probes;
the brain electrode chip punching method comprises the following steps:
a1, acquiring the aperture and position of each to-be-punched hole of a brain electrode chip;
step A2, determining the punching energy of each hole to be punched according to the hole diameter of each hole to be punched;
step A3, determining the energy coefficient of each hole to be punched according to the hole diameter of each hole to be punched;
step A4, based on a preset laser drilling function, calculating the drilling time of each hole to be drilled according to the energy coefficient and the drilling energy of each hole to be drilled;
and A5, controlling the laser puncher to sequentially punch at the positions to be punched along a punching path by using the laser with the corresponding energy intensity and the corresponding punching time according to the energy coefficient to be punched.
Before punching, determining energy coefficients and punching time of all holes to be punched according to the hole diameters and positions of all holes to be punched, sequentially moving to all punching positions along a punching path to punch holes, adjusting the laser energy intensity of a laser puncher according to the corresponding energy coefficients at all the punching positions, and irradiating a brain electrode chip by the laser with the energy intensity and the corresponding punching time, so that the punching of all the holes to be punched is completed; compare in traditional circulating mode of punching, because laser puncher need not to return the original point many times, it is shorter to remove total route, thereby it is higher to punch efficiency, in addition, set up the laser probe array on the laser puncher, and adjust the energy intensity of laser through the laser probe quantity of adjusting the start, every laser probe's power is less relatively, the vibration that can arouse when opening and close is very little, compare in the laser puncher of current high-power single probe, the vibration that arouses when changing laser energy intensity is littleer, thereby can reduce the positional deviation that punches that arouses because the vibration.
Preferably, step A2 comprises:
and calculating the punching energy to be punched according to the aperture to be punched by adopting a preset punching energy calculation formula.
Therefore, the punching energy to be punched can be quickly and conveniently determined.
Preferably, step A3 comprises:
a301, calculating an aperture threshold value according to the aperture to be punched;
step A302, comparing the aperture to be punched with the aperture threshold value to determine the energy coefficient to be punched.
Preferably, step a301 comprises:
acquiring a maximum aperture value and a minimum aperture value of the aperture;
calculating an average of the maximum aperture value and the minimum aperture value as the aperture threshold.
Preferably, step a302 comprises:
if the aperture to be punched is larger than the aperture threshold, setting the energy coefficient to be punched to be K times of a preset basic energy coefficient, wherein K is a preset positive integer value larger than 1;
if the aperture to be punched is not larger than the aperture threshold, setting the energy coefficient to be punched as a preset basic energy coefficient.
Actually, in punching, the energy intensity of the laser is large, and although punching efficiency is higher, the precision of the punching aperture is relatively low, and conversely, the energy intensity of the laser is small, and although punching aperture precision is higher, punching efficiency is relatively low. Here, according to actual aperture size ground dynamic adjustment laser energy intensity and punching time, the aperture is big more, then laser energy intensity is big more, corresponding punching time shortens, the aperture is little less, then laser energy intensity is little less, corresponding punching time increases, realize at the in-process that punches, to laser energy intensity and punching time's dynamic adjustment, the realization is to waiting to punch the self-adaptation to different apertures and is punched, thereby be favorable to realizing the time of whole process of punching and the balance of the aperture precision of punching, realize the whole optimization of the overall process of punching.
Preferably, the laser drilling function is:
wherein ,
for punching energy, is selected>
Is an energy factor>
For the laser energy intensity of a single laser probe, <' > or>
For the punching time>
Is a time coefficient->
Is a compensation constant;
the step A4 comprises the following steps:
calculating the punching time to be punched according to the following formula:
wherein ,
is a first->
The punch time to be punched is selected>
Is the first->
Said punch energy to be punched>
Is the first->
The energy factor to be punched is/are>
The number of holes to be punched.
Preferably, step A5 comprises:
step A501, determining the number of the laser probes to be started when the holes to be punched are punched according to the energy coefficient of each hole to be punched, and recording the number as a first number;
step A502, planning a punching path which is sequentially connected with the positions to be punched according to the positions to be punched;
step A503, controlling the laser puncher to sequentially move to the positions to be punched along the punching path, and starting the corresponding first number of laser probes at the positions to be punched to continuously irradiate the corresponding punching time for the brain electrode chips.
In a second aspect, the application provides a brain electrode chip punching device, which is applied to laser punching equipment, wherein the laser punching equipment comprises a laser puncher, a laser probe array consisting of a plurality of laser probes is arranged at the lower end of the laser puncher, the laser probes are used for emitting laser, and the laser energy intensity of the laser puncher can be adjusted by adjusting the number of the started laser probes;
the brain electrode chip perforating device comprises:
the first acquisition module is used for acquiring the aperture and the position of each hole to be punched of the brain electrode chip;
the punching energy determining module is used for determining the punching energy of each hole to be punched according to the aperture of each hole to be punched;
the energy coefficient determining module is used for determining the energy coefficient of each hole to be punched according to the aperture of each hole to be punched;
the punching time calculation module is used for calculating the punching time to be punched according to the energy coefficient to be punched and the punching energy based on a preset laser punching function;
and the punching control module is used for controlling the laser puncher to sequentially punch holes at the positions to be punched along a punching path by using the laser with the corresponding energy intensity and the corresponding punching time according to the energy coefficients to be punched.
