CN115780941A - Brazing process for high-silicon aluminum alloy hole assembly parts - Google Patents
Brazing process for high-silicon aluminum alloy hole assembly parts Download PDFInfo
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- CN115780941A CN115780941A CN202211466886.XA CN202211466886A CN115780941A CN 115780941 A CN115780941 A CN 115780941A CN 202211466886 A CN202211466886 A CN 202211466886A CN 115780941 A CN115780941 A CN 115780941A
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Abstract
The invention discloses a high-silicon aluminum alloy hole assembly part brazing process, which comprises the steps of plating a Ni-P layer and an Au layer on the surface of a part, welding by using Au80Sn20 eutectic brazing filler metal, controlling the adoption of a step heating mode, controlling the cooling rate to enable the part and the brazing filler metal to be heated in a balanced manner, reducing stress and deformation caused by uneven temperature distribution on a workpiece, avoiding the defects of welding cracks and raw material Si cracks, strictly controlling the volume ratio of a welding seam and the brazing filler metal, and effectively eliminating the overflow of the welding flux and the generation of welding seam holes, thereby ensuring the welding quality.
Description
Technical Field
The invention relates to a brazing process, in particular to a brazing process of a high-silicon aluminum alloy.
Background
The brazing process is to fill brazing filler metal with a lower melting point into a welding gap, and the brazing filler metal is heated to fill the welding gap to weld two parts together, so that the general part brazing filler metal has good wettability and can well meet welding requirements. The high-silicon aluminum alloy has the advantages of low expansion coefficient, low density, high strength, high thermal conductivity, easy processing, good plating performance and the like, and is widely applied to the fields of aerospace, modern electronic information technology and the like as a shell of a packaging structural member. However, since the high silicon aluminum alloy contains a large amount of hard Si phase, wettability of the brazing material to the alloy surface is deteriorated, and it is difficult for ordinary soldering to satisfy the welding requirements. In order to improve the brazing performance, an article of interfacial reaction between Au80Sn20 eutectic brazing filler metal and a Ni/Au plating layer in brazing is disclosed in an electric welding machine journal, volume 50 in 2020 and 2.2.2.2, wherein a Ni layer and an Au layer are plated on the surface of a high-silicon aluminum alloy, and the AuSn eutectic brazing filler metal is used for brazing. However, the brazing process is prone to defects such as solder overflow, weld voids, welding cracks and raw material Si cracks after welding is completed, and brazing quality is difficult to guarantee.
Disclosure of Invention
In order to overcome the defects that the high-silicon aluminum alloy brazing process in the prior art is easy to generate solder overflow, weld joint cavities, welding cracks and raw material Si cracks, the invention adopts the technical scheme that:
a brazing process for a high-silicon aluminum alloy hole assembly comprises the following steps:
s1, selecting materials: selecting a silicon-aluminum alloy with the silicon content of 30-70%, and selecting an Au80Sn20 eutectic solder as a solder;
s2, surface treatment: plating a Ni-P layer and an Au layer on the surface of the silicon-aluminum alloy part in sequence;
s3, preparing a brazing filler metal: the brazing filler metal is configured in the welding seam of the silicon-aluminum alloy part to be welded, so that the volume ratio of the brazing filler metal to the welding seam is 0.85-1.25;
s4, placing the parts with the prepared brazing filler metal into a vacuum furnace, and vacuumizing to 10 DEG ～2 Pa；
s5, keeping the vacuum state, raising the temperature to 150-180 ℃ at the speed of 1-2 ℃/s, and preserving the temperature for 5-10 minutes;
s6, filling nitrogen into the furnace until the pressure in the furnace is between 30 and 90KPa, raising the temperature to 250 to 270 ℃ at the speed of 1 to 2 ℃/s, and preserving the temperature for 1 to 5 minutes;
s7, heating to 310-350 ℃ at the speed of 1-2 ℃/s, and preserving the heat for 30 seconds-3 minutes; after the heat preservation is finished, vacuumizing to below 10Pa, quickly filling nitrogen, cooling to below 250 ℃ at the speed of 1-2 ℃/s, discharging and air cooling.
Furthermore, the Ni-P layer adopts electroless plating, and the Au layer adopts electroplating.
Furthermore, the thickness of the Ni-P layer is 3-15 μm, and the thickness of the Au layer is 0.5-5 μm.
Further, the silicon-aluminum alloy parts and the brazing filler metal are subjected to ultrasonic cleaning in absolute ethyl alcohol solution for 8-10 minutes before charging, and then are dried by nitrogen for drying, and then brazing filler metal preparation is carried out.
