CN115701252A

CN115701252A - Preparation method of display panel, display panel and display panel production equipment

Info

Publication number: CN115701252A
Application number: CN202211486908.9A
Authority: CN
Inventors: 李才文; 覃事建
Original assignee: Shenzhen China Star Optoelectronics Semiconductor Display Technology Co Ltd
Current assignee: Shenzhen China Star Optoelectronics Semiconductor Display Technology Co Ltd
Priority date: 2022-04-11
Filing date: 2022-11-24
Publication date: 2023-02-07
Also published as: CN114784063A

Abstract

The application discloses a preparation method of a display panel, the display panel and display panel production equipment, which comprises the following steps: providing a glass substrate; preparing an OLED array layer on the glass substrate; preparing a passivation layer and a flat layer on the OLED array layer, preparing a first through hole on the flat layer and preparing a second through hole on the passivation layer; wherein, in the step of etching the through holes on the passivation layer and the flat layer: arranging a light resistance layer on one side of the glass substrate far away from the OLED array layer; carrying out hydrofluoric acid spraying treatment to form a through hole on the passivation layer; and stripping the photoresist layer. The technical effect of the application is that the glass substrate is protected from corrosion when the passivation layer is etched by hydrofluoric acid.

Description

Preparation method of display panel, display panel and display panel production equipment

Technical Field

The application relates to the field of display, in particular to a display panel, a preparation method of the display panel and display panel production equipment.

Background

In the existing flexible device TFT manufacturing process, in order to reduce one illumination, hydrofluoric acid HF is selected to etch a passivation layer, but at the same time, the back surface of a glass substrate is also corroded when passing through hydrofluoric acid, the glass substrate is in a water drop shape in a macroscopic state, roll printing white dirt exists, the glass substrate is in a sand gravel shape in a microscopic state, the biggest influence is that the peeling difficulty occurs when Laser peeling occurs in actual production, a display surface is separated after a device layer is pulled, black spots and thin black lines occur on a picture after lighting, the Laser peeling (LLO for short in the whole process) manufacturing process is seriously influenced, and even the serious consequences such as damage and tear of the device are caused.

Disclosure of Invention

The application aims to provide a display panel preparation method, a display panel and display panel production equipment, and the technical problems that a glass substrate is seriously corroded, roller printing exists and the like in a manufacturing process of etching a passivation layer by hydrofluoric acid in the existing display panel preparation process can be solved.

In order to achieve the above object, the present application provides a method for manufacturing a display panel, which includes the steps of: providing a glass substrate; preparing an OLED array layer on the glass substrate; preparing a passivation layer and a flat layer on the OLED array layer, preparing a first through hole on the flat layer and preparing a second through hole on the passivation layer; wherein the steps of preparing a first via hole on the planarization layer and preparing a second via hole on the passivation layer include: arranging a light resistance layer on one side of the glass substrate far away from the OLED array layer; performing hydrofluoric acid spraying treatment to form the second through hole on the passivation layer; and stripping the photoresist layer.

Further, the step of preparing the passivation layer and the planarization layer on the OLED array layer includes: depositing a layer of insulating material on the surface of one side, away from the glass substrate, of the OLED array layer to serve as a passivation layer; coating a layer of inorganic material on the surface of one side of the passivation layer, which is far away from the glass substrate, to form a flat layer; after exposure, development, baking and etching, the first through hole is formed on the flat layer and is arranged corresponding to the drain electrode of the OLED array layer.

Further, the step of arranging a light resistance layer on the side of the glass substrate far away from the OLED array layer includes: and spraying a light resistance material on one side of the glass substrate far away from the OLED array layer, and carrying out baking and curing treatment to form the light resistance layer.

Furthermore, when the photoresist material is sprayed, a roller type roller is adopted to roll on the bottom surface of the glass substrate, so that the photoresist material is uniformly sprayed.

Further, in the step of performing the baking curing treatment, a heating wire or an extreme ultraviolet curing treatment is adopted.