Before punching, determining energy coefficients and punching time of all holes to be punched according to the hole diameters and positions of all holes to be punched, sequentially moving to all punching positions along a punching path to punch holes, adjusting the laser energy intensity of a laser puncher according to the corresponding energy coefficients at all the punching positions, and irradiating a brain electrode chip by the laser with the energy intensity and the corresponding punching time, so that the punching of all the holes to be punched is completed; compare in traditional circulating mode of punching, because laser puncher need not to return the original point many times, it is shorter to remove total route, thereby it is higher to punch efficiency, in addition, set up the laser probe array on the laser puncher, and adjust the energy intensity of laser through the laser probe quantity of adjusting the start, every laser probe's power is less relatively, the vibration that can arouse when opening and close is very little, compare in the laser puncher of current high-power single probe, the vibration that arouses when changing laser energy intensity is littleer, thereby can reduce the positional deviation that punches that arouses because the vibration.
In a third aspect, the present application provides an electronic device comprising a processor and a memory, wherein the memory stores a computer program executable by the processor, and the processor executes the computer program to execute the steps of the brain electrode chip punching method as described above.
In a fourth aspect, the application provides a laser punching device, which is used for punching a brain electrode chip and comprises a positioning table, a laser puncher and a control device, wherein the laser puncher is arranged above the positioning table, a laser probe array consisting of a plurality of laser probes is arranged at the lower end of the laser puncher, the laser probes are used for emitting laser, and the laser energy intensity of the laser puncher can be adjusted by adjusting the number of the started laser probes;
the positioning table is used for placing brain electrode chips to be punched;
the control device is used for obtaining the aperture and the position of each to-be-punched hole of the brain electrode chip, determining the punching energy of each to-be-punched hole according to each to-be-punched hole, determining the energy coefficient of each to-be-punched hole according to each to-be-punched hole, calculating the punching time of each to-be-punched hole according to each to-be-punched energy coefficient and punching energy based on a preset laser punching function, and controlling the laser puncher to sequentially punch holes at each to-be-punched position along a punching path by using laser with corresponding energy intensity and corresponding punching time according to each to-be-punched energy coefficient.
Has the advantages that:
according to the brain electrode chip punching method, the device, the electronic equipment and the laser punching equipment, before punching, the energy coefficient and the punching time of each hole to be punched are determined according to the hole diameter and the position of each hole to be punched, then the hole is punched by moving to each punching position along a punching path in sequence, at each punching position, the laser energy intensity of a laser puncher is adjusted according to the corresponding energy coefficient, and the brain electrode chip is irradiated by the laser with the energy intensity and the corresponding punching time, so that the punching of each hole to be punched is completed; compare in traditional circulating mode of punching, because laser puncher need not to return the original point many times, it is shorter to remove total route, thereby it is higher to punch efficiency, in addition, set up the laser probe array on the laser puncher, and adjust the energy intensity of laser through the laser probe quantity of adjusting the start, every laser probe's power is less relatively, the vibration that can arouse when opening and close is very little, compare in the laser puncher of current high-power single probe, the vibration that arouses when changing laser energy intensity is littleer, thereby can reduce the positional deviation that punches that arouses because the vibration.
Drawings
Fig. 1 is a flowchart of a method for punching an electroencephalogram chip according to an embodiment of the present application.
Fig. 2 is a schematic structural diagram of an electroencephalogram chip perforating device according to an embodiment of the present application.
Fig. 3 is a schematic structural diagram of an electronic device according to an embodiment of the present application.
Fig. 4 is a schematic structural diagram of a laser drilling apparatus according to an embodiment of the present application.
Fig. 5 is a bottom view of a laser punch of a laser punching apparatus according to an embodiment of the present disclosure.
Description of reference numerals: 1. a first acquisition module; 2. a punching energy determination module; 3. an energy coefficient determination module; 4. a punching time calculation module; 5. a punching control module; 301. a processor; 302. a memory; 303. a communication bus; 90. a brain electrode chip; 100. a positioning table; 200. a laser puncher; 201. a laser probe; 300. a control device; 400. a double-shaft driving device.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. The components of the embodiments of the present application, generally described and illustrated in the figures herein, can be arranged and designed in a wide variety of different configurations. Thus, the following detailed description of the embodiments of the present application, presented in the accompanying drawings, is not intended to limit the scope of the claimed application, but is merely representative of selected embodiments of the application. All other embodiments, which can be derived by a person skilled in the art from the embodiments of the present application without making any creative effort, shall fall within the protection scope of the present application.
It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures. Meanwhile, in the description of the present application, the terms "first", "second", and the like are used only for distinguishing the description, and are not to be construed as indicating or implying relative importance.
Referring to fig. 1, fig. 1 is a method for punching a brain electrode chip in some embodiments of the present application, which is applied to a laser punching device, the laser punching device includes a laser puncher, a laser probe array composed of a plurality of laser probes is disposed at a lower end of the laser puncher, the laser probes are used for emitting laser, and laser energy intensity of the laser puncher can be adjusted by adjusting the number of the started laser probes;
the brain electrode chip punching method comprises the following steps:
a1, acquiring the aperture and position of each hole to be punched of a brain electrode chip;
step A2, determining the punching energy of each hole to be punched according to the hole diameter of each hole to be punched;
step A3, determining the energy coefficient of each hole to be punched according to the hole diameter of each hole to be punched;
step A4, based on a preset laser drilling function, calculating the drilling time of each hole to be drilled according to the energy coefficient and the drilling energy of each hole to be drilled;
and step A5, controlling the laser puncher to sequentially punch holes at the positions to be punched along a punching path by using the laser with corresponding energy intensity and corresponding punching time according to the energy coefficients to be punched.
