CN115762358A

CN115762358A - Manufacturing method of LED module and LED module

Info

Publication number: CN115762358A
Application number: CN202211520933.4A
Authority: CN
Inventors: 张宏利; 肖道粲; 丁崇彬
Original assignee: Shenzhen Absen Optoelectronic Co Ltd; Huizhou Absen Optoelectronic Co Ltd
Current assignee: Shenzhen Absen Optoelectronic Co Ltd; Huizhou Absen Optoelectronic Co Ltd
Priority date: 2022-11-30
Filing date: 2022-11-30
Publication date: 2023-03-07

Abstract

The application provides a manufacturing method of an LED module, which comprises the following steps: preparing materials: preparing a lamp panel and a bottom shell with a surrounding edge; assembling: the lamp panel is arranged at the position, within the surrounding edge, of the bottom shell; and (3) glue pouring: glue is filled into the lamp panel, so that the glue is filled between the LED chips on the lamp panel; glue fixation: solidifying the glue to form solid glue; cutting: and cutting off the surrounding edge and part of the solid glue inside the surrounding edge together, so that the distance between the adjacent LED chips is less than 2mm when the two adjacent LED modules are spliced. The application also provides an LED module which is manufactured by the manufacturing method of the LED module. According to the lamp panel protection device, the surrounding edge is formed on the bottom shell, so that a glue pouring process is convenient for the lamp panel, and the protection requirement of the lamp panel in outdoor use is met; the surrounding edge and part of the solid glue are cut off, the requirement that the pixel distance of the LED display screen is smaller than 2mm is met, and the occurrence of dark lines at the splicing position of the LED module is avoided.

Description

Manufacturing method of LED module and LED module

Technical Field

The application belongs to the technical field of display, and particularly relates to a manufacturing method of an LED module and the LED module.

Background

Along with the high-speed development of LED display screen industry, LED display screen pixel interval is done more and more littleer, when the LED display screen is used to the open air, still need satisfy ultraviolet resistance, waterproof, resistant high low temperature and resistant requirements such as high humidity, and prior art realizes above-mentioned requirement through encapsulating the lamp plate, and for satisfying the encapsulating demand, the drain pan border of LED module can set up the encapsulating surrounding edge and spill over in order to stop glue.

The encapsulating surrounding edge is used as a part of the bottom shell and is spliced with the LED modules, and in order to avoid black lines at the splicing positions of the adjacent LED modules, the thickness of the encapsulating surrounding edge is required to be matched with the pixel pitch, for example, when the pixel pitch is required to be less than 2mm, the thickness of the encapsulating surrounding edge is required to be reduced to be less than 0.3mm; the existing bottom shell is generally manufactured in an injection molding, die casting or machining mode, and the thickness of 0.3mm exceeds the limit of the existing shell processing technology of the bottom shell. Therefore, a production process or method of the glue-filling small-pitch module, which can break through the limitation of the bottom shell processing process, is urgently needed.

Disclosure of Invention

An object of the embodiment of the application is to provide a manufacturing method of an LED module, so as to solve the technical problem that a glue-pouring LED display screen in the prior art cannot realize a smaller pixel pitch due to the limitation of a bottom shell processing technology.

In order to achieve the purpose, the technical scheme adopted by the application is as follows: the manufacturing method of the LED module comprises the following steps:

preparing materials: preparing a lamp panel and a bottom shell with a surrounding edge;

assembling: the lamp panel is installed on the position, located within the surrounding edge, of the bottom shell;

glue pouring: filling glue into the lamp panel, so that the glue is filled among the LED chips on the lamp panel;

glue solidification: solidifying the glue to form solid glue;

cutting: and cutting off the surrounding edge and part of the solid glue inside the surrounding edge together, so that the distance between the adjacent LED chips is smaller than 2mm when the two adjacent LED modules are spliced.

In a possible design, the bottom case further comprises a main body part and a connecting edge, the surrounding edge is arranged around the main body part, the connecting edge is connected between the main body part and the surrounding edge, and a glue groove is formed by the surrounding edge, the connecting edge and the main body part in a surrounding manner;

when the lamp panel is assembled, the lamp panel is arranged on the main body part;

when glue is poured, the glue flows from the lamp panel to the glue groove;

and when the material is cut, the surrounding edge, part of the connecting edge and the solid glue on the connecting edge are cut off together.

