CN115823776A - Subcooler, automatically controlled box and air conditioning system - Google Patents

Abstract

The application discloses a subcooler, an electric control box and an air conditioning system, wherein the subcooler comprises a collecting pipe assembly, a heat dissipation plate and a laminated assembly; the collecting pipe assembly comprises a first collecting pipe and a second collecting pipe; the stacking assembly comprises at least one first flat pipe and at least one second flat pipe which are stacked, the first flat pipe is communicated with the first collecting pipe, and the second flat pipe is communicated with the second collecting pipe; the surface of the heat dissipation plate facing the laminated assembly is provided with a clamping groove, and the laminated assembly is clamped in the clamping groove. By the scheme, the heat dissipation efficiency of the subcooler can be improved, and the subcooling of the refrigerant flow can be realized.

Description

Subcooler, automatically controlled box and air conditioning system

Technical Field

The application relates to the technical field of air conditioners, in particular to a subcooler, an electric control box and an air conditioning system.

Background

The refrigerant circulating system for the air conditioner generally adopts an economizer to increase the supercooling degree of an outlet of a condenser, improve the refrigerating capacity of a unit mass refrigerant and improve the capacity and the energy efficiency of a refrigerating system. In addition, the subcooler can be applied to heat dissipation based on the function of the subcooler, and can be generally divided into space heat dissipation and local heat dissipation. The space heat dissipation is mainly combined with a fan to perform fin heat dissipation, and the local heat dissipation is mainly realized by directly connecting the subcooler and the heating device through an aluminum plate and utilizing heat conduction. But the existing subcoolers have low heat dissipation efficiency.

Disclosure of Invention

The application at least provides a subcooler, automatically controlled box and air conditioning system to improve the radiating efficiency of subcooler.

A first aspect of the present application provides a subcooler including a header assembly, a heat dissipation plate, and a stack assembly;

the collecting pipe assembly comprises a first collecting pipe and a second collecting pipe;

the stacking assembly comprises at least one first flat pipe and at least one second flat pipe which are stacked, the first flat pipe is communicated with the first collecting pipe, and the second flat pipe is communicated with the second collecting pipe;

the surface of the heat dissipation plate facing the laminated assembly is provided with a clamping groove, and the laminated assembly is clamped in the clamping groove.

The first collecting pipe is used for providing a first refrigerant flow for the first flat pipe and/or collecting the first refrigerant flow flowing through the first flat pipe, and the second collecting pipe is used for providing a second refrigerant flow for the second flat pipe and/or collecting the second refrigerant flow flowing through the second flat pipe, so that heat exchange is carried out between the first refrigerant flow flowing through the first flat pipe and the second refrigerant flow flowing through the second flat pipe.

The central axis of at least one of the first collecting pipe and the second collecting pipe is intersected with the flat surface of at least one of the first flat pipe and the second flat pipe.

The heat dissipation plate is connected with at least two faces of the laminated assembly, and the at least two faces face different directions of the first flat pipe.

The clamping groove is formed by two clamping plates, the stacked assembly is clamped between the two clamping plates, and the clamping plates cover at least part of flat surfaces of the stacked assembly.

The collecting pipe assembly comprises a main collecting pipe and a flow isolating plate, wherein the flow isolating plate is arranged in the main collecting pipe, so that the main collecting pipe is arranged into a first collecting pipe and a second collecting pipe which are separated by the flow isolating plate.

Wherein, total collecting pipe sets to by flow partition board divided first collecting pipe and second collecting pipe, and first flat pipe runs through the lateral wall of total collecting pipe and inserts in first collecting pipe, and the second flat pipe runs through the lateral wall of total collecting pipe and flow partition board and inserts in the second collecting pipe, perhaps the second flat pipe runs through the lateral wall of total collecting pipe and inserts in the second collecting pipe, and first flat pipe runs through the lateral wall of total collecting pipe and flow partition board and inserts in first collecting pipe.

Wherein, first pressure manifold and second pressure manifold set up along the length direction interval of first flat pipe.

The first flat pipe and the second flat pipe are stacked, and the end part of the first flat pipe is communicated with the first collecting pipe; the second flat pipe penetrates through the first collecting pipe, and the end part of the second flat pipe is communicated with the second collecting pipe.

Wherein, the tip separation setting of the first flat pipe of range upon range of setting and the flat pipe of second.

Wherein, first pressure manifold and second pressure manifold set up along the vertical direction interval of first flat tub of extending direction.

