CN115666097A

CN115666097A - Computer room temperature control method and device, storage medium and electronic equipment

Info

Publication number: CN115666097A
Application number: CN202211383986.6A
Authority: CN
Inventors: 操奎; 刘谦; 刘薇; 刘嘉男
Original assignee: China Construction Bank Corp
Current assignee: China Construction Bank Corp
Priority date: 2022-11-07
Filing date: 2022-11-07
Publication date: 2023-01-31

Abstract

The invention provides a method and a device for controlling the temperature of a machine room, a storage medium and electronic equipment, wherein the method comprises the following steps: determining a plurality of machine room modules, wherein each machine room module comprises a plurality of cabinets, and a plurality of devices are deployed in each cabinet; determining the equipment inlet air temperature and the component temperature set corresponding to each equipment, judging whether each equipment meets the local hot spot condition of the equipment or not according to the equipment inlet air temperature and the component temperature set, judging whether each cabinet meets the local hot spot condition of the cabinet or not, taking the equipment meeting the conditions as hot spot equipment, and taking the cabinet meeting the conditions as the hot spot cabinet; carrying out equipment abnormity inspection on the hotspot equipment to obtain an abnormity inspection result; performing exception handling on the hotspot equipment according to the exception checking result of the hotspot equipment so as to reduce the running temperature of the equipment; and through a preset refrigeration system, each hot cabinet is cooled, so that temperature control is realized. By applying the method, when the equipment has a high-temperature trend, local hot spots can be identified in time and processed, and the temperature control effect can be improved.

Description

Computer room temperature control method and device, storage medium and electronic equipment

Technical Field

The invention relates to the technical field of equipment operation and maintenance, in particular to a method and a device for controlling the temperature of a machine room, a storage medium and electronic equipment.

Background

The machine room of the data center is a workplace of enterprise data processing equipment and electronic communication equipment, and the heat load is large, so that the temperature of the machine room needs to be adjusted throughout the year to be at an appropriate temperature. An air conditioning system is usually deployed in a machine room, and a common temperature control method is to detect the ambient temperature of the machine room through the air conditioning system and adjust the refrigeration effect based on the ambient temperature to realize temperature control.

The temperature distribution inside the machine room is actually uneven, and a local area with too high temperature is called a local hot spot, and the local hot spot is easy to bring adverse effects to the operation of the data center, so that the processing of the local hot spot also becomes one of the keys of the temperature control of the machine room. Under the scene of considering local hot spots, the existing machine room temperature control mode usually identifies whether the local hot spots exist through the inlet air temperature of the cabinet, so as to adjust the refrigeration effect of the air conditioning system, eliminate the local hot spots and realize the temperature control of the machine room.

The inventor researches and discovers that the heat source of the local hot spot is often IT equipment, in the existing machine room temperature control mode, local hot spot processing is carried out based on the air inlet temperature of the cabinet, the air inlet temperature of the cabinet is often lower than the temperature of the IT equipment, when the IT equipment has high temperature or high temperature trend, the local hot spot is difficult to identify in time, and the temperature control effect is poor.

Disclosure of Invention

In view of this, the embodiment of the invention provides a machine room temperature control method to solve the problems that in the existing machine room temperature control mode, the local hot spot of the IT equipment as the heat source is difficult to identify in time based on the cabinet inlet air temperature, and the temperature control effect is poor.

The embodiment of the invention also provides a machine room temperature control device which is used for ensuring the actual realization and application of the method.

In order to achieve the above purpose, the embodiments of the present invention provide the following technical solutions:

a method of machine room temperature control, comprising:

under the condition that temperature control needs to be carried out on a machine room, determining a plurality of machine room modules corresponding to the machine room, wherein each machine room module comprises a plurality of cabinets, and a plurality of devices are deployed in each cabinet;

for each device deployed in each cabinet, determining a device inlet air temperature corresponding to the current device and a component temperature set corresponding to the current device, where the component temperature set includes multiple device component temperatures corresponding to the current device;

for each device deployed in each cabinet, judging whether the device meets a preset device local hot spot condition or not according to a component temperature set corresponding to the device, and if the device meets the preset device local hot spot condition, determining the device as a hot spot device;

for each cabinet, judging whether the cabinet meets a preset cabinet local hot spot condition or not according to the inlet air temperature of equipment corresponding to each piece of equipment arranged in the cabinet, and if the cabinet meets the preset cabinet local hot spot condition, determining the cabinet as a hot spot cabinet;

according to a preset equipment detection strategy, equipment abnormity inspection is carried out on each hotspot equipment, and an abnormity inspection result corresponding to each hotspot equipment is obtained;

for each hotspot device, performing exception processing on the hotspot device according to an exception check result corresponding to the hotspot device, so that the hotspot device is in a normal running state, and the running temperature of the hotspot device is reduced;

and cooling each hot spot cabinet through a preset refrigeration system so as to reduce the ambient temperature of each hot spot cabinet and complete the temperature control process.

Optionally, the determining the current device intake air temperature corresponding to the device and the component temperature set corresponding to the device includes:

determining the equipment model corresponding to the equipment;

determining a target equipment temperature acquisition instruction corresponding to the equipment model in a plurality of preset equipment temperature acquisition instructions; each equipment temperature acquisition instruction is a hardware management interface operation instruction set based on an intelligent platform management interface;

according to the target equipment temperature acquisition instruction, establishing an equipment temperature acquisition task corresponding to the equipment;

executing the equipment temperature acquisition task to obtain an equipment temperature acquisition result corresponding to the equipment;

acquiring the air inlet temperature of the equipment corresponding to the equipment in the equipment temperature acquisition result;

and acquiring a plurality of equipment component temperatures corresponding to the equipment in the equipment temperature acquisition result, and forming a component temperature set corresponding to the equipment by using the plurality of equipment component temperatures corresponding to the equipment.

Optionally, the method for determining whether the device meets a preset device local hot spot condition according to the component temperature set corresponding to the device includes:

for each equipment component temperature in the component temperature set corresponding to the equipment, determining a component temperature threshold corresponding to the equipment component temperature, judging whether the equipment component temperature is greater than the corresponding component temperature threshold, and if so, determining the equipment component temperature as a target equipment component temperature;

and judging whether the target equipment component temperature exists in the component temperature set corresponding to the equipment or not, and if so, determining that the equipment meets the preset local hot spot condition of the equipment.

Optionally, the method for determining whether the cabinet meets a preset local hot spot condition of the cabinet according to the inlet air temperature of the equipment corresponding to each piece of equipment disposed in the cabinet includes:

for each device deployed in the cabinet, determining a device inlet air temperature threshold corresponding to the device, and judging whether the device inlet air temperature corresponding to the device is greater than the device inlet air temperature threshold, if so, determining the device as a local hotspot device corresponding to the cabinet;

and judging whether the local hot spot equipment exists in the cabinet, and if the local hot spot equipment exists in the cabinet, determining that the cabinet meets the preset local hot spot condition of the cabinet.