Before punching, determining energy coefficients and punching time of all holes to be punched according to the hole diameters and positions of all holes to be punched, sequentially moving to all punching positions along a punching path to punch holes, adjusting the laser energy intensity of a laser puncher according to the corresponding energy coefficients at all the punching positions, and irradiating a brain electrode chip by the laser with the energy intensity and the corresponding punching time, so that the punching of all the holes to be punched is completed; compare in traditional circulating mode of punching, because laser puncher need not to return the original point many times, it is shorter to remove total route, thereby it is higher to punch efficiency, in addition, set up the laser probe array on the laser puncher, and adjust the energy intensity of laser through the laser probe quantity of adjusting the start, every laser probe's power is less relatively, the vibration that can arouse when opening and close is very little, compare in the laser puncher of current high-power single probe, the vibration that arouses when changing laser energy intensity is littleer, thereby can reduce the positional deviation that punches that arouses because the vibration.
The laser drilling apparatus may be the laser drilling apparatus shown in fig. 4, and includes a positioning table 100, a laser puncher 200 disposed above the positioning table 100, and a control device 300, where a laser probe array (shown in fig. 5) composed of a plurality of laser probes 201 is disposed at a lower end of the laser puncher 200. Preferably, the plurality of laser probes 201 are arranged in a multi-layer circular ring shape (as shown in fig. 5), so that the laser beam after adjusting the energy intensity is in a circular shape, thereby ensuring the precision of the hole diameter of the punched hole.
The method comprises the following steps that A1, the aperture and the position of each hole to be punched can be recorded in advance when a brain electrode chip is designed, a parameter table to be punched is formed, and the aperture and the position of each hole to be punched are directly read from the parameter table to be punched in the step A1; alternatively, in step A1, the electroencephalogram chip plan is read, and then the aperture and position of each hole to be punched are identified from the electroencephalogram chip plan (the specific identification method is prior art, and the detailed description thereof is omitted here).
The punching energy of each hole to be punched refers to the total energy of the laser irradiated on the brain electrode chip (the total energy is equal to the integral of the energy intensity of the laser on the irradiation time) required for completing the punching process of the hole to be punched.
The punching energy required by different apertures can be obtained in advance through tests, and a punching energy lookup table (which records a plurality of different apertures and corresponding punching energy) can be formed according to test results, or a punching energy calculation formula for calculating punching energy according to the apertures can be fitted according to the test results.
Thus, in some embodiments, step A2 comprises:
and inquiring in a preset punching energy inquiry table according to the aperture of each hole to be punched to obtain the punching energy of each hole to be punched.
In the method, corresponding to the situation that the actual aperture to be punched is not recorded in the punching energy lookup table, the punching energy corresponding to the aperture closest to the actual aperture in the punching energy lookup table may be selected as the lookup result, or two apertures (i.e., the aperture smaller than and closest to the actual aperture and the aperture larger than and closest to the actual aperture) adjacent to the actual aperture in the punching energy lookup table and the corresponding punching energy may be used to perform interpolation operation to obtain the punching energy corresponding to the actual aperture (the specific interpolation operation method is the prior art, and details thereof are not described here).
In other embodiments, step A2 comprises:
and calculating the punching energy to be punched according to the aperture to be punched by adopting a preset punching energy calculation formula.
Thereby the punching energy of each to-be-punched hole can be rapidly and conveniently determined.
Wherein the energy coefficient is a coefficient related to the number of activations of the laser probe, the energy coefficient being proportional to the number of activations of the laser probe, and in some embodiments, the energy coefficient may be equal to the number of activations of the laser probe.
The specific rule for determining the energy coefficient according to the aperture can be set according to practical requirements, for example, in some embodiments, step A3 includes:
step A301, calculating an aperture threshold value according to each aperture to be punched;
and A302, comparing the aperture to be punched with an aperture threshold value to determine the energy coefficient of each hole to be punched.
Wherein, step a301 includes:
acquiring a maximum aperture value and a minimum aperture value of the aperture;
and calculating the average value of the maximum aperture value and the minimum aperture value as the aperture threshold value.
Expressed by a formula, namely:
In fact, the manner of calculating the aperture threshold value is not limited to this, and for example, an average value of all the apertures to be punched may be used as the aperture threshold value.
Wherein, step a302 includes:
if the aperture to be punched is larger than the aperture threshold value, setting the energy coefficient to be punched to be K times of a preset basic energy coefficient, wherein K is a preset positive integer value larger than 1;
and if the aperture to be punched is not larger than the aperture threshold, setting the energy coefficient to be punched as a preset basic energy coefficient.
Actually, when drilling, the energy intensity of the laser is large, and although the drilling efficiency is higher, the precision of the drilling aperture is relatively low, and conversely, the energy intensity of the laser is small, and although the precision of the drilling aperture is higher, the drilling efficiency is relatively low. Here, according to actual aperture size dynamic ground regulation laser energy intensity and punching time, the aperture is big more, then laser energy intensity is big more, corresponding punching time shortens, the aperture is little, then laser energy intensity is little, corresponding punching time increases, realize at the punching in-process, dynamic adjustment to laser energy intensity and punching time, the realization is waited to punch the self-adaptation to different apertures and is punched, thereby be favorable to realizing the time of whole punching process and the balance of the aperture precision of punching, realize the whole optimization of the overall process that punches.
The value of K can be set according to actual needs, for example, but is not limited to 2. The basic energy coefficient can be set according to actual needs, and is minimum 1 for the condition that the energy coefficient is equal to the starting number of the laser probes.