Wherein, the flat pipe range upon range of setting of first flat pipe and second, and the tip of the flat pipe of tip and the second of first flat pipe separates in the vertical direction in order to be connected to first pressure manifold and second pressure manifold respectively.

Wherein, first flat pipe and the alternative range upon range of setting of second flat pipe in the range upon range of subassembly.

Wherein, first flat pipe includes a plurality of first microchannels, and the flat pipe of second includes a plurality of second microchannels.

The second aspect of the present application provides an electric control box, which comprises a box body and the subcooler, wherein the subcooler is connected with the box body.

A third aspect of the present application provides an air conditioning system including the subcooler described above.

The beneficial effect of this application is: in the subcooler, the heat dissipation plate in the subcooler is connected with at least two surfaces of the laminated assembly, wherein the at least two surfaces face different directions of the first flat tube, so that the heat dissipation plate is attached to at least two surfaces of at least one flat tube in the laminated assembly, the heat exchange area of the heat dissipation plate is effectively increased, and the heat dissipation efficiency of the subcooler is improved; and range upon range of subassembly is including range upon range of at least one first flat pipe and at least one flat pipe of second that sets up, first flat pipe and the first pressure manifold intercommunication in the pressure manifold subassembly, the flat pipe of second in the pressure manifold subassembly circulate, first flat pipe and the flat pipe range upon range of setting of second are like this and are communicate with the pressure manifold of difference respectively, make the coolant stream in the flat pipe of first flat pipe of flowing through and the flat pipe of second can absorb the heat to the coolant stream in the flat pipe of another one of first flat pipe of flowing through and second, so that the coolant stream in the flat pipe of first flat pipe of flowing through and the flat pipe of second realizes the subcooling, can realize the subcooling of coolant stream.

It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the application.

Drawings

The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present application and, together with the description, serve to explain the principles of the application.

FIG. 1 is a schematic view of a subcooler according to an embodiment of the present application;

FIG. 2 is a schematic view of a subcooler according to another embodiment of the present application;

FIG. 3 is an enlarged schematic view of area A of FIG. 2;

fig. 4 is a schematic structural view of the heat radiating plate of fig. 2;

FIG. 5 is a schematic structural view of the first flat tube in FIG. 2;

FIG. 6 is a schematic diagram of the configuration of an embodiment of a header assembly of the subcooler of FIG. 2;

FIG. 7 is a schematic block diagram of another embodiment of a header assembly of the subcooler of FIG. 2;

FIG. 8 is a schematic view of a subcooler according to another embodiment of the present application;

FIG. 9 is a schematic structural view of a stacked assembly according to an embodiment of the present application;

FIG. 10 is a schematic structural diagram of an electronic control box according to an embodiment of the present application;

fig. 11 is a schematic structural diagram of an air conditioning system according to an embodiment of the present application.

Detailed Description

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

Reference herein to "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of the application. The appearances of the phrase in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. It is explicitly and implicitly understood by one skilled in the art that the embodiments described herein can be combined with other embodiments.

In subcooler 1 of fig. 1, subcooler 1 includes flat pipe 11, pressure manifold 13 and heating panel 12, and wherein heating panel 12 sets up on flat pipe 11 surface and paints heat dissipation silica gel reinforcing heat conduction at the two contact surface, and heating panel 12 only laminates mutually with a surface of flat pipe 11 like this, has restricted heating panel 12's heat transfer area to a great extent, and subcooler 1 radiating efficiency is low, and structure, form and service function are also comparatively single. In addition, the surface of the heat dissipation plate 12 may be provided with electronic components to dissipate heat of the electronic components through the heat dissipation plate 12.

Based on this, this application provides a subcooler, and the at least two faces of heating panel and stack assembly link to each other in this subcooler, and wherein two at least faces are towards the not equidirectional of first flat pipe, and two at least surfaces of at least one flat pipe are laminated mutually in heating panel and the stack assembly like this, have increased the heat transfer area of heating panel effectively, have improved the radiating efficiency of subcooler.

As shown in fig. 2, fig. 2 is a schematic structural diagram of an embodiment of the subcooler 2 of the present application. The subcooler 2 of the present embodiment includes a header assembly, a plurality of stacked assemblies, and a heat dissipation plate 25.

As shown in fig. 2, the heat dissipation plate 25 may be connected to at least two surfaces of the stacked assembly, and the at least two surfaces face different directions, so that the heat dissipation plate 25 is attached to at least two surfaces of at least one flat tube in the stacked assembly, thereby effectively increasing the heat exchange area of the heat dissipation plate 25 and improving the heat dissipation efficiency of the subcooler 2.

