CN115739563B - jCR curing box for semiconductor chip - Google Patents
jCR curing box for semiconductor chip Download PDFInfo
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- CN115739563B CN115739563B CN202211557109.6A CN202211557109A CN115739563B CN 115739563 B CN115739563 B CN 115739563B CN 202211557109 A CN202211557109 A CN 202211557109A CN 115739563 B CN115739563 B CN 115739563B
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Abstract
The invention relates to a semiconductor chip JCR curing box which comprises an outer box, an inner box, a fan and a heating part, wherein the inner box is arranged in the outer box, a gap is reserved between the upper, lower, left and right sides of the inner box and the inner wall of the outer box to form an annular interlayer, the fan is arranged outside one side of the inner box, the heating part is arranged outside the fan in a surrounding mode, the inner box comprises an upper plate, a lower plate, a plurality of chip fixing frames and two side plates, a plurality of ventilation holes are uniformly formed in the side plates and the chip fixing frames, a plurality of wind shields are further designed in the outer sides of the side plates, and a plurality of ventilation holes are also designed in the upper sides of the wind shields. The air conditioner has the advantages that the air conditioner is ingenious in design, reasonable and compact in structure, a plurality of air ventilation holes are formed in the side plates on the two sides of the inner box, and the wind shield is arranged on the outer side of each air ventilation hole and used for adjusting the opening and closing degree of the air ventilation holes, so that the air quantity of an inlet and an outlet is adjusted; ensures different space positions inside the curing box, has good consistency of the received temperature and heat radiation, and meets the curing requirement of chips.
Description
Technical Field
The invention relates to the field of semiconductor production, in particular to a JCR curing box for a semiconductor chip.
Background
In the high-voltage silicon stack production process, a layer of JCR curing film is coated on the surface of a chip to improve the pressure resistance, and the curing box is used for baking and curing the JCR film.
A plurality of layers of chip fixing frames can be placed in the curing box, and chips are placed in the chip fixing frames.
Because the space positions of the chip fixing frame placed in the curing box are different, the received temperature and the received heat radiation are different, and therefore, the defect of inconsistent chip quality can be generated.
Disclosure of Invention
In order to solve the technical problems, the invention provides the JCR curing box for the semiconductor chip, which is ingenious in design, reasonable and compact in structure, ensures different space positions in the curing box, has good consistency of the received temperature and heat radiation, and meets the chip curing requirement.
The technical scheme of the invention is as follows:
the utility model provides a semiconductor chip JCR solidification case, it includes outer case, inner box, fan, heating portion, the inner box is installed in the outer incasement portion, and the clearance forms cyclic annular intermediate layer around leaving between the inner wall of outer case about the upper and lower of inner box and the outer wall of outer case, the fan is installed to inner box one side outside, heating portion encircles and installs in the fan outside, the inner box includes upper plate, hypoplastron, a plurality of chip mount and two curb plates, installs respectively in the inside front and back both sides case wall of outer case in two curb plates front and back both sides, seals the connection through the upper plate above two curb plates, seals the connection through the hypoplastron in two curb plates lower extreme, installs a plurality of chip mount between two curb plates, evenly open a plurality of ventilation holes above curb plate and the chip mount, a plurality of ventilation holes have also been designed on the curb plate, and a plurality of waist-shaped holes have been designed to correspond every deep bead design on the curb plate, and two horizontal waist-shaped holes have in the correspondence in the middle of the curb plate, and two silk-screwed into through two screw in respectively two corresponding two after-in horizontal silk-shaped bolt screw-in holes.
The air permeability holes designed on each wind shield are respectively identical to the air permeability holes in the corresponding area on the side plate.
The fan is characterized in that a fan housing is arranged between the fan and the adjacent side plates, the fan housing is designed into a rectangular fan housing, a fan port is formed in the middle of the fan housing, the fan housing is arranged outside the side plates adjacent to the fan, the fan is rotatably arranged on the side wall of the outer box, the air suction port of the fan is located outside the fan port of the fan housing, a driving motor is arranged on the outer side of the side wall of the outer box, and the driving motor is connected with the fan in a driving mode.
The heating part is designed as an electric heating pipe, the electric heating pipe surrounds the air outlet position of the fan, and two end heads of the electric heating pipe are arranged on the inner side of the wall of the outer box through supporting plates.
And an air ventilation hole is formed in the support plate.
The outer box is designed into a rectangular box body, a box door is arranged on the front side of the box body, and heat preservation interlayers are arranged on the upper part, the lower part, the left part, the right part and the rear part of the box body and in the box door.
