CN115711887A - Method for simultaneously unsealing multiple small-sized chips and application thereof - Google Patents
Method for simultaneously unsealing multiple small-sized chips and application thereof Download PDFInfo
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- CN115711887A CN115711887A CN202211190135.XA CN202211190135A CN115711887A CN 115711887 A CN115711887 A CN 115711887A CN 202211190135 A CN202211190135 A CN 202211190135A CN 115711887 A CN115711887 A CN 115711887A
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Abstract
The invention provides a method for simultaneously unsealing a plurality of small-sized chips and application thereof, comprising the following steps: smoothly adhering and fixing a plurality of chips to be unsealed on a whole block on a carrier through an adhesive; drying to completely solidify the adhesive, and then scraping off the adhesive on the surface of the chip; calculating the size of a corresponding laser windowing opening according to the size of the single chip to be unsealed, and performing laser windowing on the whole chip to be unsealed according to the size of the laser windowing opening corresponding to the size of the single chip to be unsealed to obtain a product with good laser unsealing performance; selecting a liquid medicine according to the material quality of a product welding line, placing a product subjected to laser unsealing on a heating plate with a set unsealing temperature, carrying out titration reaction on the selected acidic liquid medicine, and then carrying out cleaning reaction by using a plastic package material cleaning agent until the plastic package material on the surface of the chip is completely reacted; the clamping of the small-size chip product of being convenient for like this is got, and the chip unseals effectually, has improved the product quality after the chip unseals for chip unseals efficiency and has also obtained the improvement.
Description
Technical Field
The invention relates to the technical field of chip unsealing, in particular to a method for simultaneously unsealing a plurality of small-size chips and application thereof.
Background
Chip unseal in-process chip product size not of uniform size, current chip unseal when carrying out failure analysis, have following problem: 1) The small-sized chip product is difficult to clamp, easy to fall off and difficult to operate; 2) In the process of dissolving the plastic packaging material by the acidic liquid medicine, the acidic liquid medicine is not easy to store on the surface of a product, the product is easy to damage, and the quality requirement of unsealing the chip cannot be met; 3) The chip product has small size, and the reaction time of a single chip is slow, so that the unsealing efficiency of the chip is low; the technical problem to be solved urgently at present is how to avoid the problems that the small chip products are not easy to clamp in the unsealing process, the quality of unsealing the chip is guaranteed, the unsealing efficiency of the chip is improved and the like.
Disclosure of Invention
In order to solve the technical problems, the method for unsealing the small-size chips simultaneously and the application thereof provided by the invention have the advantages that the operation is simple, the clamping of the small-size chip products is convenient, the chip unsealing effect is good, the problems of chip surface damage and bonding wire damage after the chips are unsealed are effectively avoided, the product quality after the chips are unsealed is improved, and the chip unsealing efficiency is also improved.
In order to achieve the purpose, the technical scheme of the invention is as follows:
the invention provides a method for unsealing a plurality of small-sized chips simultaneously, which comprises the following steps:
s1, smoothly adhering and fixing a plurality of chips to be unsealed on a whole carrier through an adhesive; drying to completely solidify the adhesive, and then scraping off the adhesive on the surface of the chip;
s2, calculating in sequence, calculating the size of the corresponding laser windowing according to the size of the single chip to be unsealed, and performing laser windowing on the whole chip to be unsealed according to the size of the windowing corresponding to the size of the single chip to be unsealed to obtain a product which is well unsealed by laser;
s3, after liquid medicine is selected according to the material of the product welding wire, the product subjected to laser unsealing is placed on a heating plate with a set unsealing temperature, selected acid liquid medicine is firstly titrated on the product subjected to laser unsealing for reaction, and then the plastic packaging material cleaning agent is used for cleaning reaction until the plastic packaging material on the surface of the chip is completely reacted, so that the unsealing of the chip is completed;
s4, after the chip is unsealed, whether the bonding wires of the product and the outline of the chip are completely leaked is checked, whether the surface of the chip has obvious plastic package material residues is checked, and if the chip has the obvious plastic package material residues, the steps S1-S4 are repeated until the surface of the chip and the bonding wires are unsealed.