In one possible design, the lamp panel includes a printed circuit board and an LED chip attached to the printed circuit board;

and during glue pouring, the glue pouring thickness on the printed circuit board is at least higher than the solder feet of the LED chip, and the glue pouring thickness is lower than the height of the LED chip.

In one possible design, the thickness of the potting compound on the printed circuit board is in the range of 0.4mm to 0.6mm.

In one possible design, the glue is poured at a speed of 20mm-26mm per second;

and/or, when the glue is filled, the glue is filled at the speed of 1.8-2.2 g per second.

In a possible design, during glue filling, glue is filled to different positions of the lamp panel and the edge of the lamp panel through a plurality of glue heads simultaneously.

In a possible design, in the step of preparing material, preparing a sealing ring is further included;

the assembly comprises the following steps:

mounting the sealing ring on the bottom shell in an area located inside the surrounding edge;

and tightly supporting the periphery of the lamp panel on the sealing ring, and fixedly connecting the lamp panel with the bottom shell.

In a possible design, the outer edge of the lamp panel extends to the outside of the outer edge of the sealing ring, and glue is filled between the outer edge of the lamp panel and the bottom shell.

In one possible design, the method for manufacturing the LED module further includes the following steps:

and glue is filled between the edge of the periphery of the back surface of the lamp panel and the bottom shell.

In one possible design, the bottom shell comprises a bottom plate, a side plate and a glue edge, the side plate vertically extends from the edge of the periphery of the bottom plate, the glue edge is arranged on the inner side of the side plate, a glue cavity is formed by enclosing the glue edge, the side plate and the bottom plate, and a glue filling opening communicated with the glue cavity is formed in the bottom plate;

during installation, the sealing ring is abutted to the top end of the side plate, the edge of the lamp panel is abutted to the sealing ring, and the back of the lamp panel is abutted to the rubber edge.

The application provides a manufacturing method of an LED module, which has the beneficial effects that: according to the method for manufacturing the LED module, the surrounding edge is formed on the bottom shell firstly, the surrounding edge can prevent glue from overflowing, so that a glue pouring process can be conveniently performed on the lamp panel, the glued lamp panel can meet the requirements of ultraviolet resistance, water resistance, high and low temperature resistance, high and high humidity resistance and the like, the outdoor use requirement is met, and the LED module and the LED display screen manufactured through the process can be applied outdoors; simultaneously, after glue solidification, the surrounding edge is cut off, and cut off the part solid glue outside the lamp plate with inside the surrounding edge, make lamp plate edge thickness can reach and be less than 0.3mm requirement, then after two adjacent LED modules splice each other, lamp plate edge thickness can with pixel interval phase-match, thereby make the pixel interval of the LED display screen after the concatenation accomplish below 2mm, effectual solution is because of current technology limitation, the surrounding edge can't be done more frivolous, lead to the technical problem that appears the dark line between the adjacent module after assembling, also greatly reduced the cost and the technical degree of difficulty of parts such as drain pan simultaneously, in addition, still avoided appearing the dark line in LED module concatenation position, the display effect of LED display screen has been guaranteed, light is even.

On the other hand, the application also provides an LED module which is manufactured by the LED module manufacturing method.

The application provides a LED module's beneficial effect lies in: the LED module provided by the embodiment of the application is manufactured by manufacturing the LED module, so that the requirement that the pixel pitch of the LED display screen is smaller than 2mm can be met, meanwhile, a dark line cannot appear at the splicing position of the LED module, the display effect of the LED display screen is ensured, and the light is uniform; in addition, the waterproof paint can meet the requirements of ultraviolet resistance, water resistance, high and low temperature resistance, high humidity resistance and the like, can bear the conditions of direct sunlight for a long time, high temperature and high humidity weather and the like, and is not easy to generate the problems of yellowing and waterproof failure.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the embodiments or the prior art descriptions will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without inventive exercise.

