CN115752990A - Mechanical impact test fixing device and method for integrated circuit device - Google Patents

Abstract

The invention discloses a mechanical impact test fixing device and a fixing method of an integrated circuit device. The method comprises the following steps: (A) A fixing mechanism is arranged on the mechanical impact table, meanwhile, the ceramic package integrated circuit device to be tested is fixed in the impact equipment through a fixing piece, then the impact equipment is placed on the mechanical impact table, and finally, the impact equipment is fixed through the fixing mechanism; (B) Setting test conditions on the basis of the step (A) to carry out an impact test; (C) And (C) loosening the fixing mechanism on the basis of the step (B), and then rotating the impact equipment to adjust the test direction of the impact equipment to complete the impact test. The invention avoids the occurrence of the condition of cracking of a device ceramic body in the processes of clamping, fixing and running, and is beneficial to achieving the purpose of the original mechanical impact test.

Description

Mechanical impact test fixing device and method for integrated circuit device

Technical Field

The invention relates to the technical field of mechanical environment tests, in particular to a fixing device and a fixing method for a mechanical impact test of an integrated circuit device.

Background

The known environmental test is a test technology for checking the quality and reliability of products, and aims to eliminate defective unqualified products and ensure that the quality and reliability of the defective unqualified products meet the actual use requirements. As an important component of an environmental test, mechanical tests such as high-acceleration centrifugation, vibration, impact and the like aim to determine the adaptability of a product subjected to a mechanical environment and evaluate the structural stability and integrity of the product, and are indispensable test items for microelectronic component identification, batch assessment, screening and the like.

The military semiconductor integrated circuit devices can be produced and supplied after reliability evaluation is carried out, the reliability evaluation standard is according to GJB597B-2012 semiconductor integrated circuit general specification, the reliability evaluation flow is called authentication inspection, the authentication requires a bearing party to authenticate the devices, the reliability evaluation standard is subject to all requirements (such as a table shown in figure 1) of tests of group A, group B, group C and group D of the devices according to a specified device grade by a GJB548B (integrated circuit, chip screening program and method) method 5005 so as to prove that the reliability evaluation standard can meet the tests, peak acceleration values of mechanical impact equipment and devices fixed on the mechanical impact equipment in six directions under four test conditions of the GJB548B method 2002.1 (peak acceleration 500g and 1.0 ms), test condition group B (peak acceleration 1500g and 0.5 ms), test condition group C (peak acceleration 3000g and 0.3 ms) are not measured simultaneously, the peak acceleration values of the mechanical impact equipment and the devices fixed on the mechanical impact equipment under the four test conditions are not proved to be consistent with the peak acceleration values when the equipment works under the four test conditions, the peak acceleration values are not proved to be combined with the devices, and the situation of the devices is not proved to be consistent with the occurrence of the test method.

For the field of integrated circuit reliability detection, particularly for a mechanical shock test (including mechanical shock, frequency sweep vibration and constant acceleration, and related test and method conditions are shown in fig. 1) in a ceramic packaged semiconductor integrated circuit identification and inspection D grouping test, the test mainly examines the reliability of raw materials used by a device and related packaging processes, and an additional acting force is introduced to the device in the device fixing process and the device testing process by the traditional clamp method, so that the situation of cracking of a device ceramic body is easily caused, the sealing failure of the device is caused, and the original test purpose cannot be achieved.

Disclosure of Invention

Technical problem to be solved

Aiming at the defects in the prior art, the invention provides a fixing device and a fixing method for a mechanical impact test of an integrated circuit device, which avoid the occurrence of the condition of cracking of a device ceramic body in the processes of clamping, fixing and running, are beneficial to avoiding the problem that the sealing failure of the device cannot achieve the purpose of the original mechanical impact test, and therefore, the requirements of a ceramic packaged integrated circuit device in the mechanical impact test can be met.

(II) technical problems to be solved

In order to achieve the purpose, the technical scheme adopted by the invention is as follows:

the utility model provides a mechanical shock test fixing device of integrated circuit device, includes the mechanical impact platform, be fixed with the backing plate on the mechanical impact platform, place the impact equipment that is used for the clamping to wait to test ceramic package integrated circuit device on the backing plate, just be provided with on the mechanical impact platform and be used for fixing the fixed establishment of impact equipment, be provided with the mounting that is used for fixing waiting to test ceramic package integrated circuit device in the impact equipment.

