CN115746765A - Glue for integrally sticking stick on rubber plate and process - Google Patents
Glue for integrally sticking stick on rubber plate and process Download PDFInfo
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- CN115746765A CN115746765A CN202211472221.XA CN202211472221A CN115746765A CN 115746765 A CN115746765 A CN 115746765A CN 202211472221 A CN202211472221 A CN 202211472221A CN 115746765 A CN115746765 A CN 115746765A
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- glue
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- stick
- mold
- integrated
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- 239000003292 glue Substances 0.000 title claims abstract description 60
- 238000000034 method Methods 0.000 title claims abstract description 22
- 239000003822 epoxy resin Substances 0.000 claims abstract description 21
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 21
- 229910021419 crystalline silicon Inorganic materials 0.000 claims abstract description 19
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 18
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 18
- 239000010703 silicon Substances 0.000 claims abstract description 18
- 239000002518 antifoaming agent Substances 0.000 claims abstract description 14
- 239000004593 Epoxy Substances 0.000 claims abstract description 9
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 8
- 239000003085 diluting agent Substances 0.000 claims abstract description 8
- 239000000945 filler Substances 0.000 claims abstract description 8
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 7
- 238000003756 stirring Methods 0.000 claims description 24
- 239000013078 crystal Substances 0.000 claims description 19
- 239000004836 Glue Stick Substances 0.000 claims description 18
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 claims description 8
- 239000004721 Polyphenylene oxide Substances 0.000 claims description 8
- -1 alkyl glycidyl ether Chemical compound 0.000 claims description 8
- 229920000570 polyether Polymers 0.000 claims description 8
- 238000010438 heat treatment Methods 0.000 claims description 7
- 238000004519 manufacturing process Methods 0.000 claims description 7
- 239000004952 Polyamide Substances 0.000 claims description 6
- 239000013530 defoamer Substances 0.000 claims description 6
- 229920002647 polyamide Polymers 0.000 claims description 6
- 229920006295 polythiol Polymers 0.000 claims description 6
- UWFRVQVNYNPBEF-UHFFFAOYSA-N 1-(2,4-dimethylphenyl)propan-1-one Chemical compound CCC(=O)C1=CC=C(C)C=C1C UWFRVQVNYNPBEF-UHFFFAOYSA-N 0.000 claims description 4
- QNYBOILAKBSWFG-UHFFFAOYSA-N 2-(phenylmethoxymethyl)oxirane Chemical compound C1OC1COCC1=CC=CC=C1 QNYBOILAKBSWFG-UHFFFAOYSA-N 0.000 claims description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 4
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 claims description 4
- 229910000019 calcium carbonate Inorganic materials 0.000 claims description 4
- 239000000741 silica gel Substances 0.000 claims description 4
- 229910002027 silica gel Inorganic materials 0.000 claims description 4
- 150000003376 silicon Chemical class 0.000 claims description 4
- SHKUUQIDMUMQQK-UHFFFAOYSA-N 2-[4-(oxiran-2-ylmethoxy)butoxymethyl]oxirane Chemical compound C1OC1COCCCCOCC1CO1 SHKUUQIDMUMQQK-UHFFFAOYSA-N 0.000 claims description 3
- ZBCBWPMODOFKDW-UHFFFAOYSA-N diethanolamine Chemical compound OCCNCCO ZBCBWPMODOFKDW-UHFFFAOYSA-N 0.000 claims description 3
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 3
- 239000002390 adhesive tape Substances 0.000 claims description 2
- 239000004033 plastic Substances 0.000 abstract description 8
- 238000005520 cutting process Methods 0.000 abstract description 7
- 239000000853 adhesive Substances 0.000 description 8
- 230000001070 adhesive effect Effects 0.000 description 8
- 239000000203 mixture Substances 0.000 description 6
- 238000002360 preparation method Methods 0.000 description 5
- 229920000297 Rayon Polymers 0.000 description 4
- 235000012431 wafers Nutrition 0.000 description 4
- 238000013329 compounding Methods 0.000 description 3
- 238000007599 discharging Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Images
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Adhesives Or Adhesive Processes (AREA)
Abstract
The invention provides a glue and a process for sticking a rod with an integrated rubber plate, belonging to the field of sticking a rod with crystalline silicon; in the invention, the sticky stick glue comprises a component A and a component B, wherein the component A comprises epoxy resin, epoxy diluent, filler and defoaming agent, and the component B comprises curing agent; the stick-sticking glue water can realize the processes of stick sticking, cutting and degumming under the condition of not using a plastic plate, and realizes the aim of integrating the plastic plate; when the stick sticking glue is used for sticking a stick on crystalline silicon, the stick sticking process time of 2-3h can be saved, and the overall efficiency of silicon wafer cutting is greatly improved.