Fig. 1 is a schematic flowchart of a method for manufacturing an LED module according to an embodiment of the present disclosure;

fig. 2 is a schematic perspective view of an LED module provided in the embodiment of the present application before cutting;

FIG. 3 is an exploded view of the LED module of FIG. 2;

FIG. 4 is a schematic longitudinal sectional view of the LED module shown in FIG. 2;

FIG. 5 is an enlarged view of a portion A of FIG. 4;

FIG. 6 is a schematic diagram of the bottom shell of FIG. 2 prior to cutting;

fig. 7 is a schematic front view of the LED module provided in the embodiment of the present application after being cut;

fig. 8 is a schematic back view of the LED module provided in the embodiment of the present application after being cut;

FIG. 9 is a schematic longitudinal sectional view of the LED module shown in FIG. 8;

FIG. 10 is an enlarged view of portion B of FIG. 9;

fig. 11 is a schematic view of the bottom shell of fig. 9 after cutting.

Wherein, in the figures, the various reference numbers:

1. a bottom case; 11. a main body part; 111. a base plate; 1111. filling a glue opening; 112. a side plate; 113. gluing edges; 114. connecting ribs; 115. a glue cavity; 12. surrounding edges; 13. a connecting edge; 14. a glue groove; 2. a lamp panel; 21. a printed circuit board; 22. an LED chip; 3. a seal ring; 31. abutting the edges; 32. a limiting edge; 4. and (3) solid glue.

Detailed Description

In order to make the technical problems, technical solutions and advantageous effects to be solved by the present application clearer, the present application is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of and not restrictive on the broad application.

It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or be indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or be indirectly connected to the other element.

It will be understood that the terms "length," "width," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like, as used herein, refer to an orientation or positional relationship indicated in the drawings that is solely for the purpose of facilitating the description and simplifying the description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus should not be considered as limiting the present application.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present application, "a plurality" means two or more unless specifically limited otherwise.

Referring to fig. 1, a method for manufacturing an LED module according to an embodiment of the present disclosure is now described. The manufacturing method of the LED module is used for manufacturing the LED module.

The manufacturing method of the LED module comprises the following steps:

s10, preparing materials: a lamp panel 2 and a bottom case 1 are prepared, wherein the bottom case 1 has a surrounding edge 12.

Specifically, referring to fig. 2 to 5, the lamp panel 2 includes a printed circuit board 21 and a plurality of LED chips 22, each LED chip 22 is disposed on the printed circuit board 21 in a matrix, and the LED chips 22 are attached to the printed circuit board 21 and electrically connected to the printed circuit board 21. The LED chip 22 may be a front-mount red chip, a front-mount blue chip, a front-mount green chip, a full-flip red chip, a full-flip blue chip, and a full-flip green chip.

The bottom shell 1 has a surrounding edge 12, which means that as shown in fig. 5 and 6, a peripheral edge of the bottom shell 1 is enclosed by the surrounding edge 12, so that when glue is poured into an area inside the surrounding edge 12, the surrounding edge 12 will have a blocking effect on the glue, and the glue is prevented from overflowing outwards.

S20, assembling: the lamp panel 2 is arranged on the bottom shell 1 at a position within the surrounding edge 12;

specifically, the functional tests of the LED chip 22 and the lamp panel 2 are firstly tested, and then the tested lamp panel 2 is installed on the bottom case 1.

Install lamp plate 2 in the region that lies in surrounding edge 12 on drain pan 1, then when carrying out the encapsulating protection to lamp plate 2, can block glue through surrounding edge 12, prevent that glue from outflowing before admittedly gluing.

S30, glue pouring: pouring glue into the lamp panel 2, so that the glue is filled between the LED chips 22 on the lamp panel 2;

specifically, the purpose of the potting adhesive is to encapsulate the printed circuit board 21 to protect the printed circuit board 21, and encapsulate the solder tails of the LED chip 22 to protect the circuit portion of the LED chip 22, wherein the encapsulation function is ultraviolet resistance, water resistance, high/low temperature resistance, high/high humidity resistance, and the like.

When glue pouring is carried out, glue is mainly poured into gaps among the LED chips 22 on the printed circuit board 21, and then the glue flows to the edge of the printed circuit board 21 and the area between the edge of the printed circuit board 21 and the surrounding edge 12, so that uniform glue sealing is ensured.