Preferably, strike equipment including strikeing anchor clamps, it has the mounting groove that is used for the installation to wait to test ceramic package integrated circuit device just to strike to open on the anchor clamps be provided with anchor clamps apron on the mounting groove, anchor clamps apron can be used to cover the ceramic package integrated circuit device that waits to test in the mounting groove, and be in strike anchor clamps the mounting groove and be provided with on the anchor clamps apron and be used for fixing waiting to test ceramic package integrated circuit device on the mounting groove the mounting, anchor clamps apron with it passes through the fixed locking of retaining member to strike anchor clamps.

Preferably, the locking member is a locking screw.

Preferably, the backing plate is fixed on the mechanical impact table through fastening screws.

Preferably, the fixing piece comprises a cover plate double-sided tape arranged on the clamp cover plate or/and a bottom surface double-sided tape arranged on the mounting groove.

Preferably, the cover plate double-sided tape or/and the bottom surface double-sided tape is/are an ultrathin sticky adhesive film, and the ultrathin sticky adhesive film requires that both sides have stickiness.

Preferably, the thickness of the ultrathin sticky glue film is not more than 0.2mm, the ultrathin sticky glue film is made of acrylic acid, and the size of the ultrathin sticky glue film is larger than that of the ceramic packaged integrated circuit device to be tested.

Preferably, at least one of said impact devices, adjacent said impact devices, is stacked together.

Preferably, four impact devices are used.

Preferably, at least one mounting groove formed on the impact clamp

Preferably, a plurality of the mounting grooves are uniformly distributed on the impact clamp at intervals.

Preferably, four or six or nine mounting grooves are uniformly distributed on the impact clamp at intervals.

Preferably, the impact clamp is made of a metal material, and the thickness of the impact clamp is larger than 10mm.

Preferably, the fixing mechanism comprises a connecting rod arranged on the mechanical impact table, a cross beam is arranged on the connecting rod, and the connecting rod and the cross beam are connected together through a fastener.

Preferably, the mechanical impact table is provided with two corresponding connecting rods, the adjacent connecting rods are connected into a whole through the cross beam, and each connecting rod is connected with the cross beam through a fastener.

Preferably, the fastener is a nut.

Preferably, the structural material of the cross beam is a metal material.

Preferably, the test device further comprises a first acceleration sensor arranged on the mechanical impact table and a second acceleration sensor arranged on the ceramic package integrated circuit device to be tested.

Preferably, the acceleration sensor is bonded to the mechanical impact table by glue, and the acceleration sensor is bonded to the bottom surface of the ceramic package integrated circuit device to be tested by glue.

In addition, the invention also provides a mechanical impact test fixing method of the integrated circuit device, which is characterized in that: the method comprises the following steps:

(A) The fixing mechanism is arranged on the mechanical impact table, the ceramic packaged integrated circuit device to be tested is fixed in the impact equipment through a fixing piece, then the impact equipment provided with the ceramic packaged integrated circuit device to be tested is placed on the mechanical impact table, and finally the impact equipment provided with the ceramic packaged integrated circuit device to be tested is fixed through the fixing mechanism;

(B) Setting test conditions as required on the basis of the step (A) to carry out an impact test;

(C) And (B) loosening the fixing mechanism on the basis of the step (B), then rotatably installing the impact equipment of the ceramic packaged integrated circuit device to be tested, and adjusting the test direction of the impact equipment provided with the ceramic packaged integrated circuit device to be tested to finish the impact test.

(III) technical effects to be achieved

Compared with the prior art, the invention has the beneficial effects that:

firstly, the impact equipment is provided with a fixing piece for fixing the ceramic packaging integrated circuit device to be tested, and the impact equipment is reasonable in arrangement, simple in structure and convenient to implement.