In fact, the energy coefficient to be punched is not limited to be set to only two values, for example, the case of being larger than the aperture threshold value may be divided into a plurality of aperture ranges (the specific number of the segments may be set according to actual needs), and a proportional value Q (Q is a positive integer value larger than 1) is assigned to each aperture range, so that if the aperture to be punched is not larger than the aperture threshold value, the energy coefficient to be punched is set to be a preset basic energy coefficient; and if the aperture to be punched is larger than the aperture threshold, setting the energy coefficient to be punched as a corresponding basic energy coefficient Q times according to the aperture range in which the aperture to be punched falls.
In this embodiment, the laser drilling function is:
wherein ,
for punching energy, is selected>
Is an energy factor>
For the laser energy intensity of a single laser probe (related to the performance of the laser probe, and can be set according to the laser energy intensity adjusting range of the laser probe), and/or>
For the punching time>
For a time factor (which can be set as desired, for example, but not exclusively, 1), ->
A compensation constant (which can be measured by experiment in advance);
thus, step A4 includes:
calculating the punching time to be punched according to the following formula:
wherein ,
is the first->
A time of said punch to be punched, based on the number of bits in the sample>
Is a first->
The punching energy of each of the holes to be punched,
is the first->
The energy factor to be punched>
The number of holes to be punched.
Specifically, step A5 includes:
step A501, determining the number of the laser probes to be started when the holes are punched according to the energy coefficient of each hole to be punched, and recording the number as a first number;
step A502, planning a punching path sequentially connecting all positions to be punched according to all positions to be punched;
and step A503, controlling the laser puncher to sequentially move to the positions to be punched along the punching path, and starting a corresponding first number of laser probes at the positions to be punched to continuously irradiate the brain electrode chips for the corresponding punching time.
The energy coefficient is a coefficient related to the starting number of the laser probes, the energy coefficient is in direct proportion to the starting number of the laser probes, and the conversion relation between the energy coefficient and the starting number of the laser probes can be preset according to actual needs. For the case where the energy factor is equal to the number of activations of the laser probe, the energy factor is directly used as the first number in step a501.
Wherein, the shortest perforation paths to be perforated can be planned and connected in sequence by using the existing path planning algorithm (such as, but not limited to, a-x algorithm, dijkstra algorithm, etc.); therefore, the moving distance of the laser puncher is shortest, and the punching efficiency is effectively improved.
Wherein, to the condition that laser probe is the multilayer ring form and arranges (as the condition that fig. 5 shows), when controlling laser hole puncher to start the laser probe of first quantity, can confirm the number that the laser probe that needs to start encircles (all laser probes that arrange on same ring constitute a laser probe ring) according to the following formula:
wherein ,
for the number of laser probe rings to be activated, is selected>
Is a first->
The number of the laser probes of each laser probe ring (from inside to outside, the serial number of each laser probe ring->
Gradually increasing)), is selected>
Is a first amount;
if it is not
Then the 1 st to the 1 th are selected>
Starting all laser probes of each laser probe ring;
if it is not
Then the 1 st to the 1 th are selected>
All laser probes of the individual laser probe ring are activated and the ^ th or ^ th based on the following formula>
Laser probe activation interval->
And then the fifth->
After one laser probe is randomly selected from the laser probe rings as a selected probe, the latest determined fifth or fifth based on the clockwise or counterclockwise direction is selected in turn>
The laser probe is used as the next selected probe until the total number of the selected probes and the 1 st to the 1 st->
The sum of the total number of all laser probes in a laser probe ring is equal to &>
And activating all selected probes, wherein>
For activating the interval for the laser probe, is activated>
Is the first->
The number of laser probes of each laser probe ring,
is a rounding function.
Therefore, the laser beam emitted by the laser puncher can be ensured to be circular to the maximum extent, so that the punching aperture precision is ensured.
According to the method for punching the brain electrode chip, the hole diameter and the position of each to-be-punched hole of the brain electrode chip are obtained; determining the punching energy of each hole to be punched according to the hole diameter of each hole to be punched; determining the energy coefficient of each hole to be punched according to the hole diameter of each hole to be punched; based on a preset laser drilling function, calculating the drilling time of each hole to be drilled according to the energy coefficient and the drilling energy of each hole to be drilled; controlling a laser puncher to sequentially punch holes at positions to be punched along a punching path by using laser with corresponding energy intensity and corresponding punching time according to the energy coefficients to be punched; thereby improving the punching efficiency and reducing the punching position deviation. Specifically, the method has the following advantages:
1. by adopting a pre-decision strategy before punching, the contradiction between the whole punching efficiency and the whole punching error is effectively considered in the process of punching the surface of the chip;
2. establishing a laser drilling function, wherein the core of the function is that dynamic adjustment of laser energy and drilling time is realized in the drilling process by setting different coefficients, and self-adaptive drilling of holes to be drilled with different apertures is realized; the punching method has the corresponding beneficial effects that when the large aperture is punched, a large-energy and short-time punching method is adopted, so that the problem of low overall efficiency caused by long time consumption in the process of punching the large aperture to be punched is avoided; when the small-aperture to-be-punched hole is punched, a 'small-energy and long-time' punching method is adopted, so that the problem of large aperture error in the punching process of the small-aperture to-be-punched hole is avoided;
3. the self-adaptive punching method for punching holes with different apertures on the surface of the brain electrode chip is realized by combining the idea of 'decision making in advance', the whole punching time can be effectively shortened, the problem of large aperture error in the punching process is solved, the punching efficiency of a single batch of chips is improved, and the method has high practical application value.
