CN115666153A - Display substrate, preparation method thereof and display device - Google Patents
Display substrate, preparation method thereof and display device Download PDFInfo
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- CN115666153A CN115666153A CN202211327925.8A CN202211327925A CN115666153A CN 115666153 A CN115666153 A CN 115666153A CN 202211327925 A CN202211327925 A CN 202211327925A CN 115666153 A CN115666153 A CN 115666153A
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Abstract
The embodiment of the application provides a display substrate, a preparation method thereof and a display device. The anode is positioned on one side of the substrate; the light-emitting layer is positioned on one side of the anode, which is far away from the substrate; the cathode is positioned on one side of the light-emitting layer far away from the substrate; wherein: the anode comprises an island-shaped discontinuous irregular conductive structure, and the material of the conductive structure comprises indium. The embodiment of the application provides a display substrate, utilize metal indium film to have the characteristic of natural diffuse reflection medium, can deposit to island discontinuity, and island shape conductive structure who differs, therefore, can form anomalous positive pole plane of reflection after increasing metal indium film, the light that the luminescent layer sent shines behind the positive pole, form the light to all directions propagation after the diffuse reflection of positive pole, thereby can improve the big visual angle luminance of organic electroluminescent display device, reduce the colour cast, reach the effect that improves product visual angle luminance, moreover, the steam generator is simple in structure, and is suitable for large-scale industrial production and uses.
Description
Technical Field
The application relates to the technical field of display, in particular to a display substrate, a preparation method of the display substrate and a display device.
Background
Along with the continuous development of intelligent science and technology, the market is more and more extensive to the product demand that mirror surface and demonstration combine, and this type of product not only is applied to under the application fields such as house, market, advertising, makeup and beauty, still can be applied to application scenes such as on-vehicle rear-view mirror.
The organic electroluminescent device is usually mirror reflection, and the color of the organic electroluminescent device is often greatly changed along with the change of the viewing angle, so that the organic electroluminescent display device has large viewing angle, low brightness and large color shift.
Disclosure of Invention
The present application provides a display substrate, a manufacturing method thereof, and a display device, aiming at the disadvantages of the existing methods, and is used to solve the technical problems of low brightness and large color cast of the display device with a large viewing angle in the prior art.
In a first aspect, an embodiment of the present application provides a display substrate, including:
a substrate;
an anode on one side of the substrate;
the light-emitting layer is positioned on one side of the anode, which is far away from the substrate;
the cathode is positioned on one side of the light-emitting layer away from the substrate;
wherein: the anode comprises an island-shaped discontinuous irregular conductive structure, and the material of the conductive structure comprises indium.
In one possible implementation manner, the anode includes a first metal layer, the first metal layer includes one or more of aluminum and silver, and the first metal layer is located on one side of the conductive structure close to the substrate or on one side of the conductive structure far away from the substrate;
or the anode comprises a first contact anode layer, the first contact anode layer comprises a transparent conductive film layer, and the first contact anode layer is positioned on one side of the conductive structure close to the substrate or on one side of the conductive structure far away from the substrate.
In a possible implementation manner, if the anode includes the first metal layer, the anode further includes a second metal layer, and the second metal layer is located on a side of the conductive structure away from the substrate, or on a side of the conductive structure close to the substrate; the second metal layer includes a conductive reflective film layer.
In a possible implementation manner, if the anode includes the first metal layer, the anode further includes a second contact anode layer, and the second contact anode layer is located on one side of the conductive structure close to the substrate; and/or the anode further comprises a third contact anode layer, and the third contact anode layer is positioned on one side of the light-emitting layer close to the substrate.
In one possible implementation, the material of the second contact anode layer comprises a transparent conductive material, and the material of the third contact anode layer comprises a transparent conductive material;
when the anode comprises a second metal layer, the material of the second metal layer comprises one or more of aluminum, silver.
In a possible implementation manner, if the anode includes the first metal layer, the film thickness of the conductive structure is not less than 500 angstroms and not more than 5 microns, the film thickness of the first metal layer is not less than 500 angstroms and not more than 5 microns, and the film thickness of the third contact anode layer is not less than 80 angstroms and not more than 500 angstroms.
In a possible implementation, if the anode includes the first contact anode layer, a fourth contact anode layer is further included;
if the first contact anode layer is positioned at one side of the conductive structure close to the substrate, the fourth contact anode layer is positioned at one side of the conductive structure far away from the substrate;
if the first contact anode layer is located on the side of the conductive structure far away from the substrate, the fourth contact anode layer is located on the side of the conductive structure near the substrate.
