CN115832859A - Integrated multi-element device coupling packaging equipment - Google Patents
Integrated multi-element device coupling packaging equipment Download PDFInfo
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- CN115832859A CN115832859A CN202211446087.6A CN202211446087A CN115832859A CN 115832859 A CN115832859 A CN 115832859A CN 202211446087 A CN202211446087 A CN 202211446087A CN 115832859 A CN115832859 A CN 115832859A
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- 230000008878 coupling Effects 0.000 title claims abstract description 192
- 238000010168 coupling process Methods 0.000 title claims abstract description 192
- 238000005859 coupling reaction Methods 0.000 title claims abstract description 191
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 38
- 238000001514 detection method Methods 0.000 claims abstract description 128
- 230000007246 mechanism Effects 0.000 claims abstract description 38
- 239000013307 optical fiber Substances 0.000 claims abstract description 10
- 238000006073 displacement reaction Methods 0.000 claims description 29
- 230000010287 polarization Effects 0.000 claims description 21
- 238000001723 curing Methods 0.000 claims description 14
- 238000001179 sorption measurement Methods 0.000 claims description 12
- 238000003848 UV Light-Curing Methods 0.000 claims description 9
- 230000003287 optical effect Effects 0.000 claims description 6
- 239000004065 semiconductor Substances 0.000 abstract description 24
- 239000000463 material Substances 0.000 abstract description 5
- 238000000034 method Methods 0.000 abstract description 3
- 238000005538 encapsulation Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000007689 inspection Methods 0.000 description 2
- 230000003044 adaptive effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
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- 238000005457 optimization Methods 0.000 description 1
- 238000012858 packaging process Methods 0.000 description 1
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- 230000008023 solidification Effects 0.000 description 1
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
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Abstract
The invention provides integrated multi-component coupling packaging equipment, wherein a component charging assembly is used for charging various components, a component clamping coupling assembly is used for taking, moving and coupling the components, a laser shell positioning assembly is used for positioning a laser shell, a light-emitting chip is connected to a light outlet of the laser shell through an optical fiber, a dispensing curing assembly is used for dispensing and curing the components, and a coupling detection assembly comprises a light path guide mechanism and a camera detection mechanism, wherein the light path guide mechanism guides light through a plurality of reflecting mirror surfaces, so that the light emitted by different components during coupling is received by the camera detection mechanism, and the coupling precision detection is carried out. The semiconductor laser device packaging method can finish the coupling packaging of a plurality of components of the semiconductor laser device on the equipment in sequence, does not need to replace different equipment, has high automation degree, obviously reduces the time consumption of loading and unloading, material transferring and the like, and effectively improves the coupling packaging efficiency of the semiconductor laser device.
Description
Technical Field
The invention relates to the technical field of semiconductor lasers, in particular to integrated multi-element device coupling packaging equipment.
Background
Semiconductor lasers, also known as laser diodes, have the characteristics of high output power, small volume, light weight, long service life, high photoelectric conversion efficiency and the like, and are widely applied in various fields at present. The light output power of a single-tube high-power semiconductor laser can reach more than 50W magnitude at present, in order to further improve the output power of the semiconductor laser, the single-tube high-power semiconductor laser is applied to more occasions, a plurality of light emitting chips are generally selected to be arranged together in a combined mode to form a linear array, an area array or a stacked array structure, then the light output by each light emitting chip is subjected to space combination, and is focused and coupled into an optical fiber, so that high-power output with high light beam quality is realized. The semiconductor laser comprises a laser shell, wherein a light outlet for mounting optical fibers is formed in the laser shell, light emitting chips distributed in an array mode are distributed in the laser shell, and light beams of the light emitting chips are finally combined and coupled into the optical fibers to serve as output of the semiconductor laser. The light beams are combined through a Polarization Beam Splitter (PBS), namely one part of the light beams is P polarized light and the other part of the light beams is S polarized light, and the light beams are combined at the position of the PBS. In order to make the arrangement inside the laser housing more compact, a mirror is generally provided on the beam combining path of the S-polarized light itself, and the S-polarized light is reflected and then incident into a polarization splitting prism at 90 degrees with respect to the P-polarized light, thereby completing polarization combining. And finally, converging the optical fiber by a focusing lens at the position of the light outlet. Therefore, the coupling accuracy of the polarization splitting prism, the reflecting mirror, the focusing mirror, and the like significantly affect the output power of the semiconductor laser.