As shown in fig. 3 and 4, a clamping groove 252 may be formed on the surface of the heat dissipation plate 25 facing the stacked assembly, and the stacked assembly is clamped in the clamping groove 252, so that the heat dissipation plate 25 may be connected to at least two surfaces of the stacked assembly by inserting the stacked assembly into the clamping groove 252 of the heat dissipation plate 25, thereby increasing the heat exchange area of the heat dissipation plate 25, improving the heat exchange efficiency of the subcooler 2, and satisfying the local heat dissipation requirement during the subcooler 2; the clamping grooves 252 can be used for limiting the distance between the stacked components, and improving the precision of the subcooler 2 in the welding process and the manufacturability in the assembling process; and when flat tub width direction is parallel with the pressure manifold extension line, heating panel 25 also can be connected with range upon range of subassembly to be used for the electronic component heat dissipation.

The depth of the clamping groove 252 may be equal to the width of the laminated assembly (may be equal to the width of the first flat tube 23 or the second flat tube 24), that is, the clamping groove 252 may cover the flat surface of the flat tube connected thereto in the laminated assembly, so as to greatly increase the heat exchange area of the heat dissipation plate 25. In other embodiments, the depth of the locking groove 252 may be greater than or less than the width of the laminated assembly, that is, the locking groove 252 may cover a part of the flat surface of the flat tube connected thereto in the laminated assembly, which is not limited herein.

The width of the clamping groove 252 can be equal to the thickness of the laminated assembly, so that the laminated assembly can be just clamped in the clamping groove 252, the fitting degree of the laminated assembly and the clamping groove 252 is improved, and the precision of the subcooler 2 in the welding process and the manufacturability in the assembling process are improved.

The cross section of the clamping groove 252 arranged on the heat dissipation plate 25 can be matched with the cross section of the laminated assembly, so that the laminated assembly can be effectively attached to the inner wall of the clamping groove 252, and the heat exchange efficiency is improved. In one embodiment, the heat sink 25 has a rectangular cross-section of the slot 252, so that the heat sink 25 can be attached to three sides of the stacked assembly to increase the heat exchange area of the heat sink 25. Of course, in other embodiments, the cross section of the slot 252 disposed on the heat dissipation plate 25 may also be triangular or circular, and may be specifically disposed according to the shape of the cross section of the stacked assembly, which is not limited herein.

Alternatively, the stacked assembly may be snapped into the snap groove 252 by welding or the like.

Alternatively, the card slot 252 may be formed by two card boards 251, and the distance between the two card boards 251 is the thickness of the stacked assembly, so that the stacked assembly can be clamped between the two card boards 251.

The stack comprises at least one first flat tube 23 and at least one second flat tube 24.

As shown in fig. 5, the first flat tube 23 may be provided with at least one first microchannel 231, and the extending direction of the first microchannel 231 is substantially consistent with the length direction L of the first flat tube 23, so that the refrigerant flow can flow in the at least one first microchannel 231 in the first flat tube 23. The refrigerant flow flowing through the first flat tube may also be referred to as a first refrigerant flow.

Similarly, at least one second microchannel is also disposed in the second flat tube 24, and the extending direction of the second microchannel is substantially consistent with the length direction of the second flat tube 24, so that the refrigerant flow can flow in the at least one second microchannel in the second flat tube 24. The refrigerant flow flowing through the second flat tube may also be referred to as a second refrigerant flow.

The first flat pipe 23 and the second flat pipe 24 can be cuboids. In other embodiments, the first flat tube 23 and the second flat tube 24 may also be carriers with cross sections of other shapes, such as cylinders or cubes.

In the stacked assembly, the number of the first flat tubes 23 and the number of the second flat tubes 24 are not limited, and may be specifically set according to factors such as heat exchange amount requirements, for example, 1, 3, and 8.

Wherein, the range upon range of setting of at least one first flat pipe 23 and at least one second flat pipe 24, have at least one in the range upon range of subassembly and the first flat pipe 23 of the laminating of second flat pipe 24 surface looks laminating like this to the coolant stream in one of first flat pipe 23 and the second flat pipe 24 of flowing through can absorb heat the coolant stream in another one of the convection current through first flat pipe 23 and the second flat pipe 24, so that the coolant stream in another one of the first flat pipe 23 of flowing through and the second flat pipe 24 realizes the subcooling.