Secondly, the impact equipment comprises an impact clamp, wherein the impact clamp is provided with a mounting groove for mounting the ceramic packaged integrated circuit device to be tested, a clamp cover plate is arranged on the mounting groove and can be used for covering the ceramic packaged integrated circuit device to be tested in the mounting groove, fixing parts for fixing the ceramic packaged integrated circuit device to be tested on the mounting groove are arranged on the mounting groove of the impact clamp and the clamp cover plate, the clamp cover plate and the impact clamp are fixedly locked through a locking part, the fixing parts comprise a cover plate double-sided adhesive tape arranged on the clamp cover plate or/and a bottom surface double-sided adhesive tape arranged on the mounting groove, the cover plate double-sided adhesive tape or/and the bottom surface double-sided adhesive tape are ultrathin adhesive films, and the ultrathin adhesive films require that both sides of the adhesive films have adhesive properties.

Thirdly, the invention (A) is provided with a fixing mechanism on a mechanical impact platform, and simultaneously, a ceramic packaging integrated circuit device to be tested is fixed in impact equipment through a fixing piece, then the impact equipment provided with the ceramic packaging integrated circuit device to be tested is placed on the mechanical impact platform, and finally the impact equipment provided with the ceramic packaging integrated circuit device to be tested is fixed through the fixing mechanism; (B) Setting test conditions as required on the basis of the step (A) to carry out an impact test; (C) Loosening the fixed establishment on the basis of step (B), then the rotatory impact equipment who installs the ceramic package integrated circuit device that remains to test, carry on can be to the impact equipment adjustment test direction completion impact test who installs the ceramic package integrated circuit device that remains to test, impact equipment includes the impact anchor clamps, it has the mounting groove that is used for installing the ceramic package integrated circuit device that waits to test to open on the impact anchor clamps and is provided with the anchor clamps apron on the mounting groove, the anchor clamps apron can be used for covering the ceramic package integrated circuit device that waits to test in the mounting groove, and be provided with on the mounting groove of impact anchor clamps and the anchor clamps apron and be used for fixing the ceramic package integrated circuit device that waits to test on the mounting groove, the anchor clamps apron passes through retaining member fixed locking, the mounting includes the apron double-sided sticky tape that sets up on the anchor clamps apron or/and sets up the bottom surface double-sided sticky tape on the mounting groove, apron double-sided sticky tape or/and bottom surface double-sided sticky tape are ultra-thin sticky glue film, and it all has stickness to require, it is reasonable in design not only, be convenient for people's manual operation, and use ultra-thin stickness glue film as the carrier that device and anchor clamps are connected, fix on the impact test bench again, this kind of device can not take place firm structure, this kind of device simultaneously, can not take place, the acceleration can combine closely, it can be favorable to impact test to take place, the phenomenon more closely, the impact anchor clamps.

Drawings

FIG. 1 is a schematic representation of all requirements tables for the prior art group A, group B, group C and group D tests.

Fig. 2 is a schematic structural view of a mechanical shock test fixture for an integrated circuit device according to the present invention.

FIG. 3 is a schematic structural view of a fixing device for clamping four ceramic packaged integrated circuit devices to be tested at one time.

Fig. 4 is a schematic view of the impact device of fig. 3.

Fig. 5 is a sectional view taken along the line B-B in fig. 4.

FIG. 6 is a schematic view of a cover plate of the fixture of the present invention.

FIG. 7 is a schematic structural view of a fixing device for clamping nine ceramic packaged integrated circuit devices to be tested at one time.

Fig. 8 is a schematic view of the impact clamp of fig. 7.

Fig. 9 is a sectional view taken along the direction C-C.

FIG. 10 is a schematic view of an embodiment of the present invention without a cover plate of the clamp.

FIG. 11 is a schematic view of an embodiment of the impact clamp of the present invention without the clamp cover plate.

Fig. 12 is a sectional view taken along line C-C of fig. 11.

In the figure: 1, a mechanical impact table; 2, a backing plate; 3, an impact device; 4, a fixing mechanism; 31, an impact clamp; 32, mounting grooves; 33, a clamp cover plate; 34, a locking member; 41, a connecting rod; 42, a cross beam; 43, a fastener; 51, cover double-sided tape; 52, bottom double tape; 61, an acceleration sensor I; and 62, an acceleration sensor II.

Detailed Description

In the description of the present invention, it should be noted that when an element is referred to as being "fixed" or "disposed" to another element, it can be directly on the other element or be indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or be indirectly connected to the other element.