Therefore, the coupling precision of each component of the semiconductor laser determines the packaging quality of the semiconductor laser to a great extent, and the output power of the semiconductor laser is reduced remarkably when the coupling precision is unqualified. The prior art changes the coupling by means of manual operation through automation equipment. However, since the polarization beam splitter prism, the reflector, the focusing mirror, etc. all need to be coupled, the automation device in the prior art still has not high efficiency. And these components and parts need rely on different equipment to accomplish the coupling encapsulation, if adopt same equipment to accomplish whole coupling encapsulation operations then can show the time spent that reduces unloading etc. and promote semiconductor laser coupling encapsulation efficiency.
Disclosure of Invention
The present invention is directed to provide an apparatus for integrally coupling and packaging multiple components of a semiconductor laser, which overcomes the above-mentioned shortcomings in the prior art.
In order to achieve the aim, the invention provides integrated multi-component coupling packaging equipment which comprises a component loading assembly, a component clamping and coupling assembly, a laser shell positioning assembly, a dispensing curing assembly and a coupling detection assembly, wherein the component loading assembly is used for loading a component to be packaged; the component loading assembly is used for loading various components; the component clamping and coupling assembly is used for taking, moving and coupling components; the laser shell positioning assembly is used for positioning the laser shell and connecting the light emitting chip to a light outlet of the laser shell through an optical fiber; the dispensing curing assembly is used for dispensing and curing components; the coupling detection assembly comprises a light path guide mechanism and a camera detection mechanism, wherein the light path guide mechanism guides light through a plurality of reflector surfaces, and light emitted by different components is received by the camera detection mechanism when the different components are coupled so as to detect coupling precision.
Further, components and parts centre gripping coupling subassembly includes the components and parts clamping part, the components and parts clamping part is connected with anchor clamps motion platform, anchor clamps motion platform has a plurality of degrees of freedom of motion, the components and parts clamping part can press from both sides tight location and negative pressure adsorption positioning.
Furthermore, the component clamping part comprises a clamping motor or a clamping cylinder, the clamping motor or the clamping cylinder is used for controlling two clamping arms which are oppositely arranged, and the tail ends of the clamping arms are provided with clamping heads;
the chuck at least comprises a first clamping groove and a second clamping groove, the first clamping groove and the second clamping groove are arranged in a clinging manner, and the sizes of the first clamping groove and the second clamping groove are different so as to clamp different components; the chuck is also provided with a negative pressure adsorption hole, and the negative pressure adsorption hole is connected with a negative pressure end and used for generating a negative pressure adsorption component.
Furthermore, the component loading assembly comprises a plurality of loading trays, the loading trays are respectively used for loading different components, and clamping grooves matched with the corresponding components in shape are formed in the loading trays so that the corresponding components can be stably placed.
Further, the laser shell positioning assembly comprises a laser shell positioning plate, the laser shell positioning plate is used for positioning the laser shell, the laser shell positioning plate is arranged on the laser shell positioning seat, and the laser shell positioning plate can rotate and adjust the angle relative to the laser shell positioning seat; the laser shell positioning seat is connected with the laser shell displacement module, and the laser shell displacement module is used for driving the laser shell positioning seat to move horizontally.
Further, the dispensing and curing assembly comprises a dispensing mechanism and a UV curing mechanism, and the dispensing mechanism and the UV curing mechanism are connected with the component clamping and coupling assembly.
Further, the coupling detection assembly comprises a first coupling detection assembly and a second coupling detection assembly, the first coupling detection assembly is used for coupling and packaging the focusing mirror, the anti-reflection sheet and the first reflecting mirror, and the second coupling detection assembly is used for coupling and packaging the polarization splitting prism and the second reflecting mirror.
Furthermore, the first coupling detection assembly comprises a first coupling detection camera and a first periscope, the first coupling detection camera and the first periscope are both mounted on a first coupling detection seat, the first coupling detection seat is connected with a first coupling detection displacement module, and the first coupling detection displacement module is used for driving the first coupling detection camera to adjust the position and moving the detection light spot back and forth along the light path.