Further, at least one first flat tube 23 and at least one second flat tube 24 may be alternately stacked, for example, the stacked assembly may be the first flat tube 23, the second flat tube 24, the first flat tube 23, or the stacked assembly may be the second flat tube 24, the first flat tube 23, the second flat tube 24, the first flat tube 23. Because the laminated assembly has two ineffective heat exchange surfaces contacting with air, the number of the laminated assembly can be reduced by increasing the number of the flat pipes in the laminated assembly to increase the number of the flat pipes in the laminated assembly, so as to increase the utilization rate of the heat exchange surfaces, in other embodiments, a plurality of first flat pipes 23 or a plurality of second flat pipes 24 can be continuously arranged in the laminated assembly, wherein the continuously arranged number of the first flat pipes 23 or the second flat pipes 24 can be set according to the actual heat exchange quantity requirement, and is not limited herein, for example, the laminated assembly can be the first flat pipes 23-the second flat pipes 24-the first flat pipes 23, or the laminated assembly can be the first flat pipes 23-the second flat pipes 24-the first flat pipes 23.

Optionally, the flat surface 232 of the first flat tube 23 in the stacked assembly may be parallel to the flat surface 241 of the second flat tube 24, the flat surface 232 of the first flat tube 23 may be a surface with a largest area in the first flat tube 23, and the flat surface 241 of the second flat tube 24 may be a surface with a largest area in the second flat tube 24, so that the contact area between the first flat tube 23 and the second flat tube 24 is large, and the heat exchange efficiency between the first flat tube 23 and the second flat tube 24 in the stacked assembly may be improved; compared with the scheme that the minimum area surface of the first flat pipe 23 is parallel to the minimum area surface of the second flat pipe 24, the surface area of the laminated assembly formed by the first flat pipe 23 and the second flat pipe 24 is smaller, more laminated assemblies can be arranged in the subcooler 2 under the condition that the volume of the subcooler 2 is the same, and the heat exchange efficiency of the subcooler 2 is further improved. In other embodiments, the flat surfaces 232 of the first flat tubes 23 may not be parallel to the flat surfaces 241 of the second flat tubes 24 in the stacked assembly.

The manifold assembly may include a first manifold 21 in communication with a first flat tube 23 and a second manifold 22 in communication with a second flat tube 24.

The central axis of at least one of the first header 21 and the second header 22 intersects the flat surface of at least one of the first flat tube 23 and the second flat tube 24. The method specifically comprises the following steps: the flat surface 232 of the first flat tube 23 intersects with the central axis X' of the first collecting tube 21, the flat surface 232 of the first flat tube 23 intersects with the central axis X of the second collecting tube 22, and/or the flat surface 241 of the second flat tube 24 intersects with the central axis X of the second collecting tube 22. That is, the central axis X 'of the first collecting pipe 21 is not parallel to the flat surface 232 of the first flat pipe 23, the central axis X' of the first collecting pipe 21 is not parallel to the flat surface 241 of the second flat pipe 24, and/or the central axis X of the second collecting pipe 22 is not parallel to the flat surface 241 of the second flat pipe 24. Because the thickness H of the flat pipe is smaller than the width W of the flat pipe (even much smaller than the width W of the flat pipe), more flat pipes can be arranged on the collecting pipe with the same length, and the space utilization rate of the subcooler 2 is improved; compared with the scheme that the flat surfaces of the stacked assembly are approximately parallel to the central axis of the collecting pipe assembly, the stacked design of the multiple layers of flat pipes is easier to realize on the basis of not increasing the pipe diameter of the collecting pipe, so that the utilization rate of a heat exchange area is improved.

Specifically, a central axis of at least one of the first collecting pipe 21 and the second collecting pipe 22 intersects with a flat surface of at least one of the first flat pipe 23 and the second flat pipe 24, and an included angle range of the intersection may be (0, 180 °). Specifically, an included angle between a central axis of at least one of the first header 21 and the second header 22 and a flat surface of at least one of the first flat pipe 23 and the second flat pipe 24 may be 30 °, 60 °, 90 °, 120 °, or 150 °, which is not limited herein; of course, the included angle of the intersection is generally between 80 ° and 90 °, so that more paths of the first flat tube 23 and the second flat tube 24 are arranged, and the utilization rate of the heat exchange area is further improved.