S40, glue fixation: solidifying the glue into solid glue 4;

the glue is solidified under certain conditions, so that the stability after the glue is sealed is ensured, and the glue is prevented from flowing to influence the sealing effect. Specifically, the LED module is horizontally arranged under the normal temperature condition for curing for about one hour, so that the stable curing of glue is ensured, the ultraviolet resistance, the water resistance, the high and low temperature resistance and the high and high humidity resistance of the solid glue 4 are ensured, and the service life of the LED display module is further ensured.

S50, cutting: the surrounding edge 12 and a part of the solid glue inside the surrounding edge 12 are cut off together, so that the distance between the adjacent LED chips 22 is less than 2mm when two adjacent LED modules are spliced.

Specifically, because the surrounding edge 12 is spliced along with the LED modules as a part of the bottom case 1, in order to avoid the occurrence of black lines at the splicing positions of the two LED modules, the thickness of the surrounding edge 12 is required to be matched with the pixel pitch, for example, when the pixel pitch is required to be less than 2mm, the thickness of the surrounding edge 12 is required to be reduced to be less than 0.3mm, and no matter the bottom case 1 is difficult to reduce the thickness of the surrounding edge 12 to be less than 0.3mm in the injection molding, die casting or machining mode, so as long as there is the surrounding edge 12, the requirement of the pixel pitch below 2mm can not be achieved after the splicing of the adjacent LED modules.

To this, this application applicant changes the thinking, through set up surrounding edge 12 on drain pan 1 to satisfy the encapsulating requirement of lamp plate 2, then after the glue solidification, cut surrounding edge 12, thereby solved drain pan 1 because surrounding edge 12 can't accomplish the problem below 0.3 mm.

Specifically, after curing, the surrounding edge 12 and a part of the solid glue within the surrounding edge 12 are cut off together, and after cutting off, the periphery of the lamp panel 2 only has the solid glue 4 and does not have the surrounding edge 12. The width that solid glue 4 was reserved to 2 peripheries of lamp plate can be set for according to the interval between two adjacent LED chips 22 of two adjacent LED modules, as long as satisfy the LED display module assembly after the concatenation, the interval between every two adjacent LED chips 22 all is less than 2mm all can. For example, when the LED chip 22 on the edge of the lamp panel 2 is closer to the edge, the reserved width of the edge solid glue 4 may be larger; when the LED chip 22 at the edge of the lamp panel 2 is far from the edge, the width reserved by the edge solid glue 4 may be small.

To sum up, the surrounding edge 12 is formed on the bottom shell 1 firstly, the surrounding edge 12 can prevent glue from overflowing, so that a glue pouring process can be conveniently performed on the lamp panel 2, the lamp panel 2 after glue pouring can meet the requirements of ultraviolet resistance, water resistance, high and low temperature resistance, high and humidity resistance and the like, namely the outdoor use requirement is met, further, the LED module and the LED display screen manufactured by the process can be applied outdoors, the bottleneck that the pixel interval of outdoor bare products is larger than 2.0mm is broken through, the advanced development and mass production of outdoor bare products with the pixel interval of less than 2.0mm are realized, the market and the first opportunity are occupied, the pixel resolution is improved by more than 60% after the pixel interval is reduced, the market requirement is met, and the related subdivided market is rapidly released in scale; meanwhile, after the glue is cured, the surrounding edge 12 is cut off, and the redundant solid glue 4 inside the surrounding edge 12 and outside the lamp panel 2 is cut off, so that the edge thickness of the lamp panel 2 can reach the requirement of being less than 0.3mm, and after two adjacent LED modules are spliced with each other, the edge thickness of the lamp panel 2 is matched with the pixel spacing, so that the pixel spacing of the spliced LED display screen can be below 2mm, the technical problem that dark lines appear between the adjacent modules after splicing due to the fact that the surrounding edge 12 cannot be made thinner due to the limitation of the existing process is effectively solved, and meanwhile, the cost and the technical difficulty of parts such as the bottom shell 1 are greatly reduced; in addition, the phenomenon that dark lines appear at the splicing position of the LED module is avoided, the display effect of the LED display screen is guaranteed, and light is uniform. The LED module of this application mainly used outdoor environment, and the environment of long-term fixed mounting or regularly installing can bear long-term sunlight and penetrate directly, and the difficult problem that produces yellow stain and waterproof inefficacy is in the condition such as high temperature and high humidity's weather.

