CN115734571A - Computing device and liquid-cooled cabinet - Google Patents

Abstract

The embodiment of the application provides a computing device and a liquid cooling cabinet, which comprise a case; the inner cavity of the case is provided with a circuit board, a heating device and two liquid cooling branches, the heating device is electrically connected to the circuit board, and the two liquid cooling branches are used for cooling the heating device; the inner cavity of the case is also provided with a liquid inlet pipeline, a liquid outlet pipeline and a double three-way pipeline connecting piece, the double three-way pipeline connecting piece comprises a connecting main body, a first three-way pipeline and a second three-way pipeline, and each liquid cooling branch is provided with a liquid inlet pipe orifice and a liquid outlet pipe orifice; the liquid inlet pipeline is communicated with liquid inlet pipe ports of the two liquid cooling branches through a first three-way pipe fitting, and the liquid outlet pipeline is communicated with liquid outlet pipe ports of the two liquid cooling branches through a second three-way pipe fitting; first and second tees are provided at the connector body, and first and second tees are stacked in a height direction of the computing device. Therefore, the height of the double three-way pipeline connecting piece along the height direction of the computing equipment is reduced, and the liquid cooling pipeline is convenient to arrange in the case.

Description

Computing device and liquid-cooled cabinet

Technical Field

The application relates to the technical field of servers, in particular to computing equipment and a liquid cooling cabinet.

Background

With the current requirements of big data, cloud computing and artificial intelligence and the update iteration of products, the power consumption of a heating device in computing equipment is higher and higher, and the heat generated by the heating device is also higher and higher. In order to protect the heating device in the computing equipment, on one hand, the heating device can be cooled by arranging an air cooling heat dissipation system and/or a liquid cooling heat dissipation system in the computing equipment; on the other hand, the heating device can be cooled in an immersed liquid cooling heat dissipation mode.

However, there is a problem in the server that the height of the liquid cooling pipes on the stacking area is too high, which makes the layout of the liquid cooling pipes difficult.

Disclosure of Invention

The embodiment of the application provides a computing device and a liquid cooling cabinet, and can solve the problem that liquid cooling pipelines are difficult to arrange due to the fact that the liquid cooling pipelines are too high in the stacking area in a server.

In a first aspect, an embodiment of the present application provides a computing device, including a chassis; the inner cavity of the case is provided with a circuit board, a heating device and two liquid cooling branches, the heating device is electrically connected to the circuit board, and the two liquid cooling branches are used for cooling the heating device; the inner cavity of the case is also provided with a liquid inlet pipeline, a liquid outlet pipeline and a double three-way pipeline connecting piece, the double three-way pipeline connecting piece comprises a connecting main body, a first three-way pipe piece and a second three-way pipe piece, and each liquid cooling branch is provided with a liquid inlet pipe orifice and a liquid outlet pipe orifice; the liquid inlet pipeline is communicated with the liquid inlet pipe orifices of the two liquid cooling branches through the first three-way pipe fitting, and the liquid outlet pipeline is communicated with the liquid outlet pipe orifices of the two liquid cooling branches through the second three-way pipe fitting; the first tee and the second tee are disposed at the connection body, the first tee and the second tee being stacked in a height direction of the computing device.

The computing equipment that this application embodiment provided includes quick-witted case, and the inner chamber of machine case is provided with circuit board, the device and two liquid cooling branches that generate heat, and the device electricity that generates heat is connected on the circuit board, is used for the device cooling that generates heat through making two liquid cooling branches to be favorable to protecting the performance of the device that generates heat.

The inner chamber of machine case still is provided with the feed liquor pipeline, liquid outlet pipe and two three-way pipe connection spare, all have the feed liquor mouth of pipe and the liquid outlet mouth of pipe through setting up every liquid cooling branch road, the feed liquor mouth of pipe that makes feed liquor pipeline and two liquid cooling branch roads passes through the first three-way pipe connection spare intercommunication of two three-way pipe connection spares, the second three-way pipe connection spare intercommunication that makes the liquid outlet mouth of pipe and two liquid cooling branch roads pass through two three-way pipe connection spares, so that the feed liquor pipeline can carry the coolant liquid to two liquid cooling branch roads, the liquid outlet pipe can export the coolant liquid in two liquid cooling branch roads, thereby make the coolant liquid can flow through the liquid cooling branch road, and the liquid cooling branch road is from the absorptive heat of heating device, and then be favorable to taking away the heat sink to the heating device, in order to guarantee the performance of heating device.

In addition, through setting up two tee bend pipeline connecting pieces including connecting main part, first tee bend pipe fitting and second tee bend pipe fitting, set up first tee bend pipe fitting and second tee bend pipe fitting in connecting main part to make first tee bend pipe fitting and second tee bend pipe fitting stack along the direction of height of computing equipment, thereby reduced the wall thickness in the direction of height, thereby can reduce two tee bend pipeline connecting pieces along the height of the direction of height of computing equipment, and then make the liquid cooling pipeline can the overall arrangement smoothly in the quick-witted case of computing equipment.

In one possible implementation, the first tee fitting and the second tee fitting are formed into the double tee pipe connection by an integral forming process.

The first three-way pipe fitting and the second three-way pipe fitting are formed into the double three-way pipe fitting through an integral forming process, so that the number of parts of the liquid cooling pipeline is reduced, and the height of the double three-way pipe fitting in the height direction of the computing equipment is further reduced.

In one possible implementation, the first tee fitting and the second tee fitting are spliced into the double tee fitting.

The first tee pipe fitting and the second tee pipe fitting are assembled to form the double tee pipe fitting, so that the flexibility of forming the double tee pipe fitting is improved, and the heat insulation piece is arranged between the first tee pipe fitting and the second tee pipe fitting conveniently.

In one possible implementation, the first tee fitting and the second tee fitting are assembled into the double tee pipe connector by screws; or the first tee pipe fitting and the second tee pipe fitting are welded into the double tee pipe connecting piece; or the first tee pipe fitting and the second tee pipe fitting are clamped into the double tee pipe connecting piece; or the first tee pipe fitting and the second tee pipe fitting are bonded to form the double tee pipe connecting piece.

The first three-way pipe fitting and the second three-way pipe fitting are assembled into the double three-way pipe fitting through the screw, welding, clamping or bonding modes, so that the assembling modes of the first three-way pipe fitting and the second three-way pipe fitting are simple, the assembling modes of the first three-way pipe fitting and the second three-way pipe fitting can be selected according to actual needs, and the manufacturing flexibility of the double three-way pipe fitting is improved.

In one possible implementation, a thermal insulation is provided between the first tee and the second tee.

Through set up the heat insulating part between first tee bend pipe fitting and second tee bend pipe fitting, the heat insulating part is favorable to improving the thermal-insulated effect between first tee bend pipe fitting and the second tee bend pipe fitting to can guarantee liquid cooling system's radiating effect.

In a possible implementation manner, the material of the heat insulation member is at least one of polycarbonate, foam, rubber or nylon.

In a possible implementation manner, the material of the double tee pipe connector is one of plastic, composite material, copper alloy, aluminum alloy or stainless steel.

In a possible implementation manner, the connecting main body is provided with three groups of interfaces, the three groups of interfaces are correspondingly communicated through channels in the connecting main body, and the extending directions of the three groups of interfaces are all perpendicular to the height direction of the computing device; the three groups of interfaces face to three directions respectively; or at least two groups of interfaces in the three groups of interfaces face to the same direction.

The extending directions of the three groups of interfaces are perpendicular to the height direction of the computing equipment, so that the height of the double three-way pipeline connecting piece in the height direction of the computing equipment can be prevented from being increased, and the liquid cooling pipelines can be conveniently and smoothly distributed in a case of the computing equipment.

Three groups of interfaces are arranged to face three directions respectively; or at least two groups of interfaces in the three groups of interfaces are arranged to face the same direction, so that the flexibility of the interface arrangement of the double three-way pipeline connecting piece is improved, and the liquid cooling pipelines in various arrangement forms can be adapted.

In a possible implementation, the connecting body is of a hexahedral structure; or the connecting main body is of a combined pipeline structure.

The connecting main body is in a hexahedral structure; or the connecting main body is arranged to be of a combined pipeline structure, so that the structural flexibility of the double-tee pipeline connecting piece is improved, and the structural form of the double-tee pipeline connecting piece can be flexibly selected according to actual needs.

In a possible implementation manner, the liquid cooling branch comprises at least one liquid cooling radiator sequentially connected in series between the liquid inlet pipe orifice and the liquid outlet pipe orifice.

Through setting up the liquid cooling branch road including the at least one liquid cooling radiator of series connection in proper order between the liquid inlet pipe mouth and the liquid outlet pipe mouth to make the liquid cooling branch road can dispel the heat to the device that generates heat through at least one liquid cooling radiator, and then be favorable to guaranteeing the performance of computing equipment.

In a possible implementation manner, a liquid cooling connector is arranged on the side wall of the case, the liquid inlet pipeline and the liquid outlet pipeline are both connected with the liquid cooling connector, and the liquid cooling connector is used for being connected with a liquid cooling pipeline outside the case.

The liquid cooling connector is arranged on the side wall of the case, so that the liquid inlet pipeline and the liquid outlet pipeline are connected with the liquid cooling connector, the liquid cooling connector is used for being connected with a liquid cooling pipeline outside the case, the liquid cooling pipeline outside the case can provide cooling media for the liquid inlet pipeline inside the case through the liquid cooling connector, or the cooling media discharged from the liquid outlet pipeline inside the case is received, and then the cooling media can flow in the liquid cooling pipeline inside the case, and the heat dissipation effect is improved.

In a second aspect, an embodiment of the present application provides a liquid cooling cabinet, including a liquid cooling pipeline and at least one computing device as described in any one of the above, the liquid cooling pipeline with the inlet pipe and the outlet pipe of the computing device communicate.

The liquid cooling rack that this application embodiment provided is owing to including above-mentioned computing device, consequently the beneficial effect that above-mentioned computing device has, and the liquid cooling rack of this application embodiment has equally, and here is no longer repeated.

Drawings

In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative efforts.

Fig. 1A is a schematic top-view structural diagram of a computing device according to an embodiment of the present application;

FIG. 1B is a simplified schematic diagram of the structure of FIG. 1A;

FIG. 2 is a schematic structural diagram I of a dual tee pipe connection of a computing device according to an embodiment of the present disclosure;

FIG. 3 is a first schematic cross-sectional structural view of a double tee connection of the computing device of FIG. 2;

FIG. 4 is a schematic cross-sectional structural view II of the dual tee connection of the computing device of FIG. 2;

FIG. 5 is a schematic structural diagram II of a two-way pipe connection of a computing device according to an embodiment of the present application;

FIG. 6 is an exploded schematic view of a double tee pipe connection of the computing device of FIG. 5;

FIG. 7 is a first schematic diagram illustrating a top view of a dual tee pipe connection of a computing device according to an embodiment of the present disclosure;

fig. 8 is a schematic top view structural diagram of a double tee pipe connection of a computing apparatus according to an embodiment of the present application.

Description of reference numerals:

100-a computing device;

110-a chassis; 120-CPU; 130-a memory; 140-a circuit board; 150-network card;

160-liquid cooling branch;

171-liquid cooled connector; 172-a liquid inlet pipe; 173-a liquid outlet pipe; 174-a liquid-cooled heat sink;

180-double tee pipe connector; 1801-a connecting body; 1802-an interface;

181-first tee fitting; 1811-locating boss; 182-a second tee fitting; 1821-locating the notch; 183-screw.

Detailed Description

The terminology used in the description of the embodiments section of the present application is for the purpose of describing particular embodiments of the present application only and is not intended to be limiting of the present application.

In order to make the aforementioned objects, features and advantages of the embodiments of the present application more comprehensible, embodiments of the present application are described in detail below with reference to the accompanying drawings. It is to be understood that the described embodiments are merely a few embodiments of the present application and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

Printed Circuit Boards (PCBs) are providers of electrical connections for electronic passive components. The processor chip is the most core part for the computing equipment, has the functions of logic processing and controlling the normal operation of the whole machine, and in the computing equipment, the processor chip is mainly fixed on the printed circuit board in the form of a chip packaging structure so as to stably control the chip in the chip packaging structure to be stably conducted with an external printed circuit board. Flip Chip (Flip Chip) is not only a Chip interconnection technology but also an ideal Chip bonding technology, and has become a packaging form frequently adopted in the fields of high-end devices and high-density packaging.

Computing equipment such as servers include a chassis, circuit boards and electronic components, both of which are disposed inside the chassis, the electronic components being electrically connected to the circuit boards. The electronic components include, but are not limited to, a Central Processing Unit (CPU) chip, a Graphics Processing Unit (GPU) chip, a memory, a network card, a capacitor, a resistor, a power supply, and other electronic components for implementing functions of the computing device. When the computing equipment is powered on to work, electronic components such as a CPU (central processing unit) and a memory on a circuit board generate heat, so that the temperature of the electronic components is increased, and the performance of the electronic components is reduced.

In order to ensure the performance of the heating devices such as the CPU and the memory, the heat generated by the heating devices inside the case of the computing device needs to be dissipated in time, so as to avoid the continuous increase of the temperature of the heating devices. At present, the heat dissipation methods of the computing device mainly include two types: the first heat dissipation mode is liquid cooling heat dissipation, and the second heat dissipation mode is air cooling heat dissipation. Wherein, the liquid cooling heat dissipation includes liquid cooling radiator heat dissipation and immersion liquid cooling heat dissipation. The liquid cooling radiator is used for radiating, so that cooling liquid in a liquid cooling radiating system flows through the liquid cooling radiator to take away heat absorbed by the liquid cooling radiator from heating devices such as a CPU (central processing unit), a memory and the like.

"U" is a unit representing the external size of the server, and is an abbreviation of unit, and the specific size represented by 1U is determined by the american Electronic Industries Association (EIA). 1u =1.75 inch =44.45 mm =4.445 cm. It will be understood by those skilled in the art that the actual dimensions of the "U" may be subject to variation during actual manufacturing, or that the particular dimensions of the "U" may be determined by other alternative server external dimensioning units or organizations, without limitation.

The embodiment of the application provides a computing device. The computing equipment comprises a case, wherein a circuit board, a heating device and two liquid cooling branches are arranged in an inner cavity of the case, the heating device is electrically connected to the circuit board, and the two liquid cooling branches are used for cooling the heating device, so that the performance of the heating device is protected.

Concretely, all have the feed liquor mouth of pipe and go out the liquid mouth of pipe through setting up every liquid cooling branch road, and set up feed liquor pipeline and liquid outlet pipe way in the inner chamber of quick-witted case, make the feed liquor mouth of feed liquor pipeline and two liquid cooling branch roads through first tee bend pipe fitting intercommunication, make the liquid outlet pipe mouth of liquid outlet pipe and two liquid cooling branch roads pass through second tee bend pipe fitting intercommunication, the feed liquor pipeline can carry the coolant liquid to two liquid cooling branch roads, the liquid outlet pipe way can be with the coolant liquid output in two liquid cooling branch roads, thereby make the coolant liquid branch road of can flowing through, and take away the liquid cooling branch road from the heat that absorbs on the heating element, and then be favorable to cooling the heating element, in order to guarantee the performance of heating element.

In addition, the first three-way pipe fitting and the second three-way pipe fitting are stacked in the height direction of the computing equipment and are formed into an integrated double three-way pipe connecting piece, the wall thickness in the height direction is reduced, and therefore the height of the double three-way pipe connecting piece in the height direction of the computing equipment can be reduced. Compared with the height H1 of stacking two independent tee pipes together in the related art, the height H2 of the double tee pipe connector in the embodiment of the application can be as low as 18mm or below 18mm, and the liquid cooling pipeline can be smoothly arranged in a case of computing equipment.

The following describes in detail specific structures of a computing device and a liquid-cooled cabinet provided in an embodiment of the present application with reference to the accompanying drawings.

Fig. 1A is a schematic top view structure diagram of a computing device according to an embodiment of the present application. It is understood that the computing device 100 of the embodiment of the present application includes, but is not limited to, a server, and the embodiment of the present application is described by taking a 1U server as an example. It should be noted that the configuration and internal layout of the 1U server may be as shown in fig. 1A, or the configuration and internal layout of the 1U server may also be set according to actual needs.

Fig. 1B is a simplified structural diagram of fig. 1A. Referring to fig. 1A and 1B, a computing device 100 according to an embodiment of the present disclosure includes a chassis 110, a circuit board 140, a memory 130, four CPUs 120, and a network card 150, where the circuit board 140 is tiled at the bottom of an inner cavity of the chassis 110, and the four CPUs 120 are arranged in two rows and two columns on the upper portion of the circuit board 140 along the Y direction and electrically connected to the circuit board 140; the memories 130 are arranged in a row along the X direction, and the memories 130 are located on the circuit board 140 between two rows of the CPUs 120 and electrically connected to the circuit board 140; the network cards 150 are arranged in a row along the X direction, and the network cards 150 are located at the lower part of the circuit board 140 along the Y direction and electrically connected to the circuit board 140.

The liquid cooling heat dissipation system is further disposed in the inner cavity of the chassis 110 of the computing device 100 in the embodiment of the present application, and the liquid cooling heat dissipation system may include a liquid cooling connector 171, a liquid inlet pipe 172, a liquid outlet pipe 173, and two liquid cooling branches 160, where the two liquid cooling branches 160 are used to cool down the heat generating devices such as the CPU120 and the memory 130. The liquid cooling connector 171 may be disposed on a side wall of the case 110, a liquid inlet end of the liquid inlet pipe 172 is communicated with a liquid inlet of the liquid cooling connector 171, and a liquid outlet end of the liquid inlet pipe 172 is communicated with liquid inlet pipe orifices of the two liquid cooling branches 160 through a first tee pipe; the liquid outlet end of the liquid outlet pipe 173 is communicated with the liquid outlet of the liquid cooling connector 171, and the liquid inlet end of the liquid outlet pipe 173 is communicated with the liquid outlet pipe openings of the two liquid cooling branches 160 through a second three-way pipe fitting. Specifically, the first tee and the second tee of the embodiments of the present application are stacked in the height direction of computing device 100 and formed as a double tee connection 180.

In one possible implementation, the liquid-cooled heat dissipation system may not include the liquid-cooled connector 171, and the liquid inlet end of the liquid inlet pipe 172 and the liquid outlet end of the liquid outlet pipe 173 may directly penetrate through the sidewall of the cabinet 110 to communicate with the liquid-cooled pipeline outside the cabinet 110.

The liquid cooling branch 160 of the embodiment of the present application includes a series pipe segment and a liquid cooling radiator 174, and the series pipe segment can connect the liquid cooling radiator 174 in series between the liquid inlet pipe orifice and the liquid outlet pipe orifice of the liquid cooling branch 160, for example, the liquid cooling radiator 174 can be a liquid cooling plate. The liquid-cooled heat sink 174 may include a memory 130 heat sink and two CPU heat sinks, the two CPU heat sinks are respectively disposed on the two CPUs 120 aligned in a row along the Y direction, and the memory 130 heat sink is disposed on the memory 130 between the two CPUs 120 aligned in a row along the Y direction; the plurality of serial pipe sections can be used for sequentially connecting the liquid inlet pipe orifice, the lower CPU radiator, the upper CPU radiator, the memory 130 radiator and the liquid outlet pipe orifice in series, so that the liquid cooling branch is used for cooling the two CPUs 120 and the memory 130 which are arranged in a line along the Y direction. The series connected pipe segments may also be connected in series with the liquid cooled heat sink 174 in other orders as long as the requirements of the present embodiment are met.

During operation, the coolant in the inlet pipe 172 enters the two liquid cooling branches 160 through the first tee in the double tee connection 180. Taking the left liquid cooling branch in fig. 1B as an example, the cooling liquid entering the left liquid cooling branch via the first three-way pipe sequentially flows through the CPU radiator located below, the CPU radiator located above, and the memory 130 radiator, and finally enters the liquid outlet pipe 173 via the second three-way pipe in the two-way pipe connection 180. In fig. 1B, the flow direction of the cooling liquid in the right side liquid cooling branch is the same as that of the cooling liquid in the left side liquid cooling branch, and is not described herein again. The heat absorbed by the CPU heat sink and the memory 130 heat sink from the CPU120 and the memory 130 can be taken away by the cooling liquid in the process of flowing in the liquid cooling branch 160, thereby facilitating the cooling of the CPU120 and the memory 130.

The first tee fitting and the second tee fitting of the embodiments of the present application are stacked in the height direction of the computing device 100 and formed as a double tee fitting 180, and the height H2 of the double tee fitting 180 may be as low as 18mm or less than 18mm, so as to be stacked in the height direction of the computing device 100 with other structures in the case 110 of the computing device 100 without exceeding the height of the case 110.

Fig. 2 is a first schematic structural diagram of a double tee pipe connection of a computing device according to an embodiment of the present disclosure. Referring to fig. 2, the double tee pipe connector 180 according to the embodiment of the present disclosure may be obtained by an integral forming process, and the double tee pipe connector 180 includes a connecting body 1801, a first tee pipe, and a second tee pipe, which are disposed in the connecting body 1801.

In a first possible implementation, the material of the double tee pipe connector 180 may be plastic. The plastic double tee pipe connector 180 may be formed by any process including, but not limited to, injection molding, extrusion molding, blow molding, blister molding, compression molding, and calendaring.

In a second possible implementation, the material of the double tee connector 180 may be a composite material, for example, a composite material of nylon (PPA) and fiberglass. The integrated forming process of the double tee pipe connector 180 made of the composite material includes, but is not limited to, injection molding, extrusion molding, blow molding, plastic forming, compression molding, calendaring and the like.

In a third possible implementation, the material of the double tee pipe connector 180 may be metal, for example, the metal includes, but is not limited to, copper alloy, aluminum alloy, stainless steel, and the like. The process of integrally forming the metallic double tee pipe connection 180 includes, but is not limited to, a casting process.

The connection body 1801 of the double tee pipe connection 180 of the embodiment of the present application is provided with three sets of interfaces 1802, and the extending directions of the three sets of interfaces 1802 are all perpendicular to the height direction of the computing device 100, so as to avoid increasing the height of the double tee pipe connection 180 in the height direction of the computing device 100.

Each set of ports 1802 may include an inlet port 1802 and an outlet port 1802. For example, an inlet interface 1802 in the first set of interfaces 1802 may communicate with an outlet end of the inlet pipe 172, and an outlet interface 1802 in the first set of interfaces 1802 may communicate with an inlet end of the outlet pipe 173; a liquid outlet interface 1802 in the second group of interfaces 1802 can be communicated with a liquid inlet pipe orifice of the first liquid cooling branch, and a liquid inlet interface 1802 in the second group of interfaces 1802 can be communicated with a liquid outlet pipe orifice of the first liquid cooling branch; liquid outlet interface 1802 in the third group of interfaces 1802 can communicate with the liquid inlet pipe mouth of the second liquid cooling branch, and liquid inlet interface 1802 in the second group of interfaces 1802 can communicate with the liquid outlet pipe mouth of the first liquid cooling branch. The inlet ports 1802 in the first set of ports 1802 can simultaneously communicate with the outlet ports 1802 in the second set of ports 1802 and the outlet ports 1802 in the third set of ports 1802 through the passages in the connecting body 1801, and the outlet ports 1802 in the first set of ports 1802 can simultaneously communicate with the inlet ports 1802 in the second set of ports 1802 and the inlet ports 1802 in the third set of ports 1802 through the passages in the connecting body 1801.

Optionally, the three sets of interfaces 1802 of the embodiment of the present application face in three directions, respectively.

In other possible implementations, at least two sets 1802 of interfaces of the three sets 1802 face in the same direction. Illustratively, one set of interfaces 1802 in the three sets of interfaces 1802 faces in one direction, and the remaining two sets of interfaces 1802 in the three sets of interfaces 1802 face in the other direction; alternatively, the three sets of interfaces 1802 are all oriented in the same direction.

Optionally, the connection body 1801 according to this embodiment of the application is a hexahedral structure, the top surface and the bottom surface of the connection body 1801 are opposite and spaced apart from each other along the height direction of the computing device 100, and four side surfaces of the connection body 1801 are opposite to each other two by two and surround between the top surface and the bottom surface of the connection body 1801.

Optionally, the three sets of interfaces 1802 of the embodiment of the present application are respectively located on three of four sides of the connection body 1801. For example, as shown in fig. 2, a first set of interfaces 1802 may be located on a first side of connection body 1801, a second set of interfaces 1802 may be located on a second side of connection body 1801, and a third set of interfaces 1802 may be located on a third side of connection body 1801, where the first side and third side are opposite and the second side is connected between the first side and third side.

In another possible implementation, the three sets of interfaces 1802 may be located on two of the four sides of the connection body 1801, respectively (not shown). For example, first set of interfaces 1802 may be located on a first side of connection body 1801, and second set of interfaces 1802 and third set of interfaces 1802 may each be located on a second side of connection body 1801, the first side and the second side being adjacent; alternatively, the first set of interfaces 1802 may be located on a first side of the connection body 1801, and the second set of interfaces 1802 and the third set of interfaces 1802 may both be located on a third side of the connection body 1801, the first side and the third side being opposite.

In yet another possible implementation, the three sets of interfaces 1802 may each be located on one of four sides of the connection body 1801 (not shown).

In other possible implementations, the connection body 1801 may be a composite pipe structure (not shown). For example, a combined pipeline structure formed by stacking and combining two "T" type pipelines may be used, and the three sets of interfaces 1802 are correspondingly communicated through the combined pipeline structure to form the double tee pipeline connecting piece 180 with the function of double tee, in which case, the three sets of interfaces 1802 face three directions respectively. When the connecting body 1801 is a combined pipe structure with other shapes, one set of interfaces 1802 in the three sets of interfaces 1802 may face one direction, and the other two sets of interfaces 1802 in the three sets of interfaces 1802 may both face the other direction; alternatively, the three sets of interfaces 1802 may all face in the same direction.

FIG. 3 is a first schematic cross-sectional structural view of a double tee connection of the computing device of FIG. 2; FIG. 4 is a schematic cross-sectional structural diagram II of the dual tee connection of the computing device of FIG. 2. Referring to fig. 3 and 4, two tee structures, namely a first tee pipe 181 and a second tee pipe 182, stacked in the height direction of the computing apparatus 100 are disposed in the double tee pipe connection 180 according to the embodiment of the present disclosure, so that the double tee pipe connection 180 can realize the function of a double tee.

Fig. 5 is a schematic structural diagram of a double tee pipe connection of a computing apparatus according to an embodiment of the present application. Referring to fig. 5, the double tee pipe connection 180 of the embodiment of the present application may be obtained through a makeup process, i.e., a first tee pipe 181 and a second tee pipe 182 are makeup into the double tee pipe connection 180.

Specifically, first tee fitting 181 includes a first connection body 1801 and three first ports 1802 coupled to first connection body 1801, the three first ports 1802 extending in a direction perpendicular to the height of computing device 100 to avoid increasing the height of tee connector 180 formed by the assembly of first tee fitting 181 and second tee fitting 182 in the height of computing device 100. The material of the first tee pipe 181 includes, but is not limited to, plastic, composite material, and metal, wherein the composite material includes, but is not limited to, composite material composed of nylon (PPA) and glass fiber, and the metal includes, but is not limited to, copper alloy, aluminum alloy, stainless steel, and the like. The first tee fitting 181 may be obtained by an integral molding process, or may be obtained by a combined machining process. The first connection body 1801 and the first interface 1802 of the first three-way pipe fitting 181 may be made of the same material or different materials.

Second tee fitting 182 includes a second connection body 1801 and three second ports 1802 attached to second connection body 1801, the three second ports 1802 each extending in a direction perpendicular to the height of computing apparatus 100 to avoid increasing the height of the two-way pipe connection 180 formed by the assembly of first tee fitting 181 and second tee fitting 182 in the height direction of computing apparatus 100. The material of second tee 182 includes, but is not limited to, plastic, composite material including, but not limited to, composite material composed of nylon (PPA) and fiberglass, and metal including, but not limited to, copper alloy, aluminum alloy, stainless steel, etc. Second tee fitting 182 may be obtained by an integral molding process or may be obtained by a combined machining process. The second connection body 1801 and the second interface 1802 of the second tee 182 may or may not be the same material.

The first connection body 1801 of the first tee fitting 181 and the second connection body 1801 of the second tee fitting 182 are mated together to form the double tee connection 180. For example, the first connection body 1801 and the second connection body 1801 may be assembled to form a connection body 1801 having a hexahedral structure; alternatively, the first connecting body 1801 may be a "T" shaped pipe, the second connecting body 1801 may also be a "T" shaped pipe, and the first connecting body 1801 and the second connecting body 1801 may be assembled to form a connecting body 1801 (not shown) of a combined pipe structure. Optionally, the first tee fitting 181 and the second tee fitting 182 may be made of the same material or different materials.

In a first possible implementation, first tee fitting 181 and second tee fitting 182 may be assembled into double tee fitting 180 by screws 183. For example, the number, type and installation position of the screws 183 may be set according to actual needs, as long as the requirements of the present embodiment can be met, and are not described herein again. It will be appreciated that when the screw 183 extends in the height direction of the computing device 100, the length of the screw 183 is less than or equal to the height of the tee connector 180 in the height direction of the computing device 100, and the nut of the screw 183 is recessed within the connector body 1801 without adding additional height to the tee connector 180.

In a second possible implementation, first tee fitting 181 and second tee fitting 182 are welded into a double tee fitting 180. Illustratively, when the first connection body 1801 of the first tee fitting 181 and the second connection body 1801 of the second tee fitting 182 are both of a metallic material, the first connection body 1801 of the first tee fitting 181 and the second connection body 1801 of the second tee fitting 182 may be welded to form the first tee fitting 181 and the second tee fitting 182 into the double tee fitting 180.

In a third possible implementation, first tee fitting 181 and second tee fitting 182 are snap-fitted into a double tee fitting 180. Illustratively, one of the first connection body 1801 of the first tee fitting 181 and the second connection body 1801 of the second communication fitting may be provided with a snap fit structure and the other may be provided with a mating structure, the snap fit structure and the mating structure snap fit connection such that the first tee fitting 181 and the second tee fitting 182 form a double tee fitting connection 180.

In a fourth possible implementation, first tee fitting 181 and second tee fitting 182 are bonded into a double tee fitting 180. Illustratively, an adhesive may be disposed between the first connection body 1801 of the first tee fitting 181 and the second connection body 1801 of the second communicating tube, which may bond the first and second connection bodies 1801, 1801 together to form the first and second tee fittings 181, 182 into the double tee fitting 180.

It will be appreciated that the union tee fitting 180 of the embodiments of the present application, in which first and second tee fittings 181 and 182 are assembled, includes a connection body 1801 comprised of first and second connection bodies 1801 and 1801, and three sets of ports 1802 comprised of three first ports 1802 and three second ports 1802, each set of ports 1802 including one first port 1802 and one second port 1802.

Optionally, the three sets of interfaces 1802 of the embodiment of the present application face in three directions, respectively. In other possible implementations, at least two sets 1802 of interfaces of the three sets 1802 face in the same direction. Illustratively, one set of interfaces 1802 in the three sets of interfaces 1802 faces in one direction, and the remaining two sets of interfaces 1802 in the three sets of interfaces 1802 face in the other direction; alternatively, the three sets of interfaces 1802 are all oriented in the same direction.

FIG. 6 is an exploded schematic view of a double tee pipe connection of the computing device of FIG. 5. Referring to fig. 6, the first tee pipe 181 and the second tee pipe 182 of the embodiment of the present application are assembled together by screws 183, and the number of the screws 183 can be determined according to actual needs. One of first tee 181 and second tee 182 may be provided with a locating protrusion 1811 and the other with a locating notch 1821, locating protrusion 1811 mating with locating notch 1821 when first tee 181 and second tee 182 are mated together.

A thermal shield (not shown) may be disposed between first tee fitting 181 and second tee fitting 182. For example, when the first three-way pipe fitting 181 and the second three-way pipe fitting 182 are both made of metal, the heat insulation piece is beneficial to improving the heat insulation effect between the first three-way pipe fitting 181 and the second three-way pipe fitting 182 so as to ensure the heat dissipation effect of the liquid cooling heat dissipation system; or, when the first three-way pipe fitting 181 and the second three-way pipe fitting 182 are made of a plastic material or a composite material, the heat insulation member is beneficial to further improving the heat insulation effect between the first three-way pipe fitting 181 and the second three-way pipe fitting 182, so as to further ensure the heat dissipation effect of the liquid cooling heat dissipation system. Of course, when the first tee pipe fitting 181 and the second tee pipe fitting 182 are made of plastic materials or composite materials, a heat insulation piece does not need to be arranged between the first tee pipe fitting 181 and the second tee pipe fitting 182, and the heat insulation effect of the plastic materials and the composite materials is good.

Optionally, the material of the thermal insulation member in the embodiment of the present application includes, but is not limited to, polycarbonate (PC), foam, rubber, or nylon.

Fig. 7 is a first schematic top view of a dual tee connector of a computing device according to an embodiment of the present disclosure. Referring to fig. 7, the double tee pipe connector 180 of the present embodiment includes a connecting body 1801 and three sets of ports 1802 attached to the connecting body 1801.

Wherein the three sets of interfaces 1802 are respectively connected to a first side, a second side and a third side of the connection body 1801, the first side of the connection body 1801 is opposite to the third side of the connection body 1801, and the second side of the connection body 1801 is connected between the first side of the connection body 1801 and the third side of the connection body 1801. The set of interfaces 1802 coupled to the first side of the connection body 1801 extend in a first direction, the set of interfaces 1802 coupled to the second side of the connection body 1801 extend in a second direction, and the set of interfaces 1802 coupled to the third side of the connection body 1801 extend in a third direction, the first direction, the second direction, and the third direction being different, illustratively, the first direction and the second direction being opposite to each other, and the third direction being perpendicular to the first direction.

Each set of interfaces 1802 of the present embodiment may include a first interface 1802 and a second interface 1802. Illustratively, the first interface 1802 in the first group of interfaces 1802, the first interface 1802 in the second group of interfaces 1802, and the first interface 1802 in the third group of interfaces 1802 may communicate with each other through a channel in the connection body 1801; the second interface 1802 in the first set of interfaces 1802, the second interface 1802 in the second set of interfaces 1802 and the second interface 1802 in the third set of interfaces 1802 may communicate with each other through channels in the connection body 1801.

Fig. 8 is a schematic top view structural diagram of a two-way pipe connection of a computing apparatus according to an embodiment of the present application. Referring to fig. 8, the double tee pipe connector 180 of the present embodiment includes a connecting body 1801 and three sets of ports 1802 attached to the connecting body 1801.

Wherein one set of interfaces 1802 of the three sets of interfaces 1802 is connected to a first side of the connection body 1801, the remaining two sets of interfaces 1802 of the three sets of interfaces 1802 are connected to a second side of the connection body 1801, and the first side of the connection body 1801 is adjacent to the second side of the connection body 1801. One set of interfaces 1802 coupled to a first side of the connection body 1801 may extend in a first direction and the remaining two sets of interfaces 1802 coupled to a second side of the connection body 1801 may extend in a second direction, the first and second directions being different, and for example, may be perpendicular to each other.

Each set of interfaces 1802 of the present embodiment may include a first interface 1802 and a second interface 1802. Illustratively, the first interface 1802 in the first group of interfaces 1802, the first interface 1802 in the second group of interfaces 1802, and the first interface 1802 in the third group of interfaces 1802 may communicate with each other through a channel in the connection body 1801; the second interface 1802 in the first set of interfaces 1802, the second interface 1802 in the second set of interfaces 1802 and the second interface 1802 in the third set of interfaces 1802 may communicate with each other through channels in the connection body 1801.

The embodiment of the application further provides a liquid cooling rack, and the liquid cooling rack comprises a liquid cooling pipeline and at least one computing device, wherein the liquid cooling pipeline is communicated with the liquid inlet pipeline and the liquid outlet pipeline of the computing device.

For example, the liquid cooling pipeline may include a liquid inlet main pipe and a liquid outlet main pipe, and the liquid inlet main pipe and the liquid outlet main pipe may be correspondingly communicated with a liquid inlet pipeline and a liquid outlet pipeline of the computing device through the liquid cooling connector; or the liquid inlet main pipe and the liquid outlet main pipe can be directly and correspondingly communicated with the liquid inlet pipeline and the liquid outlet pipeline. During specific application, the liquid inlet main pipe can provide cooling liquid for a liquid inlet pipeline of the computing equipment, and the liquid outlet main pipe can receive the cooling liquid discharged by a liquid outlet pipeline of the computing equipment, so that the cooling liquid in the computing equipment flows, and heat generated by a heating device of the computing equipment is taken away.

The numerical values referred to in the embodiments of the present application are approximate values, and may have a certain range of errors due to the influence of the manufacturing process, and the error may be considered to be negligible by those skilled in the art. In the description of the embodiments of the present application, "up", "down", "left" and "right" are described based on the orientations in the drawings, and it is understood that when the placement posture of the apparatus of the embodiments of the present application is changed, the orientations are changed accordingly.

In the description of the embodiments of the present application, it should be noted that unless otherwise explicitly stated or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, a fixed connection, an indirect connection via an intermediary, a connection between two elements, or an interaction between two elements. Specific meanings of the above terms in the embodiments of the present application can be understood by those of ordinary skill in the art according to specific situations.

The terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising a … …" does not exclude the presence of another identical element in a process, method, article, or apparatus that comprises the element.

The terms "first," "second," "third," "fourth," and the like in the description and in the claims of the embodiments of the application and in the drawings described above, if any, are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order.

Finally, it should be noted that: the above embodiments are only used for illustrating the technical solutions of the embodiments of the present application, and are not limited thereto. Although embodiments of the present application have been described in detail with reference to the foregoing embodiments, those skilled in the art will understand that: it is also possible to modify the solutions described in the previous embodiments or to substitute some or all of them with equivalents. And the modifications or the substitutions do not make the essence of the corresponding technical solutions depart from the scope of the technical solutions of the embodiments of the present application.

Claims (12)

1. A computing device comprising a chassis;

the inner cavity of the case is provided with a circuit board, a heating device and two liquid cooling branches, the heating device is electrically connected to the circuit board, and the two liquid cooling branches are used for cooling the heating device;

the inner cavity of the case is also provided with a liquid inlet pipeline, a liquid outlet pipeline and a double three-way pipeline connecting piece, the double three-way pipeline connecting piece comprises a connecting main body, a first three-way pipe piece and a second three-way pipe piece, and each liquid cooling branch is provided with a liquid inlet pipe orifice and a liquid outlet pipe orifice; the liquid inlet pipeline is communicated with the liquid inlet pipe orifices of the two liquid cooling branches through the first three-way pipe fitting, and the liquid outlet pipeline is communicated with the liquid outlet pipe orifices of the two liquid cooling branches through the second three-way pipe fitting;

the first tee and the second tee are disposed at the connection body, the first tee and the second tee being stacked in a height direction of the computing device.

2. The computing apparatus of claim 1, wherein the first tee and the second tee are formed into the double tee connection by an integral forming process.

3. The computing device of claim 1, wherein the first tee and the second tee are spliced into the double tee connection.

4. The computing device of claim 3, wherein the first tee and the second tee are assembled into the double tee connection with screws;

or the first tee pipe fitting and the second tee pipe fitting are welded into the double tee pipe connecting piece;

or the first tee pipe fitting and the second tee pipe fitting are clamped to form the double tee pipe connecting piece;

or the first tee pipe fitting and the second tee pipe fitting are bonded to form the double tee pipe connecting piece.

5. The computing device of claim 3 or 4, wherein a thermal shield is disposed between the first tee and the second tee.

6. The computing device of claim 5, wherein the thermal insulation is at least one of polycarbonate, foam, rubber, or nylon.

7. The computing device of any of claims 1-6, wherein the material of the double tee connector is one of plastic, composite, copper alloy, aluminum alloy, or stainless steel.

8. The computing device according to any one of claims 1 to 7, wherein the connecting body is provided with three sets of interfaces, the three sets of interfaces are correspondingly communicated through channels in the connecting body, and the three sets of interfaces extend in a direction perpendicular to the height direction of the computing device;

the three groups of interfaces respectively face to three directions;

or at least two groups of interfaces in the three groups of interfaces face to the same direction.

9. The computing device of claim 8, wherein the connecting body is a hexahedral structure;

or the connecting main body is of a combined pipeline structure.

10. The computing device of any of claims 1-9, wherein the liquid-cooled branch comprises at least one liquid-cooled heat sink serially connected in series between the liquid inlet port and the liquid outlet port.

11. The computing device of any of claims 1-10, wherein a side wall of the case is provided with a liquid-cooled connector, the liquid inlet conduit and the liquid outlet conduit both being connected to the liquid-cooled connector, the liquid-cooled connector being configured to connect to a liquid-cooled conduit external to the case.

12. A liquid-cooled cabinet comprising a liquid-cooled conduit and at least one computing device as recited in any of claims 1-11, the liquid-cooled conduit communicating with an inlet conduit and an outlet conduit of the computing device.

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