CN115696902B - Packaging device for packaging environmental factor acquisition system - Google Patents
Packaging device for packaging environmental factor acquisition system Download PDFInfo
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- CN115696902B CN115696902B CN202211680765.5A CN202211680765A CN115696902B CN 115696902 B CN115696902 B CN 115696902B CN 202211680765 A CN202211680765 A CN 202211680765A CN 115696902 B CN115696902 B CN 115696902B
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Abstract
An environmental factor acquisition system and a packaging device comprise an environmental factor acquisition system and a packaging device used for packaging the environmental factor acquisition system. The environment factor acquisition system comprises a base, a circuit board and a cover plate, wherein the circuit board is provided with a temperature sensing module, a humidity sensing module, an illumination sensing module and a personnel existence sensing module. The packaging device comprises a circuit board conveying unit, a module storage unit, a module clamping unit, a bending unit, a welding unit, a base conveying unit, a cover plate storage unit and a cover plate installation unit. The bending unit is used for bending the pins of the sensing module. The welding unit is used for welding the sensing assembly to the circuit board. The base conveying unit is used for conveying the base and mounting the circuit board on the base. The system can realize low-cost and all-element environmental factor collection, is convenient and fast to communicate, is stable and reliable to operate, realizes full-automatic packaging from the whole process of obtaining the module, bending and welding to the assembly shell by the packaging device, and has high working efficiency.
Description
Technical Field
The invention relates to the technical field of building intelligent equipment, in particular to an environmental factor acquisition system and an encapsulation device.
Background
In the intelligent operation and maintenance system of the building, the importance of energy conservation and consumption reduction is particularly outstanding, the energy expenditure can be saved, and the low-carbon operation can be realized. An automated energy management system is generally composed of several units of environmental factor acquisition/environmental regulation and control algorithm/energy consumption equipment parameter control, which form an automated loop control feedback system. In the three units, the equipment parameter control technology is mature, the self-defined control decision can be realized by general software of an environment regulation and control algorithm, but the environment factor acquisition link has a larger problem at present.
The sensing modules adopted in the process of collecting environmental factors at present are various in types, large in occupied space, high in power consumption and high in cost. In addition, the environmental factor collecting device needs to be replaced when the environmental factor collecting device fails, and the environmental factor sensing module is updated quickly, so that different sensing modules need to be used, the packaging device needs to be replaced along with the environmental factor sensing module, and the cost is increased.
Disclosure of Invention
Aiming at the defects, the invention provides the environmental factor acquisition system and the packaging device, the system can realize low-cost and full-factor environmental factor acquisition, the communication is convenient and fast, the operation is stable and reliable, the packaging device realizes full-automatic packaging in the whole process of acquiring the module, bending and welding to the assembly shell, and the working efficiency is high.
In order to achieve the purpose of the invention, the following technology is adopted:
an environmental factor collection system comprising:
the bottom surface in the base is provided with a plurality of mounting holes;
the circuit board, bottom in locating the base sets up a plurality of through-holes that match with the mounting hole on the circuit board, is equipped with host system on the circuit board, still is equipped with a plurality of positions of welding on the circuit board, welds and installs sensing assembly on the position, and sensing assembly includes four sensing module: the system comprises a temperature sensing module, a humidity sensing module, an illumination sensing module and a personnel existence sensing module;
the cover plate is arranged on the circuit board, a plurality of mounting rods matched with the mounting holes are arranged at the lower end of the cover plate, a plurality of through grooves are formed in the upper end face of the cover plate, and the through grooves are used for allowing sensing parts of all sensing modules of the sensing assembly to extend out of the cover plate.
An encapsulation device for encapsulating an environmental factor collection system, comprising:
the circuit board conveying unit is used for conveying the circuit board and mounting the sensing assembly on the circuit board;
the module storage unit is arranged on one side of the circuit board conveying unit, is used for storing the sensing module and comprises a plurality of module grooves;
the module clamping unit is arranged above the circuit board conveying unit and used for clamping the sensing module;
the bending unit is also arranged on one side of the circuit board conveying unit and comprises a pair of ninth linear mechanisms, one end of an output shaft of each ninth linear mechanism is provided with a fourth rotating motor, one end of an output shaft of each fourth rotating motor is provided with a second connecting rod, one end of each fourth rotating motor is provided with a second connecting plate, one side of one end face of each second connecting plate is provided with a second fixed plate, one side face of each second connecting plate is provided with a tenth linear mechanism, one end of the output shaft of each ninth linear mechanism is provided with a second movable plate matched with the second fixed plate, and an area between the second fixed plate and the second movable plate is used for bending pins of the sensing module;
the welding unit is arranged on the other side of the circuit board conveying unit and comprises a moving assembly, a rotating assembly is arranged at the lower end of the moving assembly, and a laser welder is arranged at one end of the rotating assembly;
the base conveying unit is also arranged on the other side of the circuit board conveying unit and is used for conveying the base and mounting the circuit board on the base;
the cover plate storage unit is arranged on one side of the base conveying unit and used for storing the cover plate;
the cover plate installation unit is arranged above the cover plate storage unit and comprises a transfer assembly arranged on the hanging bracket, and a vacuum suction hanger is arranged at the lower end of the transfer assembly.