In one embodiment, referring to fig. 5 and 6, the bottom case 1 further includes a main body portion 11 and a connecting edge 13, the surrounding edge 12 is enclosed in the main body portion 11, the connecting edge 13 is connected between the main body portion 11 and the surrounding edge 12, the connecting edge 13 and the main body portion 11 are enclosed to form a glue groove 14; when assembling, the lamp panel 2 is mounted on the main body part 11; during glue filling, glue flows from the lamp panel 2 to the glue groove 14; when the material is cut, the solid glue on the surrounding edge 12, part of the connecting edge 13 and the connecting edge 13 is cut off together.

Wherein, 11 mainly used installation lamp plate 2 of main part, the setting of surrounding edge 12 can be convenient for lamp plate 2 encapsulating, connect the setting of limit 13 for surrounding edge 12 can set up with main part 11 at the interval, the encapsulating of being convenient for on the one hand of it, on the other hand also make when excision only need to amputate connect limit 13 can, can not lead to the fact the influence to main part 11, in addition, can also be through connecting the thin some that limit 13 set up, so that amputate fast and connect limit 13 and surrounding edge 12.

In actual design, the bottom shell 1 can be manufactured in a plastic molding mode, and the thicknesses of the connecting edge 13 and the surrounding edge 12 can be reduced as much as possible under the condition that molding conditions are met, so that the processing cost and the material cost can be reduced, and meanwhile, the bottom shell is convenient to cut.

In one embodiment, referring to fig. 5, the bottom end surface of the surrounding edge 12 is flush with the bottom end surface of the main body 11, so that the bottom shell 1 is conveniently placed on a horizontal plane, and the installation and glue filling process of the lamp panel 2 are also facilitated.

Referring to fig. 5, the connection point of the connection edge 13 on the main body 11 is lower than the top end surface of the main body 11, so that the surrounding edge 12, the connection edge 13 and the main body 11 can form a glue groove 14 for filling glue. Meanwhile, the connection point of the connecting edge 13 on the main body part 11 cannot be too low, so that the glue filling amount is too large and the glue amount is wasted. Specifically, the forming position of the connecting edge 13 on the main body 11 may be set according to actual needs, and is not limited herein.

Wherein, single lamp plate 2 can be joined in marriage within 250mm as the size of main part 11, also can install a plurality of lamp plates 2 if the size of main part 11 is great, requires each lamp plate 2 to flush as far as possible after the installation.

In one embodiment, referring to fig. 5 and 10, the lamp panel 2 includes a printed circuit board 21 and an LED chip 22. When the glue is poured, the thickness of the glue on the printed circuit board 21 is at least higher than the solder feet of the LED chip 22, and the thickness of the glue is lower than the height of the LED chip 22.

The height of the solid glue 4 is higher than that of the welding leg of the LED chip 22, so that the welding leg of the LED chip 22 can be protected, good connection between the LED chip 22 and the printed circuit board 21 is guaranteed, and light emission of the LED chip 22 is further guaranteed; and the height of the solid glue 4 is set to be lower than that of the LED chip 22, so that the influence of the solid glue 4 on the light emitting effect of the LED chip 22 due to the covering of the LED chip 22 can be avoided.

Optionally, the LED chip 22 of this application is a low-power chip, the height of the LED chip 22 is approximately 1mm, in order to ensure the protective effect of the potting adhesive on the printed circuit board 21 and the solder fillet, and also in order to prevent the influence of the potting adhesive on the light-emitting effect of the LED chip 22, the potting adhesive thickness range on the printed circuit board 21 is set to 0.4mm-0.6mm, so as to ensure that the potting adhesive can completely cover the solder fillet of each LED chip 22, so as to ensure the protective effect on the solder fillet, and the potting adhesive thickness is far lower than the height of the LED chip 22, that is, the upper half of the LED chip 22 is exposed outside, so as not to shield the side surface of the LED chip 22, and thus the shielding effect of the potting adhesive on the LED chip 22 is avoided.

