CN115835820A

CN115835820A - Imaging method using image sensor having a plurality of radiation detectors

Info

Publication number: CN115835820A
Application number: CN202180047668.XA
Authority: CN
Inventors: 刘雨润; 曹培炎
Original assignee: Shenzhen Xpectvision Technology Co Ltd
Current assignee: Shenzhen Xpectvision Technology Co Ltd
Priority date: 2021-04-23
Filing date: 2021-04-23
Publication date: 2023-03-21
Also published as: US20240003830A1; EP4326153A1; TWI800319B; TW202242449A; WO2022222122A1

Abstract

Disclosed herein is a method comprising: a scene portion (i), i =1, \ 8230; \8230; partial image of N of a scene is captured with a radiation detector (100) of an image sensor (490). For i =1, \8230;, N, the Qi partial images of the scene portion (i) are captured by Qi radiation detectors (100) of the P radiation detectors (100), respectively, qi being an integer larger than 1. The Qi partial images are Qi partial images of the partial images. The method further comprises the following steps: for i =1, \8230;, N, an enhanced partial image (i) is generated from the Qi partial images of the scene portion (i). Generating the enhanced partial image (i) is based on a position and orientation of the Qi radiation detectors (100) relative to the image sensor and a displacement between Qi imaging positions of the scene relative to the image sensor (490). The scene is at Qi imaging positions when the Qi radiation detectors (100) respectively capture the Qi partial images.

Description

Imaging method using image sensor having a plurality of radiation detectors

[ background of the invention ]

A radiation detector is a device that measures properties of radiation. Examples of properties may include the spatial distribution of the intensity, phase and polarization of the radiation. The radiation may be radiation that has interacted with the object. For example, the radiation measured by the radiation detector may be radiation that has penetrated the object. The radiation may be electromagnetic radiation, such as infrared light, visible light, ultraviolet light, X-rays or gamma rays. The radiation may also be of other types, such as alpha rays and beta rays. The imaging system may include an image sensor having a plurality of radiation detectors.

[ summary of the invention ]

Disclosed herein is a method comprising: capturing M partial images of N scene portions (scene portion (i), i =1, \8230;, N) of a scene with P radiation detectors of an image sensor, wherein M, N and P are positive integers, and wherein, for i =1, \8230;, N, qi partial images of the scene portion (i) are captured by Qi radiation detectors of the P radiation detectors, respectively, qi being an integer greater than 1, and wherein the Qi partial images are Qi partial images of the M partial images; and for i =1, \8230 \ 8230;, N, generating an enhanced partial image (i) from the Qi partial images of the scene portion (i), wherein the generating of the enhanced partial image (i) is based on (a) positions and orientations of the Qi radiation detectors relative to the image sensor, and (B) displacements between Qi imaging positions of the scene relative to the image sensor, wherein the scene is at the Qi imaging positions when the Qi radiation detectors respectively capture the Qi partial images.

In an aspect, at least two of the M partial images are captured simultaneously by the image sensor.

In an aspect, the at least two partial images are captured by at least two of the P radiation detectors.

In one aspect, for i =1, \8230 \ 8230 @, N, qi >2.

In one aspect, N >1.

In one aspect, for i =1, \8230, N, qi = P.

In an aspect, the generating the enhanced partial image (i) comprises applying one or more super resolution algorithms to the Qi partial images.

In an aspect, the applying the one or more super resolution algorithms to the Qi partial images comprises aligning the Qi partial images.

In one aspect, the method further comprises stitching the enhanced partial images (i), i =1, \8230;, N, resulting in a stitched image of the scene.

In an aspect, the stitching is based on a position and orientation of at least one of the P radiation detectors relative to the image sensor.

In an aspect, the method further comprises determining the displacement between the Qi imaging positions using a stepper motor comprising a mechanism for measuring a distance of movement caused by the stepper motor.

In an aspect, the method further comprises determining the displacement between the Qi imaging positions using optical diffraction.

In an aspect, the capturing includes moving the scene in a straight line relative to the image sensor throughout the capturing.

In an aspect, the scene does not reverse direction of movement throughout the capturing.

In one aspect, N >1, j and k are 1, \8230 ≠ 8230 ≠ k, and the Qj radiation detectors are distinct from the Qk radiation detectors.

In one aspect, N >1, j and k belong to 1, \8230 ≠ 8230 ≠ k, N, j ≠ k, and Qj ≠ Qk.

Disclosed herein is a method comprising: capturing M partial images of N scene portions (scene portion (i), i =1, \8230;, N) of a scene with P radiation detectors of an image sensor, wherein M, N and P are positive integers, and wherein, for i =1, \8230;, N, qi partial images of the scene portion (i) are captured by Qi radiation detectors of the P radiation detectors, respectively, qi being an integer greater than 1, and wherein the Qi partial images are Qi partial images of the M partial images; and for i =1, \8230 \ 8230;, N, generating an enhanced partial image (i) from the Qi partial images of the scene portion (i).

