CN115831827B - Wafer cleaning and drying device - Google Patents
Wafer cleaning and drying device Download PDFInfo
- Publication number
- CN115831827B CN115831827B CN202310107958.XA CN202310107958A CN115831827B CN 115831827 B CN115831827 B CN 115831827B CN 202310107958 A CN202310107958 A CN 202310107958A CN 115831827 B CN115831827 B CN 115831827B
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- sliding
- inner ring
- gear
- shell
- outer ring
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- 238000001035 drying Methods 0.000 title claims abstract description 23
- 238000004140 cleaning Methods 0.000 title claims abstract description 18
- 230000007246 mechanism Effects 0.000 claims abstract description 19
- 238000001704 evaporation Methods 0.000 abstract description 14
- 230000008020 evaporation Effects 0.000 abstract description 14
- 239000007921 spray Substances 0.000 abstract description 6
- 230000009467 reduction Effects 0.000 abstract description 2
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 18
- 239000007788 liquid Substances 0.000 description 13
- 230000000694 effects Effects 0.000 description 8
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 7
- 238000005507 spraying Methods 0.000 description 5
- 238000007789 sealing Methods 0.000 description 4
- 238000007664 blowing Methods 0.000 description 2
- 230000003993 interaction Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000003889 chemical engineering Methods 0.000 description 1
- 238000002485 combustion reaction Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 239000000446 fuel Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000010349 pulsation Effects 0.000 description 1
- 238000004088 simulation Methods 0.000 description 1
Images
Classifications
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Abstract
The invention relates to the technical field of object surface drying, in particular to a wafer cleaning and drying device, which comprises a spray header, wherein the spray header is provided with a shell communicated with an external air source, the shell is provided with a rotatable outer ring, the outer ring is rotationally provided with an inner ring, the outer ring is provided with a first vent hole which is obliquely arranged, the inner ring is provided with a second vent hole which is opposite to the first vent hole in the oblique direction, a driving mechanism for driving the outer ring and the inner ring to rotate relatively is arranged in the shell, the outer ring is provided with a first meshing tooth and the inner ring is provided with a second meshing tooth, the driving mechanism comprises a first gear matched with the first meshing tooth and a second gear meshed with the second meshing tooth, the first gear is fixedly connected with the second gear through a connecting rod, the connecting rod is slidingly provided with a sliding sleeve, the inner ring is provided with a blade which is driven to rotate through air flow, and the shell is provided with a push-pull mechanism for driving the sliding sleeve to slide so as to solve the technical problem of evaporation efficiency reduction caused by gas stagnation on the evaporation surface.
Description
Technical Field
The invention relates to the field of object surface drying, in particular to a wafer cleaning and drying device.
Background
When the object is surface dried, a single air outlet is usually used for blowing air to the target surface, but because the air flows on the target surface to enable the air close to the target surface area to be condensed and prevent evaporation of the liquid on the target surface, the air blown through the target surface is mostly not involved in the evaporation, so that the evaporation efficiency is lower, and water stains have a certain residual.
The prior art discloses a wafer cleaning and drying device, which is characterized in that the invention patent with the name of CN111092036B is entitled to a box body for cleaning a wafer, and the top of the box body is provided with an opening for the wafer to enter and exit the box body; the supporting mechanism is arranged in the box body and used for bearing the wafer, and the supporting mechanism can be lifted; and the spray pipe is arranged at the opening and used for spraying dry gas on the surface of the cleaned wafer. According to the wafer cleaning and drying device, the spraying pipe is arranged at the opening of the box body, and the spraying pipe is used for spraying drying gas on the cleaned wafer to dry the surface of the wafer. It will be appreciated that this approach exploits the marangoni effect, i.e., the surface tension gradient difference, to remove water adhering to the wafer surface; however, the shower pipe disclosed in the publication is also dried by adopting a convection blowing mode, and gas near the surface area of the wafer is also condensed to prevent evaporation of surface liquid, so that the evaporation efficiency is low, and certain water stain remains.