Further, the circuit board conveying unit comprises a first conveying belt mechanism arranged on the support, a pair of fixing assemblies is arranged on two sides of the first conveying belt mechanism, a fourth linear mechanism placed on the support is further arranged on one side of the first conveying belt mechanism, a push plate is arranged at one end of an output shaft of the first conveying belt mechanism, a slide way is further arranged on the other side of the first conveying belt mechanism, an extension plate is arranged on one side of the upper end of the extension plate, the upper end face of the extension plate is matched with the lower end face of the circuit board, an extension rod is arranged on one side of the extension plate and used for limiting the circuit board of the assembled sensing assembly, a pair of limiting fences is arranged on two sides of the slide way, a fifth linear mechanism is arranged on one side of one limiting fence, and a movable fence matched with the limiting fence is arranged at one end of the output shaft of the fifth linear mechanism.
Further, the module clamping unit comprises a sixth linear mechanism arranged on the hanger, a seventh linear mechanism which is vertical to the sixth linear mechanism and is arranged on the same horizontal plane is arranged at the lower end of the sliding end of the sixth linear mechanism, an eighth linear mechanism which is vertically arranged is arranged at the lower end of the sliding end of the seventh linear mechanism, a second rotating motor is arranged at one end of an output shaft of the eighth linear mechanism, a first connecting rod is arranged on the periphery of one end of the output shaft of the second rotating motor, a third rotating motor is arranged at one end of the first connecting rod, a double-head linear cylinder is arranged at one end of the output shaft of the first connecting rod, an L-shaped rod is arranged at one end of each of two output shafts of the double-head linear cylinder, and a clamping block is arranged at one end of the lower portion of the double-head linear cylinder.
Furthermore, the moving assembly comprises an eleventh linear mechanism arranged on the hanger, a twelfth linear mechanism is arranged at one end of an output shaft of the moving assembly, the rotating assembly comprises a fifth rotating motor arranged at the lower end of a sliding end of the twelfth linear mechanism, a sixth rotating motor is arranged at the output shaft of the rotating assembly, and the laser welding device is arranged at one end of the sixth rotating motor.
Further, the base conveying unit comprises a second conveyor belt mechanism arranged on the support, a pair of thirteenth linear mechanisms arranged on the support are arranged on two sides of the second conveyor belt mechanism, and an L-shaped plate is arranged at one end of an output shaft of the thirteenth linear mechanism.
Further, the transfer assembly comprises a fourteenth linear mechanism, one end of an output shaft of the fourteenth linear mechanism is provided with a fifteenth linear mechanism which is vertically arranged, the lower end of the output shaft of the fifteenth linear mechanism is provided with a seventh rotating motor, one end of an output shaft of the seventh rotating motor is provided with a sixteenth linear mechanism which is vertically arranged, and the vacuum suction hanger is arranged at the lower end of the output shaft of the sixteenth linear mechanism.
Furthermore, the fixing assembly comprises a first linear mechanism, one end of an output shaft of the first linear mechanism is provided with a vertically arranged second linear mechanism, one end of an output shaft of the second linear mechanism is provided with a first rotating motor, one end of an output shaft of the first rotating motor is provided with a first connecting plate, one end of the first connecting plate is provided with a first fixing plate, one side face of the first connecting plate is provided with a third linear mechanism, one end of the output shaft of the first rotating motor is provided with a first movable plate matched with the first fixing plate, and an area between the first fixing plate and the first movable plate is used for clamping the circuit board.
The beneficial effects of this technical scheme lie in:
1. the system for collecting the environmental factors in real time is packaged into industrial hardware equipment with small volume and low power consumption, and signals are uniformly collected and then sent to a subsequent processing unit of an automatic energy consumption management system, so that the aims of reasonably using heating ventilation and lighting equipment and saving energy and reducing consumption are fulfilled.
2. The packaging device of the real-time environmental factor acquisition system can realize full-automatic packaging from the acquisition module, bending and welding to the whole process of assembling the shell, and can install the temperature sensing modules, the humidity sensing modules, the illumination sensing modules and the personnel existence sensing modules of different specifications on the circuit boards of the corresponding different specifications, and meanwhile, the base and the cover plate of the different specifications can also be correspondingly installed, so that the system can be conveniently upgraded, and the intelligent operation and maintenance cost of a building can be reduced.
Drawings
Fig. 1 shows an overall perspective view of an embodiment of the present application.
Fig. 2 shows an exploded view of an environmental factor collection system according to an embodiment of the present application.