In one possible implementation, the material of the second contact anode layer comprises a transparent conductive material;
if the anode comprises the first contact anode layer, the film thickness of the conductive structure is not less than 1000 angstroms and not more than 5 microns, and the film thickness of the first contact anode layer is not less than 80 angstroms and not more than 500 angstroms;
or, if the anode includes the first contact anode layer, the film thickness of the conductive structure is not less than 20 angstroms and not more than 50 angstroms, and the film thickness of the first contact anode layer is not less than 200 angstroms and not more than 2000 angstroms; the film thickness of the fourth contact anode layer is not less than 200 angstroms and not more than 2000 angstroms.
In one possible implementation, the cathode includes a transparent conductive layer, or the cathode includes a conductive reflective film layer, and the material of the conductive reflective film layer includes one or more of aluminum and silver.
In a second aspect, embodiments of the present application provide a display device, including the display substrate according to the first aspect.
In a third aspect, an embodiment of the present application provides a method for manufacturing a display substrate, including:
providing a substrate;
manufacturing an anode, a light emitting layer and a cathode on one side of a substrate in sequence; the anode comprises an island-shaped discontinuous irregular conductive structure, and the conductive structure is made of indium.
In one possible implementation, fabricating an anode on one side of a substrate includes:
manufacturing a first metal layer on one side of the substrate, and manufacturing a conductive structure on one side of the first metal layer far away from the substrate, or manufacturing a conductive structure on one side of the substrate, and manufacturing a first metal layer on one side of the conductive structure far away from the substrate;
or, a first contact anode layer is manufactured on one side of the substrate, and a conductive structure is manufactured on one side, far away from the substrate, of the first contact anode layer; or, a conductive structure is manufactured on one side of the substrate, and a first contact anode layer is manufactured on one side of the conductive structure far away from the substrate.
The beneficial technical effects brought by the technical scheme provided by the embodiment of the application comprise:
the anode of the display substrate provided by the embodiment of the application comprises an island-shaped discontinuous irregular conductive structure, and the material of the conductive structure comprises indium. The metal indium film is utilized to have the characteristic of a natural diffuse reflection medium, can be deposited into an island-shaped discontinuous conductive structure, and has different island shapes, therefore, an irregular anode reflecting surface can be formed after the metal indium film is added, light emitted by the light emitting layer irradiates the anode, and light propagating to all directions is formed after diffuse reflection of the anode, so that the large-visual-angle brightness of the organic electroluminescent display device can be improved, the color cast is reduced, the effect of improving the visual-angle brightness of a product is achieved, the structure is simple, and the organic electroluminescent display device is suitable for large-scale industrial production and application. Moreover, the metal indium film can be realized only by a vacuum evaporation or sputtering process, the purpose of improving the large viewing angle can be achieved on the premise of not reducing the brightness and the power consumption of the display device, additional processes such as etching and the like are not needed, the process is simple, and the preparation cost is low.
Additional aspects and advantages of the present application will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the present application.
Drawings
The foregoing and/or additional aspects and advantages of the present application will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:
FIG. 1 is a schematic illustration of specular and diffuse reflection;
fig. 2 is a schematic structural diagram of a display substrate according to an embodiment of the present disclosure;
fig. 3 is a schematic structural diagram of another display substrate provided in this embodiment of the present application;
fig. 4 is a schematic structural diagram of another display substrate provided in the embodiment of the present application;
fig. 5 is a schematic structural diagram of another display substrate according to an embodiment of the present disclosure;
fig. 6 is a schematic flow chart illustrating a method for manufacturing a display substrate according to an embodiment of the present disclosure;
fig. 7a to fig. 7c are schematic views of various indium metal films provided in the embodiments of the present application.
Reference numerals:
100-substrate, 101-conductive structure, 102 a-first contact anode layer, 102 b-second contact anode layer, 102 c-third contact anode layer, 102 d-fourth contact anode layer, 103-light emitting layer, 104-cathode, 105-first metal layer, anode-106.
Detailed Description
Reference will now be made in detail to the present application, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar parts or parts having the same or similar functions throughout. In addition, if a detailed description of the known art is unnecessary for the features of the present application shown, it is omitted. The embodiments described below with reference to the accompanying drawings are exemplary only for explaining the present application and are not construed as limiting the present application.