The prior art discloses a numerical simulation of turbulent flow in a coaxial jet swirling combustion chamber and a prior art disclosed in chemical engineering journal volume 52, which describes that 'interaction exists between coaxial rotary jet to achieve the adjustment of an aerodynamic field and a fuel concentration field', and concretely describes that 'a peak value of pulsation speed appears near an interface area of two jet flows due to the interaction of the two rotary jet flows', and the physical model disclosed in the prior art is utilized to solve the problem of evaporation efficiency reduction caused by evaporation surface gas stagnation in the prior art.
Disclosure of Invention
The invention provides a wafer cleaning and drying device, which aims to solve the technical problem of reduced evaporation efficiency caused by gas stagnation on the evaporation surface.
The wafer cleaning and drying device adopts the following technical scheme: the spray head is provided with a shell communicated with an external air source, the shell is provided with a rotatable outer ring, the outer ring is rotationally provided with an inner ring, the outer ring is provided with a first exhaust hole which is obliquely arranged, the inner ring is provided with a second exhaust hole which is opposite to the first exhaust hole in the oblique direction, and a driving mechanism for driving the outer ring and the inner ring to rotate relatively is arranged in the shell.
Further, the outer ring is provided with first meshing teeth, the inner ring is provided with second meshing teeth, the driving mechanism comprises a first gear matched with the first meshing teeth and a second gear meshed with the second meshing teeth, the first gear is fixedly connected with the second gear through a connecting rod, the connecting rod is slidably provided with a sliding sleeve, the inner ring is provided with blades driven to rotate through air flow, and the shell is provided with a push-pull mechanism for driving the sliding sleeve to slide.
Further, the push-pull mechanism comprises a first sliding rail fixedly connected with the shell, the sliding sleeve is provided with a first sliding block in sliding fit with the first sliding rail, the sliding sleeve is rotationally connected with the first sliding block, and the first sliding rail is provided with a push-pull rod for driving the first sliding block to slide along the first sliding rail.
Further, when the first sliding block is located at the middle position of the connecting rod, the push-pull rod is of the extending limit length.
Further, the periphery of the outer ring is provided with a ring groove, and the shell is provided with a convex edge which is in running fit with the sliding groove.
Further, the shell is provided with a second sliding block, the second sliding block is provided with a second sliding rail in a sliding fit manner, and the second sliding rail is provided with a push-pull cylinder for pushing and pulling the second sliding block.
Further, the outer sides of the blades are fixedly connected with the inner ring so as to reduce vibration of the blades.
Further, the shell is provided with an air inlet.
The beneficial effects of the invention are as follows: when the driving mechanism of the wafer cleaning and drying device enables the outer ring and the inner ring to rotate relatively, the rotation directions of the inner ring and the outer ring are opposite, and the inclination directions of the first vent hole and the second vent hole are opposite, so that the first vent hole forms a forward rotating cyclone, the second vent hole forms a reverse rotating cyclone, the critical area of the forward rotating cyclone and the reverse rotating cyclone breaks the thermal boundary layer and the speed boundary layer, and the critical area of the forward rotating cyclone and the reverse rotating cyclone breaks the tension of liquid on the wafer surface at the critical area so as to enable the liquid distribution to be flatter, the critical area of the forward rotating cyclone and the reverse rotating cyclone has a faster evaporation effect, the liquid on the wafer surface can be evaporated quickly, and the water stain on the wafer surface is avoided.
Drawings
In order to more clearly illustrate the embodiments of the invention or the technical solutions of the prior art, the drawings which are used in the description of the embodiments or the prior art will be briefly described, it being obvious that the drawings in the description below are only some embodiments of the invention, and that other drawings can be obtained according to these drawings without inventive faculty for a person skilled in the art.
Fig. 1 is a schematic structural view of a showerhead according to the present invention.
Fig. 2 is a front view of the showerhead of fig. 1.
Fig. 3 is a cross-sectional view of the showerhead of fig. 2.
Fig. 4 is an isometric view of the showerhead of fig. 3 in cross-section.