Furthermore, the second coupling detection assembly comprises a second coupling detection camera and a second periscope, the second coupling detection camera and the second periscope are both mounted on a second coupling detection seat, the second coupling detection seat is connected with a second coupling detection displacement module, and the second coupling detection displacement module is used for driving the second coupling detection camera to adjust the position and moving the detection light spot back and forth along the light path.
Further, the laser shell is sequentially coupled and packaged with a focusing mirror, an anti-reflection sheet, a first reflecting mirror, a polarization beam splitter prism and a second reflecting mirror.
The scheme of the invention has the following beneficial effects:
according to the integrated multi-element coupling packaging equipment, the coupling packaging of a plurality of elements of the semiconductor laser can be sequentially completed on the equipment through adaptive arrangement of the element loading assembly, the element clamping coupling assembly, the laser shell positioning assembly, the coupling detection assembly and the like aiming at different elements, the operation of different equipment does not need to be replaced, the automation degree is high, the time consumption for loading and unloading, material transferring and the like is remarkably reduced, and the coupling packaging efficiency of the semiconductor laser is effectively improved;
other advantages of the present invention will be described in detail in the detailed description that follows.
Drawings
FIG. 1 is a schematic view of the overall structure of the present invention;
FIG. 2 is a schematic diagram of a semiconductor laser coupling package device according to the present invention;
FIG. 3 is a schematic view of a component holding portion of the present invention;
FIG. 4 is a schematic diagram of a component clamping and coupling assembly and a dispensing curing assembly according to the present invention;
FIG. 5 is a schematic view of a component loading assembly of the present invention;
FIG. 6 is a schematic view of a laser housing positioning assembly of the present invention (including a 90 degree rotated state);
FIG. 7 is a schematic view of a first coupling detection assembly of the present invention;
FIG. 8 is a schematic view of a second coupling detection assembly according to the present invention.
[ instruction of reference ]
100-a semiconductor laser; 101-a focusing mirror; 102-anti-reverse; 103-a first mirror; 104-a polarization beam splitter prism; 105-a second mirror; 106-light outlet; 200-a component loading assembly; 201-a loading tray; 202-card slot; 300-the component holds the coupling assembly; 301-component holding part; 302-a clamping motor; 303-a chuck; 304-a first clamping groove; 305-a second clamping groove; 306-negative pressure adsorption holes; 307-clamp X-axis slide; 308-clamp Z-axis slide; 309-clamp Y-axis slide; 310-a swivel mount; 311-Z axis rotating platform; 312-flatly pasting the rotating platform; 400-laser housing positioning assembly; 401-laser housing positioning plate; 402-laser housing positioning seat; 403-laser housing displacement module; 500-dispensing curing components; 501-glue dispensing mechanism; 502-a UV curing mechanism; 600-a coupling detection assembly; 601-a first coupling detection camera; 602-a first periscope; 603-a first coupling detection mount; 604-a first coupling detection displacement module; 605-a second coupling detection camera; 606-a second periscope; 607-a second coupling detection seat; 608-second coupling detection displacement module.
Detailed Description
In order to make the technical problems, technical solutions and advantages of the present invention more apparent, the following detailed description is given with reference to the accompanying drawings and specific embodiments. It is to be understood that the embodiments described are only a few embodiments of the present invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention. Furthermore, the technical features involved in the different embodiments of the present invention described below may be combined with each other as long as they do not conflict with each other.
In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the device or component in question must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted", "connected" and "connected" are to be understood broadly, for example, as being either a locked connection, a detachable connection, or an integral connection; can be mechanically or electrically connected; the two components can be directly connected or indirectly connected through an intermediate medium, or the two components can be communicated with each other. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
As shown in fig. 1, an embodiment of the present invention provides an integrated multi-component coupling and packaging apparatus, which is suitable for integrated coupling and packaging of multiple components of a semiconductor laser 100. As shown in fig. 2, the components include a laser housing, and a focusing mirror 101, an anti-reflection plate 102, a first reflecting mirror 103, a polarization splitting prism 104, and a second reflecting mirror 105, which are enclosed in the laser housing. The packaging adopts a reverse light-passing mode, namely, the light outlet 106 of the laser shell is connected with the light-emitting chip through an optical fiber, so that the light emitted by the light-emitting chip is transmitted to the light outlet 106 through the optical fiber and then sequentially emitted into each component, and the coupling precision is determined by means of optical power (light spot) detection.
