CN115798785A - Printed circuit silver paste for automotive interior functional device and preparation method thereof - Google Patents
Printed circuit silver paste for automotive interior functional device and preparation method thereof Download PDFInfo
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- CN115798785A CN115798785A CN202211587244.5A CN202211587244A CN115798785A CN 115798785 A CN115798785 A CN 115798785A CN 202211587244 A CN202211587244 A CN 202211587244A CN 115798785 A CN115798785 A CN 115798785A
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- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 title claims abstract description 169
- 229910052709 silver Inorganic materials 0.000 title claims abstract description 101
- 239000004332 silver Substances 0.000 title claims abstract description 101
- 238000002360 preparation method Methods 0.000 title claims abstract description 29
- 239000003822 epoxy resin Substances 0.000 claims abstract description 63
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 63
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Chemical compound NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 claims abstract description 47
- 239000004202 carbamide Substances 0.000 claims abstract description 47
- 239000000654 additive Substances 0.000 claims abstract description 39
- 230000000996 additive effect Effects 0.000 claims abstract description 39
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 claims abstract description 29
- 239000002245 particle Substances 0.000 claims abstract description 8
- 239000000203 mixture Substances 0.000 claims description 15
- 238000000034 method Methods 0.000 claims description 9
- 238000005096 rolling process Methods 0.000 claims description 9
- 238000007789 sealing Methods 0.000 claims description 6
- 239000007787 solid Substances 0.000 claims description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 5
- 238000005303 weighing Methods 0.000 claims description 5
- 238000000227 grinding Methods 0.000 claims description 4
- 238000002156 mixing Methods 0.000 claims description 4
- 125000002723 alicyclic group Chemical group 0.000 claims description 3
- 239000004844 aliphatic epoxy resin Substances 0.000 claims description 3
- 239000004841 bisphenol A epoxy resin Substances 0.000 claims description 3
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 claims description 3
- -1 glycidyl ester Chemical class 0.000 claims description 3
- 239000004845 glycidylamine epoxy resin Substances 0.000 claims description 3
- 238000003756 stirring Methods 0.000 claims description 3
- 239000007788 liquid Substances 0.000 claims 1
- 238000003466 welding Methods 0.000 abstract description 4
- 238000001723 curing Methods 0.000 description 14
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 8
- 238000009472 formulation Methods 0.000 description 7
- 239000000758 substrate Substances 0.000 description 7
- 238000012360 testing method Methods 0.000 description 6
- 230000000694 effects Effects 0.000 description 3
- 238000007639 printing Methods 0.000 description 3
- 238000007650 screen-printing Methods 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000013035 low temperature curing Methods 0.000 description 2
- 238000010146 3D printing Methods 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- DJUWPHRCMMMSCV-UHFFFAOYSA-N bis(7-oxabicyclo[4.1.0]heptan-4-ylmethyl) hexanedioate Chemical compound C1CC2OC2CC1COC(=O)CCCCC(=O)OCC1CC2OC2CC1 DJUWPHRCMMMSCV-UHFFFAOYSA-N 0.000 description 1
- JRPRCOLKIYRSNH-UHFFFAOYSA-N bis(oxiran-2-ylmethyl) benzene-1,2-dicarboxylate Chemical compound C=1C=CC=C(C(=O)OCC2OC2)C=1C(=O)OCC1CO1 JRPRCOLKIYRSNH-UHFFFAOYSA-N 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 231100000252 nontoxic Toxicity 0.000 description 1
- 230000003000 nontoxic effect Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 230000002195 synergetic effect Effects 0.000 description 1
- 235000012431 wafers Nutrition 0.000 description 1
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- Epoxy Resins (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
The invention discloses a printed circuit silver paste for an automotive interior functional device and a preparation method thereof, wherein the silver paste comprises silver powder, an organic carrier and an additive, the silver powder is spherical silver powder and/or flake silver powder, the particle diameter of the spherical silver powder is 0.3-5 microns, and the particle diameter of the flake silver powder is 3-15 microns; the organic carrier consists of epoxy resin and dicyandiamide; the additive is an organic urea accelerator and/or hydrazide; according to the mass percentage, the silver powder accounts for 55-92% of the total mass of the silver paste, and the organic carrier and the additive together account for 8-45% of the total mass of the silver paste. The silver paste can be cured at a low temperature of 120 ℃ or even lower, and can simultaneously ensure that the silver paste can achieve lower volume resistivity and larger welding tension.
