CN115845516A - Heat dissipation filtering device and method - Google Patents
Heat dissipation filtering device and method Download PDFInfo
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- CN115845516A CN115845516A CN202211652060.2A CN202211652060A CN115845516A CN 115845516 A CN115845516 A CN 115845516A CN 202211652060 A CN202211652060 A CN 202211652060A CN 115845516 A CN115845516 A CN 115845516A
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- 230000017525 heat dissipation Effects 0.000 title claims abstract description 85
- 238000000034 method Methods 0.000 title claims abstract description 42
- 238000001914 filtration Methods 0.000 title claims abstract description 23
- 239000002245 particle Substances 0.000 claims abstract description 122
- 238000001816 cooling Methods 0.000 claims abstract description 13
- 239000004065 semiconductor Substances 0.000 claims description 13
- 238000005057 refrigeration Methods 0.000 claims description 5
- 230000005855 radiation Effects 0.000 claims description 4
- 230000009471 action Effects 0.000 claims description 3
- 230000004044 response Effects 0.000 claims description 2
- 238000005229 chemical vapour deposition Methods 0.000 abstract description 29
- 230000008569 process Effects 0.000 abstract description 21
- 239000012535 impurity Substances 0.000 abstract description 16
- 239000000463 material Substances 0.000 abstract description 13
- 238000012423 maintenance Methods 0.000 abstract description 9
- 238000000926 separation method Methods 0.000 abstract description 5
- 230000002349 favourable effect Effects 0.000 abstract description 3
- 239000008187 granular material Substances 0.000 abstract 3
- 238000009434 installation Methods 0.000 abstract 1
- 238000006243 chemical reaction Methods 0.000 description 21
- 239000010409 thin film Substances 0.000 description 14
- 238000007789 sealing Methods 0.000 description 9
- 238000010586 diagram Methods 0.000 description 6
- 238000007086 side reaction Methods 0.000 description 5
- 239000010408 film Substances 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- 238000005979 thermal decomposition reaction Methods 0.000 description 4
- 230000009467 reduction Effects 0.000 description 3
- 238000000151 deposition Methods 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 230000002411 adverse Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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Abstract
The application provides a heat dissipation filter device and a method, wherein the heat dissipation filter device achieves heat dissipation of a filter through a heat dissipation sheet arranged on the outer wall of the filter after gas containing particle impurities is obtained through an air inlet arranged on the filter, so that heat dissipation of the filter is achieved in the process of filtering the impurity particles in the gas; when radiating to the filter, based on the particle separator of filter intracavity installation, realize the separation to gas particle to collect the granule through the granule collection mouth, discharge the normal atmospheric temperature gas that does not contain the granule through the gas outlet and collect and the processing procedure in order to accomplish subsequent tail gas. The device realizes the separation of gas and impurity particles and the cooling of high-temperature tail gas, and is favorable for reducing the maintenance frequency of a tail gas pipeline in the process of growing a film material by using a Chemical Vapor Deposition (CVD) mode.
Description
Technical Field
The application relates to the field of chemical vapor deposition, in particular to a heat dissipation filtering device and a heat dissipation filtering method.
Background
In the process of growing a thin film material by Chemical Vapor Deposition (CVD), it is usually necessary to heat a gas to a high temperature under a high temperature and vacuum environment to cause a thermal decomposition reaction of the gas, so that the thermally decomposed molecules or atoms undergo a deposition reaction on the surface of a substrate to form a thin film for protecting the substrate.
However, in the practical application process, a part of gas does not participate in the thermal decomposition reaction, and the gas which does not participate in the thermal reaction usually undergoes side reactions and generates particle impurities, and the particle impurities can cause the clamping stagnation and the blockage of various valves on the tail gas pipeline, so that the valves cannot be closed at the specified positions; in addition, because the tail gas temperature is very high, can destroy the sealing washer of tail gas hookup location, cause sealed inefficacy, can influence the vacuum state in the reaction chamber of being connected with it, appear pressure fluctuation. In the case of such a serious condition, the quality of the film formed in the reaction chamber may be adversely affected. Therefore, the exhaust gas line is often maintenance-intensive, time-consuming and costly.
