CN115710475A - Adhesion promoter for high-temperature-resistant ethylene propylene diene monomer rubber and acrylic acid adhesive tape - Google Patents
Adhesion promoter for high-temperature-resistant ethylene propylene diene monomer rubber and acrylic acid adhesive tape Download PDFInfo
- Publication number
- CN115710475A CN115710475A CN202211672160.1A CN202211672160A CN115710475A CN 115710475 A CN115710475 A CN 115710475A CN 202211672160 A CN202211672160 A CN 202211672160A CN 115710475 A CN115710475 A CN 115710475A
- Authority
- CN
- China
- Prior art keywords
- adhesion promoter
- resin
- adhesive tape
- ethylene propylene
- diene monomer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229920002943 EPDM rubber Polymers 0.000 title claims abstract description 41
- 239000002318 adhesion promoter Substances 0.000 title claims abstract description 37
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 title claims abstract description 25
- 239000002390 adhesive tape Substances 0.000 title claims abstract description 19
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 title claims abstract description 16
- 229920006226 ethylene-acrylic acid Polymers 0.000 title abstract description 7
- 239000011347 resin Substances 0.000 claims abstract description 22
- 229920005989 resin Polymers 0.000 claims abstract description 22
- 230000009477 glass transition Effects 0.000 claims abstract description 17
- -1 polypropylene Polymers 0.000 claims abstract description 17
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 15
- 239000004743 Polypropylene Substances 0.000 claims abstract description 12
- 229920001155 polypropylene Polymers 0.000 claims abstract description 12
- 239000003960 organic solvent Substances 0.000 claims abstract description 10
- 230000004048 modification Effects 0.000 claims abstract description 7
- 238000012986 modification Methods 0.000 claims abstract description 7
- 239000002994 raw material Substances 0.000 claims abstract description 4
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 claims description 18
- 239000003522 acrylic cement Substances 0.000 claims description 16
- OZAIFHULBGXAKX-UHFFFAOYSA-N 2-(2-cyanopropan-2-yldiazenyl)-2-methylpropanenitrile Chemical compound N#CC(C)(C)N=NC(C)(C)C#N OZAIFHULBGXAKX-UHFFFAOYSA-N 0.000 claims description 14
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 claims description 12
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 claims description 11
- 239000004925 Acrylic resin Substances 0.000 claims description 8
- 229920000178 Acrylic resin Polymers 0.000 claims description 8
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 claims description 6
- 239000002904 solvent Substances 0.000 claims description 6
- 229920005792 styrene-acrylic resin Polymers 0.000 claims description 6
- 239000004342 Benzoyl peroxide Substances 0.000 claims description 5
- OMPJBNCRMGITSC-UHFFFAOYSA-N Benzoylperoxide Chemical compound C=1C=CC=CC=1C(=O)OOC(=O)C1=CC=CC=C1 OMPJBNCRMGITSC-UHFFFAOYSA-N 0.000 claims description 5
- 235000019400 benzoyl peroxide Nutrition 0.000 claims description 5
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 claims description 4
- 239000000460 chlorine Substances 0.000 claims description 4
- 229910052801 chlorine Inorganic materials 0.000 claims description 4
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 4
- 125000003277 amino group Chemical group 0.000 claims description 3
- 125000003700 epoxy group Chemical group 0.000 claims description 3
- 239000000203 mixture Substances 0.000 claims description 3
- 239000000853 adhesive Substances 0.000 abstract description 2
- 230000001070 adhesive effect Effects 0.000 abstract description 2
- 238000010382 chemical cross-linking Methods 0.000 abstract description 2
- 230000007774 longterm Effects 0.000 abstract description 2
- 239000003607 modifier Substances 0.000 abstract 1
- 238000000034 method Methods 0.000 description 6
- 230000000694 effects Effects 0.000 description 4
- 238000004132 cross linking Methods 0.000 description 3
- 229920001971 elastomer Polymers 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 239000006087 Silane Coupling Agent Substances 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000011056 performance test Methods 0.000 description 2
- 230000006978 adaptation Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000004566 building material Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000012948 isocyanate Substances 0.000 description 1
- 150000002513 isocyanates Chemical class 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 description 1
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 1
- 239000007858 starting material Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 229920001909 styrene-acrylic polymer Polymers 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Abstract
The application relates to the technical field of adhesives, and particularly discloses an adhesion promoter for high-temperature-resistant ethylene propylene diene monomer and acrylic acid adhesive tape, which is characterized by comprising the following raw materials in parts by weight: 50-80% of organic solvent, 10-30% of high glass transition temperature resin, 1-5% of chlorinated polypropylene and 0.1-1.0% of curing agent. The adhesion promoter adopts resin with a special modification group and a high glass transition temperature as a main body, chlorinated polypropylene is added as a modifier, certain chemical crosslinking is formed in front of ethylene propylene diene monomer and an acrylic acid adhesive tape under the action of a curing agent, the bonding strength is increased, the high temperature resistance is improved, the high temperature of 120 ℃ is resisted, the bonding strength is basically not influenced, and the problem of long-term high temperature resistance after the ethylene propylene diene monomer and the acrylic acid adhesive tape are bonded is solved.