One side of the outer box is provided with a control cabinet, the front surface of the control cabinet is provided with a control panel, and a driving motor of the fan is arranged in the control cabinet.
And a smoke exhaust pipe is further designed on the semiconductor chip JCR curing box, the mouth part of the smoke exhaust pipe, which is arranged at the lower end of the smoke exhaust pipe, faces upwards, penetrates through the outer box and is positioned at the upper end inside the outer box.
The invention has the advantages of ingenious design, reasonable and compact structure, and circulating air channels are distributed in the interlayers around the inner box and the outer box; the right outer side of the inner box is provided with a heating part and a fan, and the fan circulates hot air into the inner box to heat the chip; a plurality of ventilation holes are formed in the side plates on two sides of the inner box, and a wind shield is arranged on the outer side of each ventilation hole and used for adjusting the opening and closing degree of the ventilation holes so as to adjust the inlet and outlet air quantity; ensures different space positions inside the curing box, has good consistency of the received temperature and heat radiation, and meets the curing requirement of chips.
Drawings
Fig. 1 is a schematic diagram of the present invention.
Fig. 2 is a schematic cross-sectional view of the present invention.
Fig. 3 is a schematic view of the chip holder of the present invention.
Fig. 4 is a schematic illustration of a side panel and a wind deflector of the present invention.
Fig. 5 is an enlarged partial schematic view of fig. 4.
Fig. 6 is a schematic view of a side panel and a wind deflector of the present invention.
Fig. 7 is a schematic perspective view in section of the present invention.
Detailed Description
Referring to fig. 1-7, a semiconductor chip JCR curing box comprises an outer box 1, an inner box 2, a fan 3 and a heating part 4, wherein the inner box 2 is arranged inside the outer box 1, a gap is reserved between the upper, lower, left and right sides of the inner box 2 and the inner wall of the outer box 1 to form an annular interlayer, the fan 3 is arranged outside one side of the inner box 2, the heating part 4 is arranged outside the fan 3 in a surrounding manner, the inner box 2 comprises an upper plate, a lower plate, a plurality of chip fixing frames 21 and two side plates 22, the front side and the rear side of the two side plates 22 are respectively arranged on the front side and the rear side of the inner box 1, the upper sides of the two side plates 22 are respectively connected in a closed manner through the upper plate, the lower ends of the two side plates 22 are respectively connected in a closed manner through the lower plate, a plurality of chip fixing frames 21 are arranged between the two side plates 22, a plurality of wind through holes 23 are uniformly formed on the upper sides of the side plates 22 and the chip fixing frames 21, a plurality of wind shields 24 are also designed outside the side plates 22, a plurality of wind through holes 23 are also designed on the wind through the wind shields 24, a plurality of the whole side plates 24 are distributed on the side plates 24, the whole wind shields 24 are distributed on the side, the side plates 24 are respectively and are in a plurality of horizontal bolt holes are designed to be in a shape corresponding to the two middle plates 25, and the two horizontal bolts are screwed into two holes through two corresponding to the two horizontal bolt holes 25.
The air holes 23 on each wind shield 24 are respectively distributed in the same way as the air holes 23 on the corresponding area of the side plate 22. The design ensures that ventilation holes of the side plates can be maximized, the wind shields can move back and forth to shield the ventilation holes on the side plates through solid areas, so that air flow size control is achieved, the wind shields in different areas can be adjusted according to actual temperature, temperature differences of different spaces inside the inner box are small, 9-point positions of the inner space are measured, and the temperature differences are smaller than 0.5 degree.
A fan housing 31 is designed between the fan 3 and the adjacent side plate 22, the fan housing 31 is designed into a rectangular fan housing 31, an air duct opening 32 is formed in the middle of the fan housing 31, the fan housing 31 is covered outside the side plate 22 adjacent to the fan 3, the fan 3 is rotatably arranged on the side wall of the outer box 1, an air suction opening of the fan 3 is positioned outside the air duct opening 32 of the fan housing 31, a driving motor 33 is arranged on the outer side of the side wall of the outer box 1, and the driving motor 33 is in driving connection with the fan 3. The fan adopts a centrifugal fan, and the middle side sucks air and blows out the air in a circle. The heating part 4 is designed as an electric heating pipe, the electric heating pipe surrounds the air outlet position of the fan 3 in a circle, and two end heads of the electric heating pipe are arranged on the inner side of the wall of the outer box 1 through the supporting plate 41. The support plate 41 is provided with ventilation holes 42. The centrifugal fan is of the existing design, the center sucks air, the periphery exhausts air, the electric heating pipe surrounds the fan for a circle, and heat is directly taken away; the ventilation holes 42 of the support plate 41 are designed to ensure smooth air flow.
