CN115821340A - Preparation method of high-conductivity and high-strength copper-plated carbon fiber - Google Patents
Preparation method of high-conductivity and high-strength copper-plated carbon fiber Download PDFInfo
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- 229920000049 Carbon (fiber) Polymers 0.000 title claims abstract description 163
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- 229910000365 copper sulfate Inorganic materials 0.000 claims abstract description 12
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- PUAQLLVFLMYYJJ-UHFFFAOYSA-N 2-aminopropiophenone Chemical compound CC(N)C(=O)C1=CC=CC=C1 PUAQLLVFLMYYJJ-UHFFFAOYSA-N 0.000 description 1
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Images
Abstract
The invention discloses a preparation method of high-conductivity high-strength copper-plated carbon fiber, which comprises the following steps: 1) Ablating, cleaning and drying the polyacrylonitrile-based carbon fibers to obtain carbon fibers with oxidized surfaces; 2) Mixing copper sulfate, sodium citrate, sodium tartrate, sodium dodecyl sulfate and water to prepare electroplating solution; 3) Taking the carbon fiber with the oxidized surface as a cathode and the copper sheet as an anode, electroplating in electroplating solution, washing to be neutral by using deionized water, and drying in a vacuum oven to obtain copper-plated carbon fiber; 4) And annealing the copper-plated carbon fiber under the protection of nitrogen, and cooling. The carbon fiber is subjected to surface ablation oxidation treatment, so that the surface of the carbon fiber has proper roughness, the bonding force between a coating and the carbon fiber interface is improved, the problems of poor coating quality, more defects and easy peeling during copper annealing treatment are solved, the coating is compact and uniform after annealing, the resistivity and the porosity are reduced, stress concentration points are reduced, and the mechanical property is improved.
Description
Technical Field
The invention relates to a conductive fiber, in particular to a preparation method of a high-conductivity high-strength copper-plated carbon fiber.
Background
The carbon fiber has the advantages of high strength, high modulus, low expansion coefficient, low density and the like, and is widely applied to the fields of aerospace, automobiles, ships, sports goods, medical appliances and the like. Meanwhile, the conductive material and the electromagnetic shielding material prepared by using the carbon fiber and the composite material thereof have the advantages of light weight, high strength and the like, and have the possibility of replacing the traditional metal material. However, since carbon fibers are non-metallic fibers and have a resistivity much higher than that of metals, the conductivity and electromagnetic shielding effect of the material are poor, and thus it is necessary to improve the conductivity of carbon fibers.
The metallization of the carbon fiber is an effective way for improving the conductivity of the carbon fiber, and the metallization can also solve the problem of poor wettability and compatibility between the carbon fiber and a metal matrix. Many researchers have used metals such as silver, copper, nickel, zinc, platinum, etc. to coat modified carbon fibers. Among them, copper has the advantages of low cost, high conductivity and more usage. Currently, among many metallization processes, electroplating is one of the effective methods for preparing metallized carbon fibers.
The copper/carbon composite material prepared by the method of modifying the carbon fiber by electroplating and chemical plating has high adhesion of the electroplated copper layer on the carbon fiber, and the copper-plated carbon fiber can also be used as a novel wire material. However, the electroplating method also has some disadvantages, such as generation of gas and doping of impurities during the electroplating process, which may cause obvious defects on the electroplated copper layer, low temperature during formation of the plating layer, low interface bonding strength, loose and easy peeling of the electroplated copper layer, which may cause unsatisfactory conductivity of the copper-plated carbon fiber, and unexpected improvement of mechanical properties.