The method for simultaneously unsealing a plurality of small-size chips, which is provided by the invention, has the advantages of simple operation, convenience for clamping small-size chip products, good chip unsealing effect, capability of effectively avoiding the problems of chip surface and bonding wire damage after the chips are unsealed, improvement on the product quality after the chips are unsealed, and chip unsealing efficiency improvement.
Preferably, the adhesive in step S1 is CH 2 ＝C(CN)-COO-C 2 H 5 。
As a preferred technical scheme, the drying temperature in the step S1 is 115-125 ℃, and the drying time is 3-5min.
Preferably, in step S1, the whole chip to be unsealed is adhered to the carrier by tweezers at a low magnification of 8X-45X.
As a preferred technical scheme, the step S3 of selecting the liquid medicine according to the material of the welding wire of the product comprises the following steps: when the material of the product bonding wire is a copper wire or a gold wire and the copper wire, the acidic liquid medicine selected is fuming nitric acid and sulfuric acid, and the volume ratio of the fuming nitric acid to the sulfuric acid is 2:1; when the material of the product bonding wire is a gold wire or an alloy wire, the acid liquid medicine selected is fuming nitric acid.
As a preferred technical scheme, the unsealing temperature of the heating plate selected in the step S3 is 70-125 ℃, and the heating time is 0.5-1.5min; when the material of the product bonding wire is one or two of a gold wire and a copper wire, the temperature of the heating plate is selected to be 115-125 ℃; when the material of the product welding wire is an alloy wire, the temperature of the heating plate is selected to be 70 ℃.
As a preferable technical scheme, the plastic packaging material cleaning agent in the step S3 is acetone, and the cleaning reaction time of the plastic packaging material cleaning agent is 4-6 seconds.
As a preferred technical solution, the step S3 includes the following specific steps: selecting a liquid medicine according to the material quality of a product welding wire, placing a product subjected to laser unsealing on a heating plate with a set unsealing temperature, carrying out titration on the selected acidic liquid medicine, dripping the selected acidic liquid medicine on the product subjected to laser unsealing, covering the product subjected to laser unsealing by the dripped selected acidic liquid medicine, carrying out cleaning reaction by using a plastic package material cleaning agent after the plastic package material on the surface of the product subjected to laser unsealing reacts with the selected acidic liquid medicine, repeating the steps in S3 until the chip is unsealed, reserving part of the carrier, normally cleaning and photographing until the plastic package material on the surface of the chip completely reacts.
As a preferred technical scheme, a low power microscope is adopted in the step S4 to check whether all bonding wires and chip outlines of the product leak out; and (5) checking whether the surface of the chip has obvious plastic package material residues by using a high-power microscope.
The invention also provides a method for simultaneously unsealing a plurality of small-sized chips, which is applied to the failure analysis of the semiconductor component.
The method for simultaneously unsealing a plurality of small-sized chips and the application thereof provided by the invention have the following beneficial effects:
1) According to the method for unsealing the small-size chip simultaneously by multiple particles and the application thereof, the technical problem that tweezers are not easy to clamp when the size of the product is small is solved in the chip unsealing process, and the technical purposes that the tweezers are easy to clamp and the chip unsealing effect is good in the chip unsealing process are achieved;
2) According to the method for simultaneously unsealing a plurality of small-sized chips and the application thereof, the technical problems that acid liquid medicine is not easy to store on the surface of a product and is easy to completely soak in a solution to damage the product in the unsealing process of the chip are solved, the surface of the unsealed chip and bonding wires are not damaged, and the quality of the unsealed chip is improved;
3) The method for simultaneously unsealing a plurality of small-sized chips and the application thereof solve the technical problems of small size of a single chip product, slow reaction time for unsealing the single chip and low efficiency, and improve the unsealing efficiency of the chip.
Drawings
FIG. 1 is a schematic view of a plurality of chips to be unsealed being flatly bonded and fixed on a carrier by an adhesive;
FIG. 2 is a schematic view of the internal structure of a product after the chip is unsealed;
1-large-particle products; 2-the product to be unsealed; 3-chip; 4-adhesive; 5-a carrier; 6-base pin; 7-welding lines.
Detailed Description
Preferred embodiments of the present invention will be described in detail below with reference to the accompanying drawings.