Therefore, how to collect the side reaction particle impurities and cool the tail gas in the process of growing the thin film material by using a Chemical Vapor Deposition (CVD) method, the influence of the particle impurities and the high-temperature tail gas on devices and sealing structures on the tail gas pipeline is reduced, and the reduction of the maintenance frequency of the tail gas pipeline becomes a technical problem which needs to be solved by the technical personnel in the field.
Disclosure of Invention
The embodiment of the application provides a heat dissipation filtering device and a method, so that in the process of growing a thin film material by using a Chemical Vapor Deposition (CVD) mode, by-reaction particle impurities are collected, the influence of the particle impurities on devices on a tail gas pipeline and high-temperature tail gas on a sealing structure is reduced, and the reduction of the maintenance frequency of the tail gas pipeline becomes a technical problem to be solved urgently by technical personnel in the field.
According to a first aspect of embodiments of the present application, there is provided a heat dissipation filter device, including: a filter, a heat sink;
the filter comprises a particle separator arranged in a filter cavity of the filter, and an air inlet, an air outlet and a particle collecting port which are communicated with each other through the filter cavity;
the cooling fin is arranged on the outer wall of the filter and used for cooling the filter when the filter filters particles in the gas;
after gas containing particles enters the filter cavity through the gas inlet, separating the particles in the gas from the gas through a particle separator; the particles are discharged out of the filter through the particle port, and the gas from which the particles are removed flows out of the filter through the gas outlet.
In an optional embodiment of the present application, the method further comprises: a particle collector coupled to the particle collection port.
In an alternative embodiment of the present application, the particulate collection port is disposed in the bottom of the filter.
In an alternative embodiment of the present application, the inner sidewall of the particle separator is provided with a flow guide plate facing the particle collection opening;
the particles in the gas are close to the inner side wall of the particle separator under the action of centrifugal force generated by the particle separator, and enter the particle collecting port along the drainage plate.
In an alternative embodiment of the present application, the particle collection port is fitted with a gas guiding cone having an apex pointing towards the filter chamber.
In an alternative embodiment of the present application, the heat sink includes: radiating fins, or semiconductor cooling fins.
In an alternative embodiment of the present application, the heat sink includes: radiating fins and semiconductor refrigerating fins;
the cold surface of the semiconductor refrigeration piece is connected with the outer side wall of the filter, and the hot surface of the semiconductor refrigeration piece is connected with the radiating fin.
In an optional embodiment of the present application, further comprising: a particle collector;
the particle collector is connected to the particle collection port.
In an optional embodiment of the present application, further comprising: a housing provided with a heat dissipating assembly; the filter and the heat sink are mounted inside the housing.
In an alternative embodiment of the present application, the housing is provided with a heat dissipation air outlet and a heat dissipation air inlet; the heat dissipation assembly includes: and the heat radiation fan is arranged at the heat radiation air outlet.
According to a second aspect of the embodiments of the present application, there is provided a heat dissipation filtering method, including: and responding to the request information for the heat dissipation filtering function, and starting any one of the heat dissipation filtering devices.
Compared with the prior art, the method has the following advantages:
the application provides a heat dissipation filter device and a method, wherein the heat dissipation filter device comprises: a filter, a heat sink; the filter comprises a particle separator arranged in a filter cavity of the filter, and an air inlet, an air outlet and a particle collecting port which are communicated with each other through the filter cavity; the cooling fin is arranged on the outer wall of the filter and used for cooling the filter when the filter filters particles in the gas; after gas containing particles enters the filter cavity through the gas inlet, separating the particles in the gas through a particle separator; the particles are discharged out of the filter through the particle port, and the gas from which the particles are removed flows out of the filter through the gas outlet.
After the heat dissipation filtering device obtains gas containing particles through the gas inlet arranged on the filter, the heat dissipation of the filter is completed through the heat dissipation fins arranged on the outer wall of the filter, so that the heat dissipation of the filter is completed in the process of filtering the gas particles; when the filter is cooled, the gas particles are separated based on the particle separator arranged in the filter cavity of the filter, the particles are discharged through the particle collecting port, and the gas without the particles is discharged through the gas outlet to complete the subsequent reaction. The device realizes the separation of gas and particles and the cooling of high-temperature tail gas, and is favorable for reducing the maintenance frequency of a tail gas pipeline in the process of growing a thin film material by using a Chemical Vapor Deposition (CVD) mode.