Optionally, in the method, the cooling process performed on each hot spot cabinet by using a preset refrigeration system includes:

determining a floor air opening corresponding to each hot spot cabinet in a plurality of floor air openings contained in the preset refrigeration system;

for each hot spot cabinet, determining an equipment position corresponding to local hot spot equipment corresponding to the hot spot cabinet, and determining air outlet information corresponding to a floor air port corresponding to the hot spot cabinet according to the equipment position corresponding to the local hot spot equipment and the equipment air inlet temperature, wherein the air outlet information comprises an air outlet direction and an air outlet amount;

generating a refrigeration regulation instruction according to the air outlet information corresponding to the floor air inlet corresponding to each hot spot cabinet;

and sending the refrigeration regulation instruction to the preset refrigeration system, so that the preset refrigeration system performs air outlet control on the floor air inlet corresponding to each hot spot cabinet, and cooling each hot spot cabinet.

The method described above, optionally, further includes:

determining the inlet air temperature of the cabinet corresponding to each cabinet;

for each machine room module, judging whether the machine room module meets a preset module local hot spot condition or not according to the inlet air temperature of the cabinet corresponding to each cabinet included in the machine room module, and if the machine room module meets the preset module local hot spot condition, determining the machine room module as a hot spot module;

and cooling each hot spot module through the preset refrigeration system so as to reduce the ambient temperature of each hot spot module.

Optionally, the method for determining whether the machine room module meets the preset local hot spot condition of the module according to the inlet air temperature of the cabinet corresponding to each cabinet included in the machine room module includes:

for each cabinet included in the machine room module, judging whether the inlet air temperature of the cabinet corresponding to the cabinet is greater than a preset module temperature threshold value, and if the inlet air temperature of the cabinet corresponding to the cabinet is greater than the preset module temperature threshold value, determining the cabinet as a local hot-spot cabinet;

and judging whether the local hot point cabinet exists in each cabinet included by the machine room module, and if the local hot point cabinet exists in each cabinet included by the machine room module, determining that the machine room module meets the preset module local hot point condition.

A machine room temperature control apparatus comprising:

the system comprises a first determining unit and a second determining unit, wherein the first determining unit is used for determining a plurality of machine room modules corresponding to a machine room under the condition that the temperature of the machine room needs to be controlled, each machine room module comprises a plurality of cabinets, and a plurality of devices are arranged in each cabinet;

a second determining unit, configured to determine, for each device deployed in each cabinet, a device inlet air temperature corresponding to the current device and a component temperature set corresponding to the device, where the component temperature set includes multiple device component temperatures corresponding to the device;

a first determining unit, configured to determine, for each device deployed in each cabinet, whether the device meets a preset device local hot spot condition according to a component temperature set corresponding to the device, and determine, if the device meets the preset device local hot spot condition, that the device is a hot spot device;

the second judging unit is used for judging whether the cabinet meets a preset cabinet local hot spot condition or not according to the equipment inlet air temperature corresponding to each equipment arranged in the cabinet, and if the cabinet meets the preset cabinet local hot spot condition, determining the cabinet as a hot spot cabinet;

the anomaly checking unit is used for carrying out equipment anomaly checking on each hotspot equipment according to a preset equipment detection strategy to obtain an anomaly checking result corresponding to each hotspot equipment;

the anomaly processing unit is used for carrying out anomaly processing on each hotspot device according to an anomaly checking result corresponding to the hotspot device so as to enable the hotspot device to be in a normal running state and reduce the running temperature of the hotspot device;

and the cooling processing unit is used for cooling each hot spot cabinet through a preset refrigeration system so as to reduce each ambient temperature of the hot spot cabinet and complete the temperature control process.

A storage medium, comprising stored instructions, wherein when executed, the storage medium controls a device to execute the method as described above.

An electronic device comprising a memory, and one or more instructions, wherein the one or more instructions are stored in the memory and configured to be executed by one or more processors to perform the room temperature control method as described above.

The method for controlling the temperature of the machine room provided by the embodiment of the invention comprises the following steps: determining a plurality of machine room modules corresponding to a machine room, wherein each machine room module comprises a plurality of cabinets, and a plurality of devices are deployed in each cabinet; determining equipment inlet air temperature and component temperature sets corresponding to each equipment, wherein the component temperature set corresponding to each equipment comprises a plurality of equipment component temperatures corresponding to the equipment; judging whether each device meets a preset device local hot spot condition or not according to a component temperature set corresponding to each device, and determining the device meeting the device local hot spot condition as a hot spot device; judging whether each cabinet meets a preset cabinet local hot spot condition or not according to the inlet air temperature of equipment corresponding to each equipment arranged in each cabinet, and determining the cabinet meeting the cabinet local hot spot condition as a hot spot cabinet; according to a preset equipment detection strategy, equipment abnormity inspection is carried out on each hot equipment, and an abnormity inspection result corresponding to each hot equipment is obtained; for each hotspot device, performing exception processing according to the corresponding exception checking result to enable the hotspot device to be in a normal running state so as to reduce the running temperature of the device; and cooling each hot spot cabinet through a preset refrigeration system so as to reduce the ambient temperature of each hot spot cabinet. By applying the method provided by the embodiment of the invention, whether the local hot spot exists can be identified based on the air inlet temperature and the component temperature of the equipment in the cabinet, and the local hot spot related to the air inlet temperature of the equipment and the local hot spot related to the component temperature can be respectively processed in a targeted manner. The identification of local hot spots is based on the relevant temperature of the equipment, when the equipment has high temperature or high temperature trend, the local hot spots can be identified in time, the temperature control is carried out in time, the local hot spots are eliminated or reduced, the temperature of the machine room is controlled in a proper range, and the temperature control effect is good.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the provided drawings without creative efforts.

Fig. 1 is a flowchart of a method for controlling a temperature of a machine room according to an embodiment of the present invention;

FIG. 2 is a schematic diagram of a local hot spot of an IT device according to an embodiment of the present invention;

fig. 3 is a schematic diagram of a local hot spot of a cabinet according to an embodiment of the present invention;

fig. 4 is a schematic diagram of a local hot spot of a module according to an embodiment of the present invention;

FIG. 5 is an exemplary diagram of a process for controlling a temperature of a machine room according to an embodiment of the present invention;

FIG. 6 is a diagram illustrating another example of a process for controlling the temperature of a machine room according to an embodiment of the present invention;

fig. 7 is a schematic structural diagram of a machine room temperature control device according to an embodiment of the present invention;

fig. 8 is a schematic structural diagram of an electronic device according to an embodiment of the present invention.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be obtained by a person skilled in the art without making any creative effort based on the embodiments in the present invention, belong to the protection scope of the present invention.