Preferably, the central axis X' of the first collecting pipe 21 is perpendicular to the flat surface 232 of the first flat pipe 23, the central axis X of the second collecting pipe 22 is perpendicular to the flat surface 241 of the second flat pipe 24, and more paths of the first flat pipe 23 and the second flat pipe 24 can be maximally arranged along the central axis direction of the collecting pipe assembly, so that the space utilization rate of the collecting pipe assembly in the length direction is fully improved. Simultaneously, because the axis X' of first pressure manifold 21 is perpendicular to the planum 232 of first flat pipe 23, the axis X of second pressure manifold 22 is perpendicular to the planum 241 of the flat pipe 24 of second, the mounting hole of first flat pipe 23 and the flat pipe 24 of second on the pressure manifold subassembly is for transversely punching a hole, but make full use of pressure manifold pipe wall material realizes the turn-ups degree of depth that punches a hole to area of contact when increase pressure manifold and flat pipe welding improves the compressive strength of solder joint. Meanwhile, it needs to be noted that the punching and welding process in the embodiment of the application is consistent with the existing mature scheme, complex operation processes are not needed, and the process is simple. The embodiment of the application improves the production feasibility and the reliability of the subcooler 2 on the basis of optimizing the integral structure of the subcooler 2.

Wherein, be provided with first mass flow channel in the first pressure manifold 21, at least one microchannel and first mass flow channel intercommunication in the first flat pipe 23 to provide the refrigerant flow and/or collect the refrigerant flow that flows through first microchannel 231 to first microchannel 231 through first mass flow channel. In the present embodiment, the number of the first collecting pipes 21 is two, and the two first collecting pipes 21 are respectively communicated with two ends of the first micro-channel 231, so as to provide a refrigerant flow to the first micro-channel 231 by using one of the two first collecting pipes 21; and the other of the two first headers 21 is used to collect the first refrigerant flow passing through the first microchannels 231.

A second collecting channel is arranged in the second collecting pipe 22, and at least one microchannel in the second flat pipe 24 can be communicated with the second collecting channel to provide a refrigerant flow to the second microchannel through the second collecting channel and/or collect the refrigerant flow flowing through the second microchannel. In this embodiment, the number of the second collecting pipes 22 is two, and the two second collecting pipes 22 are respectively communicated with two ends of the second microchannel, so as to provide a refrigerant flow to the second microchannel by using one of the two second collecting pipes 22; and the other of the two second headers 22 is used to collect the refrigerant flow passing through the second microchannels.

In an embodiment, the same end of all the first flat tubes 23 in the subcooler 2 is connected with the same first collecting pipe 21, and the same end of all the second flat tubes 24 in the subcooler 2 is connected with the same second collecting pipe 22, so that each microchannel is prevented from being provided with a corresponding collecting pipe, and the cost is reduced.

In the embodiment shown in fig. 2, the long axis X of the first collecting pipe 21 and the long axis X of the second collecting pipe 22 may be substantially parallel to each other based on the condition that the length direction of the first flat pipe 23 is substantially parallel to the length direction of the second flat pipe 24. However, in other embodiments, the long axis X of the first header 21 and the long axis X of the second header 22 may be adjusted according to the length direction of the first flat tube 23 and the second flat tube 24, for example, arranged perpendicular to each other.

In this embodiment, the first header 21 and the second header 22 may be spaced apart from each other.

In another embodiment, the first header 21 and the second header 22 may be nested, that is, one of the first header 21 and the second header 22 is sleeved outside the other of the first header 21 and the second header 22. Specifically, as shown in fig. 6, the diameter of the second collecting pipe 22 is smaller than that of the first collecting pipe 21, the first collecting pipe 21 is sleeved outside the second collecting pipe 22, the first flat pipe 23 penetrates through the side wall of the first collecting pipe 21 and is inserted into the first collecting pipe 21, and the second flat pipe 24 penetrates through the side walls of the first collecting pipe 21 and the second collecting pipe 22 and is inserted into the second collecting pipe 22.

In yet another embodiment, the first header 21 and the second header 22 are formed by dividing the main header 27 by a flow divider 26. That is, the header assembly includes a main header 27 and a flow partition 26, and the flow partition 26 is provided in the main header 27 so that the main header 27 is provided as the first header 21 and the second header 22 separated by the flow partition 26. Specifically, as shown in fig. 7, the first flat pipe 23 penetrates through a side wall of the main header 27 and is inserted into the first header 21, and the second flat pipe 24 penetrates through a side wall of the main header 27 and the flow partition 26 and is inserted into the second header 22. Alternatively, the second flat tube 24 may extend through the side wall of the main header 27 and be inserted into the second header 22, and the first flat tube 23 may extend through the side wall of the main header 27 and the cutoff plate 26 and be inserted into the first header 21. In comparison to the manifold assembly shown in fig. 3: the present embodiment can reduce the cost and volume of the header pipe assembly by using one header pipe 27 to perform the functions of both the first header 21 and the second header 22.

