CN115843156A

CN115843156A - PCB circuit repairing method and device

Info

Publication number: CN115843156A
Application number: CN202211475695.XA
Authority: CN
Inventors: 刘文波; 康雄雄; 李小海
Original assignee: Huizhou Zhongjing Electronic Technology Co ltd
Current assignee: Huizhou Zhongjing Electronic Technology Co ltd
Priority date: 2022-11-23
Filing date: 2022-11-23
Publication date: 2023-03-24

Abstract

The application relates to a PCB circuit repairing method, which comprises the following steps: acquiring a PCB (printed Circuit Board), and acquiring an image of the PCB by using an image acquisition module; judging whether the PCB has defects according to the acquired PCB image, and locking the position interval of the defects; when the defect size is larger than a first threshold value, fixing the line width by adopting UV glue operation and repairing the defect by using a tin furnace tin immersion machine; and when the defect size is smaller than a second threshold value, adopting copper wire spot welding with the same line width to repair the defect. The above-mentioned scheme that this application provided when finding the circuit board goes wrong, can in time restore it, has reduced bad loss to the customer end, has stopped the customer and has complained and outside failure cost, has promoted the production quality, has reduced and has scrapped the cost waste.

Description

PCB circuit repairing method and device

Technical Field

The invention relates to the technical field of Printed Circuit Board (PCB) product processes, in particular to a PCB circuit repairing method and device.

Background

At present, a Printed Circuit Board (PCB), also called a printed circuit board, is an important electronic component, is a support body of an electronic component, and is a carrier for electrical connection of the electronic component. With the rapid development of the industry, the development of refinement becomes more and more important. The requirements of the client on the integrity of the line width of the product are stricter and stricter, and the integration level of electronic components is higher and higher. Accordingly, the requirements of the printed circuit board on the quality of the circuit are correspondingly improved.

Because a large amount of circuit open circuits, gaps, scratches and other defects can be found in the overhauling process of the circuit board, and the prior art lacks a repairing method for the problems of open circuits, gaps, scratches and the like, the circuit board is directly scrapped, and the cost is wasted.

Disclosure of Invention

Therefore, it is necessary to provide a method and an apparatus for repairing a circuit of a PCB, aiming at the problem that when the existing circuit board is repaired and found to be defective, a corresponding repairing method is lacked.

The application provides a PCB circuit repairing method, which comprises the following steps:

acquiring a PCB (printed Circuit Board), and acquiring an image of the PCB by using an image acquisition module;

judging whether the PCB has defects according to the acquired PCB image, and locking the position interval of the defects;

when the defect size is larger than a first threshold value, adopting UV glue operation to fix the line width and utilizing a tin furnace tin immersion machine to repair the defect; and when the defect size is smaller than a second threshold value, adopting copper wire spot welding with the same line width to repair the defect.

In one embodiment, after spot welding with copper wires having equal line widths, the method further comprises:

wiping the PCB for many times along the direction of the circuit where the defect is located;

glue supplementing;

and baking for a preset time by using a UV lamp to ensure the line to be cured.

In one embodiment, after repairing the defect by using a tin furnace tin dipping machine or repairing the defect by using copper wire spot welding with equal line width, the method further comprises the following steps:

and detecting whether the circuit on the PCB is qualified or not, and if not, repairing the PCB by using laser equipment.

In one embodiment, the repairing the PCB with the laser device includes:

calculating the line width of the defect position and the volume of the defect position;

calculating the using amount of the laser cladding powder according to the line width and the volume;

and setting parameters of laser equipment according to the using amount of the laser cladding powder, and finally repairing the PCB through the laser equipment.

In one embodiment, the laser cladding powder is copper powder.

In one embodiment, the determining whether the PCB has the defect and locking the position interval of the defect includes:

carrying out binarization processing on the image of the PCB;

extracting a circuit track and a circuit width on the PCB;

and automatically comparing the circuit track and the circuit width with the circuit in the PCB design drawing, and marking different points as position intervals of the defects.

In one embodiment, the determining whether the PCB has a defect according to the obtained PCB image includes:

acquiring three-dimensional imaging information of a preset circuit board;

acquiring three-dimensional imaging information of the PCB;

and comparing the three-dimensional imaging information of the PCB with the three-dimensional imaging information of a preset circuit board.

In one embodiment, the defect comprises an open circuit or an open circuit.

In one embodiment, the first threshold is 3-3.5 mils and the second threshold is 1.5-2 mils.

The invention also provides a PCB circuit repairing device, which comprises:

the acquisition module is used for acquiring an image of the PCB by using the image acquisition module;

the judging and locking module is used for judging whether the PCB has defects according to the acquired PCB image and locking the position intervals of the defects;

the repairing module is used for fixing the line width by adopting UV glue operation and repairing the defect by utilizing a tin furnace tin immersion machine when the defect size is larger than a first threshold value; and when the defect size is smaller than a second threshold value, adopting copper wire spot welding with the same line width to repair the defect.

The beneficial effects of the invention include:

according to the PCB circuit repairing method provided by the invention, when the circuit board is found to have problems, the circuit board can be repaired in time, so that the bad loss to a client is reduced, the customer complaints and the external failure cost are avoided, the production quality is improved, and the waste of scrapping cost is reduced.

Drawings

Fig. 1 is a schematic flow chart of a method for repairing a circuit of a PCB provided in an embodiment of the present application.

Detailed Description

In order to make the aforementioned objects, features and advantages of the present application more comprehensible, embodiments accompanying the present application are described in detail below with reference to the accompanying drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present application. This application is capable of embodiments in many different forms than those described herein and that modifications may be made by one skilled in the art without departing from the spirit and scope of the application and it is therefore not intended to be limited to the specific embodiments disclosed below.

In the description of the present application, it is to be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," "circumferential," and the like are used in the orientations and positional relationships indicated in the drawings for convenience in describing the present application and for simplicity in description, and are not intended to indicate or imply that the referenced devices or elements must have a particular orientation, be constructed and operated in a particular orientation, and are therefore not to be considered limiting of the present application.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of the feature. In the description of the present application, "plurality" means at least two, e.g., two, three, etc., unless explicitly specified otherwise.

In this application, unless expressly stated or limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can include, for example, fixed connections, removable connections, or integral parts; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as appropriate.

In this application, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may be directly contacting the first and second features or indirectly contacting the first and second features through intervening media. Also, a first feature "on," "over," and "above" a second feature may be directly or diagonally above the second feature, or may simply indicate that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely under the first feature, or may simply mean that the first feature is at a lesser elevation than the second feature.

It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and the like as used herein are for illustrative purposes only and do not denote a unique embodiment.

As shown in fig. 1, in an embodiment of the present application, a method for repairing a circuit of a PCB is provided, which includes the following steps:

step 101: acquiring a PCB (printed Circuit Board), and acquiring an image of the PCB by using an image acquisition module;

step 102: judging whether the PCB has defects according to the acquired PCB image, and locking the position interval of the defects;

step 103: when the defect size is larger than a first threshold value, fixing the line width by adopting UV glue operation and repairing the defect by using a tin furnace tin immersion machine; and when the defect size is smaller than a second threshold value, adopting copper wire spot welding with the same line width to repair the defect.

For step 103, illustratively, when the defect size is larger than 3mil or more, the repairing manner is as follows: fixing the line width of the Open position of the circuit by adopting UV adhesive operation, and enabling the 3M adhesive tape tension test and the tin furnace tin immersion test to repair the position without falling off; when the defect size is less than 2mil or less, the repairing mode is as follows: copper wires with equal line widths are selected for spot welding connection, the copper wires are kept consistent with the original circuit after being repaired, the surface is smooth, and no welding joint exists; and (3) wiping the circuit back and forth for 4-6 times in the direction of the circuit by using an eraser, cleaning dust on the surface of the circuit, flattening the glue filling, baking the glue filling area for 3 x 8mm by using a UV lamp for 6-10S, completely curing the circuit, and keeping synchronous related tests qualified.