Description
Technical Field
The technical field of the adhesive, in particular to an adhesion promoter of high-temperature-resistant ethylene propylene diene monomer and acrylic acid adhesive tape.
Background
Ethylene propylene diene monomer as a rubber material has excellent oxidation resistance, corrosion resistance and other capabilities as well as excellent high temperature resistance, and can be used for a long time at 120 ℃, so that the ethylene propylene diene monomer has various applications in the aspects of automobiles, cables, building materials, heat-resistant instruments and the like, and sometimes adhesive tapes are required to be used for fixing and bonding in the use process of some heat-resistant instruments, for example, heat-resistant pipe sleeves and the like in high-temperature environments such as motors, engines and the like are required to be fixed and connected, and the acrylic adhesive tape with excellent bonding performance is a good choice, not only has good bonding performance on materials such as metals and the like, but also has excellent insulating performance, but has the defect of poor bonding performance on ethylene propylene diene monomer, and generally needs to be added with a primer or an adhesion promoter.
The traditional primer or adhesion promoter is generally isocyanate or silane coupling agent and other treating agents, the surface affinity of the acrylic adhesive tape and ethylene propylene diene monomer is improved after partial polar groups are added after the surface modification of ethylene propylene diene monomer, so that the bonding strength is improved, but the modification only on the physical layer is generally difficult to resist high temperature, because the acrylic adhesive tape becomes soft along with the increase of temperature, the bonding strength is easy to reduce due to the simple physical bonding, so that the position of the adhesive tape is easy to slip, while the traditional high-temperature-resistant treatment methods such as epoxy resin, polyurethane and the like have insufficient affinity with rubber on one hand, and on the other hand, the traditional high-temperature-resistant treatment methods are mostly two-component, need to be mixed before use, and are troublesome to use. Therefore, it is urgent to develop an adhesion promoter for bonding epdm and acrylic tape, which is easy to use, and can withstand high temperature.
Disclosure of Invention
In order to improve the bonding performance of the ethylene propylene diene monomer and the acrylic acid adhesive tape at high temperature, the application provides an adhesion promoter of the high-temperature-resistant ethylene propylene diene monomer and the acrylic acid adhesive tape.
The application provides an adhesion promoter of high temperature resistant ethylene propylene diene monomer and acrylic acid adhesive tape, which adopts the following technical scheme: an adhesion promoter for high-temperature-resistant ethylene propylene diene monomer and acrylic acid adhesive tape is characterized by comprising the following raw materials in parts by weight: 50-80% of organic solvent, 10-30% of high glass transition temperature resin, 1-5% of chlorinated polypropylene and 0.1-1.0% of curing agent.
As a preferable technical solution of the present invention, the adhesion promoter for the high temperature resistant epdm rubber and the acrylic adhesive tape is characterized in that the organic solvent includes but is not limited to ethyl acetate, toluene, acetone, butanone, and the like.
In a preferred embodiment of the present invention, the organic solvent may be any one or a mixture of two or more of the above solvents.
As a preferred technical solution of the present invention, the adhesion promoter for the high temperature resistant epdm rubber and the acrylic adhesive tape is characterized in that the high glass transition temperature resin includes, but is not limited to, pure acrylic resin, styrene-acrylic resin, silicone-acrylic resin, urethane-modified acrylic resin, and the like.
