CN115688493A - Punching abnormity monitoring method and device, electronic equipment and storage medium - Google Patents
Punching abnormity monitoring method and device, electronic equipment and storage medium Download PDFInfo
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Abstract
The invention discloses a stamping abnormity monitoring method and device, electronic equipment and a storage medium. The method comprises the steps of acquiring historical stamping data of all stamping processes from an initial stamping process to a current stamping process for each stamping process; wherein the total number of stamping processes is greater than or equal to 3; establishing a current enveloping model of the current stamping process according to the historical stamping data; obtaining the stamping data of the stamping process; determining a relative relationship between the stamping data and the enveloping model; and judging the abnormal condition of the stamping process according to the relative relation. The scheme provided by the invention adopts an incremental successive model building mode to monitor the stamping process, so that the monitoring result of each stamping process is accurate and reliable.
Description
Technical Field
The invention relates to the technical field of production monitoring, in particular to a stamping abnormity monitoring method and device, electronic equipment and a storage medium.
Background
In the daily production process, the phenomenon of material jumping is easy to occur in the stamping process. The phenomenon of stamping material jumping refers to the phenomenon that cut waste, paper pieces, metal scraps (metal wires) and the like generated in the production process jump to a processing area due to a plurality of reasons, and after stamping, indentations are formed on the surface of a workpiece.
Stamping belongs to instantaneous pressure processing and relates to a collision mechanism, a shearing mechanism, a plastic deformation mechanism and the like. Therefore, the pressing process is influenced by many factors. For example: die state (punch abrasion, die abrasion, magnetism, punch structural property change), machining material factors, punch state (cam, motor working state, slide block running condition), impact self characteristics (foreign matter enters a machining area in the environment) and the like.
These factors are all influencing factors for the occurrence of the material jumping phenomenon. Due to the fact that the stamping process involves many mechanisms and influence factors, a manufacturer cannot accurately estimate whether the next stroke has the material jumping phenomenon according to time in the daily production process, namely cannot accurately judge the material jumping phenomenon in the production process, and economic loss is easily caused.
Disclosure of Invention
In the prior art, the detection of the stamping material jumping phenomenon often adopts that: after a certain amount of workpieces are produced, a certain amount of workpieces are extracted according to a pre-specified sampling inspection standard, and surface defects caused by the phenomenon are screened by using a visual inspection instrument or a visual measuring instrument, so that a sampling inspection result represents the dimensional quality of the workpieces produced in a previous period of time.
However, the following problems still exist in this workpiece dimension monitoring mode:
1. the workpieces are sampled and inspected in a certain proportion to represent a large batch of workpieces, and the effect is poor. The problem that the reliability of the whole sampling evaluation is unreasonable exists, a lot of abnormal workpieces cannot be selected in time, and after the oversize is found, a large number of oversize workpieces are produced, so that the waste of raw materials is caused.
2. When the monitoring precision is to be improved, the sampling frequency needs to be increased. But this will put a great operating pressure on the production unit.
3. Once the defect of material jumping and crushing is found by spot check, the whole batch needs to be subjected to full check, which wastes time and labor.
4. Visual inspection and visual monitoring methods belong to the screening of results afterwards, and are difficult to trace the reason of material skip, and the reason tracing can only be performed based on statistics or long-time accumulated experience.
Based on this, in order to solve the technical problem that the monitoring of the material jumping phenomenon in the existing stamping process is inaccurate and reliable, the embodiment of the invention provides a stamping abnormity monitoring method and device, electronic equipment and a storage medium.
The technical scheme of the embodiment of the invention is realized as follows:
the embodiment of the invention provides a stamping abnormity monitoring method, which comprises the following steps:
for each stamping process, acquiring historical stamping data of all stamping processes from the initial stamping process to the current stamping process; wherein the total number of stamping processes is greater than or equal to 3;
establishing a current enveloping model of the current stamping process according to the historical stamping data;
obtaining the stamping data of the stamping process;
determining a relative relationship between the stamping data and the enveloping model;
and judging the abnormal condition of the stamping process according to the relative relation.
In the above scheme, after the abnormal condition of the stamping process is determined according to the relative relationship, the method further includes:
and when the punching process is judged to be abnormal, setting the next punching process as the initial punching process.
In the above scheme, before obtaining historical stamping data of all stamping processes from the initial stamping process to the current stamping process, the method further includes:
setting the first stamping process after the generation equipment is stopped, the production parameters are adjusted, the die is replaced or the die is modified as the initial stamping process.
In the above scheme, the stamping data includes a stamping signal value, and acquiring each stamping data includes:
and acquiring a stamping signal value between a preset first time before the maximum value of the stamping signal value and a preset second time after the maximum value of the stamping signal value in each stamping process.
In the above scheme, before obtaining historical stamping data of all stamping processes from an initial stamping process to a current stamping process for each stamping process, the method further includes:
obtaining the stamping times of the stamping process;
judging whether the stamping times are larger than a preset threshold value or not;
when the stamping times are larger than a preset threshold value, acquiring an envelope model of a stamping process of a first preset threshold value;
determining a first relative relation between the stamping data and an envelope model of a first preset threshold secondary stamping process;
and judging the abnormal condition of the stamping process according to the first relative relation.
In the foregoing scheme, the establishing a current envelope model of the current stamping process according to the historical stamping data includes:
setting the stamping process as the j +1 th stamping process, acquiring m stamping data in each stamping process, and establishing an envelope model by using the following formula:
wherein the content of the first and second substances,
and
respectively forming upper and lower definite boundaries of the envelope model in the j +1 th stamping process;
；
；
and
is a definite scale factor;
for the former j punching processesiAverage of individual press data;
for the first j punching processesiStandard deviation of individual stamped data; is calculated by the formula
、
；
、
。
In the foregoing solution, the determining a relative relationship between the stamping data and the envelope model includes:
setting the stamping process as the j +1 th stamping process, acquiring m stamping data in each stamping process, and determining the relative relationship between the stamping data and the envelope model by using the following formula:
wherein L is the current stamping data and the current enveloping modelThe relative relationship between the two or more of the two,
and
respectively forming upper and lower definite boundaries of the envelope model in the j +1 th stamping process;
；
；
and
is a definite scale factor;
the average value of ith stamping data in the previous j stamping processes is obtained;
the standard deviation of the ith stamping data in the previous j stamping processes; is calculated by the formula
、
；
、
。
The embodiment of the invention also provides a device for monitoring the stamping abnormity, which comprises:
the first acquisition module is used for acquiring historical stamping data of all stamping processes from the initial stamping process to the current stamping process for each stamping process; wherein the total number of stamping processes is greater than or equal to 3;
the establishing module is used for establishing the enveloping model of the stamping process according to the historical stamping data;
the second acquisition module is used for acquiring the stamping data of the stamping process;
the determining module is used for determining the relative relationship between the stamping data and the envelope model;
and the judging module is used for judging the abnormal condition of the stamping process according to the relative relation.
An embodiment of the present invention further provides an electronic device, including: a processor and a memory for storing a computer program capable of running on the processor; wherein the content of the first and second substances,
the processor is adapted to perform the steps of any of the above methods when running the computer program.
The embodiment of the invention also provides a storage medium, wherein a computer program is stored in the storage medium, and when the computer program is executed by a processor, the steps of any one of the methods are realized.
According to the stamping abnormity monitoring method, the stamping abnormity monitoring device, the electronic equipment and the storage medium, historical stamping data of all stamping processes from an initial stamping process to a current stamping process are obtained for each stamping process; wherein the total number of stamping processes is greater than or equal to 3; establishing a current enveloping model of the current stamping process according to the historical stamping data; obtaining the stamping data of the stamping process; determining a relative relationship between the stamping data and the enveloping model; and judging the abnormal condition of the stamping process according to the relative relation. The scheme provided by the invention adopts an incremental successive model building mode to monitor the stamping process, so that the monitoring result of each stamping process is accurate and reliable.
Drawings
FIG. 1 is a schematic flow chart of a method for monitoring stamping anomalies according to an embodiment of the present disclosure;
FIG. 2 is a schematic diagram of a third stamping process for creating a temporary model according to the embodiment of the present invention;
FIG. 3 is a schematic diagram of the temporary model established in the stamping process of j +1 times in the embodiment of the present invention;
FIG. 4 is a schematic diagram of a stable model established during the stamping process according to an embodiment of the present invention;
FIG. 5 is a schematic diagram illustrating successful establishment of a stable model according to an embodiment of the present invention;
FIG. 6 is a schematic diagram illustrating a failure of a stable model according to an embodiment of the present invention;
FIG. 7 is a schematic structural diagram of a stamping anomaly monitoring device according to an embodiment of the present invention;
fig. 8 is an internal structural diagram of a computer device according to an embodiment of the present invention.
Detailed Description
The present invention will be described in further detail with reference to the accompanying drawings and examples.
The embodiment of the invention provides a stamping abnormity monitoring method, as shown in fig. 1, the method comprises the following steps:
step 101: for each stamping process, acquiring historical stamping data of all stamping processes from the initial stamping process to the current stamping process; wherein the total number of stamping processes is greater than or equal to 3;
step 102: establishing a current enveloping model of the current stamping process according to the historical stamping data;
step 103: obtaining the stamping data of the stamping process;
step 104: determining a relative relationship between the stamping data and the enveloping model;
step 105: and judging the abnormal condition of the stamping process according to the relative relation.
The embodiment can be applied to the stamping scene of high-frequency discrete production, in particular to the scene of frequent die replacement and more stamping parameter adjustment. The high-frequency stamping scene is a stamping scene with the frequency of more than 30spm (stroke per min), the single processing time is extremely short, the stamping action time is shorter, and the stamping scene is about 1/8 to 1/9 of the single processing time. For example, a stamping scenario with a frequency of 60spm, a production time of 1s per piece, and a processing time of about 0.12 s.
In this embodiment, an envelope model is first established by using small sample data, and then a material skip phenomenon in the production process is monitored according to a relative relationship between the latest production process monitoring data and an envelope region in the envelope model (for example, an area beyond an envelope range in the envelope model). For example, the monitoring data of the 200 th stamping process does not exceed the area of the envelope range in the envelope model, so that the 200 th stamping process is judged not to have the material skip phenomenon. Monitoring data of the 600 th stamping process exceed the area of an envelope range in the envelope model, so that the material jumping phenomenon in the 600 th stamping process is judged.
In addition, the present embodiment monitors the punching process by using an incremental successive modeling method. As shown in fig. 2, for the third stamping process, the stamping data of the previous two stamping processes is obtained first to establish a temporary model M2, and the temporary model M2 is used to determine the abnormal condition of the third stamping process; for the fourth stamping process, firstly, stamping data of the previous stamping process is obtained to establish a temporary model M3, and the temporary model M3 is used for judging the abnormal condition of the fourth stamping process; by analogy, as shown in fig. 3, for the j +1 th stamping process, a temporary model Mj is established by using the previous j stamping data, and the abnormal condition of the j +1 th stamping process is monitored by using the temporary model Mj. The punching process is monitored by adopting an incremental successive model building mode, the required sample data amount is small, and the monitoring result of each punching process can be accurate and reliable.
In an embodiment, after determining an abnormal condition of the stamping process according to the relative relationship, the method further includes:
and when the punching process is judged to be abnormal, setting the next punching process as the initial punching process.
In the embodiment, it is required to ensure that no material jumping or other abnormalities are generated in the previous n-time stamping process, and when the material jumping or other abnormalities are generated, the established envelope model is not suitable for judgment of the subsequent stamping process. At this time, the initial punching process needs to be determined again.
In addition, since there are punch wear, die wear, and the like in the punching process, it is possible to set the reconstruction of the model every t (e.g., 10) minutes to prevent the model from being degraded due to a change in the production state. In addition, when w abnormalities occur continuously, it can be determined that a significant abnormality, such as punch breakage, die breakage, punch press failure, or the like, has occurred.
The method has short modeling time and small required data volume, and can avoid the problem of model failure caused by monitoring curve drift phenomenon due to the change of punching force and punch and die states along with time.
In an embodiment, before obtaining the historical punching data of all punching processes from the initial punching process to the current punching process, the method further includes:
setting the first stamping process after the shutdown of the generating equipment, the adjustment of production parameters, the replacement of the die or the modification of the die as the initial stamping process.
In this embodiment, after the mold is replaced, the machine is stopped for a long time, the mold is repaired, and the production parameters are adjusted, the modeling process needs to be restarted to ensure the effectiveness of the model.
In one embodiment, the stamping data includes stamping signal values, and acquiring each stamping data includes:
and acquiring a stamping signal value between a preset first time before the maximum value of the stamping signal value and a preset second time after the maximum value of the stamping signal value in each stamping process.
Specifically, the present embodiment may utilize sensors to collect stamping data during the stamping process. Such as ultrasonic sensors, impact force sensors, acceleration sensors, noise sensors, etc. And the process parameters, the production batches and the PLC monitoring data set by production can be obtained through the equipment PLC module. Here, the process parameters include set punching force, stroke, material name, spm information. In addition, the monitoring data of each workpiece production process can be recorded according to the workpiece ID.
In the embodiment, the punching signal is cut, and only the data of the effective working period is extracted. For example, data of 1000 before and after the maximum value is extracted.
After the data of the production process are collected, the data can be cleaned, and abnormal values caused by sensor abnormality and the like can be eliminated.
In an embodiment, before obtaining the historical punching data of all punching processes from the initial punching process to the current punching process for each punching process, the method further includes:
obtaining the stamping times of the stamping process;
judging whether the stamping times are larger than a preset threshold value or not;
when the stamping times are larger than a preset threshold value, acquiring an envelope model of a stamping process of a first preset threshold value;
determining a first relative relation between the stamping data and an envelope model of a first preset threshold stamping process;
and judging the abnormal condition of the stamping process according to the first relative relation.
Here, in order to reduce the amount of calculation, after the envelope model of the press process is created n (for example, 30) times, the envelope model of the press process of the nth time may be used as a stable envelope model for the judgment of the subsequent press process, and the subsequent press process does not need to reconstruct the envelope model each time.
Namely, when j = n, a stable machining model Mn is obtained, and after the model Mn is constructed, the subsequent punching process monitors abnormal conditions by using the model Mn, as shown in fig. 4.
Next, the model calculation process of the present application will be explained with an embodiment. Specifically, the method comprises the following steps of;
in an embodiment, the stamping process is set as a j +1 th stamping process, and m stamping data are obtained in each stamping process, where the expression of the corresponding point in the j th stamping is:
the formula for establishing the envelope model is as follows:
wherein the content of the first and second substances,
and
the upper and lower definite boundaries of the enveloping model in the j +1 th stamping process are respectively;
；
；
and
is a definite scale factor;
for the former j punching processesiAverage values of individual stamping data;
for the former j punching processesiStandard deviation of individual stamped data; is calculated by the formula
、
；
、
。
Through the process, the temporary stamping model Mj +1 is constructed for the previous j times.
After the temporary model Mj +1 is built, the abnormity judgment of the j +1 th stamping process can be carried out by using the model Mj + 1.
Determining the relative relationship between the stamping data and the envelope model by using the following formula:
wherein, L is the relative relation between the current stamping data and the current enveloping model,
and
respectively forming upper and lower definite boundaries of the envelope model in the j +1 th stamping process;
；
；
and
is the upper and lower definite scale coefficients;
the average value of ith stamping data in the previous j stamping processes;
the standard deviation of the ith stamping data in the previous j stamping processes; is calculated by the formula
、
；
、
。
And setting a judgment threshold, and judging that the j +1 th stamping process is normal machining when L is less than Llim (judgment threshold), or judging that the j +1 th stamping process is abnormal. Here, if the j +1 th press process is abnormal, it is necessary to restart the setup of M2.
And analogy is carried out, when the modeling times n are reached, the model stops being built, and the stable model Mn is produced.
And when a workpiece X is newly processed, namely j > n, calculating:
and when the L is less than the Llim (judgment threshold), judging that the subsequent stamping process is normal, otherwise, judging that the subsequent stamping process is abnormal.
In addition, it should be noted here that in the n-time modeling process, because the initial modeling sample has a small deviation, that is, the sample has a small richness, for the upper and lower definite proportionality coefficients, a strategy from large to small should be adopted, and the expression thereof is:
wherein the content of the first and second substances,
in order to adjust the parameters of the system,
is constantly greater than zero.
According to the stamping abnormity monitoring method, the device, the electronic equipment and the storage medium provided by the embodiment of the invention, for each stamping process, historical stamping data of all stamping processes from an initial stamping process to a current stamping process are obtained; wherein the total number of stamping processes is greater than or equal to 3; establishing a current enveloping model of the current stamping process according to the historical stamping data; obtaining the stamping data of the stamping process; determining a relative relationship between the stamping data and the enveloping model; and judging the abnormal condition of the stamping process according to the relative relation. The scheme provided by the invention adopts an incremental successive model building mode to monitor the stamping process, so that the monitoring result of each stamping process is accurate and reliable.
The present invention will be described in detail below with reference to application examples.
In this embodiment, a method based on a kernel function and an incremental model is adopted to construct a system for monitoring stamping anomalies.
In this embodiment, an envelope model is established by using small sample data, and a skip material monitoring model is established according to a relative relationship (for example, an area exceeding an envelope range) between monitoring data of a latest production process and an envelope region.
Referring to fig. 5 and 6, the model needs to ensure that no material jump or other abnormalities are generated in the previous n times of processing, and if the material jump or other abnormalities are generated, the model construction fails.
The modeling process of the embodiment is as follows:
the data of the stamping production process are collected by using a sensor, the process parameters, the production batches and the PLC monitoring data set by production are obtained from the PLC of the machine station, and the monitoring data of the production process of each workpiece are recorded according to the ID of the workpiece.
(a) The detected injection molding machine system consists of a punch and a die.
(b) Wherein, an ultrasonic sensor is arranged on the mould (the stamping force, acceleration and noise sensors are also applicable to the modeling method)
(c) The collected process parameters include:
the press force, stroke, material name, spm information are set.
Firstly, cutting a stamping signal, extracting only effective working period data, wherein the strategy is to extract data of 400 (for example) before the maximum value and 1000 (for example) after the maximum value, and the data needs to be adjusted according to the processing condition and an analysis mechanism and is input by a system.
And cleaning the acquired production process data, identifying abnormal values caused by sensor abnormality and the like, and filtering the noise frequency band data by using a common filtering method.
The model construction process comprises the following steps:
when the model needs to be retrained due to factors such as model changing, model repairing, long-time shutdown and the like, the following modeling process is adopted:
firstly, the model needs the first two punching processes to establish a temporary model M2 for determining the abnormal situation of the third punching process, as shown in fig. 2.
By analogy, when the machining is performed to the j +1 th time, a temporary model Mj is established by using the data of the previous j times, and the abnormal condition of the j +1 th time of machining is monitored, as shown in FIG. 3.
When j = n, the stable machining model Mn is obtained, the model construction is completed, and the subsequent monitoring is performed on the abnormal condition by using the model, as shown in fig. 4.
Taking the jth stamping as an example, constructing a model expression, wherein the expression of the corresponding point of the jth stamping is as follows:
wherein j =2,4, \8230n.
And (3) calculating the average value and the standard deviation of corresponding points of the previous j punching times:
wherein, the first and the second end of the pipe are connected with each other,
，
。
to be provided with
As a center, a temporary monitoring model of the first two stamping is established, wherein the upper and lower definite limits are as follows:
wherein the content of the first and second substances,
，
and aj and bj are infimum proportional coefficients and are described later.
And finishing the construction of the temporary stamping model Mj for the first j times.
Can calculate out
Wait for the (j + 1) th modulo signal
After the acquisition is finished, judging the abnormal condition of the (j + 1) th module:
and setting a threshold value, and judging that the (j + 1) th mode is normal machining when L is less than Llim, or else, judging that the mode is abnormal. If the (j + 1) th module machining is abnormal, M2 needs to be established again.
And analogizing in sequence, stopping building the model after the modeling times n are reached, and producing the stable model Mn.
The logic of the subsequent judgment formula is as follows, and a workpiece X is newly processed:
and when L is less than Llim, judging that the subsequent die is normal machining, otherwise, judging that the subsequent die is abnormal.
In the n modeling processes, because the initial modeling sample deviation is small, that is, the sample richness is small, for the upper and lower definite scale coefficients, a strategy from big to small should be adopted, and the expression is as follows:
wherein the content of the first and second substances,
in order to adjust the parameters of the system,
is constantly greater than zero.
Meanwhile, since there are punch wear and die wear in the punching process, it is necessary to reconstruct the model every t (e.g., 10) minutes to prevent the model from being degraded due to a change in the production state.
If w anomalies occur consecutively, it is considered that a significant anomaly, such as punch fracture, die break, punch failure, etc., has occurred.
In the embodiment, in a stamping scene, a modeling method for material skip monitoring is used for modeling by using n-1 processing data (small samples) so as to judge the normal condition of subsequent processing, and if the normal condition exceeds a certain upper and lower limit, the abnormal condition is determined. Only the number of sampling points before 400 (for example) and after 1000 (for example) of the highest point is intercepted to construct a model. And aiming at the condition that sample data fails due to abnormality in the small sample collection process, an incremental successive modeling method is adopted, and if the abnormality occurs, modeling is carried out again. Because the difference between samples is small in the initial stage of incremental successive modeling, a strategy of gradually reducing the proportionality coefficient (for example, a infimum proportional adjustment strategy based on exponential function change) is adopted to adjust, so as to overcome the problem. And adopting a model reconstruction strategy every t minutes to prevent model degradation caused by the change of the production state. Whenever there are consecutive w anomalies, a significant anomaly is considered to have occurred, and the model needs to be reconstructed.
In addition, the system has the following advantages:
1. by adopting a small sample modeling mode, a monitoring model can be established under the conditions of insufficient data accumulation and more production state changes. The method is particularly effective for scenes of frequently changing the die and the machining process.
2. The model is constructed by intercepting only the number of sampling points of the top 400 (for example) and the bottom 1000 (for example), so that the calculation amount can be reduced, and the influence of redundant data on the model can be reduced.
3. By adopting the incremental successive modeling method, negative samples in the sample collection process can be prevented (in the traditional mode, the modeling samples are all positive samples needing to be ensured manually).
4. By utilizing the strategy of gradually reducing the proportionality coefficient, the problem that the early stage discrimination is strict due to small difference between samples at the early stage can be avoided.
5. And adopting a time and great abnormal model construction strategy to prevent the model degradation problem caused by the change of the production state.
In order to implement the method according to the embodiment of the present invention, an embodiment of the present invention further provides a stamping anomaly monitoring apparatus, as shown in fig. 7, the stamping anomaly monitoring apparatus 1000 includes: a first obtaining module 1001, a building module 1002, a second obtaining module 1003, a determining module 1004 and a judging module 1005; wherein, the first and the second end of the pipe are connected with each other,
a first obtaining module 1001, configured to obtain, for each stamping process, historical stamping data of all stamping processes from an initial stamping process to a current stamping process; wherein the total number of stamping processes is greater than or equal to 3;
an establishing module 1002, configured to establish a current envelope model of the current stamping process according to the historical stamping data;
a second obtaining module 1003, configured to obtain the stamping data of the stamping process;
a determining module 1004, configured to determine a relative relationship between the current stamping data and the current envelope model;
a determining module 1005, configured to determine an abnormal condition of the stamping process according to the relative relationship.
In practical applications, the first obtaining module 1001, the establishing module 1002, the second obtaining module 1003, the determining module 1004, and the determining module 1005 may be implemented by a processor in the punching abnormality monitoring apparatus.
It should be noted that: the above-mentioned apparatus provided in the above-mentioned embodiment is only exemplified by the division of the above-mentioned program modules when executing, and in practical application, the above-mentioned processing may be distributed to be completed by different program modules according to needs, that is, the internal structure of the terminal is divided into different program modules to complete all or part of the above-mentioned processing. In addition, the apparatus provided in the above embodiment and the method embodiment belong to the same concept, and the specific implementation process thereof is described in the method embodiment, which is not described herein again.
In order to implement the method of the embodiment of the present invention, the embodiment of the present invention further provides a computer program product, where the computer program product includes computer instructions, and the computer instructions are stored in a computer-readable storage medium. A processor of the computer device reads the computer instructions from the computer-readable storage medium, and the processor executes the computer instructions to cause the computer device to perform the steps of the above-described method.
Based on the hardware implementation of the program module, in order to implement the method according to the embodiment of the present invention, an electronic device (computer device) is also provided in the embodiment of the present invention. Specifically, in one embodiment, the computer device may be a terminal, and its internal structure diagram may be as shown in fig. 8. The computer apparatus includes a processor a01, a network interface a02, a display screen a04, an input device a05, and a memory (not shown in the figure) connected through a system bus. Wherein the processor a01 of the computer device is arranged to provide computing and control capabilities. The memory of the computer device includes an internal memory a03 and a nonvolatile storage medium a06. The nonvolatile storage medium a06 stores an operating system B01 and a computer program B02. The internal memory a03 provides an environment for running the operating system B01 and the computer program B02 in the nonvolatile storage medium a06. The network interface a02 of the computer apparatus is used for communicating with an external terminal through a network connection. The computer program is executed by the processor a01 to implement the method of any of the above embodiments. The display screen a04 of the computer device may be a liquid crystal display screen or an electronic ink display screen, and the input device a05 of the computer device may be a touch layer covered on the display screen, a key, a trackball or a touch pad arranged on a casing of the computer device, or an external keyboard, a touch pad or a mouse.
Those skilled in the art will appreciate that the architecture shown in fig. 8 is merely a block diagram of some of the structures associated with the disclosed aspects and is not intended to limit the computing devices to which the disclosed aspects apply, as particular computing devices may include more or less components than those shown, or may combine certain components, or have a different arrangement of components.
The device provided by the embodiment of the present invention includes a processor, a memory, and a program stored in the memory and capable of running on the processor, and when the processor executes the program, the method according to any one of the embodiments is implemented.
As will be appreciated by one skilled in the art, embodiments of the present application may be provided as a method, system, or computer program product. Accordingly, the present application may take the form of an entirely hardware embodiment, an entirely software embodiment or an embodiment combining software and hardware aspects. Furthermore, the present application may take the form of a computer program product embodied on one or more computer-usable storage media (including, but not limited to, disk storage, CD-ROM, optical storage, and the like) having computer-usable program code embodied therein.
The present application is described with reference to flowchart illustrations and/or block diagrams of methods, apparatus (systems), and computer program products according to embodiments of the application. It will be understood that each flow and/or block of the flow diagrams and/or block diagrams, and combinations of flows and/or blocks in the flow diagrams and/or block diagrams, can be implemented by computer program instructions. These computer program instructions may be provided to a processor of a general purpose computer, special purpose computer, embedded processor, or other programmable data processing apparatus to produce a machine, such that the instructions, which execute via the processor of the computer or other programmable data processing apparatus, create means for implementing the functions specified in the flowchart flow or flows and/or block diagram block or blocks.
These computer program instructions may also be stored in a computer-readable memory that can direct a computer or other programmable data processing apparatus to function in a particular manner, such that the instructions stored in the computer-readable memory produce an article of manufacture including instruction means which implement the function specified in the flowchart flow or flows and/or block diagram block or blocks.
These computer program instructions may also be loaded onto a computer or other programmable data processing apparatus to cause a series of operational steps to be performed on the computer or other programmable apparatus to produce a computer implemented process such that the instructions which execute on the computer or other programmable apparatus provide steps for implementing the functions specified in the flowchart flow or flows and/or block diagram block or blocks.
In a typical configuration, a computing device includes one or more processors (CPUs), input/output interfaces, network interfaces, and memory.
The memory may include forms of volatile memory in a computer readable medium, random Access Memory (RAM) and/or non-volatile memory, such as Read Only Memory (ROM) or flash memory (flash RAM). The memory is an example of a computer-readable medium.
Computer-readable media, including both permanent and non-permanent, removable and non-removable media, may implement the information storage by any method or technology. The information may be computer readable instructions, data structures, modules of a program, or other data. Examples of computer storage media include, but are not limited to, phase change memory (PRAM), static Random Access Memory (SRAM), dynamic Random Access Memory (DRAM), other types of Random Access Memory (RAM), read Only Memory (ROM), electrically Erasable Programmable Read Only Memory (EEPROM), flash memory or other memory technology, compact disc read only memory (CD-ROM), digital Versatile Discs (DVD) or other optical storage, magnetic cassettes, magnetic tape magnetic disk storage or other magnetic storage devices, or any other non-transmission medium that can be used to store information that can be accessed by a computing device. As defined herein, computer readable media does not include transitory computer readable media (transmyedia) such as modulated data signals and carrier waves.
It will be appreciated that the memory of embodiments of the invention may be either volatile memory or nonvolatile memory, or may include both volatile and nonvolatile memory. Among them, the nonvolatile Memory may be a Read Only Memory (ROM), a Programmable Read Only Memory (PROM), an Erasable Programmable Read-Only Memory (EPROM), an Electrically Erasable Programmable Read-Only Memory (EEPROM), a magnetic random access Memory (FRAM), a magnetic random access Memory (Flash Memory), a magnetic surface Memory, an optical Disc, or a Compact Disc Read-Only Memory (CD-ROM); the magnetic surface storage may be disk storage or tape storage. Volatile Memory can be Random Access Memory (RAM), which acts as external cache Memory. By way of illustration and not limitation, many forms of RAM are available, such as Static Random Access Memory (SRAM), synchronous Static Random Access Memory (SSRAM), dynamic Random Access Memory (DRAM), synchronous Dynamic Random Access Memory (SDRAM), double Data Rate Synchronous Dynamic Random Access Memory (DDRSDRAM), enhanced Synchronous Dynamic Random Access Memory (ESDRAM), enhanced Synchronous Dynamic Random Access Memory (Enhanced DRAM), synchronous Dynamic Random Access Memory (SLDRAM), direct Memory (DRmb Access), and Random Access Memory (DRAM). The described memory for embodiments of the present invention is intended to comprise, without being limited to, these and any other suitable types of memory.