In the description of the present invention, it should be noted that the terms "center", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. indicate orientations or positional relationships based on orientations or positional relationships shown in the drawings, or orientations or positional relationships that are conventionally placed when the product of the present invention is used, and are merely for convenience of description and simplification of the description, but do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore should not be construed as limiting the present invention. Furthermore, the terms "first," "second," "third," and the like are used solely to distinguish one from another and are not to be construed as indicating or implying relative importance. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless specifically defined otherwise. The meaning of "a number" is one or more unless specifically limited otherwise.

In the description of the present invention, it should also be noted that, unless otherwise explicitly specified or limited, the terms "disposed," "mounted," "connected," and "connected" are to be construed broadly and may, for example, be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.

In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood, however, that the description herein of specific embodiments is only intended to illustrate the invention and not to limit the scope of the invention. Moreover, in the following description, descriptions of well-known structures and techniques are omitted so as to not unnecessarily obscure the concepts of the present invention.

The first embodiment is as follows: referring to fig. 2, a fixing device for mechanical impact test of an integrated circuit device includes a mechanical impact table 1, a pad 2 is fixed on the mechanical impact table 1, and in this embodiment, the pad 2 is fixed on the mechanical impact table 1 through a fastening screw (convenient to implement and operate), an impact device 3 for clamping a ceramic package integrated circuit device to be tested is placed on the pad 2, and a fixing mechanism 4 for fixing the impact device 3 is arranged on the mechanical impact table 1, which is characterized in that: the impact equipment 3 is internally provided with a fixing piece for fixing a ceramic packaging integrated circuit device to be tested; the impact device 3 comprises an impact clamp 31, an installation groove 32 for installing a ceramic package integrated circuit device to be tested is arranged on the impact clamp 31, a clamp cover plate 33 is arranged on the installation groove 32, the clamp cover plate 33 can be used for covering the ceramic package integrated circuit device to be tested in the installation groove 32, the impact clamp 31 is arranged on the installation groove 32 and the clamp cover plate 33 is provided with a fixing part for fixing the ceramic package integrated circuit device to be tested on the installation groove 32, the clamp cover plate 33 is fixedly locked by the impact clamp 31 through a locking part 34, so that the clamp cover plate 33 is connected with the impact clamp 31 through the locking part 34 into a whole, and the disassembly and the installation are also facilitated. The locking piece 34 is a locking screw, which is convenient to implement.

As shown in fig. 1 to 12, further, the fixing member includes a cover plate double-sided tape 51 disposed on the clamp cover plate 33 or/and a bottom surface double-sided tape 52 disposed on the mounting groove 32, specifically, the cover plate double-sided tape 51 is located on an upper end surface of the ceramic packaged integrated circuit device to be tested, the clamp cover plate 33 is covered on the cover plate double-sided tape 51, which is more favorable for fixing the ceramic packaged integrated circuit device to be tested and the clamp cover plate 33 together, and the bottom surface double-sided tape 52 is located on a lower end surface of the mounting groove 32, so as to fix the lower end surface of the ceramic packaged integrated circuit device to be tested in the mounting groove 32, which is more favorable for fixing the ceramic packaged integrated circuit device to be tested in the mounting groove 32. Wherein apron double-sided tape 51 or bottom surface double-sided tape 52 are ultra-thin stickness glued membrane, and ultra-thin stickness glued membrane requires two-sided stickness that all has, and ultra-thin stickness glued membrane thickness is not more than 0.2mm, and ultra-thin stickness glued membrane material is acrylic acid, and ultra-thin stickness glued membrane size will be greater than waiting to test ceramic package integrated circuit device size, is favorable to better covering waiting to test ceramic package integrated circuit device like this. The first scheme is as follows: a cover plate double-sided tape 51 can be arranged on the clamp cover plate 33 independently, so that the cover plate double-sided tape 51 is pasted on the ceramic packaged integrated circuit device to be tested, and then the other side of the cover plate double-sided tape 51 is pasted on the clamp cover plate 33, thereby playing a role in fixing the ceramic packaged integrated circuit device to be tested; scheme two is as follows: a bottom surface double-adhesive tape 52 can be stuck on the lower bottom surface of the mounting groove 32 independently, and then the ceramic packaged integrated circuit device to be tested is stuck on the other surface of the bottom surface double-adhesive tape 52, which is beneficial to fixing the ceramic packaged integrated circuit device to be tested in the mounting groove 32; the preferable scheme is three: the cover plate 33 of the fixture is provided with a cover plate double-sided tape 51, and simultaneously, the lower bottom surface of the mounting groove 32 is adhered with a bottom surface double-sided tape 52, so that the ceramic package integrated circuit device to be tested can be fixed more favorably. The mode is various, can supply people to choose the room greatly.

