CN115679425A - Electroplating clamp and electroplating equipment - Google Patents
Electroplating clamp and electroplating equipment Download PDFInfo
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- CN115679425A CN115679425A CN202211390913.XA CN202211390913A CN115679425A CN 115679425 A CN115679425 A CN 115679425A CN 202211390913 A CN202211390913 A CN 202211390913A CN 115679425 A CN115679425 A CN 115679425A
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- bearing
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Abstract
The application relates to the technical field of electroplating equipment, in particular to an electroplating clamp and electroplating equipment. The electroplating clamp comprises a conductive contact mechanism, a bearing mechanism, a lifting clamping mechanism, a supporting mechanism and a rotation driving mechanism; the conductive contact mechanism is connected to the top of the bearing mechanism; the lifting clamping mechanism comprises a lifting driving member, a first fixed connecting seat, a first movable connecting seat, a synchronous transmission rod and a clamping disc; the lifting driving component is arranged on the supporting mechanism and can drive the first fixed connecting seat to drive the clamping disc to be close to or far away from the conductive contact mechanism; the rotation driving mechanism is arranged on the supporting mechanism, is connected with the bearing mechanism and can drive the bearing mechanism to drive the synchronous transmission rod, the clamping disc, the conductive contact mechanism and the first movable connecting seat to synchronously rotate. The electroplating clamp realizes the breakthrough of integrating rotation, clamping and uniform electric conduction, and effectively improves the thickness uniformity of the electroplated coating of the wafer and the yield of products.
Description
Technical Field
The application relates to the technical field of electroplating equipment, in particular to an electroplating clamp and electroplating equipment.
Background
Wafer electroplating is one of the key steps in the semiconductor chip manufacturing process, and the wafer is placed in an electroplating solution, a negative voltage is connected to the wafer to serve as a cathode, a positive voltage is connected to a soluble or insoluble anode, and metal ions in the electroplating solution are deposited on the surface of the wafer through the action of an electric field.
With the continuous improvement of the automation degree of semiconductor wafer manufacturing equipment, the automation degree of wafer electroplating equipment becomes an important index for meeting the production requirements. At present, the electroplating clamp used by the wafer electroplating equipment on the market is mostly of a manual clamping conductive type, and the problems of low automation degree, low production efficiency, poor stability and the like exist, so that the requirement of the equipment cannot be met.
Disclosure of Invention
An object of the application is to provide an electroplating fixture and electroplating device to solve the technical problem that the degree of automation that electroplating fixture of manual centre gripping conduction type among the prior art exists is low, production efficiency is low and stability is relatively poor to a certain extent.
The application provides an electroplating clamp which comprises a conductive contact mechanism, a bearing mechanism, a lifting clamping mechanism, a supporting mechanism and a rotation driving mechanism;
the bearing mechanism is used for bearing and positioning a workpiece to be electroplated, and the conductive contact mechanism is connected to the top of the bearing mechanism;
the lifting clamping mechanism comprises a lifting driving member, a first fixed connecting seat, a first movable connecting seat, a synchronous transmission rod and a clamping disc;
the lifting driving component is arranged on the supporting mechanism, the first fixed connecting seat is connected with the lifting driving component, the first movable connecting seat is rotatably connected with the first fixed connecting seat, one end of the synchronous transmission rod is connected with the first movable connecting seat, the other end of the synchronous transmission rod sequentially penetrates through the bearing mechanism to be connected with the clamping disc, and the lifting driving component can drive the first fixed connecting seat to drive the clamping disc to be close to or far away from the conductive contact mechanism;
the rotation driving mechanism is arranged on the supporting mechanism, and the rotation driving mechanism is connected with the bearing mechanism and can drive the bearing mechanism to drive the synchronous transmission rod, the clamping disc, the conductive contact mechanism and the first movable connecting seat to rotate synchronously.
In the above technical solution, further, the electroplating jig further includes a conductive slip ring mechanism, and the conductive slip ring mechanism includes a slip ring stator disposed on the supporting mechanism and a slip ring rotor rotatably sleeved with the slip ring stator;
the slip ring rotor is connected with the rotation driving mechanism, and the rotation driving mechanism can drive the slip ring rotor to synchronously rotate along with the bearing mechanism;
the slip ring rotor is electrically connected with the conductive contact mechanism, and the slip ring stator is electrically connected with an external power supply.
In any of the above technical solutions, further, the supporting mechanism includes an installation base and a connecting arm, one end of the connecting arm is connected with the installation base, and the other end of the connecting arm is used for being connected with the machine platform;
the rotation driving mechanism comprises a rotating shaft and a driving assembly, the shaft hole is formed in the mounting seat, the rotating shaft is rotatably arranged in the shaft hole in a penetrating mode, and the driving assembly is arranged at the bottom of the mounting seat and can drive the bottom end of the rotating shaft to rotate.
In any of the above technical solutions, further, the slip ring stator is disposed at the top of the mounting seat, the slip ring rotor rotatably penetrates through the inside of the slip ring stator, the slip ring rotor is provided with a second shaft hole, and the rotating shaft penetrates through the second shaft hole and is connected with the slip ring rotor;
the first fixed connecting seat and the first movable connecting seat are provided with avoiding through holes, and the conducting slip ring mechanism is accommodated in the avoiding through holes.
In any of the above technical solutions, further, the carrying mechanism includes a carrying tray;
the bearing discs are arranged at the top of the first movable connecting seat at intervals, and the top end of the rotating shaft is connected with the bottom of the bearing disc;
the inner peripheral side wall of the top end of the bearing disc is provided with a positioning groove, and the positioning groove is matched with the outer peripheral side wall of a workpiece to be electroplated;
bear the inside of dish and be formed with the direction and hold the chamber, press from both sides tight dish liftable set up in the direction holds the intracavity, the bottom of synchronous drive pole with first swing joint seat is connected, the top of synchronous drive pole passes bear the dish with press from both sides tight dish and be connected.
In any of the above technical solutions, further, the carrying mechanism further includes a plurality of positioning blocks;
the positioning blocks are arranged at the top end of the bearing disc and are distributed at intervals along the circumferential direction of the bearing disc;
the positioning block protrudes out of the peripheral side wall of the bearing plate, and a positioning insertion hole is formed in the positioning block;
the conductive contact mechanism comprises a conductive disc and a plurality of connecting columns, the connecting columns are correspondingly inserted into the positioning insertion holes of the positioning blocks one by one, and the conductive disc is positioned on the top side of the bearing disc.
In any of the above technical solutions, further, the conductive disc includes an annular conductive substrate and a plurality of conductive elastic pins, and the plurality of conductive elastic pins are connected with the annular conductive substrate and sequentially arranged at intervals along the circumferential direction of the annular conductive substrate;
the conductive slip ring mechanism further comprises a first connecting wire and a second connecting wire;
the first connecting wire is electrically connected with the slip ring stator and is used for externally connecting a power supply cathode;
one end of the second connecting line is electrically connected with the slip ring rotor, and the other end of the second connecting line is electrically connected with the connecting column.
In any of the above technical solutions, further, the carrying mechanism further includes a plurality of limiting portions disposed at the top end of the carrying tray, and the plurality of limiting portions are sequentially arranged at intervals along the circumferential direction of the carrying tray;
the inner peripheral side wall of the limiting portion is provided with an arc-shaped sunken portion, and the arc-shaped sunken portion is matched with the local outer peripheral side wall of the workpiece to be electroplated, so that the arc-shaped sunken portion is formed into the positioning groove.
In any of the above technical solutions, further, a boss is provided at a circumferential edge of the top of the clamping disk, and the boss extends around the circumference of the clamping disk.
The application also provides electroplating equipment, which comprises the electroplating clamp in any technical scheme.
Compared with the prior art, the beneficial effect of this application is:
the application provides an electroplating fixture, including electrically conductive contact mechanism, bearing mechanism, lift clamping mechanism, supporting mechanism and rotation actuating mechanism. The bearing mechanism is used for bearing a workpiece to be electroplated, the lifting driving component of the lifting clamping mechanism drives the clamping disc to jack the workpiece to be electroplated and press the workpiece to be electroplated on the conductive contact mechanism through the synchronous transmission rod of the lifting driving component, so that the workpiece to be electroplated is in conductive contact with the conductive contact mechanism, and the conductive contact mechanism is used for connecting an external power supply, so that the workpiece to be electroplated is electrically connected with the external power supply.
The rotation driving mechanism drives the bearing mechanism to rotate, so that the bearing mechanism can drive the clamping disc, the workpiece to be electroplated and the conductive contact mechanism to synchronously rotate, and when the workpiece to be electroplated enters electroplating solution, the coating uniformity and the product yield of the workpiece to be electroplated can be improved by rotating the workpiece to be electroplated.
In addition, first fixed connection seat and first swing joint seat are connected between synchronous transfer line and lift drive component for the rotation drive of rotation drive mechanism and the lift drive decoupling of lift drive component ensure that the two do not influence each other.
In conclusion, the electroplating clamp realizes the breakthrough of integrating rotation, clamping and uniform electric conduction, particularly, on the basis of realizing reliable clamping of the workpiece to be electroplated, the workpiece to be electroplated is clamped to rotate, meanwhile, good electric conduction contact is kept, the production efficiency and stability are ensured, and the coating thickness uniformity and the product yield of wafer electroplating are effectively improved.
The electroplating equipment provided by the application comprises the electroplating clamp, so that all the beneficial effects of the electroplating clamp can be realized.
Drawings
In order to more clearly illustrate the detailed description of the present application or the technical solutions in the prior art, the drawings needed to be used in the detailed description of the present application or the prior art description will be briefly introduced below, and it is obvious that the drawings in the following description are some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative efforts.
Fig. 1 is a schematic structural diagram of an electroplating fixture according to an embodiment of the present disclosure;
FIG. 2 is an exploded view of a plating jig according to an embodiment of the present invention;
FIG. 3 is a schematic view of a plating jig according to an embodiment of the present disclosure in a first state;
FIG. 4 isbase:Sub>A cross-sectional view of FIG. 3 at section A-A;
FIG. 5 is an enlarged view of a portion of FIG. 4 at B;
FIG. 6 is a schematic view of a second state of a plating jig according to an embodiment of the present invention;
FIG. 7 is a cross-sectional view of FIG. 6 at section C-C;
FIG. 8 is a schematic structural diagram of a lifting/lowering clamping mechanism of a plating jig according to an embodiment of the present disclosure;
FIG. 9 is a schematic structural diagram of a clamping plate of an elevating clamping mechanism of a plating jig according to an embodiment of the present disclosure;
FIG. 10 is a cross-sectional view of FIG. 9 at section D-D;
FIG. 11 is an enlarged view of a portion of FIG. 10 at E;
fig. 12 is a schematic structural diagram of a supporting mechanism of a plating jig according to an embodiment of the present disclosure;
fig. 13 is a schematic structural diagram of a conductive plate of a conductive contact mechanism of a plating jig according to an embodiment of the present application.
Reference numerals:
1-electroplating a fixture; 10-a support mechanism; 100-a linker arm; 101-a mounting seat; 11-a rotational drive mechanism; 110-a drive assembly; 111-a rotating shaft; 12-a lifting clamping mechanism; 120-a lift drive member; 121-a first stationary connection base; 122-a second stationary connection base; 123-crossed ball bearings; 124-a first movable connecting seat; 125-synchronous drive rod; 126-a clamping disk; 1260-boss; 13-a carrying mechanism; 130-a carrier tray; 131-a positioning block; 1310-a positioning receptacle; 132-a limiting part; 1320-arc-shaped recess; 133-a connecting flange; 14-a conductive contact mechanism; 140-a placement tray; 141-ring-shaped conductive substrate; 142-a conductive pogo pin; 143-a sealing member; 144-connecting column; 15-conductive slip ring mechanism; 150-slip ring rotor; 151-slip ring stator; 152-a first connection line; 153-second connecting line; 2-the workpiece to be electroplated.
Detailed Description
The technical solutions of the present invention will be described clearly and completely with reference to the accompanying drawings, and it is to be understood that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
Example one
Referring to fig. 1 to 13, an embodiment of the present application provides a plating jig 1 for a plating apparatus, which is capable of clamping, positioning, and conducting electricity to a workpiece 2 to be plated, where the workpiece 2 to be plated is, for example, a wafer.
As shown in fig. 1 and fig. 2, the plating jig 1 provided in this embodiment includes a conductive contact mechanism 14, a carrying mechanism 13, a lifting and lowering clamping mechanism 12, a supporting mechanism 10, a rotation driving mechanism 11, and a conductive slip ring mechanism 15.
Hereinafter, the above-described components of the plating jig 1 will be specifically described.
In an alternative of this embodiment, the bearing mechanism 13 is used for bearing and positioning the workpiece 2 to be electroplated, and the bearing mechanism 13 includes a bearing tray 130, so that the workpiece 2 to be electroplated is borne and positioned by the bearing tray 130.
Particularly, the positioning groove is formed in the inner peripheral side wall of the top end of the bearing plate 130, and the positioning groove is matched with the outer peripheral side wall of the workpiece to be electroplated 2, so that the workpiece to be electroplated 2 is positioned through the positioning groove.
In this embodiment, in order to reduce the possibility of generating spatial interference between the carrier tray 130 and the peripheral sidewall of the workpiece 2 to be electroplated, the carrier mechanism 13 further includes a plurality of limiting portions 132 disposed at the top end of the carrier tray 130, for example, the number of the limiting portions 132 is two, three, four or more, and the plurality of limiting portions 132 are uniformly arranged at intervals along the circumferential direction of the carrier tray 130.
The inner peripheral side wall of the limiting portion 132 is formed with an arc-shaped recessed portion 1320, the arc-shaped recessed portion 1320 is matched with the local outer peripheral side wall of the workpiece 2 to be electroplated, so that the plurality of arc-shaped recessed portions 1320 form a positioning groove, that is, the local position of the workpiece 2 to be electroplated is limited in the arc-shaped recessed portion 1320, and thus the workpiece 2 to be electroplated is positioned in a multi-point bearing manner through the arc-shaped recessed portions 1320 of the plurality of limiting portions 132.
In an alternative of this embodiment, as shown in fig. 8, the elevation clamping mechanism 12 includes an elevation driving member 120, a first stationary coupling base 121, a first movable coupling base 124, a timing transmission rod 125, and a clamping disk 126.
The lifting driving member 120 is disposed on the supporting mechanism 10, and the first fixing connection seat 121 is connected to the lifting driving member 120, wherein the first fixing connection seat 121 is, for example, a first fixing flange, the lifting driving member 120 is, for example, an air cylinder or a linear driving module, etc., the number of the lifting driving members 120 may be multiple, and the multiple lifting driving members 120 are arranged at intervals along the circumferential direction of the first fixing connection seat 121 and are all disposed on the supporting mechanism 10.
The first movable connecting seat 124 is rotatably connected to the first fixed connecting seat 121, and specifically, the first movable connecting seat 124 is connected to the first fixed connecting seat 121 through a rotating structure, optionally, the lifting clamping mechanism 12 further includes a second fixed connecting seat 122 and a crossed ball bearing 123, the second fixed connecting seat 122 is disposed at the top of the first fixed connecting seat 121, an inner ring of the crossed ball bearing 123 is connected to an outer circumferential wall of the second fixed connecting seat 122, and an outer ring of the crossed ball bearing 123 is connected to an inner circumferential wall of the first movable connecting seat 124, so that the first movable connecting seat 124 and the outer ring of the crossed ball bearing 123 rotate relative to the inner ring of the crossed ball bearing 123 and the second fixed connecting seat 122, and the first movable connecting seat 124 can rotate relative to the first fixed connecting seat 121.
One end of the timing transmission rod 125 is connected to the first movable connection seat 124, the other end of the timing transmission rod 125 sequentially passes through the carrying mechanism 13 and the clamping disc 126 to be connected, and the lifting driving member 120 can drive the first fixed connection seat 121 to drive the timing transmission rod 125 and the clamping disc 126 to approach or separate from the conductive contact mechanism 14, in other words, the lifting driving member 120 can drive the first fixed connection seat 121, the first movable connection seat 124, the timing transmission rod 125 and the clamping disc 126 to synchronously lift, so that the clamping disc 126 can press the workpiece 2 to be electroplated in the carrying disc 130 to the electrical contact mechanism 14 in a lifting process, that is, in a process of approaching the conductive contact mechanism 14, so as to clamp the workpiece 2 to be electroplated between the clamping disc 126 and the conductive contact mechanism 14, thereby realizing current conduction between the workpiece 2 to be electroplated and the conductive contact mechanism 14, and enabling the two to be electrically connected.
The rotation driving mechanism 11 is disposed on the supporting mechanism 10, and the rotation driving mechanism 11 is connected to the carrying mechanism 13 and can drive the carrying mechanism 13 to drive the synchronous transmission rod 125, the clamping disk 126, the first movable connection seat 124 and the conductive contact mechanism 14 to rotate synchronously.
Specifically, since the synchronous transmission rod 125 connects the carrying mechanism 13 with the first movable connecting seat 124, the carrying mechanism 13 can rotate synchronously with the first movable connecting seat 124, and when the conductive contact mechanism 14 is connected with the carrying mechanism 13, the conductive contact mechanism 14 and the workpiece 2 to be plated clamped between the conductive contact mechanism 14 and the clamping disk 126 also rotate synchronously with the carrying mechanism 13. Therefore, during the electroplating process, the workpiece 2 to be electroplated can be driven to rotate in the electroplating solution by the rotation driving mechanism 11, and the electroplating uniformity of the workpiece 2 to be electroplated is improved.
In this embodiment, the supporting mechanism 10 is configured to support and fix other components of the electroplating fixture 1, the supporting mechanism 10 includes an installation seat 101 and a connecting arm 100, one end of the connecting arm 100 is connected to the installation seat 101, and the other end of the connecting arm 100 is configured to be connected to a machine, where a structural form of the machine and a connection manner between the machine and the connecting arm 100 may be adjusted according to an actual usage scenario, and are not limited, for example, the machine may be an external driving device.
Alternatively, the mount 101 is disc-shaped, and both the top and the bottom of the mount 101 may be used to mount other components.
In this embodiment, the rotation driving mechanism 11 includes a rotating shaft 111 and a driving assembly 110, a shaft hole has been opened in the mounting seat 101, the rotating shaft 111 rotatably penetrates through the shaft hole, the driving assembly 110 is disposed at the bottom of the mounting seat 101 and can drive the bottom end of the rotating shaft 111 to rotate, the top end of the rotating shaft 111 is connected with the bearing mechanism 13, so that when the driving assembly 110 drives the rotating shaft 111 to rotate, the rotating shaft 111 can drive the bearing mechanism 13 to rotate.
Alternatively, the driving assembly 110 includes a motor, a driving gear and a driven gear, the driving gear is connected to an output shaft of the motor, the driven gear is connected to the rotating shaft 111, and the driving gear is engaged with the driven gear, so that power output by the output shaft of the motor can be transmitted to the rotating shaft 111 through the driving gear and the driven gear, and the rotating shaft 111 rotates.
In an alternative of this embodiment, the conductive slip ring mechanism 15 is used to electrically connect the conductive contact mechanism 14 with an external power source. The conductive slip ring mechanism 15 includes a slip ring stator 151 disposed on the supporting mechanism 10 and a slip ring rotor 150 rotatably sleeved with the slip ring stator 151, in other words, the slip ring stator 151 is rotatably sleeved outside the slip ring rotor 150, or the slip ring rotor 150 is rotatably sleeved outside the slip ring stator 151.
When the conductive contact mechanism 14 rotates along with the bearing mechanism 13, since the slip ring rotor 150 rotates synchronously with the bearing mechanism 13, it can be ensured that the conductive contact mechanism 14 and the workpiece 2 to be electroplated can still establish a reliable electrical connection relationship with an external power supply even during the rotation process.
In this embodiment, the slip ring stator 151 is disposed on the top of the mounting base 101, and the slip ring rotor 150 rotatably penetrates through the slip ring stator 151, so that the slip ring rotor 150 and the slip ring stator 151 are rotatably sleeved.
The slip ring rotor 150 has been seted up the second shaft hole, and the pivot 111 wears to locate in the second shaft hole and is connected with slip ring rotor 150 to slip ring rotor 150 can rotate along with pivot 111 synchronization, and then slip ring rotor 150 can rotate along with bearing mechanism 13, electrically conductive contact mechanism 14 and wait to electroplate work piece 2 synchronization, and does not influence the fixed connection of slip ring stator 151 for mount pad 101.
In order to reduce the total height of the electroplating fixture 1 and improve the space utilization rate of the electroplating fixture 1 along the height direction, the first fixed connection seat 121 and the first movable connection seat 124 are both provided with an avoiding through hole, and the conductive slip ring mechanism 15 is accommodated in the avoiding through hole, so that the conductive slip ring mechanism 15, the first fixed connection seat 121 and the first movable connection seat 124 share the height space.
In this embodiment, in order to electrically connect the conductive slip ring mechanism 15 to an external power source and the conductive contact mechanism 14, the conductive slip ring mechanism 15 further includes a first connection line 152 and a second connection line 153.
Wherein, first connecting wire 152 is connected with slip ring stator 151 electricity, and be used for external power source negative pole, the one end and the slip ring rotor 150 electricity of second connecting wire 153 are connected, the other end and the electrically conductive contact mechanism 14 electricity of second connecting wire 153 are connected, because electrically conductive contact member, second connecting wire 153 and slip ring rotor 150 can synchronous revolution, therefore the winding can not take place for second connecting wire 153, and because mount pad 101, first connecting wire 152 and slip ring stator 151 all fixed the setting, therefore first connecting wire 152 can not receive the influence of slip ring rotor 150 pivoted, thereby can not take place the winding yet.
In an alternative of this embodiment, the bearing tray 130 is disposed at the top of the first movable connecting seat 124 at intervals, the top end of the rotating shaft 111 is connected to the bottom of the bearing tray 130, specifically, the bottom of the bearing tray 130 is provided with a connecting flange 133, and the top end of the rotating shaft 111 is connected to the connecting flange 133, so that when the driving assembly 110 drives the rotating shaft 111 to rotate, the bearing tray 130 can rotate synchronously.
In this embodiment, the inside of bearing dish 130 is formed with the direction and holds the chamber, and clamping disk 126 sets up in the direction with liftable and lower and holds the intracavity, specifically speaking, the direction holds the chamber and can be the tube-shape, and the outer peripheral lateral wall of clamping disk 126 contacts with the inner peripheral lateral wall that the chamber was held to the direction to when clamping disk 126 can hold the direction of height in chamber and remove along the direction under the drive of lift drive component 120, play the effect to the direction and the location that clamping disk 126 goes up and down, avoid clamping disk 126 to incline, improve clamping disk 126 to waiting to electroplate work piece 2's clamping reliability.
The bottom end of the timing transmission rod 125 is connected to the first movable connecting seat 124, and the top end of the timing transmission rod 125 penetrates through the bearing plate 130 to be connected to the clamping plate 126, so that on one hand, the lifting driving member 120 can drive the clamping plate 126 to reciprocate along the height direction of the bearing plate 130 through the timing transmission rod 125, and on the other hand, the bearing plate 130 can drive the timing transmission rod to synchronously rotate because the timing transmission rod 125 penetrates through the bearing plate 130, so that the timing transmission rod 125 sequentially drives the first movable connecting seat 124 to synchronously rotate, and meanwhile, the rotating shaft 111 drives the slip ring rotor 150 to synchronously rotate.
In the embodiment, as shown in fig. 9 to 11, the circumferential edge of the top of the clamping disc 126 is provided with the boss 1260, and the boss 1260 extends around the circumference of the clamping disc 126, so that when the clamping disc 126 compresses the workpiece 2 to be electroplated, the clamping disc 126 can contact with the workpiece 2 to be electroplated through the boss 1260, and only annular line contact is formed, so that the occupied area of the clamping disc 126 on the workpiece 2 to be electroplated is reduced, and the effective utilization rate of the workpiece 2 to be electroplated is improved.
In this embodiment, as shown in fig. 12 and 13, in order to realize the positioning connection between the conductive contact mechanism 14 and the carrying mechanism 13, the carrying mechanism 13 further includes a plurality of positioning blocks 131.
The positioning blocks 131 are disposed at the top end of the carrier tray 130 and are arranged at intervals along the circumferential direction of the carrier tray 130, for example, the number of the positioning blocks 131 is two, three, four or more.
The locating block 131 protrudes from the peripheral side wall of the bearing disc 130, and the locating block 131 is provided with a locating jack 1310, the conductive contact mechanism 14 comprises a conductive disc and a plurality of connecting poles 144, the connecting poles 144 are inserted into the locating jacks 1310 of the locating blocks 131 in a one-to-one correspondence manner, the conductive disc is located on the top side of the bearing disc 130, so that the conductive disc is fixed by inserting the locating jacks 1310 and the connecting poles 144 of the locating block 131, the conductive disc can rotate synchronously along with the bearing disc 130, in addition, the clamping disc 126 can compress the workpiece to be electroplated 2 located in the bearing disc 130 tightly onto the conductive disc, and the conductive disc can conduct current to the surface of the workpiece to be electroplated 2.
In this embodiment, the conductive disc includes an annular conductive substrate 141 and a plurality of conductive elastic pins 142, the plurality of conductive elastic pins 142 are connected to the annular conductive substrate 141 and are sequentially arranged at intervals along the circumferential direction of the annular conductive substrate 141, wherein the conductive elastic pins 142 are made of a conductor with certain elasticity, so that on one hand, reliable conductive contact between the conductive elastic pins 142 and the surface of the workpiece 2 to be electroplated can be ensured, and on the other hand, the conductive elastic pins 142 can be prevented from being too rigid to scratch the surface of the workpiece 2 to be electroplated.
Optionally, the number of the conductive elastic needles 142 may be several, several tens, hundreds, or even several hundreds, all the conductive elastic needles 142 may be uniformly arranged at intervals along the circumferential direction of the annular conductive substrate 141, and a plurality of conductive contacts are formed by using a plurality of conductive elastic needles 142 and the workpiece 2 to be electroplated, so as to effectively improve the conductive uniformity, and be beneficial to improving the thickness uniformity of the electroplated coating and the yield of the product.
Optionally, as shown in fig. 5, the conductive contact mechanism 14 further includes a placing disc 140 made of an insulating material and a sealing member 143, the sealing member 143 is annular, and the conductive disc is disposed on the placing disc 140 and supported, fixed and protected by the placing disc 140. The sealing member 143 is connected to the conductive plate or placing plate 140 and is located inside the conductive pogo pin 142, thereby isolating the conductive plate from the plating solution by the annular sealing member 143.
Specifically, the second connection line 153 is electrically connected between the connection post 144 and the slip ring rotor 150, so that the current of the slip ring rotor 150 is conducted to the surface of the workpiece 2 to be plated through the second connection line 153, the connection post 144, the conductive substrate, and the conductive pogo pin 142 in sequence.
Optionally, the mounting seat 101, the bearing disc 130 of the bearing mechanism 13, the positioning block 131, the limiting portion 132, the clamping disc 126 and the rotating shaft 111 are all made of insulating materials, so as to ensure that the conducting path of the current is, in sequence, the slip ring stator 151, the slip rotor, the connecting column 144, the annular conducting substrate 141, the conducting pin and the workpiece 2 to be electroplated.
In conclusion, in the actual operation process, the electroplating fixture 1 clamps the workpiece 2 to be electroplated according to the following steps:
the lifting driving means 120 is, for example, an air cylinder, as shown in fig. 3 and 4, a cylinder rod of the air cylinder is retracted to the lowest position, so as to drive the clamping plate 126 to descend to the lowest position, to avoid from the positioning groove formed by the arc-shaped recess 1320 of the carrier plate 130, and the robot holds the workpiece 2 to be plated and places it in the positioning groove formed by the arc-shaped recess 1320 of the carrier plate 130.
As shown in fig. 6 and fig. 7, the cylinder rod of the air cylinder is then extended, so as to drive the clamping disc 126 to ascend until the boss 1260 of the clamping disc 126 contacts with the workpiece 2 to be electroplated and lifts up the workpiece 2 to be electroplated, so that the workpiece 2 to be electroplated contacts with the conductive spring pins 142 of the conductive contact mechanism 14 and contacts with the sealing member 143 of the conductive contact mechanism 14, the electrical connection of the workpiece 2 to be electroplated with the power supply cathode is realized, and the conductive sealing is realized through the sealing member 143, so that the electroplating solution is prevented from directly contacting with the conductive spring pins 142.
The driving assembly 110 is started to drive the rotating shaft 111 to rotate, the rotating shaft 111 drives the bearing disc 130, the clamping disc 126, the conductive contact mechanism 14 and the workpiece 2 to be electroplated to rotate, the electroplating fixture 1 is driven to integrally turn over by the external device connected with the connecting arm 100 until the workpiece 2 to be electroplated enters electroplating solution, and then the electroplating power supply can be started to start electroplating operation on the workpiece 2 to be electroplated.
After the electroplating operation process is finished, the electroplating power supply is cut off, the electroplating fixture 1 is driven by the external device to turn over again until the workpiece 2 to be electroplated is separated from the electroplating solution, the cylinder rod of the control cylinder retracts to the lowest position, the clamping disc 126 is driven to drive the workpiece 2 to be electroplated on the clamping disc to be placed back into the positioning groove formed by the arc-shaped concave part 1320 of the bearing disc 130, and the workpiece which is electroplated is obtained.
Finally, the electroplated workpiece is taken away from the bearing plate 130 through the manipulator, and the next process treatment can be carried out on the workpiece.
Example two
The second embodiment provides a plating apparatus, the plating apparatus includes the plating jig of the first embodiment, the technical features of the plating jig disclosed in the first embodiment are also applicable to the second embodiment, and the technical features of the plating jig disclosed in the first embodiment are not described repeatedly.
The electroplating equipment in the embodiment has the advantages of the electroplating clamp in the first embodiment, and the advantages of the electroplating clamp disclosed in the first embodiment are not repeated herein.
Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; while the invention has been described in detail and with reference to the foregoing embodiments, it will be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; and the modifications or the substitutions do not make the essence of the corresponding technical solutions depart from the scope of the technical solutions of the embodiments of the present invention. Furthermore, those skilled in the art will appreciate that while some embodiments described herein include some features included in other embodiments, rather than other features, combinations of features of different embodiments are meant to be within the scope of the invention and form different embodiments. For example, any of the claimed embodiments may be used in any combination. The information disclosed in this background section is only for enhancement of understanding of the general background of the invention and should not be taken as an acknowledgement or any form of suggestion that this information forms the prior art that is already known to a person skilled in the art.
Claims (10)
1. An electroplating clamp is characterized by comprising a conductive contact mechanism, a bearing mechanism, a lifting clamping mechanism, a supporting mechanism and a rotation driving mechanism;
the bearing mechanism is used for bearing and positioning a workpiece to be electroplated, and the conductive contact mechanism is connected to the top of the bearing mechanism;
the lifting clamping mechanism comprises a lifting driving member, a first fixed connecting seat, a first movable connecting seat, a synchronous transmission rod and a clamping disc;
the lifting driving component is arranged on the supporting mechanism, the first fixed connecting seat is connected with the lifting driving component, the first movable connecting seat is rotatably connected with the first fixed connecting seat, one end of the synchronous transmission rod is connected with the first movable connecting seat, the other end of the synchronous transmission rod sequentially penetrates through the bearing mechanism to be connected with the clamping disc, and the lifting driving component can drive the first fixed connecting seat to drive the clamping disc to be close to or far away from the conductive contact mechanism;
the rotation driving mechanism is arranged on the supporting mechanism and connected with the bearing mechanism and can drive the bearing mechanism to drive the synchronous transmission rod, the clamping disc, the conductive contact mechanism and the first movable connecting seat to synchronously rotate.
2. The plating jig of claim 1, further comprising a conductive slip ring mechanism comprising a slip ring stator disposed on the support mechanism and a slip ring rotor rotatably sleeved with the slip ring stator;
the slip ring rotor is connected with the rotation driving mechanism, and the rotation driving mechanism can drive the slip ring rotor to synchronously rotate along with the bearing mechanism;
the slip ring rotor is electrically connected with the conductive contact mechanism, and the slip ring stator is electrically connected with an external power supply.
3. An electroplating jig according to claim 2, wherein the supporting mechanism comprises a mounting base and a connecting arm, one end of the connecting arm is connected with the mounting base, and the other end of the connecting arm is used for being connected with a machine platform;
the rotation driving mechanism comprises a rotating shaft and a driving assembly, a shaft hole is formed in the mounting seat, the rotating shaft is rotatably arranged in the shaft hole in a penetrating mode, and the driving assembly is arranged at the bottom of the mounting seat and can drive the bottom of the rotating shaft to rotate.
4. The electroplating jig as claimed in claim 3, wherein the slip ring stator is disposed on top of the mounting seat, the slip ring rotor is rotatably disposed inside the slip ring stator, the slip ring rotor is provided with a second axial hole, and the rotating shaft is disposed inside the second axial hole and connected with the slip ring rotor;
the first fixed connecting seat and the first movable connecting seat are provided with avoidance through holes, and the conductive sliding ring mechanism is accommodated in the avoidance through holes.
5. A plating jig according to claim 3, wherein the carrying mechanism comprises a carrying tray;
the bearing discs are arranged at the top of the first movable connecting seat at intervals, and the top end of the rotating shaft is connected with the bottom of the bearing disc;
the inner peripheral side wall of the top end of the bearing disc is provided with a positioning groove, and the positioning groove is matched with the outer peripheral side wall of a workpiece to be electroplated;
the inside of bearing the dish is formed with the direction and holds the chamber, press from both sides tight dish liftable set up in the direction holds the intracavity, the bottom of synchronous drive pole with first swing joint seat is connected, the top of synchronous drive pole passes bear the dish with press from both sides tight dish and be connected.
6. The plating jig of claim 5, wherein the carrier mechanism further comprises a plurality of positioning blocks;
the positioning blocks are arranged at the top end of the bearing disc and are distributed at intervals along the circumferential direction of the bearing disc;
the positioning block protrudes out of the peripheral side wall of the bearing plate, and a positioning insertion hole is formed in the positioning block;
the conductive contact mechanism comprises a conductive disc and a plurality of connecting columns, the connecting columns are correspondingly inserted into the positioning insertion holes of the positioning blocks one by one, and the conductive disc is positioned on the top side of the bearing disc.
7. The electroplating jig of claim 6, wherein the conductive disc comprises an annular conductive substrate and a plurality of conductive elastic pins, the plurality of conductive elastic pins are connected with the annular conductive substrate and are sequentially arranged at intervals along the circumferential direction of the annular conductive substrate;
the conductive slip ring mechanism further comprises a first connecting wire and a second connecting wire;
the first connecting wire is electrically connected with the slip ring stator and is used for externally connecting a power supply cathode;
one end of the second connecting line is electrically connected with the slip ring rotor, and the other end of the second connecting line is electrically connected with the connecting column.
8. An electroplating jig according to claim 5, wherein the carrying mechanism further comprises a plurality of limiting parts arranged at the top end of the carrying tray, and the plurality of limiting parts are sequentially arranged at intervals along the circumferential direction of the carrying tray;
the inner peripheral side wall of the limiting portion is provided with an arc-shaped sunken portion, and the arc-shaped sunken portion is matched with the local outer peripheral side wall of the workpiece to be electroplated, so that the arc-shaped sunken portion is formed into the positioning groove.
9. A plating jig according to claim 5, wherein a circumferential edge of the top of the clamping disk is provided with a boss extending circumferentially around the clamping disk.
10. An electroplating apparatus comprising the electroplating jig of any one of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211390913.XA CN115679425A (en) | 2022-11-08 | 2022-11-08 | Electroplating clamp and electroplating equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211390913.XA CN115679425A (en) | 2022-11-08 | 2022-11-08 | Electroplating clamp and electroplating equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN115679425A true CN115679425A (en) | 2023-02-03 |
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ID=85049600
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202211390913.XA Pending CN115679425A (en) | 2022-11-08 | 2022-11-08 | Electroplating clamp and electroplating equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN115679425A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117305946A (en) * | 2023-11-30 | 2023-12-29 | 泉州市双塔汽车零件有限公司 | Processing technology and processing equipment for high-capacity oil pan |
-
2022
- 2022-11-08 CN CN202211390913.XA patent/CN115679425A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117305946A (en) * | 2023-11-30 | 2023-12-29 | 泉州市双塔汽车零件有限公司 | Processing technology and processing equipment for high-capacity oil pan |
| CN117305946B (en) * | 2023-11-30 | 2024-02-09 | 泉州市双塔汽车零件有限公司 | Processing technology and processing equipment for high-capacity oil pan |
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