CN115727937A - Method, device and system for measuring mechanical vibration parameters - Google Patents
Method, device and system for measuring mechanical vibration parameters Download PDFInfo
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Abstract
The invention discloses a method, a device and a system for measuring mechanical vibration parameters, which relate to the technical field of mechanical vibration measurement and comprise the following steps: collecting optical signals of a vibration area of a measuring object; converting the collected optical signals into electric signal data and storing the electric signal data; extracting and storing electrical signal data corresponding to a specific edge region of the measuring object from the stored electrical signal data; extracting time and position parameters of the specific edge region of the measuring object from the electric signal data corresponding to the specific edge region of the measuring object; and calculating the vibration parameters of the measuring object according to the time and position parameters of the specific edge area of the measuring object. The measuring system comprises a light source, an imaging objective lens, a linear CCD (charge coupled device), a semi-reflecting and semi-transmitting mirror, an area array image sensor, a virtual oscilloscope, a data processor, a reflected light processing display and transmitted light. The invention is provided with the area array image sensor and the linear CCD combined structure, thereby improving the resolution and realizing high-efficiency product detection.
Description
Technical Field
The invention relates to the technical field of mechanical vibration measurement, in particular to a method, a device and a system for measuring mechanical vibration parameters.
Background
Mechanical vibration refers to the regular reciprocating motion of an object or particle near its equilibrium position. The intensity of the vibration is measured by the vibration quantity, which can be the displacement, speed or acceleration of the vibrator. If the vibration quantity exceeds the allowable range, the mechanical equipment generates large dynamic load and noise, thereby affecting the working performance and the service life of the mechanical equipment, and in severe cases, the mechanical equipment can cause early failure of parts. Most of the existing methods for measuring mechanical vibration parameters adopt ultrasonic assistance, or use a laser beam to project to a high-resolution linear CCD or a high-speed camera, and both methods are expensive, and most of the existing vibration measuring devices have the problem of low precision, so that the popularization of the vibration measuring devices or methods is not facilitated.
Chinese patent CN102928065A discloses a non-contact mechanical vibration frequency measurement method, which comprises a frequency pulse converter VF, an infrared transmitting tube K, an infrared receiving tube F and a frequency measurement circuit C. The invention is used for the non-contact on-line measurement of the mechanical vibration frequency in the power generation industry, and can complete the measurement and the recording of the mechanical vibration frequency under the non-contact condition. However, the infrared ray is adopted to receive and transmit corresponding signals, so that a required measuring object cannot be aligned and focused effectively at the same time, and the measuring accuracy is not high.
Chinese patent CN103364068A discloses a vibration measuring device and method, which uses a vibration sensing unit to sense the vibration state, and emits a light beam emitted by a light source emitter, uses an acquisition unit to acquire the light beam reflected by the vibration sensing unit, and converts the acquired optical signal into an electrical signal, and obtains the vibration direction and amplitude according to the electrical signal corresponding to the reflected light beam. When vibration is transmitted, the vibration sensing unit generates corresponding deformation, the reflected light beam also generates corresponding displacement, and the vibration direction and the amplitude are judged according to the displacement change of the reflected light beam. When the vibration induction unit produces small deformation because of the vibration that senses, the light beam that reflects away will produce great displacement variation, is equivalent to and enlargies the vibration condition that the vibration induction unit sensed to the realization is to the collection of vibration condition. However, the displacement variation is measured by the reflected light beams, so that large errors are easily generated, and the accuracy is not good to grasp.
Disclosure of Invention
In order to solve the technical problem, the invention provides a method, a device and a system for measuring mechanical vibration parameters.
In order to achieve the purpose, the technical scheme adopted by the invention is as follows:
a method for measuring mechanical vibration parameters comprises the following steps:
step S1: collecting optical signals of a vibration area of a measuring object;
step S2: converting the collected optical signals into electric signal data and storing the electric signal data;
and step S3: extracting and storing electrical signal data corresponding to a specific edge region of the measurement object from the stored electrical signal data;
and step S4: extracting time and position parameters of the specific edge area of the measuring object from the electric signal data corresponding to the specific edge area of the measuring object;
step S5: and calculating the vibration parameters of the measuring object according to the time and position parameters of the specific edge area of the measuring object.