The arrangement of the first header 21 and the second header 22 at a distance will be described in detail below.

The first collecting pipe 21 and the second collecting pipe 22 may be arranged at intervals along the length direction L of the first flat pipe 23. Specifically, as shown in fig. 2, the end of the first flat tube 23 is communicated with the first collecting pipe 21, the second flat tube 24 penetrates through the first collecting pipe 21, and the end of the second flat tube 24 is communicated with the second collecting pipe 22.

First flat pipe 23 and the second flat pipe 24 accessible in the same range upon range of subassembly are inserted to first pressure manifold 21 through the different holes of seting up on the first pressure manifold 21, can increase with flat tub welded area to improve the intensity of solder joint, be of value to the welding. As shown in fig. 2, the ends of the first flat tube 23 and the second flat tube 24 in the stacked assembly are separately arranged so as to be inserted into the first header 21 through different holes. Further, the end of the first flat tube 23 may be separated from the second flat tube 24 connected to the first flat tube 23 in the thickness direction H of the first flat tube 23. In other embodiments, as shown in fig. 8, the first flat tube 23 and the second flat tube 24 in the same stacked assembly may be inserted into the first collecting pipe 21 through the same hole formed in the first collecting pipe 21, so that the number of times of forming holes may be reduced, and more stacked assemblies may be arranged on collecting pipes having the same length, thereby improving the space utilization rate of the subcooler 2.

In other embodiments, as shown in fig. 9, the first collecting pipe 21 and the second collecting pipe 22 may be spaced apart along the width direction W of the first flat pipe 23 (i.e., the direction perpendicular to the length direction L of the first flat pipe 23). Under the condition that first pressure manifold 21 and second pressure manifold 22 set up along the width direction W interval of first flat pipe 23, the tip of first flat pipe 23 and the tip of the flat pipe 24 of second can separate in width direction W in order to be connected to first pressure manifold 21 and second pressure manifold 22 respectively, flat pipe 24 of second need not to run through first pressure manifold 21 like this in order to insert to second pressure manifold 22, realize the simple processing nature of flat tube hole on the pressure manifold, assemble the simplicity.

In summary, the heat dissipation plate 25 in the subcooler 2 is connected with at least two surfaces of the laminated assembly, wherein at least two surfaces face different directions of the first flat tube, so that the heat dissipation plate 25 is attached to at least two surfaces of at least one flat tube in the laminated assembly, the heat exchange area of the heat dissipation plate 25 is effectively increased, and the heat dissipation efficiency of the subcooler 2 is improved; and range upon range of subassembly is including range upon range of at least one first flat pipe 23 and at least one second flat pipe 24 that sets up, first flat pipe 23 communicates with first pressure manifold 21 in the pressure manifold subassembly, the second flat pipe 24 circulates with second pressure manifold 22 in the pressure manifold subassembly, first flat pipe 23 and the range upon range of setting of second flat pipe 24 just communicate with different pressure manifolds respectively like this, make the coolant stream in the first flat pipe 23 of flowing through and the flat pipe 24 of second can absorb heat the coolant stream in the other one of flowing through first flat pipe 23 and the flat pipe 24 of second, so that the coolant stream in the other one of the first flat pipe 23 of flowing through and the flat pipe 24 of second realizes supercooling, can realize the supercooling of coolant stream.

Referring to fig. 10, fig. 10 is a schematic structural diagram of an embodiment of the electronic control box 3 according to the present application. The electronic control box 3 may include the subcooler 2 to dissipate heat for the electronic control box 3 and the electronic components 31 therein through the subcooler 2.

The electronic control box 3 may further include a box body 32 and an electronic component 31. Wherein the subcooler 2 is provided on the box body 32. In addition, a mounting cavity is formed in the box body 32, and the electronic component 31 is arranged in the mounting cavity. The box 32 is generally made of sheet metal, and the electronic components 31 disposed in the installation cavity may be a compressor, a fan, a capacitor, an electronic controller, a common mode inductor, and the like.