In one aspect, the generating an enhanced partial image is based on (a) a displacement and relative orientation between the Qi radiation detectors relative to the image sensor, and (B) a displacement between Qi imaging positions of the scene relative to the image sensor, wherein the scene is at the Qi imaging positions when the Qi radiation detectors respectively capture the Qi partial images.

[ description of the drawings ]

Fig. 1 schematically shows a radiation detector according to an embodiment.

Fig. 2A schematically shows a simplified cross-sectional view of a radiation detector according to an embodiment.

Fig. 2B schematically shows a detailed cross-sectional view of a radiation detector according to an embodiment.

Fig. 2C schematically illustrates an alternative detailed cross-sectional view of a radiation detector according to an embodiment.

Fig. 3 schematically shows a top view of a package comprising a radiation detector and a Printed Circuit Board (PCB) according to an embodiment.

Fig. 4 schematically shows a cross-sectional view of an image sensor in which a plurality of the packages of fig. 3 are mounted to a system PCB, according to an embodiment.

Fig. 5A to 5N schematically show an imaging process according to an embodiment.

Fig. 6A to 6B schematically show an image alignment process according to an embodiment.

Fig. 7 is a flow diagram summarizing and summarizing an imaging process according to an embodiment.

FIG. 8 is another flow diagram summarizing and summarizing an imaging process according to another embodiment.

[ detailed description ] A

By way of example, fig. 1 schematically illustrates a radiation detector 100. The radiation detector 100 includes an array of pixels 150 (also referred to as sensing elements 150). The array may be a rectangular array (as shown in fig. 1), a honeycomb array, a hexagonal array, or any other suitable array. The array of pixels 150 in the example of FIG. 1 has 4 rows and 7 columns; in general, however, the array of pixels 150 may have any number of rows and any number of columns.

Each pixel 150 may be configured to detect radiation incident thereon from a radiation source (not shown) and may be configured to measure a characteristic of the radiation (e.g., energy, wavelength, and frequency of the particles). The radiation may include particles, such as photons (electromagnetic waves) and sub-atomic particles. Each pixel 150 may be configured to count the number of radiation particles over a period of time for which the energy incident thereon falls in a plurality of energy intervals. All pixels 150 may be configured to count the number of radiation particles incident thereon over multiple energy intervals during the same period of time. When the incident radiation particles have similar energies, the pixel 150 may simply be configured to count the number of radiation particles incident thereon over a period of time without measuring the energy of the individual radiation particles.

Each pixel 150 may have its own analog-to-digital converter (ADC) configured to digitize an analog signal representing the energy of an incident radiation particle into a digital signal, or an analog signal representing the total energy of a plurality of incident radiation particles into a digital signal. The pixels 150 may be configured to operate in parallel. For example, while one pixel 150 measures incident radiation particles, another pixel 150 may be waiting for radiation particles to arrive. The pixels 150 may not necessarily be individually addressable.

The radiation detector 100 described herein may be applied to, for example, X-ray telescopes, X-ray mammography, industrial X-ray defect detection, X-ray microscopy or radiography, X-ray casting inspection, X-ray non-destructive testing, X-ray weld inspection, X-ray digital subtraction angiography, and the like. It may also be suitable to use the radiation detector 100 instead of a photographic plate, photographic film, PSP plate, X-ray image intensifier, scintillator or other semiconductor X-ray detector.

FIG. 2A schematically illustrates a simplified cross-sectional view of the radiation detector of FIG. 1 along line 2A-2A, according to an embodiment. More specifically, the radiation detector 100 may include a radiation absorbing layer 110 and an electronics layer 120 (e.g., ASIC) for processing or analyzing electrical signals generated in the radiation absorbing layer 110 by incident radiation. The radiation detector 100 may or may not include a scintillator (not shown). The radiation absorbing layer 110 may comprise a semiconductor material, such as silicon, germanium, gaAs, cdTe, cdZnTe, or combinations thereof. The semiconductor material may have a high quality attenuation coefficient for the radiation of interest.