It can be understood that the present invention achieves the objects of the present invention by providing several embodiments, and the present invention provides a method for unsealing a plurality of small-sized chips simultaneously, comprising the steps of:
s1, as shown in figure 1, a plurality of chips which are in a whole block and need to be unsealed are adhered and fixed on a waste product with a larger size by using an adhesive, and the waste product with the larger size is used as a carrier; adhering a plurality of chips to be unsealed on a whole block to a carrier by using tweezers at a low power, baking the chips on a heating plate at the temperature of 115-125 ℃ for 3-5 minutes to completely solidify the adhesive, and scraping off the redundant adhesive on the surfaces of the chips by using a blade, wherein the low power magnification is 8X-45X;
s2, calculating in sequence, calculating the size of the corresponding laser windowing according to the size of the single chip to be unsealed, and performing laser windowing on the whole chip to be unsealed according to the windowing size corresponding to the size of the single chip to be unsealed to obtain a product which is well unsealed by laser;
s3, after selecting liquid medicine according to the material of a product bonding wire, placing the laser unsealed product on a heating plate with the set unsealing temperature of 70-125 ℃ for heating for 0.5-1.5min, carrying out acid liquid medicine titration, dripping the acid liquid medicine on the laser unsealed product, dripping the acid liquid medicine to cover the laser unsealed product, and when the chip surface plastic package material reacts with the acid liquid medicine and the bubbling phenomenon occurs, carrying out cleaning reaction for 4-6 seconds by using a plastic package material cleaning agent (if the chip surface plastic package material is not unsealed and the acid liquid medicine is dripped again for reaction for about 3 seconds), just unsealing the chip, not completely uncovering the carrier, reserving part of the carrier, carrying out normal cleaning and photographing (the cleaning times are not proper), and completing the chip unsealing until the chip surface plastic package material completely reacts, the bonding wire and the chip surface are not damaged artificially and other areas of the chip are not damaged;
s4, after the chip is unsealed, firstly, observing under a low-power microscope, checking whether the bonding wires of the product and the outline of the chip are all leaked, checking whether the surface of the chip has obvious plastic package material residues, and if not, checking under the high-power microscope; if the chip is left, the steps S1 to S4 are repeated to unseal the chip until the surface of the chip and the bonding wires are leaked.
The invention also provides a method for simultaneously unsealing a plurality of small-sized chips, which is applied to the failure analysis of the semiconductor component.
The method for simultaneously unsealing a plurality of small-sized chips and the application thereof have the advantages of simple operation, convenient clamping of small-sized chip products, good chip unsealing effect, effective avoidance of the chip surface and bonding wire damage problem after the chip is unsealed, improvement of the product quality after the chip is unsealed, and improvement of the chip unsealing efficiency.
The invention provides a method for simultaneously unsealing a plurality of small-size chips, which comprises the following steps:
s1 As shown in FIG. 1, an adhesive CH is used 2 ＝C(CN)-COO-C 2 H 5 Bonding and fixing a plurality of chips which are in a whole block and need to be unsealed on a waste product with a larger size, wherein the waste product with the larger size is used as a carrier; adhering the whole chip to be unsealed on the carrier by tweezers at low power, and baking for 4 min on a heating plate at 120 deg.C to obtain the adhesive CH 2 ＝C(CN)-COO-C 2 H 5 Completely solidifying, and cutting the excessive adhesive CH on the chip surface 2 ＝C(CN)-COO-C 2 H 5 Scraping, wherein the low magnification is 25X;
s2, calculating in sequence, calculating the size of the corresponding laser windowing according to the size of the single chip to be unsealed, and performing laser windowing on the whole chip to be unsealed according to the size of the windowing corresponding to the size of the single chip to be unsealed to obtain a product which is well unsealed by laser;
s3, selecting a liquid medicine according to the material of the product bonding wire, when the material of the product bonding wire is a copper wire, selecting acidic liquid medicine as fuming nitric acid and sulfuric acid, wherein the volume ratio of the fuming nitric acid to the sulfuric acid is 2:1, placing the product subjected to laser unsealing on a heating plate with a set unsealing temperature of 120 ℃, heating for 1min, carrying out acidic liquid medicine titration, dripping the acidic liquid medicine on the product subjected to laser unsealing, dripping the acidic liquid medicine to cover the product subjected to laser unsealing, carrying out cleaning reaction for 5 seconds (about 3 seconds if the acidic liquid medicine is not opened, dripping the acidic liquid medicine again after the chip surface plastic sealing material reacts with the acidic liquid medicine) until the chip surface plastic sealing material completely reacts, and the bonding wire and the chip surface are free of artificial damage and the chip surface are not damaged, and the chip is unsealed, and the chip is finished;
s4, after the chip is unsealed, firstly, observing under a low-power microscope, checking whether bonding wires of a product and the outline of the chip are all leaked out, checking whether obvious plastic package material residues exist on the surface of the chip, and if not, checking under a high-power microscope; if the chip is left, the steps S1 to S4 are repeated to unseal the chip until the surface of the chip and the bonding wires are leaked.