Fig. 3 is a perspective view of a circuit board according to an embodiment of the present application.
Fig. 4 shows an overall perspective view of the second embodiment of the present application.
Fig. 5 is a perspective view illustrating a second circuit board conveying unit according to an embodiment of the present application.
Fig. 6 is a perspective view of a circuit board conveying unit at another angle according to an embodiment of the present application.
Fig. 7 is a perspective view of a second fixing assembly according to an embodiment of the present application.
Fig. 8 shows a perspective view of a second slideway according to an embodiment of the present application.
Fig. 9 is a perspective view showing a second module storage unit according to an embodiment of the present application.
Fig. 10 is a perspective view of a second module clamping unit according to an embodiment of the present application.
Fig. 11 is a perspective view illustrating a bending unit according to an embodiment of the present application.
Fig. 12 is a perspective view of a second welding unit according to an embodiment of the present application.
Fig. 13 is a perspective view of a second base conveying unit according to an embodiment of the present application.
Fig. 14 is a perspective view of a second cover storage unit according to an embodiment of the present application.
Fig. 15 is a perspective view showing a second cover plate mounting unit according to an embodiment of the present application.
The labels in the figure are: a circuit board conveying unit-1, a first conveyor belt mechanism-11, a first linear mechanism-12, a second linear mechanism-121, a first rotating motor-122, a first connecting plate-123, a first fixing plate-124, a third linear mechanism-125, a first movable plate-126, a fourth linear mechanism-13, a push plate-131, a slideway-14, an extending plate-141, an extending rod-142, a limit fence-143, a fifth linear mechanism-144, a movable fence-145, a module storage unit-2, a first mounting rack-21, a module groove-22, a module clamping unit-3, a sixth linear mechanism-31, a seventh linear mechanism-32, an eighth linear mechanism-33, a second rotating motor-34, a first connecting rod-35, a third rotating motor-36, a double-head linear cylinder-37, an L-shaped rod-38, a clamping block-39, a bending unit-4, a ninth linear mechanism-41, a fourth rotating motor-42, a second connecting rod-43, a second connecting plate-44, a second connecting plate-45, a thirteenth linear mechanism-37, a second cover plate-45, a twelfth linear mechanism-54, a second movable plate-7-54, a twelfth linear mechanism-54, a laser welding mechanism-7-54, a laser welding mechanism-4, a laser welding mechanism-7-4, a laser welding mechanism, the device comprises a cover plate mounting unit-8, a fourteenth linear mechanism-81, a fifteenth linear mechanism-82, a seventh rotating motor-83, a sixteenth linear mechanism-84, a vacuum suction crane-85, a base-91, a mounting hole-911, a circuit board-92, a through hole-921, a main control module-922, a welding position-923, a temperature sensing module-93, a humidity sensing module-94, an illumination sensing module-95, a personnel existence sensing module-96, a cover plate-97, a mounting rod-971 and a through groove-972.
Detailed Description
The present application is further described below with reference to the accompanying drawings and examples.
Example one
The environmental factor collecting system shown in fig. 1 includes a base 91, a circuit board 92, and a cover 97.
As shown in fig. 2, a plurality of mounting holes 911 are formed in the bottom surface of the base 91.
As shown in fig. 2-3, bottom in the base 91 is located to circuit board 92, sets up a plurality of through-holes 921 that match with mounting hole 911 on the circuit board 92, is equipped with host system 922 on the circuit board 92, still is equipped with a plurality of positions 923 that weld on the circuit board 92, welds and installs the sensing assembly on the position 923, and the sensing assembly includes four sensing modules: temperature sensing module 93, humidity sensing module 94, illumination sensing module 95, and person presence sensing module 96.
As shown in fig. 2, the cover plate 97 is disposed on the circuit board 92, the lower end of the cover plate is provided with a plurality of mounting rods 971 matching with the mounting holes 911, the upper end surface of the cover plate 97 is provided with a plurality of through grooves 972, and the through grooves 972 are used for extending the sensing parts of the sensing modules of the sensing assembly out of the cover plate 97.
The operation mode is as follows:
the environmental factor collection system may be installed on a wall or ceiling inside a building, and the specific installation manner may be a perforated installation or the like known to those skilled in the art.
After the installation is finished, collected signals are concentrated to the main control module 922 after the temperature sensing module 93, the humidity sensing module 94, the illumination sensing module 95 and the personnel existence sensing module 96 detect the temperature/humidity/illumination/personnel existence, then the signals are fed back to the network through the communication line in the building, and finally the signals are collected by the upper application system and used for a subsequent environment regulation and control algorithm.
Example two
In the present embodiment, the sensing module refers to a temperature sensing module 93 or a humidity sensing module 94 or an illuminance sensing module 95 or a human presence sensing module 96.