Specifically, the thickness of the potting adhesive on the printed circuit board 21 may be 0.4mm, 0.42mm, 0.44mm, 0.46mm, 0.48mm, 0.50mm, 0.52mm, 0.54mm, 0.56mm, 0.58mm, 0.6mm, and the like.

In one embodiment, when glue filling is performed, it is necessary to ensure that the glue filling of the whole lamp panel 2 is uniform, and meanwhile, the glue filling amount is required to be ensured to only cover the solder tails of the LED chips 22, and the glue filling amount cannot be too large, so that the glue filling speed is slower than that of a conventional glue filling speed. In addition, when glue is poured, a glue head is generally used for pouring the glue.

Optionally, when glue pouring is performed, the glue pouring is performed at normal temperature and at a speed of 20mm-26mm per second, so that the glue pouring can be stopped immediately when the glue pouring amount covers the LED chip 22, the glue pouring thickness is prevented from being too large, and the glue pouring uniformity of the whole lamp panel 2 can be guaranteed.

Specifically, the potting may be performed at a constant speed of 20mm, 20.5mm, 21mm, 21.5mm, 22mm, 22.5mm, 23mm, 23.5mm, 24mm, 24.5mm, 25mm, 25.5mm, and 26mm per second.

In addition, when glue pouring is carried out, glue pouring can also be carried out at the speed of 1.8-2.2 g per second, the glue discharging speed is controlled by ensuring the glue discharging amount per second, and the glue discharging speed is prevented from being too fast.

Specifically, the potting may be performed at a rate of 1.8g, 1.85g, 1.9g, 1.95g, 2.0g, 2.05g, 2.1g, 2.15g, and 2.2g per second.

In an embodiment, when the encapsulating, a plurality of glue heads of accessible carry out the encapsulating to different positions and the lamp plate 2 edge of lamp plate 2 simultaneously, then when carrying out the encapsulating, different positions on the lamp plate 2 are glued the volume and can be risen simultaneously, and the rise height is even, not only can reduce the probability that glue flows everywhere on lamp plate 2, also make simultaneously that the encapsulating volume everywhere is even on lamp plate 2, and the encapsulating is effectual.

In an embodiment, referring to fig. 3, fig. 5 and fig. 10, in the step of preparing the material, the sealing ring 3 is further prepared, that is, when the material is prepared, the bottom shell 1, the lamp panel 2 and the sealing ring 3 are prepared.

The assembly comprises the following steps: mounting the seal ring 3 on the bottom shell 1 in the region located within the peripheral edge 12, specifically mounting the seal ring 3 on the main body 11; with the periphery butt of lamp plate 2 on sealing washer 3 to with lamp plate 2 and drain pan 1 fixed connection, for example with lamp plate 2 and the locking of drain pan 1 or buckle chucking, so, can ensure to have good uniformity performance in the LED module concatenation in later stage. Above-mentioned equipment mode for sealing washer 3 can support tightly between lamp plate 2 and drain pan 1, has realized the sealing nature of being connected between lamp plate 2 and the drain pan 1, avoids glue or other liquid to flow to the back of lamp plate 2 with corroding the lamp plate 2 back via the clearance between lamp plate 2 and the drain pan 1, influences the circuit function of lamp plate 2.

In addition, during potting, potting compound is poured between the skirt 12 and the seal ring 3. Specifically, after the sealing ring 3 is installed, the rubber groove 14 is formed by enclosing the surrounding edge 12, the connecting edge 13 and the sealing ring 3.

Sealing washer 3 can cut the back at the surrounding edge 12 of drain pan 1 when playing conventional waterproof dustproof effect, acts as the function of surrounding edge 12, when the back encapsulating, can also effectually prevent that glue from spilling over.

