CN115739563A - Semiconductor chip JCR curing box - Google Patents
Semiconductor chip JCR curing box Download PDFInfo
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- CN115739563A CN115739563A CN202211557109.6A CN202211557109A CN115739563A CN 115739563 A CN115739563 A CN 115739563A CN 202211557109 A CN202211557109 A CN 202211557109A CN 115739563 A CN115739563 A CN 115739563A
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Abstract
The invention relates to a JCR (JCR) curing box for a semiconductor chip, which comprises an outer box, an inner box, a fan and a heating part, wherein the inner box is arranged in the outer box, gaps are reserved between the upper, lower, left and right peripheries of the inner box and the inner wall of the outer box to form an annular interlayer, the fan is arranged outside one side of the inner box, the heating part is arranged outside the fan in a surrounding manner, the inner box comprises an upper plate, a lower plate, a plurality of chip fixing frames and two side plates, a plurality of ventilation holes are uniformly formed in the side plates and the chip fixing frames, a plurality of wind shields are also designed outside the side plates, and a plurality of ventilation holes are also designed on the wind shields. The air-permeable box has the advantages that the design is ingenious, the structure is reasonable and compact, the side plates on the two sides of the inner box are provided with a plurality of air-permeable holes, and the outer sides of the air-permeable holes are provided with air baffles for adjusting the opening degree of the air-permeable holes so as to adjust the air quantity of the inlet and the outlet; different space positions in the curing box are ensured, the uniformity of the received temperature and the heat radiation is good, and the curing requirement of the chip is met.
Description
Technical Field
The invention relates to the field of semiconductor production, in particular to a JCR (JCR) curing box for a semiconductor chip.
Background
In the high-voltage silicon stack production process, a layer of JCR curing film is coated on the surface of a chip to improve the pressure resistance, and the JCR film is baked and cured by a curing box.
A plurality of layers of chip fixing frames can be placed in the curing box, and the chips are placed in the chip fixing frames.
Because the chip fixing frame is placed in different space positions in the curing box, the temperature and the heat radiation received are different, and the defect of inconsistent chip quality can be generated.
Disclosure of Invention
In order to solve the technical problem, the invention provides the JCR curing box for the semiconductor chip, which is ingenious in design, reasonable and compact in structure, good in consistency of the received temperature and the heat radiation and capable of ensuring different space positions in the curing box and meeting the curing requirement of the chip.
The technical scheme of the invention is as follows:
semiconductor chip JCR curing box, it includes outer container, inner box, fan, heating portion, the inner box is installed inside the outer container, leaves the clearance around the upper and lower left and right sides of inner box and between the inner wall of outer container and form cyclic sandwich, and the fan is installed to inner box one side outside, the heating portion encircles and installs in the fan outside, the inner box includes upper plate, hypoplastron, a plurality of chip mount and two curb plates, and before two curb plates were installed respectively in the inside of outer container, on the tank wall of back both sides, through upper plate sealing connection above two curb plates, two curb plate lower extremes pass through hypoplastron sealing connection, install a plurality of chip mount between two curb plates, all evenly open above curb plate and the chip mount has a plurality of ventilative holes, the curb plate outside has still designed a plurality of deep beads, has also designed a plurality of ventilative holes above a plurality of deep beads, and a plurality of deep beads are covered with whole curb plate, correspond every design above the curb plate and have two horizontal waist holes of deep bead hole of design, correspond two silk holes of screw in the middle design of deep bead back screw in two horizontal waist holes that pass through two goat's angle bolts respectively.
The plurality of ventilation holes designed on each wind shield are respectively distributed the same as the plurality of ventilation holes in the corresponding area on the side plate.
The fan is characterized in that a fan cover is designed between the fan and the adjacent side plates, an air duct opening is formed in the middle of the fan cover which is rectangular, the fan cover is arranged outside the side plates adjacent to the fan, the fan is rotatably arranged on the side wall of the outer box, the air suction opening of the fan is located on the outer side of the air duct opening of the fan cover, and a driving motor is arranged on the outer side of the side wall of the outer box and drives the fan to be connected.
The heating part is designed to be an electric heating pipe, the electric heating pipe surrounds the air outlet position around the fan, and the head parts of the two ends of the electric heating pipe are arranged on the inner side of the box wall of the outer box through support plates.
The supporting plate is provided with ventilation holes.
The outer box is designed into a rectangular box body, a box door is designed on the front side of the box body, and heat-insulating interlayers are designed in the box plates on the upper portion, the lower portion, the left portion, the right portion and the rear portion of the box body and the box door.
A control cabinet is designed on one side of the outer box, a control panel is designed in the front of the control cabinet, and a driving motor of a fan is installed in the control cabinet.
