CN115784596A - Processing method of regular micro-nano structure on glass surface - Google Patents
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- 239000011521 glass Substances 0.000 title claims abstract description 63
- 239000002086 nanomaterial Substances 0.000 title claims abstract description 23
- 238000003672 processing method Methods 0.000 title claims abstract description 18
- 238000012545 processing Methods 0.000 claims abstract description 31
- 229910003460 diamond Inorganic materials 0.000 claims abstract description 27
- 239000010432 diamond Substances 0.000 claims abstract description 27
- 238000000034 method Methods 0.000 claims description 22
- 238000011084 recovery Methods 0.000 claims description 9
- 238000006073 displacement reaction Methods 0.000 claims description 8
- 238000004140 cleaning Methods 0.000 claims description 2
- 238000001035 drying Methods 0.000 claims description 2
- 238000004506 ultrasonic cleaning Methods 0.000 claims description 2
- 238000006748 scratching Methods 0.000 claims 1
- 230000002393 scratching effect Effects 0.000 claims 1
- 239000000463 material Substances 0.000 abstract description 30
- 238000002834 transmittance Methods 0.000 abstract description 10
- 238000002310 reflectometry Methods 0.000 abstract description 4
- 230000009471 action Effects 0.000 abstract description 3
- 238000003754 machining Methods 0.000 description 12
- 230000008569 process Effects 0.000 description 10
- 239000010410 layer Substances 0.000 description 6
- 230000000694 effects Effects 0.000 description 5
- 238000009825 accumulation Methods 0.000 description 4
- 238000013461 design Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000003287 optical effect Effects 0.000 description 3
- 238000005520 cutting process Methods 0.000 description 2
- 230000004313 glare Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000005304 optical glass Substances 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- 238000002679 ablation Methods 0.000 description 1
- 230000006978 adaptation Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000005234 chemical deposition Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000001066 destructive effect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000004438 eyesight Effects 0.000 description 1
- 230000036541 health Effects 0.000 description 1
- 238000000608 laser ablation Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000005289 physical deposition Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000010008 shearing Methods 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P40/00—Technologies relating to the processing of minerals
- Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
- Y02P40/57—Improving the yield, e-g- reduction of reject rates
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Abstract
The invention relates to a processing method of a regular micro-nano structure on a glass surface, which comprises the steps of utilizing a rectangular pyramid diamond cutter to sequentially score on the glass surface along a first direction, wherein the edge of the cutter faces forwards during scoring, so that a plurality of first grooves which are arranged side by side are obtained; sequentially scribing on the surface of the glass along a second direction by using a rectangular pyramid diamond cutter, wherein the first direction is vertical to the second direction, and the face of the cutter is forward during scribing to obtain a plurality of second grooves which are arranged side by side; the plurality of first grooves and the plurality of second grooves intersect to form a pyramid structure on the surface of the glass. The plastic flow of the material is promoted by the pushing action when the edge is forward to increase the height and the depth-to-width ratio of the structure under the same load, then the material is sheared and removed by the front tool face which is used for processing the front face at 90 degrees in a crossed mode, the blockage of a groove structure caused by the flow of the material is avoided, an equivalent metamorphic layer with continuous graded refractive index can be obtained on the surface of the glass, the light transmittance when the visible light wave band is incident at all angles is improved, and the reflectivity is reduced.
Description
Technical Field
The invention belongs to the technical field of optical glass processing, and particularly relates to a processing method of a glass surface regular micro-nano structure.
Background
The optical glass has higher transmittance and lower reflectivity in a visible light waveband, but internal reflection is easy to occur when a light source enters through a multilayer interface with unmatched refractive indexes and a large angle in an optical component so as to reduce the actual light output rate. In addition, under the environment of strong light source, the specular reflection generated on the surface interface can cause the glare effect to seriously threaten the eyesight health of the user. Therefore, it is necessary to further improve the transmittance and reduce the reflectance at any incident angle in the visible light range. The regular micro-nano structure with a specific period and a specific shape is directly prepared on the surface of the glass, when the characteristic size of the microstructure is smaller than the wavelength of light, the incident light is equivalent to passing through a transition layer with continuous graded refractive index, the reflection phenomenon of a surface interface is completely eliminated, the light-emitting rate of an optical component can be effectively improved, and the glare effect is inhibited.
