CN115747902A - Sectional type control method and device based on hole filling electroplating line and electroplating system - Google Patents
Sectional type control method and device based on hole filling electroplating line and electroplating system Download PDFInfo
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- CN115747902A CN115747902A CN202211261707.9A CN202211261707A CN115747902A CN 115747902 A CN115747902 A CN 115747902A CN 202211261707 A CN202211261707 A CN 202211261707A CN 115747902 A CN115747902 A CN 115747902A
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- rectifier
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- 238000009713 electroplating Methods 0.000 title claims abstract description 118
- 238000000034 method Methods 0.000 title claims abstract description 27
- 238000007747 plating Methods 0.000 claims abstract description 52
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 22
- 229910052802 copper Inorganic materials 0.000 claims description 22
- 239000010949 copper Substances 0.000 claims description 22
- 230000005611 electricity Effects 0.000 claims description 4
- 239000002184 metal Substances 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 229910000365 copper sulfate Inorganic materials 0.000 description 2
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 238000005868 electrolysis reaction Methods 0.000 description 2
- 238000005429 filling process Methods 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N sulfuric acid group Chemical group S(O)(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- 239000002253 acid Substances 0.000 description 1
- 230000006978 adaptation Effects 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
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Abstract
The invention relates to a sectional type control method, a sectional type control device and an electroplating system based on a hole filling electroplating line, which are applied to the hole filling electroplating line, wherein a first rectifier of the hole filling electroplating line is controlled to finish flash plating on an electroplating object through a first control mode so as to obtain the flash plated object; and controlling a second rectifier of the hole filling electroplating line to complete hole filling electroplating of the flash plated object through a second control mode. Therefore, flash plating and hole filling electroplating are completed at one time on the same hole filling electroplating line, and the operation efficiency is effectively improved.
Description
Technical Field
The invention relates to the technical field of electroplating, in particular to a sectional control method and device based on a hole-filling electroplating line and an electroplating system.
Background
Electroplating is a process of plating a thin layer of other metals or alloys on the surface of some metals by using the principle of electrolysis, and a process of attaching a layer of metal film on the surface of a metal or other material product by using the action of electrolysis has the effects of preventing metal oxidation (such as corrosion), improving wear resistance, conductivity, light reflection, corrosion resistance (such as copper sulfate and the like), enhancing the appearance and the like. The Vertical continuous electroplating VCP (Vertical continuous plating) is an acid copper plating system developed for Vertical continuous electroplating equipment, is suitable for electroplating requirements of various plate types, is suitable for through hole electroplating with high current density, is suitable for direct electroplating of copper deposition, organic conductive films and the like, and is suitable for common-blind co-plating.
In the blind hole filling process of the printed circuit board, one-time electroplating is theoretically used, but the one-time electroplating can cause bad hole filling due to bad copper deposition of PTH (plated through hole). Therefore, in the actual process, the plating line is plated with about 0.05-0.15mil of hole copper once to ensure good conductivity of the hole wall during hole filling, thereby improving the success rate of hole filling, and then the hole filling plating line is plated with hole filling again.
Disclosure of Invention
Therefore, a sectional control method, a device and an electroplating system based on a hole filling electroplating line are needed to overcome the defects that the blind hole filling process needs electroplating twice and the overall operation efficiency is limited.
A sectional type control method based on a hole filling electroplating line is applied to the hole filling electroplating line and comprises the following steps:
controlling a first rectifier of the hole-filling electroplating line to complete flash plating on an electroplating object through a first control mode so as to obtain a flash-plated object;
controlling a second rectifier of the hole filling electroplating line to complete hole filling electroplating of the flash plated object in a second control mode;
wherein the first control mode and the second control mode are completely different; the first rectifier and the second rectifier belong to the same copper cylinder of the hole-filling electroplating line.
The sectional control method based on the hole-filling electroplating line is applied to the hole-filling electroplating line, and controls the first rectifier of the hole-filling electroplating line to finish flash plating on an electroplating object through a first control mode so as to obtain a flash-plated object; and controlling a second rectifier of the hole filling electroplating line to complete hole filling electroplating of the flash-plated object through a second control mode. Based on the method, the flash plating and the hole filling electroplating are completed at one time on the same hole filling electroplating line, so that the operation efficiency is effectively improved.
