CN115820193A - Polyurethane hot melt adhesive for thin base material and preparation method thereof - Google Patents
Polyurethane hot melt adhesive for thin base material and preparation method thereof Download PDFInfo
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- 229920002635 polyurethane Polymers 0.000 title claims abstract description 64
- 239000004814 polyurethane Substances 0.000 title claims abstract description 64
- 239000004831 Hot glue Substances 0.000 title claims abstract description 61
- 239000000463 material Substances 0.000 title claims description 9
- 238000002360 preparation method Methods 0.000 title abstract description 10
- 239000011347 resin Substances 0.000 claims abstract description 50
- 229920005989 resin Polymers 0.000 claims abstract description 49
- 229920005906 polyester polyol Polymers 0.000 claims abstract description 40
- 229920005862 polyol Polymers 0.000 claims abstract description 32
- 150000003077 polyols Chemical class 0.000 claims abstract description 32
- 239000004721 Polyphenylene oxide Substances 0.000 claims abstract description 31
- 229920000570 polyether Polymers 0.000 claims abstract description 31
- 239000000758 substrate Substances 0.000 claims abstract description 22
- 229920005992 thermoplastic resin Polymers 0.000 claims abstract description 16
- 239000012948 isocyanate Substances 0.000 claims abstract description 15
- 150000002513 isocyanates Chemical class 0.000 claims abstract description 15
- 239000002994 raw material Substances 0.000 claims abstract description 8
- 238000000034 method Methods 0.000 claims abstract description 5
- 229920000178 Acrylic resin Polymers 0.000 claims description 29
- 239000004925 Acrylic resin Substances 0.000 claims description 29
- 229920001169 thermoplastic Polymers 0.000 claims description 25
- 239000004416 thermosoftening plastic Substances 0.000 claims description 25
- 239000004433 Thermoplastic polyurethane Substances 0.000 claims description 24
- 229920002803 thermoplastic polyurethane Polymers 0.000 claims description 24
- 238000010438 heat treatment Methods 0.000 claims description 10
- 238000006243 chemical reaction Methods 0.000 claims description 9
- UPMLOUAZCHDJJD-UHFFFAOYSA-N 4,4'-Diphenylmethane Diisocyanate Chemical compound C1=CC(N=C=O)=CC=C1CC1=CC=C(N=C=O)C=C1 UPMLOUAZCHDJJD-UHFFFAOYSA-N 0.000 claims description 8
- 238000001816 cooling Methods 0.000 claims description 6
- 238000007599 discharging Methods 0.000 claims description 5
- 238000002844 melting Methods 0.000 claims description 5
- 230000008018 melting Effects 0.000 claims description 5
- 238000003756 stirring Methods 0.000 claims description 5
- 239000003208 petroleum Substances 0.000 claims description 4
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 claims description 2
- 229920001634 Copolyester Polymers 0.000 claims description 2
- 239000005057 Hexamethylene diisocyanate Substances 0.000 claims description 2
- 239000005058 Isophorone diisocyanate Substances 0.000 claims description 2
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 claims description 2
- KXBFLNPZHXDQLV-UHFFFAOYSA-N [cyclohexyl(diisocyanato)methyl]cyclohexane Chemical compound C1CCCCC1C(N=C=O)(N=C=O)C1CCCCC1 KXBFLNPZHXDQLV-UHFFFAOYSA-N 0.000 claims description 2
- RRAMGCGOFNQTLD-UHFFFAOYSA-N hexamethylene diisocyanate Chemical compound O=C=NCCCCCCN=C=O RRAMGCGOFNQTLD-UHFFFAOYSA-N 0.000 claims description 2
- NIMLQBUJDJZYEJ-UHFFFAOYSA-N isophorone diisocyanate Chemical compound CC1(C)CC(N=C=O)CC(C)(CN=C=O)C1 NIMLQBUJDJZYEJ-UHFFFAOYSA-N 0.000 claims description 2
- 150000003505 terpenes Chemical class 0.000 claims description 2
- 235000007586 terpenes Nutrition 0.000 claims description 2
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 claims description 2
- 231100000252 nontoxic Toxicity 0.000 abstract description 2
- 230000003000 nontoxic effect Effects 0.000 abstract description 2
- 239000003960 organic solvent Substances 0.000 abstract description 2
- 238000001723 curing Methods 0.000 description 15
- 230000001070 adhesive effect Effects 0.000 description 13
- 239000000853 adhesive Substances 0.000 description 12
- 238000012360 testing method Methods 0.000 description 5
- 229920013701 VORANOL™ Polymers 0.000 description 4
- 239000004744 fabric Substances 0.000 description 3
- 238000013008 moisture curing Methods 0.000 description 3
- 239000002131 composite material Substances 0.000 description 2
- 238000002425 crystallisation Methods 0.000 description 2
- 230000008025 crystallization Effects 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- 238000005187 foaming Methods 0.000 description 2
- 230000009477 glass transition Effects 0.000 description 2
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 238000004513 sizing Methods 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- KPAPHODVWOVUJL-UHFFFAOYSA-N 1-benzofuran;1h-indene Chemical compound C1=CC=C2CC=CC2=C1.C1=CC=C2OC=CC2=C1 KPAPHODVWOVUJL-UHFFFAOYSA-N 0.000 description 1
- KXDHJXZQYSOELW-UHFFFAOYSA-M Carbamate Chemical compound NC([O-])=O KXDHJXZQYSOELW-UHFFFAOYSA-M 0.000 description 1
- 239000004970 Chain extender Substances 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 239000012752 auxiliary agent Substances 0.000 description 1
- CQEYYJKEWSMYFG-UHFFFAOYSA-N butyl acrylate Chemical compound CCCCOC(=O)C=C CQEYYJKEWSMYFG-UHFFFAOYSA-N 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 238000006757 chemical reactions by type Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 239000000806 elastomer Substances 0.000 description 1
- 230000002427 irreversible effect Effects 0.000 description 1
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920001228 polyisocyanate Polymers 0.000 description 1
- 239000005056 polyisocyanate Substances 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 230000036632 reaction speed Effects 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000012941 solvent-based polyurethane adhesive Substances 0.000 description 1
- 230000003075 superhydrophobic effect Effects 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 239000004753 textile Substances 0.000 description 1
- JOYRKODLDBILNP-UHFFFAOYSA-N urethane group Chemical group NC(=O)OCC JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
Abstract
The invention relates to the technical field of hot melt adhesives, in particular to the field of IPC 09J175, and further relates to a polyurethane hot melt adhesive for thin substrates and a preparation method thereof. The method comprises the following raw materials: 30-50 parts of polyether polyol, 15-35 parts of polyester polyol, 15-50 parts of thermoplastic resin, 5-20 parts of tackifying resin and 8-15 parts of isocyanate. The polyurethane hot melt adhesive prepared by the invention has excellent low temperature resistance and bonding performance; does not contain any organic solvent, is nontoxic and environment-friendly.
Description
Technical Field
The invention relates to the technical field of hot melt adhesives, in particular to the field of IPC 09J175, and further relates to a polyurethane hot melt adhesive for thin substrates and a preparation method thereof.
Background
Polyurethane adhesives are widely used in the research and application of adhesives for composite films. The moisture curing reaction type polyurethane hot melt adhesive is an adhesive containing urethane groups and/or isocyanate groups in molecular chains, can perform irreversible reaction with moisture in the air, has extremely high reaction activity, has excellent adhesive capacity to various base materials due to the existence of polar groups and a properly crosslinked reticular structure, and is a preferable adhesive product of a composite film.
Chinese patent CN 110885660A discloses a polyurethane hot melt adhesive for low surface energy materials and a preparation method thereof, wherein the raw materials comprise polyether polyol, polyester polyol, polyolefin, isocyanate, coumarone-indene tree, butyl acrylate, a catalyst and an auxiliary agent, and the polyurethane hot melt adhesive can be applied to PE, PP, PVC films without surface treatment, other low surface energy textile fabrics and the like; however, the polyurethane hot melt adhesive prepared by the patent has higher peel strength to polyester fabric and super-hydrophobic fabric, and has lower peel strength to PP, and the adhesion performance to a PP film needs to be improved. Chinese patent CN 108976382A discloses a preparation method of a bi-component polyurethane adhesive, which adopts polyol, polyisocyanate and chain extender as raw materials to prepare a series of-OH-group-terminated solvent-based polyurethane adhesives, and then a certain amount of curing agent is added, so that the adhesive can be used for PVC membrane coating PVC profiled bars; however, the bi-component solvent type polyurethane adhesive needs to be dried for several minutes to tens of minutes when in use, otherwise, a large amount of solvent remains in the adhesive, and air bubbles are easily formed in the adhesive layer in the curing process, so that the bonding quality is affected.
Disclosure of Invention
The invention provides a polyurethane hot melt adhesive for thin base materials, which comprises the following raw materials in parts by weight: 30-50 parts of polyether polyol, 15-35 parts of polyester polyol, 15-50 parts of thermoplastic resin, 5-20 parts of tackifying resin and 8-15 parts of isocyanate.
In some preferred embodiments, the polyether polyol has a number average molecular weight of 1000 to 3000g/mol.
Based on the system of the invention, polyether polyol, especially polyether polyol with the number average molecular weight of 1000-3000 g/mol, is introduced, so that the low temperature resistance and the bonding performance of the polyurethane hot melt adhesive can be effectively improved. The applicant guesses that: on one hand, the polyether polyol is a polymer with ether bonds on the molecular main chain and hydroxyl on the terminal group, and has lower cohesive energy of the ether bonds in the molecular structure, easy rotation and better flexibility; isocyanate reaction can be carried out to the maximum extent, so that a high polymer with a large number of repeated carbamate segments is generated, and the low temperature resistance of the polyurethane hot melt adhesive is further improved; on the other hand, the polarity of the polyether polyol with the number average molecular weight is relatively high, and the intermolecular acting force is strong, so that the bonding strength of the polyurethane hot melt adhesive is improved.
In order to increase the initial adhesive strength and the curing rate of the polyurethane hot melt adhesive, in some preferred embodiments, the polyester polyol is a crystalline polyester polyol.
Preferably, the number average molecular weight of the crystalline polyester polyol is 2000 to 4000g/mol.
Based on the system, the crystalline polyester polyol with the number average molecular weight of 2000-4000 g/mol can be introduced to effectively improve the bonding strength and the curing rate, and the foaming phenomenon of the polyurethane hot melt adhesive can be avoided. The applicant guesses that: the polyurethane hot melt adhesive prepared from the crystalline polyester polyol under the number average molecular weight has proper relative molecular mass, can generate enough adhesive force before moisture curing, and enhances the curing rate of the polyurethane hot melt adhesive. When the number average molecular weight of the crystalline polyester polyol is higher, the crystallinity of the polyurethane hot melt adhesive is influenced and the final bonding performance is reduced due to too high reaction speed in the curing process; the higher number average molecular weight also leads to high melt viscosity of the polyurethane hot melt adhesive, which affects the adhesive property and increases the difficulty of sizing.
In some preferred embodiments, the mass ratio of the polyether polyol to the crystalline polyester polyol is (1-3): 1.
Based on the system, the curing time can be reduced while the bonding strength of the polyurethane hot melt adhesive is ensured by controlling the mass ratio (1-3): 1 of the polyether polyol to the crystalline polyester polyol. The polyether polyol has a lower glass transition temperature, so that the curing time is longer, the initial strength of the polyurethane hot melt adhesive is weaker, the polyester polyol has a higher glass transition temperature and a higher softening point temperature than the polyether polyol, and the curing time of the polyurethane hot melt adhesive can be effectively reduced by selecting a proper proportion of the polyether polyol and the crystalline polyester polyol.
In order to further improve the curing speed and the bonding strength of the polyurethane hot melt adhesive, thermoplastic resin is introduced into the system. In some preferred embodiments, the thermoplastic resin is selected from one or more combinations of thermoplastic acrylic resins, TPU resins (thermoplastic polyurethane elastomers), copolyester resins.
Preferably, the thermoplastic resin is selected from the group consisting of thermoplastic acrylic resins and TPU resins.
Preferably, the weight average molecular weight of the thermoplastic acrylic resin is 20000 to 60000.
In some preferred embodiments, the mass ratio of the thermoplastic acrylic resin to the TPU resin is 1: (1-3).
The crystallization speed of the thermoplastic acrylic resin is high, the opening time is obviously shortened, and the initial adhesion of the polyurethane hot melt adhesive is improved, but because the crystallization shrinkage rate of the thermoplastic acrylic resin is high, the wetting capacity of the thermoplastic acrylic resin to a base material is poor, the polyurethane hot melt adhesive is rapidly hardened and shrunk along with the reduction of the temperature after the polyurethane system is added, the adhesion of the polyurethane hot melt adhesive to the base material is deteriorated in the process of cooling the polyurethane hot melt adhesive to the room temperature, and the moisture curing reaction of a bonding part is not completed at the moment, so that the problems of slow curing rate and final peeling strength reduction are caused.
In order to solve the above problems, a TPU resin is introduced into the system of the present invention, and the mass ratio of the thermoplastic acrylic resin to the TPU resin is controlled to 1: (1-3), the compatibility of the system can be improved, and the compatibility of the system can be further improved because the chain end of the TPU resin contains reactive hydroxyl and can react with a small amount of terminal-NCO to form a bond after the TPU resin is added into a polyurethane system.
In some preferred embodiments, the tackifying resin is selected from one or more combinations of acrylic resins, C5 petroleum resins, C9 petroleum resins, rosin resins, terpene resins.
Preferably, the tackifying resin is selected from acrylic resins; preferably, the acrylic resin is a wound-winning resinAC 1620。
In some preferred embodiments, the isocyanate is selected from at least one of diphenylmethane diisocyanate, hexamethylene diisocyanate, isophorone diisocyanate, dicyclohexylmethane diisocyanate.
The invention provides a preparation method of a polyurethane hot melt adhesive for a thin base material, which comprises the following steps: putting polyether polyol, polyester polyol, tackifying resin and thermoplastic resin into a reaction kettle in sequence, fully and uniformly stirring, heating to 130-150 ℃ for melting, and dehydrating until no bubbles exist; keeping the temperature at 130-150 ℃ for 1-3 h, cooling to 70-90 ℃, adding isocyanate, heating to 100-110 ℃, reacting for 1-3 h, and discharging to obtain the product.
Has the advantages that:
1. the introduction of polyether polyol, particularly the introduction of polyether polyol with the number average molecular weight of 1000-3000 g/mol can effectively improve the low temperature resistance and the bonding property of the polyurethane hot melt adhesive.
2. The invention can effectively improve the bonding strength and the curing rate by introducing the crystalline polyester polyol with the number average molecular weight of 2000-4000 g/mol, and can avoid the foaming phenomenon of the polyurethane hot melt adhesive.
3. According to the invention, the mass ratio (1-3): 1 of polyether polyol to crystalline polyester polyol is controlled, so that the adhesive strength of the polyurethane hot melt adhesive can be ensured, and the curing time can be reduced.
4. The invention introduces thermoplastic resin, and the mass ratio of the thermoplastic acrylic resin to the TPU resin is controlled to be 1: (1-3) the compatibility of the system is improved, and the curing rate and the peeling strength of the polyurethane hot melt adhesive are improved.
5. The polyurethane hot melt adhesive provided by the invention has the solid content of 100%, does not contain any organic solvent, and is nontoxic and environment-friendly.
Detailed Description
Example 1
Embodiment 1 provides a polyurethane hot melt adhesive for thin substrates, which comprises the following raw materials in parts by mass: 40 parts of polyether polyol, 25 parts of polyester polyol, 40 parts of thermoplastic resin, 15 parts of tackifying resin and 12 parts of isocyanate.
The polyether polyol has a number average molecular weight of 2000g/mol, dow brand, model number VORANOL 2000LM.
The polyester polyol is crystalline polyester polyol, the number average molecular weight of the crystalline polyester polyol is 3500g/mol, and the brand name is 7360.
Said thermoplasticThe nature resin is thermoplastic acrylic resin and TPU resin; the mass ratio of the thermoplastic acrylic resin to the TPU resin is 1:3; the TPU resin is American Luoborun45-90/03。
The weight average molecular weight of the thermoplastic acrylic resin is 30000, and the brand name is Mitsubishi, BR-113.
The isocyanate is diphenylmethane diisocyanate.
A preparation method of a polyurethane hot melt adhesive for thin substrates comprises the following steps: putting polyether polyol, crystalline polyester polyol, tackifying resin, thermoplastic acrylic resin and TPU resin into a reaction kettle in sequence, fully and uniformly stirring, heating to 140 ℃ for melting, and dehydrating until no bubbles exist; keeping the temperature at 140 ℃ for 2h, cooling to 80 ℃, adding diphenylmethane diisocyanate, heating to 100 ℃, reacting for 2h, and discharging to obtain the product.
Example 2
Embodiment 2 provides a polyurethane hot melt adhesive for thin substrates, which comprises the following raw materials in parts by mass: 45 parts of polyether polyol, 25 parts of polyester polyol, 30 parts of thermoplastic resin, 12 parts of tackifying resin and 13 parts of isocyanate.
The polyether polyol has a number average molecular weight of 2000g/mol, dow brand, model number VORANOL 2000LM.
The polyester polyol is crystalline polyester polyol, the number average molecular weight of the crystalline polyester polyol is 3500g/mol, and the brand name is 7360.
The thermoplastic resin is thermoplastic acrylic resin and TPU; the mass ratio of the thermoplastic acrylic resin to the TPU resin is 1:3; the TPU resin is American Luoborun45-90/03。
The weight average molecular weight of the thermoplastic acrylic resin is 30000, and the brand name is Mitsubishi, BR-113.
The isocyanate is diphenylmethane diisocyanate.
A preparation method of a polyurethane hot melt adhesive for thin substrates comprises the following steps: putting polyether polyol, crystalline polyester polyol, tackifying resin, thermoplastic acrylic resin and TPU resin into a reaction kettle in sequence, fully and uniformly stirring, heating to 140 ℃ for melting, and dehydrating until no bubbles exist; keeping the temperature at 140 ℃ for 2h, cooling to 80 ℃, adding diphenylmethane diisocyanate, heating to 100 ℃, reacting for 2h, and discharging to obtain the product.
Example 3
Embodiment 3 provides a polyurethane hot melt adhesive for thin substrates, which comprises the following raw materials in parts by mass: 50 parts of polyether polyol, 15 parts of polyester polyol, 30 parts of thermoplastic resin, 12 parts of tackifying resin and 13 parts of isocyanate.
The polyether polyol has a number average molecular weight of 2000g/mol, dow brand, model number VORANOL 2000LM.
The polyester polyol is crystalline polyester polyol, the number average molecular weight of the crystalline polyester polyol is 3500g/mol, and the brand name is 7360.
The thermoplastic resin is thermoplastic acrylic resin and TPU; the mass ratio of the thermoplastic acrylic resin to the TPU resin is 1:3; the TPU resin is American Luoborun45-90/03。
The weight average molecular weight of the thermoplastic acrylic resin is 30000, and the brand name is Mitsubishi, BR-113.
The isocyanate is diphenylmethane diisocyanate.
A preparation method of a polyurethane hot melt adhesive for thin substrates comprises the following steps: putting polyether polyol, crystalline polyester polyol, tackifying resin, thermoplastic acrylic resin and TPU resin into a reaction kettle in sequence, fully and uniformly stirring, heating to 140 ℃ for melting, and dehydrating until no bubbles exist; keeping the temperature at 140 ℃ for 2h, cooling to 80 ℃, adding diphenylmethane diisocyanate, heating to 100 ℃, reacting for 2h, and discharging to obtain the product.
Example 4
Example 4 provides a polyurethane hot melt adhesive for thin substrates, the specific embodiment of which is the same as example 1, except that the polyether polyol has a molecular weight of 4000g/mol brand dow, model VORANOL 4000LM.
Example 5
Example 5 provides a polyurethane hot melt adhesive for thin substrates, the specific embodiment is the same as example 1, except that the number average molecular weight of the crystalline polyester polyol is 8500g/mol, the brand name is won, and the number is 7361.
Example 6
Example 6 provides a polyurethane hot melt adhesive for thin substrates, which is prepared in the same manner as in example 1, except that the polyester polyol is amorphous polyester polyol, brand name 7130.