Description
Technical Field
The invention belongs to the field of crystal silicon rod sticking, and particularly relates to a glue and a process for sticking a rod, wherein a glue board is integrated with the rod.
Background
In recent years, the solar photovoltaic industry gradually becomes a new leading industry, silicon wafers are main raw materials for manufacturing solar cells, and silicon wafer cutting is an important link in solar cell manufacturing. Before the silicon wafer is cut, stick bonding treatment needs to be carried out on the crystal silicon obtained by the evolution, a plastic plate for stick bonding needs to be bonded on a crystal support by using a plate bonding adhesive in the existing stick bonding process, after about 30-60min, the stick bonding adhesive is coated on the plastic plate, then the crystal silicon is placed on the plastic plate for bonding, and after 3h, cutting can be carried out. The whole stick sticking operation steps are complicated and time-consuming, and the whole efficiency of the production line is greatly influenced.
Therefore, a glue stick glue integrated with a glue board and a glue stick process matched with the glue stick glue are needed to be designed.
Disclosure of Invention
Aiming at the defects in the prior art, the invention provides a glue with an integrated glue plate and a stick sticking glue process. In the invention, the sticky stick glue comprises a component A and a component B, wherein the component A comprises epoxy resin, epoxy diluent, filler and defoaming agent, and the component B comprises curing agent; the stick-sticking glue water can realize the processes of stick sticking, cutting and degumming under the condition of not using a plastic plate, and realizes the aim of integrating the plastic plate; when the stick sticking glue is used for sticking a stick on crystalline silicon, the stick sticking process time of 2 to 3h can be saved, and the overall efficiency of silicon wafer cutting is greatly improved.
The invention firstly provides a glue stick integrated with a rubber plate, wherein the glue stick comprises a component A and a component B;
the component A comprises epoxy resin, an epoxy diluent, a filler and a defoaming agent;
the component B comprises a curing agent.
Further, the mass ratio of the component A to the component B in the stick glue is 1-5.
Further, the component A comprises 100-200 parts by weight of epoxy resin, 20-50 parts by weight of epoxy diluent, 150-250 parts by weight of filler and 0.5-1 part by weight of defoaming agent;
the component B contains 100 to 300 parts of curing agent.
Further, in the component A, the epoxy resin comprises one or more of E51 epoxy resin, E44 epoxy resin and E54 epoxy resin;
the epoxy diluent comprises one or more of 1,4 butanediol diglycidyl ether, alkyl glycidyl ether, benzyl glycidyl ether and ethylene glycol diglycidyl ether;
the filler comprises one or more of calcium carbonate, aluminum oxide, aluminum hydroxide and silicon micropowder;
the defoaming agent comprises one or more of organic silicon defoaming agent, polyether modified silicon defoaming agent and polyether defoaming agent.
Further, in the component B, the curing agent comprises one or more of polythiol, polyamide, aliphatic amine and alicyclic amine.
The invention also provides a stick sticking process adopting the stick sticking glue, which comprises the following steps:
(1) Uniformly stirring the sticky bar glue integrated with the rubber plate, guiding the sticky bar glue into a silica gel mold to manufacture a mold, and fixing the manufactured mold on a crystal support by using double faced adhesive tape;
(2) Uniformly stirring the glue stick and the glue water integrated with the glue plate, pouring the mixture into a mold fixed on a crystal support, and then placing the crystalline silicon on the mold;
(3) And then heating the die with the crystal silicon at high temperature to obtain the processed crystal bar.