In a preferred embodiment of the present invention, the resin having a high glass transition temperature is characterized in that the glass transition temperature is 80 to 120 ℃.
In a preferred embodiment of the present invention, the high glass transition temperature resin contains a modified epoxy group, amino group, hydroxyl group, or no modification.
As a preferable technical scheme of the invention, the adhesion promoter of the high-temperature-resistant ethylene propylene diene monomer and the acrylic acid adhesive tape is characterized in that the chlorinated polypropylene chloride content is 20-70%.
As a preferred technical solution of the present invention, the adhesion promoter for the high temperature resistant epdm rubber and the acrylic adhesive tape is characterized in that the curing agent includes, but is not limited to, azobisisobutyronitrile, azobisisoheptonitrile, benzoyl peroxide, etc.
In a preferred embodiment of the present invention, the curing agent may be one or more of the above-mentioned curing agents.
By adopting the technical scheme, the resin with high glass transition temperature is adopted as the matrix, so that the adhesion promoter can keep the bonding strength at high temperature and cannot be softened to have no strength due to high temperature.
By adopting the technical scheme, the added resin with high glass transition temperature contains special polar groups, has good affinity with the acrylic adhesive tape, and ensures that the resin has good effect in preliminary bonding
By adopting the technical scheme, the added chlorinated polypropylene has good rubber affinity, and good bonding effect on ethylene propylene diene monomer rubber in preliminary bonding is ensured
By adopting the technical scheme, the added curing agent can generate a crosslinking reaction under the high-temperature condition, and because the adhesion promoter layer is very thin, unsaturated double bonds on the ethylene propylene diene monomer rubber, the adhesion promoter coating and the acrylic adhesive tape layer can form a mutual crosslinking system at high temperature, so that a certain chemical bond crosslinking and curing are formed, a sample is firmly bonded under the high-temperature condition, and a long-term stable bonding effect can be formed even at the temperature of 120 ℃ for a long time.
In summary, the present application has the following beneficial effects:
1. the single-component adhesion promoter is directly coated on the surface of the ethylene propylene diene monomer rubber and can be bonded after the solvent is volatilized, the use is simple and convenient, and the fact that the two components need to be mixed before use and must be used within a specified time after mixing is not considered.
2. The acrylic resin with special affinity groups and the chlorinated polypropylene are used as the basic adhesion promoting material, so that the initial adhesion capacity of ethylene propylene diene monomer and acrylic adhesive tape can be improved, and the problem of poor room-temperature adhesion performance of ethylene propylene diene monomer and acrylic resin is solved.
3. According to the application, the special curing agent can enable unsaturated bonds in the ethylene propylene diene monomer and the acrylic resin to form certain chemical crosslinking at high temperature, so that the bonding strength of the ethylene propylene diene monomer and the acrylic adhesive tape at high temperature is improved, and the ethylene propylene diene monomer can endure the temperature of 120 ℃ for a long time.
Detailed Description
The application provides an adhesion promoter of high temperature resistant ethylene propylene diene monomer and acrylic acid adhesive tape, which adopts the following technical scheme: the adhesion promoter for the high-temperature-resistant ethylene propylene diene monomer and the acrylic acid adhesive tape is characterized by comprising the following raw materials in parts by weight: 50-80% of organic solvent, 10-30% of high glass transition temperature resin, 1-5% of chlorinated polypropylene and 0.1-1.0% of curing agent.
In some preferred embodiments, the adhesion promoter for the high temperature resistant epdm rubber and the acrylic adhesive tape is characterized in that the organic solvent includes but is not limited to ethyl acetate, toluene, acetone, butanone, and the like.
In some preferred embodiments, the organic solvent may be any one or a mixture of 2 of the above solvents.
In some preferred embodiments, the adhesion promoter for the high temperature resistant epdm rubber and the acrylic adhesive tape is characterized in that the high tg resin includes, but is not limited to, pure acryl, styrene-acrylic, silicone-acrylic, urethane-modified acrylic, and the like.
In some preferred embodiments, the high glass transition temperature resin is characterized by a glass transition temperature of 80-120 ℃.
In some preferred embodiments, the high glass transition temperature resin is characterized in that the resin contains modified epoxy groups, amino groups, hydroxyl groups or is not modified.