It will be understood by those within the art that, unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. It will be further understood that terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning that is consistent with their meaning in the context of the prior art and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein.
As used herein, the singular forms "a", "an", "the" and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms "comprises" and/or "comprising," when used in this specification, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof. It will be understood that when an element is referred to as being "connected" or "coupled" to another element, it can be directly connected or coupled to the other element or intervening elements may also be present. Further, "connected" or "coupled" as used herein may include wirelessly connected or wirelessly coupled. As used herein, the term "and/or" includes all or any element and all combinations of one or more of the associated listed items.
The inventor of the present application has studied and found that an organic electroluminescent device generally has a specular reflection, and the color of the device is often greatly changed along with the change of the viewing angle, thereby resulting in a large viewing angle, low brightness and large color shift of the organic electroluminescent display device. The general solution is to adjust some films on the light-emitting side to improve the viewing angle, and the process is complicated.
As shown in fig. 1, diffuse reflection is a phenomenon in which light projected on a rough surface is reflected in various directions. When a parallel incident light beam strikes a rough surface, the surface reflects the light beam in all directions, so that although the incident light beams are parallel to each other, the reflected light beams are randomly reflected in different directions due to the non-uniform normal directions of the points, and the reflection is called "diffuse reflection" or "diffusion". Diffusely reflected light rays may be directed in different directions than specularly reflected light rays.
The application provides a display substrate, a preparation method thereof and a display device, and aims to solve the technical problems in the prior art.
The following describes the technical solution of the present application and how to solve the above technical problems in detail by specific embodiments.
An embodiment of the present application provides a display substrate, as shown in fig. 2 to 5, the display substrate includes: a substrate 100, an anode 106, a light-emitting layer 103, and a cathode 104.
An anode 106 positioned at one side of the substrate 100;
a light emitting layer 103 on a side of the anode 106 away from the substrate 100;
a cathode 104 on a side of the light-emitting layer 103 away from the substrate 100;
wherein: the anode 106 includes an island-shaped discontinuous irregular conductive structure 101, and a material of the conductive structure 101 includes indium (In).
Alternatively, the light emitting layer 103 comprises an organic electroluminescent layer and the display substrate comprises an OLED light emitting device.
The anode 106 of the display substrate provided by the embodiment of the present application includes an island-shaped discontinuous irregular conductive structure 101, and a material of the conductive structure 101 includes indium (In). By utilizing the characteristic that the metal indium (In) film has a natural diffuse reflection medium, the metal indium (In) film can be deposited into the conductive structure 101 with discontinuous islands and different island shapes, therefore, an irregular anode reflecting surface can be formed after the metal indium (In) film is added, light emitted by the light emitting layer irradiates the anode 106, and light which is transmitted to all directions is formed after the light irradiates the anode 106 through diffuse reflection, so that the large-visual-angle brightness of the organic electroluminescent display device can be improved, the color cast is reduced, the effect of improving the visual-angle brightness of a product is achieved, the structure is simple, and the organic electroluminescent display device is suitable for large-scale industrial production and application. In addition, the metal indium (In) film can be realized only by a vacuum evaporation or sputtering process, the purpose of improving the large viewing angle can be achieved on the premise of not reducing the brightness and the power consumption of the display device, additional processes such as etching and the like are not needed, the process is simple, and the preparation cost is low.
In some embodiments, as shown in fig. 3 and 5, the anode 106 includes a first metal layer 105, the first metal layer 105 includes one or more of aluminum and silver, the first metal layer 105 is located on a side of the conductive structure 101 close to the substrate 100 or on a side of the conductive structure 101 far from the substrate 100, and fig. 3 and 5 only show that the first metal layer 105 is located on a side of the conductive structure 101 far from the substrate 100.
In some embodiments, as shown in fig. 3 and 5, if the anode 106 includes the first metal layer 105, the anode 106 further includes a second contact anode layer 102b, and the second contact anode layer 102b is located on a side of the conductive structure 101 close to the substrate 100; and/or, the anode 106 further includes a third contact anode layer 102c, and the third contact anode layer 102c is located at one side of the light emitting layer 103 close to the substrate 100.
In some embodiments, if the anode 106 includes the first metal layer 105, the anode 106 further includes a second metal layer (not shown), the second metal layer is located on a side of the conductive structure 101 away from the substrate 100, or on a side of the conductive structure 101 close to the substrate 100; the second metal layer includes a conductive reflective film layer.