Fig. 4 shows a packaging apparatus for packaging an environmental factor collecting system according to the first embodiment, which includes a circuit board conveying unit 1, a module storage unit 2, a module clamping unit 3, a bending unit 4, a welding unit 5, a base conveying unit 6, a cover storage unit 7, and a cover installation unit 8.
As shown in fig. 5 to 6, the circuit board conveying unit 1 includes a first belt conveying mechanism 11 disposed on the support, a belt width of an upper end of the first belt conveying mechanism 11 is smaller than a width of the circuit board 92, and a pair of fixing components for stabilizing the circuit board 92 of the sensor component to be assembled are disposed on two sides of the first belt conveying mechanism 11.
As shown in fig. 7, the fixing assembly includes a first linear mechanism 12, a second linear mechanism 121 vertically disposed is disposed at one end of an output shaft of the first linear mechanism 12, a first rotating motor 122 is disposed at one end of the output shaft of the second linear mechanism 121, a first connecting plate 123 is disposed at one end of an output shaft of the first rotating motor 122, a first fixing plate 124 is disposed at one end of the first connecting plate 123, a third linear mechanism 125 is disposed at one side of the first connecting plate 123, a first movable plate 126 matched with the first fixing plate 124 is disposed at one end of the output shaft, a region between the first fixing plate 124 and the first movable plate 126 is used for clamping the circuit board 92, a fourth linear mechanism 13 disposed on the support is further disposed at one side of the first conveying mechanism 11, a push plate 131 for pushing the circuit board 92 with the sensing assembly assembled is disposed at one end of the output shaft, and a slide 14 is further disposed at the other side of the first conveying mechanism 11.
As shown in fig. 8, an extension board 141 is disposed on one side of the upper end of the slide way 14, the upper end surface of the extension board 141 is matched with the lower end surface of the circuit board 92, an extension rod 142 is disposed on one side of the extension board 141, the extension rod 142 is used for limiting the circuit board 92 with the sensor module assembled, a pair of position-limiting rails 143 is disposed on two sides of the slide way 14, a fifth linear mechanism 144 is disposed on one side of one position-limiting rail 143, a movable rail 145 matched with the position-limiting rail 143 is disposed at one end of an output shaft of the fifth linear mechanism, and an area between the movable rail 145 and one position-limiting rail 143 is used for sliding down the circuit boards 92 with different specifications.
As shown in fig. 9, the module storage unit 2 is provided at one side of the circuit board transfer unit 1 with a predetermined interval for storing the sensor modules, and the module storage unit 2 includes a plurality of sets of first mounting frames 21 on which module slots 22 for storing the sensor modules are mounted, and the specifications of the module slots 22 may be changed according to different specifications of the sensor modules.
As shown in fig. 10, the module clamping unit 3 is disposed above the circuit board conveying unit 1 for clamping the sensing module, the module clamping unit 3 includes a sixth linear mechanism 31 disposed on the hanger, specifically, a sliding range of a sliding end of the sixth linear mechanism 31 covers a region from above the circuit board conveying unit 1 to above the module storage unit 2, a seventh linear mechanism 32 disposed at a same horizontal plane and perpendicular to a lower end of the sliding end of the sixth linear mechanism 31 is disposed at a lower end of the sliding end of the seventh linear mechanism 32, an eighth linear mechanism 33 disposed vertically is disposed at a lower end of the sliding end of the seventh linear mechanism 32, a second rotating motor 34 is disposed at one end of an output shaft of the eighth linear mechanism 33, a first connecting rod 35 is disposed at an outer peripheral side of one end of the output shaft of the second rotating motor 34, a third rotating motor 36 is disposed at one end of the first connecting rod 35, a double-headed linear cylinder 37 is disposed at one end of each of two output shafts of the double-headed linear cylinder 37, and an L-shaped rod 38 is disposed at one end of a lower end of the double-headed linear cylinder 37.
As shown in fig. 11, the bending unit 4 is also disposed at one side of the circuit board conveying unit 1 and has a predetermined interval, specifically, the bending unit 4 is disposed between the module storage unit 2 and the circuit board conveying unit 1, the bending unit 4 includes a pair of ninth linear mechanisms 41, one end of an output shaft of the pair of ninth linear mechanisms is provided with a fourth rotating motor 42, one end of an output shaft of the fourth rotating motor 42 is provided with a second connecting rod 43, one end of the fourth connecting rod is provided with a second connecting plate 44, one end surface side of the second connecting plate 44 is provided with a second fixing plate 45, one side surface of the second connecting plate 44 is provided with a tenth linear mechanism 46, one end of the output shaft is provided with a second movable plate 47 matched with the second fixing plate 45, and an area between the second fixing plate 45 and the second movable plate 47 is used for bending the pins of the sensor module.