Fig. 5 isbase:Sub>A cross-sectional view of fig. 2 taken alongbase:Sub>A-base:Sub>A.
Figure 6 is an isometric view of the showerhead of figure 5 in cross-section.
Fig. 7 is a cross-sectional view of another angle of the showerhead.
In the figure: 1. a spray header; 2. a housing; 3. an outer ring; 4. an inner ring; 5. a first exhaust hole; 6. a second exhaust hole; 7. a first engagement tooth; 8. a second meshing tooth; 9. a first gear; 10. a second gear; 11. a connecting rod; 12. a sliding sleeve; 13. a blade; 14. a first slide rail; 15. a first slider; 16. a push-pull rod; 17. a ring groove; 18. a convex edge; 19. a second slider; 20. a second slide rail; 21. an air inlet.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
In embodiment 1 of the wafer cleaning and drying device of the present invention, the main invention point of the wafer cleaning and drying device is located at the shower head, and the other structures are similar to those disclosed in the prior art, for example, the invention is named a wafer cleaning and drying device, and the invention patent with the grant notice number CN111092036B, so that the existing structures except the shower head are not repeated; as shown in fig. 1 to 7, the shower head 1 comprises a shower head 1, wherein the shower head 1 is provided with a shell 2 communicated with an external air source, the shell is provided with a rotatable outer ring 3, a sealing ring is arranged between the shell and the outer ring to realize a rotary sealing effect, the outer ring is rotationally provided with an inner ring 4, the outer ring and the inner ring are also rotationally sealed through the sealing ring, the outer ring is provided with a first air exhaust hole 5 which is obliquely arranged, the inner ring is provided with a second air exhaust hole 6 which is obliquely opposite to the first air exhaust hole, one end of the first air exhaust hole 5 and one end of the second air exhaust hole 6 are communicated with the outside, the other end of the second air exhaust hole is communicated with an inner cavity of the shell, and a driving mechanism for driving the outer ring and the inner ring to relatively rotate is arranged in the shell. When the driving mechanism enables the outer ring and the inner ring to rotate relatively, the rotation directions of the inner ring and the outer ring are opposite, and the inclination directions of the first exhaust hole 5 and the second exhaust hole 6 are opposite, so that the first exhaust hole 5 forms a forward rotating cyclone, the second exhaust hole 6 forms a reverse rotating cyclone, the critical area of the forward rotating cyclone and the reverse rotating cyclone breaks the thermal boundary layer and the speed boundary layer, and meanwhile, the critical area of the forward rotating cyclone and the reverse rotating cyclone breaks the tension of liquid on the wafer surface at the critical area so that the liquid distribution is flatter, the critical area of the forward rotating cyclone and the reverse rotating cyclone has a faster evaporation effect, the liquid on the wafer surface can be evaporated quickly, and the water stain on the wafer surface is avoided.
The outer ring is provided with a first meshing tooth 7, the inner ring is provided with a second meshing tooth 8, the driving mechanism comprises a first gear 9 matched with the first meshing tooth and a second gear 10 meshed with the second meshing tooth, the first gear and the second gear are fixedly connected through a connecting rod 11, the connecting rod is slidably provided with a sliding sleeve 12, the inner ring is provided with a blade 13 driven to rotate through air flow, and the shell is provided with a push-pull mechanism for driving the sliding sleeve to slide. When the air flow passes through the inner ring, the air flow drives the blades 13 to rotate, the blades 13 drive the inner ring 4 to rotate, the inner ring 4 drives the second gear 10 to rotate, the second gear 10 drives the first gear 9 to rotate through the connecting rod 11, and the first gear 9 finally drives the outer ring to reversely rotate relative to the inner ring.