As an example, FIG. 2B schematically illustrates a detailed cross-sectional view of the radiation detector of FIG. 1 along line 2A-2A. More specifically, the radiation absorbing layer 110 may include one or more diodes (e.g., p-i-n or p-n) formed from one or more discrete regions 114 of first and second doped regions 111, 113. The second doped region 113 may be separated from the first doped region 111 by an optional intrinsic region 112. The discrete regions 114 are separated from each other by the first doped region 111 or the intrinsic region 112. The first and second doped regions 111, 113 have opposite type doping (e.g., region 111 is p-type and region 113 is n-type, or alternatively, region 111 is n-type and region 113 is p-type). In the example of fig. 2B, each discrete region 114 of the second doped region 113 forms a diode with the first doped region 111 and the optional intrinsic region 112. That is, in the example of fig. 2B, the radiation absorbing layer 110 has a plurality of diodes (more specifically, 7 diodes correspond to 7 pixels 150 in a row in the array of fig. 1, of which only 2 pixels 150 are labeled in fig. 2B for simplicity). The plurality of diodes have an electrode 119A as a common (common) electrode. The first doped region 111 may also have discrete portions.

The electronics layer 120 may include an electronics system 121 suitable for processing or interpreting signals generated by radiation incident on the radiation absorbing layer 110. Electronic system 121 may include analog circuits such as filter networks, amplifiers, integrators, and comparators, or digital circuits such as microprocessors and memory. Electronic system 121 may include one or more ADCs. The electronic system 121 may include components that are shared by the pixels 150 or components that are dedicated to a single pixel 150. For example, the electronic system 121 may include an amplifier dedicated to each pixel 150 and a microprocessor shared among all pixels 150. The electronic system 121 may be electrically connected to the pixels 150 through the vias 131. The space between the vias may be filled with a filler material 130, which may increase the mechanical stability of the connection of the electronic device layer 120 and the radiation absorbing layer 110. Other bonding techniques may connect the electronic system 121 to the pixel 150 without using the via 131.

When radiation from a radiation source (not shown) strikes the radiation absorbing layer 110, which includes a diode, the radiation particles may be absorbed and generate one or more charge carriers (e.g., electrons, holes) by a variety of mechanisms. Charge carriers may drift under an electric field to an electrode of one of the diodes. The field may be an external electric field. The electrical contacts 119B may include discrete portions, each of which is in electrical contact with a discrete region 114. The term "electrical contact" may be used interchangeably with the word "electrode". In an embodiment, the charge carriers may drift in each direction such that charge carriers generated by a single radiation particle are not substantially shared by two different discrete regions 114 (where "substantially not shared" means that less than 2%, less than 0.5%, less than 0.1%, or less than 0.01% of the charge carriers flow to one different discrete region 114 compared to the rest of the charge carriers). Charge carriers generated by radiation particles incident around the footprint of one of the discrete regions 114 are substantially not shared with another of the discrete regions 114. The pixel 150 associated with the discrete region 114 may be a region around the discrete region 114 in which substantially all (greater than 98%, greater than 99.5%, greater than 99.9%, or greater than 99.99%) of the charge carriers generated by the radiation particles incident therein flow toward the discrete region 114. That is, less than 2%, less than 1%, less than 0.1%, or less than 0.01% of these charge carriers flow through the pixel 150.

FIG. 2C schematically illustrates an alternative detailed cross-sectional view of the radiation detector 100 of FIG. 1 along line 2A-2A, according to an embodiment. More specifically, the radiation absorbing layer 110 may contain resistors of semiconductor materials such as silicon, germanium, gaAs, cdTe, cdZnTe, or combinations thereof, but does not include diodes. The semiconductor material may have a high quality attenuation coefficient for the radiation of interest. In an embodiment, the electronic device layer 120 of fig. 2C is similar in structure and function to the electronic device layer 120 of fig. 2B.

When radiation strikes the radiation absorbing layer 110, which includes resistors but not diodes, it may be absorbed and generate one or more charge carriers by a variety of mechanisms. The radiation particles may generate 10 to 100000 charge carriers. Charge carriers can drift under the electric field to

electrical contacts

119A and 119B. The electric field may be an external electric field. Electrical contact 119B includes discrete portions. In an embodiment, the charge carriers may drift in each direction such that the charge carriers generated by a single radiation particle are substantially not shared by two different discrete portions of electrical contact 119B (where "substantially not shared" means that less than 2%, less than 0.5%, less than 0.1%, or less than 0.01% of the charge carriers flow to one different discrete portion compared to the rest of the charge carriers). Charge carriers generated by radiation particles incident around the footprint of one of the discrete portions of electrical contact 119B are substantially not shared with another of the discrete portions of electrical contact 119B. Pixels 150 associated with discrete portions of electrical contact 119B may be regions around the discrete portions in which substantially all (greater than 98%, greater than 99.5%, greater than 99.9%, or greater than 99.99%) of the charge carriers generated by the radiation particles incident thereon flow to the discrete portions of electrical contact 119B. That is, less than 2%, less than 0.5%, less than 0.1%, or less than 0.01% of these charge carriers flow through the pixel associated with one discrete portion of electrical contact 119B.

