CN115693167B - Digital coding super-surface based on resonance opening - Google Patents
Digital coding super-surface based on resonance opening Download PDFInfo
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- CN115693167B CN115693167B CN202211394015.1A CN202211394015A CN115693167B CN 115693167 B CN115693167 B CN 115693167B CN 202211394015 A CN202211394015 A CN 202211394015A CN 115693167 B CN115693167 B CN 115693167B
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Abstract
The invention discloses a digital coding super-surface based on a resonance opening, which introduces a resonance opening structure into super-surface design, and can change the distribution of surface induced current by adjusting the size of the resonance opening, thereby changing the resonance frequency and generating different phase differences; meanwhile, the diode is arranged in the resonance opening, and the on-off of the diode can be controlled to determine the work of the corresponding resonance opening, so that the adjustment of a plurality of phase differences is realized; in addition, the resonance openings are led into the super surface, when the super surface is expanded to a higher bit, only more resonance openings are needed to be added, and the number of diodes needed for expansion is the same as that of the resonance openings, so that a plurality of diodes are not needed to be arranged; therefore, the digital coding super-surface provided by the invention has a simple structure, can realize the rapid expansion of higher bit, has low expansion cost, and is suitable for being widely popularized and applied in the fields of wireless communication, satellite communication, radar communication and the like.
Description
Technical Field
The invention belongs to the technical field of digital coding super-surfaces, and particularly relates to a digital coding super-surface based on a resonance opening.
Background
The digital coding super-surface can be regarded as an electromagnetic metamaterial in a two-dimensional form, and is formed by periodically or quasi-periodically arranging a plurality of units in a sub-wavelength scale, so that the flexible regulation and control of electromagnetic characteristics can be realized; compared with three-dimensional metamaterials, the super-surface has the advantages of small volume, light weight, low manufacturing cost, easy conformal and easy integration, wherein the electromagnetic parameters of the traditional super-surface are continuously regulated and controlled, so that the traditional super-surface can be called an 'analog super-surface', the digital coding super-surface is characterized by using discrete digital states to represent electromagnetic characteristics, and electromagnetic waves are regulated and controlled by using corresponding coding sequences or coding patterns, so that the design flow of the super-surface is simplified, the design difficulty is reduced, and more novel digital regulation and control methods are provided.
At present, a common method for regulating electromagnetic waves by using a digital coding super-surface is to integrate passive devices in a unit, mainly comprising a PIN diode, a varactor diode, an RF-MESS switch and the like, and more importantly, the digital coding super-surface establishes a bridge between a physical world and a digital world, and a theoretical method in digital information theory and signal processing can be used for designing the super-surface.
In the practical application process, in order to realize the regulation and control of the 1bit phase, a plurality of PIN diodes are usually designed in the traditional digital coding super-surface unit, and when a high bit and super-large array is needed, the cost is increased accordingly; meanwhile, the traditional 2bit digital coding super surface structure is complex in design, and in the design process, the structural shape of a unit is designed mostly by experience, so that the design is difficult to expand to other frequency bands and higher bits; therefore, how to provide a digital coding super surface with low design complexity, low cost and capable of expanding to other frequency bands and higher bits becomes a hot problem of research.
Disclosure of Invention
The invention aims to provide a digital coding super-surface based on a resonance opening, which is used for solving the problems of high cost and difficult expansion to higher bit in the prior art.
In order to achieve the above purpose, the present invention adopts the following technical scheme:
In a first aspect, there is provided a digitally encoded subsurface based on a resonant opening, comprising: any one of the super-surface units comprises a super-surface layer, a grounding plate and a bias circuit layer which are sequentially arranged from top to bottom;
At least one first resonance opening is formed in one side of the surface of the super-surface layer, at least one second resonance opening is formed in the other side of the surface of the super-surface layer, and the number of the first resonance openings is the same as that of the second resonance openings and the first resonance openings are opposite to each other;
A diode is respectively arranged in any first resonance opening and any second resonance opening, wherein the cathode of the diode is electrically connected with the grounding plate, the anode of the diode is electrically connected with the bias circuit layer, and the bias circuit layer is used for providing different bias voltages for the diode so as to control the connection and disconnection of the diode by using the different bias voltages, and the first resonance opening or the second resonance opening on the corresponding side is controlled to work based on the connection and disconnection of the diode.
Based on the disclosure, the invention introduces the resonance opening structure into the super-surface design, and the distribution of the surface induced current can be changed by adjusting the size of the resonance opening, so as to change the resonance frequency and generate different phase differences; meanwhile, a diode is arranged in each resonance opening, wherein the cathode of any diode is grounded, and the anode is electrically connected with the bias circuit layer, so that different bias voltages can be applied to the diode through the bias circuit layer, the on-off of the diode is controlled, and the on-off of the diode determines the working state of the corresponding resonance opening, therefore, the invention determines the working of the corresponding resonance opening by controlling the on-off of the diode, and thus, the adjustment of a plurality of phase differences is realized; in addition, the resonance openings are led into the super surface, when the super surface is expanded to a higher bit, only more resonance openings are needed to be added, and the number of diodes needed for expansion is the same as that of the resonance openings, so that a plurality of diodes are not needed to be arranged; therefore, through the design, the digital coding super-surface provided by the invention has a simple structure, can realize the rapid expansion of higher bit, has low expansion cost, and is suitable for being widely popularized and applied in the fields of wireless communication, satellite communication, radar communication and the like.
In one possible design, the surface of the super surface layer is provided with a plurality of first metallized through holes, wherein any one first resonance opening and any one second resonance opening respectively correspond to one first metallized through hole;
The grounding plate is provided with second metallized through holes in one-to-one correspondence with the first metallized through holes in one-to-one correspondence, the bias circuit layer is provided with third metallized through holes in one-to-one correspondence with the second metallized through holes in one-to-one correspondence with the first metallized through holes, a conductive path is formed between any one first metallized through hole and the second metallized through holes and the third metallized through holes in the corresponding positions, and anodes of diodes in any first resonance opening and any second resonance opening are electrically connected with the bias circuit layer through the first metallized through holes, the second metallized through holes and the third metallized through holes in the corresponding sides.
Based on the disclosure, the invention discloses a connection structure of diodes and bias circuit layers in each resonant opening, namely, a connection between the diodes and the bias circuit layers is realized by arranging metallized through holes on a super surface layer, a grounding plate and the bias circuit layers; meanwhile, each second metallization through hole is not connected with the grounding plate, so that the diode and the bias circuit layer are not grounded, and the normal on-off control of the diode is guaranteed.
In one possible design, the ground plate is provided with insulating holes the same as the second metallized through holes in number, wherein one second metallized through hole is arranged in any one insulating hole, and insulating materials are filled between any insulating hole and the corresponding second metallized through hole.
Based on the disclosure, the insulating hole is configured for each second metalized through hole on the grounding plate, and insulating materials are filled between each metalized through hole and the corresponding insulating hole, so that the insulating connection between the metalized through holes and the corresponding insulating holes can be realized, and the first metalized through holes are not grounded.
In one possible design, anodes of the diodes in either of the first resonant openings and either of the second resonant openings are electrically connected to the corresponding side of the first metallized via, respectively, through a phase delay line.
In one possible design, the phase delay line employs wires or conductive patches.
In one possible design, a first bias circuit is disposed on one side of the bias circuit layer, and a second bias circuit is disposed on the other side of the bias circuit layer, wherein an anode of the diode in any first resonant opening is electrically connected to the first bias circuit, and an anode of the diode in any second resonant opening is electrically connected to the second bias circuit.
In one possible design, a metal patch is further disposed on the super surface layer, wherein the metal patch is disposed between the first and second resonant openings, and a cathode of either diode is electrically connected to the metal patch;
And a fourth metallized through hole is further formed in the super-surface layer, one end of the fourth metallized through hole is electrically connected with the metal patch, and the other end of the fourth metallized through hole is electrically connected with the grounding plate.