The traditional antireflection method is to cover one or more layers of antireflection films on the surface of an optical element, utilize reflected light to generate destructive interference to reduce surface reflection, design the refractive index of a single-layer or multi-layer film under corresponding target wavelength according to the refractive index of a matrix, prepare the film through physical or chemical deposition and attach the film to the surface of a material, so that the transmissivity can be effectively improved within a certain range, but the antireflection with small angle and specific wavelength can only be realized, and the problems of interface combination, thermal expansion coefficient adaptation, refractive index matching and the like exist between the film layer and a substrate. The nano-imprinting technology can easily prepare a large-area microstructure, effectively improves the production efficiency, and has higher preparation requirements on the template, difficult processing of the template with the micro-nano scale and higher manufacturing cost. The laser ablation processing microstructure has the advantages of low cost, high efficiency, high precision and the like, and is widely applied, but the influence of the diameter of a light spot on the structural period during laser processing and the defects caused by factors such as structural deformation, material sputtering, component modification and the like due to the thermal effect during ablation need to be considered. It is widely believed that the method of mechanical removal by tool-to-material interference can ensure the surface type precision of the machined surface and microstructure, but glass is a hard and brittle material, so that the problem of how to ensure that a complete regular microstructure without surface/subsurface cracks is obtained in the machining process is still to be solved.
Disclosure of Invention
Aiming at the technical problems in the prior art, the invention aims to: the processing method of the regular micro-nano structure on the glass surface is provided, an equivalent altered layer with continuous gradient refractive index can be obtained on the glass surface, the interface between air and a medium is effectively eliminated, the light transmittance is improved when the visible light wave band is incident at all angles, and the reflectivity is reduced.
The purpose of the invention is realized by the following technical scheme:
a processing method of a regular micro-nano structure on a glass surface comprises the following steps,
sequentially scribing on the surface of the glass along a first direction by using a rectangular pyramid diamond cutter, wherein the edge of the cutter faces forwards during scribing, so that a plurality of first grooves which are arranged side by side are obtained;
sequentially scribing on the surface of the glass along a second direction by using a rectangular pyramid diamond cutter, wherein the first direction is vertical to the second direction, and the face of the cutter is forward during scribing to obtain a plurality of second grooves which are arranged side by side;
the plurality of first grooves and the plurality of second grooves intersect to form a pyramid structure on the surface of the glass.
Further, the actual scribing depth of the first groove is h s1 ，
Wherein the included angle of the edges of the rectangular pyramid diamond cutter is alpha, the normal force applied during processing is P, the glass hardness is H, and the elastic recovery rate of the glass is mu when the edges are scribed forwards 1 。
Further, the actual scribing depth of the second groove is h s2 ，
Wherein the included angle of the rectangular pyramid diamond cutter surface is beta, and the elastic recovery rate of the glass is mu when the surface is scribed and processed forwards 2 。
Further, the residual depth h of the first trench r1 In order to realize the purpose,
h r1 ＝(1-μ 1 )h s1 。
further, the residual depth h of the second trench r2 In order to realize the purpose,
h r2 ＝(1-μ 2 )h s2 。
further, the width distance D of the groove between the adjacent first grooves s1 In order to realize the purpose,
further, the width distance D of the groove between the adjacent second grooves s2 In order to realize the purpose,
furthermore, the first groove and the second groove are both realized by controlling the glass to move by using the displacement platform.
Further, the method also comprises the following steps of cleaning the glass by using ultrasonic waves and then drying the glass before scribing the glass.
Further, the method also comprises the following step of adjusting the flatness of the surface of the glass by using a leveling device after ultrasonic cleaning.
Compared with the prior art, the invention has the following beneficial effects:
firstly, a rectangular pyramid diamond cutter is used for sequentially scoring the surface of glass along a first direction in a forward-facing mode, and when the diamond cutter is subjected to forward-facing machining, the forward pushing effect of two side faces of the cutter on materials can promote the plastic flow of the materials, so that the materials on two sides of a first groove are accumulated to obtain a structure with a larger height and depth-to-width ratio; and then, the glass surface is sequentially scribed along the second direction by utilizing the mode that the cutter faces forwards, and when the glass surface faces forwards, the front cutter face of the cutter cuts and removes the material, so that the material cannot be accumulated, and the structure height is low.