The focusing mirror 101 and the anti-reflection sheet 102 are arranged right opposite to the light outlet 106, the first reflecting mirror 103 is used for reflecting the (reversely) collimated light beam of the focusing mirror 101 by 90 degrees and emitting the light beam to the polarization splitting prism 104, the polarization splitting prism 104 splits the light into P-polarized light and S-polarized light, the P-polarized light can directly transmit the polarization splitting prism 104, the S-polarized light is reflected by 90 degrees relative to the P-polarized light, the P-polarized light is finally reflected by 90 degrees through the second reflecting mirror 105, and the two laser beams correspond to the light beam formed in the finished semiconductor laser 100. Therefore, when these components are coupled and packaged, the focusing mirror 101 and the reflection preventing plate 102 can directly detect the outgoing light, the first reflecting mirror 103 detects the reflected light, the polarization splitting prism 104 detects the reflected S-polarized light, and the second reflecting mirror 105 detects the reflected P-polarized light. As can be seen from the arrangement of the various components, the detection of the light beam needs to be performed from three directions.
The apparatus includes a component loading assembly 200, a component clamping coupling assembly 300, a laser housing positioning assembly 400, a dispensing curing assembly 500, and a coupling detection assembly 600. The component loading assembly 200 is used for loading various components, and includes the focusing mirror 101, the reflection preventing plate 102, the first reflecting mirror 103, the polarization splitting prism 104 and the second reflecting mirror 105, and different components are loaded respectively. The component clamping and coupling assembly 300 is used for component taking, moving and coupling, and can ensure clamping and positioning of different components. The laser housing positioning assembly 400 is used for positioning the laser housing, and simultaneously connects the light emitting chip to the light outlet 106 of the laser housing through an optical fiber, so that the light outlet 106 emits light for coupling to the component. The dispensing curing assembly 500 is used for dispensing and curing components, so that each component is packaged, and before the next component is coupled, the components are cured and packaged first, and displacement and the like are avoided. The coupling detection assembly 600 comprises a light path guide mechanism and a camera detection mechanism, wherein the light path guide mechanism guides light through a plurality of reflecting mirror surfaces, light emitted by different components is received by the camera detection mechanism when the components are coupled, coupling precision detection is carried out by means of the camera detection mechanism, and a light spot detection method is adopted.
Meanwhile, as shown in fig. 3, in this embodiment, the component clamping and coupling assembly 300 includes a component clamping portion 301, the component clamping portion 301 is connected to the fixture moving platform, and the fixture moving platform has a plurality of degrees of freedom of movement, so as to control the component clamping portion 301 to accurately take materials from various components loaded at different positions, and move the components to a coupling position for adjustment and coupling.
The component clamping portion 301 can clamp and position a component corresponding to the component clamping portion and the component clamping portion. Specifically, in this embodiment, the component clamping portion 301 includes a clamping motor 302, and the clamping motor 302, for example, a finger cylinder, is used to drive two clamping arms that are arranged oppositely, so that the two clamping arms can be controlled to close or release.
The end of the gripper arm is a collet 303. The collet 303 at least includes a first clamping groove 304 and a second clamping groove 305, the first clamping groove 304 and the second clamping groove 305 are disposed in close contact with each other, and the sizes of the first clamping groove 304 and the second clamping groove 305 are not the same, for example, the first clamping groove 304 is larger than the second clamping groove 305, so that a certain step surface is formed at the transition position of the first clamping groove 304 and the second clamping groove 305 to clamp different components. In addition, the chuck 303 is further provided with a negative pressure adsorption hole 306, the negative pressure adsorption hole 306 is connected with a negative pressure end and used for generating negative pressure to adsorb the component, so that when the component is clamped by the clamping groove, especially when the component cannot be stably clamped by the chuck alone, the clamping is further ensured to be firm by negative pressure adsorption.