In one embodiment, the first control mode and the second control mode are current control;
the first control mode is used for providing a first current for the first rectifier; the second control mode is used for providing a second current for the second rectifier; the first current is greater than the second current.
In one embodiment, the second current is a null current.
In one embodiment, the first current is a normal operating current of a rectifier in the filled plating line.
In one embodiment, the first fairing is adjacent to the second fairing.
A sectional type controlling means based on porefilling electricity plate wire is applied to porefilling electricity plate wire, includes:
the first control module is used for controlling a first rectifier of the hole filling electroplating line to finish flash plating on an electroplating object through a first control mode so as to obtain a flash plated object;
the second control module is used for controlling a second rectifier of the hole filling electroplating line to complete hole filling electroplating of the flash plated object in a second control mode;
wherein the first control mode and the second control mode are completely different; the first rectifier and the second rectifier belong to the same copper cylinder of the hole filling electroplating line.
The sectional control device based on the hole-filling electroplating line is applied to the hole-filling electroplating line, and controls the first rectifier of the hole-filling electroplating line to finish flash plating on an electroplating object through a first control mode so as to obtain a flash-plated object; and controlling a second rectifier of the hole filling electroplating line to complete hole filling electroplating of the flash-plated object through a second control mode. Therefore, flash plating and hole filling electroplating are completed at one time on the same hole filling electroplating line, and the operation efficiency is effectively improved.
An electroplating system, comprising:
a first rectifier;
a second rectifier;
the first controller is configured to control the first rectifier to finish flash plating on the electroplating object in a first control mode to obtain a flash plated object;
and the second controller is configured to control a second rectifier of the hole filling electroplating line to finish the hole filling electroplating of the flash-plated object through a second control mode.
In the electroplating system, the first rectifier of the hole-filling electroplating line is controlled to complete flash plating on the electroplating object in a first control mode so as to obtain the flash plated object; and controlling a second rectifier of the hole filling electroplating line to complete hole filling electroplating of the flash plated object through a second control mode. Based on the method, the flash plating and the hole filling electroplating are completed at one time on the same hole filling electroplating line, so that the operation efficiency is effectively improved.
In one embodiment, the first controller and the second controller are copper cylinder controllers.
In one embodiment, the first controller controls the first rectifiers individually.
In one embodiment, the second controller controls the second rectifiers individually.
Drawings
FIG. 1 is a schematic diagram of an exemplary embodiment of an electroplating system;
FIG. 2 is a flow chart of a segmented control method based on a hole-filling plating line according to an embodiment;
FIG. 3 is a block diagram of a segmented control device based on a hole-filling plating line according to an embodiment.
Detailed Description
For better understanding of the objects, technical solutions and effects of the present invention, the present invention will be further explained with reference to the accompanying drawings and examples. It is to be noted that the following examples are provided only for illustrating the present invention and are not intended to limit the present invention.
The embodiment of the invention provides a sectional control method and device based on a hole-filling electroplating line and an electroplating system.
Fig. 1 is a schematic diagram of an operation structure of an electroplating system according to an embodiment, as shown in fig. 1, the electroplating system according to an embodiment includes:
a first rectifier 10;
a second rectifier 11;
the first controller 20 is configured to control the first rectifier 10 to complete flash plating on the electroplating object in a first control mode to obtain a flash plated object;
and a second controller 21 configured to control the second rectifier 11 of the hole-filling plating line to complete hole-filling plating of the flash-plated object by a second control manner.
As shown in fig. 1, the first rectifier 10 is adjacent to the second rectifier 11, and in the process, flash plating is performed by the first rectifier 10, and hole-filling plating is performed by the second rectifier 11. The first rectifier 10 and the second rectifier 11 belong to the same hole-filling plating line. As a preferred embodiment, the first rectifier 10 and the second rectifier 11 share the same copper cylinder.
In the conventional via-filling plating line, a plurality of commutators under one copper cylinder are controlled by the same controller. In this embodiment, the respective rectifiers (the first rectifier and the second rectifier) under one copper cylinder are controlled by different controllers.