Fig. 3 schematically shows a top view of a package 200 comprising a radiation detector 100 and a Printed Circuit Board (PCB) 400. The term "PCB" as used herein is not limited to a particular material. For example, the PCB may include a semiconductor. The radiation detector 100 may be mounted to a PCB 400. For clarity, the wiring between the detector 100 and the PCB 400 is not shown. The PCB 400 may have one or more radiation detectors 100.PCB 400 may have an area 405 not covered by radiation detector 100 (e.g., for accommodating bond wires 410). The radiation detector 100 may have an active area 190 where the pixels 150 (fig. 1) are located. The radiation detector 100 may have a peripheral region 195 near the edges of the radiation detector 100. The peripheral region 195 is free of pixels 150 and the radiation detector 100 does not detect radiation particles incident on the peripheral region 195.

Fig. 4 schematically shows a cross-sectional view of an image sensor 490 according to an embodiment. The image sensor 490 may include a plurality of the packages 200 of fig. 3 mounted to a system PCB 450. As an example, fig. 4 shows only 2 packages 200. The electrical connection between PCB 400 and system PCB 450 may be made through bond wires 410. To accommodate bond wires 410 on PCB 400, PCB 400 may have an area 405 not covered by detector 100. To accommodate the bond wires 410 on the system PCB 450, the packages 200 may have gaps between them. The gap may be about 1mm or more. Radiation particles incident on the peripheral region 195, region 405, or gap are not detected by the package 200 on the system PCB 450. A dead zone of a radiation detector (e.g., radiation detector 100) is a region of a radiation receiving surface of the radiation detector where radiation particles incident thereon cannot be detected by the radiation detector. A dead zone of a package (e.g., package 200) is a region of a radiation-receiving surface of the package where radiation particles incident thereon cannot be detected by one or more detectors in the package. In this example shown in fig. 3 and 4, the dead zone of package 200 includes peripheral region 195 and region 405. The dead zone (e.g., 488) of an image sensor (e.g., image sensor 490) having a set of packages (e.g., packages 200 mounted on the same PCB, packages 200 arranged in the same layer) includes a combination of the dead zone of each package in the set and each gap between each package.

The image sensor 490 including the radiation detector 100 may have a dead zone 488 that cannot detect incident radiation. However, the image sensor 490 may capture partial images of all points of an object or scene (not shown), and these captured partial images may then be stitched to form a complete image of the entire object or scene.

Fig. 5A-5N schematically illustrate an imaging session using the image sensor 490 of fig. 4, according to an embodiment. Referring to fig. 5A, in an embodiment, an image sensor 490 may be used to scan a scene 510. The image sensor 490 may include two

radiation detectors

100a and 100b (similar to the radiation detector 100), and the

radiation detectors

100a and 100b may include

active areas

190a and 190b, respectively. For simplicity, only the

active areas

190a and 190b of the image sensor 490 are shown, while other portions of the image sensor 490 are omitted. In an embodiment, the

radiation detectors

100a and 100b of the image sensor 490 may be identical.

For purposes of illustration, object 512 (two swords) may be part of scene 510. In an embodiment, the scene 510 may include 4 scene portions 510.1, 510.2, 510.3, and 510.4. In an embodiment, as the image sensor 490 scans the scene 510, the scene 510 may move from left to right while the image sensor 490 remains stationary.

Specifically, in an embodiment, the scene 510 may begin at a first imaging position (fig. 5A) in which the scene portion 510.1 is aligned with the active area 190 a. In an embodiment, the active area 190a may capture a partial image 520a1 of the scene portion 510.1 (fig. 5B) while the scene 510 remains stationary at the first imaging position.

Next, in an embodiment, the scene 510 may be further moved to the right to a second imaging position (fig. 5C) where the scene portion 510.2 is aligned with the active area 190 a. In an embodiment, the active area 190a may capture a partial image 520a2 of the scene portion 510.2 while the scene 510 remains stationary at the second imaging position (fig. 5D).

Next, in an embodiment, the scene 510 may be further moved to the right to a third imaging position (fig. 5E) where the scene portion 510.3 is aligned with the active area 190 a. In an embodiment, the active area 190a may capture a partial image 520a3 of the scene portion 510.3 while the scene 510 remains stationary at the third imaging position (fig. 5F).

Next, in an embodiment, the scene 510 may be further moved to the right to a fourth imaging position (fig. 5G) where (a) the scene portion 510.4 is aligned with the active area 190a and (B) the scene portion 510.1 is aligned with the active area 190B. In an embodiment, while the scene 510 remains stationary at the fourth imaging position, the

active areas

190a and 190b may simultaneously capture partial images 520a4 and 520b1 of the scene portions 510.4 and 510.1, respectively (fig. 5H).

