CN115678275A - Bismaleimide resin for autoclave zero-suction-rubber molding prepreg and preparation method thereof - Google Patents
Bismaleimide resin for autoclave zero-suction-rubber molding prepreg and preparation method thereof Download PDFInfo
- Publication number
- CN115678275A CN115678275A CN202211398679.5A CN202211398679A CN115678275A CN 115678275 A CN115678275 A CN 115678275A CN 202211398679 A CN202211398679 A CN 202211398679A CN 115678275 A CN115678275 A CN 115678275A
- Authority
- CN
- China
- Prior art keywords
- bismaleimide resin
- bismaleimide
- resin
- autoclave
- component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229920005989 resin Polymers 0.000 title claims abstract description 94
- 239000011347 resin Substances 0.000 title claims abstract description 94
- XQUPVDVFXZDTLT-UHFFFAOYSA-N 1-[4-[[4-(2,5-dioxopyrrol-1-yl)phenyl]methyl]phenyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C(C=C1)=CC=C1CC1=CC=C(N2C(C=CC2=O)=O)C=C1 XQUPVDVFXZDTLT-UHFFFAOYSA-N 0.000 title claims abstract description 80
- 229920003192 poly(bis maleimide) Polymers 0.000 title claims abstract description 79
- 238000002360 preparation method Methods 0.000 title claims abstract description 9
- 238000010068 moulding (rubber) Methods 0.000 title claims description 4
- 238000000465 moulding Methods 0.000 claims abstract description 32
- 238000000034 method Methods 0.000 claims abstract description 31
- 239000000178 monomer Substances 0.000 claims abstract description 29
- 239000012745 toughening agent Substances 0.000 claims abstract description 16
- 238000010521 absorption reaction Methods 0.000 claims abstract description 14
- 239000004643 cyanate ester Substances 0.000 claims abstract description 14
- 239000003607 modifier Substances 0.000 claims abstract description 14
- WOCGGVRGNIEDSZ-UHFFFAOYSA-N 4-[2-(4-hydroxy-3-prop-2-enylphenyl)propan-2-yl]-2-prop-2-enylphenol Chemical compound C=1C=C(O)C(CC=C)=CC=1C(C)(C)C1=CC=C(O)C(CC=C)=C1 WOCGGVRGNIEDSZ-UHFFFAOYSA-N 0.000 claims abstract description 10
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 claims abstract description 10
- 229920006259 thermoplastic polyimide Polymers 0.000 claims abstract description 9
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 claims abstract description 8
- 239000002245 particle Substances 0.000 claims abstract description 7
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims abstract description 7
- 238000007613 slurry method Methods 0.000 claims abstract description 6
- 125000001931 aliphatic group Chemical group 0.000 claims abstract description 5
- -1 diallyl bisphenol S Chemical compound 0.000 claims abstract description 5
- ZZTCPWRAHWXWCH-UHFFFAOYSA-N diphenylmethanediamine Chemical compound C=1C=CC=CC=1C(N)(N)C1=CC=CC=C1 ZZTCPWRAHWXWCH-UHFFFAOYSA-N 0.000 claims abstract description 5
- WZCQRUWWHSTZEM-UHFFFAOYSA-N 1,3-phenylenediamine Chemical compound NC1=CC=CC(N)=C1 WZCQRUWWHSTZEM-UHFFFAOYSA-N 0.000 claims abstract description 3
- 229940018564 m-phenylenediamine Drugs 0.000 claims abstract description 3
- 239000003292 glue Substances 0.000 claims description 28
- XLJMAIOERFSOGZ-UHFFFAOYSA-M cyanate Chemical compound [O-]C#N XLJMAIOERFSOGZ-UHFFFAOYSA-M 0.000 claims description 16
- 239000012943 hotmelt Substances 0.000 claims description 14
- 239000000463 material Substances 0.000 claims description 11
- 238000003756 stirring Methods 0.000 claims description 11
- 239000002313 adhesive film Substances 0.000 claims description 9
- 239000000805 composite resin Substances 0.000 claims description 8
- 238000000227 grinding Methods 0.000 claims description 7
- 238000002156 mixing Methods 0.000 claims description 7
- 230000001276 controlling effect Effects 0.000 claims description 6
- 230000001105 regulatory effect Effects 0.000 claims description 6
- 239000000853 adhesive Substances 0.000 claims description 4
- 230000001070 adhesive effect Effects 0.000 claims description 4
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims description 4
- 239000000843 powder Substances 0.000 claims description 4
- 238000013329 compounding Methods 0.000 claims description 2
- 239000000835 fiber Substances 0.000 claims description 2
- 239000003973 paint Substances 0.000 claims 1
- 238000007493 shaping process Methods 0.000 claims 1
- AHZMUXQJTGRNHT-UHFFFAOYSA-N [4-[2-(4-cyanatophenyl)propan-2-yl]phenyl] cyanate Chemical compound C=1C=C(OC#N)C=CC=1C(C)(C)C1=CC=C(OC#N)C=C1 AHZMUXQJTGRNHT-UHFFFAOYSA-N 0.000 abstract description 2
- 238000003860 storage Methods 0.000 abstract description 2
- 238000003825 pressing Methods 0.000 description 15
- 239000002131 composite material Substances 0.000 description 12
- 229920000049 Carbon (fiber) Polymers 0.000 description 5
- 239000004917 carbon fiber Substances 0.000 description 5
- 239000011159 matrix material Substances 0.000 description 5
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 5
- 239000011859 microparticle Substances 0.000 description 5
- 238000004321 preservation Methods 0.000 description 5
- 238000010438 heat treatment Methods 0.000 description 3
- 238000010327 methods by industry Methods 0.000 description 2
- 239000011825 aerospace material Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- KQDDPKLNKUOCEX-UHFFFAOYSA-N benzene-1,3-diamine;pyrrole-2,5-dione Chemical compound O=C1NC(=O)C=C1.O=C1NC(=O)C=C1.NC1=CC=CC(N)=C1 KQDDPKLNKUOCEX-UHFFFAOYSA-N 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 229920006037 cross link polymer Polymers 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000032798 delamination Effects 0.000 description 1
- 230000009477 glass transition Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
Landscapes
- Reinforced Plastic Materials (AREA)
Abstract
The invention provides bismaleimide resin for autoclave zero-absorption molding prepreg and a preparation method thereof. The resin is prepared from a bismaleimide resin monomer component, a modifier component, a cyanate ester component and a toughening agent component by a slurry method, wherein the bismaleimide resin monomer component comprises 30-50 parts by mass, 10-25 parts by mass, 30-60 parts by mass and 15-30 parts by mass, the bismaleimide resin monomer component comprises at least one of a diphenylmethane diamine type bismaleimide monomer, a m-phenylenediamine type bismaleimide monomer or an aliphatic bismaleimide monomer, the modifier component comprises at least one of diallyl bisphenol A, diallyl bisphenol A ether or diallyl bisphenol S, the cyanate ester component comprises at least one of bisphenol A cyanate ester, bisphenol F cyanate ester or phenolic cyanate ester, and the toughening agent component comprises thermoplastic polyimide micron-sized particles. The prepreg prepared by the bismaleimide resin has good room-temperature spreadability and long storage life, can realize the control modes of can feeding pressurization and zero-glue-absorption process in the autoclave forming process, and greatly improves the product forming quality.
Description
Technical Field
The invention relates to bismaleimide resin for autoclave zero-absorption molding prepreg and a preparation method thereof, belonging to the field of preparation of raw materials in the field of composite materials.
Background
The bismaleimide resin is a highly crosslinked polymer with a three-dimensional network structure, and the network structure endows the bismaleimide resin with excellent characteristics of high temperature resistance, radiation resistance, humidity resistance, good mechanical property, dimensional stability and the like, so the bismaleimide resin is widely applied to main sections of aviation and aerospace and composite material structural members.
The autoclave molding process is the most common molding method for aerospace high-performance resin-based composite material structural members, and is used for manufacturing resin-based composite material structural members with complex structures and large overall sizes. When a traditional bismaleimide resin system adopts an autoclave molding process to prepare a resin matrix composite material, the heating rate, the heat preservation step, the pressurization point and the glue absorption process in the molding process need to be determined according to the rheological property of resin. The setting of the pressure point and the glue absorption process in the composite material forming process needs to be changed according to the size and the thickness of a composite material part and the structural form of a mould, so that the dependence on process experience is large, and the quality fluctuation of the composite material part is often large. The pressurizing point is an important parameter of the autoclave forming process, and the determination of the pressurizing point directly influences the performance of the composite material. If the pressing time is too late (after the gel point of the resin matrix), more voids and even large-area delamination of the composite material can be caused, and the resin matrix can be unevenly distributed in the composite material; for the resin matrix with low viscosity, if the pressing time is too early, the resin matrix can be greatly lost, and various performances of the composite material can be seriously influenced.
Disclosure of Invention
The invention aims to overcome the defects in the prior art, provides a bismaleimide resin system capable of realizing a control mode of tank inlet pressurization and zero glue absorption process in an autoclave molding process engineering, and solves the problems of large quality fluctuation and low molding efficiency of composite material workpieces caused by pressurization point control and the glue absorption process.
The purpose of the invention is mainly realized by the following technical scheme:
the bismaleimide resin for the autoclave zero-suction glue molding prepreg comprises the following components in parts by mass:
bismaleimide resin monomer component: 30-50 parts;
the modifier comprises the following components: 10-25 parts;
cyanate ester component: 30-60 parts;
the toughening agent comprises the following components: 15-30 parts;
the bismaleimide resin is prepared from the four components by a slurry method; when the prepreg of the bismaleimide resin is formed by an autoclave, the monomer component and the toughening agent component of the bismaleimide resin exert the function of regulating and controlling the viscosity of the resin in a powder form at a low temperature section, and the toughening agent component is gradually dissolved in the modifier component or the cyanate ester component at a high temperature section to exert the function of regulating and controlling the viscosity of the resin.
Preferably, the bismaleimide resin monomer component is at least one of a diphenylmethane diamine type bismaleimide monomer, a m-phenylenediamine type bismaleimide monomer or an aliphatic bismaleimide monomer.
Preferably, the modifier component is at least one of diallyl bisphenol A, diallyl bisphenol A ether or diallyl bisphenol S.
Preferably, the cyanate ester component is at least one of bisphenol a cyanate ester, bisphenol F cyanate ester or phenolic cyanate ester.
Preferably, the toughening agent component is thermoplastic polyimide micron-sized particles with an average particle size of 5-30um.
A preparation method of bismaleimide resin for autoclave zero-absorption molding prepreg is prepared by a slurry method and comprises the following steps:
the method comprises the following steps: adding the bismaleimide resin monomer component into the modifier component, and grinding into paste;
step two: adding the toughening agent component into the cyanate ester component, and uniformly stirring;
step three: and (3) mixing the components obtained in the first step and the second step, and uniformly dispersing to obtain the bismaleimide resin with good room-temperature spreadability for the autoclave zero-suction adhesive molding prepreg.
Preferably, step one is ground to the paste using a three-roll grinder.
A preparation method of a bismaleimide resin-based composite material comprises the following steps:
preparing the bismaleimide resin prepared by the invention into a hot-melt resin adhesive film, and then compounding the hot-melt resin adhesive film with fibers to obtain a prepreg;
and curing the prepreg by adopting an autoclave molding process to obtain the bismaleimide resin based composite material.
The bismaleimide resin-based composite material prepared by the method.
Compared with the prior art, the invention has the following beneficial effects:
(1) The bismaleimide resin can realize tank feeding pressurization and a zero-glue-suction process, solves the problems of large quality fluctuation and low molding efficiency of composite material workpieces caused by pressurization point control and a glue-suction process, and greatly improves the product molding quality. Because the resin is prepared by a slurry method, the bismaleimide resin monomer and the toughening agent play a role in regulating and controlling the viscosity of the resin in a powder form at a low temperature section, and the no-flow adhesive is ensured, and the toughening agent is gradually dissolved in the modifier or cyanate at a high temperature section to play a role in regulating and controlling the viscosity, so that the no-flow adhesive is ensured. The bismaleimide resin system can realize the control modes of tank feeding pressurization and zero glue absorption process in the autoclave forming process engineering, wherein the tank feeding pressurization refers to that after the bismaleimide prepreg is placed into an autoclave, the pressure required by prepreg curing can be immediately filled for heating and curing (namely, the temperature is raised under pressure, so that the resin can flow out under pressure because the resin viscosity is reduced due to temperature rise is avoided), the temperature does not need to be raised firstly, the resin is reacted for a period of time, and then pressurization is carried out after the resin viscosity is increased. The control mode of the zero glue absorption process is that resin does not flow out along with the rise of temperature and the increase of pressure in the process of curing the resin prepreg by the autoclave, namely glue does not flow in the curing process.
(2) Because the resin is prepared by a slurry method, the bismaleimide resin monomer and the toughening agent are not dissolved in the modifier or cyanate in advance, and the system has better viscosity and room temperature spreadability; on the other hand, different from that the bismaleimide resin monomer and the toughening agent are pre-dissolved in each component of the modifier system to be dispersed in a molecular level, and each component of the system exists in a form of micro powder particles, so that the reaction rate of the bismaleimide monomer component, the modifier component and the cyanate component at room temperature is remarkably reduced, and the storage life is longer.
(3) The cyanate component is introduced into the system, the cyanate is a thermosetting resin with excellent humidity resistance and dielectric property, the glass transition temperature of the cyanate, particularly phenolic cyanate, can reach more than 380 ℃, and is far higher than that of the bismaleimide resin, and the bismaleimide resin is modified by the cyanate, so that the dielectric property and the heat resistance of the bismaleimide resin can be improved simultaneously on the premise of not reducing the toughness of the bismaleimide resin.
Detailed Description
The present invention will be described in further detail below with reference to specific examples.
Example 1
Adding 40g of diphenylmethane diamine bismaleimide monomer into 20g of diallyl bisphenol A, primarily stirring uniformly, grinding into paste by using a three-roll grinder, adding 20g of thermoplastic polyimide microparticles into 50g of phenolic cyanate ester, uniformly stirring, and finally mixing and dispersing the two components uniformly to obtain bismaleimide resin for the autoclave zero-suction-rubber molding prepreg with good room-temperature spreadability.
The bismaleimide resin prepared by the invention is prepared into a hot melt resin adhesive film, and then is compounded with CCF800S carbon fiber to prepare the hot melt prepreg. The prepreg is cut and laid to be a board with the size of 320mm multiplied by 2mm, an autoclave molding process is adopted for curing, and two pressurizing modes of pressurizing at room temperature (25 ℃) and pressurizing after heat preservation for 1 hour at 130 ℃ are selected. The glue yield of the formed plate is counted, and shown in table 1, the glue yield of the plate under the two pressing points is changed very little, which shows that the resin pressing window is very wide, the glue yield is controllable, and the manufacturability is good.
TABLE 1 amount of gum formed from flat plate
| Pressure point | 25℃ | Keeping the temperature at 130 ℃ for 1h |
| Amount of gum discharged/g | 4.6 | 3.8 |
Example 2
Adding 30g of m-phenylenediamine bismaleimide monomer into 25g of diallyl bisphenol A ether, stirring uniformly primarily, grinding into paste by using a three-roll grinder, adding 30g of thermoplastic polyimide microparticles into 30g of bisphenol F cyanate, stirring uniformly, and finally mixing and dispersing uniformly the two components to obtain the bismaleimide resin for the autoclave zero-absorption molding prepreg with good room temperature spreadability.
The bismaleimide resin prepared by the invention is prepared into a hot melt resin adhesive film, and then is compounded with CCF800S carbon fiber to prepare the hot melt prepreg. The prepreg is cut and laid to be a board with the thickness of 320mm multiplied by 2mm, an autoclave molding process is adopted for curing, and two pressurization modes of pressurization at room temperature (25 ℃) and pressurization after heat preservation at 130 ℃ for 1 hour are selected. The glue yield of the formed plate is counted, and shown in table 2, the glue yield of the plate under the two pressing points is changed very little, which shows that the resin pressing window is very wide, the glue yield is controllable, and the manufacturability is good.
TABLE 2 amount of glue discharged from the plate forming
| Pressure point | 25℃ | Keeping the temperature at 130 ℃ for 1h |
| Amount of gum discharged/g | 4.3 | 3.7 |
Example 3
Adding 50g of aliphatic bismaleimide monomer into 20g of diallyl bisphenol S, primarily stirring uniformly, grinding into paste by using a three-roll grinder, adding 15g of thermoplastic polyimide microparticles into 60g of bisphenol A cyanate, uniformly stirring, mixing the two components, and uniformly dispersing to obtain the bismaleimide resin for the autoclave zero-absorption molding prepreg with good room temperature spreadability.
The bismaleimide resin prepared by the invention is prepared into a hot melt resin adhesive film, and then is compounded with CCF800S carbon fiber to prepare the hot melt prepreg. The prepreg is cut and laid to be a board with the thickness of 320mm multiplied by 2mm, an autoclave molding process is adopted for curing, and two pressurization modes of pressurization at room temperature (25 ℃) and pressurization after heat preservation at 130 ℃ for 1 hour are selected. The glue yield of the formed plate is counted, and shown in table 3, the glue yield of the plate under the two pressing points is changed very little, which shows that the resin pressing window is very wide, the glue yield is controllable, and the manufacturability is good.
TABLE 3 Flat plate Molding run-out
| Pressure point | 25℃ | Keeping the temperature at 130 ℃ for 1h |
| Amount of gum discharged/g | 4.9 | 4.1 |
Example 4
Adding 30g of aliphatic bismaleimide monomer into 10g of diallyl bisphenol A ether, primarily stirring uniformly, grinding into paste by using a three-roll grinder, adding 15g of thermoplastic polyimide microparticles into 40g of phenolic cyanate, uniformly stirring, mixing the two components, and uniformly dispersing to obtain the bismaleimide resin for the autoclave zero-absorption molding prepreg with good room temperature spreadability.
The bismaleimide resin prepared by the invention is prepared into a hot melt resin adhesive film, and then is compounded with CCF800S carbon fiber to prepare the hot melt prepreg. The prepreg is cut and laid to be a board with the thickness of 320mm multiplied by 2mm, an autoclave molding process is adopted for curing, and two pressurization modes of pressurization at room temperature (25 ℃) and pressurization after heat preservation at 130 ℃ for 1 hour are selected. The glue yield of the formed plate is counted, and shown in table 4, the glue yield of the plate under the two pressing points is changed very little, which shows that the resin pressing window is very wide, the glue yield is controllable, and the manufacturability is good.
TABLE 4 Flat plate Molding run-out
| Applying pressureDot | 25℃ | Keeping the temperature at 130 ℃ for 1h |
| Amount of gum discharged/g | 4.7 | 3.9 |
Comparative example 1
Adding 40g of diphenylmethane diamine type bismaleimide monomer into 20g of diallyl bisphenol A, heating to 130 ℃, keeping the temperature for 30min to enable the system to become uniform tan liquid, adding 20g of thermoplastic polyimide microparticles into 50g of phenolic cyanate, uniformly stirring, and finally mixing and uniformly dispersing the two components to obtain the modified bismaleimide resin.
The bismaleimide resin prepared by the invention is prepared into a hot melt resin adhesive film, and then is compounded with CCF800S carbon fiber to prepare the hot melt prepreg. The prepreg was cut and laid to a sheet material of 320mm × 320mm × 2mm, followed by curing, and two pressing methods of pressing at room temperature (25 ℃) and holding at 130 ℃ for 1 hour and then pressing were selected. The glue yield statistics of the molded sheet materials are shown in table 5, and the glue yield of the sheet materials under two pressing points is greatly changed, which indicates that the resin needs to accurately select the pressing points.
TABLE 5 Flat plate Molding run-out
| Pressure point | 25℃ | Keeping the temperature at 130 ℃ for 1h |
| Amount of gum discharged/g | 20.6 | 3.8 |
The particular embodiments of the present invention disclosed above are illustrative only and are not intended to be limiting, since various alternatives, modifications, and variations will be apparent to those skilled in the art without departing from the spirit and scope of the invention. The invention should not be limited to the disclosure of the embodiments in the present specification, but the scope of the invention is defined by the appended claims.
Claims (10)
1. The utility model provides an autoclave is zero inhales gluey shaping bimaleimide for preimpregnation material which characterized in that: the paint comprises the following components in parts by mass:
bismaleimide resin monomer component: 30-50 parts;
the modifier comprises the following components: 10-25 parts;
cyanate ester component: 30-60 parts;
the toughening agent comprises the following components: 15-30 parts;
the bismaleimide resin is prepared from the four components by a slurry method; when the prepreg of the bismaleimide resin is formed by an autoclave, the monomer component and the toughening agent component of the bismaleimide resin exert the function of regulating and controlling the viscosity of the resin in a powder form at a low temperature section, and the toughening agent component is gradually dissolved in the modifier component or the cyanate ester component at a high temperature section to exert the function of regulating and controlling the viscosity of the resin.
2. The bismaleimide resin for the autoclave zero-suction-glue molding prepreg according to claim 1, which is characterized in that: the bismaleimide resin monomer component is at least one of diphenylmethane diamine type bismaleimide monomer, m-phenylenediamine type bismaleimide monomer or aliphatic bismaleimide monomer.
3. The bismaleimide resin for the autoclave zero-suction-glue molding prepreg according to claim 1, which is characterized in that: the modifier component is at least one of diallyl bisphenol A, diallyl bisphenol A ether or diallyl bisphenol S.
4. The bismaleimide resin for the autoclave zero-suction-glue molding prepreg according to claim 1, which is characterized in that: the cyanate component is at least one of bisphenol A cyanate, bisphenol F cyanate or phenolic cyanate.
5. The bismaleimide resin for the autoclave zero-suction-glue molding prepreg according to claim 1, which is characterized in that: the toughening agent component is thermoplastic polyimide micron-sized particles.
6. The bismaleimide resin for the autoclave zero-suction-glue molding prepreg according to claim 5, wherein: the thermoplastic polyimide micron-sized particles have an average particle size of 5-30um.
7. The method for preparing bismaleimide resin for autoclave zero-absorption molding prepreg according to claim 1, wherein the bismaleimide resin comprises: the method comprises the following steps:
the method comprises the following steps: adding the bismaleimide resin monomer component into the modifier component, and grinding into paste;
step two: adding the toughening agent component into the cyanate ester component, and uniformly stirring;
step three: and (3) mixing the components obtained in the first step and the second step, and uniformly dispersing to obtain the bismaleimide resin with good room-temperature spreadability for the autoclave zero-suction adhesive molding prepreg.
8. The preparation method of bismaleimide resin for autoclave zero-suction-rubber molding prepreg according to claim 7, wherein the bismaleimide resin comprises the following components: and step one, grinding the paste by using a three-roll grinder.
9. The preparation method of the bismaleimide resin-based composite material is characterized by comprising the following steps:
preparing the bismaleimide resin as claimed in any one of claims 1 to 6 into a hot-melt resin adhesive film, and then compounding the hot-melt resin adhesive film with fibers to obtain a prepreg;
and curing the prepreg by adopting an autoclave molding process to obtain the bismaleimide resin based composite material.
10. A bismaleimide resin based composite prepared according to the method of claim 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211398679.5A CN115678275A (en) | 2022-11-09 | 2022-11-09 | Bismaleimide resin for autoclave zero-suction-rubber molding prepreg and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211398679.5A CN115678275A (en) | 2022-11-09 | 2022-11-09 | Bismaleimide resin for autoclave zero-suction-rubber molding prepreg and preparation method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN115678275A true CN115678275A (en) | 2023-02-03 |
Family
ID=85050115
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202211398679.5A Pending CN115678275A (en) | 2022-11-09 | 2022-11-09 | Bismaleimide resin for autoclave zero-suction-rubber molding prepreg and preparation method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN115678275A (en) |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2008011765A1 (en) * | 2006-07-19 | 2008-01-31 | Beijing Institute of Aeronautical Materials, AVIC I | A toughened composite material laminate and a process of preparation thereof |
| CN106832925A (en) * | 2017-01-20 | 2017-06-13 | 航天材料及工艺研究所 | It is a kind of to flow controllable bismaleimide resin system, preparation method and sweat connecting material |
| CN107459820A (en) * | 2017-09-01 | 2017-12-12 | 江苏欧亚铂瑞碳复合材料有限公司 | A kind of preparation method of micro-and nano-particles collaboration interlayer toughened span/carbon fibre composite |
| CN107955372A (en) * | 2017-12-14 | 2018-04-24 | 威海光威复合材料股份有限公司 | The preparation method of bimaleimide resin cyanate ester resin composite material |
| CN111320871A (en) * | 2020-04-13 | 2020-06-23 | 上海蒂姆新材料科技有限公司 | Bismaleimide resin prepreg composite material and preparation method thereof |
| CN113580711A (en) * | 2021-06-15 | 2021-11-02 | 航天特种材料及工艺技术研究所 | Ablation-resistant light bearing cover plate and preparation method thereof |
| CN113911401A (en) * | 2021-09-30 | 2022-01-11 | 北京元蛋复合材料有限公司 | Light/high-temperature-resistant integrated composite material satellite lens hood and preparation method thereof |
| CN114349994A (en) * | 2022-01-10 | 2022-04-15 | 长春长光宇航复合材料有限公司 | Modified bismaleimide carbon fiber prepreg, composite material and preparation method thereof |
-
2022
- 2022-11-09 CN CN202211398679.5A patent/CN115678275A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2008011765A1 (en) * | 2006-07-19 | 2008-01-31 | Beijing Institute of Aeronautical Materials, AVIC I | A toughened composite material laminate and a process of preparation thereof |
| CN106832925A (en) * | 2017-01-20 | 2017-06-13 | 航天材料及工艺研究所 | It is a kind of to flow controllable bismaleimide resin system, preparation method and sweat connecting material |
| CN107459820A (en) * | 2017-09-01 | 2017-12-12 | 江苏欧亚铂瑞碳复合材料有限公司 | A kind of preparation method of micro-and nano-particles collaboration interlayer toughened span/carbon fibre composite |
| CN107955372A (en) * | 2017-12-14 | 2018-04-24 | 威海光威复合材料股份有限公司 | The preparation method of bimaleimide resin cyanate ester resin composite material |
| CN111320871A (en) * | 2020-04-13 | 2020-06-23 | 上海蒂姆新材料科技有限公司 | Bismaleimide resin prepreg composite material and preparation method thereof |
| CN113580711A (en) * | 2021-06-15 | 2021-11-02 | 航天特种材料及工艺技术研究所 | Ablation-resistant light bearing cover plate and preparation method thereof |
| CN113911401A (en) * | 2021-09-30 | 2022-01-11 | 北京元蛋复合材料有限公司 | Light/high-temperature-resistant integrated composite material satellite lens hood and preparation method thereof |
| CN114349994A (en) * | 2022-01-10 | 2022-04-15 | 长春长光宇航复合材料有限公司 | Modified bismaleimide carbon fiber prepreg, composite material and preparation method thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN107987473B (en) | Epoxy resin for vacuum bag forming prepreg and preparation method thereof | |
| CN105038142B (en) | A kind of novolac epoxy resin sweat connecting preparation method for material | |
| US20200139576A1 (en) | Method for Preparing Cold-Pressing Adhesive and Cold-Pressing Processing System for Plant Fiber Boards | |
| CN110885535B (en) | Preparation method of epoxy resin composition suitable for autoclave initial pressurization | |
| CN107163565B (en) | Nylon composite material for selective laser sintering and preparation method thereof | |
| CN107033550A (en) | A kind of fiber prepreg material fast-curing resin and preparation method thereof | |
| CN109456439B (en) | Photoinitiated rapidly-prepared polymethacrylimide foamable particle | |
| CN1760267A (en) | Technique and equipment for fabricating plastic sheet material produced from molding laminar die in low pressure | |
| CN104629251A (en) | Flame retardant composition and application thereof | |
| CN102491741A (en) | Method for preparing ITO ceramic target | |
| CN115678275A (en) | Bismaleimide resin for autoclave zero-suction-rubber molding prepreg and preparation method thereof | |
| CN113136089A (en) | Rapid curing wave-transparent composite material and preparation method thereof | |
| CN111532010B (en) | Preparation process of insulating and heat-insulating laminated composite material | |
| CN110372980B (en) | Manufacturing method of PTFE ceramic composite substrate with low water absorption and high copper foil adhesive force | |
| CN115975346B (en) | Epoxy resin premix for OOA cured prepreg and preparation method thereof | |
| CN103450822A (en) | Thermosetting membrane for adhesion of bulletproof fiber and processing method of thermosetting membrane | |
| CN107932933B (en) | Fiber composite material and method for producing same by using RTM (resin transfer molding) method | |
| CN113903937B (en) | Rapid mould pressing composite graphite bipolar plate, preparation method thereof and fuel cell | |
| CN113442402B (en) | POE material-based high-weather-resistance photovoltaic adhesive film preparation process | |
| CN102069525B (en) | Process and device for manufacturing thick fiber board by high frequency-contact combined heating mode | |
| CN107141532A (en) | Without asbestos seal gasket and preparation method thereof | |
| CN116063819B (en) | Medium-temperature curing epoxy resin premix for unmanned aerial vehicle structural member and preparation method | |
| CN116239393B (en) | Hard carbon fiber heat-insulating felt and preparation method thereof | |
| CN109438916A (en) | Heat-resisting antistatic polyether-ether-ketone composite material of one kind and preparation method thereof | |
| CN115466509B (en) | Polyimide composite material with low dielectric and high toughness and preparation method thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |