CN115692292A - Device and method for correcting wafer offset in wafer conveying process - Google Patents
Device and method for correcting wafer offset in wafer conveying process Download PDFInfo
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- CN115692292A CN115692292A CN202211447975.XA CN202211447975A CN115692292A CN 115692292 A CN115692292 A CN 115692292A CN 202211447975 A CN202211447975 A CN 202211447975A CN 115692292 A CN115692292 A CN 115692292A
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Abstract
The application provides a device for correcting wafer offset in the process of transmitting wafers and a correction method thereof, wherein the device comprises: a wafer angle positioner; the optical sensing element comprises a signal light emitting end and a signal light receiving end, and is arranged on one side of the wafer angle positioner, and the distance between an optical signal emitted by the signal light emitting end and the wafer angle positioner is the radius value of the wafer plus or minus a preset error value; a data acquisition module; a data processing module; and a mechanical arm. The deviation of the wafer can be automatically identified and the deviation position of the wafer can be automatically corrected, the problems of deviation of the initial position of the wafer in a wafer box, deviation of a mechanical arm dragging and grabbing and the like which need manual processing are solved, the production efficiency is effectively improved, and the scratching and collision risks caused by the position deviation of wafer transmission are reduced; meanwhile, the offset of the wafer is automatically corrected, and the offset precision is improved.
Description
Technical Field
The present disclosure relates to semiconductor manufacturing technologies, and more particularly, to a device and a method for correcting wafer shift during wafer transfer.
Background
In a semiconductor manufacturing process, a series of processes are performed on a wafer: absolute vacuum, chemical etching, high energy plasma bombardment, intense uv radiation, etc., through hundreds of discrete processing steps, the wafer is polished into CPU, memory chips, image processors, etc. These processes are environmentally demanding and most work is carried out in sealed vacuum chambers. The wafer transmission system is an important component of the semiconductor special equipment, and the wafer is transferred from one process chamber to another process chamber through the transmission system so as to transmit the wafer from the atmospheric environment to the vacuum environment, thereby realizing the processing of the wafer in the vacuum environment.
Generally, the wafer is stored in the wafer cassette before entering the next process node, and during the process of transferring the wafer from the wafer cassette to the reaction chamber of the current process node, the relative position between the wafer and the robot arm may be shifted due to the initial position shift of the wafer in the wafer cassette or the position shift of the robot arm for grabbing the wafer, as shown in fig. 1 and fig. 2, the relative position between the wafer and the robot arm in fig. 1 is not shifted, and the wafer is just accommodated in the wafer slot of the robot arm; in fig. 2, the wafer and the robot arm have a relative position offset, which causes problems such as wafer dragging by the robot arm, wafer grabbing by the robot arm offset, etc., and after the robot arm grabs and detects the offset wafer, the machine station alarms, and the wafer transfer stops, which needs to be manually processed.
Disclosure of Invention
In view of the above disadvantages of the prior art, an object of the present invention is to provide a device for correcting wafer offset during wafer transfer and a correction method thereof, which are used to solve the problems in the prior art that after the wafer position is offset during wafer transfer, a robot arm captures and detects the offset wafer, a machine station gives an alarm, and wafer transfer is stopped and needs to wait for manual processing, resulting in lower production efficiency.
To achieve the above and other related objects, the present application provides an apparatus for correcting wafer deviation during wafer transfer, the apparatus comprising:
the wafer angle positioner is used for enabling a wafer placed in the wafer angle positioner to make the wafer translate along a direction and monitoring the angle of the wafer;
the optical sensing element comprises a signal light emitting end and a signal light receiving end and is arranged on one side of the wafer angle positioner, and the distance between an optical signal emitted by the signal light emitting end and the wafer angle positioner is the wafer radius value plus or minus a preset error value;
the data acquisition module is connected with the optical sensing element and is used for acquiring a first time when the wafer starts to touch the optical signal sent by the optical sensing element and a second time when the wafer finally touches the optical signal sent by the optical sensing element in each rotation period when the wafer rotates in the wafer angle positioner;
the data processing module is connected with the data acquisition module and used for acquiring the first time and the second time acquired by the data acquisition module and calculating the offset midpoint position and the offset of the wafer according to the minimum value of the absolute value of the difference value between the first time and the second time and the rotation speed of the wafer angle positioner;
and the mechanical arm is connected with the data processing module and used for re-grabbing the wafer based on the offset and the offset midpoint position of the wafer, compensating the offset along the connecting line direction of the offset midpoint position and the offset point of the wafer and then transmitting the offset to the wafer angle positioner.
Optionally, the light sensing element is a laser sensing element.
Further, the laser sensing element is an infrared laser sensing element.
Optionally, the apparatus further includes a wafer cassette for carrying the wafer, and the robot arm grabs the wafer from the wafer cassette and transfers the wafer to the wafer angle positioner.
Optionally, the wafer radius value is 150mm, and the preset error value is 0mm to 2mm.
Optionally, the device is used in a wafer transfer process of a wafer etching process.
The application also provides a correction method for correcting wafer offset in the wafer conveying process, which comprises the following steps:
providing a device for correcting wafer deviation in the wafer conveying process;
judging whether the wafer rotates on the wafer angle positioner and blocks the optical signal emitted by the signal light emitting end of the optical sensing element;
if not, confirming the positioning point of the wafer based on the rotation of the wafer in the wafer angle positioner, and grabbing and transmitting the wafer to the next station by the mechanical arm;
if yes, the data acquisition module sequentially acquires a first time when the wafer starts to touch the optical signal sent by the optical sensing element and a second time when the wafer finally touches the optical signal sent by the optical sensing element in each rotation period;
the data processing module acquires the first time and the second time acquired by the data acquisition module, and calculates the offset midpoint position and the offset of the wafer according to the minimum value of the absolute value of the difference between the first time and the second time and the rotation speed of the wafer angle positioner;
and the mechanical arm recaptures the wafer based on the offset, compensates the offset and then transmits the wafer to the wafer angle positioner, and the wafer is corrected by the offset.
Optionally, before the robot arm re-grasps the wafer, the wafer is rotated to the grasping angle of the robot arm.
Optionally, when the correction method is used in a wafer transfer process of a wafer etching process, the wafer transfer process further includes transferring the wafer to an airlock chamber, a vacuum transfer chamber, and a reaction chamber in sequence.
Optionally, the wafer is rotated clockwise or counter-clockwise in the wafer angle positioner.
As described above, the device and the method for correcting wafer offset in the wafer transferring process of the present application can automatically recognize the wafer offset and automatically correct the offset position of the wafer, thereby eliminating the problems of the wafer offset in the initial position of the wafer in the wafer box, the mechanical arm dragging and grabbing offset, etc. which need manual processing, effectively improving the production efficiency, and reducing the scratching and collision risks caused by the wafer transfer position offset; meanwhile, the offset of the wafer is automatically corrected, and the offset precision is improved.
Drawings
FIG. 1 is a schematic view of a wafer and a robot without deviation.
FIG. 2 is a schematic diagram of a wafer and a robot with shifted relative positions.
Fig. 3 is a partial schematic structural diagram of the apparatus for correcting wafer offset during wafer transfer according to the present application, in which the relative position between the wafer and the robot arm is not offset, and the wafer is transferred to the wafer angle positioner without offset, and at this time, the wafer does not block the signal light emitted by the light sensing element during rotation.
Fig. 4 is a schematic structural diagram illustrating a structure in which a wafer is transferred to a wafer angle positioner and is shifted after the wafer and the robot arm are shifted with respect to each other, and the wafer does not block signal light emitted from the photo sensor during rotation, wherein the wafer rotates clockwise.
FIG. 5 is a schematic plan view of the wafer transferred to the wafer angular positioner after the wafer is shifted from the robot arm, showing the position relationship between the shift point and the center of the wafer.
FIG. 6 shows that the wafer in FIG. 5 is rotated to make the connection line between the offset point and the center of the wafer vertical, so as to facilitate the re-grasping of the wafer by the robot arm.
Fig. 7 is a flowchart illustrating a method for correcting wafer offset during wafer transfer according to the present invention.
Description of the element reference numerals
10. Wafer
11. Mechanical arm
21. Light sensing element
211. Signal light emitting terminal
212. Signal light receiving end
213. Optical signal
20. Wafer angle positioner
Detailed Description
The following description of the embodiments of the present application is provided by way of specific examples, and other advantages and effects of the present application will be readily apparent to those skilled in the art from the disclosure herein. The present application is capable of other and different embodiments and its several details are capable of modifications and/or changes in various respects, all without departing from the spirit of the present application.
Please refer to fig. 1 to 7. It should be noted that the drawings provided in the present embodiment are only for illustrating the basic idea of the present application, and the drawings only show the components related to the present application rather than the number, shape and size of the components in actual implementation, and the type, quantity and ratio of the components in actual implementation may be changed arbitrarily, and the layout of the components may be more complicated.
As described in the background, in a semiconductor processing process, a series of processes are performed on a wafer, and the wafer is generally transferred through a cassette during the transfer from one process chamber to another process chamber, for example, when entering an etching process node, the wafer is transferred out of the etching process chamber through the cassette, and before entering an etching reaction chamber, the wafer needs to pass through a plurality of transmission nodes: the wafer angle positioner, the air lock chamber, the vacuum transfer chamber and the like enter the etching reaction cavity finally, because the wafer in the wafer box is transferred from the last process node, initial position deviation is easy to generate in the wafer box or the position deviation of the wafer grabbed by a mechanical arm is easy to generate, and the position deviation is generally larger than the transmission deviation inside the process node (such as the air lock chamber, the vacuum transfer chamber and the like), so that the adverse effect is more serious, when the condition is generated, the machine can give an alarm, the wafer transfer is stopped, manual processing is required to be waited, and the working efficiency is reduced.
Based on the problems, the device for correcting the wafer offset in the wafer conveying process can automatically recognize the offset of the wafer and automatically correct the offset position of the wafer, so that the problems of the wafer offset in the initial position of a wafer box, the wafer dragging and grabbing offset of a mechanical arm and the like which need manual processing are solved, the production efficiency is effectively improved, and the scratching and collision risks caused by the position offset during wafer conveying are reduced; meanwhile, the offset of the wafer is automatically corrected, and the offset precision is improved.
Specifically, as shown in fig. 3 to 6, the apparatus includes:
a wafer angle positioner 20 for translating the wafer 10 disposed therein in an orientation, wherein orientation refers to either clockwise or counterclockwise, and monitoring the angle of the wafer 10;
the optical sensing element 21 includes a signal light emitting end 211 and a signal light receiving end 212, which are disposed at one side of the wafer angle positioner 20, and a distance L1 between a light signal 213 emitted from the signal light emitting end 211 and a center of the wafer angle positioner 20, i.e., a deviation point a of a wafer, is a predetermined error value of the wafer radius value r ± where the predetermined error value is a measurement error value of an apparatus itself;
a data collecting module (not shown in the drawings) connected to the light sensing element 21, for collecting a first time t1 when the wafer 10 starts to touch the optical signal 213 emitted by the light sensing element 21 and a second time t2 when the wafer 10 finally touches the optical signal 213 emitted by the light sensing element 21 in each rotation cycle when the wafer 10 rotates in the wafer angular positioner 20;
a data processing module (not shown in the figure), connected to the data acquisition module, configured to obtain the first time t1 and the second time t2 acquired by the data acquisition module, and calculate an offset midpoint position C and an offset L2 of the wafer 10 according to a minimum value (i.e., min | t1-t2 |) of an absolute value of a difference between the first time t1 and the second time t2 and a rotation speed of the wafer angle positioner 20;
and a robot arm (not shown in the figure) connected to the data processing module, and configured to re-grab the wafer 10 based on the offset L2 and the offset midpoint C of the wafer 10, compensate the offset L2 along a connection line between the offset midpoint C and the offset point a of the wafer, and transmit the compensated offset L2 to the wafer angle positioner 20.
The working principle of the device for correcting the wafer offset in the wafer conveying process provided by the application is as follows: as shown in fig. 1 and 3, when the wafer and the robot arm are not shifted from each other, the robot arm rotates the wafer in the wafer angle positioner without blocking the signal light emitted from the light sensing element, and at this time, the center B of the wafer coincides with the center of the wafer angle positioner (as shown in fig. 3); when the relative position between the wafer and the robot arm deviates, the center of the wafer does not coincide with the rotation center of the wafer angle positioner, and the center of the wafer deviates from the rotation center of the wafer angle positioner by an amount greater than a preset error value, at this time, the robot arm rotates the wafer in the wafer angle positioner to shield the signal light emitted by the light sensing element, and each rotation cycle of the wafer has two time points, one of which is the time t1 when the wafer starts to shield the signal light emitted by the light sensing element (i.e., the time when the signal light receiving end starts to receive the signal light), and the other is the time t2 when the wafer finally shields the signal light emitted by the light sensing element (i.e., the time when the signal light receiving end starts to receive the signal light), at this time, the deviation point a of the wafer coincides with the center of the wafer angle positioner (as shown in fig. 4). As shown in fig. 5, since the optical sensing element is disposed at a position (L1 is a wafer radius value r ± a preset error value) from the wafer angle positioner L1, a quadrilateral formed by the points a, t1, B, and t2 is approximately a rhombus, a diagonal line L2 of the rhombus is an offset of the wafer, an intersection point C of two diagonal lines of the rhombus is an offset center point position, and a connecting line between the point C and the center a of the wafer angle positioner is an offset direction of the wafer, the offset L2 can be calculated by a property of the rhombus, and the calculation process is as follows:
wafer perimeter S1=2 π r
the arc length of rotation S2= min | t1-t2| ω r from time t1 to time t2
Wherein θ is a rotation angle of the wafer at the time from t1 to t2, φ is an included angle between a connecting line direction of the offset center point position C and the offset point A of the wafer and a radius direction of the wafer at the time of a point t1 or a point t2, ω is an angular velocity of the wafer angle positioner, r is a radius of the wafer, and min | t1-t2| is an absolute value of a time difference between t1 and t2 in each rotation period of the wafer. Therefore, the offset L2 can be obtained from the radius r of the wafer and the angular velocity ω, t1, and t2 of the wafer angle positioner, and the robot arm can correct the wafer offset by compensating the offset L2.
The optical sensing element 21 can select the existing common sensing elements, such as an LED optical sensing element, a laser sensing element, and the like, and the laser sensing element is preferably selected in the application, so that the collimation of laser is strong, the light spot is small, and the correction accuracy can be effectively improved. More preferably, the light sensing element is an infrared laser sensing element. Typically, the wafers are placed in a pod prior to being transferred to the wafer angle positioner 20, and the transfer process is performed by a robot arm that grasps and transfers the wafers placed in the pod to the wafer angle positioner 20.
The device for correcting the wafer offset in the wafer conveying process is suitable for correcting the wafer position offset of any size. In this embodiment, the radius value of the wafer is selected to be 150mm, and the predetermined error value is 0mm to 2mm, such as 0.5mm, 1.0mm, 1.5mm, and 2.0mm. In practice, the predetermined error value may be determined according to the actual condition based on the wafer size and the requirement of the correction precision.
The device for correcting the wafer deviation in the wafer conveying process can be suitable for any transmission system with a wafer angle positioner, such as a wafer transmission system of a wafer etching process.
It should be noted that, all modules referred to in this application are logic modules, and in practical applications, a logic unit may be a physical unit, may also be a part of a physical unit, and may also be implemented by a combination of multiple physical units. In addition, in order to highlight the innovative part of the present application, a unit which is not so closely related to solve the technical problem proposed by the present application is not introduced in the present embodiment, but it does not indicate that no other unit exists in the present embodiment.
Based on the device for correcting the wafer offset in the wafer conveying process, the application also provides a method for correcting the wafer offset in the wafer conveying process. As shown in fig. 3 and 7, the correction method includes:
providing a device for correcting wafer deviation in the wafer conveying process;
judging whether the wafer rotates on the wafer angle positioner and blocks the optical signal emitted by the signal light emitting end of the optical sensing element;
if not, confirming the positioning point of the wafer based on the rotation of the wafer in the wafer angle positioner, and grabbing and transmitting the wafer to the next station by the mechanical arm;
if yes, the data acquisition module sequentially acquires a first time t1 when the wafer starts to touch the optical signal sent by the optical sensing element and a second time t2 when the wafer finally touches the optical signal sent by the optical sensing element in each rotation period;
the data processing module obtains the first time t1 and the second time t2 acquired by the data acquisition module, and calculates an offset midpoint position and an offset of the wafer (as shown in fig. 5) according to a minimum value of an absolute value of a difference between the first time t1 and the second time t2 (i.e., a time interval between the first time t1 and the second time t2 in each rotation period of the wafer) and a rotation speed (generally, an angular speed) of the wafer angle positioner; the calculation method of the offset midpoint position and the offset of the wafer can be referred to the above calculation method, and is not detailed here;
and the mechanical arm recaptures the wafer based on the offset, compensates the offset and then transmits the wafer to the wafer angle positioner, and the wafer is corrected by the offset.
Since the existing robot arm cannot flexibly grab the wafer in any direction, the wafer needs to be continuously rotated to the grabbing angle of the robot arm in the actual correction process, as shown in fig. 6, the robot arm grabs the wafer in the vertical direction, so that the wafer needs to be continuously rotated to the vertical direction of the connecting line between the offset central point position C and the offset point a of the wafer, and then the robot arm grabs the wafer again and compensates the offset L2 and then transfers the wafer to the wafer angle positioner. By way of example, when the correction method is used in a wafer transfer process of a wafer etching process, the whole transfer process generally includes the following nodes: the wafer box, the wafer angle positioner, the air lock chamber, the vacuum transfer chamber and the reaction chamber, and the correction method realizes the offset correction at the transfer contact of the wafer angle positioner.
For example, the rotation direction of the wafer in the wafer angle positioner may be set as required, and may be, for example, clockwise rotation or counterclockwise rotation.
In summary, the present application provides a device and a method for correcting wafer offset during wafer transfer, which can automatically identify wafer offset and automatically correct the offset position of the wafer, thereby eliminating the problems of wafer initial position offset in a wafer cassette, mechanical arm dragging and grabbing offset, etc. which require manual handling, effectively improving production efficiency, and reducing the risk of scratching and collision caused by wafer transfer due to position offset; meanwhile, the offset of the wafer is automatically corrected, and the offset precision is improved. Therefore, the application effectively overcomes various defects in the prior art and has high industrial utilization value.
The above embodiments are merely illustrative of the principles and utilities of the present application and are not intended to limit the application. Any person skilled in the art can modify or change the above-described embodiments without departing from the spirit and scope of the present application. Accordingly, it is intended that all equivalent modifications or changes which can be made by those skilled in the art without departing from the spirit and technical concepts disclosed in the present application shall be covered by the claims of the present application.
Claims (10)
1. An apparatus for correcting wafer drift during wafer transfer, the apparatus comprising:
a wafer angle positioner (20) for translating a wafer (10) disposed therein in a directional manner and monitoring the angle of the wafer (10);
a light sensing element (21) comprising a signal light emitting end (211) and a signal light receiving end (212), the light sensing element being disposed at one side of the wafer (10) angle positioner, wherein a distance between a light signal (213) emitted from the signal light emitting end (211) and a center of the wafer angle positioner (20) is a radius value of the wafer (10) ± a preset error value;
a data acquisition module, connected to the photo sensor (21), for acquiring a first time when the wafer (10) starts to touch the optical signal (213) emitted by the photo sensor (21) and a second time when the wafer (10) finally touches the optical signal (213) emitted by the photo sensor (21) in each rotation cycle when the wafer (10) rotates in the wafer angular positioner (20);
the data processing module is connected with the data acquisition module and used for acquiring the first time and the second time acquired by the data acquisition module and calculating the offset midpoint position and the offset of the wafer (10) according to the minimum value of the absolute value of the difference value between the first time and the second time and the rotation speed of the wafer angle positioner (20);
and the mechanical arm (11) is connected with the data processing module and is used for re-grabbing the wafer (10) based on the offset and the offset midpoint position of the wafer (10), compensating the offset along the connecting line direction of the offset midpoint position and the offset point of the wafer (10) and then transmitting the compensated offset to the wafer angle positioner (20).
2. The apparatus of claim 1, wherein the wafer deflection correcting device comprises: the light sensing element (21) is a laser sensing element.
3. The apparatus as claimed in claim 2, wherein the apparatus further comprises: the laser sensing element (21) is an infrared laser sensing element.
4. The apparatus as claimed in claim 1, wherein the apparatus further comprises: the device also comprises a wafer box for carrying the wafer (10), and the mechanical arm (11) grabs the wafer (10) from the wafer box and transmits the wafer to the wafer angle positioner (20).
5. The apparatus of claim 1, wherein the wafer deflection correcting device comprises: the radius value of the wafer (10) is 150mm, and the preset error value is 0 mm-2 mm.
6. The apparatus of claim 1, wherein the wafer deflection correcting device comprises: the device is used in the wafer transmission process of the wafer etching process.
7. A correction method for correcting wafer offset in a wafer conveying process is characterized by comprising the following steps:
providing a device for correcting wafer excursion during wafer transfer according to any one of claims 1-6;
judging whether the wafer (10) rotates on the wafer angle positioner (20) or not, and blocking an optical signal (213) emitted by the signal light emitting end (211) of the optical sensing element (21);
if not, based on the rotation of the wafer (10) in the wafer angle positioner (20), confirming the positioning point of the wafer (10), and the mechanical arm (11) grabs and transmits the wafer (10) to the next station;
if yes, the data acquisition module sequentially acquires a first time when the wafer (10) starts to touch the optical signal (213) sent by the optical sensing element (21) and a second time when the wafer (10) finally touches the optical signal (213) sent by the optical sensing element (21) in each rotation period;
the data processing module acquires the first time and the second time acquired by the data acquisition module, and calculates the offset midpoint position and the offset of the wafer (10) according to the minimum value of the absolute value of the difference between the first time and the second time and the rotation speed of the wafer angle positioner (20);
and the mechanical arm (11) recaptures the wafer (10) based on the offset, compensates the offset, and transmits the wafer to the wafer angle positioner (20) to finish the offset correction of the wafer (10).
8. The method as claimed in claim 7, wherein the wafer is transferred by a wafer transfer apparatus comprising: before the mechanical arm (11) re-grabs the wafer (10), the method further comprises rotating the wafer (10) to a grabbing angle of the mechanical arm (11).
9. The method as claimed in claim 7, wherein the wafer is transferred by a wafer transfer apparatus comprising: when the correction method is used in the wafer (10) transmission process of the wafer (10) etching process, the wafer (10) transmission process further comprises the step of sequentially transmitting the wafer (10) to an air lock chamber, a vacuum transmission chamber and a reaction chamber.
10. The method as claimed in claim 7, wherein the wafer is transferred by a wafer transfer apparatus comprising: the wafer (10) is rotated clockwise or counter-clockwise in the wafer angular positioner (20).
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117524963A (en) * | 2024-01-05 | 2024-02-06 | 厦门特仪科技有限公司 | Wafer edge inspection device based on laser and control method thereof |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117524963A (en) * | 2024-01-05 | 2024-02-06 | 厦门特仪科技有限公司 | Wafer edge inspection device based on laser and control method thereof |
| CN117524963B (en) * | 2024-01-05 | 2024-03-15 | 厦门特仪科技有限公司 | Wafer edge inspection device based on laser and control method thereof |
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