The invention also provides a method for simultaneously unsealing a plurality of small-size chips, which is applied to the failure analysis of the semiconductor component.
The method for unsealing the small-sized chips simultaneously in multiple particles and the application thereof have the advantages of simple operation, convenience for clamping the small-sized chip products, good unsealing effect of the chips, effective avoidance of the problem of chip surface and bonding wire damage after the chips are unsealed, improvement of the product quality after the chips are unsealed, and improvement of the unsealing efficiency of the chips.
The invention provides a method for simultaneously unsealing a plurality of small-sized chips, which comprises the following steps:
s1 As shown in FIG. 1, using an adhesive CH 2 ＝C(CN)-COO-C 2 H 5 Bonding and fixing a plurality of chips which are in a whole block and need to be unsealed on a waste product with a larger size, wherein the waste product with the larger size is used as a carrier; adhering the whole chip to be unsealed on the carrier by tweezers at low power, and baking at 115 deg.C for 3 min to obtain adhesive CH 2 ＝C(CN)-COO-C 2 H 5 Completely solidifying, and cutting the excessive adhesive CH on the chip surface 2 ＝C(CN)-COO-C 2 H 5 Scraping, wherein the low magnification is 8X;
s2, calculating in sequence, calculating the size of the corresponding laser windowing according to the size of the single chip to be unsealed, and performing laser windowing on the whole chip to be unsealed according to the size of the windowing corresponding to the size of the single chip to be unsealed to obtain a product which is well unsealed by laser;
s3, selecting a liquid medicine according to the material of a product bonding wire, when the material of the product bonding wire is gold wire, selecting an acidic liquid medicine as fuming nitric acid, placing the product subjected to laser unsealing on a heating plate with a set unsealing temperature of 115 ℃ for heating for 0.5, carrying out titration of the acidic liquid medicine, dripping the acidic liquid medicine on the product subjected to laser unsealing, dripping the acidic liquid medicine to cover the product subjected to laser unsealing, carrying out cleaning reaction for 4 seconds (if the chip surface plastic package material is not opened out, dripping the acidic liquid medicine again, and reacting for about 3 seconds) by using acetone when the bubbling phenomenon occurs, just unsealing the chip, not opening all the carriers, reserving part of the carriers, normally cleaning and photographing (the cleaning times are not too many) until the chip surface plastic package material completely reacts, the bonding wire and the chip surface are not artificially damaged, and other areas of the chip are not damaged, and unsealing of the chip is completed;
s4, after the chip is unsealed, firstly, observing under a low-power microscope, checking whether bonding wires of a product and the outline of the chip are all leaked out, checking whether obvious plastic package material residues exist on the surface of the chip, and if not, checking under a high-power microscope; if the chip is left, the steps S1 to S4 are repeated to unseal the chip until the surface of the chip and the bonding wires are leaked.
The invention also provides a method for simultaneously unsealing a plurality of small-sized chips, which is applied to the failure analysis of the semiconductor component.
The method for unsealing the small-sized chips simultaneously in multiple particles and the application thereof have the advantages of simple operation, convenience for clamping the small-sized chip products, good unsealing effect of the chips, effective avoidance of the problem of chip surface and bonding wire damage after the chips are unsealed, improvement of the product quality after the chips are unsealed, and improvement of the unsealing efficiency of the chips.