Because the first direction and the second direction of the cutter processing are mutually perpendicular, in the crossing process, the accumulation in the forward facing processing can cause the blockage of the material pushed up by the second groove when the original first groove structure is scribed for the second time, so that the structure is difficult to form, and a regular three-dimensional structure with high profile precision needs to be obtained by adopting a forward facing processing mode in the second processing. According to the invention, firstly, the plastic flow of the material is promoted by utilizing the pushing action when the edge is forward, so that the height and the depth-to-width ratio of the structure under the same load are increased, then the material is sheared and removed by using the front tool face which is processed forward at 90 degrees in a crossed manner, so that the blockage of the groove structure caused by the material flow is avoided, an equivalent altered layer with a continuous gradually-changed refractive index can be obtained on the surface of the glass, the interface between air and a medium is effectively eliminated, the light transmittance is improved when the visible light wave band is incident at all angles, and the reflectivity is reduced.
Drawings
FIG. 1 is a schematic diagram of the shape of a pyramid diamond tool head and the structure of a tip.
FIG. 2 is a schematic diagram of the process of machining a rectangular pyramid diamond cutter on the surface of glass.
Fig. 3 is a schematic structural diagram of a rectangular pyramid diamond tool machining device.
Fig. 4 is a schematic view of the tool edge forward machining.
Fig. 5 is a schematic view of the tool face forward machining.
FIG. 6 is a schematic view of the groove structure formed by the scribing process of the cutter.
FIG. 7 is a schematic view of a pyramid array structure formed by a cutting tool scribing process.
Fig. 8 is a comparison of glass transmittance measurements.
In the figure:
the method comprises the following steps of 1-rotating table, 2-leveling device, 3-displacement platform, 4-diamond cutter, 5-clamp, 6-glass workpiece, 7-force sensor and 8-moving lead screw.
Detailed Description
The key point of the invention is the design of the structure period and the height, the elastic recovery phenomenon of the hard brittle material in the plastic processing is considered, and the structure is designed and predicted according to the applied load, so that a more accurate three-dimensional micro-nano structure is obtained. In addition, through analyzing the influence of the forward-facing processing and the forward-facing processing on the material removal form, the effect of the two side surfaces on forward pushing of the material during the forward-facing processing can promote the plastic flow of the material, so that the material accumulation on the two sides of the groove can obtain a structure with a larger height and depth-to-width ratio, and the shearing removal of the material by the tool rake surface during the forward-facing processing can not cause the accumulation of the material, so the structure height is lower. However, in the crossing process, the accumulation in the forward facing process may cause the existing groove structure to be blocked by the material pushed up by the second pushing, and the structure is difficult to form. Therefore, a regular three-dimensional structure with high profile accuracy needs to be obtained by face-to-face machining in the second machining. And the structure of the micro-nano scale can be really obtained by utilizing the tip of the diamond. However, the existing methods for mechanically removing the micro-nano structure are limited by the size of the cutter, so that the micro-nano structure is difficult to process, and the processed sample is difficult to ensure no crack when the hard and brittle material is directly processed.
According to the invention, a theoretical model of the load depth of the rectangular pyramid diamond cutter 4 considering elastic recovery in different directions is constructed on the basis of the Hertz contact theory through elastoplasticity, so as to design and predict the size characteristics of the processed three-dimensional micro-nano structure. In addition, the difference of the material removal modes in forward-facing and forward-facing processing is analyzed through experimental phenomena, the pushing action in forward-facing processing is firstly utilized to promote the plastic flow of the material to increase the height and the depth-to-width ratio of the structure under the same load, and then the cutting removal of the rake face facing forward processing is utilized in a 90-degree crossed manner to the material, so that the blockage of the groove structure caused by the material flow is avoided.
The present invention is described in further detail below.
A processing method of a regular micro-nano structure on the surface of glass comprises the following steps,
sequentially scribing the surface of the glass along a first direction by using a rectangular pyramid diamond cutter 4, and leading the edge of the diamond cutter 4 to be forward during scribing processing to obtain a plurality of first grooves which are arranged side by side;
sequentially scribing the glass surface along a second direction by using a rectangular pyramid diamond cutter 4, wherein the first direction is vertical to the second direction, and the surface of the diamond cutter 4 faces forwards during scribing so as to obtain a plurality of second grooves which are arranged side by side;
the plurality of first grooves and the plurality of second grooves intersect to form a pyramid structure on the surface of the glass.