Description
Technical Field
The invention relates to the technical field of conductive silver paste, in particular to printed circuit silver paste for an automotive interior functional device and a preparation method thereof.
Background
In the current manufacturing process, conductive circuits are required to be printed on the heat-labile substrates to realize communication of all functional devices and realize related functions. However, the curing temperature of the low-temperature curing silver paste in the current market is generally about 195 ℃, which has been monopolized abroad for a long time, the lower-temperature curing silver paste is in a shortage state in the market, and in order to realize printing on a heat-labile substrate, research on curing of the silver paste under the low-temperature condition has been carried out for several years, but generally, along with the reduction of the curing temperature and the reduction of the curing time of the silver paste, the performance of the prepared conductive silver paste is generally poor, most obviously, the volume resistivity of the silver paste cannot be controlled at a lower value, which is generally higher than 8 x 10 -5 Omega cm, and the welding tension is generally not high and is generally lower than 2.0N. Therefore, there is a need to develop a new conductive silver paste on a thermolabile substrate and a method for preparing the same, so as to fill the gap of the silver paste in the current market.
Disclosure of Invention
The invention aims to provide a printed circuit silver paste for an automotive interior functional device and a preparation method thereof. The silver paste can be cured at a low temperature of 120 ℃ or even lower, and can simultaneously ensure that the silver paste can achieve lower volume resistivity and larger welding tension.
The technical scheme of the invention is as follows: the printed circuit silver paste for the functional device of the automotive interior comprises silver powder, an organic carrier and an additive, wherein the silver powder is spherical silver powder and/or flake silver powder, the particle size of the spherical silver powder is 0.3-5 micrometers, and the particle size of the flake silver powder is 3-15 micrometers;
the organic carrier consists of epoxy resin and dicyandiamide;
the additive is an organic urea accelerator and/or hydrazide;
according to the mass percentage, the silver powder accounts for 55-92% of the total mass of the silver paste, and the organic carrier and the additive together account for 8-45% of the total mass of the silver paste.
In the printed circuit silver paste for the functional device of the automobile interior, when the additive is the combination of the organic urea accelerator and the hydrazide, in the organic carrier and the additive, the mass of the dicyandiamide is 1-17% of that of the epoxy resin; the mass of the organic urea accelerant is 0.5-7% of that of the epoxy resin; the mass of the hydrazide is 1-7% of that of the epoxy resin;
when the additive is only the organic urea accelerator, the mass of the dicyandiamide in the organic carrier and the additive is 1-17% of that of the epoxy resin; the mass of the organic urea accelerant is 0.5-7% of that of the epoxy resin;
when the additive is only hydrazide, the mass of dicyandiamide in the organic carrier and the additive is 1-17% of the mass of the epoxy resin; the mass of the hydrazide is 1-7% of that of the epoxy resin.
In the printed circuit silver paste for the functional device of the automobile interior, the epoxy resin is one or more of glycidyl ether epoxy resin, glycidyl ester epoxy resin, glycidyl amine epoxy resin, aliphatic epoxy resin and alicyclic epoxy resin.
In the silver paste for the printed circuit of the automobile interior functional device, the organic urea accelerator is one or more of Anyhard 2020P, ecure20, UR200, UR300, UR500, omicure U-24, omicure U-35, omicure U-205, omicure U-52, omicure U-415, U-cat 3512T, U-cat3513 and U-cat 3513T.
In the foregoing printed circuit silver paste for functional devices of automotive interiors, when the additive is only an organic urea accelerator, the organic urea accelerator is UR300, and the epoxy resin is bisphenol a type epoxy resin; the mass of the organic urea accelerator is 3% of that of the epoxy resin, and the mass of the dicyandiamide is 7% of that of the epoxy resin; the ratio of the mass of the silver powder to the total mass of the organic vehicle and additive is greater than 5.5.
In the aforementioned printed circuit silver paste for automotive interior functional devices, when the additive is a combination of an organic urea accelerator and a hydrazide, the organic urea accelerator consists of UR200, UR300 and UR500 in a mass ratio of 1; the total mass of the organic urea accelerator is 3% of the total mass of the epoxy resin, the mass of the dicyandiamide is 7% of the total mass of the epoxy resin, and the mass of the hydrazide is 1% of the total mass of the epoxy resin; the ratio of the mass of the silver powder to the total mass of the organic vehicle and additive is greater than 5.0.
