CN113766804B - Airborne immersion type electronic heat dissipation testing module - Google Patents
Airborne immersion type electronic heat dissipation testing module Download PDFInfo
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- CN113766804B CN113766804B CN202110924569.7A CN202110924569A CN113766804B CN 113766804 B CN113766804 B CN 113766804B CN 202110924569 A CN202110924569 A CN 202110924569A CN 113766804 B CN113766804 B CN 113766804B
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20845—Modifications to facilitate cooling, ventilating, or heating for automotive electronic casings
- H05K7/20872—Liquid coolant without phase change
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20845—Modifications to facilitate cooling, ventilating, or heating for automotive electronic casings
- H05K7/20854—Heat transfer by conduction from internal heat source to heat radiating structure
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
Abstract
The invention provides an airborne immersive electronic heat dissipation test module, which is used for performing simulated heat dissipation test of an airborne task electronic system, and comprises the following components: the heat source heating body for simulating the electronic components is distributed in the box body and comprises a heating core and polyimide films positioned on two sides of the heating core; the liquid connector is arranged in the box body and used for communicating the box body with external cooling liquid so as to cool the heat source heating body. The invention solves the thermal design problem of single-phase immersion type heat dissipation performance of the high-power and high-integration electronic module, and optimizes the design of the polytetrafluoroethylene shunt pipeline and the flow distribution and heat dissipation fins through the simulation analysis result. And moreover, the internal structure of the heat dissipation test module is reasonably designed, a heat source simulation design based on a PI heating film heating body is adopted, and the whole weight of the heat dissipation test module is reduced through a plastic filling piece.
Description
Technical Field
The invention relates to the technical field of airborne equipment, in particular to an airborne immersive electronic heat dissipation test module.
Background
An ASAAC (integrated modular avionics system standard made by the european standards institute of advanced technology attachment), VITA48 (integrated modular avionics system standard made by the international trade association), LRM (The Line Replaceable Module, field replaceable module) modular standard design is one of the important development features of an on-board integrated modular mission electronics system. In general, junction temperature control of electronic components within a module is one of the important factors in thermal reliability design. Various cooling mode module types, such as air cooling, conduction cooling, liquid cooling, mixed type and the like, are developed according to the heat consumption of devices in the module.
Through the development of several generations of airborne modularized comprehensive rack series, the maximum allowable power of a single air-cooled or conduction-cooled electronic module can reach 200W, and the maximum power of a liquid-cooled electronic module (LFT) can reach 250W-300W. However, the high-power and high-heat-flux density characteristics of the electronic system are more and more obvious for the design of a new generation of on-board comprehensive modularized and high-integration task electronic system. The heat dissipation mode of the airborne electronic module needs to be innovatively designed and researched according to the use characteristics of the airborne electronic module, so that the thermal reliability of the device is improved.
At present, most liquid cooling heat dissipation module technologies mainly concentrate on researching a conduction type and penetration type liquid cooling module in which cooling liquid is in indirect contact with components. The penetrating liquid cooling module with high heat dissipating capacity is one structure with cold plates in different flow channel configurations and electronic devices adhered to the two sides of the cold plates. However, the structure and the cold plate manufacturing and treatment process are complex, and the problems of heat dissipation and liquid passing are affected due to the blockage of the liquid joint caused by deposition of flow channel impurities such as welding flux or corrosive substances corroded by cooling liquid in the cold plate during long-term operation. The problems of local temperature hot spots, uneven heat dissipation, poor heat dissipation effect and the like exist for components on the PCB with high integration level and large-size heat consumption layout. Meanwhile, the safety risks of cooling liquid corrosion, leakage damage to circuits, sealing joints and the like exist.
Disclosure of Invention
The invention provides an airborne immersive electronic heat dissipation test module, which aims to solve the technical problem of how to design an airborne task electronic system with a good heat dissipation effect.
According to an embodiment of the invention, the airborne immersive electronic heat dissipation test module is used for performing simulated heat dissipation test of an airborne task electronic system, and comprises:
the heat source heating body used for simulating the electronic components is distributed in the box body and comprises a heating core and polyimide films positioned on two sides of the heating core;
the liquid connector is arranged in the box body and used for communicating the box body with external cooling liquid so as to cool the heat source heating body;
and the box body is hermetically connected with the sealing cover.
According to some embodiments of the invention, a diversion pipeline connected with the liquid connector is arranged in the box body, the diversion pipeline is provided with a plurality of injection ports, and the cooling liquid flowing into the diversion pipeline through the liquid connector is injected through the injection ports.
In some embodiments of the present invention, an aluminum block is disposed on an outer surface of the heat source/heat generator, and the aluminum block has the same size as the electronic component to be simulated.
According to some embodiments of the invention, at least part of the heat source heating body is provided with a heat radiating fin.
In some embodiments of the invention, one of the end faces of the cartridge is provided with a plurality of identical output openings and with positioning guide pins for guiding alignment.
According to some embodiments of the invention, locking mechanisms for securing the heat dissipation test module to the integrated chassis slot are provided on both opposing side panels of the box.
In some embodiments of the invention, the cartridge and the cover are sealingly connected by a sealing gasket and a plurality of cross-grooved countersunk screws.
According to some embodiments of the invention, none of the plurality of cross-slot countersunk head screws protrude from the outer surface of the cover and/or the box and are coated with a locking glue for fastening.
In some embodiments of the invention, at least part of the heat source heating body is provided with a temperature measuring point.
According to some embodiments of the invention, the cartridge is filled with a plastic filler compatible with the cooling fluid.
The invention has the following beneficial effects:
the invention develops a novel airborne immersed electronic heat radiation test module meeting an airborne comprehensive modularized framework for the first time, solves the problem of single-phase immersed heat radiation performance heat design of a high-power and high-integration electronic module, and optimizes polytetrafluoroethylene shunt pipelines and flow distribution and heat radiation fin design through simulation analysis results. In addition, the internal structure of the heat radiation test module is reasonably designed, the heat source simulation design based on the PI heating film heating body is adopted, and the whole weight of the heat radiation test module is reduced through the plastic filling piece.
Drawings
FIG. 1 is a schematic view of a first direction view of an airborne immersive electronic heat dissipation test module according to an embodiment of the invention;
FIG. 2 is a schematic diagram of a second direction view of an airborne immersive electronic heat dissipation test module according to an embodiment of the invention;
FIG. 3 is a schematic diagram of a third-direction view of an airborne immersive electronic heat dissipation test module according to an embodiment of the invention;
FIG. 4 is a fourth perspective view of an airborne immersive electronic heat dissipation test module in accordance with an embodiment of the invention;
FIG. 5 is a schematic diagram of heat source distribution (heat consumption, area) in an airborne immersive electronic heat dissipation test module according to an embodiment of the invention;
FIG. 6 is a schematic diagram of the internal components of an airborne immersive electronic heat dissipation test module in accordance with an embodiment of the invention;
FIG. 7 is a cross-sectional view of the airborne immersive electronic heat dissipation test module shown in FIG. 6;
FIG. 8 is a simulated cloud image of device surface temperature within an airborne immersive electronic heat dissipation test module in accordance with an embodiment of the invention;
FIG. 9 is a simulated cloud diagram of coolant velocity within an airborne immersive electronic heat dissipation test module in accordance with an embodiment of the invention;
FIG. 10 is a simulated cloud diagram of cooling fluid pressure within an airborne immersive electronic heat dissipation test module in accordance with an embodiment of the invention;
FIG. 11 is a schematic diagram of a heat source simulation design PI heating film heater according to an embodiment of the present invention;
fig. 12 is a schematic diagram of an airborne immersion electronic heat dissipation test module temperature measurement point arrangement according to an embodiment of the invention.
Reference numerals:
the heat dissipation test module 100,
the device comprises a box body 10, a PCB 110, a heat source heating body 111, a shunt pipeline 120, an injection orifice 121, a radiating fin 130, a positioning guide pin 140, a locking mechanism 150, an output port 160, a plugging device 170, a metal block 180,
the liquid-phase connector 20 is provided with a plurality of fluid-phase connectors,
the cover 30 is provided with a sealing means,
a plastic filler 40.
Detailed Description
In order to further describe the technical means and effects adopted by the present invention for achieving the intended purpose, the following detailed description of the present invention is given with reference to the accompanying drawings and preferred embodiments.
According to the invention, the heat dissipation mode of direct contact between the cooling liquid and the components is researched, namely, the single-phase immersion liquid heat dissipation technology is researched, and the design of the novel high-integration, high-power and modularized immersion cooling electronic module suitable for the airborne use environment is researched.
In the related art, an immersed phase-change liquid-cooled server is used in a ground data center, and a large amount of heat is taken away through liquid phase-change latent heat by directly immersing different functional open liquid-cooled server devices in a liquid-cooled cabinet or device filled with fluoridized liquid, wherein the standard-size series immersed liquid-cooled server is commonly developed by units such as Zhongkeguang and Ali. The disclosed test data and application show that the immersed phase change heat dissipation device has the advantages of strong heat dissipation capability, high reliability, good temperature uniformity, energy conservation, environmental protection, no corrosion and the like.
The existing server immersion type heat dissipation technology is only suitable for the ground data center environment, and is unsuitable for direct airborne application because the environment conditions on an airborne platform are harsh and the design requirements of an airborne comprehensive modularized architecture are required to be met. Meanwhile, the requirements of integration level, heat consumption, junction temperature control and the like of components in the airborne module are considered, and a proper immersion type heat dissipation technology is selected. There are few domestic studies and designs of electronic modules that use direct contact single-phase submerged heat dissipation technology on board. The invention combines the design requirements of the existing airborne comprehensive modularized architecture to design a novel airborne single-phase immersion type.
On the one hand, through carrying out reasonable type selection and structural design to the structural feature of this heat dissipation test module, satisfy the requirement such as airborne modularization, quick maintainability, maintainability. Meanwhile, the single-phase immersion liquid cooling heat dissipation design is carried out on the functional devices in the high-integration-level high-power module, and the heat source layout, the coolant flow distribution and the pipeline design are optimized through calculation, so that the heat dissipation performance and the temperature control requirement of the device are met by adding the heat dissipation fins on the surfaces of part of the high-heat-flow-density devices. On the other hand, the cooling liquid in the module is reasonably and optimally designed for weight reduction, and plastic materials compatible with the fluoridized liquid are filled. Finally, a thermal simulation heat source heating body design based on a polyimide heating film is designed, and corresponding test interfaces such as thermocouples are designed, so that the thermal test requirement of the novel heat dissipation module is met.
In particular, compared to the prior art, the present invention requires an improved design from at least the following aspects:
1. the design requirements of the airborne comprehensive modularized architecture and the environment adaptability are met.
Because the on-board task electronic system is mainly characterized by integration and modularization, unlike the design type of directly loading a ground server into a full liquid cooling device, an immersed liquid cooling radiating electronic module structure conforming to a liquid cooling integrated rack configuration in an on-board use environment is designed. Meanwhile, the heat radiation test module meets the use requirements of airborne environments such as high and low temperature, high and low pressure, vibration impact, maintainability, reliability, safety, electromagnetic compatibility, corrosive mold salt fog and the like. There are differences in design requirements for coolant type selection, material compatibility, sealability, liquid connectors, and the like.
2. And the heat radiation test module is designed for single-phase immersion liquid cooling heat radiation and optimized design.
According to the actual heat dissipation and temperature control requirements, the single-phase immersed liquid cooling direct contact heat dissipation technology and the non-phase change heat dissipation technology are adopted. Through simulation analysis of heat dissipation performance such as the fluid state and the temperature distribution of the surface of the device in the heat dissipation test module, the heat source of the device in the real functional module is reasonably distributed, a polytetrafluoroethylene pipeline for flow distribution is designed in the module, and heat dissipation fins are designed above the surface of a part of high heat flux device, so that the heat exchange area is enhanced, the overall heat dissipation capacity is improved, and a better temperature control level is realized.
3. Thermal testing and heat source simulation design.
The invention simulates the actual heat consumption of a heat source in a functional module based on a polyimide heating film, and designs a corresponding test interface such as a thermocouple and the like for module-level heat test verification of direct contact with cooling liquid. All in-module material type selection designs meet the requirement of compatibility with cooling liquid.
4. And (5) weight reduction design.
In order to reduce the volume of cooling liquid and the weight of liquid in the whole module, a part of area is filled with plastic material compatible with fluoridized liquid and having smaller density under the condition of not influencing the heat dissipation of a circuit board and devices.
As shown in fig. 1 to 7, according to an embodiment of the present invention, an airborne immersive electronic heat dissipation test module 100, where the heat dissipation test module 100 is used for performing a simulated heat dissipation test of an airborne task electronic system, the heat dissipation test module 100 includes: a cartridge 10, a liquid connector 20 and a cover 30.
Wherein, a heat source heating body 111 for simulating electronic components is arranged in the box body 10, the heat source heating body 111 comprises a heating core and polyimide films positioned at two sides of the heating core, and the box body 10 is connected with the sealing cover 30 in a sealing way.
The liquid connector 20 is provided in the case 10 for communicating the inside of the case 10 with the external cooling liquid to cool the heat source/generator 111.
According to some embodiments of the present invention, as shown in fig. 6 and 7, a flow dividing line 120 connected to the liquid connector 20 is provided in the cartridge 10, the flow dividing line 120 is provided with a plurality of injection ports 121, and the cooling liquid flowing into the flow dividing line 120 through the liquid connector 20 is injected through the plurality of injection ports 121.
As shown in fig. 5 to 7, one of the two liquid connectors 20 of the communication case 10 is a cooling liquid inlet end, and the other is a cooling liquid outlet end. The split line 120 communicates with the liquid connector 20 at the coolant inlet end.
Thus, the cooling liquid flows into the diversion pipeline 120 through the liquid connector 20 at the inlet end of the cooling liquid, and is ejected through the plurality of ejection openings 121, so as to cool the heat source heating body 111, and improve the cooling effect of the heat source heating body 111.
In some embodiments of the present invention, the outer surface of the heat source heat generator 111 is provided with an aluminum block, the size of which is the same as the size of the electronic component to be simulated. Therefore, the authenticity and the reliability of the heat dissipation simulation of the onboard task electronic system can be improved. As shown in fig. 6, a metal block 180 is disposed on the PCB 110, and the metal block 180 may be an aluminum alloy block or an indium sheet, which is used for simulating a real electronic component.
According to some embodiments of the present invention, as shown in fig. 6, at least part of the heat source heat-generating body 111 is provided with a heat radiation fin 130. That is, the heat radiation fins 130 may be provided in all the heat source heat generators 111, or the heat radiation fins 130 may be provided only in a position where a part of the heat source heat generators 111 generates a large amount of heat, and the heat radiation effect of the heat source heat generators 111 may be improved by providing the heat radiation fins 130.
In some embodiments of the present invention, as shown in fig. 4, one of the side panels of the case 10 is provided with a plug-in device 170 for assisting in mounting and dismounting the heat dissipation test module 100. Thus, the heat dissipation test module 100 may be conveniently mounted and dismounted by providing the plugging device 170, for example, the plugging device 170 may be a handle.
In some embodiments of the invention, as shown in fig. 2, one of the end faces of the cartridge 10 is provided with a plurality of identical output openings 160 and with locating guide pins 140 for guiding alignment. By providing the positioning guide pins 140, guiding and positioning can be performed when the test module is assembled and connected, so that the heat dissipation test module 100 can be conveniently installed and connected.
According to some embodiments of the present invention, as shown in fig. 3 and 5, locking mechanisms 150 are provided on both opposing side panels of the box 10 for securing the heat dissipation test module 100 to the integrated chassis slot. Thus, by providing the locking mechanism 150, the heat dissipation test module 100 can be stably and firmly fixed to the integrated chassis slot.
In some embodiments of the present invention, as shown in fig. 1 and 5, the case 10 and the cover 30 are sealingly connected by a sealing gasket and a plurality of cross-grooved countersunk screws. Thereby, the sealability between the case 10 and the cover 30 can be ensured.
According to some embodiments of the present invention, none of the plurality of cross-slot countersunk screws protrude from the outer surfaces of the cover 30 and/or the case 10, that is, none of the plurality of cross-slot countersunk screws protrude from the outer surfaces of the cover 30 and the case 10, and are coated with an anti-loose adhesive. This can improve the sealing effect between the cover 30 and the case 10.
In some embodiments of the present invention, as shown in fig. 12, at least part of the heat source heat-generating body 111 is provided with a temperature measuring point. It can be appreciated that by setting the temperature measuring point, the heat dissipation effect of the heat dissipation test module 100 is conveniently tested.
According to some embodiments of the present invention, as shown in fig. 7, the case 10 is filled with a plastic filler 40 compatible with a cooling liquid. As used herein, "compatible" is understood to mean that the plastic filler piece 40 does not react with the coolant piece, and that the coolant does not corrode the plastic filler piece 40. The plastic filling member 40 is a plastic filling member 40 with a small density, so as to reduce the overall weight of the heat dissipation test module 100.
The invention develops the novel airborne immersed electronic heat radiation test module 100 meeting the airborne comprehensive modularized architecture for the first time, solves the problem of single-phase immersed heat radiation performance heat design of the high-power and high-integration electronic module, and optimizes the design of the polytetrafluoroethylene shunt pipeline 120 and the flow distribution and heat radiation fins 130 through the simulation analysis result. In addition, the invention reasonably designs the internal structure of the heat radiation test module 100, adopts a heat source simulation design based on a PI heating film heating body, and reduces the whole weight of the heat radiation test module 100 through the plastic filling piece 40.
The airborne immersive electronic heat dissipation test module 100 in accordance with the present invention is described in detail below with reference to the accompanying drawings. It is to be understood that the following description is exemplary only and is not to be taken as limiting the invention in any way.
As shown in fig. 1 to 7, the immersion heat dissipation testing module 100 according to the present invention adopts a fully-enclosed box 10, and the external components mainly comprise a main structure of the box 10, a cover 30, a locking mechanism 150, a plugging device 170, a TSF self-sealing liquid connector 20, a positioning guide pin 140, a testing wire output port 160 end, and a screw seal.
The immersion heat dissipation test module 100 has an external dimension of 50.8mm (width) × 242.49mm (height) ×
400mm (deep) without self-sealing joints, locating guide pins 140 and test outlet ends.
As shown in fig. 4, two plugging devices 170 are arranged on the front panel of the immersive heat dissipation test module 100, and as shown in fig. 3, two locking mechanisms 150 are installed on two sides of the box body 10. Considering the use of the immersive heat dissipation test module 100 of the present invention as a thermal test, a unified thermal test power supply and signal line screw-sealed output port end, i.e., output port 160 shown in fig. 2, is designed to replace the actual functional module back-end hermetic electrical connector. The end face has a total of 16 outlets 160. Meanwhile, the phi 6 positioning guide pins 140 are designed to replace the guide recognition pins on the electric connector, so that the insertion and extraction guide and alignment of the heat dissipation test module 100 are facilitated.
The plugging device 170, the locking mechanism 150 and the self-sealing liquid connector 20 in the immersive heat dissipation testing module 100 respectively play roles of quick power-assisted mounting and dismounting, fixing the locking module on a comprehensive rack slot, realizing leak-free interconnection and blind plugging of cooling liquid between liquid in the module and an external system, and respectively selecting standard QB-SEM-03-Z, QB-SEM-03-Y, XS F-282.2-H, TSFX-5T01MAlJM01 model.
As shown in fig. 1, the cooling liquid tightness design of the immersion heat dissipation testing module 100 tightly presses and fixes the cover plate and the sealing gasket on the main body structure of the closed box body 10 through 40M 5 cross-groove countersunk screws. All countersunk screws do not exceed the outer outline dimension of the module box body 10, and are smeared with anti-loose glue for fastening.
The invention is based on the single-phase immersion type heat radiation technology principle, and analyzes the heat radiation performance of components arranged in the functional module, and the specific heat source distribution, area and heat consumption are shown in figure 5. The total power consumption of the immersive heat dissipation test module 100 is designed to be 500W. Wherein, the heating electronic components are arranged on both sides of the PCB 110.
In order to meet the requirements of high and low temperature, insulation, colorless and transparent, low viscosity, nonflammability, difficult thermal decomposition, good compatibility and the like of the vehicle, the cooling liquid adopts FC40 fluorinated liquid of 3M company.
As shown in fig. 8-10, thermal simulation analysis is performed on the immersion type heat dissipation test module 100 according to the present invention: the inlet temperature of the fluoridation solution is set to 55 ℃ and the flow is set to 4L/min. The main body structure of the box body 10 is made of 6063 aluminum alloy metal material, and the heat conductivity coefficient is 202W/m.K. The PCB thermal conductivity was set to 0.173W/m.K, isotropy.
As shown in fig. 7, in order to ensure a better heat dissipation effect, polytetrafluoroethylene split-flow pipelines 120 are additionally designed, and cooling liquid injection ports 121 which are uniformly distributed and arranged in the split-flow pipelines 120 are distributed for flow distribution. Meanwhile, the heat radiating fins 130 are additionally designed on the surface of part of the high heat flux heat source heating body 111 so as to enhance the heat exchange area and realize a better temperature control level. The thermal contact resistance between the heat dissipation fin 130 and the chip is set to 82W/m.K.
The results of the thermal simulation analysis are shown in fig. 8-10. It can be seen that the pressure drop at the coolant inlet and outlet is 10.26kPa, and the temperature difference at the coolant inlet and outlet is 3.9 ℃. The highest temperature of the surface of the component is 89.3 ℃ and less than 95 ℃, thereby meeting the temperature control requirement of the component.
The present invention adopts PI heating film heater design for the simulation of heat source distributed in the module in fig. 5, as shown in fig. 11. The section structure of the PI heating membrane main body is sequentially a polyimide film with the thickness of 0.08mm, a heating core with the thickness of 0.05mm and a polyimide film with the thickness of 0.08mm, and the total thickness is designed to be 0.22mm. The application temperature of the heating film is between-40 ℃ and 120 ℃, the temperature resistance can reach 150 ℃ in a short time, and the heating film can be maintained for 2 hours.
An aluminum block with the thickness of 4mm is designed above the heating film to be closely attached to the heating body, and the size is the same as the actual size of the device. The thermocouple temperature measuring point is arranged on the upper surface of the aluminum block and the lower surface of the radiating fin 130. The 6 sets of temperature measurement points are approximately distributed as shown in fig. 12. All thermocouple testing cables and other materials meet the requirements of temperature resistance, heat insulation, flame retardance, pressure resistance and compatibility with fluoridized liquid, and are output from the rear end face of the module in a unified way, and the module is sealed by threads.
As shown in fig. 6 and 7, the internal structural features of the immersion heat dissipation test module 100 mainly comprise a PCB board 110, a PI heating film heater, four groups of heat dissipation fins 130, five groups of aluminum alloy blocks and indium sheets, a polytetrafluoroethylene shunt pipeline 120, a shunt port, a plastic filling member 40, a fluorinated solution and the like.
The polytetrafluoroethylene shunt pipeline 120 is provided with a plurality of uniformly distributed cooling liquid injection ports 121, which play a role in flow distribution. The shunt pipeline 120 is fixed on the inner side surface of the box body 10 structure through a transition structural member. The PI heating film heater, the plastic filling piece 40 and the radiating fins 130 are connected through screws and fixed on the rib column at the bottom of the box body 10 structure.
To reduce the volume of coolant, the plastic filler 40 is hollow polypropylene PP plastic, thereby reducing the weight of the immersive heat sink test module 100.
In summary, the invention develops the novel airborne immersion type electronic heat radiation test module 100 meeting the airborne comprehensive modularized architecture for the first time, solves the problem of single-phase immersion type heat radiation performance heat design of the high-power and high-integration electronic module, and optimizes the design of the polytetrafluoroethylene shunt pipeline 120, the flow distribution and the heat radiation fins 130 through the simulation analysis result. In addition, the invention reasonably designs the internal structure of the heat radiation test module 100, adopts a heat source simulation design based on a PI heating film heating body, and reduces the whole weight of the heat radiation test module 100 through the plastic filling piece 40.
While the invention has been described in connection with specific embodiments thereof, it is to be understood that these drawings are included in the spirit and scope of the invention, it is not to be limited thereto.
Claims (9)
1. An airborne immersive electronic heat dissipation test module, wherein the heat dissipation test module is used for performing a simulated heat dissipation test of an airborne task electronic system, the heat dissipation test module comprising:
the heat source heating body used for simulating the heating effect of the electronic component is distributed in the box body and comprises a heating core and polyimide films positioned on two sides of the heating core;
the liquid connector is arranged in the box body and used for communicating the box body with external cooling liquid so as to cool the heat source heating body;
the box body is hermetically connected with the sealing cover;
the box body is internally provided with a diversion pipeline connected with the liquid connector, the diversion pipeline is provided with a plurality of jet ports, and the cooling liquid flowing into the diversion pipeline through the liquid connector is jetted out through the jet ports.
2. The airborne immersive electronic heat dissipation test module of claim 1, wherein an outer surface of the heat source heat generation body is provided with an aluminum block having a size identical to a size of the electronic component being simulated.
3. The on-board immersive electronic heat dissipation test module of claim 1, wherein at least a portion of the heat source heat generation bodies are provided with heat dissipation fins.
4. The airborne immersive electronic heat dissipation test module of claim 1, wherein one of the side faces of the cartridge is provided with a plurality of identical output openings and with positioning guide pins for guiding alignment.
5. The airborne immersive electronic heat dissipation test module of claim 1, wherein a locking mechanism for securing the heat dissipation test module to an integrated rack slot is provided on both opposing side panels of the box.
6. The on-board immersive electronic heat sink test module of claim 1, wherein the box and the cover are sealingly connected by a sealing gasket and a plurality of cross-slot countersunk screws.
7. The on-board immersion electronic heat dissipation test module of claim 6, wherein none of the plurality of cross-slot countersunk head screws protrude from an outer surface of the cover and/or the box and are coated with an anti-loose glue for fastening.
8. The on-board immersive electronic heat sink test module of claim 1, wherein at least a portion of the heat source heat generation body is provided with a temperature measurement point.
9. The on-board immersive electronic heat sink test module of any of claims 1-8, wherein the cartridge is filled with a plastic filler compatible with the cooling fluid.
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