By adopting the technical scheme, when the circuit board is found to be out of order, the circuit board can be repaired in time, bad loss to a client is reduced, customer complaints and external failure cost are avoided, production quality is improved, and waste of scrapping cost is reduced.

In some embodiments, the method further comprises, after spot welding with copper wires of equal line width: the first step is as follows: wiping the PCB for many times along the direction of the circuit where the defect is located; the second step: glue supplementing; the third step: and baking for a preset time by using a UV lamp to ensure the line to be cured.

In some embodiments, after repairing the defect using a tin furnace wicking machine or repairing the defect using spot welding of copper wires of equal line width, the method further comprises:

and detecting whether the circuit on the PCB is qualified or not, and if the circuit on the PCB is not qualified, repairing the PCB by using laser equipment.

Further, the repairing the PCB board by using the laser device includes:

In some embodiments, the laser cladding powder herein is copper powder.

In some embodiments, the determining whether the PCB has the defect and locking the location area of the defect includes: carrying out binarization processing on the image of the PCB; extracting a circuit track and a circuit width on the PCB; and automatically comparing the line track and the line width with the lines in the PCB design drawing, and marking different points as position intervals of the defects.

In some embodiments, determining whether the PCB has a defect according to the acquired PCB image includes: acquiring three-dimensional imaging information of a preset circuit board; acquiring three-dimensional imaging information of the PCB; and comparing the three-dimensional imaging information of the PCB with the three-dimensional imaging information of the preset circuit board.

In some embodiments, the defect in the present application comprises an open circuit or an open circuit.

The application also provides a PCB board circuit prosthetic devices, and the device includes:

the judging and locking module is used for judging whether the PCB has defects according to the acquired PCB image and locking the position interval of the defects;

It should be understood that the units or modules recited in the above-described apparatus correspond to the various steps in the method described with reference to fig. 1. Thus, the operations and features described above for the method are equally applicable to the apparatus and the units included therein and will not be described in detail here. The device can be realized in the browser or other security applications of the electronic equipment in advance, and can also be loaded into the browser or other security applications of the electronic equipment in a downloading mode and the like. Corresponding elements in the apparatus may cooperate with elements in the electronic device to implement aspects of embodiments of the present application.

The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.

The above-mentioned embodiments only express several embodiments of the present application, and the description thereof is more specific and detailed, but not construed as limiting the claims. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the concept of the present application, which falls within the scope of protection of the present application. Therefore, the protection scope of the present patent shall be subject to the appended claims.

Claims

1. A PCB circuit repairing method is characterized by comprising the following steps:

when the defect size is larger than a first threshold value, fixing the line width by adopting UV glue operation and repairing the defect by using a tin furnace tin immersion machine; and when the defect size is smaller than a second threshold value, adopting copper wire spot welding with equal line width to repair the defect.

2. The PCB board circuit repairing method according to claim 1, wherein after spot welding with copper wires having equal line width, the method further comprises:

glue supplementing;

and baking for a preset time by using a UV lamp to ensure the line to be cured.

3. The method for repairing a circuit of a PCB of claim 1, wherein after repairing the defect using a tin furnace wicking machine or repairing the defect using spot welding of copper wires having an equal line width, the method further comprises:

4. The PCB circuit repairing method of claim 3, wherein the repairing the PCB by the laser device comprises:

5. The PCB board circuit repairing method of claim 4, wherein the laser cladding powder is copper powder.

6. The PCB board circuit repairing method according to claim 1, wherein the judging whether the PCB board has the defect and locking the position interval of the defect comprises:

carrying out binarization processing on the image of the PCB;

extracting a circuit track and a circuit width on the PCB;

7. The PCB circuit repairing method of claim 1, wherein the judging whether the PCB has the defect according to the obtained PCB image comprises:

acquiring three-dimensional imaging information of a preset circuit board;

acquiring three-dimensional imaging information of the PCB;

8. The PCB board line repair method of claim 1, wherein the defect comprises an open circuit or an open circuit.

9. The PCB board circuit repairing method of claim 1, wherein the first threshold is 3-3.5 mils, and the second threshold is 1.5-2 mils.

10. A PCB board circuit prosthetic devices, its characterized in that, the device includes: