CN111849408A - Moisture-curing polyurethane hot melt adhesive with high initial adhesion strength and preparation method thereof - Google Patents
Moisture-curing polyurethane hot melt adhesive with high initial adhesion strength and preparation method thereof Download PDFInfo
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- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
- C09J175/04—Polyurethanes
- C09J175/08—Polyurethanes from polyethers
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
- C08G18/40—High-molecular-weight compounds
- C08G18/4009—Two or more macromolecular compounds not provided for in one single group of groups C08G18/42 - C08G18/64
- C08G18/4018—Mixtures of compounds of group C08G18/42 with compounds of group C08G18/48
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
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- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
- C08G18/40—High-molecular-weight compounds
- C08G18/4009—Two or more macromolecular compounds not provided for in one single group of groups C08G18/42 - C08G18/64
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
- C08G18/40—High-molecular-weight compounds
- C08G18/42—Polycondensates having carboxylic or carbonic ester groups in the main chain
- C08G18/4202—Two or more polyesters of different physical or chemical nature
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
- C08G18/40—High-molecular-weight compounds
- C08G18/42—Polycondensates having carboxylic or carbonic ester groups in the main chain
- C08G18/4236—Polycondensates having carboxylic or carbonic ester groups in the main chain containing only aliphatic groups
- C08G18/4238—Polycondensates having carboxylic or carbonic ester groups in the main chain containing only aliphatic groups derived from dicarboxylic acids and dialcohols
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
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- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
- C08G18/40—High-molecular-weight compounds
- C08G18/48—Polyethers
- C08G18/4825—Polyethers containing two hydroxy groups
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
- C08G18/40—High-molecular-weight compounds
- C08G18/48—Polyethers
- C08G18/4833—Polyethers containing oxyethylene units
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
- C08G18/40—High-molecular-weight compounds
- C08G18/48—Polyethers
- C08G18/4833—Polyethers containing oxyethylene units
- C08G18/4837—Polyethers containing oxyethylene units and other oxyalkylene units
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
- C08G18/40—High-molecular-weight compounds
- C08G18/48—Polyethers
- C08G18/4854—Polyethers containing oxyalkylene groups having four carbon atoms in the alkylene group
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
- C08G18/40—High-molecular-weight compounds
- C08G18/62—Polymers of compounds having carbon-to-carbon double bonds
- C08G18/6216—Polymers of alpha-beta ethylenically unsaturated carboxylic acids or of derivatives thereof
- C08G18/622—Polymers of esters of alpha-beta ethylenically unsaturated carboxylic acids
- C08G18/6225—Polymers of esters of acrylic or methacrylic acid
- C08G18/6229—Polymers of hydroxy groups containing esters of acrylic or methacrylic acid with aliphatic polyalcohols
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
- C09J175/04—Polyurethanes
- C09J175/06—Polyurethanes from polyesters
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G2170/00—Compositions for adhesives
- C08G2170/20—Compositions for hot melt adhesives
Abstract
The invention discloses a high initial adhesion strength moisture-curing polyurethane hot melt adhesive and a preparation method thereof, wherein the high initial adhesion strength moisture-curing polyurethane hot melt adhesive is prepared from the following raw materials in parts by weight: 20-50 parts of polyether polyol, 10-40 parts of crystalline polyester polyol, 5-30 parts of liquid polyester polyol, 10-20 parts of polyisocyanate, 10-35 parts of thermoplastic acrylic resin, 2-15 parts of tackifying resin, 0.1-0.5 part of catalyst and 0.1-1 part of antioxidant. The moisture-curing polyurethane hot melt adhesive provided by the invention has the advantages of long opening time, high initial adhesion strength, high curing speed, higher final adhesion strength, good damp and heat resistance and high and low temperature impact resistance, can achieve pressure-free maintenance and realizes high-efficiency production of electronic products.
Description
Technical Field
The invention belongs to the field of reactive polyurethane hot melt adhesives, and relates to a high initial adhesion strength reactive polyurethane hot melt adhesive for quickly assembling electronic products.
Background
The reactive moisture-curing polyurethane hot melt adhesive (PUR) has 100 percent of solid content and no solvent, is an environment-friendly adhesive, is quick to position, and is widely applied to the fields of household appliances, handheld electronic equipment, woodwork, textile, automobile interior trim and the like in recent years. The PUR is solid at normal temperature, is melted into liquid after being heated, and is applied to bonding of base materials. When the adhesive cools to become a solid, the initial strength is provided due to the cooling crystallization and physical crosslinking of the polyurethane prepolymer. The isocyanate then reacts with the substrate surface and moisture in the air to form chemical crosslinks that provide the final bond.
Traditional PUR hot melt adhesive is just viscous force little, needs longer pressurize time in the electron device manufacture process, and more pressurize tool has greatly reduced production efficiency. In order to improve the production efficiency and meet the requirement of a fast assembly flow line, the high-performance and high-initial-adhesion-strength polyurethane hot melt adhesive is increasingly required.
Disclosure of Invention
In order to solve the technical problems, the invention aims to improve the PUR hot melt adhesive with weak initial adhesion strength and long pressure maintaining time, improve the initial adhesion strength and shorten the pressure maintaining time under the condition of long opening time, and simultaneously have good damp and heat resistance and high and low temperature cold and hot impact resistance.
The technical scheme of the invention is as follows:
the utility model provides a high initial adhesion strength moisture cure polyurethane hot melt adhesive which characterized in that: the coating comprises the following components in parts by weight: 20-50 parts of polyether polyol, 10-40 parts of crystalline polyester polyol, 5-30 parts of liquid polyester polyol, 10-20 parts of polyisocyanate, 10-35 parts of thermoplastic acrylic resin, 2-15 parts of tackifying resin, 0.1-0.5 part of catalyst and 0.1-1 part of antioxidant.
Further, the polyether polyol has the number average molecular weight of 1000-4000; the polyether polyol is one or more of polyoxypropylene glycol, polyoxyethylene glycol, polyoxypropylene-oxyethylene glycol and polytetrahydrofuran ether.
Further, the number average molecular weight of the crystalline polyester polyol is 1000-4000; the crystalline polyester polyol is formed by polymerizing at least one acid of adipic acid, sebacic acid and dodecanoic acid with at least one alcohol of 1, 4-butanediol, neopentyl glycol, ethylene glycol, diethylene glycol and 1, 6-hexanediol, and comprises a mixture of one or more crystalline polyester polyols.
Further, the number average molecular weight of the liquid polyester polyol is 1000-4000; the liquid polyester polyol is prepared by performing polycondensation reaction on one or more of isophthalic acid, terephthalic acid, phthalic anhydride, adipic acid and sebacic acid and one or more of ethylene glycol, diethylene glycol, neopentyl glycol, 1, 4-butanediol, 1, 6-hexanediol and 3-methyl-1, 5-pentanediol.
Further, the polyisocyanate includes one or a mixture of two or more of 4, 4-diphenylmethane diisocyanate (MDI), 1, 3-diphenylmethane diisocyanate (XDI), Toluene Diisocyanate (TDI), Xylene Diisocyanate (XDI), Hexamethylene Diisocyanate (HDI), isophorone diisocyanate (IPDI), tetramethylxylene diisocyanate (TMXDI), carbodiimide-modified MDI, and naphthalene diisocyanate.
Further, the weight average molecular weight of the thermoplastic acrylic resin is 10000-50000; the acrylic resin comprises methyl acrylate, ethyl acrylate, butyl acrylate, methyl methacrylate, butyl methacrylate and copolymer; the acrylic acid contains active groups of hydroxyethyl acrylate and hydroxypropyl acrylate, and the hydroxyl value is 2-15mg KOH/g.
Furthermore, the tackifying resin is one or a mixture of terpene resin, rosin resin and petroleum resin.
Further, the catalyst is one or more of dibutyltin dilaurate, stannous octoate, dibutylene acetate, triethylene diamine and dimorpholinyl diethyl ether.
Further, the preparation steps are as follows:
step 1: putting polyether polyol, polyester polyol, acrylic resin, an antioxidant and tackifying resin into a reaction kettle according to a metering ratio, heating to 120 ℃, vacuumizing, stirring and dehydrating for 2 hours;
step 2: cooling to 70 ℃, adding diphenylmethane diisocyanate under the protection of nitrogen, slowly heating to 95 ℃, and stirring for reacting for 2 hours under the protection of nitrogen;
and step 3: adding dimorpholinyl diethyl ether under the protection of nitrogen, stirring at 95 ℃ for reaction for 15min, defoaming in vacuum, and sealing for storage to obtain the polyurethane hot melt adhesive.
Further, the vacuum degree in the step 1 is-0.09 Mpa to-0.1 Mpa.
By the scheme, the invention at least has the following advantages:
the moisture-curing polyurethane hot melt adhesive provided by the invention has the advantages of long opening time, high initial adhesion strength, high curing speed, higher final adhesion strength, good damp and heat resistance and high and low temperature impact resistance, can achieve pressure-free maintenance, and is used for realizing high-efficiency production of electronic products in electronic products.
The foregoing is a summary of the present invention, and in order to provide a clear understanding of the technical means of the present invention and to be implemented in accordance with the present specification, the following is a detailed description of the preferred embodiments of the present invention.
Detailed Description
The following examples are given to further illustrate the embodiments of the present invention. The following examples are intended to illustrate the invention but are not intended to limit the scope of the invention.
The preparation method of the reactive polyurethane hot melt adhesive comprises the following steps:
step 1: putting polyether polyol, polyester polyol, acrylic resin, an antioxidant and tackifying resin into a reaction kettle according to a metering ratio, heating to 120 ℃, vacuumizing (the vacuum degree is-0.09 Mpa to-0.1 Mpa), and stirring for dehydration for 2 hours;
Step 2: cooling to 70 ℃, adding diphenylmethane diisocyanate under the protection of nitrogen, slowly heating to 95 ℃, and stirring for reacting for 2 hours under the protection of nitrogen;
and step 3: adding dimorpholinyl diethyl ether under the protection of nitrogen, stirring at 95 ℃ for reaction for 15min, defoaming in vacuum, and sealing for storage to obtain the polyurethane hot melt adhesive.
Example 1
Adding 270g of polyether polyol, 210g of a mixture of polydodecanoic acid-1, 6-hexanediol ester diol and poly adipic acid-1, 6-hexanediol ester diol, 107g of liquid polyester polyol, 250g of hydroxy acrylic resin, 30g of tackifying resin and 1.9g of antioxidant into a reaction kettle, heating to 120 ℃, and vacuumizing (the vacuum degree is-0.09 Mpa to-0.1 Mpa), and stirring and dehydrating for 2 hours; cooling to 70 ℃, adding 130g of diphenylmethane diisocyanate under the protection of nitrogen, slowly heating to 95 ℃, and stirring for reaction for 2 hours under the protection of nitrogen; adding 2g of dimorpholinyl diethyl ether serving as a catalyst under the protection of nitrogen, stirring at 95 ℃ for reaction for 15min, defoaming in vacuum, and sealing for storage to prepare the polyurethane hot melt adhesive.
Example 2
Adding 270g of polyether polyol, 210g of a mixture of polysebacic acid-1, 6-hexanediol glycol and polyhexamethylene adipate-1, 6-hexanediol glycol, 107g of liquid polyester polyol, 250g of acrylic resin, 30g of tackifying resin and 1.9g of antioxidant into a reaction kettle, heating to 120 ℃, and vacuumizing (the vacuum degree is-0.09 Mpa to-0.1 Mpa), and stirring and dehydrating for 2 hours; cooling to 70 ℃, adding 127g of diphenylmethane diisocyanate under the protection of nitrogen, slowly heating to 95 ℃, and stirring for reaction for 2h under the protection of nitrogen; adding 2g of dimorpholinyl diethyl ether serving as a catalyst under the protection of nitrogen, stirring at 95 ℃ for reaction for 15min, defoaming in vacuum, and sealing for storage to prepare the polyurethane hot melt adhesive.
Example 3
Adding 280g of polyether polyol, 220g of a mixture of polysebacic acid-1, 6-hexanediol glycol and poly adipic acid-1, 4-butanediol glycol, 110g of liquid polyester polyol, 250g of hydroxy acrylic resin and 2g of antioxidant into a reaction kettle, heating to 120 ℃, vacuumizing (the vacuum degree is-0.09 Mpa to-0.1 Mpa), and stirring and dehydrating for 2 hours; cooling to 70 ℃, adding 135g of diphenylmethane diisocyanate under the protection of nitrogen, slowly heating to 95 ℃, and stirring for reaction for 2 hours under the protection of nitrogen; adding 2g of dimorpholinyl diethyl ether serving as a catalyst under the protection of nitrogen, stirring at 100 ℃ for reaction for 15min, defoaming in vacuum, and sealing for storage to prepare the polyurethane hot melt adhesive.
Example 4
Adding 280g of polyether polyol, 220g of a mixture of poly dodecanoic acid-1, 6-hexanediol ester diol and poly adipic acid-1, 4-butanediol ester diol, 110g of liquid polyester polyol, 250g of acrylic resin and 2g of antioxidant into a reaction kettle, heating to 120 ℃, vacuumizing (the vacuum degree is-0.09 MPa to-0.1 MPa), and stirring and dehydrating for 2 hours; cooling to 70 ℃, adding 135g of diphenylmethane diisocyanate under the protection of nitrogen, slowly heating to 95 ℃, and stirring for reaction for 2 hours under the protection of nitrogen; adding 2.5g of dimorpholinyl diethyl ether serving as a catalyst under the protection of nitrogen, stirring at 95 ℃ for reaction for 15min, defoaming in vacuum, and sealing for storage to prepare the polyurethane hot melt adhesive.
Comparative examples
Adding 350g of polyether polyol, 300g of a mixture of poly dodecanoic acid-1, 6-hexanediol ester diol and poly adipic acid-1, 6-hexanediol ester diol, 150g of liquid polyester polyol and 1.9g of antioxidant into a reaction kettle, heating to 120 ℃, vacuumizing (the vacuum degree is-0.09 MPa to-0.1 MPa), and stirring and dehydrating for 2 hours; cooling to 70 ℃, adding 137g of diphenylmethane diisocyanate under the protection of nitrogen, slowly heating to 95 ℃, and stirring for reacting for 2 hours under the protection of nitrogen; adding 3g of dimorpholinyl diethyl ether serving as a catalyst under the protection of nitrogen, stirring at 95 ℃ for reaction for 15min, defoaming in vacuum, and sealing for storage to prepare the polyurethane hot melt adhesive.
Table 1 results of performance tests of examples 1 to 4 and comparative examples
Test methods for examples and comparative examples:
and (3) viscosity testing: test using a Brookfield Thermosel viscometer at 110 ℃, 27# spindle.
Opening time: melting the adhesive at 130 deg.C for 20min, dispensing a 0.6mm wide glue line on the plastic substrate, and sticking PC sheet on the glue line at certain intervals, wherein the open time is the PC surface glue residue less than 50%.
Drawing strength: two 10mm by 40mm PC test pieces are crossly lapped, the thickness of a glue layer is 0.15mm, the pressure is maintained for 1min, the PC test pieces are cured under the environment of temperature and humidity of 25 +/-1 ℃/50 +/-5% RH, and the drawing test is carried out for 100 mm/min.
Cold and hot impact: after the glue is cured for 72h, the temperature is cycled from minus 40 ℃ to 70 ℃, 1h/cycle, 500cycles, and then the glue is kept for 24h at room temperature and tested at room temperature.
High temperature and high humidity: and after the glue is cured for 72h, the temperature and the humidity are 85 ℃/85% RH for 500h, then the glue is kept for 24h at room temperature, and the test is carried out at the room temperature.
The invention has at least the following advantages:
the moisture-curing polyurethane hot melt adhesive provided by the invention has the advantages of long opening time, high initial adhesion strength, high curing speed, higher final adhesion strength, good damp and heat resistance and high and low temperature impact resistance, can achieve pressure-free maintenance, and is used for realizing high-efficiency production of electronic products in electronic products.
The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, it should be noted that, for those skilled in the art, many modifications and variations can be made without departing from the technical principle of the present invention, and these modifications and variations should also be regarded as the protection scope of the present invention.
Claims (10)
1. The utility model provides a high initial adhesion strength moisture cure polyurethane hot melt adhesive which characterized in that: the coating comprises the following components in parts by weight: 20-50 parts of polyether polyol, 10-40 parts of crystalline polyester polyol, 5-30 parts of liquid polyester polyol, 10-20 parts of polyisocyanate, 10-35 parts of thermoplastic acrylic resin, 2-15 parts of tackifying resin, 0.1-0.5 part of catalyst and 0.1-1 part of antioxidant.
2. The high initial adhesion strength moisture-curable polyurethane hot melt adhesive according to claim 1, wherein the polyether polyol has a number average molecular weight of 1000 to 4000; the polyether polyol is one or more of polyoxypropylene glycol, polyoxyethylene glycol, polyoxypropylene-oxyethylene glycol and polytetrahydrofuran ether.
3. The high initial adhesion strength moisture-curing polyurethane hot melt adhesive according to claim 1, which is characterized in that: the number average molecular weight of the crystalline polyester polyol is 1000-4000; the crystalline polyester polyol is formed by polymerizing at least one acid of adipic acid, sebacic acid and dodecanoic acid with at least one alcohol of 1, 4-butanediol, neopentyl glycol, ethylene glycol, diethylene glycol and 1, 6-hexanediol, and comprises a mixture of one or more crystalline polyester polyols.
4. The high initial adhesion strength moisture-curing polyurethane hot melt adhesive according to claim 1, which is characterized in that: the number average molecular weight of the liquid polyester polyol is 1000-4000; the liquid polyester polyol is prepared by performing polycondensation reaction on one or more of isophthalic acid, terephthalic acid, phthalic anhydride, adipic acid and sebacic acid and one or more of ethylene glycol, diethylene glycol, neopentyl glycol, 1, 4-butanediol, 1, 6-hexanediol and 3-methyl-1, 5-pentanediol.
5. The high initial adhesion strength moisture-curing polyurethane hot melt adhesive according to claim 1, which is characterized in that: the polyisocyanate comprises one or a mixture of more than two of 4, 4-diphenylmethane diisocyanate (MDI), 1, 3-diphenylmethane diisocyanate (XDI), Toluene Diisocyanate (TDI), Xylene Diisocyanate (XDI), Hexamethylene Diisocyanate (HDI), isophorone diisocyanate (IPDI), tetramethylxylene diisocyanate (TMXDI), carbodiimide modified MDI and naphthalene diisocyanate.
6. The high initial adhesion strength moisture-curing polyurethane hot melt adhesive according to claim 1, which is characterized in that: the weight average molecular weight of the thermoplastic acrylic resin is 10000-50000; the acrylic resin comprises methyl acrylate, ethyl acrylate, butyl acrylate, methyl methacrylate, butyl methacrylate and copolymer; the acrylic acid contains active groups of hydroxyethyl acrylate and hydroxypropyl acrylate, and the hydroxyl value is 2-15mg KOH/g.
7. The high initial adhesion strength moisture-curing polyurethane hot melt adhesive according to claim 1, which is characterized in that: the tackifying resin is one or a mixture of terpene resin, rosin resin and petroleum resin.
8. The high initial adhesion strength moisture-curing polyurethane hot melt adhesive according to claim 1, which is characterized in that: the catalyst is one or more of dibutyltin dilaurate, stannous octoate, dibutylene acetate, triethylene diamine and dimorpholinyl diethyl ether.
9. The polyurethane hot melt adhesive according to any one of claims 1 to 9, wherein: the preparation steps are as follows:
step 1: putting polyether polyol, polyester polyol, acrylic resin, an antioxidant and tackifying resin into a reaction kettle according to a metering ratio, heating to 120 ℃, vacuumizing, stirring and dehydrating for 2 hours;
step 2: cooling to 70 ℃, adding diphenylmethane diisocyanate under the protection of nitrogen, slowly heating to 95 ℃, and stirring for reacting for 2 hours under the protection of nitrogen;
and step 3: adding dimorpholinyl diethyl ether under the protection of nitrogen, stirring at 95 ℃ for reaction for 15min, defoaming in vacuum, and sealing for storage to obtain the polyurethane hot melt adhesive.
10. The polyurethane hot melt adhesive of claim 9, wherein: the vacuum degree in the step 1 is-0.09 Mpa to-0.1 Mpa.
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Cited By (21)
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CN112226184A (en) * | 2020-11-16 | 2021-01-15 | 三友(天津)高分子技术有限公司 | High-temperature-resistant acrylate sealant |
CN112300744A (en) * | 2020-11-12 | 2021-02-02 | 无锡博锦高分子研究发展有限公司 | Reactive polyurethane pressure-sensitive adhesive for fan blade protective sleeve |
CN112552859A (en) * | 2020-12-29 | 2021-03-26 | 烟台信友新材料有限公司 | High-initial-adhesion low-shrinkage high-strength polyurethane hot melt adhesive and preparation method thereof |
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CN112300744A (en) * | 2020-11-12 | 2021-02-02 | 无锡博锦高分子研究发展有限公司 | Reactive polyurethane pressure-sensitive adhesive for fan blade protective sleeve |
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CN113528076A (en) * | 2020-12-31 | 2021-10-22 | 上海回天新材料有限公司 | Solvent-free single-component moisture-curing polyurethane adhesive for wearable equipment and preparation method thereof |
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CN113025257A (en) * | 2021-03-22 | 2021-06-25 | 上海华峰新材料研发科技有限公司 | Adhesive and preparation method and application thereof |
CN113388359A (en) * | 2021-06-28 | 2021-09-14 | 成都硅宝科技股份有限公司 | Edge-sealing reaction type moisture-curing polyurethane hot melt adhesive for furniture and preparation method thereof |
CN113388359B (en) * | 2021-06-28 | 2023-02-03 | 成都硅宝科技股份有限公司 | Edge-sealing reaction type moisture-curing polyurethane hot melt adhesive for furniture and preparation method thereof |
CN114736642A (en) * | 2021-08-02 | 2022-07-12 | 无锡市万力粘合材料股份有限公司 | Reactive polyurethane hot melt adhesive for fabricated building and preparation method thereof |
CN113683993A (en) * | 2021-08-11 | 2021-11-23 | 东莞华工佛塑新材料有限公司 | Moisture-curing polyurethane hot melt adhesive for pressure-maintaining-free electronic screen sealing and preparation method thereof |
CN113755124A (en) * | 2021-09-29 | 2021-12-07 | 康达新材料(集团)股份有限公司 | Reactive polyurethane hot melt adhesive for household soft bag |
CN113881386A (en) * | 2021-10-27 | 2022-01-04 | 张家港飞腾复合新材料股份有限公司 | Composite hot melt adhesive and composite board using same |
CN113980218B (en) * | 2021-10-29 | 2022-07-19 | 河南省科学院化学研究所有限公司 | Moisture-curing polyurethane hot-melt adhesive and preparation method and application thereof |
CN113980218A (en) * | 2021-10-29 | 2022-01-28 | 河南省科学院化学研究所有限公司 | Moisture-curing polyurethane hot-melt adhesive and preparation method and application thereof |
CN115011300A (en) * | 2021-12-14 | 2022-09-06 | 烟台德邦科技股份有限公司 | High-temperature-resistant polyurethane hot melt adhesive and preparation method thereof |
CN114907810A (en) * | 2022-07-15 | 2022-08-16 | 山东科力美实业有限公司 | Reactive polyurethane hot melt adhesive and continuous method double-screw extrusion process thereof |
CN115627149A (en) * | 2022-11-07 | 2023-01-20 | 华南理工大学 | Epoxidized hydroxyl-terminated polybutadiene modified moisture-curing polyurethane hot melt adhesive and preparation method thereof |
CN115627149B (en) * | 2022-11-07 | 2024-02-06 | 华南理工大学 | Epoxidized hydroxyl-terminated polybutadiene modified moisture-cured polyurethane hot melt adhesive and preparation method thereof |
CN115820193A (en) * | 2022-11-30 | 2023-03-21 | 康菲胶粘剂技术(广东)有限公司 | Polyurethane hot melt adhesive for thin base material and preparation method thereof |
CN117402579A (en) * | 2023-10-16 | 2024-01-16 | 康菲胶粘剂技术(广东)有限公司 | Polyurethane hot melt adhesive for special-shaped edge sealing and preparation method thereof |
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