Referring to fig. 11, fig. 11 is a schematic structural diagram of an embodiment of an air conditioning system 4 according to the present application. The air conditioning system 4 may include the subcooler 2 of the above-described embodiments.

In addition, the air conditioning system 4 of the present application may further include a compressor 41, a four-way valve 42, an outdoor heat exchanger 44, an indoor heat exchanger 43, a first expansion valve 45, and a second expansion valve 46. The second expansion valve 46 and the subcooler 26 are disposed between the outdoor heat exchanger 44 and the indoor heat exchanger 43, the compressor 41 provides a refrigerant flow of a circulating flow between the outdoor heat exchanger 44 and the indoor heat exchanger 43 through the four-way valve 42, the subcooler 2 is disposed between the outdoor heat exchanger 44 and the indoor heat exchanger 43, and the compressor 41 provides a refrigerant flow of a circulating flow between the outdoor heat exchanger 44 and the indoor heat exchanger 43 through the four-way valve 42.

The subcooler 26 includes a first heat exchange channel 201 and a second heat exchange channel 202, a plurality of first microchannels 231 of the first flat tube 23 in the subcooler 2 are used as the first heat exchange channel 201 of the subcooler 2, a plurality of second microchannels of the second flat tube 24 in the subcooler 2 are used as the second heat exchange channel 202 of the subcooler 2, a first end of the first heat exchange channel 201 is connected with the outdoor heat exchanger 44 through the second expansion valve 46, a second end of the first heat exchange channel 201 is connected with the indoor heat exchanger 43, a first end of the second heat exchange channel 202 is connected with a second end of the first heat exchange channel 201 through the first expansion valve 45, and a second end of the second heat exchange channel 202 is connected with the suction port 41 of the compressor 41.

When the air conditioning system 41 is in the cooling mode, the path of the refrigerant flow is:

the discharge port 411 of the compressor 41, the connection port 421 of the four-way valve 42, the connection port 422 of the four-way valve 42, the outdoor heat exchanger 44, the subcooler 26, the indoor heat exchanger 43, the connection port 42 of the four-way valve 42, the connection port 424 of the four-way valve 42, and the suction port 41 of the compressor 41.

The path (main path) of the refrigerant flow of the first heat exchange channel 201 is: the first end of the first heat exchange path 201-the second end of the first heat exchange path 201-the indoor heat exchanger 43. The path (sub path) of the refrigerant flow of the second heat exchange passage 202 is: the second end of the first heat exchange passage 201-the first expansion valve 45-the first end of the second heat exchange passage 202-the second end of the second heat exchange passage 202-the suction port 41 of the compressor 41.

For example, the operating principle of the air conditioning system 41 at this time is: the outdoor heat exchanger 44 serves as a condenser, and outputs a medium-pressure and medium-temperature refrigerant flow (the temperature may be 40 ° or less) through the second expansion valve 46, the refrigerant flow of the first heat exchange channel 201 is a medium-pressure and medium-temperature refrigerant flow, the first expansion valve 45 converts the medium-pressure and medium-temperature refrigerant flow into a low-pressure and low-temperature refrigerant flow (the temperature may be 10 ° or less or a gas-liquid two-phase refrigerant flow), and the refrigerant flow of the second heat exchange channel 202 is a low-pressure and low-temperature refrigerant flow. The low-pressure low-temperature refrigerant flow of the second heat exchange channel 202 absorbs heat from the medium-pressure medium-temperature refrigerant flow of the first heat exchange channel 201, and further the refrigerant flow of the second heat exchange channel 202 is gasified, so that the refrigerant flow of the first heat exchange channel 201 is further supercooled. The gasified refrigerant flow of the second heat exchange channel 202 performs enhanced vapor injection on the compressor 41, thereby improving the refrigerating capacity of the air conditioning system 41.

The first expansion valve 45 is used as a throttling component of the second heat exchange passage 202 to regulate the flow rate of the refrigerant flow of the second heat exchange passage 202. The refrigerant flow of the first heat exchange channel 201 exchanges heat with the refrigerant flow of the second heat exchange channel 202 to supercool the refrigerant flow of the first heat exchange channel 201. Therefore, the subcooler 26 can be used as an economizer of the air conditioning system 41, and the subcooling degree and the heat exchange efficiency of the air conditioning system 41 are improved.