Based on the above technical solution, further, the step S1 includes sequentially collecting the optical signals at different positions in the specific edge region at the same time interval along a direction parallel to the vibration of the measurement object; acquiring light intensity signals of different acquisition points in corresponding acquisition time in one acquisition cycle, namely P1 (S1, T1, Q1), P1 (S2, T2, Q2) \8230andP 1 (Sn, tn, qn), wherein P1 represents the 1 st acquisition cycle, sn represents the n-th acquired point, tn represents the time of the n-th acquired point, and Qn represents the light intensity of the n-th acquired point; the specific edge area includes at least the entire area covered by the vibration of the measurement object.
Based on the above technical solution, further, step S1 further includes: and (2) repeating the operation m times by using the same acquisition point according to the step 1, and acquiring optical signals of each acquisition point in a certain time period at corresponding acquisition time, namely P1 (S1, T1, Q1), P1 (S2, T2, Q2) \8230, P1 (Sn, tn, qn), P2 (S1, T1, Q1), P2 (S2, T2, Q2) \8230, P2 (Sn, tn, qn) \8230, pm (S1, T1, Q1), pm (S2, T2, Q2) 8230, pm (Sn, tn, qn), wherein Pm represents an mth acquisition period.
Based on the above technical solution, further, step S2 includes converting the obtained optical signal into an electrical signal to obtain P1 (S1, T1, D1), P1 (S2, T2, D2) \8230, P1 (Sn, tn, dn), P2 (S1, T1, D1), P2 (S2, T2, D2) \8230, P2 (Sn, tn, dn) \8230, pm (S1, T1, D1), pm (S2, T2, D2) \8230, pm (Sn, tn, dn), where Dn represents an electrical signal of an nth point.
Based on the above technical solution, further, step S3 includes comparing intensity changes of the electrical signals of adjacent collection points in each collection period to select an electrical signal intensity discontinuity point; the method comprises the steps of obtaining data of a mutation point of each acquisition cycle in a period of time, namely P1 (Sx 1, tx1, dx 1), P2 (Sx 2, tx2, dx 2) \ 8230and Pm (Sxm, txm, dxm).
Based on the above technical solution, further, step S4 includes obtaining a position parameter of an acquisition point where an edge of the measurement object is located in each acquisition cycle within a period of time and an acquisition time parameter, that is, P1 (Sx 1, tx 1), P2 (Sx 2, tx 2) \ 8230; pm (Sxm, txm).
Based on the above technical solution, further, step S5 includes establishing a vibration curve of the acquisition point where the edge of the measurement object is located, that is, a vibration curve graph of the measurement object, according to the position parameter and the acquisition time parameter of the acquisition point where the edge of the measurement object is located.
Based on the above technical solution, further, step S5 further includes extracting vibration parameters at least including amplitude and frequency from the vibration curve graph.
Based on the above technical solution, further, the method further includes performing error correction on the extracted parameters at least including the amplitude and the frequency of the measurement object according to the error between the extracted parameters and the real parameters in the vibration curve graph.
A measuring device for mechanical vibration parameters comprises a light source, an imaging objective lens, a linear CCD, a semi-reflecting and semi-transmitting mirror and an area array image sensor;
the light beam emitted from the light source is sequentially incident to the lens, the imaging objective lens and the half-reflecting and half-transmitting lens along the direction of the optical axis;
part of light beams penetrate through the semi-reflecting and semi-transmitting lens, and incident light beam signals are collected by the area array image sensor;
part of the light beams are reflected by the semi-reflecting and semi-transmitting mirror, and incident light beam signals are collected by the linear CCD.
The system for measuring the mechanical vibration parameters further comprises a virtual oscilloscope, a data processor, a reflected light processing display and a transmitted light which are in external communication connection, wherein the linear CCD is in communication connection with the virtual oscilloscope, the data processor and the reflected light processing display in sequence, and the area array image sensor is in communication connection with the transmitted light processing display.
Based on the technical scheme, furthermore, the transflective mirror is intersected with the optical axis, and the intersected included angle is 45 degrees.
Based on the above technical solution, further, the vibration area is an area identified and displayed by the area array image sensor.