The outer box 1 is designed into a rectangular box body, the front side of the box body is provided with a box door 11, and heat preservation interlayers are arranged on the upper part, the lower part, the left part, the right part and the rear part of the box body and in the box door 11. The heat preservation interlayer ensures that heat cannot be scattered, and is safe and reliable.
One side of the outer box 1 is provided with a control cabinet 6, the front surface of the control cabinet 6 is provided with a control panel 5, and a driving motor 33 of the fan 3 is arranged in the control cabinet 6. The PLC controller and various control switches can be arranged on the control panel, and the control panel can be realized. Multi-stage temperature, multi-stage time control, temperature recording, overtemperature alarm, broken wire alarm and other conventional operations.
The semiconductor chip JCR solidification box is further provided with a smoke discharging pipe 7, the outlet opening of the smoke discharging pipe 7 faces upwards, and the inlet opening of the lower end of the smoke discharging pipe 7 penetrates through the outer box 1 and then is located at the upper end inside the outer box 1. The design of the smoke exhaust pipe is that the JCR film of the chip can generate steam and smoke in the curing process at 240 ℃ and the steam and the smoke are exhausted through the flue of the smoke exhaust pipe. The smoke exhaust pipes of the invention are uniformly conveyed into an exhaust gas treatment device for subsequent exhaust gas treatment.
When the invention is used, as shown in the figure, the box door is opened, the chip 8 is arranged on the chip fixing frame of the inner box, the box door is closed, the heating is started, the driving motor is started to drive the fan to rotate, the fan sucks air from the inner box and blows the air from one circle, as the electric heating pipe surrounds the air outlet part of the fan, the air blows the air upwards and downwards to take away heat generated by the electric heating pipe, the air flows enter the outer side of the left side plate from the upper and lower positions of the annular interlayer, a plurality of air holes are designed on the side plate, the air flows are distributed through the plurality of air holes and enter the inner box, the chip 8 on the chip fixing frame is heated, the air flows from the left side to the right side, enters the fan housing through the air holes of the right side plate, and the fan housing is converged to enter the air inlet of the right side fan from the middle air channel opening again, and a heating cycle is completed; in order to ensure that the upper temperature, the middle temperature and the lower temperature inside the inner box are consistent with the heat radiation performance, the positions of the wind shields on the outer sides of the side plates on two sides can be adjusted, and when the wind shields are to be adjusted, two claw bolts of the wind shields are loosened, so that the wind shields can move forwards and backwards relative to the side plates under the guidance of two kidney-shaped holes, the ventilation holes of the wind shields are completely communicated with the corresponding ventilation holes on the side plates at the beginning, the ventilation holes on the side plates are blocked by the wind shields, the air flow size through the ventilation holes is adjusted by the size of the ventilation holes of the side plates, the temperature difference at different positions of the inner box is controlled to be not more than 0.5 ℃, the heat radiation consistency is ensured, and the chip quality is ensured. In order to ensure high valve size adjustment precision of the ventilation holes of the side plates, the invention divides the upper, middle and lower three areas by the plurality of wind shields arranged on the outer side of each side plate, the wind shields are designed into the large wind shields 241 and the small wind shields 242, the upper and lower two areas are respectively provided with the large wind shields 241 and the plurality of large wind shields 241 are respectively provided with two rows and four rows, the middle area is provided with the small wind shields 242 and the plurality of small wind shields 242, three rows and three rows are respectively provided, the middle area is provided with three rows and three columns, the position is close to the air inlet position of the fan, the flow velocity of wind is prevented from being too fast, and the three rows and three rows of distribution can more effectively control the wind velocity.