Further, the step of performing hydrofluoric acid spraying treatment comprises: and carrying out hydrofluoric acid spraying treatment at least twice, wherein the passivation layer forms a second through hole at a position corresponding to the first through hole of the flat layer, the second through hole is arranged corresponding to the drain electrode of the OLED array layer, and the second through hole of the passivation layer is communicated with the first through hole of the flat layer.

Further, after the hydrofluoric acid spraying step, air drying treatment is performed.

Further, in the step of stripping the light resistance layer, the light resistance layer is separated from the glass substrate in a laser stripping mode.

In order to achieve the above object, the present application provides a display panel, which is prepared by the preparation method of the display panel of the present invention; the display panel includes: a glass substrate; the OLED array layer is arranged on the surface of one side of the glass substrate; the passivation layer is arranged on the surface of one side, away from the glass substrate, of the OLED array layer, and a second through hole formed by etching through hydrofluoric acid is formed in the passivation layer; the flat layer is arranged on the surface, far away from the OLED array layer, of the passivation layer, a first through hole is formed in the flat layer and communicated with the second through hole, and the first through hole and the second through hole are arranged corresponding to the drain electrode of the OLED array layer.

In order to achieve the above object, the present application provides a display panel production apparatus for producing the display panel of the present invention, which includes a first production chamber, a second production chamber, a photoresist spraying chamber, a photoresist baking chamber, a first hydrofluoric acid spraying chamber, a second hydrofluoric acid spraying chamber, and an air drying chamber, which are sequentially disposed; the first production chamber is used for preparing an OLED array layer on the glass substrate; the second production chamber is used for preparing a passivation layer and a flat layer on the OLED array layer; the light resistance spraying chamber is used for spraying light resistance materials on one side of the glass substrate far away from the OLED array layer; the light resistance baking chamber is used for baking and curing the light resistance material on one side of the glass substrate, which is far away from the OLED array layer, to form the light resistance layer; the first hydrofluoric acid spray chamber and the second hydrofluoric acid spray chamber are used for forming the second through hole on the passivation layer; the air drying chamber is used for carrying out air drying treatment.

The utility model provides a technological effect lies in, at the lower surface spraying one deck light resistance layer of glass substrate, when carrying out hydrofluoric acid spray etching to the passivation layer, the light resistance layer can play the protection glass substrate's effect prevents that its surface from leaving the gyro wheel seal, avoids being corroded by hydrofluoric acid, just can avoid glass substrate is the white dirt of drop form and gyro wheel seal form under macroscopic state, presents phenomenons such as gravel form under the microcosmic state, can reduce when actual production and peel off the degree of difficulty, prevents that OLED array layer from receiving to drag and then causing display surface Peeling, lighting a lamp the back picture and appear black spot, thin black line scheduling problem, improves display panel's display effect, improves display device's yield.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.

Fig. 1 is a flowchart of a method for manufacturing a display panel provided in an embodiment of the present application;

FIG. 2 is a schematic structural diagram of a light-shielding layer provided in an embodiment of the present application after being prepared;

FIG. 3 is a schematic structural diagram of a buffer layer prepared according to an embodiment of the present disclosure;

fig. 4 is a schematic structural diagram of an active layer prepared according to an embodiment of the present disclosure;

FIG. 5 is a schematic diagram illustrating a structure of a gate insulating layer after being formed according to an embodiment of the present disclosure;

fig. 6 is a schematic structural diagram of a gate layer after being fabricated according to an embodiment of the present disclosure;

FIG. 7 is a schematic diagram illustrating a structure of a dielectric layer after being formed according to an embodiment of the present application;

fig. 8 is a schematic structural diagram after a source/drain layer is prepared according to the embodiment of the present application;

fig. 9 is a schematic structural diagram after a first through hole is prepared according to an embodiment of the present application;

fig. 10 is a flowchart of preparing a second via according to an embodiment of the present application;

FIG. 11 is a schematic diagram illustrating a structure of a photoresist prepared according to an embodiment of the present application;