It should also be noted that the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrases "comprising a," "8230," "8230," or "comprising" does not exclude the presence of additional identical elements in the process, method, article, or apparatus comprising the element.
The above are merely examples of the present application and are not intended to limit the present application. Various modifications and changes may occur to those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application should be included in the scope of the claims of the present application.
Claims (10)
1. A method of monitoring for stamping anomalies, the method comprising:
for each stamping process, acquiring historical stamping data of all stamping processes from the initial stamping process to the current stamping process; wherein the total number of stamping processes is greater than or equal to 3;
establishing a current enveloping model of the current stamping process according to the historical stamping data;
obtaining the stamping data of the stamping process;
determining a relative relationship between the stamping data and the enveloping model;
and judging the abnormal condition of the stamping process according to the relative relation.
2. The method according to claim 1, wherein after determining the abnormal condition of the stamping process according to the relative relationship, the method further comprises:
and when the punching process is judged to be abnormal, setting the next punching process as the initial punching process.
3. The method of claim 1, wherein prior to obtaining historical stamping data for all stamping processes from an initial stamping process to a current stamping process, the method further comprises:
setting the first stamping process after the generation equipment is stopped, the production parameters are adjusted, the die is replaced or the die is modified as the initial stamping process.
4. The method of claim 1, wherein the stamping data comprises stamping signal values, and wherein obtaining each stamping data comprises:
and acquiring a stamping signal value between a preset first time before the maximum value of the stamping signal value and a preset second time after the maximum value of the stamping signal value in each stamping process.
5. The method of claim 1, wherein for each stamping process, before obtaining historical stamping data for all stamping processes from an initial stamping process to a previous stamping process, the method further comprises:
obtaining the stamping times of the stamping process;
judging whether the stamping times are larger than a preset threshold value or not;
when the stamping times are larger than a preset threshold value, acquiring an envelope model of a stamping process of a first preset threshold value;
determining a first relative relation between the stamping data and an envelope model of a first preset threshold stamping process;
and judging the abnormal condition of the stamping process according to the first relative relation.
6. The method according to claim 1, wherein the establishing a present envelope model of the present stamping process according to the historical stamping data comprises:
setting the stamping process as the j +1 th stamping process, acquiring m stamping data in each stamping process, and establishing an envelope model by using the following formula:
wherein the content of the first and second substances,
and
respectively forming upper and lower definite boundaries of the envelope model in the j +1 th stamping process;
；
；
and
is the upper and lower definite scale coefficients;
for the first j punching processesiAverage of individual press data;
for the former j punching processesiStandard deviation of individual stamped data; is calculated by the formula
、
；
、
。
7. The method of claim 1, wherein the determining a relative relationship between the current stamping data and the current envelope model comprises:
setting the stamping process as the j +1 th stamping process, acquiring m stamping data in each stamping process, and determining the relative relationship between the stamping data and the envelope model by using the following formula:
wherein L is the relative relation between the current stamping data and the current envelope model,
and
is respectively j +Enveloping the upper and lower definite boundaries of the model in the 1-time stamping process;
；
；
and
is a definite scale factor;
the average value of ith stamping data in the previous j stamping processes;
the standard deviation of the ith stamping data in the previous j stamping processes; is calculated by the formula
、
；
、
。
8. A press anomaly monitoring device, the device comprising:
the first acquisition module is used for acquiring historical stamping data of all stamping processes from the initial stamping process to the current stamping process for each stamping process; wherein the total number of stamping processes is greater than or equal to 3;
the establishing module is used for establishing the enveloping model of the stamping process according to the historical stamping data;
the second acquisition module is used for acquiring the stamping data of the stamping process;
the determining module is used for determining the relative relationship between the stamping data and the enveloping model;
and the judging module is used for judging the abnormal condition of the stamping process according to the relative relation.
9. An electronic device, comprising: a processor and a memory for storing a computer program capable of running on the processor; wherein the content of the first and second substances,
the processor is adapted to perform the steps of the method of any one of claims 1 to 7 when running the computer program.
10. A storage medium having a computer program stored thereon, wherein the computer program, when executed by a processor, performs the steps of the method of any one of claims 1 to 7.
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