The preparation method of the printed circuit silver paste for the functional device of the automotive interior comprises the following steps:
step 1, weighing epoxy resin, dicyandiamide, an organic urea accelerator and/or hydrazide in sequence according to a formula;
dissolving or dispersing dicyandiamide, an organic urea accelerator and/or hydrazide in epoxy resin, mechanically stirring to fully and uniformly mix the dicyandiamide, the organic urea accelerator and/or hydrazide, and sealing and storing to obtain an organic component M;
and 3, weighing the silver powder and the organic component M obtained in the step 2 according to the formula, fully mixing the silver powder and the organic component M by using a homogenizing mixer, and repeatedly rolling for several times by using a three-roll grinder until the fineness of the mixture is below 10 micrometers after the silver powder and the organic component M are uniformly mixed.
In the preparation method of the printed circuit silver paste for the automotive interior functional device, when the silver powder and the organic component M are mixed in the step 3, the silver powder is equally divided into 3 parts and sequentially added into the organic component M, and after each addition of the silver powder, the silver powder is uniformly stirred by the homogenizer and then the next part of the silver powder is added.
In the preparation method of the printed circuit silver paste for the functional device of the automotive interior, the silver powder and the organic component M are fully mixed, and then the mixture is rolled for 4-6 times by a three-roll grinder.
In the foregoing method for preparing the printed circuit silver paste for functional devices of automotive interiors, in step 2, the epoxy resin, dicyandiamide, organic urea accelerator and/or hydrazide are added into the flask, and the mixture is mechanically stirred for 2 hours at 300r/min in a water bath at 25 ℃ until the solid is completely dissolved or dispersed in the epoxy resin.
Compared with the prior art, the invention has the beneficial effects that: the silver paste can realize low-temperature curing, the lowest curing temperature can reach 90 ℃, the curing can be completed within 30 minutes at 120 ℃, and the volume resistivity of the silver paste prepared by the formula and the preparation method is generally not higher than 90 multiplied by 10 -8 Omega · m; by adjusting the formula of the silver paste (mainly introducing hydrazide and adjusting the organic components in a correlation manner), the volume resistivity of the finally prepared silver paste can be even lower than 6 multiplied by 10 under the premise that curing is completed within 30 minutes at 120 DEG C -8 Omega.m, welding tension larger than 2.0N and moderate viscosity. The silver paste greatly expands the application range of the existing silver paste, can be used for printing heat-resistant substrates such as silicon wafers, glass and the like, and can also be used for printing heat-intolerant substrates such as PET, PC and the like. The silver paste disclosed by the invention is safe, environment-friendly, non-toxic and harmless, and can be stably stored for 12-24 months.
Detailed Description
The present invention is further illustrated by the following examples, which are not to be construed as limiting the invention.
The silver paste consists of silver powder, an organic carrier and an additive, wherein the silver powder is spherical silver powder and/or flake silver powder, the particle size of the spherical silver powder is 0.3-5 micrometers, and the particle size of the flake silver powder is 3-15 micrometers; the organic carrier consists of epoxy resin and dicyandiamide; the additive is an organic urea accelerator and/or hydrazide; according to the mass percentage, the silver powder accounts for 55-92% of the total mass of the silver paste, and the organic carrier and the additive together account for 8-45% of the total mass of the silver paste.
When the additive is the combination of the organic urea accelerator and the hydrazide, the mass of the dicyandiamide in the organic carrier and the additive accounts for 1-17% of that of the epoxy resin; the mass of the organic urea accelerant is 0.5-7% of that of the epoxy resin; the mass of the hydrazide is 1-7% of that of the epoxy resin;
when the additive is only the organic urea accelerator, the mass of the dicyandiamide in the organic carrier and the additive is 1-17% of that of the epoxy resin; the mass of the organic urea accelerant is 0.5-7% of that of the epoxy resin;
when the additive is only hydrazide, the mass of dicyandiamide in the organic carrier and the additive is 1-17% of the mass of the epoxy resin; the mass of the hydrazide is 1-7% of that of the epoxy resin.
The epoxy resin is one or more of glycidyl ether epoxy resin, glycidyl ester epoxy resin, glycidyl amine epoxy resin, aliphatic epoxy resin and alicyclic epoxy resin.
The organic urea accelerator is one or more of Anyhard 2020P, ecure20, UR200, UR300, UR500, omicure U-24, omicure U-35, omicure U-205, omicure U-52, omicure U-415, U-cat 3512T, U-cat3513 and U-cat 3513T.
Based on the above-defined conditions, the combination of organic vehicle and additive is recorded as organic component M, and a formulation of 13 organic components M as shown in table 1 below is prepared:
TABLE 1 formulation of organic component M (unit: g)
In the present invention, the hydrazide functions in the formulation as an organic urea accelerator, both to lower the temperature of the reaction of dicyandiamide with the epoxy resin, to shorten the time required for the reaction, and to improve the curing efficiency. The effect of the hydrazide and the organic urea accelerator is almost the same when used alone, but the effect of the hydrazide and the organic urea accelerator is better than that of the hydrazide and the organic urea accelerator when used together according to a certain proportion.
The following 10 silver paste formulations shown in table 2 were prepared from the organic component M formulation of table 1 in combination with silver powder:
TABLE 2 silver paste formula
Example 1: a printed circuit silver paste for an automotive interior functional device is prepared by selecting a No. 2 organic component M formula in a table 1, preparing 10 batches of silver pastes with different silver powder contents according to the silver paste formula in the table 2, and numbering the silver pastes from top to bottom in sequence according to the table as 2A-2J. The steps of the silver paste preparation method are divided into two parts, namely preparation of the organic component M and preparation of the silver paste.
Preparation of organic component M: 100g of bisphenol A epoxy resin, 4g of dicyandiamide and 200 g of organic urea accelerator UR are respectively weighed and placed in a 500ml flask, mechanically stirred for 2 hours at 300r/min in a water bath at 25 ℃ until the solid is completely dissolved or uniformly dispersed in the epoxy resin bisphenol A, and the organic component M is obtained and stored in a sealed way for standby.
Silver paste preparation: according to the silver paste formula in the table 2, the silver powder and the organic component M of the specified type are weighed in sequence by specified amounts, then the silver powder is added into the organic component M by three times, and the silver powder is added again after being uniformly stirred by a homogenizing stirrer after being added once. And finally, rolling the silver paste uniformly mixed by the homogenizing mixer for 5 times by using a three-roll grinding machine until the fineness is below 10 micrometers, stopping rolling, finishing the preparation of the silver paste, and sealing and storing at room temperature.
After the silver paste is prepared, the viscosity and the resistivity after curing for 30 minutes at 120 ℃ are tested, and the related test results are shown in table 3:
table 3 different batch silver paste testing
Example 2: a kind of printed circuit silver paste used for functional device of the automotive interior, choose 7# organic component M formulation in table 1, according to preparing 10 batches of silver pastes of different silver powder contents of silver paste formulation in table 2, number 3A-3J from top to bottom sequentially according to the table order. The steps of the silver paste preparation method are divided into two parts, namely preparation of the organic component M and preparation of the silver paste.
Preparation of organic component M: 100g of bisphenol A epoxy resin, 7g of dicyandiamide and 300 g of organic urea accelerator UR are respectively weighed and placed in a 500ml flask, and mechanically stirred for 2 hours at 300r/min in a water bath at 25 ℃ until the solid is completely dissolved or uniformly dispersed in the epoxy resin bisphenol A, so that the organic component M is obtained and sealed for storage.
Silver paste preparation: according to the silver paste formula in the table 2, the silver powder and the organic component M of the specified type are weighed in sequence by specified amounts, then the silver powder is added into the organic component M by three times, and the silver powder is added again after being uniformly stirred by a homogenizing stirrer after being added once. And finally, rolling the silver paste uniformly mixed by the homogenizing mixer for 5 times by using a three-roll grinding machine until the fineness is below 10 micrometers, stopping rolling, finishing the preparation of the silver paste, and sealing and storing at room temperature.
After the silver paste is prepared, the viscosity and the resistivity after curing for 30 minutes at 120 ℃ are tested, and the related test results are shown in table 4:
table 4 different batch silver paste testing
Example 3: a13 # organic component M formula in a table 1 is selected, 10 batches of silver pastes with different silver powder contents are prepared according to the silver paste formula in a table 2, and the silver pastes are numbered as 4A-4J from top to bottom in sequence according to the table. The steps of the silver paste preparation method are divided into two parts, namely preparation of the organic component M and preparation of the silver paste.
Preparation of organic component M: respectively weighing 40g of bisphenol A type epoxy resin, 40g of bis ((3, 4-epoxycyclohexyl) methyl) adipate, 20g of diglycidyl phthalate, 7g of dicyandiamide, 200 g of organic urea accelerator UR, 300 g of UR, 500 g of UR and 1g of hydrazide in a 500ml flask, mechanically stirring for 2 hours at 300r/min in a water bath at 25 ℃ until the solid is completely dissolved or uniformly dispersed in the epoxy resin bisphenol A type, and obtaining the organic component M, sealing and storing for later use.
Silver paste preparation: according to the silver paste formula of table 2, the silver powder and the organic component M of the specified type are weighed in sequence, then the silver powder is added into the organic component M in three times, and the silver powder is added again after being uniformly stirred by a homogenizing mixer after being added once. And finally, rolling the silver paste uniformly mixed by the homogenizing mixer for 5 times by using a three-roll grinding machine until the fineness is below 10 micrometers, stopping rolling, finishing the preparation of the silver paste, and sealing and storing at room temperature.
After the silver paste is prepared, the viscosity and the resistivity after curing for 30 minutes at 120 ℃ are tested, and the related test results are shown in table 5:
table 5 different batch silver paste testing
The viscosity value of the invention is related to the difficulty of screen passing during the screen printing of the paste, the higher the viscosity, the more difficult the screen passing through, on the contrary, the lower the viscosity, the more easy the screen passing through, and the too high and too low viscosity are not beneficial to the application of the silver paste, so the silver paste needs to be in a proper value, and the viscosity performance is moderate when the 13# organic component M is selected from the silver paste, and the application is strongest in all the components as can be seen from tables 3,4 and 5.
Tables 3,4 and 5 also compare the influence of the silver paste with different organic components M on the conductivity after curing, and as can be seen from the comparison of the three tables, the volume resistivity of the silver paste prepared with the organic component M13 # is the lowest, which indicates that the conductivity of the silver paste under the component is the best, and in addition, through the selection of the type of the silver paste and the control of the curing time, the volume resistivity of the silver paste prepared by the invention can be even lower than 6 multiplied by 10 -8 Omega m, the application range of the silver paste is greatly expanded, and the effect is achieved under the synergistic cooperation of the hydrazide and the organic urea accelerator.
It should be noted that the silver paste of the present invention can be used for all substrates which can endure a temperature of 90 ℃ or above, and therefore, it can be understood that the silver paste can be applied to automotive interior functional devices and products related to intelligent control thereof, and can also be applied to other fields, such as screen printing circuits, 3D printing fields or electronic component packaging, etc., without being excluded.
The silver paste of the present invention is studied for thermolabile substrates, and therefore, is not limited to applications in functional devices for automotive interior and products related to intelligent control thereof. Other methods such as screen printing circuit, preparation of solar cell front and back electrodes can also adopt the silver paste of the invention to print patterns or products meeting the use requirements.
The above is only a preferred embodiment of the present invention, and the protection scope of the present invention is not limited to the above-mentioned examples, and all technical solutions belonging to the idea of the present invention belong to the protection scope of the present invention. It should be noted that modifications and embellishments within the scope of the invention may occur to those skilled in the art without departing from the principle of the invention, and are considered to be within the scope of the invention.
Claims (10)
1. The utility model provides a printed circuit silver thick liquid for automotive interior functional device, includes silver powder, organic carrier and additive, its characterized in that:
the silver powder is spherical silver powder and/or flake silver powder, the particle size of the spherical silver powder is 0.3-5 micrometers, and the particle size of the flake silver powder is 3-15 micrometers;
the organic carrier consists of epoxy resin and dicyandiamide;
the additive is an organic urea accelerator and/or hydrazide;
according to the mass percentage, the silver powder accounts for 55-92% of the total mass of the silver paste, and the organic carrier and the additive together account for 8-45% of the total mass of the silver paste.
2. The printed circuit silver paste for automotive interior functional devices according to claim 1, characterized in that: when the additive is the combination of the organic urea accelerator and the hydrazide, the mass of the dicyandiamide in the organic carrier and the additive accounts for 1-17% of that of the epoxy resin; the mass of the organic urea accelerator is 0.5-7% of that of the epoxy resin; the mass of the hydrazide is 1-7% of that of the epoxy resin;
when the additive is only the organic urea accelerator, the mass of the dicyandiamide in the organic carrier and the additive is 1-17% of that of the epoxy resin; the mass of the organic urea accelerant is 0.5-7% of that of the epoxy resin;
when the additive is only hydrazide, the mass of dicyandiamide in the organic carrier and the additive is 1-17% of that of the epoxy resin; the mass of the hydrazide is 1-7% of that of the epoxy resin.
3. The printed circuit silver paste for automotive interior functional devices according to claim 2, characterized in that: the epoxy resin is one or more of glycidyl ether epoxy resin, glycidyl ester epoxy resin, glycidyl amine epoxy resin, aliphatic epoxy resin and alicyclic epoxy resin.
4. The printed circuit silver paste for functional devices in automotive interiors according to claim 3, characterized by: the organic urea accelerator is one or more of Anyhard 2020P, ecure20, UR200, UR300, UR500, omicure U-24, omicure U-35, omicure U-205, omicure U-52, omicure U-415, U-cat 3512T, U-cat3513 and U-cat 3513T.
5. The printed circuit silver paste for functional devices in automotive interiors according to claim 4, characterized in that: when the additive is only an organic urea accelerator, the organic urea accelerator is UR300, and the epoxy resin is bisphenol A epoxy resin; the mass of the organic urea accelerator is 3% of that of the epoxy resin, and the mass of the dicyandiamide is 7% of that of the epoxy resin;
the ratio of the mass of the silver powder to the total mass of the organic vehicle and additive is greater than 5.5.
6. The printed circuit silver paste for functional devices in automotive interiors according to claim 4, characterized in that: when the additive is a combination of an organic urea accelerator and a hydrazide, the organic urea accelerator consists of UR200, UR300 and UR500 in a mass ratio of 1; the total mass of the organic urea accelerant is 3% of the total mass of the epoxy resin, the mass of the dicyandiamide is 7% of the total mass of the epoxy resin, and the mass of the hydrazide is 1% of the total mass of the epoxy resin;
the ratio of the mass of the silver powder to the total mass of the organic vehicle and additive is greater than 5.0.
7. The preparation method of the printed circuit silver paste for the functional device of the automobile interior trim according to any one of claims 1 to 6, is characterized by comprising the following steps:
step 1, weighing epoxy resin, dicyandiamide, organic urea accelerator and/or hydrazide in sequence according to a formula;
dissolving or dispersing dicyandiamide, an organic urea accelerator and/or hydrazide in epoxy resin, mechanically stirring to fully and uniformly mix the dicyandiamide, the organic urea accelerator and/or hydrazide, and sealing and storing to obtain an organic component M;
and 3, weighing the silver powder and the organic component M obtained in the step 2 according to the formula, fully mixing the silver powder and the organic component M by using a homogenizing mixer, and repeatedly rolling for several times by using a three-roll grinding machine after uniformly mixing until the fineness of the mixture is less than 10 micrometers.
8. The method for preparing the printed circuit silver paste for the functional device of automobile interior according to claim 7, wherein the method comprises the following steps: and 3, when the silver powder is mixed with the organic component M in the step 3, the silver powder is equally divided into 3 parts and sequentially added into the organic component M, and the next part of silver powder is added after the silver powder is uniformly stirred by a homogenizing stirrer each time.
9. The method for preparing the printed circuit silver paste for the functional device of the automobile interior according to claim 8, wherein the method comprises the following steps: and after fully mixing the silver powder and the organic component M, rolling the mixture for 4-6 times by using a three-roll grinder.
10. The method for preparing the printed circuit silver paste for the functional device of the automobile interior according to claim 7, wherein the method comprises the following steps: in the step 2, the epoxy resin, dicyandiamide, organic urea accelerator and/or hydrazide are added into a flask, and the mixture is mechanically stirred for 2 hours at 300r/min in a water bath at 25 ℃ until the solid is completely dissolved or dispersed in the epoxy resin.
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