Example 7
Example 7 provides a polyurethane hot melt adhesive for thin substrates, which is prepared in the same manner as in example 1, except that the thermoplastic resin is a thermoplastic acrylic resin.
Example 8
Example 8 provides a polyurethane hot melt adhesive for thin substrates, which is prepared in the same manner as in example 1, except that the weight ratio of the thermoplastic acrylic resin to the TPU resin is 1:4.
performance testing
1. And (3) viscosity testing: the viscosity of the polyurethane hot melt adhesives prepared in examples 1 to 8 was measured using a viscometer at a test temperature of 160 ℃, and the results are reported in table 1.
2. Peel strength: the polyurethane hot melt adhesive prepared in the examples 1 to 8 is preheated at 160 ℃ for 2 hours and then coated on the surface of a wood-plastic plate, and the gluing amount is 35g/m 2 And compounded with a PVC film after sizing, and the peel strength is determined by referring to GB/T2790 1995 standard after natural curing for 24 hours at room temperature of 25 ℃, and the results are recorded in Table 1.
3. Opening time: the polyurethane hot melt adhesives prepared in examples 1 to 8 were tested with reference to HG/T3716 to 2003 standards, and the results are reported in Table 1.
4. And (3) low-temperature testing: the polyurethane hot melt adhesives prepared in examples 1 to 8 were put in a refrigerator at-40 ℃ for 12 hours, taken out, placed in parallel at a height of 1.5 m, and subjected to free fall for three times, wherein the polyurethane hot melt adhesives were qualified in the case of no brittle fracture, and unqualified in the case of brittle fracture, and the results are recorded in table 1.
Test results
Table 1:
Claims (10)
1. the polyurethane hot melt adhesive for the thin base material is characterized by comprising the following raw materials in parts by mass: 30-50 parts of polyether polyol, 15-35 parts of polyester polyol, 15-50 parts of thermoplastic resin, 5-20 parts of tackifying resin and 8-15 parts of isocyanate.
2. The polyurethane hot melt adhesive for thin substrates as claimed in claim 1, wherein the polyether polyol has a number average molecular weight of 1000 to 3000g/mol.
3. The polyurethane hot melt adhesive for thin substrates as claimed in claim 1, wherein said polyester polyol is a crystalline polyester polyol.
4. The polyurethane hot melt adhesive for thin substrates as claimed in claim 2, wherein the number average molecular weight of the crystalline polyester polyol is 2000 to 4000g/mol.
5. The polyurethane hot melt adhesive for thin substrates is characterized in that the mass ratio of the polyether polyol to the crystalline polyester polyol is (1-3): 1.
6. The polyurethane hot melt adhesive for thin substrates as claimed in claim 1, wherein the thermoplastic resin is selected from one or more of thermoplastic acrylic resin, TPU resin and copolyester resin.
7. The polyurethane hot melt adhesive for thin substrates as claimed in claim 6, wherein the mass ratio of the thermoplastic acrylic resin to the TPU resin is 1: (1-3).
8. The polyurethane hot melt adhesive for thin substrates as claimed in claim 1, wherein the tackifying resin is selected from one or more of acrylic resin, C5 petroleum resin, C9 petroleum resin, rosin resin and terpene resin.
9. The polyurethane hot melt adhesive for thin substrates as claimed in claim 1, wherein the isocyanate is at least one selected from the group consisting of diphenylmethane diisocyanate, hexamethylene diisocyanate, isophorone diisocyanate, and dicyclohexylmethane diisocyanate.
10. A method for preparing a polyurethane hot melt adhesive for thin substrates according to any one of claims 1 to 9, comprising the steps of: putting polyether polyol, polyester polyol, tackifying resin and thermoplastic resin into a reaction kettle in sequence, fully and uniformly stirring, heating to 130-150 ℃ for melting, and dehydrating until no bubbles exist; keeping the temperature at 130-150 ℃ for 1-3 h, cooling to 70-90 ℃, adding isocyanate, heating to 100-110 ℃, reacting for 2h, and discharging to obtain the product.
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CN115124964A (en) * | 2022-07-27 | 2022-09-30 | 北京长润化工有限公司 | Moisture-curing polyurethane hot melt adhesive and preparation method and application thereof |
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