As shown in fig. 12, the welding unit 5 is disposed at the other side of the circuit board conveying unit 1, the welding unit 5 includes a moving assembly, the moving assembly includes an eleventh linear mechanism 51 disposed on the hanger, a twelfth linear mechanism 52 is disposed at one end of an output shaft of the moving assembly, a rotating assembly is disposed at a lower end of a sliding end of the twelfth linear mechanism 52, the rotating assembly includes a fifth rotating motor 53, a sixth rotating motor 54 is disposed at the output shaft of the rotating assembly, a laser welder 55 is disposed at one end of the sixth rotating motor 54, and the rotating assembly is used for adjusting an angle of the laser welder 55 so as to weld the sensing module.
As shown in fig. 13, the base conveying unit 6 is also disposed on the other side of the circuit board conveying unit 1, and is used for conveying the base 91 and mounting the circuit board 92 on the base 91, the base conveying unit 6 includes a second conveyor belt mechanism 61 disposed on the support and used for conveying the base 91, a pair of thirteenth linear mechanisms 62 disposed on the support are disposed on two sides of the second conveyor belt mechanism 61, and one end of an output shaft of the thirteenth linear mechanism is provided with an L-shaped plate 63 used for sliding of the base 91 during system assembly.
As shown in fig. 14, the cover storage unit 7 is provided at one side of the base conveyor unit 6 for storing the cover 97, and the cover storage unit 7 includes a set of second mounting brackets 71 on which the cover grooves 72 are mounted, and the size of the cover grooves 72 may be changed according to the size of the cover 97.
As shown in fig. 15, the cover plate mounting unit 8 is disposed above the cover plate storage unit 7, the cover plate mounting unit 8 includes a transfer component disposed on the hanger, the transfer component includes a fourteenth linear mechanism 81, one end of an output shaft of the fourteenth linear mechanism is provided with a fifteenth linear mechanism 82 vertically disposed, a seventh rotating motor 83 is disposed at a lower end of the output shaft of the fifteenth linear mechanism 82, one end of the output shaft of the seventh rotating motor 83 is provided with a sixteenth linear mechanism 84 vertically disposed, and a vacuum sucking hanger 85 is disposed at a lower end of the output shaft of the sixteenth linear mechanism 84.
In the present embodiment, the first conveyor belt mechanism 11 and the second conveyor belt mechanism 61 are conveyor belt conveyors known to those skilled in the art.
The hangers and brackets described in this embodiment are prior art and will not be described herein.
In the present embodiment, single-axis linear cylinders are used for the first linear mechanism 12, the second linear mechanism 121, the third linear mechanism 125, the fourth linear mechanism 13, the fifth linear mechanism 144, the eighth linear mechanism 33, the ninth linear mechanism 41, the tenth linear mechanism 46, the eleventh linear mechanism 51, the thirteenth linear mechanism 62, the fourteenth linear mechanism 81, the fifteenth linear mechanism 82, and the sixteenth linear mechanism 84; the sixth linear mechanism 31, the seventh linear mechanism 32 and the twelfth linear mechanism 52 all adopt rodless linear cylinders.
The working mode is as follows:
the method comprises the following steps:
s100: the circuit boards 92 are sequentially placed on the first conveyor belt mechanism 11 for conveyance, and the bases 91 are sequentially placed on the second conveyor belt mechanism 61 for conveyance.
S200: the first conveyor belt mechanism 11 is suspended, and a circuit board 92 is fixed by the fixing component, specifically, the first movable plate 126 is pushed by the third linear mechanism 125 to expand the first fixing portion gap formed between the first fixed plate 124 and the first movable plate 126, the circuit board 92 can be placed in the first fixing portion by the second linear mechanism 121 and the first rotating motor 122, then the first movable plate 126 is pulled by the third linear mechanism 125 to clamp the circuit board 92 by the first fixing portion, and preferably, the position of the first fixing portion can be adjusted by the first linear mechanism 12 to make the first fixing portion avoid the welding position 923.