Disclosure of Invention
Aiming at the problem that the defects of the plating layer of the existing copper-plated carbon fiber obviously cause that the expected conductivity and mechanical property can not be realized, the invention provides a preparation method of the copper-plated carbon fiber with high conductivity and high strength, which comprises the following steps: 1) Ablating polyacrylonitrile-based carbon fibers at 400-500 ℃ for 20-40 min, cleaning and drying to obtain surface-oxidized carbon fibers; 2) Mixing copper sulfate, sodium citrate, sodium tartrate, sodium dodecyl sulfate and water to prepare electroplating solution; 3) Taking the carbon fiber with the oxidized surface in the step 1) as a cathode and the copper sheet as an anode, electroplating in the electroplating solution prepared in the step 2), washing the electroplated carbon fiber with deionized water to be neutral, and drying in a vacuum oven to obtain copper-plated carbon fiber; 4) Heating the copper-plated carbon fiber obtained in the step 3) to 400-600 ℃ at a speed of 8-12 ℃/min under the protection of nitrogen, annealing for 10-40 min, and cooling to obtain the high-conductivity high-strength copper-plated carbon fiber.
The carbon fiber can be divided into polyacrylonitrile-based carbon fiber, viscose-based carbon fiber and pitch-based carbon fiber according to different raw materials, wherein the overall performance of the viscose-based carbon fiber and the pitch-based carbon fiber is lower than that of the polyacrylonitrile-based carbon fiber, the precursor of the polyacrylonitrile-based carbon fiber can accurately prepare polyacrylonitrile with required indexes through a polymerization process with controllable conditions, the obtained polyacrylonitrile has high molecular weight and narrow distribution, the carbon fiber obtained after carbonization has few molecular defects and excellent mechanical properties, and therefore, the polyacrylonitrile-based carbon fiber is adopted for ablation, the specification of the used polyacrylonitrile-based carbon fiber is 6-12 k, and the diameter of the monofilament is 4-10 mu m.
Specifically, the concentration of copper sulfate in the electroplating solution prepared in the step 2) is controlled to be 50g/L, the concentration of sodium citrate is controlled to be 80-100 g/L, the concentration of sodium tartrate is controlled to be 1-5 g/L, and the concentration of sodium dodecyl sulfate is controlled to be 0.1-0.6 g/L; in the step 3), the size of the copper sheet is 80 multiplied by 20 multiplied by 1mm; the temperature of the electroplating solution is 30-60 ℃, and the electroplating voltage is 4-8V.
The method carries out surface ablation oxidation treatment on the carbon fiber, so that the surface of the carbon fiber has proper roughness, and the interface binding force between a coating and the surface of the carbon fiber is favorably improved; the annealing treatment effectively solves the problems of poor coating quality, more defects, easy peeling and the like in the copper plating of the carbon fiber, the annealed carbon fiber is tightly combined with the coating, the coating is compact and uniform, the contact resistance between copper structures is reduced, a better conduction path is provided for electrons, the resistivity is reduced, the conductivity is obviously improved compared with that of the non-annealed copper-plated carbon fiber, the porosity is reduced after annealing, the oxidation resistance of the copper-plated carbon fiber is improved, the defects of a copper layer are reduced after annealing, stress concentration points are reduced, and the mechanical property is improved.