In some embodiments, the material of the second contact anode layer 102b comprises a transparent conductive material, and the material of the third contact anode layer 102c comprises a transparent conductive material; when the anode 106 comprises a second metal layer, the material of the second metal layer comprises one or more of aluminum, silver.
In one embodiment, as shown in fig. 5, if the display substrate 100 is a top emission structure, the anode 106 may include a conductive structure 101, a first metal layer 105, a second contact anode layer 102b, and a third contact anode layer 102c.
Specifically, the second contact anode layer 102b, located on one side of the substrate 100, may serve as a contact medium for the conductive structure 101 to improve the interface adhesion. If the conductive structure 101 is well contacted, the second contact anode layer 102b may be omitted. The material of the second contact anode layer 102b is preferably Indium Tin Oxide (ITO).
A conductive structure 101 located on a side of the second contact anode layer 102b away from the substrate 100, wherein a film thickness of the conductive structure 101 is not less than 500 angstroms and not more than 5 microns (i.e. the conductive structure 101 has a thickness of less than
Including two extremes 500 and 5).
A first metal layer 105, located on a side of the conductive structure 101 away from the substrate 100, where a material of the first metal layer 105 is preferably one or more of aluminum and silver with high reflectivity; the film thickness of first metal layer 105 is not less than 500 angstroms and not more than 5 microns (i.e., the film thickness of first metal layer 105 is not less than 5 microns)
Including two extremes 500 and 5).
The third contact anode layer 102c, located on the side of the first metal layer 105 away from the substrate 100, is used to reduce the voltage of the EL device, and this layer may be omitted as product specifications allow. The third contact anode layer 102c has a film thickness of not less than 80 angstroms and not more than 500 angstroms (i.e., a film thickness of not less than 80 angstroms)
Including the two extremes of 80 and 500). The material of the third contact anode layer 102c is preferably Indium Tin Oxide (ITO).
And a light emitting layer 103 on a side of the third contact anode layer 102c away from the substrate 100. Optionally, the light emitting layer 103 may further include other organic layers, for example, the light emitting layer 103 may include a stack of one or more layers (not shown in the figure) of a hole injection layer, an electron blocking layer, a hole transport layer, an electron transport layer, a hole blocking layer, and an electron injection layer.
The cathode 104 is located on a side of the light emitting layer 103 away from the substrate 100, the cathode 104 is a transparent electrode, the cathode 104 may include a combination of one or more metals, and the material of the cathode 104 may be any conductive material. Alternatively, the cathode 104 may be a composite cathode, and the cathode 104 may include at least two metal materials, and the material of the cathode 104 is preferably Mg: ag (a mixture of magnesium and silver), IZO (indium zinc oxide), moO3: ag: moO3 (molybdenum trioxide, silver and molybdenum trioxide layered arrangement), znS: al: znS (zinc sulfide, aluminum and zinc sulfide layered arrangement), or the like.
Optionally, the display substrate may further include an optical extraction layer and an encapsulation layer (not shown in the figures).
Alternatively, in other embodiments, as shown in fig. 2 and 4, the anode 106 includes a first contact anode layer 102a, the first contact anode layer 102a includes a transparent conductive film layer, the first contact anode layer 102a is located on a side of the conductive structure 101 close to the substrate 100 or on a side of the conductive structure 101 far from the substrate 100, and only the first contact anode layer 102a is shown in fig. 2 and 4 on a side of the conductive structure 101 far from the substrate 100.
In some embodiments, as shown in fig. 4, if the anode 106 includes the first contact anode layer 102a, a fourth contact anode layer 102d is also included; if the first contact anode layer 102a is located on the side of the conductive structure 101 close to the substrate 100, the fourth contact anode layer 102d is located on the side of the conductive structure 101 away from the substrate 100; if the first contact anode layer 102a is located on the side of the conductive structure 101 away from the substrate 100, the fourth contact anode layer 102d is located on the side of the conductive structure 101 close to the substrate 100.
Optionally, the material of the second contact anode layer 102b comprises a transparent conductive material.
In another embodiment, as shown in fig. 4, if the display substrate 100 is a top emission structure, the anode 106 includes a first contact anode layer 102a, a conductive structure 101 and a fourth contact anode layer 102d.
Specifically, the fourth contact anode layer 102d is located on one side of the substrate 100, and may serve as a contact medium for the conductive structure 101 to improve the interface adhesion. If the conductive structure 101 is well contacted, the fourth contact anode layer 102d may be omitted. The material of the fourth contact anode layer 102d is preferably Indium Tin Oxide (ITO).