Meanwhile, as shown in fig. 4, in the present embodiment, the jig moving platform includes a jig X-axis sliding table 307, a jig Z-axis sliding table 308 connected to the jig X-axis sliding table 307, a jig Y-axis sliding table 309 connected to the jig Z-axis sliding table 308, and a rotary mounting base 310 connected to the jig Y-axis sliding table 309, a Z-axis rotary platform 311 and a leveling rotary platform 312 connected to the Z-axis rotary platform 311 are disposed on the rotary mounting base 310, and the holding motor 302 is connected to the leveling rotary platform 312. Therefore, the component clamping part has the translational freedom degrees in three directions and the rotational freedom degrees in three directions, and can meet the requirements of material taking, transferring and coupling. The fixture X-axis sliding table 307, the fixture Z-axis sliding table 308, the fixture Y-axis sliding table 309, the Z-axis rotating platform 311, the flatting rotating platform 312 and the like all adopt precise motion platforms, and the coupling precision of each component is guaranteed.
Meanwhile, as shown in fig. 5, in this embodiment, the component loading assembly 200 includes a plurality of loading trays 201, the loading trays 201 are respectively used for loading different components, and a clamping groove 202 adapted to the shape of the corresponding component is formed in each loading tray 201. Consequently, different components and parts homoenergetic are placed in order in corresponding charging tray 201, and the gesture is stable, and the preliminary location when being convenient for components and parts centre gripping coupling assembly 300 gets the material, and the feasibility when guaranteeing follow-up coupling. It is understood that the number of the charging trays 201 corresponds to the focusing mirror 101, the reflection preventing plate 102, the first reflecting mirror 103, the polarization splitting prism 104, and the second reflecting mirror 105, and since the focusing mirror 101 is classified into a fast axis type and a slow axis type, and for the fast axis type, it is composed of two parts, six charging trays 201 are provided in total.
As shown in fig. 6, in the present embodiment, the laser housing positioning assembly 400 includes a laser housing positioning plate 401, and the laser housing positioning plate 401 is used to position the laser housing, so that the position of the laser housing relative to the laser housing positioning plate 401 during the coupling and packaging process is determined and is kept stable. The laser housing positioning plate 401 is disposed on the laser housing positioning seat 402. The laser housing positioning seat 402 is connected with the laser housing displacement module 403, and the laser housing displacement module 403 is used for driving the laser housing positioning seat 402 to move horizontally, so as to replace the laser housing, align different laser housings to a coupling position, and the like.
Based on the foregoing requirements of detecting light beams from three directions and the overall arrangement condition of the device, the coupling detection assembly is used for detecting light beams from two directions in the present embodiment, so that the laser housing positioning assembly needs to complete one 90-degree rotation adjustment. In this embodiment, the laser housing positioning plate 401 can rotate and be adjusted by 90 degrees relative to the laser housing positioning seat 402, and is convenient to arrange in a manual adjustment mode. Therefore, after the coupling packaging of the focusing mirror 101 and the anti-reflection plate 102 is completed, the coupling detection of the first reflecting mirror 103 can be continued only by rotating the laser housing positioning plate 401 by 90 degrees and repositioning the laser housing positioning plate on the laser housing positioning seat 402.
Of course, the laser housing positioning plate 401 may also be set to rotate automatically relative to the laser housing positioning seat 402, so that the semiconductor laser coupling package can be completed more automatically, which is used as a subsequent further optimization direction.
Referring to fig. 4 again, in the present embodiment, the dispensing curing assembly 500 includes a dispensing mechanism 501 and a UV curing mechanism 502, and both the dispensing mechanism 501 and the UV curing mechanism 502 are connected to the device clamping and coupling assembly 300, such as the rotary mounting base 310. When the component holding portion 301 moves to the coupling position for coupling, the dispensing mechanism 501 is located at one side for dispensing, and the dispensing mechanism 501 is moved to the dispensing position by moving the whole body in the subsequent dispensing operation. UV curing mechanism 502 includes two UV curing heads, and it is for chuck symmetric distribution in both sides, and the slope sets up, and is fixed through the UV installing support, carries out the UV solidification to point gluey position both sides, guarantees to heat evenly etc..