Drawings
FIG. 1 is SEM images of carbon fibers of example 1 before ablation (a) and after ablation (b);
FIG. 2 is an XPS survey of the carbon fibers of example 1 before ablation (CF) and after ablation (Oxidized CF);
FIG. 3 is a C1s peak plot of the carbon fiber of example 1 before ablation (a) and after ablation (b);
FIG. 4 is a graph of the stress-strain curve (a) and the intensity and modulus histogram (b) for the carbon fibers of example 1 before ablation (CF) and after ablation (Oxidized CF);
FIG. 5 is SEM images of the fiber surface before annealing (10 μm) and after annealing (5 μm) of the copper-coated carbon fiber obtained in example 1;
FIG. 6 is SEM images of the fiber surface before annealing (10 μm) and after annealing (5 μm) of the copper-coated carbon fiber obtained in example 2;
FIG. 7 is XRD patterns of copper-plated carbon fiber (CF-Cu) obtained in comparative example 1, highly conductive high strength copper-plated carbon fiber (CF-Cu annealed at 600 ℃ C.) obtained in example 1, highly conductive high strength copper-plated carbon fiber (CF-Cu annealed at 400 ℃ C.) obtained in example 2, and highly conductive high strength copper-plated carbon fiber (CF-Cu annealed at 500 ℃ C.) obtained in example 3;
FIG. 8 is a graph of grain size and conductivity histograms for comparative example 1, example 2, example 3 and example 1 fibers, respectively, from left to right;
FIG. 9 is a bar graph of the strength and modulus of the carbon fibers ablated in example 1 (1), copper-coated carbon fibers ablated in comparative example 1 (2), highly conductive and high strength copper-coated carbon fibers ablated in example 2 (3), highly conductive and high strength copper-coated carbon fibers ablated in example 3 (4), and highly conductive and high strength copper-coated carbon fibers ablated in example 1 (5);
FIG. 10 is a stress-strain curve of the carbon fiber (Oxidized CF) after ablation in example 1, the copper-coated carbon fiber (CF-Cu) in comparative example 1, the highly conductive high strength copper-coated carbon fiber (400 ℃ C.) in example 2, the highly conductive high strength copper-coated carbon fiber (500 ℃ C.) in example 3, and the highly conductive high strength copper-coated carbon fiber (600 ℃ C.) in example 1.
Detailed Description
The present invention is described below with reference to examples, which are provided for illustration only and are not intended to limit the scope of the present invention.
1. The invention uses the following raw materials:
1. polyacrylonitrile-based carbon fiber (12 k monofilament) produced by taiwan plastics industries, ltd, having a monofilament diameter of about 7 μm, without sizing;
2. the sodium tartrate and the sodium citrate are analytically pure and are produced by Kemi European chemical reagent Co.Ltd;
3. the copper sulfate is analytically pure and is produced by Tianjin Yongda chemical reagent company Limited;
4. the sodium dodecyl sulfate is analytically pure, and is produced by Shanghai Mielin Biochemical Co.Ltd;
5. the anode is a copper plate with the purity of more than or equal to 99.9 percent, and is produced by Shenzhen spring metal Limited company.
2. The characterization device and the detection method of the invention are as follows:
1. using a field emission scanning electron microscope (SEM 450 NovaNano) to observe the shapes of the carbon fiber, the copper-plated carbon fiber and the annealed copper-plated carbon fiber;
2. performing surface element analysis on the copper-plated carbon fiber by using an attached energy spectrometer (EDS);
3. the crystallographic properties of the copper-plated carbon fiber and the annealed copper-plated carbon fiber were investigated using an X-ray diffractometer (XRD, ultima IV);
4. researching surface elements and relative contents of the carbon fibers before and after oxidation treatment by using a Thermo Fisher Scientific K-Alpha type X-ray electronic spectrometer, wherein an excitation light source is Al-Ka (1486.6 eV), and the jet voltage is 15kV;
5. the fiber breaking force is tested by using a fiber strength and elongation instrument (XQ-1A), the test data adopts the average value of 30 parallel samples, the length of the test sample is 20mm, and the stretching speed is 5mm/min.