Referring to fig. 2, the application provides a brain electrode chip punching device, which is applied to laser punching equipment, wherein the laser punching equipment comprises a laser puncher, a laser probe array consisting of a plurality of laser probes is arranged at the lower end of the laser puncher, the laser probes are used for emitting laser, and the laser energy intensity of the laser puncher can be adjusted by adjusting the number of the started laser probes;
the brain electrode chip perforating device comprises:
the first acquisition module 1 is used for acquiring the aperture and the position of each to-be-punched hole of the brain electrode chip;
the punching energy determining module 2 is used for determining the punching energy of each hole to be punched according to the aperture of each hole to be punched;
the energy coefficient determining module 3 is used for determining the energy coefficient of each hole to be punched according to the aperture of each hole to be punched;
the punching time calculation module 4 is used for calculating the punching time of each hole to be punched according to the energy coefficient and the punching energy of each hole to be punched based on a preset laser punching function;
and the punching control module 5 is used for controlling the laser puncher to sequentially punch holes at the positions to be punched along a punching path by using the laser with the corresponding energy intensity and the corresponding punching time according to the energy coefficients to be punched.
Before punching, determining energy coefficients and punching time of all holes to be punched according to the hole diameters and positions of all holes to be punched, sequentially moving to all punching positions along a punching path to punch holes, adjusting the laser energy intensity of a laser puncher according to the corresponding energy coefficients at all the punching positions, and irradiating a brain electrode chip by the laser with the energy intensity and the corresponding punching time, so that the punching of all the holes to be punched is completed; compare in traditional circulating mode of punching, because laser puncher need not to return the original point many times, it is shorter to remove total route, thereby it is higher to punch efficiency, in addition, set up the laser probe array on the laser puncher, and adjust the energy intensity of laser through the laser probe quantity of adjusting the start, every laser probe's power is less relatively, the vibration that can arouse when opening and close is very little, compare in the laser puncher of current high-power single probe, the vibration that arouses when changing laser energy intensity is littleer, thereby can reduce the positional deviation that punches that arouses because the vibration.
The laser drilling apparatus may be the laser drilling apparatus shown in fig. 4, and includes a positioning table 100, a laser puncher 200 disposed above the positioning table 100, and a control device 300, where a laser probe array (shown in fig. 5) composed of a plurality of laser probes 201 is disposed at a lower end of the laser puncher 200. Preferably, the plurality of laser probes 201 are arranged in a multi-layer circular ring shape (as shown in fig. 5), so that the laser beams after the energy intensity is adjusted are in a circular shape, thereby ensuring the precision of the hole diameter of the hole.
The method comprises the steps that the aperture and the position of each hole to be punched can be recorded in advance when a brain electrode chip is designed to form a parameter table to be punched, and the first acquisition module 1 directly reads the aperture and the position of each hole to be punched from the parameter table to be punched; alternatively, the first acquiring module 1 may read the electroencephalogram chip plan and then identify the aperture and position of each hole to be punched from the electroencephalogram chip plan (the specific identification method is prior art and is not described in detail here).
The punching energy of each hole to be punched refers to the total energy of the laser irradiated on the brain electrode chip (the total energy is equal to the integral of the energy intensity of the laser over the irradiation time) required for completing the punching process of the hole to be punched.
The punching energy required by different apertures can be obtained in advance through tests, and a punching energy lookup table (which records a plurality of different apertures and corresponding punching energy) can be formed according to test results, or a punching energy calculation formula for calculating punching energy according to the apertures can be fitted according to the test results.
Thus, in some embodiments, the puncturing energy determination module 2, when determining the puncturing energy for each aperture to be punctured according to the aperture to be punctured, performs:
and inquiring in a preset punching energy inquiry table according to the aperture of each hole to be punched to obtain the punching energy of each hole to be punched.
In response to the fact that the actual aperture to be punched is not recorded in the punching energy lookup table, the punching energy corresponding to the aperture closest to the actual aperture in the punching energy lookup table may be selected as a lookup result, or two apertures (i.e., the aperture smaller than and closest to the actual aperture and the aperture larger than and closest to the actual aperture) adjacent to the actual aperture in the punching energy lookup table and the corresponding punching energy may be used to perform interpolation operation to obtain the punching energy corresponding to the actual aperture (a specific interpolation operation method is the prior art, and details thereof are not described here).
In other embodiments, the puncturing energy determining module 2, when determining the puncturing energy for each aperture to be punctured according to each aperture to be punctured, performs:
and calculating the punching energy to be punched according to the aperture to be punched by adopting a preset punching energy calculation formula.
Thereby the punching energy of each to-be-punched hole can be rapidly and conveniently determined.
Wherein the energy coefficient is a coefficient related to the number of activations of the laser probe, the energy coefficient being proportional to the number of activations of the laser probe, and in some embodiments, the energy coefficient may be equal to the number of activations of the laser probe.
The specific rule for determining the energy coefficient according to the aperture may be set according to actual needs, for example, in some embodiments, the energy coefficient determining module 3 performs, when determining the energy coefficient to be punctured according to each aperture to be punctured:
calculating an aperture threshold according to each aperture to be punched;
and comparing the aperture to be punched with the aperture threshold value to determine the energy coefficient of each hole to be punched.
Wherein, the energy coefficient determining module 3 executes the following steps when calculating the aperture threshold according to each aperture to be punched:
acquiring a maximum aperture value and a minimum aperture value of the aperture;
and calculating the average value of the maximum aperture value and the minimum aperture value as the aperture threshold value.
Expressed by a formula, namely:
In fact, the manner of calculating the aperture threshold value is not limited to this, and for example, an average value of all the apertures to be punched may be used as the aperture threshold value.