In this application, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrases "comprising a," "8230," "8230," or "comprising" does not exclude the presence of additional like elements in a process, method, article, or apparatus that comprises the element.

As known from the background art, the elimination of local hot spots is one of the objectives of temperature control of a machine room. In an actual scene, generally, because heating power and service load of different devices are different, devices with large power and high load are usually at a higher operating temperature, and if the devices are placed in a local area, the local area of a machine room is easily overheated, so that serious problems such as hardware damage or shutdown of some devices due to overheating occur. In the operation and maintenance process of a traditional data center, when whether local hot spots exist in a machine room or not is judged, the air inlet temperature of a cabinet is generally only considered by considering the environmental temperature of the machine room, but the air inlet temperature of the cabinet is often lower than the related temperature of equipment, so that the local hot spots are difficult to identify in time. Secondly, local hot spots are usually treated by reducing the temperature of the air conditioner, optimizing the air flow structure and the like. However, if the heat generated by the equipment itself or its surroundings is high due to a failure of the equipment itself or a high deployed traffic load, etc., the traditional way of processing local hot spots is usually temporary and permanent, and it is difficult to obtain a good temperature control effect.

Therefore, the embodiment of the invention provides a machine room temperature control method, which can identify whether a local hot spot exists or not by acquiring the relevant temperature of equipment, and can identify the local hot spot in time by performing targeted processing, so that the temperature control effect is improved.

The embodiment of the invention provides a machine room temperature control method, which can be applied to a machine room temperature control system, wherein an execution main body of the method can be a server of the system, and a flow chart of the method is shown in fig. 1 and comprises the following steps:

s101: under the condition that temperature control needs to be carried out on a machine room, determining a plurality of machine room modules corresponding to the machine room, wherein each machine room module comprises a plurality of cabinets, and a plurality of devices are deployed in each cabinet;

in the method provided by the embodiment of the present invention, a machine room of a data center is divided into a plurality of machine room modules, each machine room module refers to a machine room physical space for storing a specific set of cabinets, each machine room module includes a plurality of cabinets, and each cabinet is disposed with a plurality of devices, where the devices are IT devices, such as servers, switches, routers, and the like.

S102: for each device deployed in each cabinet, determining a device inlet air temperature corresponding to the device and a component temperature set corresponding to the device, wherein the component temperature set comprises a plurality of device component temperatures corresponding to the device;

in the method provided by the embodiment of the invention, temperature acquisition is carried out on each device in the machine room (namely each device on each cabinet in each machine room module), and the current device inlet air temperature and component temperature set corresponding to each device are obtained. An air inlet and an air outlet are arranged on the equipment, and the air inlet temperature of the equipment corresponding to the equipment is the air temperature of the air inlet of the equipment. The component temperature set corresponding to the device includes temperatures of various device components of the device, that is, the device component temperatures refer to temperatures of the device components, and the device components include a CPU, a hard disk, a memory, and the like.

S103: for each device deployed in each cabinet, judging whether the device meets a preset device local hot spot condition or not according to a component temperature set corresponding to the device, and if the device meets the preset device local hot spot condition, determining the device as a hot spot device;

in the method provided by the embodiment of the invention, the local hot spot condition of the equipment is preset according to the actual requirement, and when what condition is met by the component temperature set corresponding to the equipment is defined in the local hot spot condition of the equipment, the local hot spot condition is regarded as the local hot spot with the equipment dimension. For example, a component mean threshold is set, and a condition is considered to be satisfied when the mean of the individual device component temperatures in the component temperature set exceeds the component mean threshold. As another example, a maximum temperature value is set, and when the temperature of the equipment component with the highest temperature value in the component temperature set exceeds the preset maximum temperature value, the condition is considered to be satisfied. It should be noted that, in a specific implementation process, a local hot spot condition of the device may be set according to an actual requirement, without affecting the implementation function of the method provided by the embodiment of the present invention.

In the method provided by the embodiment of the invention, whether the component temperature set corresponding to each device in the machine room is matched with the condition content of the local hot spot condition of the device is judged, and if the component temperature set is matched with the condition content of the local hot spot condition of the device, the corresponding device is judged to accord with the local hot spot condition of the device. When a device meets the local hot spot condition of the device, the device is regarded as a hot spot device, that is, the device is regarded as having a local hot spot.

S104: for each cabinet, judging whether the cabinet meets a preset cabinet local hot spot condition or not according to the inlet air temperature of equipment corresponding to each piece of equipment arranged in the cabinet, and if the cabinet meets the preset cabinet local hot spot condition, determining the cabinet as a hot spot cabinet;

according to the method provided by the embodiment of the invention, the local hot spot condition of the cabinet is preset according to actual requirements, and when the condition that the equipment inlet air temperature of equipment in the cabinet meets is defined in the local hot spot condition of the cabinet, the equipment is regarded as the local hot spot with the dimension of the cabinet. For example, a device mean threshold is set, and when the mean of the device inlet air temperatures of the devices in the cabinet exceeds the device mean threshold, the condition is considered to be satisfied, and so on. It should be noted that, in a specific implementation process, a local hot spot condition of the cabinet may be set according to an actual requirement, without affecting the implementation function of the method provided by the embodiment of the present invention.

In the method provided by the embodiment of the invention, for each cabinet in the machine room (namely each cabinet in each machine room module), whether the inlet air temperature of each device in the cabinet is matched with the condition content of the local hot spot condition of the cabinet is judged, and if so, the cabinet is judged to accord with the local hot spot condition of the cabinet. When the cabinet meets the cabinet local hot spot condition, the cabinet is regarded as a hot spot cabinet, namely the cabinet is regarded as having a local hot spot.

S105: according to a preset device detection strategy, performing device anomaly detection on each hotspot device to obtain an anomaly detection result corresponding to each hotspot device;

in the method provided by the embodiment of the invention, an equipment detection strategy is preset according to actual requirements, the equipment detection strategy comprises a script aiming at multiple items of detection of equipment, and detection items in the equipment detection strategy can comprise hardware health state check, power consumption query, CPU load check, memory load check, hard disk bandwidth check, network card flow check and the like. For each hotspot device, the hotspot device can be subjected to anomaly detection according to a preset device detection strategy to obtain an anomaly detection result corresponding to the hotspot device, and the anomaly detection result can include detection results of various detection contents.