Next, in an embodiment, the scene 510 may be further moved to the right to a fifth imaging position (fig. 5I) where the scene portion 510.2 is aligned with the active area 190b. In an embodiment, the active area 190b may capture a partial image 520b2 of the scene portion 510.2 while the scene 510 remains stationary at the fifth imaging position (fig. 5J).

Next, in an embodiment, the scene 510 may be further moved to the right to a sixth imaging position (fig. 5K) where the scene portion 510.3 is aligned with the active area 190b. In an embodiment, the active area 190b may capture a partial image 520b3 of the scene portion 510.3 (fig. 5L) while the scene 510 remains stationary at the sixth imaging position.

Next, in an embodiment, the scene 510 may be further moved to the right to a seventh imaging position (fig. 5M) where the scene portion 510.4 is aligned with the active area 190b. In an embodiment, the active area 190b may capture a partial image 520b4 (fig. 5N) of the scene portion 510.4 while the scene 510 remains stationary at the seventh imaging position.

To summarize the imaging session described above, referring to fig. 5A through 5N, each of the

active areas

190a and 190b scans through all 4 scene portions 510.1, 510.2, 510.3, and 510.4. In other words, each of the scene portions 510.1, 510.2, 510.3, and 510.4 has an image captured by both of the

active areas

190a and 190b. Specifically, scene portion 510.1 has images 520a1 and 520b1 captured by

active areas

190a and 190b, respectively. The scene portion 510.2 has images 520a2 and 520b2 captured by the

active areas

190a and 190b, respectively. The scene portion 510.3 has images 520a3 and 520b3 captured by the

active areas

190a and 190b, respectively. The scene portion 510.4 has images 520a4 and 520b4 captured by the

active areas

190a and 190b, respectively.

In an embodiment, referring to fig. 5A to 5N, for scene portion 510.1, a first enhanced partial image (not shown) of scene portion 510.1 may be generated from partial images 520a1 and 520b1 of scene portion 510.1. In an embodiment, the resolution of the first enhanced partial image may be higher than the resolution of the partial images 520a1 and 520b1. For example, the resolution of the first enhanced partial image may be twice the resolution of the partial images 520a1 and 520b1. In particular, the partial images 520a1 and 520b1 may each have 28 picture elements (fig. 1), while the first enhanced partial image may have 2 × 28=56 picture elements.

In an embodiment, the first enhanced partial image may be generated from the partial images 520a1 and 520b1 by applying one or more super resolution algorithms to the partial images 520a1 and 520b1. Fig. 6A and 6B illustrate how one or more super resolution algorithms may be applied to the partial images 520a1 and 520B1 to obtain a first enhanced partial image, according to an embodiment.

In particular, fig. 6A shows the scene 510 at a first imaging position (left half of fig. 6A, where the active area 190a captures a partial image 520a1 of the scene portion 510.1), followed later at a fourth imaging position (right half of fig. 6A, where the active area 190b captures a partial image 520b1 of the scene portion 510.1). For simplicity, only scene portion 510.1 of scene 510 is shown (i.e., the other 3 scene portions 510.2, 510.3, and 510.4 of scene 510 are not shown).

In one aspect, in an embodiment, the position and orientation of the

radiation detectors

100a and 100b relative to the image sensor 490 may be determined. Thereby, the displacement and relative orientation between the

radiation detectors

100a and 100b with respect to the image sensor 490 can be determined. In an embodiment, these determinations may be performed by the manufacturer of the image sensor 490, and the resulting determination data may be stored in the image sensor 490 for later use in subsequent imaging sessions, including the imaging sessions described above.

On the other hand, in an embodiment, a stepper motor (not shown) may be used to move the scene 510 from the first imaging position, through the second and third imaging positions, to the fourth imaging position during the imaging session described above. In an embodiment, the stepper motor may include a mechanism for measuring the distance of movement caused by the stepper motor. For example, electrical pulses may be sent to a stepper motor to determine the displacement of the scene 510. In this way, a displacement between the first imaging position and the fourth imaging position relative to the image sensor 490 may be determined. Alternatively, instead of using a stepper motor with a mechanism for measuring distance, optical diffraction may be used to determine the displacement between the first imaging position and the fourth imaging position relative to the image sensor 490. In general, any method for determining the distance traveled by the scene 510 relative to the image sensor 490 may be used to determine the displacement between the first imaging location and the fourth imaging location relative to the image sensor 490.