FIG. 12 is a top view of the interior of a photoresist bake chamber provided in embodiments of the present application;

FIG. 13 is a schematic structural view of hydrofluoric acid treated as provided by an embodiment of the present application;

FIG. 14 is a schematic diagram illustrating a structure after stripping the photoresist according to an embodiment of the present application;

fig. 15 is a schematic structural diagram of a display panel production apparatus provided in an embodiment of the present application;

description of reference numerals:

100. a glass substrate; 200. an OLED array layer; 300. a passivation layer; 400. a planarization layer;

201. a light-shielding layer; 202. a buffer layer; 203. an active layer; 204. a gate insulating layer; 205. a gate layer; 206. a dielectric layer; 207. a source electrode; 208. a drain electrode;

2061. a dielectric layer via;

301. a second through hole; 401. a first through hole;

10. a photoresist layer; 20. a nozzle; 41. baking device

1000. Display panel production equipment;

1. a first production room; 2. a second production chamber; 3. a photoresist spraying chamber; 4. a photoresist baking chamber; 5. a first hydrofluoric acid spray chamber; 6. a second hydrofluoric acid spray chamber; 7. and an air drying chamber.

Detailed Description

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application. Furthermore, it should be understood that the detailed description and specific examples, while indicating preferred embodiments of the present application, are given by way of illustration and explanation only, and are not intended to limit the present application. In the present application, unless indicated to the contrary, the use of the directional terms "upper" and "lower" generally refer to the upper and lower positions of the device in actual use or operation, and more particularly to the orientation of the figures of the drawings; while "inner" and "outer" are with respect to the outline of the device.

The embodiment of the application provides a preparation method of a display panel, the display panel and display panel production equipment. The following are detailed below. It should be noted that the following description of the embodiments is not intended to limit the preferred order of the embodiments.

As shown in fig. 1, the present embodiment provides a method for manufacturing a display panel, which includes steps S1 to S3.

S1, providing a glass substrate 100, wherein the glass substrate 100 plays a role of a substrate and a supporting role, and the glass substrate 100 is cleaned, so that the influence of particles on a subsequent process is reduced.

And S2, preparing an OLED array layer 200 on the glass substrate 100. As shown in fig. 2 to 8, a light-shielding layer 201, a buffer layer 202, an active layer 203, a gate insulating layer 204, a gate layer 205, a dielectric layer 206, a source 207, and a drain 208 are sequentially prepared to obtain an OLED array layer 200, where the OLED array layer 200 is a circuit control switch of the display panel.

The preparation steps of the OLED array layer 200 are as follows:

a layer of metal material is prevented from being deposited on the upper surface of the glass substrate 100 by adopting a physical deposition coating, the metal material is a single-layer metal material or a multi-layer combined material or an alloy material such as copper (Cu), molybdenum (Mo), titanium (Ti), aluminum (Al), and the like, and a light shielding layer 201 (see fig. 2) is formed after patterning through operations such as photoresist coating, exposure, development, etching, stripping, and the like, and the light shielding layer 201 plays a role in shielding incident light.

An inorganic material is deposited on the upper surfaces of the glass substrate 100 and the light-shielding layer 201 by a chemical deposition coating method, the inorganic material may be a single layer or a stacked structure of silicon nitride (SiN) or silicon oxide (SiO), a buffer layer 202 is formed (see fig. 3), and the buffer layer 202 has an external water and oxygen isolation effect.

A layer of semiconductor material is deposited by physically depositing a coating on the upper surface of the buffer layer 202, for example: indium Gallium Zinc Oxide (IGZO), indium Gallium Tin Oxide (IGTO), and the like, and then patterned by photoresist coating, exposure, development, etching, film stripping, and the like to form the active layer 203 (see fig. 4). The active layer 203 is formed of a single layer or a stacked structure of these semiconductor materials or an alloy material.

An inorganic material, which is typically a single layer or a stacked structure of silicon nitride (SiN) or silicon oxide (SiO), is deposited on the upper surface of the active layer 203 by chemical deposition to form the gate insulating layer 204 (see fig. 5).