Further, in the step (1), the periphery of the mold is in a step shape, and a plurality of uneven supporting strips are arranged in the center of the mold.
Further, the height of the die is 8-10mm, and the step height around the die is 4mm; the width of the supporting strip is 5-10mm, the height of a concave interface in the supporting strip is 4mm, the height of a convex interface in the supporting strip is 8mm, and the spacing length of the concave-convex interface is 8-10mm.
Further, in the step (2), after the crystalline silicon is placed on the die, the woodworking clamp is locked, and the weight is pressed to ensure that the crystalline silicon cannot move.
Further, in the step (3), the high-temperature heating is carried out at 100 to 150 ℃ for 30 to 60min.
Compared with the prior art, the invention has the beneficial effects that:
according to the invention, the glue stick and glue water integrated with the glue board are used for manufacturing the mould, so that the processes of sticking, cutting and degumming can be completed only by using the glue stick and glue water integrated with the glue board without using a plastic board, and the glue board integration is realized on the basis of saving the cost. The viscose glue can be cured at room temperature or by heating, and the curing time can be adapted to the time required by production by changing the formula.
In addition, the rod sticking process adopting the rod sticking glue can solve the problems of multiple crystal silicon rod sticking procedures, long waiting time and low overall efficiency, can save the rod sticking procedure time of 2 to 3 hours, is not easy to block wires and drop pieces after crystal silicon is cut, and has good application value.
Drawings
FIG. 1 is a schematic view of a mold mounted on a susceptor.
Fig. 2 is a schematic drawing of the pouring of the viscose into the mould.
Fig. 3 is a schematic view of crystalline silicon placed on a mold.
Reference numerals:
1-crystal support; 2-a mould; 3-supporting the bars; 4-crystalline silicon.
Detailed Description
The invention will be further described with reference to the following figures and specific examples, but the scope of the invention is not limited thereto.
Example 1:
1. the formula of the adhesive stick glue for integrating the rubber plates comprises the following components:
and (2) component A:
e51 epoxy 150kg;
30kg of 1.4-butanediol diglycidyl ether;
180kg of calcium carbonate;
0.45kg of silicone defoaming agent.
And (B) component:
100kg of alicyclic amine;
120kg of fatty amine.
2. Preparing glue for the glue stick integrated with the rubber plate:
preparing a component A:
e51 epoxy resin and 1, 4-butanediol diglycidyl ether are put into a double-planet stirring kettle and stirred for 15min, calcium carbonate is put into the double-planet stirring kettle and stirred for 60min, the organosilicon defoamer is put into the double-planet stirring kettle and continuously stirred for 30min, and then the mixture is vacuumized for 40min to discharge and fill, so that the component A is obtained.
B, preparation of a component:
and (3) putting the alicyclic amine and the aliphatic amine into a double-planet stirring kettle, stirring for 30min, vacuumizing for 40min, and discharging and filling to obtain the component B.
And then compounding the component A and the component B according to the mass ratio of 2:1, and uniformly stirring to obtain the adhesive stick glue integrating the rubber plates.
Example 2:
1. the formula of the glue for the glue stick integrated with the rubber plate comprises the following components:
component A:
100kg of E44 epoxy resin;
30kg of alkyl glycidyl ether;
20kg of benzyl glycidyl ether;
180kg of alumina;
70kg of aluminum hydroxide;
1kg of polyether modified silicon defoamer.
And (B) component:
50kg of polyamide;
50kg of polythiol.
2. Preparing glue for the glue stick integrated with the rubber plate:
preparation of a component A:
e44 epoxy resin, alkyl glycidyl ether and benzyl glycidyl ether are put into a double-planet stirring kettle to be stirred for 15min, then aluminum oxide and aluminum hydroxide are put into the double-planet stirring kettle to be stirred for 60min, the polyether modified silicon defoamer is put into the double-planet stirring kettle to be continuously stirred for 30min, and then the mixture is vacuumized for 40min to be discharged and filled to obtain the component A.