S300: sequentially acquiring the sensing modules from the module storage unit 2 through the module clamping unit 3, specifically, moving the position of the second rotating motor 34 through the sixth linear mechanism 31, the seventh linear mechanism 32 and the eighth linear mechanism 33, rotating the angle of the clamping block 39 through the second rotating motor 34 and the third rotating motor 36, and clamping the sensing modules through the double-headed linear cylinder 37;
s301: when the module holding unit 3 acquires the humidity sensing module 94 in the step S300, the following step S302 is performed; in the step S300, when the module holding unit 3 acquires the illuminance sensing module 95 or the human presence sensing module 96, the following step S303 is executed;
s302: when the module clamping unit 3 clamps the sensing module to the bending unit 4 for bending, when the brightness sensing module 95 or the personnel presence sensing module 96 is bent, only a mechanism on one side of the bending unit 4 is used, specifically, the tenth straight line mechanism 46 pushes the second movable plate 47 to expand the distance between the second fixed part formed between the second fixed plate 45 and the second movable plate 47, the ninth straight line mechanism 41 pushes the second fixed part to cover the pins of the sensing module, then the tenth straight line mechanism 46 pulls the second movable plate 47 to enable the second fixed part to clamp the sensing module, the fourth rotating motor 42 rotates the pins, and the eighth straight line mechanism 33 is started to pull the sensing module to ascend to bend the pins;
s303: when the temperature sensing module 93 is clamped by the module clamping unit 3 to the bending unit 4 for bending, and the temperature sensing module 93 is bent, mechanisms on both sides of the bending unit 4 are required to be used, specifically, the sixth linear mechanism 31, the seventh linear mechanism 32 and the eighth linear mechanism 33 move the sensing module between the two second connecting plates 44, the tenth linear mechanism 46 pushes the second movable plate 47 to enlarge the distance between the second fixing parts formed between the second fixing plate 45 and the second movable plate 47, the ninth linear mechanism 41 pushes the second fixing part to cover the pins of the sensing module, the tenth linear mechanism 46 pulls the second movable plate 47 to enable the second fixing part to clamp the sensing module, the fourth rotating motor 42 rotates the pins, the eighth linear mechanism 33 is started simultaneously, the sensing module is pulled to rise, the inner sides of the pins are bent once, the ninth linear mechanism 41 changes the position of the second fixing part to enable the second fixing part to clamp the pins to be close to the outer sides, the pins are rotated by the fourth rotating motor 42, the eighth linear mechanism 33 is started simultaneously, the sensing module is pushed to fall, and thus the pins can be bent like a sea gull-shaped pin shown in fig. 2.
S400: the sensing modules clamped by the clamping device are placed on a circuit board 92 to be assembled through the module clamping unit 3, the sensing modules are welded on the circuit board 92 through the welding unit 5 while being clamped, and the sensing modules are sequentially clamped, placed and welded until the sensing modules are completely welded on the circuit board 92, specifically, the eleventh linear mechanism 51 and the twelfth linear mechanism 52 of the moving assembly move the positions of the rotating assemblies, the angles of the laser welding device 55 are adjusted through the fifth rotating motor 53 and the sixth rotating motor 54, and all pins of the sensing modules are welded on a welding position 923.
S500: the circuit board 92 is assembled in the base 91, specifically, the thirteenth linear mechanism 62 is started, the position of the base 91 is limited through the L-shaped plate 63, the base 91 which is in direct contact with the L-shaped plate 63 can be used for receiving the circuit board 92, the thirteenth linear mechanism 62 is stopped while the base 91 and the L-shaped plate 63 are in contact with each other, according to the specification of the circuit board 92, the movable fence 145 is pushed through the fifth linear mechanism 144, the distance between the movable fence 145 and the limiting fence 143 is adjusted, the distance is matched with the circuit board 92, the circuit board 92 can fall along the slide way 14, the first conveyor belt mechanism 11 is continuously started, the circuit board 92 with the welded sensing assembly is moved to the side face of the contact extension rod 142, then the first conveyor belt mechanism 11 is stopped, the fourth linear mechanism 13 is started, the circuit board 92 is pushed through the push plate 131, and falls down to the slide way 14 and falls onto the matched base 91 on the base conveying unit 6.
S600: the cover plate 97 is obtained from the cover plate storage unit 7 by the cover plate mounting unit 8, and specifically, the position of the vacuum pickup 85 is adjusted by the transfer units, i.e., the fourteenth linear mechanism 81 and the fifteenth linear mechanism 82, the angle of the vacuum pickup 85 is adjusted by the seventh rotating motor 83, and after the vacuum pickup 85 is brought close to the cover plate 97 by the sixteenth linear mechanism 84, the cover plate 97 is obtained by the vacuum pickup 85.
S700: the cover plate 97 is mounted on the circuit board 92 placed in the base 91 through the cover plate mounting unit 8, specifically, after the position is adjusted through the fourteenth straight line mechanism 81 and the fifteenth straight line mechanism 82, the cover plate 97 is lowered through the sixteenth straight line mechanism 84 and the operation of the vacuum suction hanger 85 is stopped, the vacuum suction hanger 85 is pushed by the sixteenth straight line mechanism 84, the cover plate is continuously pressed downwards, the mounting rod 971 is pressed to the mounting hole 911 through the through hole 921, and the mounting of the environmental factor collecting system is completed.
Between the steps S300 and S400, since the temperature sensing module 93 is usually mounted directly without being bent, the pins of the humidity sensing module 94 are usually on the same side and need to be bent, and the pins of the illuminance sensing module 95 and the personnel presence sensing module 96 are usually on both sides and also need to be bent, in this embodiment, it is distinguished whether the above several sensing modules need to be bent in the bending unit 4 or not and the specific bending manner.
The above are only some examples listed in the present application and are not intended to limit the present application.