Drawings
In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly introduced below, it is obvious that the drawings in the following description are only embodiments of the present application, and for those skilled in the art, other drawings can be obtained according to the provided drawings without creative efforts.
Fig. 1 is a schematic structural diagram of a heat dissipation filter device according to an embodiment of the present disclosure;
fig. 2 is another schematic structural diagram of a heat dissipation filter device according to another embodiment of the present disclosure;
fig. 3 is a schematic diagram illustrating a disassembled structure of a heat dissipation filter device according to another embodiment of the present disclosure;
fig. 4 is a schematic view of an application scenario of a heat dissipation filter device according to another embodiment of the present application.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments obtained by a person of ordinary skill in the art based on the embodiments in the present application without making any creative effort belong to the protection scope of the present application.
In the process of growing a thin film material by Chemical Vapor Deposition (CVD), it is usually necessary to heat a gas to a high temperature under a high temperature and vacuum environment to cause a thermal decomposition reaction of the gas, so that the thermally decomposed molecules or atoms undergo a deposition reaction on the surface of a substrate to form a thin film for protecting the substrate.
However, in the practical application process, a part of gas does not participate in the thermal decomposition reaction, and the gas which does not participate in the thermal reaction usually undergoes side reactions and generates particle impurities, and the particle impurities can cause clamping stagnation and blockage of various valves on the tail gas pipeline, so that the valves cannot be closed at specified positions, and therefore, the tail gas pipeline needs frequent maintenance, and is time-consuming and high in cost; in addition, because the temperature of the exhaust gas is very high, the sealing ring at the connecting position of the exhaust gas can be damaged, the sealing effect can be caused, the vacuum state of the reaction chamber connected with the exhaust gas can be influenced, pressure fluctuation can occur, and the quality of a film generated in the reaction chamber can be even influenced when the conditions are serious.
Therefore, how to collect the side reaction particle impurities and cool the tail gas in the process of growing the thin film material by using a Chemical Vapor Deposition (CVD) method, the influence of the particle impurities and the high-temperature tail gas on devices and sealing structures on the tail gas pipeline is reduced, and the reduction of the maintenance frequency of the tail gas pipeline becomes a technical problem which needs to be solved by the technical personnel in the field.
The present application provides a heat dissipation filter device and method, which are used to collect side reaction particle impurities during the process of growing a thin film material by Chemical Vapor Deposition (CVD), reduce the influence of the particle impurities on devices on a tail gas pipeline and high temperature tail gas on a sealing structure, and reduce the maintenance frequency of the tail gas pipeline, and will be described in detail one by one in the following embodiments.
Exemplary devices
The embodiment of the application firstly provides a heat dissipation filtering device.
Referring to fig. 1, fig. 1 is a schematic structural diagram of a heat dissipation filter device according to an embodiment of the present disclosure.
As shown in fig. 1, the heat dissipation filter device includes: filter 101, and heat sink 102.
The filter 101 comprises a particle separator (not shown in fig. 1) arranged in a filter chamber of the filter 101, and an inlet 103, an outlet 104 and a particle collection opening 105 through the filter chamber.
The heat radiating fins 102 are installed on an outer wall of the filter 101 to radiate heat to the filter 101 when the filter 101 filters particles in the gas.
After gas containing particles enters a filter cavity through a gas inlet 103, separating the particles in the gas through a particle separator; the particles exit the filter 101 through the particle collection port 105; the particulate-cleaned gas then exits the filter through outlet 104.
In an alternative embodiment of the present application, the inner side wall of the particle separator is further provided with a flow guiding plate facing the particle collection opening 105. After the gas containing particles enters the particle separator of the filter 101, the particle separator generates centrifugal force by high-speed rotation, so that the particles in the gas are close to the inner side wall of the particle separator under the action of the centrifugal force, the gas is further separated from the particles, and the particles finally gradually reach the particle collecting port 105 along the flow guide plate.
Therefore, in the process of generating the film by using a Chemical Vapor Deposition (CVD) generation mode, the device realizes the separation of gas and particle impurities through the particle separator, and simultaneously, the particle collector collects particles, so that the blockage of a pipeline is avoided, and the maintenance cost of a tail gas pipeline is reduced.
In an optional embodiment of the present application, the heat dissipation filter device further comprises: a particle collector.