In this embodiment, since the coupling detection unit 600 needs to detect from two directions, a first coupling detection unit and a second coupling detection unit are provided. The first coupling detection component is used for coupling and packaging the focusing mirror 101, the anti-reflection plate 102 and the first reflecting mirror 103, and the second coupling detection component is used for coupling and packaging the polarization splitting prism 104 and the second reflecting mirror 105. It will be appreciated that the sensing directions of the first coupling sensing assembly and the second coupling sensing assembly are also at 90 degrees to each other.
In the embodiment, as shown in fig. 7, the first coupling detection assembly includes a first coupling detection camera 601 and a first periscope 602. Wherein, the first coupling inspection camera 601 and the first periscope 602 are both installed on the first coupling inspection base 603. The first coupling detection seat 603 is connected to the first coupling detection displacement module 604, and the first coupling detection displacement module 604 is used for driving the first coupling detection camera 601 to adjust the position and move the detection spot back and forth along the light path. Similarly, as shown in fig. 8, the second coupling detection module includes a second coupling detection camera 605 and a second periscope 606, the second coupling detection camera 605 and the second periscope 606 are both mounted on a second coupling detection seat 607, the second coupling detection seat 607 is connected to a second coupling detection displacement module 608, and the second coupling detection displacement module 608 is used for driving the second coupling detection camera 605 to adjust the position and move the detection spot back and forth along the optical path.
It should be noted that the first periscope 602 and the second periscope 606 are arranged to move the optical path upward in parallel to enter the first coupling detection camera 601 or the second coupling detection camera 605. Therefore, the bottom end of the periscope can be lowered to the height of the coupling position of the components in the coupling detection process, the coupling detection camera does not need to be lowered to the corresponding height, and collision and interference of other components on the laser shell positioning plate 401 are avoided.
In this embodiment, the X-axis sliding table 307 of the fixture of the component clamping and coupling assembly 600 is configured as a gantry, and also serves as an X-direction moving mechanism of the first coupling detection displacement module 604 and the second coupling detection displacement module 605. Therefore, the first coupling detection displacement module 604 and the second coupling detection displacement module 605 are provided with vertical motion mechanisms to control the periscope and the coupling detection camera to move up and down.
It should be noted that in the present embodiment, the coupling detection camera confirms the coupling accuracy by means of the light spot detection (in the prior art), and therefore both the first coupling detection camera 601 and the second coupling detection camera 602 need to be displaced back and forth with respect to the optical path. Specifically, in this embodiment, the front-back displacement of the first coupling detection camera 601 is completed by the front-back movement mechanism of the first coupling detection displacement module 604, and the front-back displacement of the second coupling detection camera 605 is completed by the clamp X-axis sliding table 307 directly, without setting a separate front-back movement mechanism.
By adopting the integrated multi-component coupling and packaging device provided by the embodiment, the laser shell is sequentially coupled and packaged with the focusing mirror 101, the anti-reflection sheet 102, the first reflecting mirror 103, the polarization splitting prism 104 and the second reflecting mirror 105, when the focusing mirror 101 and the anti-reflection sheet 102 are packaged, the emergent light is in the Y direction, and the coupling detection is directly finished by the first coupling detection component; then, the first reflector 103 is packaged, the laser housing positioning plate 401 is rotated by 90 degrees, the reflected light of the first reflector 103 is in the Y direction, and the coupling detection is still completed by the first coupling detection assembly; then, a polarization beam splitter 104 and a second reflecting mirror 105 are packaged, emergent light to be detected is in the X direction, and coupling detection is completed by means of a second coupling detection component. Therefore, the scheme comprehensively considers the operation automation degree and the module arrangement, designs a reasonable coupling packaging procedure, and ensures the orderly, efficient and reliable packaging of the semiconductor laser.
While the foregoing is directed to the preferred embodiment of the present invention, it will be understood by those skilled in the art that various changes and modifications may be made without departing from the spirit and scope of the invention as defined in the appended claims.
Claims (10)
1. The integrated multi-component coupling and packaging equipment is characterized by comprising a component loading assembly, a component clamping and coupling assembly, a laser shell positioning assembly, a dispensing and curing assembly and a coupling detection assembly; the component loading assembly is used for loading various components; the component clamping and coupling assembly is used for taking, moving and coupling components; the laser shell positioning assembly is used for positioning the laser shell and connecting the light emitting chip to a light outlet of the laser shell through an optical fiber; the dispensing curing assembly is used for dispensing and curing components; the coupling detection assembly comprises a light path guide mechanism and a camera detection mechanism, wherein the light path guide mechanism guides light through a plurality of reflector surfaces, and light emitted by different components is received by the camera detection mechanism when the different components are coupled so as to detect coupling precision.