Claims (7)
1. The utility model provides an encapsulating device for encapsulation environmental factor collection system, environmental factor collection system includes base (91), circuit board (92), apron (97), a plurality of mounting holes (911) have been seted up to the bottom in base (91), bottom in base (91) is located in circuit board (92), sets up a plurality of through-holes (921) that match with mounting hole (911) on circuit board (92), is equipped with host system (922) on circuit board (92), still is equipped with a plurality of positions (923) of welding on circuit board (92), welds and installs the sensing subassembly on position (923), and the sensing subassembly includes four sensing module: temperature sensing module (93), humidity sensing module (94), illumination sensing module (95), personnel exist sensing module (96), circuit board (92) is located in apron (97), and its lower extreme is equipped with a plurality of installation poles (971) that match with mounting hole (911), and a plurality of logical grooves (972) have been seted up to apron (97) up end, lead to groove (972) and are used for supplying each sensing module sensing part of sensing subassembly to probe out apron (97), its characterized in that includes:
a circuit board conveying unit (1) for conveying a circuit board (92) and mounting a sensing component on the circuit board (92);
the module storage unit (2) is arranged on one side of the circuit board conveying unit (1) and used for storing the sensing module and comprises a plurality of module grooves (22);
the module clamping unit (3) is arranged above the circuit board conveying unit (1) and used for clamping the sensing module;
the bending unit (4) is also arranged on one side of the circuit board conveying unit (1), the bending unit (4) comprises a pair of ninth linear mechanisms (41), one end of an output shaft of the ninth linear mechanism is provided with a fourth rotating motor (42), one end of the output shaft of the fourth rotating motor (42) is provided with a second connecting rod (43), one end of the ninth linear mechanism is provided with a second connecting plate (44), one side of one end face of the second connecting plate (44) is provided with a second fixed plate (45), one side face of the second connecting plate (44) is provided with a tenth linear mechanism (46), one end of the output shaft of the tenth linear mechanism is provided with a second movable plate (47) matched with the second fixed plate (45), and an area between the second fixed plate (45) and the second movable plate (47) is used for bending pins of the sensing module;
the welding unit (5) is arranged on the other side of the circuit board conveying unit (1), the welding unit (5) comprises a moving assembly, a rotating assembly is arranged at the lower end of the moving assembly, and a laser welding device (55) is arranged at one end of the rotating assembly;
the base conveying unit (6) is also arranged on the other side of the circuit board conveying unit (1) and is used for conveying the base (91) and mounting the circuit board (92) on the base (91);
the cover plate storage unit (7) is arranged on one side of the base conveying unit (6) and is used for storing the cover plate (97);
the cover plate installation unit (8) is arranged above the cover plate storage unit (7), the cover plate installation unit (8) comprises a transfer assembly arranged on the hanging bracket, and a vacuum suction hanger (85) is arranged at the lower end of the transfer assembly.
2. The packaging device according to claim 1, wherein the circuit board conveying unit (1) comprises a first belt conveying mechanism (11) arranged on the support, a pair of fixed components are arranged on two sides of the first belt conveying mechanism (11), a fourth linear mechanism (13) arranged on the support is further arranged on one side of the first belt conveying mechanism (11), a push plate (131) is arranged at one end of an output shaft of the fourth linear mechanism, a slide way (14) is further arranged on the other side of the first belt conveying mechanism (11), an extension plate (141) is arranged on one side of the upper end of the first belt conveying mechanism, the upper end face of the extension plate (141) is matched with the lower end face of the circuit board (92), an extension rod (142) is arranged on one side of the extension plate (141), the extension rod (142) is used for limiting the circuit board (92) with the assembled sensing components, a pair of limiting rails (143) is arranged on two sides of the slide way (14), a fifth linear mechanism (144) is arranged on one side of one limiting rail (143), and a movable rail (145) matched with the limiting rail (143) is arranged on one end of the output shaft.
3. The packaging device according to claim 1, wherein the module clamping unit (3) comprises a sixth linear mechanism (31) arranged on the hanger, a seventh linear mechanism (32) is arranged at the lower end of the sliding end of the sixth linear mechanism (31) and is perpendicular to the sixth linear mechanism in the same horizontal plane, an eighth linear mechanism (33) is arranged vertically at the lower end of the sliding end of the seventh linear mechanism (32), a second rotating motor (34) is arranged at one end of the output shaft of the eighth linear mechanism (33), a first connecting rod (35) is arranged on the outer peripheral side of one end of the output shaft of the second rotating motor (34), a third rotating motor (36) is arranged at one end of the first connecting rod (35), a double-head linear cylinder (37) is arranged at one end of the output shaft, an L-shaped rod (38) is arranged at each of two output shafts of the double-head linear cylinder (37), and a clamping block (39) is arranged at one end of the lower portion.