In one embodiment, as shown in FIG. 1, the first controller 20 controls the first rectifier 10 individually and the second controller 21 controls the second rectifier 11 individually.
As a preferred embodiment, the first controller 20 and the second controller 21 are copper cylinder controllers. The copper cylinder controller of the original hole filling electroplating line is adopted to reduce the adjustment of the original hole filling circuit line, and reduce the hardware change and software adaptation to reduce the setting cost.
Based on this, the first controller 20 and the second controller 21 are used to perform respective controls of the first rectifier 10 and the second rectifier 11.
It is noted that in the embodiment of fig. 1, the first controller 20 and the second controller 21 are separately provided and individually control the corresponding rectifiers. In view of the above, the present embodiment provides a method for controlling a plating line by a hole filling method, in which the first controller and the second controller are implemented by an integrated control device. The embodiment of fig. 1 is merely for ease of understanding of a segmented control method based on a hole-filling plating line.
Based on this, fig. 2 is a flowchart illustrating a sectional control method based on a hole-filling plating line according to an embodiment, and as shown in fig. 2, the sectional control method based on the hole-filling plating line according to an embodiment includes steps S100 and S101:
s100, controlling a first rectifier of the hole-filling electroplating line to finish flash plating on an electroplating object through a first control mode so as to obtain a flash-plated object;
s101, controlling a second rectifier of the hole filling electroplating line to complete hole filling electroplating of the flash plated object in a second control mode;
wherein the first control mode is completely different from the second control mode; the first rectifier and the second rectifier belong to the same copper cylinder of the hole-filling electroplating line.
Taking the electroplating system shown in fig. 1 as an example, the execution subject of step S100 may be a first controller, and the execution subject of step S201 may be a second controller.
The first control mode and the second control mode are completely different, so that the flash plating and the hole filling electroplating are separately controlled.
In one embodiment, the first control mode and the second control mode are current control.
The first control mode is used for providing a first current for the first rectifier; the second control mode is used for providing a second current for the second rectifier; the first current is greater than the second current.
The first current is larger than the second current, and the first current and the second current are not interfered with each other. Taking a common rectifier as an example, the first current of the first rectifier is set to be a normal coefficient, the second current of the second rectifier is set to be 0-0.1, at this time, the second current is a null current or a weak current, and the copper liquid corresponding to the copper cylinder is sulfuric acid and copper sulfate, which can bite the copper surface, so as to achieve the effect of not increasing copper and not reducing copper, namely, the second rectifier outputs the weak current to perform protection operation.
In one embodiment, the second current is a null current, and the first current is a normal operation current of a rectifier in the hole-filling plating line.
The sectional control method based on the hole-filling electroplating line in any embodiment is applied to the hole-filling electroplating line, and controls the first rectifier of the hole-filling electroplating line to finish flash plating on an electroplating object through a first control mode so as to obtain a flash-plated object; and controlling a second rectifier of the hole filling electroplating line to complete hole filling electroplating of the flash plated object through a second control mode. Therefore, flash plating and hole filling electroplating are completed at one time on the same hole filling electroplating line, and the operation efficiency is effectively improved.
The embodiment of the invention also provides a sectional type control device based on the hole-filling electroplating line.
Fig. 3 is a block diagram illustrating an embodiment of a sectional type control apparatus based on a hole-filling plating line, and as shown in fig. 3, the embodiment of the sectional type control apparatus based on the hole-filling plating line includes:
the first control module 100 is configured to control the first rectifier of the hole-filling electroplating line to complete flash plating on an electroplating object through a first control manner, so as to obtain a flash-plated object;
the second control module 101 is configured to control, in a second control manner, a second rectifier of the hole filling electroplating line to complete hole filling electroplating on the flash plated object;
wherein the first control mode is completely different from the second control mode; the first rectifier and the second rectifier belong to the same copper cylinder of the hole filling electroplating line.