2. The integrated multi-component coupling and packaging device according to claim 1, wherein the component clamping and coupling assembly comprises a component clamping portion, the component clamping portion is connected with a fixture moving platform, the fixture moving platform has a plurality of degrees of freedom of movement, and the component clamping portion can be clamped and positioned and can be subjected to negative pressure adsorption and positioning.
3. The integrated multi-component coupling and packaging device according to claim 2, wherein the component clamping portion comprises a clamping motor or a clamping cylinder, the clamping motor or the clamping cylinder is used for controlling two clamping arms which are oppositely arranged, and the tail ends of the clamping arms are chucks;
the chuck at least comprises a first clamping groove and a second clamping groove, the first clamping groove and the second clamping groove are arranged in a clinging manner, and the sizes of the first clamping groove and the second clamping groove are different so as to clamp different components; the chuck is also provided with a negative pressure adsorption hole, and the negative pressure adsorption hole is connected with a negative pressure end and used for generating a negative pressure adsorption component.
4. The integrated multi-component coupling and packaging device according to claim 1, wherein the component loading assembly comprises a plurality of loading trays, the loading trays are respectively used for loading different components, and clamping grooves matched with the shapes of the corresponding components are formed in the loading trays so as to enable the corresponding components to be stably placed.
5. The integrated multi-component coupling packaging device according to claim 1, wherein the laser housing positioning assembly comprises a laser housing positioning plate for positioning the laser housing, the laser housing positioning plate is disposed on a laser housing positioning seat, and the laser housing positioning plate can rotate and adjust an angle relative to the laser housing positioning seat; the laser shell positioning seat is connected with the laser shell displacement module, and the laser shell displacement module is used for driving the laser shell positioning seat to move horizontally.
6. The integrated multi-component coupling and packaging device according to claim 2, wherein the dispensing and curing assembly comprises a dispensing mechanism and a UV curing mechanism, and the dispensing mechanism and the UV curing mechanism are connected with the component clamping and coupling assembly.
7. The integrated multi-component coupling packaging device of claim 1, wherein the coupling detection assembly comprises a first coupling detection assembly and a second coupling detection assembly, the first coupling detection assembly is used for coupling packaging of the focusing mirror, the anti-reflection plate and the first reflection mirror, and the second coupling detection assembly is used for coupling packaging of the polarization splitting prism and the second reflection mirror.
8. The integrated multi-component coupling and packaging device according to claim 7, wherein the first coupling detection assembly comprises a first coupling detection camera and a first periscope, the first coupling detection camera and the first periscope are both mounted on a first coupling detection base, the first coupling detection base is connected with a first coupling detection displacement module, and the first coupling detection displacement module is configured to drive the first coupling detection camera to adjust a position and move the detection spot back and forth along the optical path.
9. The integrated multi-component coupling and packaging apparatus according to claim 8, wherein the second coupling detection assembly comprises a second coupling detection camera and a second periscope, the second coupling detection camera and the second periscope are both mounted on a second coupling detection base, the second coupling detection base is connected to a second coupling detection displacement module, and the second coupling detection displacement module is configured to drive the second coupling detection camera to adjust a position and move the detection spot back and forth along the optical path.
10. The integrated multi-component coupling and packaging device of claim 7, wherein the laser housing is sequentially coupled and packaged with a focusing mirror, an anti-reflection plate, a first reflecting mirror, a polarization beam splitter prism and a second reflecting mirror, when the focusing mirror and the anti-reflection plate are packaged, the emergent light is in the Y direction, and the coupling detection is directly completed by the first coupling detection component; then packaging the first reflector, rotating the positioning plate of the laser shell by 90 degrees to enable the reflected light of the first reflector to be in the Y direction, and completing coupling detection by the first coupling detection assembly; and then packaging the polarization beam splitter prism and the second reflector, wherein emergent light to be detected is in the X direction, and coupling detection is completed by the second coupling detection component.
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