CN115716993B - Oriented high-heat-conductivity wave absorbing plate and preparation method thereof - Google Patents
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- 238000002360 preparation method Methods 0.000 title claims abstract description 29
- 229920000049 Carbon (fiber) Polymers 0.000 claims abstract description 57
- 239000004917 carbon fiber Substances 0.000 claims abstract description 57
- 239000000463 material Substances 0.000 claims abstract description 42
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 claims abstract description 38
- 230000005684 electric field Effects 0.000 claims abstract description 23
- 239000000945 filler Substances 0.000 claims abstract description 12
- 238000010008 shearing Methods 0.000 claims abstract description 11
- 239000006247 magnetic powder Substances 0.000 claims abstract description 6
- 239000002861 polymer material Substances 0.000 claims abstract description 4
- 239000002994 raw material Substances 0.000 claims abstract 2
- 238000001125 extrusion Methods 0.000 claims description 25
- 239000011248 coating agent Substances 0.000 claims description 19
- 238000000576 coating method Methods 0.000 claims description 19
- 229920002545 silicone oil Polymers 0.000 claims description 14
- 239000000843 powder Substances 0.000 claims description 13
- 239000000919 ceramic Substances 0.000 claims description 12
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 10
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims description 9
- 229920002554 vinyl polymer Polymers 0.000 claims description 9
- 238000000034 method Methods 0.000 claims description 7
- 238000002156 mixing Methods 0.000 claims description 7
- 239000011863 silicon-based powder Substances 0.000 claims description 7
- 239000011148 porous material Substances 0.000 claims description 6
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 5
- 229910052581 Si3N4 Inorganic materials 0.000 claims description 5
- 239000003054 catalyst Substances 0.000 claims description 5
- 229910052739 hydrogen Inorganic materials 0.000 claims description 5
- 239000001257 hydrogen Substances 0.000 claims description 5
- 125000004435 hydrogen atom Chemical class [H]* 0.000 claims description 5
- 239000012762 magnetic filler Substances 0.000 claims description 5
- 229910052697 platinum Inorganic materials 0.000 claims description 5
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims description 5
- 238000001291 vacuum drying Methods 0.000 claims description 5
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 claims description 4
- 238000004891 communication Methods 0.000 claims description 4
- 238000003825 pressing Methods 0.000 claims description 4
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims description 4
- 229910010271 silicon carbide Inorganic materials 0.000 claims description 4
- 229910052582 BN Inorganic materials 0.000 claims description 3
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 claims description 3
- 230000004888 barrier function Effects 0.000 claims description 3
- 239000000835 fiber Substances 0.000 claims description 3
- 230000003287 optical effect Effects 0.000 claims description 3
- 229910000859 α-Fe Inorganic materials 0.000 claims description 3
- 239000002131 composite material Substances 0.000 claims description 2
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 claims description 2
- 238000005520 cutting process Methods 0.000 claims description 2
- 238000007731 hot pressing Methods 0.000 claims description 2
- UQSXHKLRYXJYBZ-UHFFFAOYSA-N iron oxide Inorganic materials [Fe]=O UQSXHKLRYXJYBZ-UHFFFAOYSA-N 0.000 claims description 2
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 2
- NDLPOXTZKUMGOV-UHFFFAOYSA-N oxo(oxoferriooxy)iron hydrate Chemical compound O.O=[Fe]O[Fe]=O NDLPOXTZKUMGOV-UHFFFAOYSA-N 0.000 claims description 2
- 238000007493 shaping process Methods 0.000 claims description 2
- 230000002195 synergetic effect Effects 0.000 claims description 2
- 239000011787 zinc oxide Substances 0.000 claims description 2
- CSDREXVUYHZDNP-UHFFFAOYSA-N alumanylidynesilicon Chemical compound [Al].[Si] CSDREXVUYHZDNP-UHFFFAOYSA-N 0.000 claims 1
- 229920005570 flexible polymer Polymers 0.000 claims 1
- PEUPIGGLJVUNEU-UHFFFAOYSA-N nickel silicon Chemical compound [Si].[Ni] PEUPIGGLJVUNEU-UHFFFAOYSA-N 0.000 claims 1
- 239000012299 nitrogen atmosphere Substances 0.000 claims 1
- 239000011358 absorbing material Substances 0.000 abstract description 5
- 238000010521 absorption reaction Methods 0.000 abstract description 5
- 230000015556 catabolic process Effects 0.000 abstract description 5
- 230000009471 action Effects 0.000 abstract description 4
- 230000000694 effects Effects 0.000 abstract description 3
- 238000005524 ceramic coating Methods 0.000 abstract 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 4
- 229910002804 graphite Inorganic materials 0.000 description 4
- 239000010439 graphite Substances 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 3
- 229910000519 Ferrosilicon Inorganic materials 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 230000005670 electromagnetic radiation Effects 0.000 description 2
- 238000004100 electronic packaging Methods 0.000 description 2
- 238000001878 scanning electron micrograph Methods 0.000 description 2
- 241001391944 Commicarpus scandens Species 0.000 description 1
- 229910002796 Si–Al Inorganic materials 0.000 description 1
- KSIIOJIEFUOLDP-UHFFFAOYSA-N [Si].[Fe].[Ni] Chemical compound [Si].[Fe].[Ni] KSIIOJIEFUOLDP-UHFFFAOYSA-N 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 238000011056 performance test Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
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- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
The invention relates to the technical field of heat-conducting wave-absorbing materials, in particular to an oriented high-heat-conducting wave-absorbing plate and a preparation method thereof. The raw materials comprise, by weight, 100 parts of flexible high polymer materials, 100-400 parts of insulating carbon fibers and 300-800 parts of fillers, wherein the carbon fibers are oriented in the thickness direction by utilizing the action of shearing force; the characteristics of high electric field intensity of the insulating ceramic coating carbon fiber are utilized, and the carbon fiber is subjected to higher orientation adjustment in the thickness direction under the action of electric field force; simultaneously, the heat conduction and wave absorption performance are further provided by combining the effects of the heat conduction and the magnetic powder filler, and the anisotropic material with higher breakdown voltage, high heat conduction coefficient and excellent wave absorption performance is obtained.
Description
Technical Field
The invention relates to the technical field of heat-conducting wave-absorbing materials, in particular to an oriented high-heat-conducting wave-absorbing plate and a preparation method thereof.
Background
People find that the problems of electromagnetic pollution, information leakage and the like of electronic equipment become more serious while solving the heat dissipation problem through the heat conduction gasket. Firstly, electronic components with electromagnetic radiation and high heat generation in a closed environment can emit electromagnetic radiation to the outside during operation, and electromagnetic interference can be caused to surrounding equipment. While the thermally conductive silicone rubber already occupies the thickness space, no extra thickness space is structurally available to allow the use of wave absorbing materials. The heat-conducting wave-absorbing material is a novel material with double functions of heat conduction and electromagnetic compatibility, and is used in core electronic devices such as optical communication, servers, 5G communication equipment, signal receiving modules and the like.
At present, the gasket with the heat conductivity coefficient higher than 8w/mk has the defects of poor general mechanical strength, poor flexibility and toughness, loose material combination, easy bending and breakage, and limited inherent repeated tearing and uncovering operability of the heat conducting gasket. In addition, in most electronic packaging occasions, the gasket is required to have certain insulating property and high breakdown voltage, and even if the gasket works under certain voltage conditions, the gasket cannot cause short circuit and damage of equipment due to voltage breakdown. Therefore, how to obtain a thermal interface material with high thermal conductivity, good insulation performance and excellent wave absorbing property is a significant challenge in the current electronic packaging field.
Disclosure of Invention
Aiming at the problems of the heat-conducting wave-absorbing material, the application makes the carbon fiber oriented in the thickness direction by coating the ceramic insulating coating on the surface of the carbon fiber and utilizing the action of electric field force and shearing force; and combining the effect of the magnetic powder filler to obtain the anisotropic material with higher breakdown voltage, high heat conductivity coefficient and excellent wave absorbing performance.
The invention adopts the following scheme:
an oriented high-heat-conductivity wave absorbing plate is prepared from 100 parts by weight of flexible high-molecular material, 100-400 parts by weight of insulating carbon fiber and 300-800 parts by weight of heat-conducting and magnetic filler, wherein the heat-conducting and magnetic filler is highly oriented in the thickness direction by utilizing the synergistic effect of shearing force and electric field force;
the insulating carbon fiber is formed by coating a ceramic insulating coating on the surface of the carbon fiber.
Preferably, the flexible material comprises 100-150 parts by weight of vinyl silicone oil, 2-6 parts by weight of side hydrogen silicone oil and 0.5-1.5 parts by weight of platinum catalyst, wherein the viscosity of the vinyl silicone oil is 100-10000 Pa.s.
Preferably, the filler comprises ceramic powder and magnetic powder, wherein the ceramic powder is one or more of aluminum oxide, aluminum nitride, silicon carbide, silicon nitride, boron nitride and zinc oxide, and the magnetic powder is one or more of ferrite, carbonyl iron, ferric oxide, ferrosilicon aluminum and ferrosilicon nickel; the carbon fibers are in powder form, and the average length of the fibers is 50-500 mu m.
Preferably, the insulating carbon fiber is insulating graphite fiber; the ceramic insulating coating is a silicon carbide or silicon nitride coating.
Preferably, the preparation method of the ceramic insulating coating comprises the following steps: si powder and carbon fiber powder are uniformly mixed, ar or N 2 Treating at 1200-1800 deg.c for 1-8 hr in atmosphere; the mass ratio of the Si powder to the carbon fiber powder is as follows: 0.05-1:1.
The preparation method of the oriented high-heat-conductivity wave absorbing plate comprises the following steps:
(1) Preparing preparation materials: uniformly mixing insulating carbon fibers and a heat conducting filler in a flexible high polymer material to prepare a preparation material;
(2) Shear orientation: extruding the prepared material through an extruder to orient the carbon fibers in the flowing direction, wherein the extruded material is uniformly and flatly arranged in a die;
(3) Electric field orientation: applying alternating voltage with the field intensity of 0.5-10 KV/mm to two ends of the die, and performing electric field orientation; the direction of the electric field is parallel to the flow direction of the carbon fiber;
(4) And (5) hot pressing and curing: applying pressure to the oriented preparation material through a hot press, and shaping and solidifying the material through controlling the temperature;
(5) Cutting into pieces: and (3) slicing the composite material block according to application requirements, wherein the slicing thickness is 0.3-3 mm, and the carbon fiber heat conduction wave-absorbing sheet is obtained.
Preferably, before shearing and orientation, the method further comprises the step of vacuumizing the uniformly mixed preparation in a vacuum drying oven, wherein the vacuum degree of the vacuum oven is-0.1 Mpa, and the vacuumizing time is 10-15 min.
Preferably, the extruder in the step (3) is a screw extruder, the extrusion nozzle is a fence extrusion nozzle, and the single pore cross section of the fence extrusion nozzle is less than or equal to 100mm 2 The length of the extrusion nozzle is more than or equal to 30mm, and the wall thickness among pores is less than or equal to 0.5mm.
Preferably, the conditions of the hot press curing in the step (5) are as follows: the pressure is 1-4 MPa, the temperature is 80-180 ℃, and the curing time is 1-8 h.
The oriented high-heat-conductivity wave absorbing plate is applied to communication base stations, optical modules and servers.
Drawings
FIG. 1 is an SEM image of an insulated carbon fiber prepared in example 1;
FIG. 2 is an SEM image of a highly oriented carbon fiber heat conducting wave absorbing pad prepared in example 1;
fig. 3 is a reflectance image of the carbon fiber gasket prepared in example 1.
The invention has the beneficial effects that:
1. according to the preparation method, the carbon fibers are oriented to a certain degree in the flowing direction under the action of the shearing force, meanwhile, the problem of uneven orientation degree in the shearing orientation process is solved by applying the electric field parallel to the flowing direction of the carbon fibers, and the insulating layer is coated on the surfaces of the carbon fibers, so that the problem that the carbon fibers are easy to break down when the electric field is applied is solved, a higher alternating-current voltage field can be provided, and the carbon fibers are promoted to be oriented and arranged; a sheet excellent in heat conduction and wave absorption properties with a high degree of orientation and approximately perpendicular is obtained.
2. The oriented high-heat-conductivity carbon fiber sheet comprises a flexible high-molecular material, an inorganic heat-conductivity filler and carbon fibers, wherein the heat-conductivity filler is mixed in the flexible high-molecular material through compounding to form a heat-conductivity network, so that the carbon fibers are better oriented in the flowing direction, and the oriented high-heat-conductivity carbon fiber sheet is a sheet with heat-conductivity, insulating property and flexibility; meanwhile, through the protection effect of the filler and the insulating layer, the overall breakdown voltage is improved, and the application field of the heat conduction gasket is enlarged.
3. The gasket has excellent heat conduction and wave absorption performance, the carbon fiber orientation structure is favorable for reflecting electric loss of electromagnetic waves, the ceramic insulating layer on the surface of the carbon fiber promotes dielectric loss of the electromagnetic waves, and the added magnetic filler is combined to provide a magnetic loss function, so that the integral gasket realizes various electromagnetic wave losses, and has outstanding wave absorption characteristics.
Detailed Description
In order to more clearly illustrate the technical scheme of the invention, the invention is further described below by combining the embodiment. It should be understood that the invention is not limited to the following examples, but is capable of modification and/or variation in any form which will fall within the scope of the invention. The equipment and materials used in the examples below are commercially available or are conventional in the art. The methods in the following examples are conventional in the art unless otherwise specified.