As a simplified example, it is assumed that the position and orientation of the radiation detectors 100a and 100B with respect to the image sensor 490 are determined, whereby (a) the displacement between the radiation detectors 100a and 100B in the eastward direction is determined to be 12 sensing element widths (i.e., 12 times the width 102 of the sensing element 150 of fig. 1), and (B) the relative orientation between the radiation detectors 100a and 100B is zero. In other words, the radiation detector 100a would need to translate (without rotation) in an eastward direction a distance of 12 sensing element widths to reach and coincide with the radiation detector 100b.

Further, in the simplified example, it is further assumed that the displacement between the first imaging position and the fourth imaging position with respect to the image sensor 490 in the eastward direction is determined to be 11.3 sensing element widths. In other words, the scene 510 is moved in an eastward direction by a distance of 11.3 sensing element widths to reach the fourth imaging position.

As a result, in a simplified example, as shown in fig. 6B, when the two partial images 520a1 and 520B1 are aligned such that the images of the points of the scene portion 510.1 in the partial images 520a1 and 520B1 coincide, the 28 picture elements 150B 'of the partial image 520B1 are moved to the right of the 28 picture elements 150a' of the partial image 520a1 by an offset 610 of 0.7 (i.e., 12-11.3) sense element widths. In fig. 6B, a portion of the partial image 520B1 overlapping the partial image 520a1 is not shown for the sake of simplicity.

In an embodiment, where the offset 610 (i.e., 0.7 sense element widths) is determined, one or more super resolution algorithms may be applied to the partial images 520a1 and 520b1 based on the determined offset 610, resulting in a first enhanced partial image of the scene portion 510.1.

Described above is a simplified example where the radiation detector 100a needs to translate in order to reach and coincide with the radiation detector 100b. Typically, in order to reach and coincide with radiation detector 100b, radiation detector 100a may require both translation and rotation. This means that the orientation of the

radiation detectors

100a and 100b relative to the image sensor 490 is different, or in other words, the relative orientation between the

radiation detectors

100a and 100b is not zero.

Further, in a general case, the displacement between the first imaging position and the fourth imaging position with respect to the image sensor 490 may be in a direction different from the eastern direction. However, in a general case, with sufficient information (i.e., (a) the position and orientation of the radiation detectors 100a and 100B with respect to the image sensor 490, and (B) the displacement between the first imaging position and the fourth imaging position with respect to the image sensor 490), the partial images 520a1 and 520B1 may be aligned in a manner similar to that described above in the simplified example.

In summary, in the case where the position and orientation of the

radiation detectors

100a and 100b with respect to the image sensor 490 are determined, and in the case where the displacement between the first imaging position and the fourth imaging position with respect to the image sensor 490 is determined, the partial images 520a1 and 520b1 may be aligned, and the shift amount 610 between the image elements 150a 'and 150b' may be determined. As a result, one or more super resolution algorithms may be applied to the partial images 520a1 and 520b1 based on the determined offset 610 between image elements 150a 'and 150b', resulting in a first enhanced partial image of the scene portion 510.1.

In an embodiment, a second enhanced partial image of scene portion 510.2 may be generated from partial images 520a2 and 520b2 in a similar manner; a third enhanced partial image of the scene portion 510.3 may be generated from the partial images 520a3 and 520b3 in a similar manner; a fourth enhanced partial image of the scene portion 510.4 may be generated from the partial images 520a4 and 520b4 in a similar manner.

Fig. 7 is a flowchart 700 summarizing and summarizing the imaging session (fig. 5A-5N) described above, according to an embodiment. Specifically, in step 710, M partial images (e.g., M =8 partial images 520a1, 520a2, 520a3, 520a4, 520b1, 520b2, 520b3, and 520b 4) of N scene portions (scene portion (i), i =1, \\8230; \ 8230;, N) (e.g., N =4 scene portions 510.1, 510.2, 510.3, and 510.4) of a scene (e.g., scene 510) are captured by P radiation detectors (e.g., P =2

radiation detectors

100a and 100 b) of an image sensor (e.g., image sensor 490).

Further, for i =1, \8230;, N, the Qi partial images (e.g., Q1=2 partial images 520a1 and 520b1 in the case of i = 1) of the scene portion (i) (e.g., scene portion 510.1) are captured by Qi radiation detectors (e.g., Q1=2

radiation detectors

100a and 100 b) of the P radiation detectors, respectively. Further, the Qi partial images (e.g., Q1=2 partial images 520a1 and 520b1 in the case of i = 1) are Qi partial images among the M partial images (e.g., M =8 partial images 520a1, 520a2, 520a3, 520a4, 520b1, 520b2, 520b3, and 520b 4).