As shown in fig. 1 to 12, further, at least one of the striking devices 3, adjacent to the striking device 3, is stacked, which not only facilitates the installation, but also allows a plurality of striking devices to be processed at a time. Whereas in the present embodiment four are used for the percussion device 3. It is also to be noted that, at least one mounting groove 32 is formed on the impact fixture 31, and in the embodiment, a plurality of mounting grooves 32 are uniformly distributed on the impact fixture 31 at intervals, so that the testing of a plurality of ceramic packaged integrated circuit devices to be tested can be performed at one time, and the working efficiency is improved, wherein four or six or nine mounting grooves 32 are uniformly distributed on the impact fixture 31 at intervals. It is also to be emphasized that the impact clamp 31 is required to be made of a metal material, and the thickness of the impact clamp 31 is larger than 10mm.

As shown in fig. 1 to 12, further, the fixing mechanism 4 includes a connecting rod 41 disposed on the mechanical impact table 1, a cross beam 42 is disposed on the connecting rod 41, the connecting rod 41 and the cross beam 42 are connected together through a fastening member 43, in this embodiment, two corresponding connecting rods 41 are disposed on the mechanical impact table 1, adjacent connecting rods 41 are connected into a whole through the cross beam 42, and each connecting rod 41 and the cross beam 42 are connected together through a fastening member 43. It is to be noted that the fastening member 43 is a nut. It is also contemplated that the cross beam 42 is constructed of a metallic material. The structure is beneficial to being suitable for the impact equipment 3 with different heights, greatly improves the universality and can meet the use requirements.

As shown in fig. 1 to fig. 12, further, the test device further includes a first acceleration sensor 61 disposed on the mechanical impact table 1, and a second acceleration sensor 62 disposed on the ceramic package integrated circuit device to be tested, wherein the first acceleration sensor 61 is firmly adhered to the mechanical impact table 1 by using glue, and the second acceleration sensor 62 is firmly adhered to the bottom surface of the ceramic package integrated circuit device to be tested by using glue, which is better favorable for collecting peak acceleration.

In addition, the invention also provides a mechanical impact test fixing method of the integrated circuit device, which is characterized in that: the method comprises the following steps:

(A) The fixing mechanism 4 is installed on the mechanical impact table 1, the ceramic packaged integrated circuit device to be tested is fixed in the impact equipment 3 through a fixing piece, then the impact equipment 3 provided with the ceramic packaged integrated circuit device to be tested is placed on the mechanical impact table 1, and finally the impact equipment 3 provided with the ceramic packaged integrated circuit device to be tested is fixed through the fixing mechanism 4;

(B) Setting test conditions (the test conditions comprise peak acceleration, pulse time, impact times and the like) according to requirements on the basis of the step (A) to perform an impact test;

(C) And (B) loosening the fixing mechanism 4 on the basis of the step (B), then rotating the impact equipment 3 provided with the ceramic packaged integrated circuit device to be tested, and adjusting the test direction (the direction comprises six directions of Y1, Y2, X1, X2, Z1 and Z2) of the impact equipment 3 provided with the ceramic packaged integrated circuit device to be tested to complete the impact test.

Further, before the fixing mechanism 4 is installed on the mechanical impact table 1, the backing plate 2 may be fixed on the mechanical impact table 1 through a fastening screw, and the impact device 3 of the ceramic package integrated circuit device to be tested is placed on the backing plate 2, so that damage to the device is reduced, and subsequent tests are facilitated.