When the energy coefficient determining module 3 compares each aperture to be punched with the aperture threshold to determine each energy coefficient to be punched, the following steps are performed:
if the aperture to be punched is larger than the aperture threshold value, setting the energy coefficient to be punched to be K times of a preset basic energy coefficient, wherein K is a preset positive integer value larger than 1;
and if the aperture to be punched is not larger than the aperture threshold value, setting the energy coefficient to be punched as a preset basic energy coefficient.
Actually, when drilling, the energy intensity of the laser is large, and although the drilling efficiency is higher, the precision of the drilling aperture is relatively low, and conversely, the energy intensity of the laser is small, and although the precision of the drilling aperture is higher, the drilling efficiency is relatively low. Here, according to actual aperture size dynamic ground regulation laser energy intensity and punching time, the aperture is big more, then laser energy intensity is big more, corresponding punching time shortens, the aperture is little, then laser energy intensity is little, corresponding punching time increases, realize at the punching in-process, dynamic adjustment to laser energy intensity and punching time, the realization is waited to punch the self-adaptation to different apertures and is punched, thereby be favorable to realizing the time of whole punching process and the balance of the aperture precision of punching, realize the whole optimization of the overall process that punches.
The value of K can be set according to actual needs, for example, but is not limited to 2. The basic energy coefficient can be set according to actual needs, and is minimum 1 for the condition that the energy coefficient is equal to the starting number of the laser probes.
In fact, the energy coefficient to be punched is not limited to be set to only two values, for example, the case of being larger than the aperture threshold value may be divided into a plurality of aperture ranges (the specific number of the segments may be set according to actual needs), and a proportional value Q (Q is a positive integer value larger than 1) is assigned to each aperture range, so that if the aperture to be punched is not larger than the aperture threshold value, the energy coefficient to be punched is set to be a preset basic energy coefficient; and if the aperture to be punched is larger than the aperture threshold, setting the energy coefficient to be punched as a corresponding basic energy coefficient Q times according to the aperture range in which the aperture to be punched falls.
In this embodiment, the laser drilling function is:
wherein ,
for punching energy, is selected>
Is an energy factor>
For the laser energy intensity of a single laser probe (related to the performance of the laser probe, can be set according to the laser energy intensity adjusting range of the laser probe), and/or>
For the punching time>
For a time factor (which can be set as desired, for example, but not limited to, 1), is/are selected>
A compensation constant (which can be measured by experiment in advance);
thus, the punching time calculation module 4 executes, when calculating each punching time to be punched based on a preset laser punching function according to each energy coefficient to be punched and punching energy:
calculating the punching time to be punched according to the following formula:
wherein ,
is the first->
A punching time to be punched, based on the measured value>
Is the first->
A punch energy to be punched which is greater or less than>
Is the first->
An energy factor to be punched, based on the measured value>
The number of holes to be punched.
Specifically, the punching control module 5 executes the following steps when controlling the laser puncher to punch holes at the positions to be punched in sequence along a punching path by using the laser with the corresponding energy intensity and the corresponding punching time according to the energy coefficients to be punched:
determining the number of the laser probes to be started when the holes are punched according to the energy coefficient of each hole to be punched, and recording the number as a first number;
planning a punching path sequentially connecting the positions to be punched according to the positions to be punched;
and controlling the laser puncher to sequentially move to the positions to be punched along the punching path, and starting the corresponding first number of laser probes at the positions to be punched to continuously irradiate the corresponding punching time for the brain electrode chips.
The energy coefficient is a coefficient related to the starting number of the laser probes, the energy coefficient is in direct proportion to the starting number of the laser probes, and the conversion relation between the energy coefficient and the starting number of the laser probes can be preset according to actual needs. For the case where the energy factor is equal to the number of activations of the laser probe, the energy factor is taken directly as the first number.
Wherein, the shortest perforation paths to be perforated can be planned and connected in sequence by using the existing path planning algorithm (such as, but not limited to, a-x algorithm, dijkstra algorithm, etc.); therefore, the moving distance of the laser puncher is shortest, and the punching efficiency is effectively improved.
Wherein, for the condition that the laser probes are arranged in a multilayer circular ring shape (as shown in fig. 5), when controlling the laser puncher to start the first number of laser probes, the number of laser probe rings (all the laser probes arranged on the same circular ring form a laser probe ring) to be started can be determined according to the following formula:
wherein ,
for the number of laser probe rings to be activated, is selected>
Is a first->
The number of the laser probes of each laser probe ring (from inside to outside, the serial number of each laser probe ring->
Gradually increasing)), is selected>
Is a first amount;
if it is not
Then the 1 st to the 1 th are selected>
Starting all laser probes of each laser probe ring;
if it is not
Then the 1 st to the 1 th are selected>
All laser probes of the individual laser probe ring are activated and the ^ th or ^ th based on the following formula>
Laser probe activation interval for individual laser probe rings>
And then on a first->
After one laser probe is randomly selected from the laser probe rings as a selected probe, the laser probes are sequentially selected in the clockwise or anticlockwise directionBased on the newly determined fifth or fifth position of the selected probe>
The laser probe is used as the next selected probe until the total number of the selected probes and the 1 st to the 1 st->
The sum of the total number of all laser probes of a laser probe ring equals ≥>
And activating all selected probes, wherein>
For activating the interval for the laser probe, is activated>
Is the first->
The number of laser probes of each laser probe ring,
is a rounding function.
Therefore, the laser beam emitted by the laser puncher can be ensured to be circular to the maximum extent, so that the punching aperture precision is ensured.