Referring to fig. 5 and 10, the longitudinal section of the sealing ring 3 is L-shaped, the sealing ring 3 includes a butt edge 31 and a limit edge 32, the butt edge 31 is perpendicularly connected to the limit edge 32, the butt edge 31 is butt-connected between the main body portion 11 and the lamp panel 2, the limit edge 32 is attached to the outer side wall of the main body portion 11, the installation of the sealing ring 3 on the main body portion 11 is limited by the limit edge 32, and the sealing ring 3 is guaranteed to be installed in place, so that the purpose of preventing glue is achieved.

In one embodiment, the outer edge of lamp plate 2 extends to outside the outer edge of sealing washer 3, and the encapsulating is filled between the outer edge of lamp plate 2 and drain pan 1. Specifically, when the outward flange of lamp plate 2 extended to beyond the outward flange of sealing washer 3, can be at the outward flange of lamp plate 2 with be connected between the limit 13 encapsulating, after the glue solidification, can be connected through solid glue 4 between lamp plate 2 and the connection limit 13 to ensure waterproof reliable.

In one embodiment, when cutting, the cutting may be performed by a CNC machine, the bottom case 1 is fixed by a fixture, and then the surrounding edge 12, the connecting edge 13 and the excess solid glue 4 are cut off by a cutter. According to multiple experiments, the time required for cutting a single LED module is 3 minutes. Please refer to fig. 7 and fig. 8, which are the front and the back of the LED module after being cut.

Wherein, the size that needs the cutting can be calculated according to the theoretical size of module. For example, a first distance from the edge LED chip 22 to the outer edge of the peripheral edge 12 is measured, and then a second distance from the LED chip 22 to the edge of the bottom case 1 is calculated according to the distance between two adjacent LED chips 22, where the size to be cut is obtained by subtracting the second distance from the first distance.

The cutting accuracy can generally be ensured by: 1. firstly, improve the machining precision of drain pan 1, then carry out accurate location, through with the cutter after the accurate location in the middle of the lathe at last, guarantee the cutting precision through the volume that moves respectively around to, and this volume of moving is the difference of first distance and second distance promptly. 2. Can also aim at the cutter with the sign line during the cutting through carrying out the sign line on the installation tool at the lathe to realize accurate cutting.

In addition, after the trimming of the LED module is finished, if the phenomenon of burrs caused by glue amount exists, the trimming can be completed in various ways such as manual trimming, grinding wheel edge grinding, freezing trimming and the like.

In one embodiment, the method for manufacturing the LED module further includes the following steps: glue is poured between a week edge at the 2 backs of lamp plate and drain pan 1, so can guarantee the leakproofness between the 2 backs of lamp plate and the drain pan 1, prevents that outside glue or other liquid from permeating to the back of lamp plate 2 in order to corrode lamp plate 2 between lamp plate 2 and the drain pan 1.

In one embodiment, not only the butt joint has sealing washer 3 between lamp plate 2 and drain pan 1, still glues between a week edge at the lamp plate 2 back and drain pan 1 simultaneously to realize the dual protection between lamp plate 2 and the drain pan 1, avoid some glue or other liquid to permeate to the back of lamp plate 2 between lamp plate 2 and the drain pan 1 in order to corrode lamp plate 2.

Referring to fig. 5, 6, 10 and 11, the bottom case 1 includes a bottom plate 111, a side plate 112 and a glue edge 113, the side plate 112 extends vertically from a periphery of the bottom plate 111, the glue edge 113 and the side plate 112 are disposed on the same side of the bottom plate 111, the glue edge 113 is disposed on an inner side of the side plate 112, a glue cavity 115 is formed by enclosing the glue edge 113, the side plate 112 and the bottom plate 111, and a glue filling opening 1111 communicated with the glue cavity 115 is formed on the bottom plate 111. During the installation, with the butt of sealing washer 3 in the top setting of curb plate 112, with the one week edge butt of lamp plate 2 in sealing washer 3, the back and the 113 butt settings of gluey limit of lamp plate 2. During glue filling, glue is filled into the glue filling cavity 115 from the glue filling opening 1111, so that the edge of the periphery of the back surface of the lamp panel 2, the side plate 112 and the glue edge 113 are sealed, and sealing is achieved.