B, preparation of a component:
and putting polyamide and polythiol into a double-planet stirring kettle, stirring for 30min, vacuumizing for 40min, and discharging and filling to obtain the component B.
And then compounding the component A and the component B according to the mass ratio of 1:1, and uniformly stirring to obtain the adhesive stick glue with integrated rubber plates.
Example 3:
1. the formula of the glue for the glue stick integrated with the rubber plate comprises the following components:
and (2) component A:
50kg of E44 epoxy resin;
e54 epoxy resin 100kg
Ethylene glycol diglycidyl ether 50kg;
150kg of silicon micropowder;
0.5kg of polyether defoamer.
And (B) component:
100kg of polyamide;
polythiol 150kg.
2. Preparing glue for the glue stick integrated with the rubber plate:
preparation of a component A:
e44 epoxy resin, E54 epoxy resin and ethylene glycol diglycidyl ether are put into a double-planetary stirring kettle to be stirred for 15min, then silicon micropowder is put into the double-planetary stirring kettle to be stirred for 60min, polyether defoamer is put into the double-planetary stirring kettle to be continuously stirred for 30min, and then the mixture is vacuumized for 40min to be discharged and filled to obtain the component A.
B, preparation of a component:
and putting polyamide and polythiol into a double-planet stirring kettle, stirring for 30min, vacuumizing for 40min, and discharging and filling to obtain the component B.
And then compounding the component A and the component B according to the mass ratio of 3:1, and uniformly stirring to obtain the adhesive stick glue integrating the rubber plates.
Example 4:
the viscose glue prepared in any one of embodiments 1~3 is poured into a silica gel mold to make a mold after being uniformly stirred, and then the made mold is fixed on a crystal support by a double-sided adhesive, and the effect after fixing is as shown in fig. 1. And then uniformly stirring the rod sticking glue, pouring the mixture into the mold (shown in figure 2), smoothly placing the crystalline silicon after the mixture is leveled, locking a carpenter clamp, and then pressing a 10kg weight to ensure that the crystalline silicon cannot be displaced, thereby obtaining the mold with the crystalline silicon placed as shown in figure 3.
And (3) putting the die with the crystalline silicon in the tunnel, and heating at 100 ℃ for 60min to obtain the crystal bar subjected to bonding processing.
Example 5:
the viscose glue prepared in any one of embodiments 1~3 is poured into a silica gel mold to make a mold after being uniformly stirred, and then the made mold is fixed on a crystal support by a double-sided adhesive, and the effect after fixing is as shown in fig. 1. And then uniformly stirring the sticky bar glue, pouring the sticky bar glue into the mold (as shown in figure 2), leveling the sticky bar glue, stably placing the crystalline silicon, locking a carpenter clamp, and then adding a weight of 20kg to ensure that the crystalline silicon cannot be displaced, thereby obtaining the mold for placing the crystalline silicon, which is shown in figure 3.
And (3) putting the mould with the crystal silicon in place into a tunnel, and heating for 30min at 150 ℃ to obtain the crystal bar which is subjected to bonding processing.
The present invention is not limited to the above-described embodiments, and any obvious improvements, substitutions or modifications can be made by those skilled in the art without departing from the spirit of the present invention.
Claims (10)
1. The glue stick glue integrated with the glue board is characterized by comprising a component A and a component B;
the component A comprises epoxy resin, an epoxy diluent, a filler and a defoaming agent;
the component B comprises a curing agent.
2. The glue stick of claim 1, wherein the mass ratio of the component A to the component B in the glue stick is 1-5.
3. The glue plate integrated stick glue of claim 1, wherein the component a comprises, by weight, 100-200 parts of epoxy resin, 20-50 parts of epoxy diluent, 150-250 parts of filler, and 0.5-1 part of defoamer;
the component B comprises 100 to 300 parts of curing agent.