According to the above, the electroencephalogram chip punching device obtains the aperture and the position of each to-be-punched hole of the electroencephalogram chip; determining the punching energy of each hole to be punched according to the hole diameter of each hole to be punched; determining the energy coefficient of each hole to be punched according to the hole diameter of each hole to be punched; based on a preset laser drilling function, calculating the drilling time of each hole to be drilled according to the energy coefficient and the drilling energy of each hole to be drilled; controlling a laser puncher to sequentially punch holes at positions to be punched along a punching path by using laser with corresponding energy intensity and corresponding punching time according to the energy coefficients to be punched; thereby improving the punching efficiency and reducing the punching position deviation. Specifically, the method has the following advantages:
1. by adopting a pre-decision strategy before punching, the contradiction between the whole punching efficiency and the whole punching error is effectively considered in the process of punching the surface of the chip;
2. establishing a laser drilling function, wherein the core of the function is that dynamic adjustment of laser energy and drilling time is realized in the drilling process by setting different coefficients, and self-adaptive drilling to be drilled with different apertures is realized; the punching method has the corresponding beneficial effects that when the large aperture is punched, a large-energy and short-time punching method is adopted, so that the problem of low overall efficiency caused by long time consumption in the process of punching the large aperture to be punched is avoided; when the small-aperture to-be-punched hole is punched, a 'small-energy and long-time' punching method is adopted, so that the problem of large aperture error in the punching process of the small-aperture to-be-punched hole is avoided;
3. the self-adaptive punching method for punching holes with different apertures on the surface of the brain electrode chip is realized by combining the idea of 'decision making in advance', the whole punching time can be effectively shortened, the problem of large aperture error in the punching process is solved, the punching efficiency of a single batch of chips is improved, and the method has high practical application value.
Referring to fig. 3, fig. 3 is a schematic structural diagram of an electronic device according to an embodiment of the present disclosure, where the electronic device includes: the processor 301 and the memory 302, the processor 301 and the memory 302 are interconnected and communicate with each other through the communication bus 303 and/or other types of connection mechanisms (not shown), the memory 302 stores a computer program executable by the processor 301, and when the electronic device runs, the processor 301 executes the computer program to execute the brain electrode chip punching method in any optional implementation manner of the above embodiments to realize the following functions: acquiring the aperture and position of each to-be-punched hole of the brain electrode chip; determining the punching energy of each hole to be punched according to the hole diameter of each hole to be punched; determining the energy coefficient of each hole to be punched according to the hole diameter of each hole to be punched; based on a preset laser drilling function, calculating the drilling time of each hole to be drilled according to the energy coefficient and the drilling energy of each hole to be drilled; and controlling the laser puncher to sequentially punch holes at the positions to be punched along a punching path by using the laser with corresponding energy intensity and corresponding punching time according to the energy coefficients to be punched.
Referring to fig. 4 and 5, the present application provides a laser punching apparatus for punching a brain electrode chip 90, which includes a positioning table 100, a laser puncher 200 disposed above the positioning table 100, and a control device 300, wherein a laser probe array composed of a plurality of laser probes 201 is disposed at a lower end of the laser puncher 200, the laser probes 201 are used for emitting laser, and the laser energy intensity of the laser puncher 200 can be adjusted by adjusting the number of the started laser probes 201;
the positioning table 100 is used for placing brain electrode chips 90 to be punched;
the control device 300 is configured to obtain each aperture and position of the brain electrode chip 90 to be punched, determine punching energy for each aperture to be punched according to each aperture to be punched, determine an energy coefficient for each aperture to be punched according to each aperture to be punched, calculate punching time for each aperture to be punched according to each energy coefficient to be punched and punching energy based on a preset laser punching function, and control the laser puncher 200 to sequentially punch holes at each position to be punched with laser with a corresponding energy intensity and corresponding punching time according to each energy coefficient to be punched (refer to the step of the brain electrode chip punching method in the foregoing specific process).
Preferably, the plurality of laser probes 201 are arranged in a multi-layer circular ring shape (as shown in fig. 5), so that the laser beam after adjusting the energy intensity is in a circular shape, thereby ensuring the precision of the hole diameter of the punched hole.
In practice, the laser drilling apparatus further includes a dual-axis driving device 400, and the dual-axis driving device 400 is used for driving the laser punch 200 to move along a horizontal plane. The dual-axis driving device 400 and the laser puncher 200 are both electrically connected to the control device 300.
In the embodiments provided in the present application, it should be understood that the disclosed apparatus and method may be implemented in other ways. The above-described embodiments of the apparatus are merely illustrative, and for example, the division of the units is only one logical division, and there may be other divisions when actually implemented, and for example, a plurality of units or components may be combined or integrated into another system, or some features may be omitted, or not executed. In addition, the shown or discussed mutual coupling or direct coupling or communication connection may be an indirect coupling or communication connection of devices or units through some communication interfaces, and may be in an electrical, mechanical or other form.
In addition, units described as separate parts may or may not be physically separate, and parts displayed as units may or may not be physical units, may be located in one place, or may be distributed on a plurality of network units. Some or all of the units can be selected according to actual needs to achieve the purpose of the solution of the embodiment.
Furthermore, the functional modules in the embodiments of the present application may be integrated together to form an independent part, or each module may exist separately, or two or more modules may be integrated to form an independent part.
In this document, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions.
The above description is only an example of the present application and is not intended to limit the scope of the present application, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, improvement and the like made within the spirit and principle of the present application shall be included in the protection scope of the present application.