Referring to fig. 2, fig. 2 is another schematic structural diagram of a heat dissipation filter device according to another embodiment of the present disclosure.
Like the heat dissipation filter device shown in fig. 1, the heat dissipation filter device shown in fig. 2 includes: filter, fins 102, inlet 103, outlet 104, and particulate collection 105.
Unlike the heat dissipation filter device shown in fig. 1, the heat dissipation filter device in fig. 2 further includes: a particle collector 201; a particle collector 201 is connected to the particle collection port 105 for collecting particles in the gas flowing from the particle collection port 105.
In another alternative embodiment of the present application, in order to enable the gas filtered by the filter 101 to be smoothly discharged through the gas outlet 104, the heat dissipation filter device further includes: the gas guide cone is arranged at the particle collecting port and the vertex points face the filter cavity.
Referring to fig. 3, fig. 3 is a schematic diagram illustrating a disassembled structure of a heat dissipation filter device according to another embodiment of the present disclosure.
As shown in fig. 3, the heat dissipation filter device includes: filter 101, fins 102, gas inlet 103, gas outlet 104, particle collection port 105, particle collector 201, and gas guide cone 301.
In the practical application process, when the gas to be cleaned of particles flows to the particle collecting port, the gas to be cleaned of particles flows along the outer wall of the gas guide cone 301 toward the gas outlet 104 under the structural influence of the gas guide cone 301, and finally flows out through the gas outlet 104.
Further, in an alternative embodiment of the present application, the heat sink 102 may be a heat dissipating fin 302 to increase a contact area between an outer wall of the filter 101 and the outside, or may be a semiconductor cooling plate 303 as shown in fig. 3, or the heat sink 102 may include a heat dissipating fin 302 and a semiconductor cooling plate 303.
Under the condition that the radiating fins 102 comprise radiating fins and semiconductor refrigerating pieces 303, the cold surfaces of the semiconductor refrigerating pieces 303 are connected with the outer side walls of the filters 101 so as to cool the filters 101, and the hot surfaces and the heat dissipation are carried out; the hot face of semiconductor refrigeration piece 303 with radiating fin links to each other to accomplish the heat dissipation more fast, be favorable to the cooling to high-temperature gas in the filter 101, avoid destroying the sealing washer of tail gas hookup location, improved the stability of utilizing Chemical Vapor Deposition (CVD) mode to generate film material in-process pressure.
In an application scenario of the present application, the gas inlet 103 is generally connected to a reaction chamber during a process of using the heat dissipation filter device to participate in a Chemical Vapor Deposition (CVD) process for forming a thin film material, please refer to fig. 4, and fig. 4 is a schematic application scenario of a heat dissipation filter device according to another embodiment of the present application.
As shown in fig. 4, fig. 4 includes a heat dissipation filter 401 and a reaction chamber 402;
the heat dissipation filter 401 is substantially the same as the heat dissipation filter mentioned in fig. 1, fig. 2, and fig. 3, and is not described herein again.
The heat dissipating filter device 401 includes: an air inlet 103, an air outlet 104; the reaction chamber 402 includes: a reaction chamber body 403 and a gas outlet 404; wherein the air outlet 404 is connected with the air inlet 103.
In the practical application process, after the reaction chamber 402 generates the high-temperature gas, the high-temperature gas flows out of the reaction chamber through the gas outlet 404, enters the heat dissipation filter device 401 through the gas inlet 103, and is subjected to particle filtration by the heat dissipation filter device 401, and the gas after particle filtration finally flows out through the gas outlet 404.
Further, in order to improve the overall heat dissipation efficiency of the heat dissipation filter 401, the heat dissipation filter 401 and the reaction chamber 402 are installed inside a housing 405 having a heat dissipation assembly, which includes a heat dissipation air inlet 406 and a heat dissipation air outlet 407; the heat dissipation air outlet 407 is disposed near the heat dissipation filter device 401.
In practical applications, air outside the housing enters the housing through the heat dissipation air inlet to cool the reaction chamber 401 and the heat dissipation filter device 402.