A layer of metal material is deposited on the upper surface of the gate insulating layer 204 by means of physical deposition coating, and the metal material is a single-layer metal material or a multi-layer composite material or an alloy material such as copper (Cu), molybdenum (Mo), titanium (Ti), aluminum (Al), etc., and then the gate layer 205 is formed by operations such as photoresist coating, exposure, development, etching, film stripping, etc. (see fig. 6).

It is to be noted in particular that: the etching step is to etch a pattern layer of the gate layer 205 by a wet etching process, and then etch a pattern of the gate insulating layer 204 by a dry etching process, so that the gate layer 205, the gate insulating layer 204 and the active layer 203 are arranged oppositely, and He (helium) is used for inducing conductization, so that the part of the active layer 203 covered by the gate layer 205 and the gate insulating layer 204 still retains the semiconductor performance, and the uncovered part is conductized and has the conductor performance.

Depositing a layer of inorganic material on the upper surfaces of the gate electrode layer 205, the gate insulating layer 204, the active layer 203 and the buffer layer 202 by chemical deposition coating, wherein the inorganic material is a single-layer or stacked structure of silicon nitride (SiN) or silicon oxide (SiO), and performing operations such as photoresist coating, exposure, development, etching, film stripping, and the like to form a dielectric layer 206 after patterning, in the etching process, the mask plate etches the dielectric layer 206 by dry etching, a dielectric layer through hole 2061 (see fig. 7) is formed after etching, and the dielectric layer through hole 2061 is used as a connecting channel between a subsequent source and drain electrode and the active layer 203.

A layer of metal material is deposited on the upper surface of the dielectric layer 206 by means of physical deposition coating, the metal material is a single-layer metal material or a multi-layer composite material or an alloy material such as copper (Cu), molybdenum (Mo), titanium (Ti), aluminum (Al), etc., and then the source electrode 207 and the drain electrode 208 are formed after the operations such as photoresist coating, exposure, development, etching, stripping, etc., and patterning (see fig. 8).

S3, preparing a passivation layer 300 and a flat layer 400 on the OLED array layer 200, preparing a first via 401 on the flat layer 400, and preparing a second via 301 on the passivation layer 300, which will be described in detail below with reference to fig. 9 to 14.

A layer of insulating material, which is silicon nitride (SiN) and/or silicon oxide (SiO), is deposited on the upper surfaces of the source electrode 207, the drain electrode 208 and the dielectric layer 206 by chemical deposition, so as to form a passivation layer 300. Then, a layer of inorganic material is coated on the upper surface of the passivation layer 300 by using a coater to form a flat layer 400, and then, the operations of exposure, development and baking are respectively performed on the flat layer 400, and after ashing, a first through hole 401 (see fig. 9) is formed on the flat layer 400 to expose a portion of the passivation layer 300, and the first through hole 401 is disposed opposite to the drain electrode 208.

In the conventional flexible device TFT, in order to reduce one-line light irradiation, hydrofluoric acid (HF) is selected to etch the passivation layer, but at the same time, the back surface of the glass substrate is also corroded by the hydrofluoric acid, resulting in white stains in a droplet shape and a roller mark shape in a macroscopic state, and gritty stains in a microscopic state. The biggest influence of corrosion of the glass substrate is that laser stripping is difficult in practical production, an OLED device layer is easy to cause a display panel to fall off after being pulled, and black spots, thin black lines and other phenomena appear on a picture after lighting.

As shown in fig. 10 to fig. 14, in order to solve the above problem, in this embodiment, a photoresist layer 10 is added on the back surface of the glass substrate 100, that is, on the side of the glass substrate 100 away from the OLED array layer 200, so that the glass substrate 100 can be protected from corrosion when the whole device is etched by hydrofluoric acid. The specific process includes steps S31 to S36, which will be described in detail below.