The push-pull mechanism comprises a first slide rail 14 fixedly connected with the shell, a first slide block 15 which is in sliding fit with the first slide rail is arranged on the slide sleeve, the slide sleeve is rotationally connected with the first slide block, and a push-pull rod 16 which drives the first slide block to slide along the first slide rail is arranged on the first slide rail. When the first sliding block is positioned at the middle position of the connecting rod, the push-pull rod is of an extending limit length. Because the first slider is located the connecting rod intermediate position, first gear 9, second gear 10 can revolve around first slider, therefore the relative rotational speed between outer loop 3, the inner ring 4 is lower this time, can stretch out limit length with the push-and-pull rod when spraying high concentration IPA (isopropyl alcohol) and N2 mixed steam that forms to the wafer surface, the liquid that the tension is little is pulled to the liquid that the tension is big this moment under marangoni effect to make the thickness that the wafer surface liquid remained more even, then pulls first slider and leave connecting rod central point, and the relative rotational speed between outer loop 3, the inner ring 4 promotes this time, further promotes the drying effect.
In other embodiments, unlike the above embodiments, the outer ring has a ring groove 17 on its outer periphery, the housing has a flange 18 in rotation fit with the chute, the ring groove and the gorgeous fit not only achieve a rotation fit relationship, but also facilitate the realization of a sealing effect, and the outer ring 3 and the inner ring 4 also adopt such a connection relationship, and a ball bearing is disposed between the flange 18 and the outer ring 3 to reduce friction. The shell is provided with a second slide block 19, the second slide block is in sliding fit with a second slide rail 20, and the second slide rail 20 is provided with a push-pull cylinder for pushing and pulling the second slide block 19, so that the shower head is mainly moved relative to the surface of the wafer, and the problem that the shower head can only jet air in a fixed area of the surface of the wafer to cause inconsistent drying rate of the surface of the wafer is avoided. The outside of the blade is fixedly connected with the inner ring to reduce the vibration of the blade, the blade is driven to rotate in a fluid shaftless pushing mode, the outside of the blade is fixed with the inner ring, so that the vibration is small, the flow section of the inside of the blade is small, the vibration caused by water flow impact is also small, and the vibration of the blade is generally reduced. The housing is provided with an air inlet 21.
When the device is used, the push-pull cylinder is started to enable the second slide block 19 to reciprocate on the second slide rail 20, at the moment, the spray header horizontally moves repeatedly on the surface of a wafer, the first slide block is firstly positioned in the middle of the connecting rod, at the moment, the first gear 9 and the second gear 10 can revolve around the first slide block, at the moment, the relative rotating speed between the outer ring 3 and the inner ring 4 is lower, firstly, high-concentration IPA (isopropyl alcohol) and N2 mixed steam is sprayed on the surface of the wafer, and the IPA (isopropyl alcohol) is quickly diffused to the periphery after contacting the water surface because of low surface tension, so that a liquid layer with thinner and uniform thickness is formed; and then the first sliding block is pulled to leave the center of the connecting rod, at the moment, the relative rotating speed between the outer ring 3 and the inner ring 4 is increased, and the critical areas of the formed forward rotating cyclone and the reverse rotating cyclone destroy the thermal boundary layer and the speed boundary layer, so that the evaporation effect is improved to quickly dry the liquid on the surface of the wafer.
The foregoing description of the preferred embodiments of the invention is not intended to be limiting, but rather is intended to cover all modifications, equivalents, alternatives, and improvements that fall within the spirit and scope of the invention.
Claims (6)
1. The utility model provides a wafer washs drying device, includes shower head (1), shower head (1) are equipped with casing (2) with external air supply intercommunication, its characterized in that: the casing (2) is equipped with rotatable outer loop (3), outer loop (3) rotate and are equipped with inner ring (4), and the rotation direction is opposite between inner loop and the outer loop, outer loop (3) are equipped with first exhaust hole (5) that the slope set up, inner ring (4) are equipped with second exhaust hole (6) opposite with first exhaust hole (5) slope direction, be equipped with the drive outer loop (3), inner loop (4) relative pivoted actuating mechanism in casing (2), outer loop (3) are equipped with first meshing tooth (7), inner loop (4) are equipped with second meshing tooth (8), actuating mechanism include with first meshing tooth (7) complex first gear (9), with second meshing tooth (8) second gear (10) meshing, through connecting rod (11) fixed connection between first gear (9) and the second gear (10), connecting rod (11) slide and be equipped with sliding sleeve (12), inner ring (4) are equipped with rotatory blade (13) through the air current drive, casing (2) are equipped with sliding mechanism of drive sliding sleeve (12).
2. The wafer cleaning and drying apparatus according to claim 1, wherein: the sliding mechanism comprises a first sliding rail (14) fixedly connected with the shell (2), a first sliding block (15) in sliding fit with the first sliding rail (14) is arranged on the sliding sleeve (12), the sliding sleeve (12) is rotationally connected with the first sliding block (15), and a sliding rod (16) for driving the first sliding block (15) to slide along the first sliding rail (14) is arranged on the first sliding rail (14).
3. The wafer cleaning and drying apparatus according to claim 2, wherein: when the first sliding block (15) is positioned at the middle position of the connecting rod (11), the push-pull rod (11) is of an extending limit length.
4. A wafer cleaning and drying apparatus according to claim 3, wherein: the periphery of the outer ring (3) is provided with a ring groove (17), and the shell (2) is provided with a convex edge (18) which is in running fit with the ring groove (17).
5. The wafer cleaning and drying apparatus according to claim 4, wherein: the shell (2) is provided with a second sliding block (19), the second sliding block (19) is provided with a second sliding rail (20) in sliding fit, and the second sliding rail (20) is provided with a push-pull cylinder for pushing and pulling the second sliding block (19).
6. The wafer cleaning and drying apparatus according to claim 5, wherein: the outer sides of the blades (13) are fixedly connected with the inner ring (4) so as to reduce vibration of the blades (13).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310107958.XA CN115831827B (en) | 2023-02-14 | 2023-02-14 | Wafer cleaning and drying device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310107958.XA CN115831827B (en) | 2023-02-14 | 2023-02-14 | Wafer cleaning and drying device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN115831827A CN115831827A (en) | 2023-03-21 |
| CN115831827B true CN115831827B (en) | 2023-04-21 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202310107958.XA Active CN115831827B (en) | 2023-02-14 | 2023-02-14 | Wafer cleaning and drying device |
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| Country | Link |
|---|---|
| CN (1) | CN115831827B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116053189B (en) * | 2023-03-29 | 2023-07-04 | 苏州智程半导体科技股份有限公司 | Wafer washs with rotatory positioning equipment |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004095880A (en) * | 2002-08-30 | 2004-03-25 | Fujitsu Ltd | Non-contact spin drying method and non-contact spin drying device |
| JP5143689B2 (en) * | 2007-09-27 | 2013-02-13 | シャープ株式会社 | Vapor phase growth apparatus and semiconductor device manufacturing method |
| JP2010045407A (en) * | 2009-11-24 | 2010-02-25 | Tokyo Electron Ltd | Gas supply member and plasma processing apparatus |
| JP5801109B2 (en) * | 2011-06-17 | 2015-10-28 | 株式会社ブリヂストン | Cleaning nozzle |
| US10302059B2 (en) * | 2017-01-24 | 2019-05-28 | Caterpillar Inc. | Filter for a fuel injector |
| CN107376170A (en) * | 2017-08-17 | 2017-11-24 | 江苏南亚门窗有限公司 | A kind of fire fighting pressurization sprinkler head |
| CN215612422U (en) * | 2021-04-25 | 2022-01-25 | 杨军 | Shower nozzle |
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| CN115831827A (en) | 2023-03-21 |
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Address after: 225500 No. 151, Keji Avenue, Sanshui street, Jiangyan District, Taizhou City, Jiangsu Province Patentee after: Jiangsu Yadian Technology Co.,Ltd. Address before: 225500 No. 151, Keji Avenue, Sanshui street, Jiangyan District, Taizhou City, Jiangsu Province Patentee before: Jiangsu Yadian Technology Co.,Ltd. |
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