Specifically, the pyramid diamond tool 4 has a indenter shape and a tip as shown in fig. 1. The included angle of the four edges of the rectangular pyramid diamond cutter 4 is alpha, and the included angle of the surface of the rectangular pyramid diamond cutter is beta.
The normal force applied by the diamond tool 4 during machining is P, the feed speed is v, and the material hardness is H. The elastic recovery rate of the glass is mu when the forward scribing is performed 1 The elastic recovery rate of the glass during face-forward scribing is mu 2 。
As shown in FIG. 2, the actual scribing depth during the process is h s Indicating the actual scribing depth h including the first groove s1 And the actual scribing depth h of the second groove s2 。
Residual depth h after scribing considering elastic recovery of workpiece r Denotes the residual depth h including the first trench r1 And the residual depth h of the second trench r2 。
In the scribing process in the same direction, after each scribing is finished, the width distance D of the moving groove of the glass is controlled by using the displacement platform 3 s Repeating the scribing to obtain a groove array with a groove width D s Including a trench width distance D between adjacent first trenches s1 And a groove width distance D between adjacent second grooves s2 。
The actual scribing depth h is increased when the ridge is processed forward s1 And the residual depth h r1 The relationship between them is:
h r1 ＝(1-μ 1 )h s1 ；
according to the Hertz theory, the actual processing depth h of the edge forward processing can be calculated s1 Comprises the following steps:
the distance D between adjacent first grooves in the forward processing of the edge can be obtained from the geometrical relationship s1 Comprises the following steps:
similarly, the actual scribing depth h in the face-forward process s2 And the residual depth h r2 The relationship between them is:
h r2 ＝(1-μ 2 )h s2 ；
according to the Hertz theory, the actual processing depth h in face-forward processing can be calculated s2 Comprises the following steps:
the distance D between the adjacent second grooves in face-forward processing can be obtained by geometric relationship s2 The method comprises the following steps:
therefore, the characteristics of the height, the period, the shape and the like of the three-dimensional structure can be accurately designed and processed.
In this embodiment, as shown in fig. 3, the processing apparatus includes a rotary table 1, a leveling device 2, a displacement table 3, a jig 5, a moving screw 8, and a force sensor 7. Wherein the rotary table 1 is used for horizontal rotation. The leveling device 2 is arranged on the rotating platform 1 and is used for adjusting the flatness of the surface of the glass. The displacement platform 3 is arranged on the leveling device 2 and is used for controlling the movement of the glass workpiece 6 in the y direction, namely controlling the groove distance and the target structure period. The clamp 5 is arranged on the displacement platform 3 and is used for clamping the glass workpiece 6.
Before processing, the glass workpiece 6 is ultrasonically cleaned in alcohol solution for ten minutes, and the surface is dried and then is installed and fixed.
The rectangular pyramid diamond cutter 4 is fixed on a force sensor 7 and used for applying and collecting normal force in the machining process, and feeding is completed on the surface of the glass through driving of a movable lead screw 8.
After the primary feeding machining is finished, the cutter returns to the initial position, meanwhile, the displacement platform 3 moves by a groove distance Ds, machining is carried out again, and the groove array distance can be obtained repeatedly. After all the groove structures in one direction are processed, the workpiece is rotated by 90 degrees under the driving of the rotating table 1, and the processing in the cross direction is carried out again, so that the complete pyramid micro-nano structure with better profile precision can be finally obtained.
It should be noted that when processing the microstructure, the first direction needs to be fed by the forward-facing scribing, and the second direction after rotating 90 ° needs to be processed by the forward-facing method. The two processing methods are shown in fig. 4 and 5.
Fig. 6 and 7 show that the method is used for applying a load of 26mN, wherein the first groove spacing is 3.2 μm when the edge front is scribed, the second groove spacing is 2.5 μm when the face front is scribed, and the structure height is 320nm. As shown in fig. 8, by testing the transmittance of the light in the visible light band, it is found that the transmittance of the trench structure and the transmittance of the pyramid structure can be improved, and the transmittance of the pyramid structure is the highest.