Further, as understood by those skilled in the art, in the heating mode, the connection port 421 of the four-way valve 42 is connected to the connection port 42, and the connection port 422 of the four-way valve 42 is connected to the connection port 424. The refrigerant flow output from the compressor 41 through the discharge port 411 flows from the indoor heat exchanger 43 to the outdoor heat exchanger 44, and the indoor heat exchanger 43 serves as a condenser. At this time, the refrigerant flow output from the indoor heat exchanger 43 is divided into two paths, one of which flows into the first heat exchange path 201 (main path), and the other of which flows into the second heat exchange path 202 (sub path) via the first expansion valve 45. The refrigerant flow of the second heat exchange channel 202 can also realize supercooling of the refrigerant flow of the first heat exchange channel 201, and the refrigerant flow flowing through the second heat exchange channel 202 performs air supplement and enthalpy increase on the compressor 41, so that the heating capacity of the air conditioner is improved.

The above description is only for the purpose of illustrating embodiments of the present application and is not intended to limit the scope of the present application, and all modifications of equivalent structures and equivalent processes, which are made by the contents of the specification and the drawings of the present application or are directly or indirectly applied to other related technical fields, are also included in the scope of the present application.

Claims (16)

1. A subcooler, characterized in that said subcooler comprises:

the collecting pipe assembly comprises a first collecting pipe and a second collecting pipe;

the laminated assembly comprises at least one first flat pipe and at least one second flat pipe which are laminated, the first flat pipe is communicated with the first collecting pipe, and the second flat pipe is communicated with the second collecting pipe;

the surface of the heat dissipation plate, which faces the laminated assembly, is provided with a clamping groove, and the laminated assembly is clamped in the clamping groove.

2. The subcooler according to claim 1, wherein the first header is configured to provide a first refrigerant flow to the first flat tube and/or collect the first refrigerant flow flowing through the first flat tube, and the second header is configured to provide a second refrigerant flow to the second flat tube and/or collect the second refrigerant flow flowing through the second flat tube, so that heat exchange is performed between the first refrigerant flow flowing through the first flat tube and the second refrigerant flow flowing through the second flat tube.

3. The subcooler of claim 1, wherein a central axis of at least one of the first header and the second header intersects a flat face of at least one of the first flat tube and the second flat tube.

4. The subcooler of claim 1, wherein said heat sink plate is attached to at least two faces of said stack, said at least two faces facing different directions of said first flat tube.

5. The subcooler of claim 1, wherein the clamping slot is comprised of two clamping plates, the stacked assembly being clamped between the two clamping plates, the clamping plates covering at least a portion of the flat sides of the stacked assembly.

6. The heat exchanger of claim 1, wherein said manifold assembly includes a main manifold and a flow divider disposed within said main manifold such that said main manifold is disposed as said first manifold and said second manifold separated by said flow divider.

7. The heat exchanger according to claim 6, wherein the main header is provided as the first header and the second header separated by the flow partition plate, the first flat tube penetrates a side wall of the main header and is inserted into the first header, the second flat tube penetrates a side wall of the main header and the flow partition plate and is inserted into the second header, or the second flat tube penetrates a side wall of the main header and is inserted into the second header, and the first flat tube penetrates a side wall of the main header and the flow partition plate and is inserted into the first header.

8. The subcooler of claim 1, wherein said first header and said second header are spaced apart along a length of said first flat tube.

9. The subcooler according to claim 8, wherein the first flat tube and the second flat tube are stacked, and an end of the first flat tube is communicated with the first collecting pipe; the second flat pipe penetrates through the first collecting pipe, and the end part of the second flat pipe is communicated with the second collecting pipe.

10. The subcooler of claim 9, wherein the ends of the first and second flat tubes in a stacked arrangement are spaced apart.

11. The subcooler of claim 1, wherein the first header and the second header are spaced apart along a direction perpendicular to a direction of extension of the first flat tube.

12. The subcooler of claim 11, wherein said first flat tube and said second flat tube are stacked and ends of said first flat tube and ends of said second flat tube are separated in said vertical direction for connection to a first header and a second header, respectively.

13. The subcooler of claim 1, wherein said first flat tubes and said second flat tubes in said stack are alternately stacked.

14. The subcooler of claim 1, wherein said first flat tube comprises a plurality of first microchannels, and said second flat tube comprises a plurality of second microchannels.

15. An electronic control box, characterized in that the electronic control box comprises a box body and a subcooler according to any one of claims 1-14, wherein the subcooler is connected with the box body.

16. An air conditioning system, characterized in that it comprises a subcooler according to any of claims 1-14.

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