The sectional control device based on the hole-filling electroplating line is applied to the hole-filling electroplating line, and controls the first rectifier of the hole-filling electroplating line to finish flash plating on an electroplating object through a first control mode so as to obtain a flash-plated object; and controlling a second rectifier of the hole filling electroplating line to complete hole filling electroplating of the flash plated object through a second control mode. Based on the method, the flash plating and the hole filling electroplating are completed at one time on the same hole filling electroplating line, so that the operation efficiency is effectively improved.
All possible combinations of the technical features in the above embodiments may not be described for the sake of brevity, but should be considered as being within the scope of the present disclosure as long as there is no contradiction between the combinations of the technical features.
The above examples only show some embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that various changes and modifications can be made by those skilled in the art without departing from the spirit of the invention, and these changes and modifications are all within the scope of the invention. Therefore, the protection scope of the present patent should be subject to the appended claims.
Claims (10)
1. A sectional type control method based on a hole filling electroplating line is applied to the hole filling electroplating line and is characterized by comprising the following steps:
controlling a first rectifier of the hole-filling electroplating line to complete flash plating on an electroplating object through a first control mode so as to obtain a flash plated object;
controlling a second rectifier of the hole filling electroplating line to complete hole filling electroplating of the flash plated object in a second control mode;
wherein the first control mode is completely different from the second control mode; the first rectifier and the second rectifier belong to the same copper cylinder of the hole filling electroplating line.
2. The segmented control method based on a hole-filling plating line according to claim 1, wherein the first control manner and the second control manner are current control;
the first control mode is used for providing a first current for the first rectifier; the second control mode is used for providing a second current for the second rectifier; the first current is greater than the second current.
3. The segmented control method based on a hole-filling plating line according to claim 2, wherein the second current is a null current.
4. The segmented control method based on a hole-filling plating line according to claim 2, wherein the first current is a normal operation current of a rectifier in the hole-filling plating line.
5. The segmented control method based on a hole-filling plating line according to claim 1, wherein the first commutator is adjacent to the second commutator.
6. The utility model provides a sectional type controlling means based on porefilling electricity plate wire, is applied to porefilling electricity plate wire which characterized in that includes:
the first control module is used for controlling a first rectifier of the hole filling electroplating line to finish flash plating on an electroplating object through a first control mode so as to obtain a flash plated object;
the second control module is used for controlling a second rectifier of the hole filling electroplating line to complete hole filling electroplating on the flash plated object in a second control mode;
wherein the first control mode and the second control mode are completely different; the first rectifier and the second rectifier belong to the same copper cylinder of the hole-filling electroplating line.
7. An electroplating system, comprising:
a first rectifier;
a second rectifier;
the first controller is configured to control the first rectifier to finish flash plating on the electroplating object in a first control mode to obtain a flash plated object;
and the second controller is configured to control a second rectifier of the hole filling electroplating line to finish the hole filling electroplating of the flash-plated object through a second control mode.
8. The plating system of claim 7, wherein the first and second controllers are copper cylinder controllers.
9. The plating system of claim 7, wherein the first controller individually controls the first rectifiers.
10. The plating system of claim 7, wherein the second controller individually controls the second rectifiers.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211261707.9A CN115747902A (en) | 2022-10-14 | 2022-10-14 | Sectional type control method and device based on hole filling electroplating line and electroplating system |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211261707.9A CN115747902A (en) | 2022-10-14 | 2022-10-14 | Sectional type control method and device based on hole filling electroplating line and electroplating system |
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| CN115747902A true CN115747902A (en) | 2023-03-07 |
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Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102647862A (en) * | 2012-04-25 | 2012-08-22 | 博敏电子股份有限公司 | Blind via filling plating method using different current parameter combinations |
| CN202626320U (en) * | 2012-04-27 | 2012-12-26 | 广州明毅电子机械有限公司 | Vertical continuous electroplating device |
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- 2022-10-14 CN CN202211261707.9A patent/CN115747902A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102647862A (en) * | 2012-04-25 | 2012-08-22 | 博敏电子股份有限公司 | Blind via filling plating method using different current parameter combinations |
| CN202626320U (en) * | 2012-04-27 | 2012-12-26 | 广州明毅电子机械有限公司 | Vertical continuous electroplating device |
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