Based on the disclosure, the invention discloses a grounding structure of any diode, namely, a metal patch is arranged on a super surface layer, and a fourth metalized through hole is also arranged, wherein the cathode of any diode is electrically connected with the metal patch, and the metal patch is grounded through the fourth metalized through hole, so that the grounding arrangement of any diode can be realized.
In one possible design, the method further comprises: the upper dielectric substrate is positioned between the super-surface layer and the grounding plate, and the lower dielectric substrate is positioned between the grounding plate and the bias circuit layer.
In one possible design, the centers of the upper dielectric substrate, the ground plate, the lower dielectric substrate, and the bias circuit layer are on the same line.
In one possible design, the super surface layer is mounted on the upper surface of the upper dielectric substrate, the ground plate is mounted on the lower surface of the upper dielectric substrate, and the lower surface of the lower dielectric substrate is mounted with the bias circuit layer.
The beneficial effects are that:
(1) According to the invention, the resonance opening structure is introduced into the super-surface design, and the distribution of the surface induced current can be changed by adjusting the size of the resonance opening, so that the resonance frequency is changed, and different phase differences are generated; meanwhile, the diode is arranged in the resonance opening, and the on-off of the diode can be controlled to determine the work of the corresponding resonance opening, so that the adjustment of a plurality of phase differences is realized; in addition, the resonance openings are led into the super surface, when the super surface is expanded to a higher bit, only more resonance openings are needed to be added, and the number of diodes needed for expansion is the same as that of the resonance openings, so that a plurality of diodes are not needed to be arranged; therefore, the digital coding super-surface provided by the invention has a simple structure, can realize the rapid expansion of higher bit, has low expansion cost, and is suitable for being widely popularized and applied in the fields of wireless communication, satellite communication, radar communication and the like.
Drawings
FIG. 1 is a schematic diagram of a digitally encoded subsurface based on a resonant opening according to an embodiment of the present invention;
FIG. 2 is a schematic diagram of reflection coefficient amplitude of a digitally encoded super surface based on a resonant opening according to an embodiment of the present invention when two resonant openings are provided;
FIG. 3 is a schematic diagram of reflection phases of a digitally encoded subsurface based on resonant openings according to an embodiment of the present invention when two resonant openings are provided;
FIG. 4 is a schematic diagram of the overall reception of a digitally encoded subsurface array of 12×12 subsurface units according to an embodiment of the present invention;
FIG. 5 is a schematic diagram of a coding pattern of a digitally encoded subsurface array of 12×12 subsurface units according to an embodiment of the present invention;
FIG. 6 is a pattern of codes and radiation patterns at 0℃for a digitally encoded subsurface array of 12×12 subsurface elements provided in accordance with an embodiment of the present invention;
FIG. 7 is a coding pattern and radiation pattern at 10℃for a digitally encoded subsurface array of 12×12 subsurface elements provided in accordance with an embodiment of the present invention;
FIG. 8 is a coding pattern and radiation pattern at 30℃for a digitally encoded subsurface array of 12×12 subsurface elements provided in accordance with an embodiment of the present invention;
FIG. 9 is a pattern of codes and radiation patterns at 50 for a digitally encoded subsurface array of 12×12 subsurface elements provided in accordance with an embodiment of the present invention.
Reference numerals: 1-a super surface layer; 2-an upper dielectric substrate; 3-a ground plate; 4-a lower dielectric substrate; a 5-bias circuit layer; 6-a first resonance opening; 7-a second resonant opening; an 8-diode; 9-a first metallized via; 10-insulating holes; 11-phase delay line; 12-a first bias circuit; 13-a second bias circuit; 14-a metal patch; 15-fourth metallized vias.
Detailed Description
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the present invention will be briefly described below with reference to the accompanying drawings and the description of the embodiments or the prior art, and it is obvious that the following description of the structure of the drawings is only some embodiments of the present invention, and other drawings can be obtained according to these drawings without inventive effort to a person skilled in the art. It should be noted that the description of these examples is for aiding in understanding the present invention, but is not intended to limit the present invention.
It will be understood that, although the terms first, second, etc. may be used herein to describe various elements, these elements should not be limited by these terms. These terms are only used to distinguish one element from another element. For example, a first element could be termed a second element, and, similarly, a second element could be termed a first element, without departing from the scope of example embodiments of the present invention.
It should be understood that for the term "and/or" that may appear herein, it is merely one association relationship that describes an associated object, meaning that there may be three relationships, e.g., a and/or B, may represent: a alone, B alone, and both a and B; for the term "/and" that may appear herein, which is descriptive of another associative object relationship, it means that there may be two relationships, e.g., a/and B, it may be expressed that: a alone, a alone and B alone; in addition, for the character "/" that may appear herein, it is generally indicated that the context associated object is an "or" relationship.
Examples:
Referring to fig. 1, the digitally encoded super surface based on the resonant opening provided in this embodiment may include, but is not limited to: several subsurface units, such as but not limited to 12×12 identical subsurface units periodically arranged, of course, the number of subsurface units may be specifically set by practical use, and is not limited to the foregoing examples; in a specific application, any of the super surface units includes a super surface layer 1, a ground plate 3 and a bias circuit layer 5 sequentially arranged from top to bottom, wherein one side of the surface of the super surface layer 1 is provided with at least one first resonance opening 6, the other side of the surface of the super surface layer 1 is provided with at least one second resonance opening 7, and in this embodiment, the number of the first resonance openings 6 and the second resonance openings 7 are the same and are oppositely arranged; as shown in fig. 1, the resonant opening is introduced into the design structure of the super surface, so that the induced current distribution on the surface can be changed by adjusting the size of the resonant opening, and the adjustment of the resonant frequency can be realized, thereby generating different phase differences.
Meanwhile, in order to realize digital control of the super surface, a diode 8 is further disposed in each of the first resonant opening 6 and the second resonant opening 7, wherein a cathode of the diode 8 is electrically connected to the ground plate 3, and an anode of the diode 8 is electrically connected to the bias circuit layer 5, so that different bias voltages are provided for the diodes 8 in each resonant opening by using the bias circuit layer 5, and the diodes 8 are controlled to be turned on and off by using the applied different bias voltages, so that the diodes 8 are controlled to work corresponding to the first resonant opening 6 or the second resonant opening 7 based on the on-off of each diode 8, and further adjustment of a plurality of phase differences is realized; specifically, referring to FIG. 1, taking a 2bit digital code super surface composed of a first resonant aperture 6 and a second resonant aperture 7 as an example, by controlling the on-off state of the diode 8 (in the presence of the on-off state of 4) in the two resonant apertures, 4 reflection phase responses of 0, pi/2, pi and 3 pi/2 respectively can be obtained, so that when different code patterns are given to the digital code super surface, the digital code super surface can be obtained byBeam scanning is achieved in range.
Further, in the present embodiment, the first resonance opening 6 and the second resonance opening 7 may be provided on both sides in the width direction of the super surface layer 1, but may be provided on both sides in the length direction; alternatively, it is preferable to provide on both sides in the length direction, as shown in fig. 1; meanwhile, the number and the size of the resonance openings can be specifically set according to actual use requirements, namely if the digital coding super surface needs to be expanded to a 2bit digital coding super surface, two resonance openings are arranged, and if the digital coding super surface needs to be expanded to a 4bit digital coding super surface, 4 resonance openings are arranged, so that when the digital coding super surface needs to be expanded to a higher bit, only more resonance openings are needed to be added, and the number of diodes needed to be expanded is the same as that of the resonance openings, and a plurality of diodes are not needed to be arranged.
The connection structure between the diode 8 and the bias circuit layer 5 and the ground plate 3 in each resonance opening is provided as follows:
First, referring to fig. 1, for example, the surface of the super surface layer 1 is provided with a plurality of first metallized through holes 9, wherein any one first resonance opening 6 and any one second resonance opening 7 respectively correspond to one first metallized through hole 9; correspondingly, second metallized through holes which are in one-to-one correspondence with the positions of the first metallized through holes 9 are arranged on the grounding plate 3 in an insulating manner, and third metallized through holes which are in one-to-one correspondence with the positions of the second metallized through holes are arranged on the bias circuit layer 5; in this embodiment, a layer of conductive metal is plated on the hole wall in the metallized through hole, so that a conductive path can be formed between any one of the first metallized through holes 9 and the second metallized through hole and the third metallized through hole at the corresponding position; based on this, the anodes of the diodes 8 in any one of the first resonant opening 6 and any one of the second resonant opening 7 on the super surface layer 1 can be electrically connected to the bias circuit layer 5 through the first metallized through hole 9, the second metallized through hole and the third metallized through hole on the corresponding sides, so as to realize the connection between the anodes of any one of the diodes 8 and the bias circuit layer 5.
In the present embodiment, the reason why the second metalized via is provided insulated from the ground plate 3 is that: the bias circuit layer 5 and the anode of the diode 8 can be prevented from being grounded, so that the normal on-off control of the diode 8 is ensured; optionally, the insulating arrangement structure of the second metallized through hole and the ground plate 3 is: referring to fig. 1, in this embodiment, insulating holes 10 having the same number as the second metallized through holes are formed on the ground plate 3, wherein one second metallized through hole is disposed in any insulating hole 10, and insulating material is filled between any insulating hole 10 and the corresponding second metallized through hole; in this way, the insulating hole 10 can be used to install the second metallized through hole, thereby establishing the conductive path between the three metallized through holes, and meanwhile, the connection between the diode 8 and the bias circuit layer 5 and the grounding plate 3 can be cut off due to the arrangement of the insulating hole 10 and the insulating material, so that the normal on-off control of the bias circuit layer 5 on the diode 8 is ensured.
Furthermore, in the present embodiment, other conducting modes may be used, such as a metal connector is used to connect the super surface layer 1, the ground plate 3 and the bias circuit layer 5, and the anode of the diode 8 is electrically connected to the metal connector, so that the electrical connection between the anode of the diode 8 and the bias circuit layer 6 can be also realized; of course, the metal connection also passes through the insulating hole 10; in addition, the insulating material may be, but not limited to, an insulating sheet, an insulating paint, a resin, etc., and the metal connector may be, but not limited to, a copper bar.
Secondly, in the present embodiment, the anodes of the diodes 8 in any one of the first resonant opening 6 and any one of the second resonant opening 7 are electrically connected to the corresponding side of the first metallized through holes 9 through a phase delay line 11, as shown in fig. 1, so that the diode 8 and the first metallized through holes 9 can be electrically connected and the diode 8 can be fixed by the phase delay line 11; further, the phase delay line 11 may be used as a pad of the diode 8 to fix the corresponding diode 8.
In this embodiment, the exemplary phase delay line 11 may be, but is not limited to, a wire or a conductive patch, wherein the conductive patch may be, but is not limited to, a copper sheet.
Referring to fig. 1, in this embodiment, a first bias circuit 12 is further disposed on one side of the bias circuit layer 5, and a second bias circuit 13 is disposed on the other side of the bias circuit layer 5, where the anode of the diode 8 in any one of the first resonant openings 6 is electrically connected to the first bias circuit 12, and the anode of the diode 8 in any one of the second resonant openings 7 is electrically connected to the second bias circuit 13; therefore, the on-off control of the diode 8 in each resonant opening can be realized by using the bias circuit, so that the work control of each resonant opening is realized, and the adjustment of a plurality of phase differences is finished.
Finally, referring to fig. 1, the following discloses the connection structure between the diode 8 and the ground plate 3 in each resonant opening:
In this embodiment, for example, a metal patch 14 is further disposed on the super surface layer 1, wherein the metal patch 14 is disposed between the first resonance opening 6 and the second resonance opening 7, and the cathode of any diode 8 is electrically connected to the metal patch 14; meanwhile, a fourth metallized through hole 15 is further arranged on the super surface layer 1, one end of the fourth metallized through hole 15 is electrically connected with the metal patch 14, and the other end of the fourth metallized through hole 15 is electrically connected with the grounding plate 3; in this way, the connection between the cathode of the diode 8 and the ground plate 3 can be achieved by means of the metal patch 14 and the fourth metallized via 15.
Alternatively, the example metal patch 14 may be, but is not limited to, a square patch or an i-shaped patch; in this embodiment, a square patch is preferable.
In addition, in this embodiment, any of the super surfaces further includes an upper dielectric substrate 2 and a lower dielectric substrate 4, as shown in fig. 1, the upper dielectric substrate 2 is located between the super surface layer 1 and the ground plate 3, and the lower dielectric substrate 4 is located between the ground plate 3 and the bias circuit layer 5; in specific implementation, for example, the super surface layer 1 is mounted on the upper surface of the upper dielectric substrate 2, the ground plate 3 is mounted on the lower surface of the upper dielectric substrate 2, the bias circuit layer 5 is mounted on the lower surface of the lower dielectric substrate 4, and the centers of the super surface layer 1, the upper dielectric substrate 2, the ground plate 3, the lower dielectric substrate 4 and the bias circuit layer 5 are located on the same straight line; in this way, the upper dielectric substrate 2 and the lower dielectric substrate 4 can be used to integrate the super surface layer 1, the ground plate 3 and the bias circuit layer 5 into a whole, thereby forming a super surface unit, and by setting different numbers of super surface units, digital coding super surfaces with different bits can be formed, and of course, the unit size can be adjusted to customize any unit with a required frequency band.
Of course, in this embodiment, the upper dielectric substrate 2 is also provided with fifth metallized through holes corresponding to the first metallized through holes one by one, and the lower dielectric substrate 4 is provided with sixth metallized through holes corresponding to the second metallized through holes one by one, so that connection between the anode of the diode 8 and the bias circuit can be ensured, and on-off control of the diode 8 is realized.
Thus, with the foregoing design, the digitally encoded subsurface provided by this embodiment is achieved by introducing a resonant opening structure into the subsurface design and disposing a diode within the resonant opening; therefore, the distribution of the surface induced current can be changed by adjusting the size of the resonance opening, so that the resonance frequency is changed, different phase differences are generated, and meanwhile, the work of the corresponding resonance opening can be controlled based on the on-off of the diode by means of the diode, so that the adjustment of a plurality of phase differences is realized; through the design, when the super-surface design structure is expanded to a higher bit, only more resonant openings are needed to be added, and the number of diodes needed by expansion is the same as that of the resonant openings, so that a plurality of diodes are not needed to be designed, the feasibility of expansion is improved, and the expansion cost is reduced.
In one possible design, the second aspect of the present embodiment provides the simulation implementation data of the digitally encoded super surface provided by the first aspect of the embodiment, to further verify the feasibility of the present invention.
In one aspect, taking a 2bit digitally encoded super surface as an example (i.e., a first resonant opening and a second resonant opening are provided), a full wave simulation is performed, the simulation process of which is as follows:
full-wave simulation is carried out on modeling corresponding to the 2bit digital coding super surface by using electromagnetic simulation software, periodic boundary conditions are adopted in the x and y directions of the unit, the +z direction is excited by using a Floquet port, and irradiation is carried out by using y polarized plane waves, so that the super surface unit can be obtained; wherein, the simulation steps are as follows:
Step one: firstly, calculating the size of the metal patch according to the microstrip line theory, enabling the resonant frequency to be located at 4.85GHz, and obtaining the phase theta.
Step two: and conducting the diode in the first resonance opening, and adjusting the size of the first resonance opening to enable the phase of the first resonance opening to be theta+90 degrees.
Step three: and closing the diode in the first resonance opening, conducting the diode in the second resonance opening, and adjusting the size of the second resonance opening to enable the phase of the second resonance opening to be theta+180 degrees.
Step four: the diodes in the first and second resonant openings are both turned on, with their phase naturally reaching θ+270°.
After simulation, referring to fig. 2, curves a, b, c, d respectively represent the reflection coefficient magnitudes of the diode in the first resonant opening and the diode in the second resonant opening in the OFF-OFF ("00"), ON-OFF ("10"), OFF-ON ("01") and ON-ON ("11"), and as can be seen from fig. 2, at 4.85GHz, the reflection coefficient magnitudes are 0.97,0.80,0.72,0.91, respectively, and the reflection coefficient efficiency is above 0.72, so that it can be proved that the digitally encoded super-surface provided by the embodiment can reflect most electromagnetic waves.
As shown in fig. 3, curves a1, b1, c1, d1 represent the reflection coefficient phases of the diode in the first resonance opening and the diode in the second resonance opening in four states "00", "10", "01" and "11", respectively, and it can be seen from fig. 3 that the phases at 4.85GHz are 122 °, 31 °, -73 °, -140 °, respectively, and the phase difference between two adjacent curves is located (90 ° -10 °,90 ° +10°), whereby this demonstrates that the proposed 2-bit encoded super surface unit can produce a phase shift of 0, 90 °,180 °,270 ° from state 1 ("00") to state 4 ("11"), respectively.
On the other hand, in order to evaluate the beam scanning performance of the digitally encoded super surface, the present embodiment uses the periodic arrangement of the super surface units provided in the first aspect of the embodiment to form a 12×12 array, and places a horn antenna in front of the array as a feed source to perform a beam scanning performance test, where the whole structure diagram is shown in fig. 4; during specific performance test, calculating a coding pattern of the super surface by utilizing a phase compensation formula according to a beam direction, and performing full-wave simulation and analysis on the coding pattern, wherein four states of each unit are respectively represented by four patterns as a '00' state, a '10' state, a '01' state and a '11' state, as shown in fig. 5; meanwhile, for convenience of explanation, the present embodiment only exemplifies30，/>Beam of (1) >, beam is at/>When the coding pattern and radiation pattern of the super surface are seen in FIG. 6, it can be seen from FIG. 6 that the pattern is shown at/>The gain in the direction is maximum; in the same way, get30，/>As can be seen from fig. 7, 8 and 9, the digitally encoded super surface provided in this embodiment can enable each unit to change according to the required reflection phase by switching the on/off simulation circuit of the diode in each resonance opening, so as to realize a beam scanning characteristic with a certain angle, and the beam scanning angle range is ±50 degrees; through the design, the digital coding super-surface provided by the invention can reduce the complexity and cost of unit design, can be rapidly expanded to other frequency bands and higher bits, and is suitable for wide application and popularization.
Finally, it should be noted that: the foregoing description is only of the preferred embodiments of the invention and is not intended to limit the scope of the invention. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (6)
1. A digitally encoded subsurface based on resonant openings, comprising: any one of the super-surface units comprises a super-surface layer (1), a grounding plate (3) and a bias circuit layer (5) which are sequentially arranged from top to bottom;
at least one first resonance opening (6) is formed in one side of the surface of the super-surface layer (1), at least one second resonance opening (7) is formed in the other side of the surface of the super-surface layer (1), and the first resonance openings (6) and the second resonance openings (7) are the same in number and are oppositely arranged;
A diode (8) is respectively arranged in any first resonance opening (6) and any second resonance opening (7), wherein the cathode of the diode (8) is electrically connected with the grounding plate (3), the anode of the diode (8) is electrically connected with the bias circuit layer (5), and the bias circuit layer (5) is used for providing different bias voltages for the diode (8) so as to control the on-off of the diode (8) by using the different bias voltages, so that the on-off of the diode (8) is used for controlling the first resonance opening (6) or the second resonance opening (7) on the corresponding side to work;
The super-surface layer (1) is also provided with a metal patch (14), wherein the metal patch (14) is arranged between the first resonance opening (6) and the second resonance opening (7), and the cathode of any diode (8) is electrically connected with the metal patch (14);
A fourth metallized through hole (15) is further formed in the super-surface layer (1), one end of the fourth metallized through hole (15) is electrically connected with the metal patch (14), and the other end of the fourth metallized through hole (15) is electrically connected with the grounding plate (3);
The surface of the super surface layer (1) is provided with a plurality of first metallized through holes (9), wherein any one first resonance opening (6) and any one second resonance opening (7) respectively correspond to one first metallized through hole (9);
The grounding plate (3) is provided with second metallized through holes in one-to-one correspondence with the positions of the first metallized through holes (9) in an insulating manner, the bias circuit layer (5) is provided with third metallized through holes in one-to-one correspondence with the positions of the second metallized through holes, wherein a conductive path is formed between any one first metallized through hole (9) and the second metallized through holes and the third metallized through holes at the corresponding positions, and anodes of diodes (8) in any one first resonance opening (6) and any one second resonance opening (7) are electrically connected with the bias circuit layer (5) through the first metallized through holes (9), the second metallized through holes and the third metallized through holes at the corresponding sides;
The grounding plate (3) is provided with insulating holes (10) the same as the second metalized through holes in number, wherein one second metalized through hole is arranged in any insulating hole (10), and insulating materials are filled between any insulating hole (10) and the corresponding second metalized through hole;
anodes of diodes (8) in any one of the first resonance openings (6) and any one of the second resonance openings (7) are electrically connected with the first metalized through holes (9) on the corresponding side through a phase delay line (11) respectively.
2. A digitally encoded metasurface based on resonant openings according to claim 1, characterized in that the phase delay line (11) employs wires or conductive patches.
3. The digitally encoded super surface based on the resonance opening according to claim 1, characterized in that one side of the bias circuit layer (5) is provided with a first bias circuit (12), the other side of the bias circuit layer (5) is provided with a second bias circuit (13), wherein the anode of the diode (8) in any one first resonance opening (6) is electrically connected to the first bias circuit (12), and the anode of the diode (8) in any one second resonance opening (7) is electrically connected to the second bias circuit (13).
4. The digitally encoded ultrasound surface based on resonant openings of claim 1, further comprising: the bias circuit comprises an upper dielectric substrate (2) and a lower dielectric substrate (4), wherein the upper dielectric substrate (2) is positioned between the super-surface layer (1) and the grounding plate (3), and the lower dielectric substrate (4) is positioned between the grounding plate (3) and the bias circuit layer (5).
5. The digitally encoded metasurface based on resonant opening according to claim 4, wherein the centers of the metasurface layer (1), the upper dielectric substrate (2), the ground plate (3), the lower dielectric substrate (4) and the bias circuit layer (5) are located on the same straight line.
6. The digitally encoded super surface based on the resonance opening according to claim 4, wherein the super surface layer (1) is mounted on the upper surface of the upper dielectric substrate (2), the ground plate (3) is mounted on the lower surface of the upper dielectric substrate (2), and the lower surface of the lower dielectric substrate (4) is mounted with the bias circuit layer (5).
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| CN108900233A (en) * | 2018-04-17 | 2018-11-27 | 东南大学 | Direct radiation radio digital communication system and method based on digital coding Meta Materials |
| CN110098473A (en) * | 2019-04-26 | 2019-08-06 | 西安电子科技大学 | A kind of tightly coupled super surface array of rectification |
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| CN110098473A (en) * | 2019-04-26 | 2019-08-06 | 西安电子科技大学 | A kind of tightly coupled super surface array of rectification |
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