Claims (4)
1. The semiconductor chip JCR curing box is characterized by comprising an outer box, an inner box, a fan and a heating part, wherein the inner box is arranged in the outer box, a gap is reserved between the upper, lower, left and right sides of the inner box and the inner wall of the outer box to form an annular interlayer, the fan is arranged outside one side of the inner box, the heating part is arranged outside the fan in a surrounding mode, the inner box comprises an upper plate, a lower plate, a plurality of chip fixing frames and two side plates, the front side and the rear side of the two side plates are respectively arranged on the inner front side and the rear side of the outer box, the upper sides of the two side plates are in closed connection through the upper plate, the lower ends of the two side plates are in closed connection through the lower plate, a plurality of chip fixing frames are arranged between the two side plates, a plurality of ventilation holes are uniformly formed in the upper sides of the side plates and the chip fixing frames, a plurality of ventilation holes are also formed in the upper sides of the side plates, the whole side plates are distributed on the side plates, two horizontal kidney-shaped holes are correspondingly designed on the side plates, two kidney-shaped holes are correspondingly designed on the side plates, and two kidney-shaped bolt screws are correspondingly screwed into the two kidney-shaped inner holes respectively; the air permeability holes designed on each wind shield are respectively identical to the air permeability holes in the corresponding area on the side plate; a fan cover is designed between the fan and the adjacent side plates, the fan cover is designed into a rectangular fan cover, a fan port is formed in the middle of the fan cover, the fan cover is arranged outside the side plate adjacent to the fan, the fan is rotatably arranged on the side wall of the outer box, the air suction port of the fan is positioned at the outer side of the fan port, a driving motor is designed and arranged at the outer side of the side wall of the outer box, and the driving motor is in driving connection with the fan; the heating part is designed as an electric heating pipe, the electric heating pipe surrounds the air outlet position of the periphery of the fan, and two end heads of the electric heating pipe are arranged on the inner side of the wall of the outer box through supporting plates; and an air ventilation hole is formed in the support plate.
2. The JCR curing box for semiconductor chips as defined in claim 1, wherein the outer box is a rectangular box body, a box door is provided at a front side of the box body, and thermal insulation interlayers are provided in upper, lower, left, right and rear box plates and the box door.
3. The semiconductor chip JCR curing box as recited in claim 1, wherein a control cabinet is designed on one side of the outer box, a front surface of the control cabinet is designed as a control panel, and a driving motor of a fan is installed in the control cabinet.
4. The JCR curing box for semiconductor chips as defined in claim 1, wherein a smoke exhaust pipe is further provided on the JCR curing box for semiconductor chips, an outlet opening of the smoke exhaust pipe is directed upward, and an inlet opening of a lower end of the smoke exhaust pipe penetrates through the outer box and is located at an upper end inside the outer box.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211557109.6A CN115739563B (en) | 2022-12-06 | 2022-12-06 | jCR curing box for semiconductor chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211557109.6A CN115739563B (en) | 2022-12-06 | 2022-12-06 | jCR curing box for semiconductor chip |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN115739563A CN115739563A (en) | 2023-03-07 |
| CN115739563B true CN115739563B (en) | 2023-08-11 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202211557109.6A Active CN115739563B (en) | 2022-12-06 | 2022-12-06 | jCR curing box for semiconductor chip |
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Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN117259156A (en) * | 2023-09-09 | 2023-12-22 | 江苏皋鑫电子有限公司 | Method for preventing temperature of oven from being out of control |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN207753100U (en) * | 2017-11-24 | 2018-08-21 | 天能电池集团有限公司 | A kind of curing chamber of accumulator plate |
| CN208504896U (en) * | 2018-06-28 | 2019-02-15 | 四川省华检食品检测有限公司 | A kind of electric heating constant-temperature blowing drying box |
| CN210399751U (en) * | 2019-06-27 | 2020-04-24 | 云南泊尔恒国际生物制药有限公司 | Rotary air inlet type hot air circulating oven |
| CN216924943U (en) * | 2022-02-10 | 2022-07-08 | 浙江华宇药业股份有限公司 | Hot-blast guiding device of chinese-medicinal material drying device |
| CN216953777U (en) * | 2022-03-07 | 2022-07-12 | 烟台恒正检测咨询服务有限公司 | Portable vacuum drying oven for detection |
-
2022
- 2022-12-06 CN CN202211557109.6A patent/CN115739563B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN207753100U (en) * | 2017-11-24 | 2018-08-21 | 天能电池集团有限公司 | A kind of curing chamber of accumulator plate |
| CN208504896U (en) * | 2018-06-28 | 2019-02-15 | 四川省华检食品检测有限公司 | A kind of electric heating constant-temperature blowing drying box |
| CN210399751U (en) * | 2019-06-27 | 2020-04-24 | 云南泊尔恒国际生物制药有限公司 | Rotary air inlet type hot air circulating oven |
| CN216924943U (en) * | 2022-02-10 | 2022-07-08 | 浙江华宇药业股份有限公司 | Hot-blast guiding device of chinese-medicinal material drying device |
| CN216953777U (en) * | 2022-03-07 | 2022-07-12 | 烟台恒正检测咨询服务有限公司 | Portable vacuum drying oven for detection |
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| CN115739563A (en) | 2023-03-07 |
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