S106: for each hotspot device, performing exception processing on the hotspot device according to an exception check result corresponding to the hotspot device, so that the hotspot device is in a normal operation state, and the operation temperature of the hotspot device is reduced;

in the method provided by the embodiment of the invention, the exception handling scripts of various check items are preset. And determining an abnormal check item corresponding to each hotspot device according to the abnormal check result of each hotspot device, wherein the abnormal check item refers to a check item with an abnormal check result. And calling the exception handling script corresponding to the corresponding exception checking item for each hotspot device, and performing exception handling on the hotspot device. The exception handling script can be a script for directly carrying out handling operation, and can directly eliminate the exception state so as to restore the normal operation of the hotspot equipment. For the inspection item which cannot be automatically disposed, the corresponding exception handling script may be used to further check the exception result, and send a disposition prompt to the operation and maintenance staff according to the check result, so that the operation and maintenance staff may handle the exception, and the equipment may be restored to a normal state. When the hotspot equipment is in a normal operation state, the heat productivity of each equipment part is in a normal range, so that the operation temperature of the hotspot equipment can be reduced.

In the method provided by the embodiment of the present invention, the content of exception handling may specifically include:

checking and finding hardware faults, calling scripts to generate maintenance suggestions (determining whether to shut down for maintenance, how long to shut down, how to maintain and the like according to hardware redundancy conditions);

checking and finding that the power consumption of the equipment is overhigh, calling a script to inquire the power consumption data of the equipment in the past month, detecting whether an abnormal value exists or not, and sending a prompt;

checking to find that the load of the CPU is higher, calling a script to check and close the abnormal process, and calling the script to start the overclocking to improve the performance;

checking that the memory load is higher, calling the script to search a program process occupying a larger memory, and automatically setting recovery time, a maximum memory use value and a shared process pool by the script according to a search result so as to reduce the memory occupation;

checking and finding that the bandwidth of the hard disk is too high, calling a script to acquire a SMART log of the hard disk, checking whether the hard disk is a hidden bad disk or not, and sending a result whether the hard disk is the hidden bad disk or not;

checking and finding that the network card flow is too high, calling a script to check whether abnormal flow exists or not, and sending a result whether the abnormal flow exists or not;

calling a record of a period of time, determining whether a local hot spot exists in the equipment all the time, and if so, sending a treatment suggestion, wherein the treatment suggestion comprises the following steps: optimizing application deployment mode, installing heat dissipation unit and the like.

It should be noted that, the specific check items and the exception handling contents mentioned in the embodiment of the present invention are only specific embodiments provided for better explaining the method provided in the embodiment of the present invention, and in a specific implementation process, the specific check items and the exception handling modes may be set according to actual requirements, without affecting implementation functions of the method provided in the embodiment of the present invention.

S107: and cooling each hot spot cabinet through a preset refrigeration system so as to reduce the ambient temperature of each hot spot cabinet and complete the temperature control process.

In the method provided by the embodiment of the invention, a refrigeration system, namely an air conditioning system, is pre-deployed in the machine room, the machine room temperature control system can be communicated with the refrigeration system, and the machine room temperature control system can trigger the refrigeration system to adjust the running state of corresponding refrigeration equipment (such as a fan, an air port and the like) based on the relevant information (such as the position) of each hot point cabinet, change the refrigeration effect, and perform cooling treatment aiming at the environment where each hot point cabinet is located, so that the environment temperature of each hot point cabinet is reduced.

Based on the method provided by the embodiment of the invention, a plurality of machine room modules corresponding to a machine room are determined, and each machine room module comprises a plurality of cabinets; determining equipment inlet air temperature and component temperature sets corresponding to each equipment deployed in each cabinet; judging whether the component temperature set corresponding to each device meets the preset local hot spot condition of the device or not according to the component temperature set corresponding to each device, and regarding the device meeting the condition as a hot spot device; judging whether each cabinet meets a preset local hot spot condition of the cabinet or not according to the equipment inlet air temperature of each equipment in each cabinet, and regarding the cabinet meeting the condition as a hot spot cabinet; according to a preset equipment detection strategy, equipment abnormity detection is carried out on each hot equipment, and an abnormity detection result is obtained; carrying out exception processing on the hotspot equipment according to an exception checking result of the hotspot equipment to enable the hotspot equipment to be in a normal running state so as to reduce the running temperature of the hotspot equipment; through predetermined refrigerating system, carry out cooling treatment to the focus rack to reduce rack ambient temperature. By applying the method provided by the embodiment of the invention, whether the local hot spot exists can be identified based on the air inlet temperature and the component temperature of the equipment in the cabinet, and the local hot spot related to the air inlet temperature of the equipment and the local hot spot related to the component temperature can be respectively processed in a targeted manner. The identification of local hot spot is based on the relevant temperature of equipment, when equipment has high temperature or high temperature trend, can in time discern local hot spot, in time carries out temperature control, eliminates or reduces local hot spot, with computer lab temperature control in the fit range, temperature control effect is better.

On the basis of the method shown in fig. 1, in the method provided by the embodiment of the present invention, the process of determining the intake air temperature of the device corresponding to the current device and the component temperature set corresponding to the current device, which is mentioned in step S102, includes:

determining the equipment model corresponding to the equipment;

in the method provided by the embodiment of the invention, the device characteristic information of all devices in the machine room is configured in the database in advance, and the device characteristic information can comprise a device type, a device model, a device physical position, a cabinet where the device is located, a module where the device is located, and the like. The device feature information corresponding to the currently processed device can be obtained from the database, and the device model can be read from the database to obtain the device model corresponding to the device.

in the method provided by the embodiment of the invention, a plurality of equipment temperature acquisition instructions are preset based on an Intelligent Platform Management Interface (IPMI), and the equipment temperature acquisition instructions are used for inquiring the air inlet temperature of equipment, the temperature of each component and the like. IPMI is an industry standard for managing peripheral devices used in enterprise systems based on the Intel architecture, and allows a user to monitor physical health characteristics of IT devices, such as temperature, voltage, fan operating status, power status, etc., using IPMI. Therefore, the IPMI can execute various hardware management interface operation instructions, and the equipment temperature acquisition instruction is also one of the instructions. The equipment temperature acquisition instructions are configured according to the equipment models, namely the preset equipment temperature acquisition instructions correspond to various equipment models one by one.

In the method provided by the embodiment of the invention, the equipment model corresponding to each equipment temperature acquisition instruction is respectively matched with the equipment model of the current equipment, so that the equipment temperature acquisition instruction matched with the equipment model of the current equipment is found in each equipment temperature acquisition instruction and is used as the target equipment temperature acquisition instruction.

in the method provided by the embodiment of the invention, the equipment temperature acquisition task is initiated based on the target equipment temperature acquisition instruction.

in the method provided by the embodiment of the invention, the thread module can be called to establish the multi-thread queue, the temperature acquisition task of the equipment is executed through the queue, and the temperature acquisition result of the equipment is obtained, wherein the temperature acquisition result of the equipment comprises the air inlet temperature, the air outlet temperature, the temperature of each equipment component and the like of the equipment.

in the method provided by the embodiment of the invention, the inlet air temperature of the equipment can be read from the acquired equipment temperature acquisition result as the inlet air temperature of the equipment corresponding to the equipment.

