CN115668097A - 芯片的控制方法和控制装置 - Google Patents

芯片的控制方法和控制装置 Download PDF

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Publication number
CN115668097A
CN115668097A CN202080101051.7A CN202080101051A CN115668097A CN 115668097 A CN115668097 A CN 115668097A CN 202080101051 A CN202080101051 A CN 202080101051A CN 115668097 A CN115668097 A CN 115668097A
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temperature
power consumption
temperature detection
detection point
subsystem
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魏威
顾郁炜
陈立前
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Huawei Technologies Co Ltd
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Huawei Technologies Co Ltd
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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
    • Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management

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  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
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Abstract

一种芯片的控制方法和装置，所述芯片包括至少一个子系统，所述芯片上设置有至少一个第一温度检测点。所述方法包括：利用每个第一温度检测点的关系模型，确定第一功耗信息，第一功耗信息使得利用每个第一温度检测点的关系模型确定的第一预测温度小于或等于该第一温度检测点的预设温度阈值(S210)。每个第一温度检测点的关系模型用于表示功耗信息和第一温度检测点的预测温度之间的关系。功耗信息用于指示每个子系统的功耗。之后，控制所述芯片根据第一功耗信息运行(S220)。根据每个第一温度检测点的关系模型，确定芯片中的子系统的功耗，在芯片的控制过程中无需对温度检测点的温度的进行频繁检测。

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PCT国内申请，说明书已公开。

Claims (26)

  1. PCT国内申请，权利要求书已公开。
CN202080101051.7A 2020-05-20 2020-05-20 芯片的控制方法和控制装置 Pending CN115668097A (zh)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116301117A (zh) * 2023-05-24 2023-06-23 荣耀终端有限公司 温度控制方法和电子设备
CN117743965A (zh) * 2024-02-21 2024-03-22 深圳市互盟科技股份有限公司 基于机器学习的数据中心能效优化方法及系统

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* Cited by examiner, † Cited by third party
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CN116954346A (zh) * 2022-04-18 2023-10-27 华为技术有限公司 芯片和电压噪声抑制方法
CN115373443B (zh) * 2022-08-26 2024-04-05 深圳市广通远驰科技有限公司 温度控制方法、装置、电子设备及存储介质
CN116069143B (zh) * 2023-04-06 2023-07-18 山东省计算中心（国家超级计算济南中心） 一种基于作业相似性判断功耗预测的节能方法及系统
CN116304956B (zh) * 2023-05-15 2023-08-15 济宁市质量计量检验检测研究院(济宁半导体及显示产品质量监督检验中心、济宁市纤维质量监测中心) 一种芯片温度异常在线检测方法
CN116400201B (zh) * 2023-06-06 2023-08-11 中诚华隆计算机技术有限公司 一种芯粒工作状态监测方法、装置、电子设备及存储介质

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8904115B2 (en) * 2010-09-28 2014-12-02 Texas Instruments Incorporated Cache with multiple access pipelines
US9207730B2 (en) * 2011-06-02 2015-12-08 Apple Inc. Multi-level thermal management in an electronic device
CN106681453A (zh) * 2016-11-24 2017-05-17 电子科技大学 一种高性能多核微处理器的动态热管理方法
CN109685207A (zh) * 2018-11-27 2019-04-26 电子科技大学 一种基于循环神经网络的多核芯片热管理方法
CN111026603B (zh) * 2019-10-25 2021-04-23 南京大学 片上网络温度预测方法及装置、设备、存储介质

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116301117A (zh) * 2023-05-24 2023-06-23 荣耀终端有限公司 温度控制方法和电子设备
CN116301117B (zh) * 2023-05-24 2023-10-20 荣耀终端有限公司 温度控制方法和电子设备
CN117743965A (zh) * 2024-02-21 2024-03-22 深圳市互盟科技股份有限公司 基于机器学习的数据中心能效优化方法及系统
CN117743965B (zh) * 2024-02-21 2024-05-07 深圳市互盟科技股份有限公司 基于机器学习的数据中心能效优化方法及系统

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