S31, a photoresist spraying step, specifically, arranging a photoresist layer 10 on a side of the glass substrate 100 away from the OLED array layer 200, i.e., spraying a layer of photoresist material on the back surface of the glass substrate 100 through a nozzle 20 (see fig. 11), where the nozzle 20 is disposed below the glass substrate 100 and sprays photoresist material upwards, the photoresist material includes resin, photosensitizer, solvent, and the like, and the nozzle 20 is located right below the glass substrate 100 to protect the lower surface of the glass substrate 100, where the thickness of the sprayed photoresist material is about 1 μm. In the spraying process, a roller is used to ensure that the photoresist is uniformly sprayed on the lower surface of the glass substrate 100.

And S32, carrying out baking curing treatment, namely transmitting the whole device sprayed with the photoresist material into a photoresist baking chamber 4 for baking curing treatment to form a photoresist layer 10, wherein the baked and cured photoresist layer 10 can have better adhesive force with the glass substrate 100. A baking device 41 is disposed on the top of the photoresist baking chamber 4, the baking device 41 is typically a heating wire or an extreme ultraviolet device (EUV) (see fig. 12), the heating wire or the EUV is uniformly distributed to ensure that the device can be uniformly heated during baking, and the heating wire typically heats the room temperature in the photoresist baking chamber 4 to 100 ℃ during baking.

S33, performing a first hydrofluoric acid spraying treatment, and transferring the whole baked and cured device to a chemical solution tank in the first hydrofluoric acid spraying chamber 5 to start the hydrofluoric acid spraying treatment, wherein in this process, the passivation layer 300 exposed from the first through hole 401 on the planarization layer 400 is corroded by the hydrofluoric acid, and in this process, the photoresist layer 10 on the lower surface of the glass substrate 100 is also partially corroded but is not completely corroded, and the glass substrate 100 protected by the photoresist layer is not exposed, so that the glass substrate 100 is not corroded and is well protected in the hydrofluoric acid spraying process.

And S34, performing second hydrofluoric acid spraying treatment, wherein the process of the second hydrofluoric acid spraying treatment is the same as that of the first hydrofluoric acid spraying treatment, two or even multiple hydrofluoric acid spraying treatments are performed because the width of the conventional hydrofluoric acid spraying cavity is insufficient, and the conventional hydrofluoric acid spraying cavity is difficult to completely etch in one operation, so that segmented spraying needs to be performed on the conventional hydrofluoric acid spraying cavity, and meanwhile, the multiple hydrofluoric acid spraying treatments are performed to improve the etching uniformity of hydrofluoric acid on the passivation layer 300, and a second through hole 301 (see figure 13) is formed by performing multiple etching until the drain electrode 208 below the passivation layer 300 is exposed, wherein the second through hole 301 corresponds to the drain electrode 208 of the OLED array layer 200, and the second through hole 301 is communicated with the first through hole 401.

And S35, carrying out air drying treatment, conveying the etched whole device into an air drying chamber for air drying treatment, and ensuring that the whole device is dried and then carrying out the next process.

S36, stripping the photoresist layer 10, specifically, separating the photoresist layer 10 from the glass substrate 100 by laser stripping (see fig. 14), in this process, the process difficulty is not increased, and the existing laser stripping technology is mature, so that the glass substrate 100 is not affected, and the glass substrate 100 is protected.

In this embodiment, at the lower surface spraying one deck light resistance layer 10 of glass substrate 100, when carrying out hydrofluoric acid spray etching to passivation layer 300, light resistance layer 10 can play the protection glass substrate 100's effect prevents that its surface from leaving the roller print, avoids being corroded by hydrofluoric acid, just can avoid glass substrate 100 is the white filth of drop form and roller print form under the macroscopic state, presents sand gravel form and so on phenomenon under the microcosmic state, can reduce the degree of difficulty of Peeling off when actual production, prevents that OLED array layer 200 from receiving to pull and then causing display surface Peeling, the back picture of lighting a lamp to appear black spot, thin black line scheduling problem, improves display panel's display effect, improves display device's yield.

As shown in fig. 14, this embodiment further provides a display panel, where the display panel is prepared by the method for preparing a display panel, and the method includes: the glass substrate 100, the OLED array layer 200, the passivation layer 300, and the planarization layer 400 further include a light emitting device (not shown), a pixel electrode (not shown), a cover plate (not shown), and the like.

OLED array layer 200 locates the surface of glass substrate 100 one side, OLED array layer 200 includes from up down in proper order: a light-shielding layer 201, a buffer layer 202, an active layer 203, a gate insulating layer 204, a gate layer 205, a dielectric layer 206, and a source electrode 207 and a drain electrode 208. The passivation layer 300 is arranged on the surface of the OLED array layer 200 far away from the glass substrate 100, and a second through hole 301 formed by etching hydrofluoric acid is arranged on the passivation layer 300. The flat layer 400 is arranged on the surface of one side, away from the OLED array layer 200, of the passivation layer 300, a first through hole 401 is arranged on the flat layer 400, the first through hole 401 is communicated with the second through hole 301, the formed through hole is opposite to the drain electrode 208 on the OLED array layer 200, and the through hole provides a channel for connection between a subsequent anode layer and the drain electrode 208, so that the OLED array layer 200 drives the light-emitting device to be in a circuit mode.

The display panel manufactured by the manufacturing method of the display panel can effectively avoid the corrosion of the back surface of the glass substrate in the process of etching the passivation layer by hydrofluoric acid, prevent the problems of Peeling of the display surface, black spots and thin black lines of a picture after lighting and the like caused by the pulling of the OLED array layer, improve the display effect of the display panel and improve the yield of display devices.

As shown in fig. 15, the present embodiment further includes a display panel production apparatus 1000 for producing the display panel according to the present invention, which includes a first production chamber 1, a second production chamber 2, a photoresist spraying chamber 3, a photoresist baking chamber 4, a first hydrofluoric acid spraying chamber 5, a second hydrofluoric acid spraying chamber 6, and an air drying chamber 7, which are sequentially disposed.

Wherein the first production chamber 1 is used for preparing an OLED array layer 200 on the glass substrate 100; the second production chamber 2 is used for preparing a passivation layer 300 and a flat layer 400 on the OLED array layer 200; the light resistance spraying chamber 3 is used for spraying light resistance materials on one side of the glass substrate 100 far away from the OLED array layer 200; the light resistance baking chamber 4 is used for baking and curing the light resistance material on one side of the glass substrate 100 away from the OLED array layer 200 to form the light resistance layer 10; the first hydrofluoric acid spray chamber 5 and the second hydrofluoric acid spray chamber 6 are used for forming the second via hole 301 on the passivation layer 300; the air drying chamber 7 is used for carrying out air drying treatment.

This embodiment increases photoresistance spray booth 3 and photoresistance baking chamber 4 before getting into first hydrofluoric acid spray booth 5, at glass substrate 100's lower surface spraying one deck layer of photoresistance 10, when carrying out hydrofluoric acid spray etching to passivation layer 300, photoresistance layer 10 can play the protection glass substrate 100's effect prevents that its surface from leaving the gyro wheel seal, avoids being corroded by hydrofluoric acid, just can avoid glass substrate 100 is the white dirt of drop form and gyro wheel seal form under the macroscopic state, presents phenomena such as grit form under the microcosmic state, can reduce the degree of difficulty of Peeling off when actual production, prevents that OLED array layer 200 from receiving to pull and then cause display surface Peeling, the back picture of lighting a lamp appears black spot, thin black line scheduling problem, improves display panel's display effect, improves display device's yield.

The above detailed description is provided for the preparation method of the display panel, the display panel and the display panel production equipment provided in the embodiments of the present application, and a specific example is applied in the present application to explain the principle and the implementation manner of the present application, and the description of the above embodiments is only used to help understanding the method and the core idea of the present application; meanwhile, for those skilled in the art, according to the idea of the present application, there may be variations in the specific embodiments and the application scope, and in summary, the content of the present specification should not be construed as a limitation to the present application.

Claims

1. The preparation method of the display panel is characterized by comprising the following steps of:

providing a glass substrate;

preparing an OLED array layer on the glass substrate; and

preparing a passivation layer and a flat layer on the OLED array layer, preparing a first through hole on the flat layer and preparing a second through hole on the passivation layer;

wherein the steps of preparing a first via hole on the planarization layer and preparing a second via hole on the passivation layer include:

arranging a light resistance layer on one side of the glass substrate far away from the OLED array layer;

performing hydrofluoric acid spraying treatment to form the second through hole on the passivation layer;

and stripping the photoresist layer.

2. The method of manufacturing a display panel according to claim 1, wherein the step of manufacturing a passivation layer and a planarization layer on the OLED array layer comprises:

depositing a layer of insulating material on the surface of one side, away from the glass substrate, of the OLED array layer to serve as a passivation layer;

coating a layer of inorganic material on the surface of one side of the passivation layer, which is far away from the glass substrate, so as to form a flat layer;

after exposure, development, baking and etching, the first through hole is formed on the flat layer and is arranged corresponding to the drain electrode of the OLED array layer.

3. The method of claim 1, wherein the step of disposing a photoresist layer on a side of the glass substrate away from the OLED array layer comprises:

and spraying a light resistance material on one side of the glass substrate far away from the OLED array layer, and carrying out baking and curing treatment to form the light resistance layer.

4. The method for manufacturing a display panel according to claim 3,

when the photoresist material is sprayed, a roller type roller is adopted to roll on the bottom surface of the glass substrate, so that the photoresist material is uniformly sprayed.

5. The method of manufacturing a display panel according to claim 3,

in the step of performing the baking curing treatment, a heating wire or extreme ultraviolet curing treatment is adopted.

6. The method for manufacturing a display panel according to claim 2, wherein the step of performing hydrofluoric acid shower treatment includes:

and carrying out hydrofluoric acid spraying treatment at least twice, wherein the passivation layer forms a second through hole at a position corresponding to the first through hole of the flat layer, the second through hole is arranged corresponding to the drain electrode of the OLED array layer, and the second through hole of the passivation layer is communicated with the first through hole of the flat layer.

7. The method for manufacturing a display panel according to claim 6,

and after the hydrofluoric acid spraying step, carrying out air drying treatment.

8. The method for manufacturing a display panel according to claim 1, wherein in the step of peeling off the photoresist layer, the photoresist layer is separated from the glass substrate by laser lift-off.

9. A display panel produced by the production method for a display panel according to any one of claims 1 to 8;

the display panel includes:

a glass substrate;

the OLED array layer is arranged on the surface of one side of the glass substrate;

the passivation layer is arranged on the surface of one side, away from the glass substrate, of the OLED array layer, and a second through hole formed by etching through hydrofluoric acid is formed in the passivation layer;

the flat layer is arranged on the surface, far away from the OLED array layer, of the passivation layer, a first through hole is formed in the flat layer and communicated with the second through hole, and the first through hole and the second through hole are arranged corresponding to the drain electrode of the OLED array layer.

10. A display panel production apparatus for producing the display panel according to claim 9, comprising a first production chamber, a second production chamber, a resist spray chamber, a resist baking chamber, a first hydrofluoric acid spray chamber, a second hydrofluoric acid spray chamber, and an air drying chamber, which are arranged in this order;

the first production chamber is used for preparing an OLED array layer on the glass substrate; the second production chamber is used for preparing a passivation layer and a flat layer on the OLED array layer; the light resistance spraying chamber is used for spraying light resistance materials on one side of the glass substrate far away from the OLED array layer; the light resistance baking chamber is used for baking and curing the light resistance material on one side of the glass substrate, which is far away from the OLED array layer, to form the light resistance layer; the first hydrofluoric acid spray chamber and the second hydrofluoric acid spray chamber are used for forming the second through hole on the passivation layer; the air drying chamber is used for carrying out air drying treatment.