Next, in step 720, for i =1, \8230;, N, an enhanced partial image (i) is generated from the Qi partial images (e.g., from Q1=2 partial images 520a1 and 520b 1) of the scene portion (i) (e.g., scene portion 510.1) (e.g., in the case of i =1, a first enhanced partial image is generated). Further, the enhanced partial images (i) are generated based on (a) positions and orientations of Qi radiation detectors (e.g., Q1=2 radiation detectors 100a and 100B in the case of i = 1) relative to the image sensor, and (B) displacements between Qi imaging positions (e.g., a first imaging position and a fourth imaging position) of a scene (e.g., scene 510) relative to the image sensor, where the scene is at the Qi imaging positions when the Qi radiation detectors capture the Qi partial images, respectively (e.g., the scene 510 is at the first imaging position and the fourth imaging position when Q1=2 radiation detectors 100a and 100B capture Q1=2 partial images 520a1 and 520B1, respectively).

In an embodiment, referring to flowchart 700 of fig. 7, at least two partial images of the m partial images are captured simultaneously by the image sensor. For example, referring to fig. 5G to 5H, two partial images 520a4 and 520b1 are simultaneously captured by the two

radiation detectors

100a and 100b, respectively.

In an embodiment, referring to flowchart 700 of fig. 7, the capturing may include moving the scene in a straight line relative to the image sensor throughout the capturing, wherein the scene does not reverse direction of movement throughout the capturing. For example, referring to fig. 5A through 5N, the scene 510 moves linearly in an eastward direction with respect to the image sensor 490, and does not move in a westward direction at any time during the scanning of the scene 510.

In an embodiment, referring to flow diagram 700 of fig. 7, for i =1, \8230 \ 8230;, N, qi may be equal to P. For example, in the above-described imaging session, Q1= Q2= Q3= Q4= P =2. In other words, each of the four scene portions 510.1, 510.2, 510.3 and 510.4 is scanned by each of the P =2

radiation detectors

100a and 100b.

In an embodiment, the first, second, third and fourth enhanced partial images may be stitched resulting in a stitched image (not shown) of the scene 510 (fig. 5A to 5M). In an embodiment, the stitching of the first, second, third, and fourth enhancement portion images may be based on the position and orientation of at least one of the

radiation detectors

100a and 100b relative to the image sensor 490. For example, stitching of the first, second, third, and fourth enhancement portion images may be based on the position and orientation of the radiation detector 100 a.

Fig. 8 is a flow chart 800 summarizing and summarizing the imaging session described above (fig. 5A-5N), according to an alternative embodiment. Specifically, in step 810, M partial images (e.g., M =8 partial images 520a1, 520a2, 520a3, 520a4, 520b1, 520b2, 520b3, and 520b 4) of N scene portions (scene portion (i), i =1, \\8230; \ 8230;, N) (e.g., N =4 scene portions 510.1, 510.2, 510.3, and 510.4) of a scene (e.g., scene 510) are captured using P radiation detectors (e.g., P =2

radiation detectors

100a and 100 b) of an image sensor (e.g., image sensor 490).

Furthermore, for i =1, \8230 \ 8230;, N, qi partial images (e.g. Q1=2 partial images 520a1 and 520b1 in case i = 1) of the scene portion (i) (e.g. scene portion 510.1) are captured by Qi radiation detectors (e.g. Q1=2

radiation detectors

100a and 100 b) of the P radiation detectors, respectively. Further, the Qi partial images (e.g., Q1=2 partial images 520a1 and 520b1 in the case of i = 1) are among the M partial images (e.g., M =8 partial images 520a1, 520a2, 520a3, 520a4, 520b1, 520b2, 520b3, and 520b 4).

Next, in step 820, for i =1, \8230;, N, an enhanced partial image (i) is generated from the Qi partial images (e.g., from Q1=2 partial images 520a1 and 520b 1) of the scene portion (i) (e.g., scene portion 510.1) (e.g., a first enhanced partial image is generated in case i = 1).

In the above embodiment, referring to fig. 5A through 5N, the image sensor 490 remains stationary while the scene 510 (along with the object 512) moves. Alternatively, as the image sensor 490 scans the scene 510, the scene (along with the object 512) may remain stationary while the image sensor 490 (along with the

radiation detectors

100a and 100 b) may move.

In the above embodiment, the image sensor 490 includes two

radiation detectors

100a and 100b. In general, the image sensor 490 may include any number of radiation detectors 100. Furthermore, each of the four scene parts 510.1, 510.2, 510.3 and 510.4 does not necessarily have images captured by all radiation detectors of the image sensor 490. Furthermore, each of the four scene parts 510.1, 510.2, 510.3 and 510.4 does not necessarily have to have an image captured by the same radiation detector.