Compared with the prior art, the invention has the following beneficial effects:
the invention is provided with the area array image sensor and the linear CCD combined structure, and can conveniently align and focus the object to be measured at the same time; the data collected by the low-resolution CCD is processed by adopting a thinning algorithm, so that the resolution is improved by more than 4 times; meanwhile, the device can be flexibly integrated into a test fixture on a production line, and high-efficiency product detection is realized.
Drawings
FIG. 1 is a flow chart of a measurement method of the present invention;
FIG. 2 is a diagram of the operation trace of the measurement method of the present invention;
FIG. 3 is a structural view of a measuring system according to embodiment 2 of the present invention;
FIG. 4 is a graph of the amplitude curve measured in example 3 of the present invention;
reference numerals: 1. a light source; 2. a lens; 3. a measurement object; 4. an imaging objective lens; 5. a half-reflecting and half-transmitting mirror; 6. an area array image sensor; 7. a linear CCD.
Detailed Description
In order to make the purpose and technical solution of the present invention clearer, the following will clearly and completely describe the technical solution of the present invention with reference to the embodiments.
It is to be understood that the terms "center," "upper," "lower," "horizontal," "left," "right," "front," "rear," "lateral," "longitudinal," and the like are used in the illustrated orientation or positional relationship as shown in the drawings for ease of description and simplicity of description, and do not indicate or imply that the referenced device or element must have a particular orientation, be constructed and operated in a particular orientation, and are therefore not to be considered limiting.
Example 1
A method for measuring a mechanical vibration parameter as shown in fig. 1 and 2, comprising the steps of:
step S1: collecting optical signals of a vibration area of a measuring object;
specifically, optical signals at different positions in a certain area are sequentially collected at the same time interval along the direction parallel to the vibration of the measuring object; light intensity signals of different acquisition points in corresponding acquisition time in one acquisition period, namely P1 (S1, T1, Q1), P1 (S2, T2, Q2) \8230andP 1 (Sn, tn, qn) are acquired; wherein, P1 represents the 1 st acquisition cycle of the linear CCD, sn represents the nth point of acquisition, tn represents the time of the nth point of acquisition, and Qn represents the light intensity of the nth point of acquisition; the specific edge area includes at least the entire area covered by the vibration of the measurement object.
And the step S1 further comprises: and (2) repeating the operation m times by using the same acquisition point according to the step 1, and acquiring optical signals of each acquisition point in a certain time period at corresponding acquisition time, namely P1 (S1, T1, Q1), P1 (S2, T2, Q2) \8230, P1 (Sn, tn, qn), P2 (S1, T1, Q1), P2 (S2, T2, Q2) \8230, P2 (Sn, tn, qn) \8230, pm (S1, T1, Q1), pm (S2, T2, Q2) 8230, pm (Sn, tn, qn), wherein Pm represents an mth acquisition period.
Step S2: converting the collected optical signals into electric signal data and storing the electric signal data;
specifically, the step S2 includes converting the acquired optical signal into an electrical signal by using a linear CCD, and obtaining P1 (S1, T1, D1), P1 (S2, T2, D2) \8230, P1 (Sn, tn, dn), P2 (S1, T1, D1), P2 (S2, T2, D2) \8230, P2 (Sn, tn, dn) \8230pm (S1, T1, D1), pm (S2, T2, D2) \8230pm (Sn, tn, dn), where Dn represents an electrical signal of an nth point.
And step S3: extracting and storing electrical signal data corresponding to a specific edge region of the measurement object from the stored electrical signal data;
specifically, the step S3 includes comparing intensity changes of the electrical signals of adjacent collection points in each collection period, and selecting an electrical signal intensity discontinuity point; and acquiring data of the mutation point of each acquisition period in a period of time, namely P1 (Sx 1, tx1, dx 1), P2 (Sx 2, tx2, dx 2) \ 8230Pm (Sxm, txm, dxm).
And step S4: extracting time and position parameters of the specific edge region of the measuring object from the electric signal data corresponding to the specific edge region of the measuring object;
specifically, the step S4 includes acquiring acquisition point position parameters and acquisition time parameters, namely P1 (Sx 1, tx 1), P2 (Sx 2, tx 2) \ 8230, pm (Sxm, txm), where the edge of the measurement object is located in each acquisition period in a period of time.
Step S5: and calculating the vibration parameters of the measuring object according to the time and position parameters of the specific edge area of the measuring object.
Specifically, the step S5 includes establishing a vibration curve of the acquisition point at which the edge of the measurement object is located according to the position parameter and the acquisition time parameter of the acquisition point at which the edge of the measurement object is located, that is, fitting the acquired parameters to obtain a vibration curve graph of the measurement object through a virtual oscilloscope, extracting vibration parameters at least including amplitude and frequency from the vibration curve graph, and performing error correction on the extracted parameters at least including the amplitude and frequency of the measurement object according to an error between the extracted parameters and real parameters in the vibration curve graph.
For example, when the measurement object vibrates up and down at a certain frequency, the linear CCD sequentially collects optical signals of respective points from top to bottom in a direction parallel to the vibration direction of the measurement object. The linear CCD acquisition frequency is not less than 4 times of the vibration frequency of the measurement object, and the linear CCD acquisition frequency is 5kHz. The linear CCD sequentially collects 5 times within one vibration period of the measurement object, thereby obtaining 5 sets of collected signals, wherein the vibration period is set to 0.001s.
For each data acquired by the linear CCD, n points are acquired from top to bottom, for example, n is 128, for example, for the 1 st group of data acquired by the linear CCD, the optical signal of the 1 st point can be: p1 (S1, T1, Q1), the optical signal at point 2 can be: p1 (S2, T2, Q2), the optical signal at point n can be calculated as: p1 (Sn, tn, qn). Wherein, P1 represents the 1 st acquisition cycle of the linear CCD, sn represents the nth point of acquisition, tn represents the time of the nth point of acquisition, and Qn represents the light intensity of the nth point of acquisition. Therefore, all data obtained by the linear CCD in the 1 st acquisition period are obtained: p1 (S1, T1, Q1), P1 (S2, T2, Q2) \8230andP 1 (Sn, tn, qn). For the light intensity Q of different collection points, when the light intensity Q does not reach the measuring object, the light of the light source is not blocked by the measuring object, the collected light intensity is larger, and when the light reaches the measuring object, the light irradiated from the light source is blocked by the measuring object, the light intensity is smaller. Therefore, the light intensity abruptly changes for several acquisition points at the edge of the measurement object. For example, P1 (Sx 1, tx1, qx 1) is the light intensity discontinuity, and thus the location Sx1 corresponding to this point is determined to be where the edge of the measurement object arrives at the time of Tx 1. Therefore, in each CCD acquisition period, the position and time of the edge of the measured object can be determined by the sudden change of the light intensity.
The linear CCD finishes the 1 st acquisition cycle to enter the 2 nd acquisition cycle, the copper 1 st acquisition cycle is the same, finish the 2 nd acquisition cycle, then the 2 nd acquisition cycle's that obtains data: p2 (S1, T1, Q1), P2 (S2, T2, Q2) \ 8230and P2 (Sn, tn, qn). All the data obtained at this time were P1 (S1, T1, Q1), P1 (S2, T2, Q2) \8230p1 (Sn, tn, qn), P2 (S1, T1, Q1), P2 (S2, T2, Q2) \8230p2 (Sn, tn, qn).
Similarly, when m acquisition cycles are completed, all the acquired data are P1 (S1, T1, Q1), P1 (S2, T2, Q2) \8230, P1 (Sn, tn, qn), P2 (S1, T1, Q1), P2 (S2, T2, Q2) \8230, P2 (Sn, tn, qn) \8230, pm (S1, T1, Q1), pm (S2, T2, Q2) \8230andPm (Sn, tn, qn).
In order to facilitate the processing of the data, the linear CDD converts the optical signals into electrical signals, i.e., Q in the data is converted into D, thereby obtaining electrical signals P1 (S1, T1, D1), P1 (S2, T2, D2) \8230, P1 (Sn, tn, dn), P2 (S1, T1, D1), P2 (S2, T2, D2) \30, P2 (Sn, tn, D n) \8230, pm (S1, T1, D1), pm (S2, T2, D2) \8230, pm (Sn, tn, D n). These data can be converted to a waveform map by a virtual oscilloscope.
The abrupt change points of the light intensity and the electrical signal are in one-to-one correspondence, and the abrupt change points in each CDD acquisition period, namely P1 (Sx 1, tx1, dx 1), P2 (Sx 2, tx2, dx 2) \ 8230, pm (Sxm, txm, D xm) can be obtained from the electrical signal in the period of time. These data can be converted to a waveform map by a virtual oscilloscope.
Further extracting the position of the acquisition point where the edge of the object is located and the acquisition time parameters, namely P1 (Sx 1, tx 1), P2 (Sx 2, tx 2) \ 8230, pm (Sxm, txm,) in each acquisition period. That is, these points represent the edge points on the measurement object, the vibration positions (Sx 1, sx2, \8230; sxm) of which are located at different times (Tx 1, tx2 \8230; txm). So that a vibration curve of the measurement object can be established therefrom. From the obtained vibration curve, vibration parameters can be extracted: amplitude and frequency, etc.
Because the measured position data (Sx 1, sx2, \8230; sxm) may have a certain error with the real vibration amplitude, the relation between the measured position data (Sx 1, sx2, \8230; sxm) and the real vibration amplitude can be obtained by measuring a measurement object with known amplitude and frequency, and then the measured position data (Sx 1, sx2, \8230; sxm) is converted into real data.
Example 2
The system for measuring the mechanical vibration parameters shown in fig. 3 comprises a measuring device, wherein the measuring device comprises a light source, a lens, a measuring object, an imaging objective lens, a linear CCD (charge coupled device), a semi-reflecting and semi-transmitting mirror and an area array image sensor, and the measuring system comprises a virtual oscilloscope, a data processor, a display and a workbench which are in external communication connection; light beams emitted from the light source sequentially enter the lens, the imaging objective lens and the half-reflecting and half-transmitting lens along the direction of an optical axis; part of light beams penetrate through the semi-reflecting and semi-transmitting lens, and incident light beam signals are collected by the area array image sensor; part of light beams are reflected by the semi-reflecting and semi-transmitting mirror, and incident light beam signals are collected by the linear CCD; the display and the virtual oscilloscope are respectively in communication connection with the linear CCD, and the data processor is in communication connection with the virtual oscilloscope. The semi-reflecting and semi-transmitting lens is obliquely arranged, specifically, the semi-reflecting and semi-transmitting lens is intersected with an optical axis, the intersection included angle is 45 degrees, and a high-brightness LED light source can be selected as the light source. The high brightness LED light source provides illumination for the measurement system because the illumination brightness needs to be high enough to keep the linear CCD integration period below 0.1ms and the equivalent scan frequency above 10kHz. I.e. mechanical vibrations with a sampling frequency higher than 10kHz and measurable at the highest above 2 kHz.
An LED light source, a lens, a measuring object, an imaging objective lens, a linear CCD, a half-reflecting and half-transmitting mirror and an area array image sensor are arranged on the workbench; the LED light source can be connected with the workbench through the height adjusting device, and the vertical position of the light source can be adjusted. The measuring object is placed on the test object clamping table, and the test object clamping table is connected with the workbench through the position adjusting device, so that the position adjustment in multiple directions of the upper, lower, left, right, front and back is realized. The linear CCD, the semi-reflecting and semi-transmitting mirror and the area array image sensor are integrated into an optical signal acquisition device, and are connected with the workbench through a height adjusting device, so that the vertical position can be adjusted. The imaging objective lens is used for imaging a required measuring object; the light beam passes through an imaging objective lens and a 45-degree half-reflecting and half-transmitting lens to be imaged to a low-resolution linear CCD (charge coupled device), and a required measuring object is scanned; the image is imaged to an area array image sensor through an imaging objective lens and a 45-degree half-reflecting and half-transmitting lens, and the video is output to a video display to help a user aim and focus a required measuring object.
The high-brightness LED light source, the imaging objective lens and the area array image sensor are coaxial, the light beam track received by the linear CCD is perpendicular to the incident light beam track received by the imaging objective lens, and the semi-reflecting and semi-transmitting lens respectively forms an included angle of 45 degrees and is equidistant with the linear CCD and the area array image sensor, so that the linear CCD and the area array image sensor simultaneously receive the light signal imaged by the measuring object. The display displays the imaging signals acquired by the area array image sensor in real time so as to help a user to aim and focus a required measuring object. The virtual oscilloscope is used for collecting and storing the linear CCD scanning output data. And the data processor is used for reading the data stored in the virtual oscilloscope, reading the edge of the object to be measured, converting the edge into corresponding vibration displacement and calculating the vibration amplitude and frequency.
The measurement principle of the device is as follows:
firstly, fixing a measuring object on a test object holding table, and adjusting the position of the holding table to ensure that the object to be measured and the vibration range thereof are in the range covered by the parallel light of the light source on one hand, so that the imaging of the edge area of the object to be measured is received by a linear CCD (charge coupled device) and an area array image sensor. When the parallel light irradiates the measuring object, the measuring object is shielded, the area outside the measuring object is passed by the parallel light, if a receiving screen is placed behind, the blocked object forms a black shadow, and the place where the black and white are connected is the edge of the object. The amplitude of the vibration in the vibration direction at any point at the edge is the same.
On the other hand, the distance between the object to be measured and the imaging objective lens is adjusted, so that the imaging signal displayed by the video screen display is clear. Because the half-reflecting and half-transmitting mirror forms 45-degree included angles and equal distances with the linear CCD and the area array image sensor respectively, the clear imaging signals displayed by the video screen display also mean that the imaging signals acquired by the linear CCD are also clear, and the data processor is favorable for reading the edge data of a measured object in the analysis process, namely searching for a mutation point. See in particular the clear image of the video display shown in fig. 3.
Due to the existence of the half-reflecting and half-transmitting mirror, the linear CCD can acquire optical signals of a plurality of points which are sequentially arranged along the vibration direction, and the acquisition points comprise at least one point positioned at the edge of an object to be detected. If the collecting point is positioned on the object to be measured, the light intensity signal is 0 or close to 0 or very weak because the light rays are blocked, if the collecting point is positioned outside the object to be measured, the light rays of the light source are received, and the light intensity signal is stronger. The edge point is from the collection point with strong light intensity to the point or points where the light intensity signal is suddenly changed into weak light intensity. And in the vibration process of the object to be detected, multiple times of acquisition are carried out at the same initial acquisition position, and the acquisition time is the same each time. The light intensity variation parameter of the fixed space region in a certain time is obtained. And if the light intensity change catastrophe point is screened, screening the edge point, thereby obtaining the sequence number of the acquisition point where the edge point is located or the spatial position where the acquisition point is located along with the change of time.
Example 3
With reference to fig. 4 and embodiment 2, another method for measuring mechanical vibration parameters can be implemented, which includes the following steps:
step S1: placing the measurement object between a light source and an imaging objective lens; specifically, the imaging objective lens receives a parallel light source which is vertically incident to the vibration direction of the measurement object and covers the vibration area, and performs imaging processing on the received parallel light source; the vibration area is an area which is identified and displayed by the area array image sensor.
Step S2: collecting optical signals and converting the optical signals into electric signals; specifically, the linear CCD collects an optical signal subjected to imaging processing by the area array image sensor, converts the optical signal into an electrical signal, and displays the electrical signal in real time;
and step S3: acquiring an electric signal by using a virtual oscilloscope, and storing the acquired electric signal;
and step S4: extracting, from the stored data, electric signal data including at least a vibration edge region of the measurement object by an externally connected data processor based on the stored electric signal data; the vibration edge area is a partial edge area of the measuring object and an area to which the partial edge area of the measuring object vibrates; the illumination area of the light source at least covers the vibration edge area; the imaging range of the imaging objective at least comprises a partial edge area of the measuring object and an area to which the partial edge area of the measuring object vibrates.
Step S5: converting the electric signal data extracted in the step S4 into a motion signal of a specific area by using a data processor;
step S6: and calculating the amplitude and the frequency according to the preset scale relation between the position change and the actual displacement.
The above are merely embodiments of the present invention, which are described in detail and with particularity, and therefore should not be construed as limiting the scope of the invention. It should be noted that, for those skilled in the art, various changes and modifications can be made without departing from the spirit of the present invention, and these changes and modifications are within the scope of the present invention.
Claims (11)
1. A method for measuring mechanical vibration parameters is characterized by comprising the following steps:
step S1: collecting optical signals of a vibration area of a measuring object;
step S2: converting the collected optical signals into electric signal data and storing the electric signal data;
and step S3: extracting and storing electrical signal data corresponding to a specific edge region of the measurement object from the stored electrical signal data;
and step S4: extracting time and position parameters of the specific edge region of the measuring object from the electric signal data corresponding to the specific edge region of the measuring object;
step S5: and calculating the vibration parameters of the measuring object according to the time and position parameters of the specific edge area of the measuring object.