The invention provides a method for simultaneously unsealing a plurality of small-sized chips, which comprises the following steps:
s1 As shown in FIG. 1, an adhesive CH is used 2 ＝C(CN)-COO-C 2 H 5 Bonding and fixing a plurality of chips which need to be unsealed in a whole blockFixing the waste products with larger sizes on the waste products with larger sizes as carriers; adhering the whole chip to be unsealed on the carrier by tweezers at low power, and baking at 125 deg.C for 5min to obtain the adhesive CH 2 ＝C(CN)-COO-C 2 H 5 Completely solidifying, and cutting the excessive adhesive CH on the chip surface 2 ＝C(CN)-COO-C 2 H 5 Scraping, wherein the low magnification is 45X;
s2, calculating in sequence, calculating the size of the corresponding laser windowing according to the size of a single chip to be unsealed, and performing laser windowing on the whole chip to be unsealed according to the size of the windowing corresponding to the size of the single chip to be unsealed to obtain a product which is well unsealed by laser;
s3, selecting a liquid medicine according to the material of a product bonding wire, when the material of the product bonding wire is an acid liquid medicine selected by an alloy wire, namely fuming nitric acid, placing the product subjected to laser unsealing on a heating plate with a set unsealing temperature of 70 ℃, heating for 1.5min, carrying out acid liquid medicine titration, dripping the acid liquid medicine on the product subjected to laser unsealing, dripping the acid liquid medicine to cover the product subjected to laser unsealing, and when the chip surface plastic package material reacts with the acid liquid medicine and bubbling occurs, carrying out cleaning reaction for 4-6 seconds (for example, acid is dripped again and the reaction lasts for about 3 seconds) by using acetone, just unsealing the chip, not completely unsealing the carrier, reserving a part of the carrier, normally cleaning and photographing (the cleaning times are not too many) until the chip surface plastic package material completely reacts, the bonding wire and the chip surface are free of artificial damage and other areas of the chip are not damaged, and unsealing of the chip is completed;
s4, after the chip is unsealed, firstly, observing under a low-power microscope, checking whether bonding wires of a product and the outline of the chip are all leaked out, checking whether obvious plastic package material residues exist on the surface of the chip, and if not, checking under a high-power microscope; if the chip is left, the steps S1 to S4 are repeated to unseal the chip until the surface of the chip and the bonding wires are leaked.
The invention also provides a method for simultaneously unsealing a plurality of small-sized chips, which is applied to the failure analysis of the semiconductor component.
The method for unsealing the small-sized chips simultaneously in multiple particles and the application thereof have the advantages of simple operation, convenience for clamping the small-sized chip products, good unsealing effect of the chips, effective avoidance of the problem of chip surface and bonding wire damage after the chips are unsealed, improvement of the product quality after the chips are unsealed, and improvement of the unsealing efficiency of the chips.
The invention provides a method for simultaneously unsealing a plurality of small-sized chips, which comprises the following steps:
s1 As shown in FIG. 1, an adhesive CH is used 2 ＝C(CN)-COO-C 2 H 5 Bonding and fixing a plurality of chips which are in a whole block and need to be unsealed on a waste product with a larger size, wherein the waste product with the larger size is used as a carrier; adhering the whole chip to be unsealed on the carrier by tweezers at low power, and baking for 4 min on a heating plate at 120 deg.C to obtain the adhesive CH 2 ＝C(CN)-COO-C 2 H 5 Completely solidifying, and cutting the excessive adhesive CH on the chip surface 2 ＝C(CN)-COO-C 2 H 5 Scraping, wherein the low magnification is 25X;
s2, calculating in sequence, calculating the size of the corresponding laser windowing according to the size of the single chip to be unsealed, and performing laser windowing on the whole chip to be unsealed according to the size of the windowing corresponding to the size of the single chip to be unsealed to obtain a product which is well unsealed by laser;
s3, selecting a liquid medicine according to the material of a product bonding wire, when the material of the product bonding wire is copper wire and gold wire, selecting acid liquid medicine as fuming nitric acid and sulfuric acid, wherein the volume ratio of the fuming nitric acid to the sulfuric acid is 2:1, placing the product subjected to laser unsealing on a heating plate with a set unsealing temperature of 125 ℃, heating for 1min, carrying out acid liquid medicine titration, dripping acid liquid medicine on the product subjected to laser unsealing, dripping the acid liquid medicine to cover the product subjected to laser unsealing, and carrying out a cleaning reaction for 5 seconds (if the acid liquid medicine is not cut out, dripping the acid liquid medicine again and reacting for about 3 seconds) when the plastic sealing material on the surface of the chip reacts with the acid liquid medicine, just unsealing the chip, not opening all the carriers, reserving part of the carriers, carrying out normal cleaning photographing (the cleaning frequency is not too many) until the plastic sealing material on the surface of the chip completely reacts, the bonding wire and the surface of the chip are free of artificial damage and the chip is not damaged and other areas of the chip are not unsealed, and the chip are finished;
s4, after the chip is unsealed, firstly, observing under a low-power microscope, checking whether the bonding wires of the product and the outline of the chip are all leaked, checking whether the surface of the chip has obvious plastic package material residues, and if not, checking under the high-power microscope; if the chip is left, the steps S1 to S4 are repeated to unseal the chip until the surface of the chip and the bonding wires are leaked.