4. Packaging unit according to claim 1, characterized in that the moving assembly comprises an eleventh linear mechanism (51) mounted on the cradle, and the output shaft of the moving assembly is provided with a twelfth linear mechanism (52), and the rotating assembly comprises a fifth rotating electric machine (53) mounted at the lower end of the sliding end of the twelfth linear mechanism (52), and the output shaft of the rotating assembly is provided with a sixth rotating electric machine (54), and the laser welder (55) is mounted at one end of the sixth rotating electric machine (54).
5. Packaging unit according to claim 1, characterized in that the base conveyor unit (6) comprises a second conveyor means (61) mounted on the frame, the second conveyor means (61) being flanked by a pair of thirteenth linear means (62) mounted on the frame, the output shaft of which being provided at one end with an L-shaped plate (63).
6. The packaging device according to claim 1, wherein the transferring assembly comprises a fourteenth linear mechanism (81), one end of an output shaft of the fourteenth linear mechanism is provided with a fifteenth linear mechanism (82) which is vertically arranged, the lower end of the output shaft of the fifteenth linear mechanism (82) is provided with a seventh rotating motor (83), one end of the output shaft of the seventh rotating motor (83) is provided with a sixteenth linear mechanism (84) which is vertically arranged, and the vacuum sucking and hanging device (85) is arranged at the lower end of the output shaft of the sixteenth linear mechanism (84).
7. The packaging device of claim 2, wherein the fixing assembly comprises a first linear mechanism (12), one end of an output shaft of the first linear mechanism is provided with a second linear mechanism (121) which is vertically arranged, one end of an output shaft of the second linear mechanism (121) is provided with a first rotating motor (122), one end of an output shaft of the first rotating motor (122) is provided with a first connecting plate (123), one end of the first connecting plate (123) is provided with a first fixing plate (124), one side surface of the first connecting plate (123) is provided with a third linear mechanism (125), one end of the output shaft is provided with a first movable plate (126) which is matched with the first fixing plate (124), and an area between the first fixing plate (124) and the first movable plate (126) is used for clamping the circuit board (92).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211680765.5A CN115696902B (en) | 2022-12-27 | 2022-12-27 | Packaging device for packaging environmental factor acquisition system |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211680765.5A CN115696902B (en) | 2022-12-27 | 2022-12-27 | Packaging device for packaging environmental factor acquisition system |
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| Publication Number | Publication Date |
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| CN115696902A CN115696902A (en) | 2023-02-03 |
| CN115696902B true CN115696902B (en) | 2023-03-17 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202211680765.5A Active CN115696902B (en) | 2022-12-27 | 2022-12-27 | Packaging device for packaging environmental factor acquisition system |
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| Country | Link |
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| CN (1) | CN115696902B (en) |
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| CN203722936U (en) * | 2014-01-23 | 2014-07-16 | 法雷奥汽车内部控制（深圳）有限公司 | Connector assembly machine |
| CN111761263A (en) * | 2020-06-23 | 2020-10-13 | 合肥晶浦传感科技有限公司 | Circuit board electronic component installation welding mechanism |
| CN215033159U (en) * | 2021-04-19 | 2021-12-07 | 湖南星创智能装备有限公司 | IGBT module pin bending mechanism |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4809140B2 (en) * | 2006-06-30 | 2011-11-09 | ヤマハ発動機株式会社 | Surface mount machine |
| CN102171825B (en) * | 2011-04-29 | 2013-02-27 | 华为技术有限公司 | Power module and encapsulation and integration method thereof |
| US9285416B2 (en) * | 2012-04-02 | 2016-03-15 | Samsung Electronics Co., Ltd. | Apparatus and method for manufacturing substrates |
| CN206847679U (en) * | 2017-05-23 | 2018-01-05 | 河南文博信息科技有限公司 | A kind of wireless humiture formaldehyde three-in-one sensor terminal |
| CN208507472U (en) * | 2018-06-14 | 2019-02-15 | 东莞市瑞其精密机械有限公司 | Electronic component pin configuration and its apparatus for bending |
| CN215453804U (en) * | 2021-07-08 | 2022-01-07 | 无锡伟鸿基电子有限公司 | SMT printing and paster tool |
| CN113539901A (en) * | 2021-07-16 | 2021-10-22 | 四川熙隆半导体科技有限公司 | Rectifier bridge assembly auxiliary device |
| CN216752480U (en) * | 2022-01-25 | 2022-06-14 | 中国人民解放军78131部队 | Battlefield complex environment information acquisition device |
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2022
- 2022-12-27 CN CN202211680765.5A patent/CN115696902B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN203722936U (en) * | 2014-01-23 | 2014-07-16 | 法雷奥汽车内部控制（深圳）有限公司 | Connector assembly machine |
| CN111761263A (en) * | 2020-06-23 | 2020-10-13 | 合肥晶浦传感科技有限公司 | Circuit board electronic component installation welding mechanism |
| CN215033159U (en) * | 2021-04-19 | 2021-12-07 | 湖南星创智能装备有限公司 | IGBT module pin bending mechanism |
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| CN115696902A (en) | 2023-02-03 |
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