Example 1
An oriented carbon fiber heat conduction wave absorbing plate is prepared by the following steps:
coating an insulating coating on the surface of the carbon fiber: uniformly mixing 1kg of Si powder and 2kg of carbon fiber powder, taking a graphite crucible as a container, and then putting the container into a high-temperature furnace for treatment at 1500 ℃ for 5 hours under inert Ar atmosphere;
the flexible material is vinyl silicone oil containing 1.2 kg, 40g of side hydrogen silicone oil and 10g of platinum catalyst, and the viscosity of the vinyl silicone oil is 500mPa.s.
The preparation method comprises the following steps of: 1kg of flexible material, 2.5kg of insulating carbon fiber and 5kg of heat conducting filler (a mixture of 1kg of silicon nitride and 4kg of Fe-Si-Al) are uniformly mixed by a high-speed stirrer to obtain a heat conducting preparation material;
a shearing orientation step: placing the uniformly mixed preparation materials in a vacuum drying oven with the vacuum degree of-0.1 Mpa, vacuumizing for 15min, extruding by an extruder to orient the carbon fibers in the flowing direction, uniformly and flatly arranging the extrusion materials in a die, wherein the extruder is a screw extruder, an extrusion nozzle is a fence type extrusion nozzle, and the fence is a grating type extrusion nozzleIndividual aperture section area of the barrier extrusion nozzle is 7mm 2 The length of the extrusion nozzle is 60mm, and the wall thickness is 0.2mm;
an electric field orientation step: applying alternating voltage with 5KV/mm field intensity at two ends of the die, wherein the application time of an electric field is 3000s, and performing electric field orientation;
and (3) hot press curing: and (3) applying pressure of 2MPa to the oriented preparation material through a hot press, controlling the temperature to be 100 ℃ for curing for 5 hours, and forming.
Comparative example 1
In this example, the electric field orientation step was not performed, and the rest was the same as in example 1.
Comparative example 2
In this example, the shear orientation step was not performed, and the rest was the same as in example 1.
Comparative example 3
The procedure of example 1 was repeated except that the step of covering the carbon fiber surface with the insulating coating was not included.
Example 2
An oriented carbon fiber heat conduction wave absorbing plate is prepared by the following steps:
coating an insulating coating on the surface of the carbon fiber: uniformly mixing 0.1kg of Si powder and 2kg of carbon fiber powder according to a proportion, taking a graphite crucible as a container, and then placing the container into a high-temperature furnace for treatment at 1200 ℃ for 8 hours under inert Ar atmosphere;
the flexible material comprises vinyl silicone oil with viscosity of 500 mPas, side hydrogen silicone oil of 60g and platinum catalyst of 2.5g, wherein the viscosity of the vinyl silicone oil is 100 mPas
The preparation method comprises the following steps of: 1kg of flexible material, 1kg of insulating carbon fiber and 3kg of heat conduction filler (0.5 kg of alumina, 1kg of ferrite and 1.5kg of carbonyl iron) are uniformly mixed by a high-speed stirrer to obtain a heat conduction preparation material;
a shearing orientation step: placing the uniformly mixed preparation materials in a vacuum drying oven with the vacuum degree of-0.1 Mpa, vacuumizing for 10min, extruding by an extruder to orient the carbon fibers in the flowing direction, uniformly and flatly arranging the extrusion materials in a die, wherein the extruder is a screw extruder, an extrusion nozzle is a fence extrusion nozzle, and the fence extrusion nozzle is a fence extrusion nozzleIndividual pore cross-sectional area of 7mm 2 The length of the extrusion nozzle is 60mm, and the wall thickness is 0.2mm;
an electric field orientation step: applying alternating voltage with field intensity of 0.5KV/mm to two ends of the die, wherein the electric field application time is 20000s, and performing electric field orientation;
and (3) hot press curing: and (3) applying pressure of 4MPa to the oriented preparation material through a hot press, controlling the temperature to be 80 ℃ for curing for 8 hours, and forming.
Example 3
An oriented carbon fiber heat conduction wave absorbing plate is prepared by the following steps:
coating an insulating coating on the surface of the carbon fiber: mixing 2kg of Si powder and 2kg of carbon fiber powder uniformly in proportion, taking a graphite crucible as a container, then putting into a high-temperature furnace, and inert N 2 Treating for 1h at 1800 ℃ under atmosphere;
the flexible material comprises 1kg of vinyl silicone oil with viscosity of 10000 Pa.s, 20g of side hydrogen silicone oil and 15g of platinum catalyst;
the preparation method comprises the following steps of: uniformly mixing 1kg of flexible material, 4kg of insulating carbon fiber and 8kg of heat conduction filler (2 kg of boron nitride and 6kg of iron silicon nickel) through a high-speed stirrer to obtain a heat conduction preparation material;
a shearing orientation step: placing the uniformly mixed preparation materials in a vacuum drying oven with the vacuum degree of-0.1 Mpa, vacuumizing for 10min, extruding by an extruder to orient the carbon fibers in the flowing direction, uniformly and flatly arranging the extrusion materials in a die, wherein the extruder is a screw extruder, an extrusion nozzle is a fence type extrusion nozzle, and the single pore cross section area of the fence extrusion nozzle is 100mm 2 The length of the extrusion nozzle is 30mm, and the gaps are 0.5mm;
an electric field orientation step: applying alternating voltage with the field intensity of 10KV/mm to two ends of the die, wherein the application time of an electric field is 300s, and performing electric field orientation;
and (3) hot press curing: and (3) applying a pressure of 1MPa to the oriented preparation material through a hot press, controlling the temperature to be 180 ℃ for curing for 1h, and forming.
Table 1: examples 1 to 13 Performance test results
。
Claims (6)
1. An oriented high-heat-conductivity wave absorbing plate is characterized in that the raw materials comprise, by weight, 100 parts of flexible high-molecular materials, 100-400 parts of insulating carbon fibers and 300-800 parts of heat-conducting and magnetic fillers, and the materials are highly oriented in the thickness direction by utilizing the synergistic effect of shearing force and electric field force;
the insulating carbon fiber is formed by coating a ceramic insulating coating on the surface of the carbon fiber;
the flexible polymer material comprises 100-150 parts by weight of vinyl silicone oil, 2-6 parts by weight of side hydrogen silicone oil and 0.5-1.5 parts by weight of platinum catalyst, wherein the viscosity of the vinyl silicone oil is 100-10000 Pa.s;
the ceramic insulating coating is a silicon carbide or silicon nitride coating;
the heat conduction and magnetic filler comprises ceramic powder and magnetic powder, wherein the ceramic powder is one or more of aluminum oxide, aluminum nitride, silicon carbide, silicon nitride, boron nitride and zinc oxide, and the magnetic powder is one or more of ferrite, carbonyl iron, ferric oxide, ferrum silicon aluminum and ferrum silicon nickel; the carbon fibers are in powder form, and the average length of the fibers is 50-500 mu m;
the preparation method of the ceramic insulating coating comprises the following steps: uniformly mixing Si powder and carbon fiber powder, and treating for 1-8h at 1200-1800 ℃ in Ar or N2 atmosphere; the mass ratio of the Si powder to the carbon fiber powder is 0.05-1:1.
2. A method for preparing the oriented high-thermal-conductivity wave absorbing plate as defined in claim 1, which is characterized by comprising the following steps:
(1) Preparing preparation materials: uniformly mixing insulating carbon fibers and a heat conducting filler in a flexible high polymer material to prepare a preparation material;
(2) Shear orientation: extruding the prepared material through an extruder to orient the carbon fibers in the flowing direction, wherein the extruded material is uniformly and flatly arranged in a die;
(3) Electric field orientation: applying alternating voltage with the field intensity of 0.5-10 KV/mm to two ends of the die, and performing electric field orientation; the direction of the electric field is parallel to the flow direction of the carbon fiber;
(4) And (5) hot pressing and curing: applying pressure to the oriented preparation material through a hot press, and shaping and solidifying the material through controlling the temperature;
(5) Cutting into pieces: and (3) slicing the composite material block according to application requirements, wherein the slicing thickness is 0.3-3 mm, and the carbon fiber heat conduction wave-absorbing sheet is obtained.
3. The preparation method according to claim 2, further comprising the step of vacuumizing the uniformly mixed preparation in a vacuum drying oven before shearing and orientation, wherein the vacuum degree of the vacuum oven is-0.1 Mpa, and the vacuumizing time is 10-15 min.
4. The method according to claim 2, wherein the extruder in the step (3) is a screw extruder, the extrusion nozzle is a barrier extrusion nozzle, the single pore cross-sectional area of the barrier extrusion nozzle is less than or equal to 100mm2, the length of the extrusion nozzle is less than or equal to 30mm, and the wall thickness between pores is less than or equal to 0.5mm.
5. The method of claim 2, wherein the conditions for hot press curing in step (5) are: the pressure is 1-4 MPa, the temperature is 80-180 ℃, and the curing time is 1-8 h.
6. The application of the oriented high-heat-conductivity wave absorbing plate in a communication base station, an optical module and a server.
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