A smoke exhaust pipe is further designed on the semiconductor chip JCR curing box, the outlet of the smoke exhaust pipe faces upwards, and the inlet at the lower end of the smoke exhaust pipe penetrates through the outer box and then is located at the upper end inside the outer box.
The invention has the advantages of ingenious design, reasonable and compact structure, and circulating air ducts are distributed in the interlayer around the inner box and the outer box; a heating part and a fan are arranged on the right outer side of the inner box, and the fan circulates hot air into the inner box to heat the chip; a plurality of ventilation holes are formed in the side plates on the two sides of the inner box, and wind shields are mounted on the outer sides of the ventilation holes and used for adjusting the opening degree of the ventilation holes so as to adjust the air quantity of the inlet and the outlet; different space positions in the curing box are ensured, the uniformity of the received temperature and the heat radiation is good, and the curing requirement of the chip is met.
Drawings
FIG. 1 is a schematic of the present invention.
Fig. 2 is a schematic cross-sectional view of the present invention.
Fig. 3 is a schematic view of the chip holder of the present invention.
FIG. 4 is a first schematic view of a side panel and windshield of the present invention.
Fig. 5 is a partially enlarged view of fig. 4.
Fig. 6 is a second schematic view of a side panel and a wind deflector of the present invention.
Fig. 7 is a schematic cross-sectional perspective view of the present invention.
Detailed Description
Referring to the attached drawings 1-7, a semiconductor chip JCR curing box comprises an outer box 1, an inner box 2, a fan 3 and a heating portion 4, wherein the inner box 2 is installed inside the outer box 1, a gap is left between the upper, lower, left, right, periphery of the inner box 2 and the inner wall of the outer box 1 to form an annular interlayer, the fan 3 is installed outside one side of the inner box 2, the heating portion 4 is installed outside the fan 3 in a surrounding mode, the inner box 2 comprises an upper plate, a lower plate, a plurality of chip fixing frames 21 and two side plates 22, the front side and the rear side of each side plate 22 are installed on the front side and the rear side of the inner box 1 respectively, the upper plate is connected in a sealing mode on the two side plates 22, the lower ends of the two side plates 22 are connected in a sealing mode through the lower plate, the chip fixing frames 21 are installed between the two side plates 22, the side plates 22 and the chip fixing frames 21 are evenly provided with a plurality of ventilation holes 23, the outer side plates 22 are also provided with a plurality of wind shields 24, a plurality of wind shields 24 are designed on the outer sides of the plurality of the wind shields 24, a plurality of wind shields 24 are also designed with a plurality of ventilation holes 23, a plurality of ventilation holes 24, a plurality of horizontal wind shields 24 are designed on the upper side plates 22, and a plurality of horizontal wind shields 24, and a plurality of bolts pass through two horizontal wind screens 25, and pass through two horizontal screw holes 26, and pass through two screw holes of the two horizontal screw holes.
The plurality of ventilation holes 23 designed on each wind shield 24 are respectively distributed the same as the plurality of ventilation holes 23 on the corresponding area on the side plate 22. The ventilative hole of curb plate can the maximize ventilate in this design assurance, and the deep bead back-and-forth movement can shelter from the ventilative hole above the curb plate through solid region to realize the air current size control, the deep bead in different regions can be adjusted according to actual temperature, and it is little to ensure the different space temperature difference in inner box inside, measures inner space 9 dot positions, and the difference in temperature is less than 0.5 degree.
The fan 3 and the adjacent side plate 22 are designed with a fan cover 31, the fan cover 31 is designed to be a rectangular fan cover 31, the middle of the fan cover 31 is provided with an air duct opening 32, the fan cover 31 covers the outer side of the side plate 22 adjacent to the fan 3, the fan 3 is rotatably arranged on the side wall of the outer box 1, the air suction opening of the fan 3 is positioned on the outer side of the air duct opening 32 of the fan cover 31, the outer side of the side wall of the outer box 1 is provided with a driving motor 33, and the driving motor 33 is in driving connection with the fan 3. The fan adopts a centrifugal fan, one side of the middle of the fan sucks air, and the air is blown out in a circle. The heating part 4 is designed to be an electric heating pipe, the electric heating pipe surrounds the air outlet position of the fan 3 for a circle, and the head parts of the two ends of the electric heating pipe are arranged on the inner side of the box wall of the outer box 1 through a support plate 41. The support plate 41 is provided with ventilation holes 42. The centrifugal fan is designed in the prior art, air is sucked in the center and exhausted on the periphery, and the electric heating pipe surrounds the fan for one circle to directly take away heat; the ventilation holes 42 of the support plate 41 are designed to ensure smooth airflow.
The outer box 1 is designed into a rectangular box body, a box door 11 is designed on the front side of the box body, and heat-insulating interlayers are designed in box plates on the upper portion, the lower portion, the left portion, the right portion and the rear portion of the box body and the box door 11. The heat-insulating interlayer ensures that heat cannot be dissipated, and is safe and reliable.
A control cabinet 6 is designed on one side of the outer box 1, a control panel 5 is designed in front of the control cabinet 6, and a driving motor 33 of the fan 3 is installed in the control cabinet 6. The PLC controller and various control switches can be installed on the control panel, and the control can be realized. Multi-stage temperature, multi-stage time control, temperature recording, overtemperature alarm, disconnection alarm and the like.
A smoke exhaust pipe 7 is further designed on the semiconductor chip JCR curing box, the outlet of the smoke exhaust pipe 7 faces upwards, and the inlet at the lower end of the smoke exhaust pipe 7 penetrates through the outer box 1 and then is located at the upper end inside the outer box 1. The smoke exhaust pipe is designed in such a way that the JCR film of the chip can generate steam and smoke in the curing process at 240 ℃, and the steam and the smoke are exhausted through a flue of the smoke exhaust pipe. A plurality of smoke exhaust pipes are uniformly conveyed into a waste gas treatment device for subsequent waste gas treatment.
When the air-cooling fan is used, as shown in the figure, a box door is opened, a chip 8 is placed on a chip fixing frame of an inner box, the box door is closed, heating is started, a driving motor is started to drive a fan to rotate, the fan sucks air from the inside of the inner box and blows out the air from a circle, the electric heating pipe surrounds an air outlet part of the fan around the circle, so that the heat generated by the electric heating pipe is taken away by blowing air, the fan blows air flow upwards and downwards, the air flow enters the outer side of a left side plate from the upper position and the lower position of an annular interlayer, a plurality of air holes are formed in the side plate, the air flow is distributed through the plurality of air holes and enters the inside of the inner box to heat the chip 8 on the chip fixing frame, the air flow flows from the left side to the right side and enters the fan cover through the air holes of the right side plate, and the air cover converges in the air inlet of the fan on the middle to finish a heating cycle; in order to ensure that the incasement portion is gone up well temperature and thermal radiation nature unanimously, can be through the deep bead position in the adjustment both sides curb plate outside, during the deep bead that will adjust, loosen two goat's horn bolts of deep bead, make the deep bead can carry out the back-and-forth movement under two waist shape hole direction for the curb plate, the ventilative hole that corresponds above ventilative hole of deep bead and the curb plate becomes mutual dislocation by communicating with each other completely like this, the deep bead begins to shelter from to ventilative hole above the curb plate, ventilative hole size through sheltering from the curb plate realizes the adjustment through ventilative hole air current size, thereby the difference in temperature of the different positions of control inner box is no longer than 0.5 degrees centigrade, guarantee the thermal radiation uniformity, chip quality obtains guaranteeing. In order to ensure high valve size adjustment precision of air holes of the side plates, a plurality of wind shields designed on the outer side of each side plate are divided into an upper area, a middle area and a lower area, the wind shields are designed into a large wind shield 241 and a small wind shield 242, the upper area and the lower area are both provided with the large wind shield 241, the large wind shields 241 are designed into two rows and four rows, the middle area is provided with the small wind shield 242, the small wind shields 242 are designed into three rows and three columns, the middle area is provided with three rows and three columns, the position is close to the air inlet position of a fan, the flow rate of wind is prevented from being too fast, and the three rows and three columns can more effectively control the wind speed.
Claims (8)
1. Semiconductor chip JCR curing box, its characterized in that, it includes outer container, inner box, fan, heating portion, the inner box is installed inside the outer container, about the upper and lower of inner box leave the clearance around all around and between the inner wall of outer container and form cyclic sandwich layer, the fan is installed to inner box one side outside, the heating portion encircles and installs in the fan outside, the inner box includes upper plate, hypoplastron, a plurality of chip mount and two curb plates, and before two curb plates, the back both sides were installed respectively before the inside of outer container, on the tank wall of back both sides, through upper plate closed connection above two curb plates, two curb plate lower extremes passed through hypoplastron closed connection, install a plurality of chip mounts between two curb plates, all evenly open above curb plate and the chip mount and have a plurality of ventilative holes, the curb plate outside has still designed a plurality of deep beads, has a plurality of ventilative holes above a plurality of deep beads, and a plurality of deep beads are covered with whole curb plates, correspond every deep bead design above the curb plate has two horizontal waists, correspond two silk holes of design in the deep bead of screw in the middle of deep bead, correspond two silk holes of screw in two horizontal waist back screw in that pass respectively through two angle bolts.