The above embodiments are preferred embodiments of the present invention, but the present invention is not limited to the above embodiments, and any other changes, modifications, substitutions, combinations, and simplifications which do not depart from the spirit and principle of the present invention should be construed as equivalents thereof, and all such modifications are intended to be included in the scope of the present invention.
Claims (10)
1. A processing method of a glass surface regular micro-nano structure is characterized by comprising the following steps: comprises the following steps of (a) preparing a solution,
sequentially scribing on the surface of the glass along a first direction by using a rectangular pyramid diamond cutter, wherein the edge of the cutter is forward during scribing processing to obtain a plurality of first grooves which are arranged side by side;
sequentially scribing on the surface of the glass along a second direction by using a rectangular pyramid diamond cutter, wherein the first direction is vertical to the second direction, and the face of the cutter is forward during scribing so as to obtain a plurality of second grooves which are arranged side by side;
the plurality of first grooves and the plurality of second grooves intersect to form a pyramid structure on the surface of the glass.
2. The processing method of the glass surface regular micro-nano structure according to claim 1, characterized in that: the actual scribing depth of the first groove is h s1 ，
Wherein the included angle of the edges of the rectangular pyramid diamond cutter is alpha, the normal force applied during processing is P, the glass hardness is H, and the elastic recovery rate of the glass is mu when the edges are scribed forwards 1 。
3. The processing method of the glass surface regular micro-nano structure according to claim 2, characterized in that: the actual scribing depth of the second groove is h s2 ，
Wherein the included angle of the square pyramid diamond cutter surface is beta, and the elastic recovery rate of the glass is mu when the surface is processed by front scratching 2 。
4. The processing method of the glass surface regular micro-nano structure according to claim 3, characterized in that: residual depth h of the first trench r1 In order to realize the purpose,
h r1 ＝(1-μ 1 )h s1 。
5. the processing method of the glass surface regular micro-nano structure according to claim 4, characterized in that: residual depth h of the second trench r2 In order to realize the purpose,
h r2 ＝(1-μ 2 )h s2 。
6. the processing method of the glass surface regular micro-nano structure according to claim 5, characterized by comprising the following steps: groove width distance D between adjacent first grooves s1 In order to realize the purpose,
7. the processing method of the glass surface regular micro-nano structure according to claim 6, characterized in that: groove width distance D between adjacent second grooves s2 In order to realize the purpose of the method,
8. the processing method of the glass surface regular micro-nano structure according to claim 1, characterized by comprising the following steps: the first groove and the second groove are both realized by controlling the glass to move by using the displacement platform.
9. The processing method of the glass surface regular micro-nano structure according to claim 1, characterized in that: the method also comprises the following steps of cleaning the glass by using ultrasonic waves and then drying the glass.
10. The processing method of the glass surface regular micro-nano structure according to claim 9, characterized in that: the method also comprises the following step of adjusting the flatness of the surface of the glass by using a leveling device after ultrasonic cleaning.
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Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110963459A (en) * | 2019-12-11 | 2020-04-07 | 华南理工大学 | Force position control-based experimental device and method for machining complex curved surface micro-nano structure |
| CN111055009A (en) * | 2019-12-29 | 2020-04-24 | 中国科学院西安光学精密机械研究所 | Manufacturing method and system of inverted quadrangular frustum pyramid/quadrangular pyramid-shaped anti-reflection micro-nano structure |
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Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110963459A (en) * | 2019-12-11 | 2020-04-07 | 华南理工大学 | Force position control-based experimental device and method for machining complex curved surface micro-nano structure |
| CN111055009A (en) * | 2019-12-29 | 2020-04-24 | 中国科学院西安光学精密机械研究所 | Manufacturing method and system of inverted quadrangular frustum pyramid/quadrangular pyramid-shaped anti-reflection micro-nano structure |
Non-Patent Citations (1)
| Title |
|---|
| 王炜: "不同形状压头不同刻划方向微纳刻划BK7光学玻璃时的力学行为", 《中国优秀硕士学位论文全文数据库 工程科技1辑》, no. 02, 15 February 2021 (2021-02-15), pages 015 - 962 * |
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