101 bit of conductive structureOn the side of the fourth contact anode layer 102d away from the substrate 100, the thickness of the conductive structure 101 is not less than 1000 angstroms and not more than 5 microns (i.e. the thickness of the conductive layer is not less than 5 microns)
Including the two extremes of 1000 and 5).
The first contact anode layer 102a is located on the side of the conductive structure 101 remote from the substrate 100 for reducing the voltage of the EL device, and this layer may be omitted as product specifications allow. The first contact anode layer 102a has a film thickness of not less than 80 angstroms and not more than 500 angstroms (i.e., a film thickness of not less than 80 angstroms and not more than 500 angstroms)
Including the two extremes of 80 and 500). The material of the first contact anode layer 102a is preferably Indium Tin Oxide (ITO).
And a light emitting layer 103 on a side of the first contact anode layer 102a away from the substrate 100. Optionally, the light emitting layer 103 may further include other organic layers, for example, the light emitting layer 103 may include a stack of one or more layers (not shown in the figure) of a hole injection layer, an electron blocking layer, a hole transport layer, an electron transport layer, a hole blocking layer, and an electron injection layer.
The cathode 104 is located on a side of the light emitting layer 103 away from the substrate 100, the cathode 104 is a transparent electrode, the cathode 104 may include a combination of one or more metals, and the material of the cathode 104 may be any conductive material. Alternatively, the cathode 104 may be a composite cathode, and the cathode 104 may include at least two metal materials, and the material of the cathode 104 is preferably Mg: ag (a mixture of magnesium and silver), IZO (indium zinc oxide), moO3: ag: moO3 (molybdenum trioxide, silver, and molybdenum trioxide are layered), znS: al: znS (zinc sulfide, aluminum, and zinc sulfide are layered), or the like.
Optionally, the display substrate may further include an optical extraction layer and an encapsulation layer (not shown in the figures).
In yet another embodiment, as shown in fig. 4, if the display substrate 100 is a bottom emission structure, the anode 106 includes a first contact anode layer 102a, a conductive structure 101, and a fourth contact anode layer 102d.
Specifically, the fourth contact anode layer 102d are located on one side of the substrate 100 and serve as a contact medium for the conductive structure 101, which can improve the interface adhesion. If the conductive structure 101 is well contacted, the fourth contact anode layer 102d may be omitted. The material of the fourth contact anode layer 102d is preferably Indium Tin Oxide (ITO). The fourth contact anode layer 102d has a film thickness of not less than 200 angstroms and not more than 2000 angstroms (i.e., a film thickness
Including the two extremes of 200 and 2000).
The conductive structure 101 is located on a side of the fourth contact anode layer 102d away from the substrate 100, and a film thickness of the conductive structure 101 is not less than 20 angstroms and not more than 50 angstroms (i.e. the conductive structure 101 is located on the side away from the substrate 100)
Including the two extremes of 20 and 50).
The first contact anode layer 102a is located on the side of the conductive structure 101 remote from the substrate 100 for reducing the voltage of the EL device, and this layer may be omitted as product specifications allow. The first contact anode layer 102a has a film thickness of not less than 200 angstroms and not more than 2000 angstroms (i.e., a film thickness of not less than 200 angstroms)
Including the two extremes of 200 and 2000). The material of the first contact anode layer 102a is preferably Indium Tin Oxide (ITO). The first contact anode layer 102a and the fourth contact anode layer 102d are alternatively selected, i.e. the anode 106 may comprise the first contact anode layer 102a layer and the conductive structure 101, or the anode 106 may comprise the conductive structure 101 and the fourth contact anode layer 102d, or the anode 106 may comprise the first contact anode layer 102a, the conductive structure 101 and the fourth contact anode layer 102d.
And a light emitting layer 103 on a side of the first contact anode layer 102a away from the substrate 100. Optionally, the light emitting layer 103 may further include other organic layers, for example, the light emitting layer 103 may include a stack of one or more layers of a hole injection layer, an electron blocking layer, a hole transport layer, an electron transport layer, a hole blocking layer, and an electron injection layer (not shown in the figure).
A cathode 104 disposed apart from the light-emitting layer 103On one side of the substrate 100, the cathode 104 includes a conductive reflective film layer made of a material including one or more of aluminum and silver. Optionally, the thickness of the film layer of the anode 106 is not less than 500 angstroms and not more than 5000 angstroms (i.e., the thickness of the film layer is not less than 500 angstroms and not more than 5000 angstroms) (i.e., the thickness of the film layer is not less than the thickness of the film layer)
Including two extremes 500 and 5000).
Optionally, the display substrate may further include an encapsulation layer (not shown) on a side of the cathode 104 away from the substrate 100.
If the display substrate is a top emission structure, the cathode 104 includes a transparent conductive layer, or if the display substrate is a bottom emission structure, the cathode 104 includes a conductive reflective film layer, and the material of the conductive reflective film layer includes one or more of aluminum and silver.
The conductive structure 101 may be used as a light emitting layer or a reflective layer, and if the display substrate is a top emission structure, the conductive structure 101 may be used as a reflective layer, or if the display substrate is a bottom emission structure, the conductive structure 101 may be used as a light emitting layer.
Alternatively, if the display substrate is a bottom emission structure, that is, the conductive structure 101 serves as a light emitting layer, the transmittance of the conductive structure 101 is greater than 80%.
In the present application, the anode 106 may include a single or multiple composite metal layers containing at least indium among metals such as indium, silver, and aluminum. The film thickness of the conductive structure 101 may be
The thickness range of the conductive structure 101 may be different according to whether the display substrate is a top emission structure or a bottom emission structure, and the application is not limited thereto.
The display substrate that this application embodiment provided, through the uneven metal level that sets up in luminescent device, increased effective light-emitting area, improved luminescent device's luminous luminance, though the outgoing light is to each side scattering, weakened forward luminance, but increased this part loss of luminous area compensatable again to make the forward luminance difference little, wide-angle luminance obviously promotes. As shown In fig. 7 a-7 c, indium (In) films of various sizes and thicknesses can provide diffuse reflective interfaces for different EL devices (organic electroluminescent devices), and the light emitted from the EL devices is angularly shifted when passing through the reflective surfaces, so that the light paths are "scattered" and function as scattering ions.
Based on the same inventive concept, embodiments of the present application provide a display device including the display substrate according to the first aspect.
Alternatively, the display device may be an organic electroluminescent display device.
The display device provided by the embodiment of the present application has the same inventive concept and the same advantageous effects as the previous embodiments, and the details that are not shown in detail in the display device can refer to the previous embodiments, and are not described herein again.
Based on the same inventive concept, embodiments of the present application provide a method for manufacturing a display substrate, as shown in fig. 6, the method includes:
s1: providing a substrate;
s2: manufacturing an anode, a light-emitting layer and a cathode on one side of a substrate in sequence; the anode comprises an island-shaped discontinuous irregular conductive structure, and the conductive structure is made of indium.
In the method for manufacturing a display substrate provided in the embodiment of the present application,
the preparation method of the display substrate provided by the embodiment of the application utilizes the characteristic that the metal indium (In) film has a natural diffuse reflection medium, can be deposited into the conductive structure 101 with discontinuous island shape and different island shapes, therefore, an irregular anode reflecting surface can be formed after the metal indium (In) film is added, and the light emitted by the light emitting layer is uniformly scattered to all directions, so that the large visual angle brightness of the organic electroluminescent display device can be improved, the color cast is reduced, the effect of improving the visual angle brightness of the product is achieved, the structure is simple, and the preparation method is suitable for large-scale industrial production and application. In addition, the metal indium (In) film can be deposited on the anode structure only through a vacuum evaporation or sputtering process, the purpose of improving the large viewing angle can be achieved on the premise of not reducing the brightness and the power consumption of the display device, additional processes such as etching and the like are not needed, the process is simple, and the preparation cost is low.
In some embodiments, fabricating an anode on one side of a substrate comprises:
manufacturing a first metal layer on one side of the substrate, and manufacturing a conductive structure on one side of the first metal layer far away from the substrate, or manufacturing a conductive structure on one side of the substrate, and manufacturing a first metal layer on one side of the conductive structure far away from the substrate;
or, a first contact anode is manufactured on one side of the substrate, and a conductive structure is manufactured on one side of the first contact anode, which is far away from the substrate; or, a conductive structure is manufactured on one side of the substrate, and a first contact anode is manufactured on one side of the conductive structure far away from the substrate.
In one specific embodiment, as shown in fig. 3, fabricating an anode on one side of a substrate includes: on one side of the substrate, a conductive structure 101, a first metal layer 105 and a third contact anode layer 102c are deposited in sequence.