By adopting the process, the parts and the brazing filler metal can be heated in a balanced manner due to the control of the temperature rising and reducing speeds, the stress and deformation caused by uneven temperature distribution on the workpiece are reduced, the defects of welding cracks and Si cracks of raw materials are avoided, the volume ratio of the brazing filler metal to the welding seam can effectively eliminate the overflow of the brazing filler metal and the generation of welding seam holes, and the welding quality is ensured.
Detailed Description
The brazing process of the high silicon aluminum alloy is further described by three groups of examples as follows:
wherein the high-silicon aluminum alloy parts all adopt the following chemical components: si:50.5, fe. The solder is Au80Sn.
Example 1
And in the stage of preparing the workpiece and the solder, the silicon-aluminum alloy part and the solder are cleaned in an absolute ethyl alcohol solution by ultrasonic waves for 8 minutes and then are dried by nitrogen, so that the cleanness and no pollution of a brazing interface are ensured, and the influence of surface impurities on the welding quality is avoided.
Surface treatment: sequentially plating a Ni-P layer and an Au layer on the surface of the silicon-aluminum alloy part; wherein the Ni-P layer is chemically plated to 4 μm thickness, and the Au layer is electroplated to 1.2 μm thickness;
preparing a brazing filler metal: the brazing filler metal is configured in a welding gap of the silicon-aluminum alloy part to be welded, so that the volume ratio of the brazing filler metal to a welding seam is 0.85;
placing the parts with the prepared brazing filler metal into a vacuum furnace, and vacuumizing to 10 DEG ～2 Pa；
Keeping the vacuum state, heating to 180 ℃ at the speed of 1 ℃/s, and keeping the temperature for 5 minutes;
filling nitrogen into the furnace until the pressure in the furnace is 90KPa, heating to 270 ℃ at the speed of 1 ℃/s, and preserving heat for 3 minutes;
heating to 330 ℃ at the speed of 1 ℃/s, and preserving heat for 40 seconds; after the heat preservation is finished, vacuumizing to below 10Pa, quickly filling nitrogen, cooling to 220 ℃ at the speed of 1 ℃/s, discharging and air cooling.
After welding, the welding material has the advantages of good surface consistency, qualified airtight inspection, compact weld joint structure, no air bubbles, no cavities and other defects.
Example 2
And in the stage of preparing the workpiece and the solder, the silicon-aluminum alloy part and the solder are cleaned in absolute ethyl alcohol solution by ultrasonic waves for 10 minutes and then are dried by nitrogen gas in the same way as in the embodiment 1, so that the brazing interface is ensured to be clean and pollution-free, and the influence of surface impurities on the welding quality is avoided.
Surface treatment: sequentially plating a Ni-P layer and an Au layer on the surface of the silicon-aluminum alloy part; wherein the Ni-P layer is chemically plated to a thickness of 5.3 μm, and the Au layer is electroplated to a thickness of 3.2 μm;
preparing a brazing filler metal: the brazing filler metal is configured in a welding gap of the silicon-aluminum alloy part to be welded, so that the volume ratio of the brazing filler metal to a welding seam is 1.25;
placing the parts with the prepared brazing filler metal into a vacuum furnace, and vacuumizing to 10 DEG ～2 Pa；
Keeping the vacuum state, raising the temperature to 180 ℃ at the speed of 1 ℃/s, and keeping the temperature for 8 minutes;
filling nitrogen into the furnace until the pressure in the furnace is 80KPa, heating to 250 ℃ at the speed of 1 ℃/s, and keeping the temperature for 2 minutes;
heating to 310 ℃ at the speed of 1 ℃/s, and keeping the temperature for 1 minute; after the heat preservation is finished, vacuumizing to below 10Pa, quickly filling nitrogen, cooling to 200 ℃ at the speed of 1 ℃/s, discharging and air cooling.
After welding, the welding material has the advantages of good surface consistency, qualified airtight inspection, compact weld joint structure, no air bubbles, no cavities and other defects.
Example 3
And in the stage of preparing the workpiece and the solder, the silicon-aluminum alloy part and the solder are cleaned in absolute ethyl alcohol solution by ultrasonic waves for 10 minutes and then are dried by nitrogen gas in the same way as in the embodiment 1, so that the brazing interface is ensured to be clean and pollution-free, and the influence of surface impurities on the welding quality is avoided.
Surface treatment: sequentially plating a Ni-P layer and an Au layer on the surface of the silicon-aluminum alloy part; wherein the Ni-P layer adopts the chemical plating thickness of 3.9 μm, and the Au layer adopts the electroplating thickness of 0.85 μm;
preparing a brazing filler metal: the brazing filler metal is configured in a welding gap of the silicon-aluminum alloy part to be welded, so that the volume ratio of the brazing filler metal to a welding seam is 1.12;
placing the parts with the prepared brazing filler metal into a vacuum furnace, and vacuumizing to 10 DEG ～2 Pa；
Keeping the vacuum state, raising the temperature to 180 ℃ at the speed of 2 ℃/s, and preserving the temperature for 10 minutes;
filling nitrogen into the furnace until the pressure in the furnace is 35KPa, raising the temperature to 262 ℃ at the speed of 1 ℃/s, and preserving the temperature for 6 minutes;
heating to 350 ℃ at the speed of 2 ℃/s, and keeping the temperature for 30 seconds; after the heat preservation is finished, vacuumizing to below 10Pa, quickly filling nitrogen, cooling to 240 ℃ at the speed of 1 ℃/s, discharging and air cooling.
After welding, the welding material has the advantages of good surface consistency, qualified airtight inspection, compact weld joint structure, no air bubbles, no cavities and other defects.
In the technical scheme:
the process aims at hole system assembly welding, and when the volume ratio of the welding flux to the welding seam is calculated, the volume of the welding seam is obtained by making a difference between the volume in the hole and the volume of the part inserted into the hole, so that the volume of the filled welding flux is determined.
The volume ratio of the solder to the welding seam needs to be controlled to be 0.85-1.25, and when the volume ratio is less than 0.85, the welding seam cannot be filled with the solder, the air tightness of the welding seam is affected, and welding seam cavities are easy to occur; when the volume ratio is more than 1.25, the solder will irregularly flow, and the appearance of the part is affected.
Preheating and raising the temperature to 150-180 ℃ at the rate of 1-2 ℃/s, preserving the heat for 5-10 minutes, raising the temperature of protective gas to 250-270 ℃ at the rate of 1-2 ℃/s, preserving the heat for 1-5 minutes, raising the temperature of welding to 310-350 ℃ at the rate of 1-2 ℃/s, and preserving the heat for 30 seconds-3 minutes; the cooling temperature is reduced to below 250 ℃ at the speed of 1-2 ℃/s, the solder is discharged from the furnace for air cooling, the stepped temperature rise can ensure that the parts and the solder are uniformly heated, the temperature reduction in the cooling process is performed firstly, quickly and then slowly, the weld joint structure can be refined, the dendrite segregation can be reduced, and the cooling is performed slowly below the solidification point of the solder, so that the internal stress can be eliminated, and the problems of welding cracks and raw material Si cracks can be avoided.
Claims (4)
1. A brazing process for a high-silicon aluminum alloy hole assembly comprises the following steps:
s1, selecting materials: selecting a silicon-aluminum alloy with the silicon content of 30-70%, and selecting an Au80Sn20 eutectic solder as a solder;
s2, surface treatment: plating a Ni-P layer and an Au layer on the surface of the silicon-aluminum alloy part in sequence;
s3, preparing a brazing filler metal: the brazing filler metal is configured into a welding seam of the silicon-aluminum alloy part to be welded, so that the volume ratio of the brazing filler metal to the welding seam is 0.85-1.25;
s4, placing the parts with the prepared brazing filler metal into a vacuum furnace, and vacuumizing to 10 DEG ～2 Pa；
s5, keeping the vacuum state, raising the temperature to 150-180 ℃ at the speed of 1-2 ℃/s, and preserving the temperature for 5-10 minutes;
s6, filling nitrogen into the furnace until the pressure in the furnace is between 30 and 90KPa, raising the temperature to 250 to 270 ℃ at the speed of 1 to 2 ℃/s, and preserving the temperature for 1 to 5 minutes;
s7, heating to 310-350 ℃ at the speed of 1-2 ℃/s, and preserving the heat for 30 seconds-3 minutes; after the heat preservation is finished, vacuumizing to below 10Pa, quickly filling nitrogen, cooling to below 250 ℃ at the speed of 1-2 ℃/s, discharging and air cooling.
2. The brazing process for the high-silicon aluminum alloy hole-series assembly part as claimed in claim 1, wherein the brazing process comprises the following steps: the Ni-P layer adopts chemical plating, and the Au layer adopts electroplating.
3. The brazing process for the high-silicon aluminum alloy hole-series assembly part as claimed in claim 1 or 2, wherein the brazing process comprises the following steps: the thickness of the Ni-P layer is 3-15 μm, and the thickness of the Au layer is 0.5-5 μm.
4. The brazing process for the high-silicon aluminum alloy hole-series assembly part as claimed in claim 1, wherein the brazing process comprises the following steps: the silicon-aluminum alloy parts and the brazing filler metal are ultrasonically cleaned in an absolute ethyl alcohol solution for 8-10 minutes before being charged, then are blow-dried by nitrogen, and then are prepared.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN202211466886.XA CN115780941A (en) | 2022-11-22 | 2022-11-22 | Brazing process for high-silicon aluminum alloy hole assembly parts |
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| CN202211466886.XA CN115780941A (en) | 2022-11-22 | 2022-11-22 | Brazing process for high-silicon aluminum alloy hole assembly parts |
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