In some preferred embodiments, the adhesion promoter for the high temperature resistant ethylene propylene diene monomer and acrylic adhesive tape is characterized in that the chlorinated polypropylene chloride content is 20-70%.
In some preferred embodiments, the adhesion promoter for high temperature resistant epdm and acrylic tape is characterized in that the curing agent includes, but is not limited to, azobisisobutyronitrile, azobisisoheptonitrile, benzoyl peroxide, and the like.
Examples
In order to better understand the technical solutions, the technical solutions will be described in detail with reference to specific embodiments. It is to be noted that the following examples are provided for illustrative purposes only and are not to be construed as limiting the scope of the present invention, and that various modifications and adaptations of the present invention which are not intended to be within the scope of the present invention may be made by those skilled in the art based on the above disclosure. In addition, the starting materials used are all commercially available, unless otherwise specified.
Example 1
The preparation example of the application discloses a method for preparing an adhesion promoter of high-temperature-resistant ethylene propylene diene monomer rubber and an acrylic acid adhesive tape, which comprises the following steps:
1) 22g of styrene-acrylic resin (Tg =80 ℃), 3g of chlorinated polypropylene (chlorine content 40%) and 50g of ethyl acetate and 24.5g of toluene were put into a stirrer and mixed and stirred;
2) After the resin and the chlorinated polypropylene are uniformly dissolved, 0.5g of azobisisobutyronitrile is added;
3) And continuously stirring and dissolving until the sample is completely dissolved into transparent liquid, thus obtaining the adhesion promoter.
Example 2
This embodiment is substantially the same as embodiment 1 except that: the styrene-acrylic resin of this example (Tg =80 ℃) was replaced with a modified styrene-acrylic resin (hydroxyl active group added; tg =85 ℃).
Example 3
This embodiment is substantially the same as embodiment 1 except that: the styrene-acrylic resin of this example (Tg =80 ℃) was replaced with pure propylene resin (Tg =100 ℃).
Example 4
This embodiment is substantially the same as embodiment 1 except that: chlorinated polypropylene (chlorine content) of this example was replaced with chlorinated polypropylene (chlorine content 63%).
Example 5
This embodiment is substantially the same as embodiment 1 except that: azobisisobutyronitrile according to this example was replaced by benzoyl peroxide.
Example 6
This embodiment is substantially the same as embodiment 2 except that: 50g of ethyl acetate from this example 24.5g were replaced by 34.5g of acetone 40g of ethyl acetate.
Example 7
This example is substantially the same as example 3, except that: azobisisobutyronitrile according to this example was replaced with benzoyl peroxide 0.3g + azobisisobutyronitrile 0.2g.
Performance test
The same mass of adhesion promoter for the high temperature resistant epdm rubber obtained in example 1~7 and the acrylic tape was taken as sample 1~7, the epdm strips and the 3M acrylic tape were used as experimental products, the silane coupling agent primer was used as control 1, and the adhesive tape was directly stuck without any adhesion promoter as control 2.
The use method comprises the steps of coating a layer of adhesion promoter on the surface of ethylene propylene diene monomer, adhering the adhesion promoter and the ethylene propylene diene monomer by using an acrylic acid adhesive tape after the solvent is completely volatilized, wherein the use method of the comparison sample 1 is consistent, and the direct adhesion of the comparison sample 2 is realized
1. Peel test
After being adhered, the ethylene propylene diene monomer and the acrylic adhesive tape are cut into strips with the length of 15cm and the width of 25mm, the peeling force of the two strips is tested by using a universal tensile machine, and the speed of the experimental machine is 300mm/min. The peel force magnitude N/25mm was recorded.
2. High temperature peel test
The samples were subjected to 60% RH in a high temperature and high humidity test chamber at 120 ℃ with reference to the parameters of the peeling test. Holding for 1d;5d; after 10d, a peel test was performed at elevated temperature and the magnitude of the peel force was recorded as N/25mm.
TABLE 1 Performance test data sheet
In the test results, the adhesion promoter of the present invention maintained stable adhesion performance for a long period of time both at normal temperature and at high temperature, while the conventional primer of reference 1 had some effect at normal temperature, but the performance at high temperature decreased sharply, and the adhesion performance of the directly adhered samples was poor.
