CN111055094A - Manufacturing method of microprism mold for reducing splicing hidden bands - Google Patents
Manufacturing method of microprism mold for reducing splicing hidden bands Download PDFInfo
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- CN111055094A CN111055094A CN201911396770.1A CN201911396770A CN111055094A CN 111055094 A CN111055094 A CN 111055094A CN 201911396770 A CN201911396770 A CN 201911396770A CN 111055094 A CN111055094 A CN 111055094A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
- B23P15/00—Making specific metal objects by operations not covered by a single other subclass or a group in this subclass
- B23P15/24—Making specific metal objects by operations not covered by a single other subclass or a group in this subclass dies
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/20—Bonding
- B23K26/21—Bonding by welding
- B23K26/24—Seam welding
Abstract
The invention discloses a method for manufacturing a microprism mold for reducing a splicing dark zone, in particular to a method for manufacturing a microprism reflective film with various appearances such as a male-female fringe, a square grid and the like by cutting a V-shaped triangular cutter into mold pieces or mold strips along a fine V-groove path of a microprism initial mold of a pyramid array in a finish machining mode through ultra-precision cutting equipment, and provides a cutting method for keeping the integrity of a unit microprism pyramid and keeping the integrity of an effective reflective area of the unit pyramid to the maximum extent.
Description
Technical Field
The invention relates to the field of optical mold manufacturing, in particular to a manufacturing method of a microprism mold for reducing a seam hidden zone.
Background
The principle that the vertexes and corner points of the complete unit pyramid are not reflective: the light irradiates one side face of the concave pyramid, three side faces with three nanoscale smoothness degrees in the concave pyramid generate total reflection, and the total reflection returns along the original path through three times of mirror reflection, but when the light irradiates the lowest point of the concave pyramid, namely the vicinity of the top point of the convex pyramid, as the three side faces are converged into a point, the space near the concave point is narrow, and the light is infinitely circularly mirror-reflected in the space, the reflected light is bound at the point, and cannot be reflected back to the light source, so that a light reflection ineffective area is generated; and near the corner point of the concave pyramid, two side faces are adjacent but farthest from the third side face, so when the light rays irradiate near the corner point of the concave pyramid, because the space is too large, the light rays are reflected to the outside of the range where the other side face is located, three times of specular reflection cannot be formed, and a light reflection invalid area is generated.
As is well known to those skilled in the art, the corner points and the vicinity of the vertexes of the unit complete regular triangular pyramid are provided with ineffective light reflecting regions, and the size of the ineffective light reflecting regions is related to the size of the inclination angles of the side surfaces of the pyramid, the refractive index of the pyramid as a medium and the like. However, the effective reflection area of the ineffective reflection area is much smaller than that of the whole pyramid, so that the non-reflection area can be observed only under the condition of amplifying dozens of times or even hundreds of times, and the non-reflection area is not seen under the macroscopic condition but the actual reflection efficiency is reduced. In order to improve the light reflection efficiency, the light reflection invalid region of the unit pyramid is removed, and then the light reflection valid region without the light reflection invalid region is spliced again, so that another prism structure, namely a full prism structure, is obtained. The full prism structure of the invalid reflection area of the edge and corner of the pyramid is removed, the reflection efficiency is improved, and the problem of direction sensitivity caused by the change of the invalid reflection area of the micro prism structure due to the change of the direction or the light irradiation angle is solved.
The mechanism that the width of the non-reflective dark band is larger than the splicing line width of the die pieces is as follows: the complete unit pyramid can be kept in the effective reflection area to form the precondition of three-time mirror reflection, and is a reflection principle that the micro-prism pyramid can reflect light reversely. The splicing line is a splicing seam of the mould piece, when the splicing seam damages or destroys one side surface of the integrity of the unit pyramid, the corresponding position of the other two side surfaces of the same unit pyramid can generate an invalid light reflecting area. The invalid light reflecting areas of the unit pyramids where the joints of the die pieces are located are visible non-light reflecting dark bands in a macroscopic state. When the damaged area of the complete unit pyramid is larger, the generated ineffective reflection area is larger, namely the non-reflection dark band is wider, and the reflection consistency of the working die and the surface of the reflection original film is influenced.
The inevitable gaps exist after the working die is spliced, so that the die after electroforming and the die splicing lines of the reflective film after cone planting exist, but the width of the die lines (the width of the splicing gaps) is not equal to the width of the non-reflective dark bands, and the width of the non-reflective dark bands is more than or equal to the width of the splicing gaps.
The existing rough machining technology cutting die piece adopts laser welding spots to splice a large die, and has the defects of straightness of the edge of the die piece, rough and excessive cross section of the edge of the die piece, loose butt joint caused by mechanical errors and human errors, insufficient surface flatness of the template piece, thermal deformation in the welding spot splicing process and the like, so that a splicing result die splicing seam has a non-reflective dark band with larger width, the non-reflective dark band is finally transmitted to a reflective original film through a working plate die on a daughter board die, and the surface integrity and the plane consistency degree of the final reflective finished film are seriously damaged.
Referring to fig. 1-4, assume that the size 1 of a regular triangular pyramid is 173um, the side length 2 of the pyramid is 200um, and the width of the patchwork 4 is 30um, i.e., the left damage size 41 is 15um and the right damage size 42 is 15 um.
Referring to fig. 1, under rough machining conditions, a common cutting tool cuts and splices in the direction of a pyramid V-shaped groove, and damages the side straight line edge 15um of a complete unit pyramid where a splice is located, so that the other two side straight line edges generate an invalid light reflecting area 15um wide, that is, the width 3 of a dark band in the prior art is 346um, and the generated invalid light reflecting area is large, thereby affecting the light reflecting consistency of the surface of a working mold and a light reflecting original film.
Referring to fig. 2, under rough machining conditions, a common cutting tool cuts and splices the pyramid in the direction of the micro pyramid where the pyramid is perpendicular to the direction of the micro V-grooves, and damages the straight edge 15um of the pyramid at the intersection of the two side surfaces of the complete unit pyramid where the splice is located and the middle line 30um of the third side surface, so that corresponding invalid light reflecting regions are generated at the intersection of the other two side surfaces and the middle lines of the first and second side surfaces, that is, the dark band width is 200 um.
Referring to fig. 3 and 4, under rough machining conditions, a common cutting tool cuts and splices the whole unit pyramid in any direction of the die piece, and due to damage to any one pyramid side surface of the whole unit pyramid where the abutted seam is located, any other two side surfaces of the unit pyramid have invalid light reflecting regions with the same damage area size, namely, non-light reflecting dark bands 240um and 280um in width which the abutted seam is 30um in width are generated.
Disclosure of Invention
The embodiment of the application provides a manufacturing method of a microprism mold for reducing splicing dark bands, solves the problem that the invalid reflection area is large due to the fact that mold pieces are cut by adopting a rough machining process technology in the prior art, achieves reduction of the splicing dark bands of the mold, further reduces the width of a non-reflection dark band of a reflection original film formed after an optical film is planted in a cone, and improves the whole reflection efficiency of a microprism reflection film.
The invention discloses a method for manufacturing a microprism mold for reducing a seam hidden zone, which comprises the following steps:
(a) providing a microprism initial mold, measuring the thickness d from the bottom of a micro V groove of the microprism initial mold to be processed to a non-pyramid surface, and the included angle a of the micro V groove, and simultaneously marking the processing path direction of a cutter, the length m of the microprism initial mold to be processed, the size L of a unit pyramid and the invalid size L1 of the unit pyramid;
(b) installing a microprism initial die on a cutting position of a precision cutting machine tool, wherein the cutting machine tool is provided with a horizontal X axis and a vertical Y axis, a plane formed by the X axis and the Y axis is parallel to a horizontal plane, and a Z axis in the gravity direction;
(c) setting the position of a workpiece base on a precision cutting machine tool as a machining starting point O, moving a sharp point of a cutter to the bottom of the micro V-shaped groove, and simultaneously adjusting the cutter to enable the side surface of the cutter to be parallel to an included angle surface of the micro V-shaped groove;
(d) the step (d) is selected from the step (A)d）1Or step (d)2Any one of the above;
the (d)1The method comprises the following specific steps:
① cutting the distance m along the Y-axis vector direction, returning to the position of the processing starting point O along the reverse vector direction of the cutting path, then descending a certain height h along the Z-axis direction of the starting point position by the cutter, and then translating the position h tan (a/2) along the X-axis vector direction until completing one complete cutting;
② repeating the step ① N times until the cutting depth is equal to the thickness d from the bottom of the fine V-shaped groove to the non-pyramid surface, stopping cutting and finishing the cutting work;
the (d)2The method comprises the following specific steps:
①1after the cutter cuts a distance m along the vector direction of the Y axis, the cutter returns to the processing starting point O along the reverse vector direction of the cutting path, and the rear cutter descends a certain height h along the Z axis direction of the starting point position1Completing one complete cutting;
②1repeat ①1Step N1Next, up to N1*h1When tan (a/2) equals the invalid reflection dimension L1 of the unit pyramid, the cutting is suspended;
③ change to a second tool, continue N2Sub-repeating process ①1And ②1Complete cutting to (N)1+N2) And stopping cutting when the thickness d from the bottom of the fine V groove to the non-pyramid surface is equal to h, and finishing the cutting work.