To improve the interfacial adhesion, as shown in fig. 5, before depositing the conductive structure 101 on one side of the substrate, the method includes: a second contact anode layer 102b is deposited on one side of the substrate. The second contact anode layer 102b may serve as a contact medium for the conductive structure 101 for improving interface adhesion.
In another specific embodiment, as shown in fig. 2, fabricating an anode on one side of a substrate comprises: on one side of the substrate, a conductive structure 101 and a first contact anode layer 102a are deposited in sequence.
To improve the interface adhesion, as shown in fig. 4, before depositing the conductive structure 101 on one side of the substrate, the method includes: a fourth contact anode layer 102d is deposited on one side of the substrate. The fourth contact anode layer 102d may serve as a contact medium for the conductive structure 101 for improving interface adhesion.
By applying the embodiment of the application, at least the following beneficial effects can be realized:
(1) The anode 106 of the display substrate provided by the embodiment of the present application includes the island-shaped and discontinuous irregular conductive structure 101, and the material of the conductive structure 101 includes indium (In). By utilizing the characteristic that the metal indium (In) film has a natural diffuse reflection medium, the metal indium (In) film can be deposited into the conductive structure 101 with discontinuous islands and different island shapes, therefore, an irregular anode reflecting surface can be formed after the metal indium (In) film is added, light emitted by the light emitting layer irradiates the anode 106, and light which is transmitted to all directions is formed after the light irradiates the anode 106 through diffuse reflection, so that the large-visual-angle brightness of the organic electroluminescent display device can be improved, the color cast is reduced, the effect of improving the visual-angle brightness of a product is achieved, the structure is simple, and the organic electroluminescent display device is suitable for large-scale industrial production and application.
(2) The indium (In) metal film can be deposited on the anode structure only through a vacuum evaporation or sputtering process, the purpose of improving the large viewing angle can be achieved on the premise of not reducing the brightness and the power consumption of the display device, additional processes such as etching and the like are not needed, the process is simple, and the preparation cost is low.
(3) The display substrate that this application embodiment provided, through the uneven metal level that sets up in luminescent device, increased effective light-emitting area, improved luminescent device's luminance, though emergent light is to each side scattering, weakened forward luminance, increased light-emitting area and can compensate this part loss again to make the forward luminance difference little, wide-angle luminance obviously promotes.
Those of skill in the art will appreciate that the various operations, methods, steps in the processes, acts, or solutions discussed in this application can be interchanged, modified, combined, or eliminated. Further, various operations, methods, steps, measures, schemes in the various processes, methods, procedures that have been discussed in this application may be alternated, modified, rearranged, decomposed, combined, or eliminated. Further, steps, measures, schemes in the prior art having various operations, methods, procedures disclosed in the present application may also be alternated, modified, rearranged, decomposed, combined, or deleted.
In the description of the present application, it is to be understood that the terms "center", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience in describing the present application and simplifying the description, but do not indicate or imply that the referred device or element must have a particular orientation, be constructed in a particular orientation, and be operated, and thus should not be construed as limiting the present application.
The terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present application, "a plurality" means two or more unless otherwise specified.
In the description of the present application, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present application can be understood in a specific case by those of ordinary skill in the art.
In the description herein, particular features, structures, materials, or characteristics may be combined in any suitable manner in any one or more embodiments or examples.
It should be understood that, although the steps in the flowcharts of the figures are shown in order as indicated by the arrows, the steps are not necessarily performed in order as indicated by the arrows. The steps are not performed in the exact order shown and may be performed in other orders unless explicitly stated herein. Moreover, at least a portion of the steps in the flow chart of the figure may include multiple sub-steps or multiple stages, which are not necessarily performed at the same time, but may be performed at different times, which are not necessarily performed in sequence, but may be performed alternately or alternately with other steps or at least a portion of the sub-steps or stages of other steps.
The foregoing is only a partial embodiment of the present application, and it should be noted that, for those skilled in the art, several modifications and decorations can be made without departing from the principle of the present application, and these modifications and decorations should also be regarded as the protection scope of the present application.
Claims (12)
1. A display substrate, comprising:
a substrate;
an anode on one side of the substrate;
the light-emitting layer is positioned on one side of the anode, which is far away from the substrate;
the cathode is positioned on one side of the light-emitting layer away from the substrate;
wherein: the anode comprises an island-shaped discontinuous irregular conductive structure, and the material of the conductive structure comprises indium.