Referring to fig. 11, four glue filling ports 1111 are formed on each side of the bottom plate 111 corresponding to the lamp panel 2, so that glue can be filled through four glue heads simultaneously on each side of the lamp panel 2, and the glue filling is uniform. It is understood that in other embodiments, the number of the glue filling ports 1111 may also be one, two, three, five, or more than five, depending on the actual length of the lamp panel 2.

Wherein, the thickness of encapsulating can be 1.5mm, 1.7mm, 1.85mm, 2mm, 2.15mm, 2.3mm etc. as long as can play the guard action.

The back glue filling is also carried out under the normal temperature condition, and the glue filling speed can be the same as that of the front glue filling speed.

In addition, after the potting, the curing needs to be carried out for about 1 hour at normal temperature.

Referring to fig. 6 and 11, the connection ribs 114 are connected between the side plates 112, and the arrangement of the connection ribs 114 can increase the structural strength of the entire bottom case 1, and on the other hand, the lamp panel 2 can be supported by the connection ribs 114, and the lamp panel 2 is locked by the connection ribs 114.

On the other hand, the application also provides the LED module which is manufactured by the manufacturing method of the LED module. This LED module includes drain pan 1, lamp plate 2, sealing washer 3 and solid glue 4, and wherein, drain pan 1 includes main part 11, and main part 11 includes bottom plate 111, curb plate 112, glues limit 113 and splice bar 114.

The specific structures of the main body 11, the lamp panel 2, the sealing ring 3 and the solid glue 4 are described above, and will not be described repeatedly here.

The above description is only a preferred embodiment of the present application and should not be taken as limiting the present application, and any modifications, equivalents, improvements, etc. made within the spirit and principle of the present application should be included in the protection scope of the present application.

Claims

1. A manufacturing method of an LED module is characterized by comprising the following steps:

preparing materials: preparing a lamp panel and a bottom shell with surrounding edges;

assembling: the lamp panel is arranged at the position, located within the surrounding edge, of the bottom shell;

and (3) glue pouring: pouring glue into the lamp panel to enable the glue to be filled between the LED chips on the lamp panel;

glue solidification: solidifying the glue to form solid glue;

cutting: and cutting off the surrounding edge and part of the solid glue inside the surrounding edge together, so that the distance between the two adjacent LED chips is smaller than 2mm when the two adjacent LED modules are spliced.

2. The method for manufacturing an LED module according to claim 1, wherein the bottom housing further comprises a main body portion and a connecting edge, the surrounding edge is surrounded on the main body portion, the connecting edge is connected between the main body portion and the surrounding edge, and a glue groove is formed by the surrounding edge, the connecting edge and the main body portion;

when glue is poured, the glue flows from the lamp panel to the glue groove;

3. The method for manufacturing an LED module according to claim 1, wherein the lamp panel includes a printed circuit board and an LED chip attached to the printed circuit board;

4. The method of claim 3, wherein the thickness of the potting adhesive on the printed circuit board is in the range of 0.4mm to 0.6mm.

5. The method for manufacturing an LED module according to claim 1, wherein the filling is performed at a speed of 20mm to 26mm per second;

6. The method for manufacturing an LED module according to claim 1, wherein during glue filling, different positions of the lamp panel and the edge of the lamp panel are simultaneously filled with glue through a plurality of glue heads.

7. The method for manufacturing an LED module according to claim 1, wherein the preparing step further comprises preparing a sealing ring;

the assembly comprises the following steps:

8. The method for manufacturing the LED module according to claim 7, wherein an outer edge of the lamp panel extends beyond an outer edge of the sealing ring, and glue is filled between the outer edge of the lamp panel and the bottom case.

9. The method for manufacturing an LED module according to claim 7, further comprising the steps of:

and glue is filled between the edge of the periphery of the back of the lamp panel and the bottom shell.

10. The method according to claim 9, wherein the bottom housing comprises a bottom plate, a side plate and a glue edge, the side plate extends vertically from a peripheral edge of the bottom plate, the glue edge is disposed on an inner side of the side plate, the glue edge, the side plate and the bottom plate enclose a glue cavity, and the bottom plate is provided with a glue filling opening communicated with the glue cavity;

11. An LED module manufactured by the method for manufacturing an LED module according to any one of claims 1 to 10.