4. The glue plate integrated stick glue of claim 1, wherein in the component A, the epoxy resin comprises one or more of E51 epoxy resin, E44 epoxy resin and E54 epoxy resin;
the epoxy diluent comprises one or more of 1,4 butanediol diglycidyl ether, alkyl glycidyl ether, benzyl glycidyl ether and ethylene glycol diglycidyl ether;
the filler comprises one or more of calcium carbonate, aluminum oxide, aluminum hydroxide and silicon micropowder;
the defoaming agent comprises one or more of an organic silicon defoaming agent, a polyether modified silicon defoaming agent and a polyether defoaming agent.
5. The glue of claim 1, wherein the curing agent in component B comprises one or more of a polythiol, a polyamide, an aliphatic amine, and an alicyclic amine.
6. A rod bonding process using the integrated rod bonding glue of any of claims 1~5, wherein said rod bonding process comprises:
(1) Uniformly stirring the sticky bar glue integrated with the glue plate, guiding the sticky bar glue into a silica gel mold to manufacture a mold (2), and fixing the manufactured mold (2) on a crystal support (1) by using a double-sided adhesive tape;
(2) Uniformly stirring the glue stick and the glue water integrated with the glue board, pouring the glue stick and the glue water into a mould (2) fixed on a crystal support (1), and then placing crystalline silicon (4) on the mould (2);
(3) And then heating the die (2) with the crystalline silicon (4) at a high temperature to obtain the processed crystal bar.
7. The rod sticking process according to claim 6, wherein in the step (1), the periphery of the mold (2) is stepped, and the center of the mold (2) is provided with a plurality of uneven support strips (3).
8. The rod sticking process according to claim 7, wherein the height of the mold (2) is 8-10mm, and the step height of the periphery is 4mm; the width of the supporting strip (3) is 5-10mm, the height of a concave interface in the supporting strip (3) is 4mm, the height of a convex interface is 8mm, and the interval length of the concave-convex interface is 8-10mm.
9. The rod bonding process according to claim 6, wherein in the step (2), after the rod bonding glue integrated with the rubber plate is leveled, the crystalline silicon (4) is stably placed on the mold, the carpenter clamp is locked, and the weight is pressed to ensure that the crystalline silicon (4) cannot be displaced.
10. The rod sticking process according to claim 6, wherein in the step (3), the high-temperature heating is carried out at 100 to 150 ℃ for 30 to 60min.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211472221.XA CN115746765A (en) | 2022-11-23 | 2022-11-23 | Glue for integrally sticking stick on rubber plate and process |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211472221.XA CN115746765A (en) | 2022-11-23 | 2022-11-23 | Glue for integrally sticking stick on rubber plate and process |
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| Publication Number | Publication Date |
|---|---|
| CN115746765A true CN115746765A (en) | 2023-03-07 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202211472221.XA Pending CN115746765A (en) | 2022-11-23 | 2022-11-23 | Glue for integrally sticking stick on rubber plate and process |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN115746765A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116987476A (en) * | 2023-08-09 | 2023-11-03 | 惠州市帕克威乐新材料有限公司 | Cold-pressed fast-curing adhesive film and preparation method thereof |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102876274A (en) * | 2012-10-22 | 2013-01-16 | 南京艾布纳密封技术有限公司 | Glue for cutting process of solar cell silicon wafers |
| CN107030907A (en) * | 2017-03-17 | 2017-08-11 | 浙江好亚能源股份有限公司 | The processing method of polysilicon chip |
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2022
- 2022-11-23 CN CN202211472221.XA patent/CN115746765A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102876274A (en) * | 2012-10-22 | 2013-01-16 | 南京艾布纳密封技术有限公司 | Glue for cutting process of solar cell silicon wafers |
| CN107030907A (en) * | 2017-03-17 | 2017-08-11 | 浙江好亚能源股份有限公司 | The processing method of polysilicon chip |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116987476A (en) * | 2023-08-09 | 2023-11-03 | 惠州市帕克威乐新材料有限公司 | Cold-pressed fast-curing adhesive film and preparation method thereof |
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