2. The display substrate of claim 1, wherein the anode comprises a first metal layer comprising one or more of aluminum and silver, and the first metal layer is located on a side of the conductive structure near the substrate or on a side of the conductive structure away from the substrate;
or, the anode comprises a first contact anode layer, the first contact anode layer comprises a transparent conductive film layer, and the first contact anode layer is positioned on one side of the conductive structure close to the substrate or one side of the conductive structure far away from the substrate.
3. The display substrate of claim 2, wherein if the anode comprises a first metal layer, the anode further comprises a second metal layer, and the second metal layer is located on a side of the conductive structure away from the substrate or on a side of the conductive structure close to the substrate; the second metal layer includes a conductive reflective film layer.
4. A display substrate according to claim 2 or 3, wherein if the anode comprises a first metal layer, the anode further comprises a second contact anode layer, the second contact anode layer being located on a side of the conductive structure adjacent to the substrate; and/or the anode further comprises a third contact anode layer, and the third contact anode layer is positioned on one side of the light-emitting layer close to the substrate.
5. The display substrate of claim 4, wherein the material of the second contact anode layer comprises a transparent conductive material, and the material of the third contact anode layer comprises a transparent conductive material;
when the anode comprises a second metal layer, the material of the second metal layer comprises one or more of aluminum and silver.
6. The display substrate of claim 4,
if the anode comprises the first metal layer, the film thickness of the conductive structure is not less than 500 angstroms and not more than 5 microns, the film thickness of the first metal layer is not less than 500 angstroms and not more than 5 microns, and the film thickness of the third contact anode layer is not less than 80 angstroms and not more than 500 angstroms.
7. The display substrate of claim 2, further comprising a fourth contact anode layer if the anode comprises the first contact anode layer;
if the first contact anode layer is positioned on one side of the conductive structure close to the substrate, the fourth contact anode layer is positioned on one side of the conductive structure far away from the substrate;
and if the first contact anode layer is positioned on one side of the conductive structure far away from the substrate, the fourth contact anode layer is positioned on one side of the conductive structure close to the substrate.
8. The display substrate of claim 7, wherein the material of the second contact anode layer comprises a transparent conductive material;
if the anode comprises a first contact anode layer, the thickness of the film layer of the conductive structure is not less than 1000 angstroms and not more than 5 microns, and the thickness of the film layer of the first contact anode layer is not less than 80 angstroms and not more than 500 angstroms;
or, if the anode includes a first contact anode layer, the thickness of the film layer of the conductive structure is not less than 20 angstroms and not more than 50 angstroms, and the thickness of the film layer of the first contact anode layer is not less than 200 angstroms and not more than 2000 angstroms; the fourth contact anode layer has a film thickness of not less than 200 angstroms and not more than 2000 angstroms.
9. The display substrate of claim 1, wherein the cathode comprises a transparent conductive layer, or wherein the cathode comprises a conductive reflective film layer, and wherein the material of the conductive reflective film layer comprises one or more of aluminum and silver.
10. A display device comprising the display substrate according to any one of claims 1 to 9.
11. A method for preparing a display substrate is characterized by comprising the following steps:
providing a substrate;
manufacturing an anode, a light emitting layer and a cathode on one side of the substrate in sequence; the anode comprises an island-shaped discontinuous irregular conductive structure, and the material of the conductive structure comprises indium.
12. The method for manufacturing a display substrate according to claim 11, wherein the manufacturing an anode on one side of the substrate comprises:
manufacturing a first metal layer on one side of the substrate, and manufacturing the conductive structure on one side of the first metal layer far away from the substrate, or manufacturing the conductive structure on one side of the substrate, and manufacturing the first metal layer on one side of the conductive structure far away from the substrate;
or, a first contact anode layer is manufactured on one side of the substrate, and the conductive structure is manufactured on one side, far away from the substrate, of the first contact anode layer; or, manufacturing a conductive structure on one side of the substrate, and manufacturing a first contact anode layer on one side of the conductive structure far away from the substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211327925.8A CN115666153A (en) | 2022-10-27 | 2022-10-27 | Display substrate, preparation method thereof and display device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211327925.8A CN115666153A (en) | 2022-10-27 | 2022-10-27 | Display substrate, preparation method thereof and display device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN115666153A true CN115666153A (en) | 2023-01-31 |
Family
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202211327925.8A Pending CN115666153A (en) | 2022-10-27 | 2022-10-27 | Display substrate, preparation method thereof and display device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN115666153A (en) |
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2022
- 2022-10-27 CN CN202211327925.8A patent/CN115666153A/en active Pending
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