The invention also provides a method for simultaneously unsealing a plurality of small-sized chips, which is applied to the failure analysis of the semiconductor component.
The method for unsealing the small-sized chips simultaneously in multiple particles and the application thereof have the advantages of simple operation, convenience for clamping the small-sized chip products, good unsealing effect of the chips, effective avoidance of the problem of chip surface and bonding wire damage after the chips are unsealed, improvement of the product quality after the chips are unsealed, and improvement of the unsealing efficiency of the chips.
As shown in fig. 2, by unsealing the internal structure of the product after the chip by the method for simultaneously unsealing a plurality of small-sized chips provided by the present invention, we can observe that the chip unsealing effect is good, the problem of chip surface and bonding wire damage after the chip is unsealed is effectively avoided, and the product quality after the chip is unsealed is improved.
The method for simultaneously unsealing a plurality of small-sized chips and the application thereof provided by the invention have the following beneficial effects:
1) According to the method for unsealing the small-size chip simultaneously by multiple particles and the application thereof, the technical problem that tweezers are not easy to clamp when the size of the product is small is solved in the chip unsealing process, and the technical purposes that the tweezers are easy to clamp and the chip unsealing effect is good in the chip unsealing process are achieved;
2) According to the method for unsealing the small-size chip simultaneously and the application thereof, the technical problems that acid liquid medicine is not easy to store on the surface of the product and is easy to completely soak in the solution to damage the product in the unsealing process of the chip are solved, the surface of the unsealed chip and bonding wires are not damaged, and the quality of the unsealed chip is improved;
3) The method for simultaneously unsealing a plurality of small-sized chips and the application thereof solve the technical problems of small size of a single chip product, slow reaction time for unsealing the single chip and low efficiency, and improve the unsealing efficiency of the chip.
It is to be understood that the present invention has been described with reference to certain embodiments, and that various changes in the features and embodiments, or equivalent substitutions may be made therein by those skilled in the art without departing from the spirit and scope of the invention. In addition, many modifications may be made to adapt a particular situation or material to the teachings of the invention without departing from the essential scope thereof. Therefore, it is intended that the invention not be limited to the particular embodiment disclosed, but that the invention will include all modifications and equivalents falling within the scope of the appended claims. In addition, many modifications may be made to adapt a particular situation or material to the teachings of the invention without departing from the essential scope thereof. Therefore, it is intended that the invention not be limited to the particular embodiment disclosed, but that the invention will include all embodiments falling within the scope of the appended claims.