Further, the second cutter is a U-shaped cutter.
Further, the maximum cross-sectional dimension of the U-shaped cutter is less than 2 × L1.
Further, the cutter is a V-shaped cutter.
Further, the V-shaped inclination angle of the V-shaped cutter is consistent with the V-shaped inclination angle of the fine V-shaped groove.
Further, the method also comprises a working procedure (e), wherein the working procedure (e) is carried out after the working procedure (d), and the specific steps are as follows: and (4) performing precise plane polishing on the cut prism initial mold, and removing redundant wedges to obtain micro prism mold sheets or sub mold strips.
And further, taking two micro-prism mold pieces or sub mold strips, and carrying out straight seam laser spot welding and splicing on the two micro-prism mold pieces or sub mold strips to form a large mold until the large mold is spliced end to complete the cylindrical working mold.
One or more technical solutions provided in the embodiments of the present application have at least the following technical effects or advantages:
1. by adopting the cutting method, the cutting finish machining method of the large mould piece is used for sacrificing the whole column of the original pyramid so as to ensure the integrity of the unit pyramids at the splicing seams of the mould pieces of the working mould, and the splicing seam dark bands of the mould are reduced, so that the width of the non-reflective dark bands of the original reflective film formed after the optical film is planted with the pyramid is reduced, and the integral reflective efficiency of the micro-prism reflective film is improved.
2. The invention provides a method for cutting and finely machining a large die piece, which is used for ensuring the maximum integrity of an effective reflecting area of a unit pyramid by replacing a cutting tool step by step, so as to ensure the maximum integrity of the effective reflecting area of the unit pyramid at the splicing seam of the die piece of a working die, reduce the width of a splicing seam dark band of the die, further reduce the width of a non-reflecting dark band of a reflecting original film formed after an optical film is planted in the pyramid, and improve the integral reflecting efficiency of a reflecting film of a microprism.
3. The manufacturing method of the invention comprises but not limited to the manufacturing method of microprism working dies of various specifications and styles, such as a plane die, a male-female stripe die, a bright-dark stripe die, a large square grid die, a small square grid die, a great wall grid die, a straight triangular grid die, an oblique square grid die and the like for reducing the seam hidden zone, and the application range is wide.
Drawings
FIG. 1 is a schematic structural diagram of a microprism working mold sheet roughly machined along a fine V-groove in the prior art;
FIG. 2 is a schematic structural diagram of a microprism working mold sheet roughly machined along a vertical fine V-groove in the prior art;
FIG. 3 is a schematic structural diagram of a microprism working mold sheet roughly machined in any direction in the prior art 1;
FIG. 4 is a schematic structural diagram of a microprism working mold sheet roughly machined in any direction in the prior art 2;
FIG. 5 is a schematic view of the structure of the precision cutting machine of the present invention;
FIG. 6 is a schematic diagram of a three-dimensional coordinate axis 3D structure according to the present invention;
FIG. 7 is a schematic view of the angle structure of the micro V-groove of the initial mold of the microprism of the present invention;
FIG. 8 is a schematic top view of the coordinate axes of the processing path of the initial mold structure of microprism in accordance with the present invention;
FIG. 9 is a schematic view of a micro-prism mold assembly structure according to embodiment 1 of the present invention;
FIG. 10 is a schematic view of a splicing structure of a micro-prism mold spliced after being over-cut according to embodiment 2 of the present invention;
FIG. 11 is a schematic diagram showing the locations of the regular triangular pyramid invalid reflective regions (gray black regions) and the dimension L1 in the field of reflective materials;
FIG. 12 is a schematic view of a splicing structure of a micro-prism mold spliced according to embodiment 2 of the present invention;
reference numerals:
1. the method comprises the following steps of pyramid size, pyramid side length, 3 dark band width, 4 splicing seam, 41 left damage size, 42 right damage size, 5 microprism initial template, 51 first sub template, 52 second sub template, 6V-shaped cutter, 7U-shaped cutter, 8 cutter rest, 9 workpiece base, 10 cutter rest base.
Detailed Description
In order to better understand the technical solution, the technical solution will be described in detail with reference to the drawings and the specific embodiments.
Example 1:
a manufacturing method of a microprism mold for reducing a splicing dark zone comprises the following steps:
(1) referring to fig. 6, a microprism initial template 5 is selected and placed under a microscope, the magnification of the microscope is adjusted until the microprism initial template 5 can be clearly observed, the direction of the pyramid array of the microprism initial template 5 and the direction of the fine V-shaped groove of the microprism are observed, the direction and distance m of the tool processing path are marked, the thickness d (d refers to the distance from the bottom of the fine V-shaped groove to the non-pyramid surface) of the microprism initial template 5 to be processed is measured, and the included angle a of the fine V-shaped groove is measured.
(2) Selecting a cutter used for finish machining cutting, wherein the cutter is a V-shaped cutter, the cross section of the cutter is V-shaped, and the cutter is arranged on a cutting path running device.
(3) Referring to fig. 5, the initial template 5 of the microprism to be processed is installed at a cutting position on a precision cutting machine, and the workpiece base 9 is translated in the horizontal direction, so that the V-shaped cutter 6 is positioned above the array pyramid micro V-grooves, and the consistency of the cutter and the micro V-grooves in the Z-axis direction is ensured.
(4) Referring to fig. 6 and 8, XYZ axes are established on the initial template 5 of the microprism, the direction of the micro V-grooves of the microprism is set as a Y axis, the direction perpendicular to the direction of the micro V-grooves is set as an X axis, and Z axes are set, and each two of the Z axes are perpendicular to the Y axis of the X axis.
(5) Referring to fig. 5 and 6, the tool is adjusted, under the microscopic condition, the workpiece base 9 is translated to enable the long edge position of the transverse width of the initial mold 5 of the microprism to be processed to be a processing starting point O, so that the sharp point of the V-shaped tool 6 moves to the bottom of the fine V-groove, and the V-shaped tool 6 is adjusted at the same time, so that the tool surface and the included angle surface of the fine V-groove are parallel to the Z-axis direction.
(6) After the cutter cuts the distance m along the Y-axis vector direction, the cutter returns to the processing starting point O along the cutting path reverse vector direction, and the rear cutter descends a certain height h in the Z-axis direction of the starting point position to complete the first complete cutting.
(7) After the height of the cutter is reduced by h, simultaneously translating h tan (a/2) along an measuring direction of the X-axis direction; and (6) repeating the procedure to finish the second complete cutting. Combining the first cutting and the second cutting together to finish path cutting once, repeating the complete path cutting for N times, stopping cutting until the cutting depth is equal to the thickness d from the bottom of the fine V groove to the non-pyramid surface, and finishing the cutting work of the initial micro prism template 5 to obtain a first sub-template 51 and a second sub-template 52;
(8) referring to fig. 9, the cut wedge-shaped cross sections of the first sub-template 51 and the second sub-template 52 are respectively subjected to precise plane polishing, and after removing the redundant wedges, the first sub-template and the second sub-template are subjected to straight-seam laser spot welding and splicing to form a large working mold piece.
Example 2:
a manufacturing method of a microprism mold for reducing a splicing dark zone comprises the following steps:
(1) selecting a microprism initial template 5, placing the microprism initial template under a microscope, adjusting the multiplying power of the microscope until the microprism initial template 5 can be clearly observed, observing the direction of a pyramid array of the microprism initial template 5 and the direction of a microprism thin V groove, marking the processing path direction and the distance m of a tool, simultaneously measuring the thickness d (d refers to the distance from the bottom of the micro V groove to a non-pyramid surface) of the microprism initial template 5 to be processed, and measuring the included angle a of the micro V groove, the size 1 of a unit pyramid and the size L1 of an invalid light reflecting area of the unit pyramid, which is shown in FIG. 11.
(2) Selecting a cutter used for finish machining cutting, wherein the cutter is a V-shaped cutter, the cross section of the cutter is V-shaped, and the cutter is arranged on a cutting path running device.
(3) Referring to fig. 5, the initial template 5 of the microprism to be processed is installed at a cutting position on a precision cutting machine, and the workpiece base 9 is translated in the horizontal direction to make the cutter be positioned above the array pyramid fine V-grooves, so as to ensure the consistency of the cutter and the fine V-grooves in the gravity direction.
(4) Referring to fig. 6 and 8, XYZ axes are established on the initial template 5 of the microprism, the direction of the micro V-grooves of the microprism is set as a Y axis, the direction perpendicular to the direction of the micro V-grooves is set as an X axis, and Z axes are set, and each two of the Z axes are perpendicular to the Y axis of the X axis.
(5) Referring to fig. 5 and 6, the tool is set, under the microscopic condition, the workpiece base 9 is translated to enable the initial mold 5 of the microprism to be processed, the long edge position of the transverse breadth is a processing starting point O, so that the sharp point of the V-shaped tool 6 moves to the bottom of the fine V-groove, and the V-shaped tool 6 is adjusted at the same time, so that the tool surface and the included angle surface of the fine V-groove are parallel to the Z-axis direction.
(6) After the V-shaped cutter 6 cuts a distance m along the vector direction of the Y axis, the V-shaped cutter returns to the processing starting point O along the reverse vector direction of the cutting path, and then the V-shaped cutter descends a certain height h along the direction of the Z axis (gravity direction) at the starting point position 01Completing one-time complete cutting;
（7）N1repeating the procedure (6) for the second time until N is reached1*h1When tan (a/2) equals the invalid reflection dimension L1 of the unit pyramid, the cutting is suspended; the cutting program controls the disc cutter holder to rotate for changing the U-shaped cutter 7, the largest cross-sectional dimension of which is less than 2 × L1.
(8) The U-shaped cutter 7 is continued to be used for the original path and feed process (namely, the U-shaped cutter is descended by a certain height h in the Z direction after completing one cutting path in the Y direction1Cutting the microprism initial template 5) and completing multiple paths N2Up to (N)1+N2) *h1When d is equal, the cutting program sends out a work finishing command, the cutting is stopped, and the cutting work is finished.
(9) Referring to fig. 12, after the die piece is cut, straight seam laser spot welding and splicing are carried out to form an ultra-large area working die such as male and female stripes and a cylindrical annular belt-shaped die.
The inclination angle of the V-shaped cutter is consistent with the inclination angle of the included angle of the micro V-shaped groove of the micro prism regular triangular pyramid array, namely the included angle between the triangular pyramids of the side surfaces of the two sides on the path where the micro V-shaped groove is located is equal to a, and the included angle between the sharp angle of the two sides on the path where the micro V-shaped groove is located and the triangular pyramid of the sharp angle is larger than a. If the steps (7) and (8) are combined in the embodiment 2, a single V-shaped cutter is used in the process without replacing the U-shaped cutter, and the cutting is stopped until the cutting depth is equal to the thickness d from the bottom of the fine V-groove to the non-pyramid surface. In the process, the edges and corners of the triangular pyramid with sharp corners to sharp corners on two sides of the path where the micro V-shaped grooves are located are damaged, and when the damage degree of the edges and corners of the unit pyramid is greater than the size L1 of the ineffective light reflecting area, overcutting is generated, namely positions which are not required to be processed are processed in the machining process, so that the light reflecting effective area is partially cut, and the width of a dark band generated by a large-block die formed by splicing overcutting sub-templates is far greater than the width of a splicing seam in the view of FIG. 10; the invention replaces the V-shaped cutter with the U-shaped cutter in time, thereby avoiding the problem of over-cutting, and the invention is shown in figure 12.
The above description is only an embodiment utilizing the technical content of the present disclosure, and any modification and variation made by those skilled in the art can be covered by the claims of the present disclosure, and not limited to the embodiments disclosed.
Claims (7)
1. A manufacturing method of a microprism mold for reducing a seam hidden belt is characterized by comprising the following steps:
(a) providing a microprism initial mold, measuring the thickness d from the bottom of a micro V groove of the microprism initial mold to be processed to a non-pyramid surface, and the included angle a of the micro V groove, and simultaneously marking the processing path direction of a cutter, the length m of the microprism initial mold to be processed, the size L of a unit pyramid and the invalid size L1 of the unit pyramid;
(b) installing a microprism initial die on a cutting position of a precision cutting machine tool, wherein the cutting machine tool is provided with a horizontal X axis and a vertical Y axis, a plane formed by the X axis and the Y axis is parallel to a horizontal plane, and a Z axis in the gravity direction;
(c) setting the position of a workpiece base on a precision cutting machine tool as a machining starting point O, moving a sharp point of a cutter to the bottom of the micro V-shaped groove, and simultaneously adjusting the cutter to enable the side surface of the cutter to be parallel to an included angle surface of the micro V-shaped groove;
(d) the step (d) is selected from the step (d)1Or step (d)2Any one of the above;
the (d)1The method comprises the following specific steps:
① cutting the distance m along the Y-axis vector direction, returning to the position of the processing starting point O along the reverse vector direction of the cutting path, then descending a certain height h along the Z-axis direction of the starting point position by the cutter, and then translating the position h tan (a/2) along the X-axis vector direction until completing one complete cutting;
② repeating the step ① N times until the cutting depth is equal to the thickness d from the bottom of the fine V-shaped groove to the non-pyramid surface, stopping cutting and finishing the cutting work;
the (d)2The method comprises the following specific steps:
①1after the cutter cuts a distance m along the vector direction of the Y axis, the cutter returns to the processing starting point O along the reverse vector direction of the cutting path, and the rear cutter descends a certain height h along the Z axis direction of the starting point position1Completing one complete cutting;
②1repeat ①1Step N1Next, up to N1*h1When tan (a/2) equals the invalid reflection dimension L1 of the unit pyramid, the cutting is suspended;
③ change to a second tool, continue N2Sub-repeating process ①1And ②1Complete cutting to (N)1+N2) And stopping cutting when the thickness d from the bottom of the fine V groove to the non-pyramid surface is equal to h, and finishing the cutting work.
2. The method for manufacturing a microprism mold for reducing the seam allowance according to claim 1, wherein the second cutter is a U-shaped cutter.
3. The method of claim 2, wherein the U-shaped knife has a maximum cross-sectional dimension of less than 2 x L1.
4. The method for manufacturing the microprism mold for reducing the seam allowance of claim 1, wherein the cutter is a V-shaped cutter.
5. The method for manufacturing the microprism mold for reducing the seam allowance according to claim 2, wherein the V-shaped inclination angle of the V-shaped cutter is consistent with the V-shaped inclination angle of the fine V-shaped groove.
6. The method for manufacturing the microprism mold for reducing the seam allowance according to claim 1, further comprising a step (e), wherein the step (e) is performed after the step (d), and the method comprises the following specific steps: and (4) performing precise plane polishing on the cut prism initial mold, and removing redundant wedges to obtain micro prism mold sheets or sub mold strips.
7. The method for manufacturing the microprism mold for reducing the seam hidden band according to claim 6, wherein two microprism mold pieces or sub mold strips are taken, and the two microprism mold pieces or sub mold strips are spliced by straight seam laser spot welding to form a large mold until the large mold is spliced end to complete the cylindrical working mold.
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN113635495A (en) * | 2021-10-15 | 2021-11-12 | 福建夜光达科技股份有限公司 | Reflecting material mold with flat-top microprism array and preparation method thereof |
| CN113732638A (en) * | 2021-09-16 | 2021-12-03 | 浙江道明光电科技有限公司 | Machining method of mold core with micro truncated pyramid array on surface |
| CN116787087A (en) * | 2023-08-23 | 2023-09-22 | 福建跃发光新材料股份有限公司 | Preparation method of pyramid array original mold with different structures |
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