The present embodiment is only for explaining the present application, and it is not limited to the present application, and those skilled in the art can make modifications of the present embodiment without inventive contribution as needed after reading the present specification, but all of them are protected by patent law within the scope of the claims of the present application.
Claims (9)
1. The adhesion promoter for the high-temperature-resistant ethylene propylene diene monomer and the acrylic acid adhesive tape is characterized by comprising the following raw materials in parts by weight: 50-80% of organic solvent, 10-30% of high glass transition temperature resin, 1-5% of chlorinated polypropylene and 0.1-1.0% of curing agent.
2. The adhesion promoter for high temperature ethylene propylene diene monomer and acrylic adhesive tape as claimed in claim 1, wherein the organic solvent includes but is not limited to ethyl acetate, toluene, acetone, butanone, etc.
3. The organic solvent according to claim 2, wherein the solvent is any one or a mixture of 2 kinds of the solvents.
4. The adhesion promoter for high temperature resistant EPDM rubber and acrylic tape according to claim 1, wherein the high Tg resin includes but is not limited to pure acryl resin, styrene-acrylic resin, silicone-acrylic resin, urethane-modified acrylic resin, etc.
5. The high glass transition temperature resin of claim 3, wherein the glass transition temperature is in the range of 80-120 ℃.
6. The high glass transition temperature resin of claim 3, wherein the resin contains modified epoxy groups, amino groups, hydroxyl groups, or no modification.
7. The adhesion promoter for high temperature resistant EPDM rubber and acrylic adhesive tape as claimed in claim 1, wherein the chlorinated polypropylene has a chlorine content of 20-70%.
8. The adhesion promoter for high temperature resistant epdm and acrylic tape as claimed in claim 1, wherein said curing agent includes but is not limited to azobisisobutyronitrile, azobisisoheptonitrile, benzoyl peroxide, etc.
9. The curing agent according to claim 7, wherein the curing agent may be 1 or more of the combinations of claim 7.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211672160.1A CN115710475A (en) | 2022-12-26 | 2022-12-26 | Adhesion promoter for high-temperature-resistant ethylene propylene diene monomer rubber and acrylic acid adhesive tape |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211672160.1A CN115710475A (en) | 2022-12-26 | 2022-12-26 | Adhesion promoter for high-temperature-resistant ethylene propylene diene monomer rubber and acrylic acid adhesive tape |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN115710475A true CN115710475A (en) | 2023-02-24 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202211672160.1A Pending CN115710475A (en) | 2022-12-26 | 2022-12-26 | Adhesion promoter for high-temperature-resistant ethylene propylene diene monomer rubber and acrylic acid adhesive tape |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN115710475A (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006307104A (en) * | 2005-05-02 | 2006-11-09 | Yokohama Rubber Co Ltd:The | Adhesive composition |
| CN1981002A (en) * | 2004-06-05 | 2007-06-13 | 阿克佐诺贝尔国际涂料股份有限公司 | Coating composition for plastic substrates |
| CN110484161A (en) * | 2019-09-16 | 2019-11-22 | 常州驰科光电科技有限公司 | It is a kind of for being bonded the hot melt adhesive film of ethylene propylene diene rubber |
| CN113667425A (en) * | 2021-09-29 | 2021-11-19 | 上海绘兰材料科技有限公司 | Acrylic acid adhesion promoter, preparation method and application thereof |
-
2022
- 2022-12-26 CN CN202211672160.1A patent/CN115710475A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1981002A (en) * | 2004-06-05 | 2007-06-13 | 阿克佐诺贝尔国际涂料股份有限公司 | Coating composition for plastic substrates |
| JP2006307104A (en) * | 2005-05-02 | 2006-11-09 | Yokohama Rubber Co Ltd:The | Adhesive composition |
| CN110484161A (en) * | 2019-09-16 | 2019-11-22 | 常州驰科光电科技有限公司 | It is a kind of for being bonded the hot melt adhesive film of ethylene propylene diene rubber |
| CN113667425A (en) * | 2021-09-29 | 2021-11-19 | 上海绘兰材料科技有限公司 | Acrylic acid adhesion promoter, preparation method and application thereof |
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