Claims (10)
1. A method for unsealing a plurality of small-sized chips at the same time is characterized by comprising the following steps:
s1, smoothly adhering and fixing a plurality of chips to be unsealed on a whole block on a carrier through an adhesive, drying to enable the adhesive to be completely solidified, and scraping off the adhesive on the surfaces of the chips;
s2, calculating in sequence, calculating the size of the corresponding laser windowing according to the size of the single chip to be unsealed, and performing laser windowing on the whole chip to be unsealed according to the size of the laser windowing corresponding to the size of the single chip to be unsealed to obtain a product which is well unsealed by laser;
s3, selecting liquid medicine according to the material of the product bonding wire, placing the product subjected to laser unsealing on a heating plate with a set unsealing temperature, titrating the selected acidic liquid medicine on the product subjected to laser unsealing for reaction, and then performing cleaning reaction by using a plastic package material cleaning agent until the plastic package material on the surface of the chip is completely reacted, so that the unsealing of the chip is completed;
s4, after the chip is unsealed, whether the bonding wires of the product and the outline of the chip are completely leaked is checked, whether the surface of the chip has obvious plastic package material residues is checked, and if the chip has the obvious plastic package material residues, the steps S1-S4 are repeated until the surface of the chip and the bonding wires are unsealed.
2. The method for simultaneously unsealing the plurality of small-sized chips according to claim 1, wherein the adhesive in step S1 is CH 2 ＝C(CN)-COO-C 2 H 5 。
3. The method for unsealing the small-sized chips simultaneously as claimed in claim 1, wherein the drying temperature in step S1 is 115-125 ℃ and the drying time is 3-5min.
4. The method for unsealing simultaneously multiple small-sized chips according to claim 1, wherein the whole chip to be unsealed is adhered to the carrier by tweezers at a low magnification of 8X to 45X in step S1.
5. The method for simultaneously unsealing a plurality of small-sized chips according to claim 1, wherein the step S3 of selecting the liquid medicine according to the material of the product bonding wire comprises the following steps: when the material of the product bonding wire is a copper wire or a gold wire and the copper wire, the acidic liquid medicine selected is fuming nitric acid and sulfuric acid, and the volume ratio of the fuming nitric acid to the sulfuric acid is 2:1; when the material of the product bonding wire is a gold wire or an alloy wire, the acid liquid medicine selected is fuming nitric acid.
6. The method for unsealing simultaneously a plurality of small-sized chips according to claim 1, wherein the unsealing temperature of the heating plate selected in step S3 is 70 ℃ to 125 ℃ and the heating time is 0.5 to 1.5min; when the material of the product bonding wire is one or two of gold wire and copper wire, the temperature of the heating plate is selected to be 115-125 ℃; when the material of the product welding wire is an alloy wire, the temperature of the heating plate is selected to be 70 ℃.
7. The method for unsealing a plurality of small-sized chips simultaneously as claimed in claim 1, wherein the plastic package cleaning agent in step S3 is acetone, and the cleaning reaction time with the plastic package cleaning agent is 4 to 6 seconds.
8. The method for unsealing simultaneously a plurality of small-sized chips according to claim 1, wherein the step S3 comprises the following specific steps: selecting a liquid medicine according to the material quality of a product welding wire, placing a product subjected to laser unsealing on a heating plate with a set unsealing temperature, carrying out titration on the selected acidic liquid medicine, dripping the selected acidic liquid medicine on the product subjected to laser unsealing, covering the product subjected to laser unsealing by the dripped selected acidic liquid medicine, carrying out cleaning reaction by using a plastic package material cleaning agent after the plastic package material on the surface of the product subjected to laser unsealing reacts with the selected acidic liquid medicine, repeating the steps in S3 until the chip is unsealed, reserving part of the carrier, normally cleaning and photographing until the plastic package material on the surface of the chip completely reacts.
9. The method for opening a plurality of small-sized chips simultaneously as claimed in claim 1, wherein in step S4, a low power microscope is used to check whether all the bonding wires and the chip contour are leaked; and (5) checking whether the surface of the chip has obvious plastic package material residues by using a high power microscope.
10. A method for simultaneously unsealing a plurality of small-sized chips is applied to failure analysis of semiconductor components.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202211190135.XA CN115711887A (en) | 2022-09-28 | 2022-09-28 | Method for simultaneously unsealing multiple small-sized chips and application thereof |
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| CN202211190135.XA CN115711887A (en) | 2022-09-28 | 2022-09-28 | Method for simultaneously unsealing multiple small-sized chips and application thereof |
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| CN115711887A true CN115711887A (en) | 2023-02-24 |
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- 2022-09-28 CN CN202211190135.XA patent/CN115711887A/en active Pending
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