2. The method for measuring mechanical vibration parameters of claim 1, wherein the step S1 comprises sequentially collecting optical signals at different positions in a specific edge region at the same time interval along a direction parallel to the vibration of the measurement object; acquiring light intensity signals of different acquisition points in corresponding acquisition time in an acquisition period, namely P1 (S1, T1, Q1), P1 (S2, T2, Q2) \8230andP 1 (Sn, tn, qn), wherein P1 represents the 1 st acquisition period, sn represents the acquired nth point, tn represents the time of the acquired nth point, and Qn represents the light intensity of the acquired nth point; the specific edge area includes at least the entire area covered by the vibration of the measurement object.
3. The method for measuring mechanical vibration parameters of claim 2, wherein the step S1 further comprises: and (2) repeating the operation m times by using the same acquisition point according to the step 1, and acquiring optical signals of each acquisition point in a certain time period at corresponding acquisition time, namely P1 (S1, T1, Q1), P1 (S2, T2, Q2) \8230, P1 (Sn, tn, qn), P2 (S1, T1, Q1), P2 (S2, T2, Q2) \8230, P2 (Sn, tn, qn) \8230, pm (S1, T1, Q1), pm (S2, T2, Q2) 8230, pm (Sn, tn, qn), wherein Pm represents an mth acquisition period.
4. The method of claim 1, wherein the step S2 comprises converting the acquired optical signal into an electrical signal to obtain P1 (S1, T1, D1), P1 (S2, T2, D2) \8230, P1 (Sn, tn, dn), P2 (S1, T1, D1), P2 (S2, T2, D2) \8230, P2 (Sn, tn, dn) 8230, pm (S1, T1, D1), pm (S2, T2, D2) \8230, pm (Sn, tn, dn), where Pm represents an electrical signal at an nth point.
5. The method for measuring mechanical vibration parameters of claim 4, wherein step S3 comprises comparing the intensity variation of the electrical signal of adjacent collection points in each collection cycle to select the intensity discontinuity of the electrical signal; the method comprises the steps of obtaining data of a mutation point of each acquisition cycle in a period of time, namely P1 (Sx 1, tx1, dx 1), P2 (Sx 2, tx2, dx 2) \ 8230and Pm (Sxm, txm, dxm).
6. The method of claim 5, wherein step S4 comprises obtaining the position parameters of the acquisition points and the acquisition time parameters of the edges of the measurement object in each acquisition cycle during a period of time, i.e. P1 (Sx 1, tx 1), P2 (Sx 2, tx 2) \8230, pm (Sxm, txm).
7. The method according to claim 6, wherein the step S5 comprises establishing a vibration curve of the collection point where the edge of the measurement object is located, i.e. a vibration curve of the measurement object, according to the position parameter and the collection time parameter of the collection point where the edge of the measurement object is located.
8. The method for measuring mechanical vibration parameters of claim 7, wherein step S5 further comprises extracting vibration parameters at least comprising amplitude and frequency from the vibration curve graph.
9. The method according to claim 8, further comprising performing error correction on the extracted parameters at least including amplitude and frequency of the object to be measured according to the error between the extracted parameters and the real parameters in the vibration graph.
10. A measuring device of mechanical vibration parameters, which adopts the measuring method of mechanical vibration parameters of any one of claims 1 to 9, is characterized by comprising a light source, an imaging objective lens, a linear CCD, a half-reflecting and half-transmitting lens and an area array image sensor;
light beams emitted from the light source sequentially enter the lens, the imaging objective lens and the half-reflecting and half-transmitting lens along the direction of an optical axis;
part of light beams penetrate through the semi-reflecting and semi-transmitting lens, and incident light beam signals are collected by the area array image sensor;
part of the light beams are reflected by the semi-reflecting and semi-transmitting mirror, and incident light beam signals are collected by the linear CCD.
11. A measuring system of mechanical vibration parameters comprises the measuring device of claim 10, and is characterized by further comprising a virtual oscilloscope, a data processor, a reflected light processing display and transmitted light which are in external communication connection, wherein the linear CCD is in communication connection with the virtual oscilloscope, the data processor and the reflected light processing display in sequence, and the area array image sensor is in communication connection with the transmitted light processing display.
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