Furthermore, the impact device 3 comprises an impact fixture 31, wherein the impact fixture 31 is provided with at least one mounting groove 32 for mounting the ceramic package integrated circuit device to be tested, and the impact fixture 31 is provided with the fixture cover plate 33; the fixing piece comprises a cover plate double-sided tape 51 arranged on the clamp cover plate 33 or/and a bottom surface double-sided tape 52 arranged on the mounting groove 32, and the clamp cover plate 33 can be independently provided with the cover plate double-sided tape 51, so that the cover plate double-sided tape 51 is adhered to the ceramic package integrated circuit device to be tested, and then the other surface of the cover plate double-sided tape 51 is adhered to the clamp cover plate 33, thereby playing a role in fixing the ceramic package integrated circuit device to be tested; scheme II: a bottom surface double-adhesive tape 52 can be stuck on the lower bottom surface of the mounting groove 32 independently, and then the ceramic packaged integrated circuit device to be tested is stuck on the other surface of the bottom surface double-adhesive tape 52, which is beneficial to fixing the ceramic packaged integrated circuit device to be tested in the mounting groove 32; the preferred scheme is three: the cover plate 33 of the fixture is provided with a cover plate double-sided tape 51, and simultaneously, the lower bottom surface of the mounting groove 32 is adhered with a bottom surface double-sided tape 52, so that the ceramic package integrated circuit device to be tested can be fixed more favorably. Wherein apron double-sided tape 51 or bottom surface double-sided tape 52 are ultra-thin stickness glued membrane, and ultra-thin stickness glued membrane requires two-sided stickness that all has, and ultra-thin stickness glued membrane thickness is not more than 0.2mm, and ultra-thin stickness glued membrane material is acrylic acid, and ultra-thin stickness glued membrane size will be greater than waiting to test ceramic package integrated circuit device size, is favorable to better covering waiting to test ceramic package integrated circuit device like this.

The packaging form of the ceramic packaging integrated circuit device to be tested in the invention comprises CDIP (ceramic dual in-line package)/CQFP (guard ring four-side pin flat package)/CSOP (ceramic small outline package)/CLCC (ceramic leadless sheet carrier package)/CBGA (ceramic ball grid array package)/CQFJ (ceramic four-side flat package (J-type lead))/CFP (ceramic flat package), thus being more beneficial to meeting the use requirement.

According to the invention, through a mechanical shock test fixing method of the integrated circuit device, the peak acceleration of the equipment in operation is consistent with the peak acceleration of the ceramic packaged integrated circuit device to be tested, and no distortion exists; and then, three types of ceramic packaged integrated circuit devices to be tested with different sizes are found for test verification, the devices are ensured not to fall off in six directions (the directions comprise six directions of Y1, Y2, X1, X2, Z1 and Z2) during the test, the ceramic packaged integrated circuit devices have no cracks after the appearance inspection test, and the airtightness detection is qualified.

Taking a CQFJ44 packaged device (a ceramic packaged integrated circuit device to be tested) as a representative example, peak acceleration values of a mechanical impact test fixing device (comprising a mechanical impact table 1, a backing plate 2, an impact device 3 of the ceramic packaged integrated circuit device to be tested and a fixing mechanism 4) are measured simultaneously in six directions (directions including Y1, Y2, X1, X2, Z1 and Z2) under four test conditions (directions including Y1, Y2, X1, X2, Z1 and Z2) according to a GJB548B method 2002.1 test condition A (peak acceleration 500g and 1.0 ms), a test condition B (peak acceleration 1500g and 0.5 ms), a test condition C (peak acceleration 3000g and 0.3 ms) and a test condition D (peak acceleration 5000g and 0.3 ms). The method comprises the following specific steps:

firstly, firmly bonding a first acceleration sensor 61 on a mechanical impact table 1 by using glue, and firmly bonding a second acceleration sensor 62 on the bottom surface of a CQFJ44 ceramic device to be tested (a ceramic packaging integrated circuit device to be tested) by using glue;

secondly, a bottom double-sided adhesive tape 52 (ultrathin flexible adhesive film) is pasted in the mounting groove 32 of the impact fixture 31, a cover plate double-sided adhesive tape 51 (ultrathin flexible adhesive film) is pasted on the top surface of the CQFJ44 ceramic device to be tested (ceramic packaged integrated circuit device to be tested), and the top surface of the CQFJ44 ceramic device to be tested is ensured to be fully contacted with the cover plate double-sided adhesive tape 51;

thirdly, placing the to-be-tested CQFJ44 ceramic ware with the top surface adhered with the cover plate double-sided adhesive tape 51 on the bottom surface double-sided adhesive tape 52 in the mounting groove 32 of the impact fixture 31, and finally bonding the to-be-tested CQFJ44 ceramic ware with the cover plate double-sided adhesive tape 51 through the fixture cover plate 33, namely, the fixture cover plate 33 covers the to-be-tested CQFJ44 ceramic ware, and the fixture cover plate 33 and the impact fixture 31 are connected into a whole through a locking piece 34 to assemble the impact equipment 3;

and fourthly, placing the impact equipment 3 on the base plate 2 of the mechanical impact table 1, and then fixing the impact equipment 3 on the base plate 2 through the fixing mechanism 4 on the impact equipment 3 to ensure that the clamp does not displace in the test process.

The peak acceleration of the equipment and the device was collected under the above four test conditions (test condition a (peak acceleration 500g, 1.0 ms), test condition B (peak acceleration 1500g,0.5 ms), test condition C (peak acceleration 3000g, 0.3 ms), and test condition D (peak acceleration 5000g, 0.3 ms), and the configuration diagram and the collection results are shown in the following table.

Peak acceleration acquisition results on equipment and devices in impact process in table

The peak acceleration values of the equipment in all directions in the impact process are basically consistent with the peak acceleration values of the devices, and the error is within four ten-thousandth.

In the invention, three packaging type devices with different sizes, namely CQFJ44, CPGA84 and CSOP8, are taken as representatives. At present, mechanical impact test conditions used in the industry are all condition B (1500 g,0.5 ms), so that three devices are tested under the test condition B, the test directions are three-axis and six-direction, each direction is 5 times, the number of test samples of each device is 15, and the device is required to be incapable of failing after the test. The method comprises the following specific steps: firstly, a first acceleration sensor 61 is firmly bonded on a mechanical impact table 1 by glue, and a second acceleration sensor 62 is firmly bonded on the bottom surface of a ceramic device (a ceramic packaged integrated circuit device to be tested) in three packaging modes to be tested by glue; then, a bottom surface double-sided tape 52 (ultrathin flexible adhesive film) is pasted in the mounting groove 32 of the impact fixture 31, a cover plate double-sided tape 51 (ultrathin flexible adhesive film) is pasted on the top surfaces of the ceramic devices (ceramic packaged integrated circuit devices to be tested) in the three packaging modes to be tested, the ceramic devices in the three packaging modes are pasted on the bottom surface double-sided tape 52 in total 45, each bottom surface double-sided tape 52 is of an independent structure, the size of the bottom surface double-sided tape 52 is larger than that of the corresponding device, and meanwhile, the top surfaces of the devices are ensured to be fully contacted with the cover plate double-sided tape 51; next, the impact device 3 is placed on the backing plate 2 of the mechanical impact table 1, and the impact device 3 is fixed on the backing plate 2 through the fixing mechanism 4 on the impact device 3, so that the clamp is ensured not to displace in the test process. According to the test conditions B (1500g, 0.5 ms), the test is carried out for 5 times in each direction in three axes and six directions, all devices are separated from the clamp in the test process and are firmly combined, the appearances and air tightness of 45 devices are checked after the test, the appearances of 45 products are all qualified, the air tightness detection is all qualified, and the method for fixing the devices by using the cover plate double-sided adhesive tape 51 or/and the bottom surface double-sided adhesive tape 52 can be fully explained to replace the traditional clamp method.

The standard parts that use in this application file all can purchase from the market, and the concrete connected mode of each part all adopts conventional means such as ripe bolt among the prior art, screw, and acceleration sensor internal component all adopts conventional model among the prior art, and its internal structure belongs to the prior art structure, and the workman just can accomplish according to the prior art manual and carry out normal operating to it, and circuit connection adopts conventional connected mode among the prior art, no longer makes concrete statement here.

It should be noted that, although the above embodiments have been described herein, the invention is not limited thereto. Therefore, based on the innovative concepts of the present invention, the technical solutions of the present invention can be directly or indirectly applied to other related technical fields by changing and modifying the embodiments described herein or by using the equivalent structures or equivalent processes of the content of the present specification and the attached drawings, and are included in the scope of the present patent.

Claims (10)

1. The utility model provides an integrated circuit device's mechanical shock test fixing device, includes mechanical shock platform (1), be fixed with backing plate (2) on mechanical shock platform (1), place impact equipment (3) that are used for the clamping to wait to test ceramic package integrated circuit device on backing plate (2), and be provided with on mechanical shock platform (1) and be used for fixing fixed establishment (4) of impact equipment (3), its characterized in that: and a fixing piece for fixing the ceramic packaged integrated circuit device to be tested is arranged in the impact equipment (3).

2. A mechanical shock test fixture for an integrated circuit device as defined in claim 1, wherein: impact equipment (3) is including strikeing anchor clamps (31), it has mounting groove (32) that are used for the installation to wait to test ceramic package integrated circuit device to strike to open on anchor clamps (31), just be provided with anchor clamps apron (33) on mounting groove (32), anchor clamps apron (33) can be used for covering wait to test ceramic package integrated circuit device in mounting groove (32), just be in strike mounting groove (32) of anchor clamps (31) and be provided with on anchor clamps apron (33) and be used for waiting to test ceramic package integrated circuit device and fix on mounting groove (32) the mounting, anchor clamps apron (33) with it fixes locking through retaining member (34) to strike anchor clamps (31).

3. A mechanical shock test fixture for an integrated circuit device as defined in claim 2, wherein: the fixing piece comprises a cover plate double-sided adhesive tape (51) arranged on the clamp cover plate (33) or/and a bottom surface double-sided adhesive tape (52) arranged on the mounting groove (32).

4. A mechanical shock test fixture for an integrated circuit device according to claim 3, wherein: the cover plate double-sided adhesive tape (51) or/and the bottom surface double-sided adhesive tape (52) are ultrathin adhesive films, and the ultrathin adhesive films require that both surfaces have adhesiveness.

5. A mechanical shock test fixture for integrated circuit devices as claimed in claim 2, 3 or 4 wherein: at least one of the impact devices (3) is stacked adjacent to the impact device (3).

6. A mechanical shock test fixture for an integrated circuit device as defined in claim 5, wherein: the impact clamp (31) is provided with at least one mounting groove (32).

7. A mechanical shock test fixture for an integrated circuit device according to claim 5, wherein: the material of the impact clamp (31) is a metal material, and the thickness of the impact clamp (31) is larger than 10mm.

8. A mechanical shock test fixture for integrated circuit devices as claimed in claim 1 or 2 or 3 or 4 or 5 or 6 or 7 wherein: the fixing mechanism (4) comprises a connecting rod (41) arranged on the mechanical impact table (1), a cross beam (42) is arranged on the connecting rod (41), and the connecting rod (41) and the cross beam (42) are connected together through a fastening piece (43).

9. A mechanical shock test fixture for integrated circuit devices as claimed in claim 1 or 2 or 3 or 4 or 5 or 6 or 7 wherein: the test bench is characterized by further comprising a first acceleration sensor (61) arranged on the mechanical impact bench (1) and a second acceleration sensor (62) arranged on a ceramic packaged integrated circuit device to be tested.

10. A mechanical impact test fixing method of an integrated circuit device is characterized by comprising the following steps: the method comprises the following steps:

(A) The fixing mechanism (4) is installed on the mechanical impact table (1), meanwhile, the ceramic packaged integrated circuit device to be tested is fixed in the impact equipment (3) through a fixing piece, then the impact equipment (3) provided with the ceramic packaged integrated circuit device to be tested is placed on the mechanical impact table (1), and finally the impact equipment (3) provided with the ceramic packaged integrated circuit device to be tested is fixed through the fixing mechanism (4);

(B) Setting test conditions as required on the basis of the step (A) to carry out an impact test;

(C) And (B) loosening the fixing mechanism (4) on the basis of the step (B), then rotatably installing the impact equipment (3) of the ceramic packaged integrated circuit device to be tested, and adjusting the test direction of the impact equipment (3) provided with the ceramic packaged integrated circuit device to be tested to finish the impact test.

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