In an optional embodiment of the present application, the heat dissipation air outlet 407 is further provided with a heat dissipation fan, after the heat dissipation function is turned on, the heat dissipation fan exhausts the air inside the housing towards the heat dissipation air outlet, so as to increase the pressure difference between the inside of the housing and the outside air at the side of the heat dissipation air inlet 406, so that the outside air enters the inside of the housing through the heat dissipation air inlet, thereby cooling the heat dissipation filter device 401 and the reaction chamber 402. The cooling efficiency of high-temperature gas in the reaction chamber and the heat dissipation filter device is further improved, the sealing ring at the tail gas connecting position is effectively prevented from being damaged, and the pressure stability in the process of generating the thin film material by using a Chemical Vapor Deposition (CVD) mode is improved.
In summary, after the heat dissipation filter device obtains the gas containing particles through the air inlet arranged on the filter, the heat dissipation of the filter is completed through the heat dissipation fins arranged on the outer wall of the filter, so that the heat dissipation of the filter is completed in the process of filtering the gas particles; when the filter is cooled, the gas particles are separated based on the particle separator arranged in the filter cavity of the filter, the particles are discharged through the particle collecting port, and the gas without the particles is discharged through the gas outlet to complete the subsequent reaction. The device realizes the separation of gas and particles, and is beneficial to reducing the maintenance frequency of tail gas management in the process of growing a thin film material by using a Chemical Vapor Deposition (CVD) mode.
Illustrative methodMethod of making
The embodiment of the present application also provides a heat dissipation filtering method, which is applied to the heat dissipation filtering device, and is used for dissipating heat from the heat dissipation filtering device while discharging particles in high-temperature gas in the process of growing a thin film material by using a Chemical Vapor Deposition (CVD) method, so as to improve the quality of the generated thin film.
Specifically, the heat dissipation filtering method includes: in response to obtaining the request information for the heat dissipation filter function, any one of the heat dissipation filter devices mentioned in the above exemplary devices is turned on.
Since the working principle of the heat dissipation filtering method is basically the same as that of the heat dissipation filtering device, reference may be made to the above description of the heat dissipation filtering device for relevant points, and details are not repeated here.
In the description of the present application, it is to be understood that the terminology used herein is for the purpose of description only and is not intended to be interpreted as indicating or implying relative importance or to imply that the number of technical features indicated is significant. In the description of the present invention, "a plurality" means two or more unless specifically defined otherwise.
In this application, unless expressly stated or limited otherwise, the terms "connected," "secured," and the like are to be construed broadly and encompass, for example, both fixedly connected and detachably connected, or integrally formed; may be an electrical connection; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
In the description of the present invention, numerous specific details are set forth. It is understood, however, that embodiments of the invention may be practiced without these specific details. In some instances, well-known methods, systems, and techniques have not been shown in detail in order not to obscure an understanding of this description.
Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; while the invention has been described in detail and with reference to the foregoing embodiments, it will be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; such modifications and substitutions do not depart from the spirit and scope of the present invention, and they should be construed as being included in the following claims and description.
Claims (11)
1. A heat dissipating filter device, comprising: a filter, a heat sink;
the filter comprises a particle separator arranged in a filter cavity of the filter, and an air inlet, an air outlet and a particle collecting port which are communicated with each other through the filter cavity;
the radiating fin is arranged on the outer wall of the filter and used for radiating heat to the filter when the filter filters foreign particles in gas;
after gas containing particles enters the filter cavity through the gas inlet, separating the particles in the gas from the gas through a particle separator; the particles are discharged from the filter through the particle port, and the gas from which the particles are removed flows out of the filter through the gas outlet.
2. The apparatus of claim 1, further comprising: a particle collector coupled to the particle collection port.
3. The device of claim 1 or 2, wherein the particle collection port is disposed at the bottom of the filter.
4. The device of claim 1, wherein the inner side wall of the particle separator is provided with a flow guide plate facing the particle collection port;
and the particles in the gas are close to the inner side wall of the particle separator under the action of centrifugal force generated by the particle separator, and enter the particle collecting port along the flow guide plate.
5. The apparatus of claim 4, wherein the particle collection port is fitted with a gas guiding cone having an apex pointing towards the filter chamber.
6. The apparatus of claim 1, wherein the heat sink comprises: radiating fins, or semiconductor cooling fins.
7. The apparatus of claim 1, wherein the heat sink comprises: radiating fins and semiconductor refrigerating sheets;
the cold surface of the semiconductor refrigeration piece is connected with the outer side wall of the filter, and the hot surface of the semiconductor refrigeration piece is connected with the radiating fin.
8. The apparatus of claim 1, further comprising: a particle collector;
the particle collector is connected to the particle collection port.
9. The apparatus of claim 1, further comprising: a housing provided with a heat dissipating assembly; the filter and the heat sink are mounted inside the housing.
10. The apparatus of claim 9, wherein the housing is provided with a heat sink air outlet and a heat sink air inlet; the heat dissipation assembly includes: and the heat radiation fan is arranged at the heat radiation air outlet.
11. A method of filtering heat dissipation, comprising:
the heat dissipation filter device according to any one of claims 1 to 10 is turned on in response to obtaining request information for a heat dissipation filter function.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211652060.2A CN115845516A (en) | 2022-12-21 | 2022-12-21 | Heat dissipation filtering device and method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211652060.2A CN115845516A (en) | 2022-12-21 | 2022-12-21 | Heat dissipation filtering device and method |
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| CN115845516A true CN115845516A (en) | 2023-03-28 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202211652060.2A Pending CN115845516A (en) | 2022-12-21 | 2022-12-21 | Heat dissipation filtering device and method |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN206473962U (en) * | 2016-12-12 | 2017-09-08 | 北京蓝星清洗有限公司 | A kind of oil burning boiler tail gas cooling, purifying system |
| CN207886977U (en) * | 2017-12-26 | 2018-09-21 | 临安派祺空气净化科技有限公司 | It is a kind of can catalyzed gas cyclone type gas-water separator |
| CN209451551U (en) * | 2018-11-19 | 2019-10-01 | 云南三环中化化肥有限公司 | Vent gas washing system |
| CN209530415U (en) * | 2018-11-06 | 2019-10-25 | 河北冀盛铝粉有限公司 | A kind of denitrogen collector of ball-milling method production aluminium powder |
| CN210278645U (en) * | 2019-05-16 | 2020-04-10 | 勤丰众成生物质新材料(南京)有限公司 | Tail dust removing equipment for producing biomass charcoal base fertilizer |
| CN212417271U (en) * | 2020-05-12 | 2021-01-29 | 宁波锦心节能环保科技有限公司 | Cyclone dust removal and temperature reduction device |
| CN214850941U (en) * | 2021-05-17 | 2021-11-23 | 陕西新银海电气有限公司 | High-heat-dissipation high-performance vector frequency converter |
-
2022
- 2022-12-21 CN CN202211652060.2A patent/CN115845516A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN206473962U (en) * | 2016-12-12 | 2017-09-08 | 北京蓝星清洗有限公司 | A kind of oil burning boiler tail gas cooling, purifying system |
| CN207886977U (en) * | 2017-12-26 | 2018-09-21 | 临安派祺空气净化科技有限公司 | It is a kind of can catalyzed gas cyclone type gas-water separator |
| CN209530415U (en) * | 2018-11-06 | 2019-10-25 | 河北冀盛铝粉有限公司 | A kind of denitrogen collector of ball-milling method production aluminium powder |
| CN209451551U (en) * | 2018-11-19 | 2019-10-01 | 云南三环中化化肥有限公司 | Vent gas washing system |
| CN210278645U (en) * | 2019-05-16 | 2020-04-10 | 勤丰众成生物质新材料(南京)有限公司 | Tail dust removing equipment for producing biomass charcoal base fertilizer |
| CN212417271U (en) * | 2020-05-12 | 2021-01-29 | 宁波锦心节能环保科技有限公司 | Cyclone dust removal and temperature reduction device |
| CN214850941U (en) * | 2021-05-17 | 2021-11-23 | 陕西新银海电气有限公司 | High-heat-dissipation high-performance vector frequency converter |
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Address after: 518107 1b, building A6, Guangming Science Park, China Merchants Group, sightseeing Road, Fenghuang community, Fenghuang street, Guangming District, Shenzhen City, Guangdong Province Applicant after: Shenzhen Nashe Intelligent Equipment Co.,Ltd. Address before: 3/F, Building A3, China Merchants Guangming Science Park, No. 3009, Sightseeing Road, Guangming District, Shenzhen, Guangdong 518107 Applicant before: Shenzhen Nashi Intelligent Equipment Co.,Ltd. |