Claims (10)
1. A punching method of a brain electrode chip is applied to laser punching equipment, the laser punching equipment comprises a laser puncher and is characterized in that a laser probe array consisting of a plurality of laser probes is arranged at the lower end of the laser puncher, the laser probes are used for emitting laser, and the laser energy intensity of the laser puncher can be adjusted by adjusting the number of the started laser probes;
the brain electrode chip punching method comprises the following steps:
a1, acquiring the aperture and position of each to-be-punched hole of a brain electrode chip;
step A2, determining the punching energy of each hole to be punched according to the hole diameter of each hole to be punched;
step A3, determining the energy coefficient of each hole to be punched according to the hole diameter of each hole to be punched;
step A4, based on a preset laser drilling function, calculating the drilling time of each hole to be drilled according to the energy coefficient and the drilling energy of each hole to be drilled;
and step A5, controlling the laser puncher to punch holes at the positions to be punched in sequence along a punching path by using the laser with the corresponding energy intensity and the corresponding punching time according to the energy coefficients to be punched.
2. The brain electrode chip punching method according to claim 1, wherein the step A2 includes:
and calculating the punching energy to be punched according to the aperture to be punched by adopting a preset punching energy calculation formula.
3. The brain electrode chip punching method according to claim 1, wherein the step A3 includes:
step A301, calculating an aperture threshold value according to the aperture to be punched;
step A302, comparing the aperture to be punched with the aperture threshold value to determine the energy coefficient to be punched.
4. The brain electrode chip punching method according to claim 3, wherein the step A301 includes:
acquiring a maximum aperture value and a minimum aperture value of the aperture;
calculating an average of the maximum aperture value and the minimum aperture value as the aperture threshold.
5. The brain electrode chip punching method according to claim 3, wherein the step A302 includes:
if the aperture to be punched is larger than the aperture threshold, setting the energy coefficient to be punched to be K times of a preset basic energy coefficient, wherein K is a preset positive integer value larger than 1;
and if the aperture to be punched is not larger than the aperture threshold value, setting the energy coefficient to be punched as a preset basic energy coefficient.
6. The brain electrode chip punching method according to claim 1, wherein the laser punching function is:
wherein ,
for punching energy, is selected>
Is an energy factor>
For the laser energy intensity of a single laser probe, <' > or>
For the punching time>
Is a time coefficient->
Is a compensation constant;
the step A4 comprises the following steps:
calculating the punching time to be punched according to the following formula:
wherein ,
is a first->
The punch time to be punched is selected>
Is the first->
The punch energy to be punched is/are>
Is the first->
Said energy coefficient to be punched>
The number of holes to be punched.
7. The brain electrode chip punching method according to claim 1, wherein the step A5 includes:
step A501, determining the number of the laser probes to be started when the holes to be punched are punched according to the energy coefficient of each hole to be punched, and recording the number as a first number;
step A502, planning a punching path which is sequentially connected with the positions to be punched according to the positions to be punched;
step A503, controlling the laser puncher to sequentially move to the positions to be punched along the punching path, and starting the corresponding first number of laser probes at the positions to be punched to continuously irradiate the corresponding punching time for the brain electrode chips.
8. A brain electrode chip perforating device is applied to laser perforating equipment, wherein the laser perforating equipment comprises a laser puncher and is characterized in that a laser probe array consisting of a plurality of laser probes is arranged at the lower end of the laser puncher, the laser probes are used for emitting laser, and the laser energy intensity of the laser puncher can be adjusted by adjusting the number of the started laser probes;
the brain electrode chip perforating device comprises:
the first acquisition module is used for acquiring the aperture and the position of each hole to be punched of the brain electrode chip;
the punching energy determining module is used for determining the punching energy of each hole to be punched according to the aperture of each hole to be punched;
an energy coefficient determining module, configured to determine an energy coefficient of each hole to be punched according to the hole diameter of each hole to be punched;
the punching time calculation module is used for calculating the punching time to be punched according to the energy coefficient to be punched and the punching energy based on a preset laser punching function;
and the punching control module is used for controlling the laser puncher to sequentially punch at the positions to be punched along a punching path by using the laser with the corresponding energy intensity and the corresponding punching time according to the energy coefficients to be punched.
9. An electronic device comprising a processor and a memory, the memory storing a computer program executable by the processor, the processor executing the computer program to perform the steps of the brain electrode chip puncturing method according to any one of claims 1 to 7.
10. A laser punching device is used for punching brain electrode chips and is characterized by comprising a positioning table, a laser puncher and a control device, wherein the laser puncher is arranged above the positioning table;
the positioning table is used for placing brain electrode chips to be punched;
the control device is used for obtaining the aperture and the position of each to-be-punched hole of the brain electrode chip, determining the punching energy of each to-be-punched hole according to each to-be-punched hole, determining the energy coefficient of each to-be-punched hole according to each to-be-punched hole, calculating the punching time of each to-be-punched hole according to each to-be-punched energy coefficient and punching energy based on a preset laser punching function, and controlling the laser puncher to sequentially punch holes at each to-be-punched position along a punching path by using laser with corresponding energy intensity and corresponding punching time according to each to-be-punched energy coefficient.
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| CN105499811A (en) * | 2015-12-31 | 2016-04-20 | 中国航空工业集团公司北京航空制造工程研究所 | Ring composite pulse laser drilling method and device |
| US20220402072A1 (en) * | 2021-06-16 | 2022-12-22 | Panasonic Intellectual Property Management Co., Ltd. | Element chip manufacturing method and substrate processing method |
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