For example, assume that the image sensor 490 includes

radiation detectors

100a, 100b and a third radiation detector (not shown, but similar to radiation detector 100). Then, in an embodiment, scene portion 510.1 may have two images captured by

radiation detectors

100a and 100b, respectively; scene portion 510.2 may have two images captured by radiation detector 100a and the third radiation detector, respectively; scene portion 510.3 may have two images captured by radiation detector 100b and the third radiation detector, respectively; and scene portion 510.4 may have three images captured by all radiation detectors (100 a, 100b and third radiation detector), respectively.

In the above-described embodiment, the position and orientation of the

radiation detectors

100a and 100b relative to the image sensor 490 is used to help align the partial images 520a1 and 520b1 (fig. 7, step 720, part (a)). Alternatively, the position and orientation of the

radiation detectors

100a and 100b may be replaced with a displacement and relative orientation between the

radiation detectors

100a and 100b relative to the image sensor 490 to help align the partial images 520a1 and 520b1. Specifically, as shown in the simplified example described above, a displacement of 12 sensing element widths in the east direction between

radiation detectors

100a and 100b relative to image sensor 490 and a relative orientation of zero between

radiation detectors

100a and 100b is used to help determine offset 610 (i.e., to help align partial images 520a1 and 520b 1).

While various aspects and embodiments are disclosed herein, other aspects and embodiments will be apparent to those skilled in the art. The various aspects and embodiments disclosed herein are for illustrative purposes and are not intended to be limiting, with the true scope and spirit being indicated by the following claims.

Claims

1. A method, comprising:

m partial images of N scene parts (scene part (i), i =1, \ 8230; \8230;, N) of the scene are captured with P radiation detectors of the image sensor,

wherein M, N and P are positive integers,

wherein for i =1, \8230 \ 8230;, N, the Qi partial images of the scene portion (i) are respectively captured by Qi radiation detectors of the P radiation detectors, qi being an integer greater than 1, and

wherein the Qi partial images are Qi partial images of the M partial images; and

for i =1, \8230 \ 8230;, N, an enhanced partial image (i) is generated from the Qi partial images of the scene portion (i),

wherein the generating of the enhanced partial image (i) is based on

(A) The position and orientation of the Qi radiation detectors relative to the image sensor, an

(B) A displacement between Qi imaging positions of the scene relative to the image sensor, wherein the scene is at the Qi imaging positions when the Qi radiation detectors respectively capture the Qi partial images.

2. The method of claim 1, wherein at least two of the M partial images are captured simultaneously by the image sensor.

3. The method of claim 2, wherein the at least two partial images are captured by at least two of the P radiation detectors.

4. The method of claim 1, wherein for i =1, \8230;, N, qi >2.

5. The method of claim 1, wherein N >1.

6. The method of claim 1, wherein for i =1, \8230;, N, qi = P.

7. The method according to claim 1, wherein the generating of the enhanced partial image (i) comprises applying one or more super-resolution algorithms to the Qi partial images.

8. The method of claim 7, wherein said applying said one or more super resolution algorithms to said Qi partial images comprises aligning said Qi partial images.

9. The method of claim 1, further comprising stitching the enhanced partial images (i), i =1, \8230;, N, resulting in a stitched image of the scene.

10. The method of claim 9, wherein the stitching is based on a position and orientation of at least one of the P radiation detectors relative to the image sensor.

11. The method of claim 1, further comprising determining the displacement between the Qi imaging positions using a stepper motor, the stepper motor comprising a mechanism for measuring a distance of movement caused by the stepper motor.

12. The method of claim 1, further comprising determining the displacement between the Qi imaging positions using optical diffraction.

13. The method of claim 1, wherein the first and second light sources are selected from the group consisting of,

wherein the capturing comprises moving the scene in a straight line relative to the image sensor throughout the capturing.

14. The method of claim 13, wherein the scene does not reverse direction of movement throughout the capturing.

15. The method of claim 1, wherein N >1, wherein j and k belong to 1, \8230, N, wherein j ≠ k, and wherein the Qj radiation detectors are distinct from the Qk radiation detectors.

16. The method of claim 1, wherein N >1, wherein j and k belong to 1, \8230, N, wherein j ≠ k, and wherein Qj ≠ Qk.

17. A method, comprising:

wherein M, N and P are positive integers,

for i =1, \8230;, N, an enhanced partial image (i) is generated from the Qi partial images of the scene portion (i).

18. The method of claim 17, wherein the generating an enhanced partial image (i) is based on

(A) A displacement and a relative orientation between the Qi radiation detectors relative to the image sensor, an

19. The method of claim 17, wherein at least two of the M partial images are captured simultaneously by the image sensor.

20. The method of claim 19, wherein the at least two partial images are captured by at least two radiation detectors of the P radiation detectors.