2. The JCR curing box for semiconductor chips as defined in claim 1, wherein the plurality of ventilation holes formed in each of the wind shields are distributed in the same manner as the plurality of ventilation holes formed in the corresponding regions of the side plates.
3. The JCR curing box for semiconductor chips as defined in claim 1, wherein a fan housing is provided between the fan and the adjacent side plate, the fan housing is configured as a rectangular fan housing, and an air inlet is provided in the middle of the fan housing, the fan housing covers the side plate adjacent to the fan, the fan is rotatably mounted on the side wall of the outer box, and the air inlet of the fan is located outside the air inlet of the fan housing, and a driving motor is provided outside the side wall of the outer box, and the driving motor is drivingly connected to the fan.
4. The JCR curing box for semiconductor chips as defined in claim 1, wherein the heating part is designed as an electric heating tube, the electric heating tube surrounds the air outlet position around the blower, and the two ends of the electric heating tube are mounted on the inner side of the box wall of the outer box through support plates.
5. The JCR curing box for semiconductor chips as defined in claim 4, wherein the support plate is provided with ventilation holes.
6. The JCR curing box for semiconductor chips as defined in claim 1, wherein the outer box is a rectangular box, the front side of the box is designed with a box door, and the box plates of the upper, lower, left, right and rear parts of the box and the box door are designed with heat-insulating interlayers.
7. The JCR curing box for semiconductor chips as defined in claim 1, wherein a control cabinet is designed on one side of the outer box, the front of the control cabinet is designed as a control panel, and a driving motor of a fan is installed in the control cabinet.
8. The JCR curing box for the semiconductor chips as claimed in claim 1, wherein a smoke exhaust pipe is further designed on the JCR curing box for the semiconductor chips, an outlet of the smoke exhaust pipe faces upwards, and an inlet at the lower end of the smoke exhaust pipe penetrates through the outer box and then is located at the upper end inside the outer box.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211557109.6A CN115739563B (en) | 2022-12-06 | 2022-12-06 | jCR curing box for semiconductor chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211557109.6A CN115739563B (en) | 2022-12-06 | 2022-12-06 | jCR curing box for semiconductor chip |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN115739563A true CN115739563A (en) | 2023-03-07 |
| CN115739563B CN115739563B (en) | 2023-08-11 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202211557109.6A Active CN115739563B (en) | 2022-12-06 | 2022-12-06 | jCR curing box for semiconductor chip |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117259156A (en) * | 2023-09-09 | 2023-12-22 | 江苏皋鑫电子有限公司 | Method for preventing temperature of oven from being out of control |
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| CN207753100U (en) * | 2017-11-24 | 2018-08-21 | 天能电池集团有限公司 | A kind of curing chamber of accumulator plate |
| CN208504896U (en) * | 2018-06-28 | 2019-02-15 | 四川省华检食品检测有限公司 | A kind of electric heating constant-temperature blowing drying box |
| CN210399751U (en) * | 2019-06-27 | 2020-04-24 | 云南泊尔恒国际生物制药有限公司 | Rotary air inlet type hot air circulating oven |
| CN216924943U (en) * | 2022-02-10 | 2022-07-08 | 浙江华宇药业股份有限公司 | Hot-blast guiding device of chinese-medicinal material drying device |
| CN216953777U (en) * | 2022-03-07 | 2022-07-12 | 烟台恒正检测咨询服务有限公司 | Portable vacuum drying oven for detection |
-
2022
- 2022-12-06 CN CN202211557109.6A patent/CN115739563B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN207753100U (en) * | 2017-11-24 | 2018-08-21 | 天能电池集团有限公司 | A kind of curing chamber of accumulator plate |
| CN208504896U (en) * | 2018-06-28 | 2019-02-15 | 四川省华检食品检测有限公司 | A kind of electric heating constant-temperature blowing drying box |
| CN210399751U (en) * | 2019-06-27 | 2020-04-24 | 云南泊尔恒国际生物制药有限公司 | Rotary air inlet type hot air circulating oven |
| CN216924943U (en) * | 2022-02-10 | 2022-07-08 | 浙江华宇药业股份有限公司 | Hot-blast guiding device of chinese-medicinal material drying device |
| CN216953777U (en) * | 2022-03-07 | 2022-07-12 | 烟台恒正检测咨询服务有限公司 | Portable vacuum drying oven for detection |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117259156A (en) * | 2023-09-09 | 2023-12-22 | 江苏皋鑫电子有限公司 | Method for preventing temperature of oven from being out of control |
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| CN115739563B (en) | 2023-08-11 |
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