Example 1
A preparation method of high-conductivity high-strength copper-plated carbon fiber comprises the following steps:
1) Ablating polyacrylonitrile-based carbon fibers for 30min at 450 ℃, cleaning and drying to obtain carbon fibers with oxidized surfaces;
2) Adding copper sulfate, sodium citrate, sodium tartrate and sodium dodecyl sulfate into water to prepare electroplating solution, and controlling the concentration of copper sulfate to be 50g/L, the concentration of sodium citrate to be 100g/L, the concentration of sodium tartrate to be 3g/L and the concentration of sodium dodecyl sulfate to be 0.5g/L;
3) Taking the carbon fiber oxidized on the surface in the step 1) as a cathode, taking a copper sheet with the size of 80 multiplied by 20 multiplied by 1mm as an anode, electroplating in the electroplating solution prepared in the step 2), wherein the temperature of the electroplating solution is 40 ℃, the electroplating voltage is 5V, washing the electroplated carbon fiber to be neutral by using deionized water after ten minutes of electroplating, and drying for 4 hours in a vacuum oven at the temperature of 60 ℃ to obtain copper-plated carbon fiber;
4) Heating the copper-plated carbon fiber obtained in the step 3) to 600 ℃ at a speed of 10 ℃/min under the protection of nitrogen, annealing for 20min, and cooling to obtain the high-conductivity high-strength copper-plated carbon fiber.
Example 2
A preparation method of high-conductivity high-strength copper-plated carbon fiber comprises the following steps:
1) Ablating polyacrylonitrile-based carbon fibers at 500 ℃ for 20min, cleaning and drying to obtain carbon fibers with oxidized surfaces;
2) Adding copper sulfate, sodium citrate, sodium tartrate and sodium dodecyl sulfate into water to prepare electroplating solution, wherein the concentration of copper sulfate is controlled to be 50g/L, the concentration of sodium citrate is controlled to be 80g/L, the concentration of sodium tartrate is controlled to be 5g/L, and the concentration of sodium dodecyl sulfate is controlled to be 0.6g/L;
3) Taking the carbon fiber oxidized on the surface in the step 1) as a cathode, taking a copper sheet with the size of 80 multiplied by 20 multiplied by 1mm as an anode, electroplating in the electroplating solution prepared in the step 2), wherein the temperature of the electroplating solution is 60 ℃, the electroplating voltage is 8V, washing the electroplated carbon fiber to be neutral by using deionized water after ten minutes of electroplating, and drying for 4 hours in a vacuum oven at the temperature of 60 ℃ to obtain copper-plated carbon fiber;
4) Heating the copper-plated carbon fiber obtained in the step 3) to 400 ℃ at a speed of 8 ℃/min under the protection of nitrogen, annealing for 15min, and cooling to obtain the high-conductivity high-strength copper-plated carbon fiber.
Example 3
A preparation method of high-conductivity high-strength copper-plated carbon fiber comprises the following steps:
1) Ablating polyacrylonitrile-based carbon fibers for 40min at 400 ℃, cleaning and drying to obtain carbon fibers with oxidized surfaces;
2) Adding copper sulfate, sodium citrate, sodium tartrate and sodium dodecyl sulfate into water to prepare electroplating solution, and controlling the concentration of copper sulfate to be 50g/L, the concentration of sodium citrate to be 90g/L, the concentration of sodium tartrate to be 1g/L and the concentration of sodium dodecyl sulfate to be 0.1g/L;
3) Taking the carbon fiber oxidized on the surface in the step 1) as a cathode and a copper sheet with the size of 80 multiplied by 20 multiplied by 1mm as an anode, electroplating in the electroplating solution prepared in the step 2), wherein the temperature of the electroplating solution is 50 ℃, the electroplating voltage is 4V, and after fifteen minutes of electroplating, the electroplated carbon fiber is washed to be neutral by deionized water and dried in a vacuum oven at 60 ℃ for 4 hours to obtain copper-plated carbon fiber;
4) Heating the copper-plated carbon fiber obtained in the step 3) to 500 ℃ at a speed of 12 ℃/min under the protection of nitrogen, annealing for 30min, and cooling to obtain the high-conductivity high-strength copper-plated carbon fiber.
Comparative example 1
The only difference from example 1 is that the copper-coated carbon fiber obtained in step 3) is not subjected to annealing treatment.
Fig. 1 is SEM images of carbon fiber before ablation (a) and after ablation (b) in example 1, wherein the ablated carbon fiber has more distinct and increased number of grooves and grooves, and the roughness of the fiber surface is increased, which facilitates mechanical engagement between the carbon fiber and copper, thereby improving the interface bonding strength. FIG. 2 is an XPS survey of the carbon fibers of example 1 before ablation (CF) and after ablation (Oxidized CF), analyzed for carbon fiber surface element content, as shown in Table 1.
TABLE 1 EXAMPLE 1 carbon fiber before ablation (CF) and after ablation (OxidizedCF) relative content of surface elements
From the analysis results in Table 1, it can be seen that the surface elements of the carbon fiber are mainly carbon and oxygen, and after the carbon fiber is subjected to ablation oxidation treatment, the atomic number concentration of O1s is obviously increased, which is increased from 13.43% to 20.73%, and the O1s/C1s is increased from 15.48 to 26.15.
Fig. 3 is a C1s peak spectrum of the carbon fiber of example 1 before ablation (a) and after ablation (b), and it can be seen that the carbon in the untreated carbon fiber has the highest content of the C — C bond and has a smaller content of the oxygen-containing functional group such as-C = OH, COOH, etc., and the carbon content in the oxygen-containing functional group such as-C = OH, COOH, etc. is increased and the kind of the oxygen-containing functional group is increased after the oxidation treatment. Example 1 the carbon element content in the different functional groups on the surface of the carbon fiber before and after the ablation treatment is shown in table 2.
TABLE 2. Example 1 carbon fiber before and after ablation surface functional group content
As can be seen from table 2, after the ablation treatment, the C-C content on the surface of the carbon fiber is reduced by 21.06%, the C-OH content is reduced by 2.76%, the-C = O content is increased by 8.28%, and the COOH content is increased by 15.55%, which indicates that the air oxidation treatment has a good activation modification effect on the carbon fiber, and generates oxygen-containing active functional groups such as-C = O and-COOH, which can be used as active sites to promote the deposition of copper ions on the surface of the fiber and make the carbon fiber have good wettability and dispersibility in the solution.
Fig. 4 is a stress-strain curve (a) and a strength-modulus histogram (b) of the carbon fiber before ablation (CF) and after ablation (Oxidized CF) in example 1, wherein the mechanical properties of the carbon fiber are slightly reduced but not much reduced after oxidation treatment, the filament strength of the carbon fiber is reduced from 4.41GPa to 4.2GPa, and the modulus is reduced from 253.14GPa to 238.4GPa, because the ablation deepens the notches and grooves on the surface of the carbon fiber, thereby increasing the stress concentration points on the surface of the fiber.
The copper and the carbon fiber are mainly combined by mechanical embedding rather than chemical combination, and the copper obtained by electroplating has smaller grain size and higher porosity. The annealing process can eliminate defects and improve the quality of the plating layer, and fig. 5 and 6 are SEM images of the fiber surfaces of the copper-plated carbon fibers obtained in examples 1 and 2 before (10 μm) and after (5 μm) annealing, respectively, and it can be seen that copper particles are fused with each other after annealing, the copper layer becomes more compact and smooth, the particle size is significantly increased, and the copper plating effect of example 1 is superior.
FIG. 7 is an XRD pattern of the copper-plated carbon fiber (CF-Cu) obtained in comparative example 1, the highly conductive high-strength copper-plated carbon fiber (CF-Cu annealed at 600 ℃) obtained in example 1, the highly conductive high-strength copper-plated carbon fiber (CF-Cu annealed at 400 ℃) obtained in example 2 and the highly conductive high-strength copper-plated carbon fiber (CF-Cu annealed at 500 ℃) obtained in example 3, and three crystal diffraction peaks corresponding to (111), (200) and (220), respectively, at 2 θ =43.4 °, 50.5 ° and 74.2 °, corresponding to the face-centered cubic structure of metal copper, and further increasing the intensity of the diffraction peak after annealing the copper layer, particularly, the intensity of the diffraction peak after annealing treatment of the copper-plated carbon fiber obtained in example 1 at 600 ℃ is nearly twice that of the intensity of the diffraction peak of the copper layer in the unannealed state, and the crystal grains grow preferentially toward (111), which indicates that the annealing treatment enhances the crystallinity and the crystal grain size of the copper layer.
From the XRD results, the average grain size (D) of the plated Cu layer was calculated using formula (1) p )，
In the formula, D p λ is the X-ray wavelength, β is the full width at half maximum (FWHM) intensity line in the diffraction curve, and θ is the bragg angle, for average grain size.
The calculation results are shown in the graph of fig. 8, and it can be seen that the grain size of the Cu layer increases with the increase of the annealing temperature. The grain size of the unannealed Cu layer in the (111) direction was 10.4nm, while the grain size of the annealed (600 deg.C) sample increased to 22.7nm.
The histograms in fig. 8 represent the conductivity of comparative example 1, example 2, example 3 and example 1 fibers, respectively, from left to right. The conductivity of the copper-plated single fibers is obviously increased after annealing, and the conductivity of the copper-plated single fibers is obviously increased and then slowly increased along with the increase of the annealing temperature. When the annealing temperature reaches 400 ℃, the conductivity of the copper-plated single fiber is increased sharply and is from 1.07 x 10 3 The S/cm is increased to 58.3 multiplied by 10 3 S/cm. Copper layer surface appearance is coarse before annealing, copper layer surface smoothness obviously improves after annealing, the surface texture of copper layer is smooth homogeneous state by the porous change of roughness, there is obvious clearance before annealing between the copper granule, lead to copper granule interface department to have higher contact resistance, consequently, copper-plated carbon fiber's electric conductivity compares the carbon fiber and does not obviously improve, and anneal the back to copper-plated carbon fiber, the copper layer becomes more even compact, copper granule interconnect, greatly reduced the contact resistance between the copper granule, the conduction path of electron has effectively been increased, and then make copper-plated carbon fiber's conductivity have had qualitative promotion, except that copper layer microstructure's defect reduces, annealing can also lead to the recrystallization and the crystalline grain of copper layer to grow up, thereby the scattering effect of grain boundary to the electron has been reduced, and then copper-plated carbon fiber's conductivity has been improved. With further increase of the annealing temperature to 600 ℃, the conductivity is significantly increased to 84.2 × 10 3 S/cm, due to further reduction of defects and enhancement of the crystallinity of the copper layer and the continued occurrence of annihilation of grain boundaries.
Fig. 9 is a bar graph of the strength and modulus of the carbon fibers ablated in example 1 (1), copper-coated carbon fibers ablated in comparative example 1 (2), highly conductive and high strength copper-coated carbon fibers in example 2 (3), highly conductive and high strength copper-coated carbon fibers in example 3 (4), and highly conductive and high strength copper-coated carbon fibers in example 1 (5). Compared with the oxidized carbon fiber, the mechanical property of the carbon fiber after copper plating is obviously reduced, the monofilament strength of the carbon fiber is reduced from 4.20GPa to 2.14GPa, the modulus is reduced from 238.40GPa to 123.58GPa, the main reason of the reduction of the mechanical property is that the strength of copper is lower, so that the mechanical property of the whole composite fiber is reduced, but the mechanical property of the fiber is improved after the copper-plated carbon fiber is annealed, taking example 1 as an example, the monofilament strength and the modulus of the copper-plated carbon fiber are increased from 2.14GPa and 123.58GPa in a non-annealed state to 2.98GPa and 147.22GPa annealed at 600 ℃, and are respectively increased by 39 percent and 19 percent. The mechanical property is increased because the defects on the surface of the copper layer after annealing are reduced, the grain boundary promotes the healing of holes in the copper layer in motion, the reduction of the defects reduces the stress concentration point of the copper layer, so that the strength of the copper is improved, and the mechanical property of the whole composite fiber is improved.
FIG. 10 is a stress-strain curve of the carbon fiber (Oxidized CF) after ablation in example 1, the copper-coated carbon fiber (CF-Cu) in comparative example 1, the highly conductive high strength copper-coated carbon fiber (400 ℃ C.) in example 2, the highly conductive high strength copper-coated carbon fiber (500 ℃ C.) in example 3, and the highly conductive high strength copper-coated carbon fiber (600 ℃ C.) in example 1. It can be seen that all types of carbon fibres exhibit elastic deformation at low strain (below 2), being brittle fracture. The stress-strain curve of the highly conductive and high strength copper-plated carbon fiber obtained in example 1 is closest to the ablated carbon fiber, which illustrates that the copper plating process of example 1 has the least effect on the ablated carbon fiber.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents, improvements and the like that fall within the spirit and principle of the present invention are intended to be included therein.
Claims (4)
1. The preparation method of the copper-plated carbon fiber with high conductivity and high strength is characterized by comprising the following steps:
1) Ablating polyacrylonitrile-based carbon fibers at 400-500 ℃ for 20-40 min, cleaning and drying to obtain surface-oxidized carbon fibers;
2) Mixing copper sulfate, sodium citrate, sodium tartrate, sodium dodecyl sulfate and water to prepare electroplating solution;
3) Taking the carbon fiber oxidized on the surface in the step 1) as a cathode and the copper sheet as an anode, electroplating in the electroplating solution prepared in the step 2), washing the electroplated carbon fiber with deionized water to be neutral, and drying in a vacuum oven to obtain copper-plated carbon fiber;
4) Heating the copper-plated carbon fiber obtained in the step 3) to 400-600 ℃ at a speed of 8-12 ℃/min under the protection of nitrogen, annealing for 10-40 min, and cooling to obtain the high-conductivity high-strength copper-plated carbon fiber.
2. The method according to claim 1, wherein the polyacrylonitrile carbon fiber is 6 to 12k in specification, and the monofilament diameter is 4 to 10 μm.
3. The method as claimed in claim 1, wherein the plating solution contains copper sulfate at a concentration of 50g/L, sodium citrate at a concentration of 80 to 100g/L, sodium tartrate at a concentration of 1 to 5g/L, and sodium lauryl sulfate at a concentration of 0.1 to 0.6g/L.
4. The method of claim 1, wherein in step 3), the copper sheet has dimensions of 80 x 20 x 1mm; the temperature of the electroplating solution is 30-60 ℃, and the electroplating voltage is 4-8V.
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Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104975278A (en) * | 2015-07-02 | 2015-10-14 | 甘肃郝氏炭纤维有限公司 | Heat-reduction metallization copper plating process for carbon fiber surface |
| KR101807189B1 (en) * | 2016-11-30 | 2018-01-18 | 우석대학교 산학협력단 | Method for Manufacturing for Ni/P Alloy Plated Polyacrylonitrile Fiber by Electroless Plating Method and Bipolar Plate for Fuel Cells Using the Same |
| KR20190088319A (en) * | 2018-01-18 | 2019-07-26 | 한국과학기술연구원 | Carbon fiber facric and manufacturing method thereof |
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Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104975278A (en) * | 2015-07-02 | 2015-10-14 | 甘肃郝氏炭纤维有限公司 | Heat-reduction metallization copper plating process for carbon fiber surface |
| KR101807189B1 (en) * | 2016-11-30 | 2018-01-18 | 우석대학교 산학협력단 | Method for Manufacturing for Ni/P Alloy Plated Polyacrylonitrile Fiber by Electroless Plating Method and Bipolar Plate for Fuel Cells Using the Same |
| KR20190088319A (en) * | 2018-01-18 | 2019-07-26 | 한국과학기술연구원 | Carbon fiber facric and manufacturing method thereof |
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