In the method provided by the embodiment of the invention, the temperature of each equipment component can be read from the acquired equipment temperature acquisition result to serve as the temperature of each equipment component corresponding to the equipment, so that a component temperature set is obtained.

On the basis of the method shown in fig. 1, in the method provided in the embodiment of the present invention, the step of determining whether the device meets the preset device local hot spot condition according to the component temperature set corresponding to the device in step S103 includes:

for each equipment component temperature in the component temperature set corresponding to the equipment, determining a component temperature threshold corresponding to the equipment component temperature, judging whether the equipment component temperature is greater than the corresponding component temperature threshold, and if the equipment component temperature is greater than the corresponding component temperature threshold, determining the equipment component temperature as a target equipment component temperature;

in the method provided by the embodiment of the invention, the component temperature thresholds of various equipment components are pre-configured according to the actual temperature control requirement, and when the temperature of a certain type of equipment component exceeds the corresponding component temperature threshold, the equipment component of the type is considered to have high temperature or high temperature trend.

In the method provided by the embodiment of the present invention, for each device component temperature, a component temperature threshold of the device component can be found in the pre-configured component temperature threshold information according to the device component type corresponding to the device component temperature, and the component temperature threshold is used as the component temperature threshold corresponding to the device component temperature. And comparing the temperature of each equipment component with the corresponding component temperature threshold, marking the current equipment component temperature if the current equipment component temperature to be compared is greater than the corresponding component temperature threshold, and taking the current equipment component temperature as the target equipment component temperature. It is considered that the device component corresponding to the target device component temperature has a high temperature or a high temperature tendency. And if the temperature of the equipment component which is currently compared is not greater than the corresponding component temperature threshold value, the temperature of the equipment component is not marked.

In the method provided by the embodiment of the invention, the mark identification is carried out on all the device component temperatures in the component temperature set, and whether the device component temperatures are marked as target device component temperatures is identified. If at least one equipment component temperature in the component temperature set is marked as the target equipment component temperature, the corresponding equipment is considered to be in accordance with the preset equipment local hot spot condition, and if no equipment component temperature in the component temperature set is marked as the target equipment component temperature, the corresponding equipment is considered to be not in accordance with the preset equipment local hot spot condition.

On the basis of the method shown in fig. 1, in the method provided in the embodiment of the present invention, the step S104 of determining whether the cabinet meets the preset local hot spot condition of the cabinet according to the intake air temperature of the equipment corresponding to each equipment disposed in the cabinet includes:

for each device deployed in the cabinet, determining a device inlet air temperature threshold corresponding to the device, judging whether the device inlet air temperature corresponding to the device is greater than the device inlet air temperature threshold, and if the device inlet air temperature corresponding to the device is greater than the device inlet air temperature threshold, determining the device as a local hotspot device corresponding to the cabinet;

in the method provided by the embodiment of the invention, the device inlet air temperature thresholds of various devices are preset according to the actual temperature control requirements. For each device in the current cabinet, according to the device type of the device, the device inlet air temperature threshold matched with the device in the pre-configured device inlet air temperature threshold information can be found and used as the device inlet air temperature threshold corresponding to the device. And comparing the inlet air temperature of the equipment corresponding to each equipment with the inlet air temperature threshold of the equipment corresponding to the equipment, and if the inlet air temperature of the equipment is greater than the inlet air temperature threshold of the equipment corresponding to the equipment, marking the equipment as local hot spot equipment. If the inlet air temperature of the equipment is not greater than the corresponding inlet air temperature threshold value of the equipment, the equipment is not marked.

In the method provided by the embodiment of the invention, each device deployed in the current cabinet is marked and identified, and whether the device is marked as a local hot spot device is identified. If at least one device is marked as a local hot spot device in each device deployed in the current cabinet, the current cabinet is considered to be in accordance with a preset local hot spot condition of the cabinet, and if each device deployed in the current cabinet is not marked as a local hot spot device, the current cabinet is considered to be not in accordance with the preset local hot spot condition of the cabinet.

On the basis of the method provided by the foregoing embodiment, in the method provided by the embodiment of the present invention, the step S107 of performing the cooling process on each hot spot cabinet through a preset refrigeration system includes:

in the method provided by the embodiment of the invention, a floor type air supply design is adopted in a refrigerating system of a machine room, and an air port floor is installed in the machine room. The refrigerating system comprises a plurality of floor air ports, and air supply of the floor air ports is realized through the air port floors. Each floor air port has the adjusting capability, and the air outlet direction, the air outlet quantity and the like can be changed.

In the method provided by the embodiment of the invention, the positions of the cabinets of all cabinets and the positions of the floor air openings are pre-configured. For each hot spot cabinet, a floor air opening matched with the position of the hot spot cabinet can be found according to the position of the hot spot cabinet, and the matched floor air opening is used as the floor air opening corresponding to the hot spot cabinet.

For each hotspot cabinet, determining the equipment position corresponding to local hotspot equipment corresponding to the hotspot cabinet, and determining air outlet information corresponding to a floor air port corresponding to the hotspot cabinet according to the equipment position corresponding to the local hotspot equipment and the equipment air inlet temperature, wherein the air outlet information comprises an air outlet direction and an air outlet amount;

in the method provided by the embodiment of the invention, equipment marked as local hot spot equipment is deployed in a hot spot cabinet, the equipment position corresponding to the local hot spot equipment is obtained according to pre-stored equipment characteristic information, and the corresponding air outlet direction and air outlet quantity can be determined according to a preset control strategy based on the equipment position corresponding to the local hot spot equipment and the equipment air inlet temperature corresponding to the equipment position, wherein the air outlet direction corresponds to the equipment position of the local hot spot equipment, the air outlet quantity is determined by the equipment air inlet temperature, and if the equipment air inlet temperature is higher, the air outlet quantity is larger. Therefore, air outlet information corresponding to the floor air opening corresponding to each hot spot cabinet is obtained.

It should be noted that, in a specific implementation process, only one local hot spot device may exist in the hot spot cabinet, or multiple local hot spot devices may exist, and in a case that multiple local hot spot devices exist, each local hot spot device may be processed based on the above process to obtain multiple sets of air outlet information, and each set of air outlet information is integrated to obtain air outlet information corresponding to a corresponding floor air outlet, and in subsequent control, the floor air outlets may be controlled to alternately perform air outlet control according to each set of air outlet information therein.

In the method provided by the embodiment of the invention, the refrigeration system can receive the refrigeration regulation instruction sent by the room temperature control system, and carry out air outlet control on the corresponding floor air port according to the refrigeration regulation instruction, namely, the corresponding floor air port is controlled to supply air according to the air outlet amount and the air outlet direction corresponding to the floor air port.

On the basis of the method shown in fig. 1, the method provided by the embodiment of the present invention further includes:

in the method provided by the embodiment of the invention, the inlet air temperature of each cabinet in the machine room can be collected through a preset machine room microenvironment monitoring system, and the collected inlet air temperature is used as the inlet air temperature of the cabinet of the corresponding cabinet. The computer room microenvironment monitoring system refers to a system for monitoring the environments, including indexes such as current, voltage, power, temperature and humidity, on which IT equipment depends during operation.

according to the method provided by the embodiment of the invention, the module local hot spot condition is preset according to the actual requirement, and when the condition that the inlet air temperature of the cabinet in the machine room module meets is defined in the module local hot spot condition, the local hot spot with the module dimension exists. For example, a cabinet mean threshold is set, and the condition is considered to be satisfied when the mean of the inlet air temperatures of all the cabinets in the room module exceeds the cabinet mean threshold. It should be noted that, in a specific implementation process, a local hot spot condition of a module may be set according to an actual requirement, without affecting the implementation function of the method provided by the embodiment of the present invention.

In the method provided by the embodiment of the invention, for each machine room module, whether the inlet air temperature of the machine cabinet corresponding to each machine cabinet in the machine room module is matched with the condition content of the local hot spot condition of the module is judged, and if so, the machine room module is judged to be in accordance with the local hot spot condition of the module. When the machine room module meets the module local hot spot condition, the machine room module is marked as a hot spot module, namely, the machine room module is considered to have a local hot spot.

In the method provided by the embodiment of the invention, the refrigeration system can be triggered to adjust the running state of the corresponding refrigeration equipment based on the relevant information of each hot spot module, such as the module position, and the temperature reduction treatment can be carried out on the environment where each hot spot module is located.

On the basis of the method provided by the above embodiment, in the method provided by the embodiment of the present invention, the process of determining whether the machine room module meets the preset module local hot spot condition according to the inlet air temperature of the cabinet corresponding to each cabinet included in the machine room module includes:

for each cabinet included in the machine room module, judging whether the inlet air temperature of the cabinet corresponding to the cabinet is greater than a preset module temperature threshold value, and if the inlet air temperature of the cabinet corresponding to the cabinet is greater than the preset module temperature threshold value, determining the cabinet as a local hot spot cabinet;

in the method provided by the embodiment of the invention, the module temperature threshold value, namely the threshold value of the inlet air temperature of the cabinet, is preset according to the actual temperature control requirement. And comparing the inlet air temperature of each cabinet in the current machine room module with the module temperature threshold, and if the inlet air temperature of the cabinet corresponding to the currently compared cabinet is greater than the module temperature threshold, marking the cabinet as a local hot-spot cabinet. And if the inlet air temperature of the cabinet is not greater than the module temperature threshold, the cabinet is not marked.

In the method provided by the embodiment of the invention, all cabinets in the current machine room module are marked and identified, whether the cabinets are marked as local hot cabinets or not is identified, if at least one cabinet in the current machine room module is marked as a local hot cabinet, the current machine room module is considered to be in accordance with the local hot condition of the module, and if each cabinet in the current machine room module is not marked as a local hot cabinet, the current machine room module is considered to be in accordance with the preset local hot condition of the module.

In order to better explain the method provided by the embodiment of the invention, the embodiment of the invention provides another method for controlling the temperature of the machine room in combination with an actual application scenario. The computer room in the embodiment of the present invention is also deployed based on the structures of the computer room modules, the cabinets, the devices in the cabinets, and the like mentioned in the above embodiments.

First, with reference to fig. 2 to fig. 4, a local hot spot in the embodiment of the present invention is described, in the method provided in the embodiment of the present invention, the local hot spot in the machine room is divided into types, such as an IT device local hot spot, a cabinet local hot spot, and a module local hot spot. In fig. 2, 3, and 4, the slash marks indicate regions of high temperature.

An IT device local hot spot refers to a local hot spot caused by a device component in the IT device that is at a higher temperature. FIG. 2 is a schematic diagram showing a schematic structure of an IT device, wherein five components including component 1 to component 5 are included, component 3 is a device component at a higher temperature, and component 3 is a local hot spot of the IT device.

A local hot spot of a cabinet refers to a local hot spot caused by IT equipment in the cabinet at a higher temperature. Fig. 3 is a schematic diagram illustrating a schematic structure of a cabinet, in which IT devices 1, 2, 3, 8230, m, and other IT devices are disposed, where the IT device 2 is a device at a higher temperature, that is, the IT device 2 is a local hotspot of the cabinet.

Module local hot spots refer to local hot spots caused by cabinets in the room module at higher temperatures. Fig. 4 is a schematic diagram showing a brief structure of a computer room module, in which a plurality of cabinets, such as a cabinet 1, a cabinet 2, a cabinet 3, and a cabinet 4, are disposed. Cabinet 4 is a cabinet at a higher temperature, so cabinet 4 is a module local hot spot.

Referring to the flowchart shown in fig. 5, a process of controlling the temperature of the machine room according to an embodiment of the present invention includes:

s201: collecting the temperature of IT equipment;

in the method provided by the embodiment of the invention, the temperature of each IT device is acquired through a script, and the temperature of the IT device comprises two types of temperatures: the temperature of air inlet and outlet of IT equipment and the temperature of IT equipment components.

As shown in fig. 6, in the method provided in the embodiment of the present invention, the process of acquiring the temperature of the IT device in step S201 specifically includes:

s301: configuring an acquisition task, inputting the characteristics of TI equipment to be acquired, and storing the characteristics into a rear-end task configuration table of a database;

in the method provided by the embodiment of the invention, the characteristics of the IT equipment can be as follows:

TABLE 1

IT device features	Means of
		Room	On-site module
cabinet	In the cabinet
		location	Physical location
Class	IT device type
		type	IT equipment model
SN	Serial number
		ILO	Management port IP
User	User name
		Password	Cipher code

S302: acquiring various scripts of an IPMI tool of an IT equipment hardware management interface to form tool information of the scripts to be distributed;

in the method provided by the embodiment of the invention, various script information of an IPMI tool of an IT equipment hardware management interface is obtained from a script library to form the information of the tool of the script to be distributed. Taking a server with the model number of RH5288H in Hua as an example, an operation method for inquiring the temperature of each component by using an IPMI interface in a Linux environment comprises the following steps: GET _ TEMP _ CMD = 'ipmitool-I landplus-H { } -U { } -P { } sdrtype Temperature'.

S303: the execution script automatically matches the IT equipment model and the hardware management interface operation instruction, and executes the IT equipment temperature acquisition task.

In the method provided by the embodiment of the invention, the script is used for automatically matching the IT equipment model and the hardware management interface operation instruction, and executing the IT equipment temperature acquisition task. Asynchronously initiating an IT equipment temperature acquisition task, transmitting a task ID to a back-end process, acquiring information of the IT equipment to be acquired and an acquisition script type from a back-end task configuration table according to the task ID, establishing a multithreading queue on the IT equipment to be acquired through a thread module, and executing the acquisition task in an uninterrupted manner to acquire the following types of IT equipment temperatures:

TABLE 2

S202: collecting the inlet air temperature of the cabinet;

in the method provided by the embodiment of the invention, the inlet air temperature of each cabinet in the module is collected from a machine room microenvironment monitoring system.

S203: processing temperature data, comparing the temperature data with a preset temperature threshold value, and judging whether a local hot spot exists or not;

in the method provided by the embodiment of the invention, the acquired temperature is processed, each type of temperature is compared with the corresponding preset temperature threshold value, and whether a local hot spot exists is judged. The threshold ranges for each type of temperature can be as follows:

TABLE 3

It should be noted that, the specific indexes and data contents shown in table 1, table 2 and table 3 are only specific examples provided for better illustrating the method provided by the embodiment of the present invention, and only some indexes and data in the actual application process are shown, meanwhile, other indexes and data may also be used in the actual application process, and are not limited to the contents mentioned in the embodiment of the present invention.

S204: analyzing the local hot spot type;

in the method provided by the embodiment of the invention, if the temperature of the IT equipment component exceeds the temperature threshold of the component, the existence of the local hot spot of the IT equipment is judged; if the inlet air temperature of a single IT device in the same cabinet exceeds a preset inlet air temperature threshold of the IT device, judging that local hot spots of the cabinet exist; and if the inlet air temperature of the cabinet exceeds the module temperature threshold value, judging that a module local hot spot exists.

S205: and giving different early warnings and processing the warnings according to the types of the local hot spots.

In the method provided by the embodiment of the invention, when the local hot spot of the IT equipment exists, the IT equipment is initiated to be checked, and the checking result is processed.

Optionally, the IT device check includes hardware health status check, power consumption query, CPU load check, memory load check, hard disk bandwidth check, network card traffic check, and the like. For the processing of the check result, the processing may be performed by calling a processing script of the exception checking item, and for a specific processing process, reference may be made to the foregoing embodiment, and details are not repeated herein for the description of step S106 of the method shown in fig. 1.

According to the method provided by the embodiment of the invention, when the local hot spot of the cabinet exists, the air inlet temperature of the IT equipment is optimized.

Optionally, the optimizing the air inlet temperature of the IT equipment includes prompting an operation and maintenance worker to optimize the deployment position of the IT equipment, plugging a gap of a cabinet where the IT equipment is located, and the like. The air outlet floor can be automatically controlled according to the local hot spot position of the cabinet, and the air outlet quantity and the air outlet direction of the air outlet floor are adjusted so as to accurately cool the hot spot in the cabinet.

In the method provided by the embodiment of the invention, when a module local hot spot exists, the module is subjected to refrigeration regulation.

Optionally, the refrigerating and adjusting of the module includes adjusting the air outlet quantity of the air outlet floor at the local hot spot of the module, plugging the gap between adjacent cabinets, adjusting the air speed of the fan corresponding to the local hot spot of the module, and the like. Specifically, the position of the cabinet (namely the position of the local hot spot of the module) can be analyzed through the cabinet number, and the air speed of the air conditioner fan closest to the position of the local hot spot of the module is controlled, so that the inlet air temperature of all cabinets in the module is kept below a threshold value.

The method provided by the embodiment of the invention can be used for acquiring the IT equipment component temperature, the IT equipment air inlet temperature and the cabinet air inlet temperature of the data center machine room, analyzing whether local hot spots and local hot spot types exist or not according to the preset temperature threshold, and carrying out targeted treatment on the local hot spots of different types. The method specifically comprises the following steps: configuring an acquisition task and executing a script, and acquiring the temperature of IT equipment and acquiring the air inlet temperature of each cabinet in a module from a machine room microenvironment monitoring system; processing the acquisition result, and comparing the acquisition result with a preset threshold; judging whether a local hot spot exists or not; and giving early warning and processing according to the type of the local hot spot.

According to the method provided by the embodiment of the invention, an IT equipment temperature acquisition method based on an IT equipment hardware management interface protocol is adopted, and the temperature values of all parts of the IT equipment can be efficiently collected in real time through an automatic script; establishing a local hot spot analysis method of a machine room, and classifying different local hot spots by combining temperature thresholds in the machine room environment; and establishing different types of local hot spot processing methods, thereby processing different local hot spots in time.

According to the method provided by the embodiment of the invention, the temperature of the IT equipment part is used as the reference index of the health state of the IT equipment, the relation between the refrigeration field of the machine room and the hardware operation and maintenance field of the IT equipment is established, the fault discovery and the load analysis of the IT equipment are helped, the whole process does not need manual intervention, a large amount of manpower and time resources are saved, and the operation and maintenance efficiency is greatly improved. Under the complicated refrigeration system of large-scale data center, combine together multilayer level temperatures such as IT equipment part temperature, IT equipment air inlet temperature, rack temperature, the local hot type of multi-angle analysis computer lab helps fortune dimension personnel multidimension to judge the computer lab refrigeration condition, optimizes the computer lab refrigeration from a plurality of departure points, has improved the computer lab fortune dimension degree of becoming more meticulous.

Corresponding to the method for controlling the temperature of the machine room shown in fig. 1, an embodiment of the present invention further provides a device for controlling the temperature of the machine room, which is used for implementing the method shown in fig. 1 specifically, and a schematic structural diagram of the device is shown in fig. 7, and includes:

a first determining unit 401, configured to determine, when temperature control needs to be performed on a machine room, a plurality of machine room modules corresponding to the machine room, where each machine room module includes a plurality of cabinets, and each cabinet is deployed with a plurality of devices;

a second determining unit 402, configured to determine, for each device deployed in each cabinet, a device inlet air temperature corresponding to the current device and a component temperature set corresponding to the current device, where the component temperature set includes multiple device component temperatures corresponding to the current device;

a first determining unit 403, configured to determine, for each device deployed in each cabinet, whether the device meets a preset device local hot spot condition according to a component temperature set corresponding to the device, and if the device meets the preset device local hot spot condition, determine the device as a hot spot device;

a second determining unit 404, configured to determine, for each cabinet, whether the cabinet meets a preset local hot spot condition of the cabinet according to an air inlet temperature of equipment corresponding to each equipment disposed in the cabinet, and determine the cabinet as a hot spot cabinet if the cabinet meets the preset local hot spot condition of the cabinet;

an anomaly checking unit 405, configured to perform device anomaly checking on each hotspot device according to a preset device detection policy, to obtain an anomaly checking result corresponding to each hotspot device;

an exception handling unit 406, configured to, for each hotspot device, perform exception handling on the hotspot device according to an exception checking result corresponding to the hotspot device, so that the hotspot device is in a normal operation state, and the operation temperature of the hotspot device is reduced;

and the cooling processing unit 407 is used for cooling each hot spot cabinet through a preset refrigeration system so as to reduce each ambient temperature of the hot spot cabinet and complete the temperature control process.

Based on the device provided by the embodiment of the invention, a plurality of machine room modules corresponding to a machine room are determined, and each machine room module comprises a plurality of cabinets; determining an equipment inlet air temperature and a component temperature set corresponding to each equipment deployed in each cabinet; judging whether the component temperature set corresponding to each device meets the preset local hot spot condition of the device or not according to the component temperature set corresponding to each device, and regarding the device meeting the condition as a hot spot device; judging whether each cabinet meets a preset local hot spot condition of the cabinet or not according to the equipment inlet air temperature of each equipment in each cabinet, and regarding the cabinet meeting the condition as a hot spot cabinet; according to a preset equipment detection strategy, equipment abnormity detection is carried out on each hotspot equipment, and an abnormity detection result is obtained; performing exception processing on the hotspot equipment according to the exception checking result of the hotspot equipment to enable the hotspot equipment to be in a normal running state so as to reduce the running temperature of the equipment; through the preset refrigerating system, the hot cabinet is cooled to reduce the ambient temperature of the cabinet. By applying the device provided by the embodiment of the invention, whether the local hot spot exists can be identified based on the air inlet temperature and the component temperature of the equipment in the cabinet, and the local hot spot related to the air inlet temperature of the equipment and the local hot spot related to the component temperature can be respectively processed in a targeted manner. The identification of local hot spots is based on the relevant temperature of the equipment, when the equipment has high temperature or high temperature trend, the local hot spots can be identified in time, the temperature control is carried out in time, the local hot spots are eliminated or reduced, the temperature of the machine room is controlled in a proper range, and the temperature control effect is good.

On the basis of the apparatus shown in fig. 7, the apparatus provided in the embodiment of the present invention may further extend to multiple units, and the functions of each unit may be referred to the descriptions in the foregoing embodiments provided for the method for controlling the temperature of the machine room, and are not further illustrated here.

The embodiment of the invention also provides a storage medium, which comprises a stored instruction, wherein when the instruction runs, the device where the storage medium is located is controlled to execute the computer room temperature control method.

An electronic device is provided in an embodiment of the present invention, and the structural diagram of the electronic device is shown in fig. 8, which specifically includes a memory 501 and one or more instructions 502, where the one or more instructions 502 are stored in the memory 501, and are configured to be executed by one or more processors 503 to perform the following operations according to the one or more instructions 502:

for each device deployed in each cabinet, determining a device inlet air temperature corresponding to the device and a component temperature set corresponding to the device, wherein the component temperature set comprises a plurality of device component temperatures corresponding to the device;

The embodiments in the present specification are described in a progressive manner, and the same and similar parts among the embodiments are referred to each other, and each embodiment focuses on the differences from the other embodiments. In particular, the system or system embodiments are substantially similar to the method embodiments and therefore are described in a relatively simple manner, and reference may be made to some of the descriptions of the method embodiments for related points. The above-described system and system embodiments are only illustrative, wherein the units described as separate parts may or may not be physically separate, and the parts displayed as units may or may not be physical units, may be located in one place, or may be distributed on a plurality of network units. Some or all of the modules may be selected according to actual needs to achieve the purpose of the solution of the present embodiment. One of ordinary skill in the art can understand and implement it without inventive effort.

Those of skill would further appreciate that the various illustrative elements and algorithm steps described in connection with the embodiments disclosed herein may be implemented as electronic hardware, computer software, or combinations of both, and that the various illustrative components and steps have been described above generally in terms of their functionality in order to clearly illustrate this interchangeability of hardware and software. Whether such functionality is implemented as hardware or software depends upon the particular application and design constraints imposed on the technical solution. Skilled artisans may implement the described functionality in varying ways for each particular application, but such implementation decisions should not be interpreted as causing a departure from the scope of the present invention.

The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A method of controlling a temperature of a machine room, comprising:

for each cabinet, judging whether the cabinet meets a preset cabinet local hot spot condition or not according to the equipment inlet air temperature corresponding to each equipment deployed in the cabinet, and if the cabinet meets the preset cabinet local hot spot condition, determining the cabinet as a hot spot cabinet;

according to a preset device detection strategy, performing device anomaly detection on each hotspot device to obtain an anomaly detection result corresponding to each hotspot device;

for each hotspot device, performing exception processing on the hotspot device according to an exception check result corresponding to the hotspot device, so that the hotspot device is in a normal operation state, and the operation temperature of the hotspot device is reduced;

2. The method of claim 1, wherein determining the current device inlet air temperature and the current component temperature set for the device comprises:

determining the equipment model corresponding to the equipment;

3. The method of claim 1, wherein determining whether the device meets a predetermined device local hot spot condition according to the component temperature set corresponding to the device comprises:

4. The method of claim 1, wherein determining whether the cabinet meets a predetermined local hot spot condition according to the inlet air temperature of the equipment corresponding to each piece of equipment disposed in the cabinet comprises:

5. The method of claim 4, wherein the cooling each hotspot cabinet through a preset refrigeration system comprises:

6. The method of claim 1, further comprising:

7. The method of claim 6, wherein the determining whether the room module meets a preset module local hot spot condition according to the inlet air temperature of the cabinet corresponding to each cabinet included in the room module comprises:

8. A machine room temperature control apparatus, comprising:

the system comprises a first determining unit and a second determining unit, wherein the first determining unit is used for determining a plurality of machine room modules corresponding to a machine room under the condition that the temperature of the machine room needs to be controlled, each machine room module comprises a plurality of cabinets, and a plurality of devices are deployed in each cabinet;

the second judgment unit is used for judging whether the cabinet meets a preset cabinet local hot spot condition or not according to the inlet air temperature of the equipment corresponding to each piece of equipment arranged in the cabinet, and if the cabinet meets the preset cabinet local hot spot condition, determining the cabinet as a hot spot cabinet;

the abnormal processing unit is used for carrying out abnormal processing on each hotspot device according to the abnormal checking result corresponding to the hotspot device so as to enable the hotspot device to be in a normal running state and reduce the running temperature of the hotspot device;

and the temperature reduction processing unit is used for reducing the temperature of each hotspot cabinet through a preset refrigeration system so as to reduce the ambient temperature of each hotspot cabinet and finish the temperature control process.

9. A storage medium, characterized in that the storage medium comprises stored instructions, wherein when the instructions are executed, the apparatus on which the storage medium is located is controlled to execute the method according to any one of claims 1 to 7.

10. An electronic device comprising a memory, and one or more instructions, wherein the one or more instructions are stored in the memory and configured to be executed by the one or more processors to perform the method of any one of claims 1-7.