CN115662930A

CN115662930A - Feeding device and method for wafer regeneration

Info

Publication number: CN115662930A
Application number: CN202211343453.5A
Authority: CN
Inventors: 张德海; 吴伟; 陈磊
Original assignee: Anhui Fulede Changjiang Semiconductor Material Co ltd
Current assignee: Anhui Fulede Changjiang Semiconductor Material Co ltd
Priority date: 2022-10-31
Filing date: 2022-10-31
Publication date: 2023-01-31

Abstract

The invention relates to the technical field of wafers, in particular to a feeding device for wafer regeneration and a method thereof.

Description

Feeding device and method for wafer regeneration

Technical Field

The invention relates to the technical field of wafers, in particular to a feeding device and a method for wafer regeneration.

Background

Wafer refers to a silicon wafer used for making silicon semiconductor circuits, the starting material of which is silicon. And after dissolving the high-purity polycrystalline silicon, doping silicon crystal seed crystals, and then slowly pulling out to form cylindrical monocrystalline silicon. After a silicon crystal bar is ground, polished and sliced, a silicon wafer, namely a wafer, is formed, and the main processing modes of the wafer are wafer processing and batch processing, namely, one or more wafers are processed simultaneously. With the smaller and smaller characteristic size of a semiconductor, the processing and measuring equipment is more and more advanced, so that the wafer processing has new data characteristics, various processing procedures are required in the wafer regeneration process, and the wafers need to be continuously loaded and transmitted in the whole processing process, so that the processing of different programs is facilitated.

In the prior art, the following problems exist:

(1) The angle and the position of the conventional feeding device cannot be adjusted more conveniently and rapidly when the conventional feeding device is used, and the position of the conventional feeding device cannot be moved according to different use conditions and cannot be adapted to different use conditions when the conventional feeding device is used;

(2) Current loading attachment is generally unable more convenient when using adjusts the height and the position of device, can't match different processingequipment according to the demand that uses in the use, uses and has certain limitation.

Disclosure of Invention

The present invention is directed to a loading device for wafer recycling and a method thereof, so as to solve the problems mentioned in the background art.

The technical scheme of the invention is as follows: the utility model provides a loading attachment and method for wafer regeneration, includes the base, still includes aversion fixed establishment, height adjusting mechanism and concatenation transport mechanism, aversion fixed establishment fixed mounting is in base bottom both sides, height adjusting mechanism fixed mounting is at the base top, height adjusting mechanism includes the elevating platform, the elevating platform both sides are provided with the extension mechanism, extension mechanism top both sides fixed mounting has aversion adjustment mechanism, aversion adjustment mechanism includes four mounting panels, four lead screw slip tables of fixed mounting respectively at four mounting panel tops, two first backup pads of fixed mounting respectively at the sliding block top of four lead screw slip tables, two respectively fixed mounting at the first electric turntable at two first backup pad tops, two respectively fixed mounting at the connecting block at two first electric turntable tops, two respectively fixed mounting at the electric lifting loop bars at two connecting block tops and two respectively fixed mounting at the rocking arms of the flexible end of two electric lifting loop bars, two rocking arm bottoms respectively fixed mounting has rotary mechanism, rotary mechanism bottom fixed mounting has spacing fixture, concatenation transport mechanism fixed mounting is in elevating platform one side.

Preferably, the shifting fixing mechanism comprises four rollers respectively fixedly mounted on two sides of the bottom of the base, two fixing plates respectively fixedly mounted on two sides of the base, four hydraulic rods respectively fixedly mounted on the bottoms of the two fixing plates, and four fixing feet respectively fixedly mounted at the bottoms of the four hydraulic rods.

Preferably, height adjusting mechanism includes quick-witted case, servo motor, threaded rod, rotatory piece, roof, elevating platform and two guide arms of difference fixed connection between quick-witted case and roof, quick-witted case fixed mounting is at the base top, servo motor fixed mounting is at quick-witted incasement portion, threaded rod fixed mounting is at servo motor morning output, rotatory piece fixed mounting is at the threaded rod top, roof fixed mounting is at rotatory piece top, the elevating platform cooperation is installed in the threaded rod outside.

Preferably, the extension mechanism comprises two mounting grooves which are respectively formed in two sides of the lifting platform, a plurality of electric push rods which are respectively and fixedly mounted in the two mounting grooves, and two extension plates which are respectively and fixedly mounted at telescopic ends of the electric push rods.

Preferably, the rotating mechanism comprises two mounting blocks fixedly mounted at the bottoms of the two rocker arms respectively, two second electric turnplates fixedly mounted at the bottoms of the two mounting blocks respectively, and two second supporting plates fixedly mounted at the bottoms of the two second electric turnplates respectively.

Preferably, the limiting and clamping mechanism comprises two positioning plates which are respectively and fixedly arranged on one side of the bottoms of the two second supporting plates, two electric sliding rails which are respectively and fixedly arranged on the bottoms of the two second supporting plates, two movable plates which are respectively and fixedly arranged on the bottoms of sliding blocks of the two electric sliding rails, four telescopic sleeves which are respectively and fixedly arranged on the two movable plates and the two positioning plates, a plurality of fixed blocks which are respectively and fixedly arranged in the four telescopic sleeves and four telescopic clamping plates which are respectively and cooperatively arranged on the inner sides of the four telescopic sleeves, and each telescopic spring is connected between the fixed block and the telescopic clamping plate.

Preferably, the limiting clamping mechanism further comprises four limiting grooves which are respectively formed in one side of the four telescopic clamping plates, a plurality of movable blocks which are respectively and fixedly installed on one side of the four limiting grooves, four movable hooks which are respectively and cooperatively installed on the inner sides of the four movable blocks, and four protective pads which are respectively and fixedly installed on one sides of the movable hooks.

Preferably, concatenation transport mechanism includes connecting plate, draw-in groove, fixture block and conveyer belt, connecting plate fixed mounting is in elevating platform one side, the draw-in groove is seted up in connecting plate one side, the fixture block cooperation is installed in the draw-in groove inboard, conveyer belt fixed connection is in fixture block one side.

The invention provides a feeding device for wafer regeneration and a method thereof through improvement, compared with the prior art, the feeding device has the following improvement and advantages:

one is as follows: the invention pushes the protective pad to drive the movable hook to contact with the movable block by arranging the shift adjusting mechanism, the rotating mechanism and the limiting clamping mechanism, continuously pushes to fold the two sides of the movable hook inwards until the movable hook rebounds through the movable block, so that the movable hook is fixedly connected with the movable block, the protective pad is fixedly arranged at the inner side of the limiting groove, the wafer can be better protected in the wafer clamping process, the wafer is prevented from being damaged in use, meanwhile, the arrangement of the limiting groove can better limit the position of the wafer, the shaking generated in feeding is avoided, the screw rod sliding table is opened to drive the first supporting plate to move above the wafer, the electric lifting loop bar is opened to drive the rocker arm to move downwards until the two telescopic clamp plates move to the two sides of the wafer respectively, the electric slide rail is opened to enable the sliding block of the electric slide rail to drive a telescopic clamping plate to move inwards until the protective pad is contacted with the two sides of the wafer, the telescopic clamping plate drives the telescopic spring to contract inwards, meanwhile, the telescopic spring generates resilience force, so that the effect of stably clamping the wafer is better achieved, the phenomenon that the wafer is shaken in the feeding process to cause falling off and influence on subsequent use is avoided, after the wafer is clamped, the first electric turntable is opened to enable the first electric turntable to drive the rocker arm to rotate, the rocker arm drives the wafer to rotate to a required position, then the wafer is slowly placed, the mounting plate, the screw rod sliding table, the first supporting plate, the first electric turntable, the connecting block, the electric lifting sleeve rod and the rocker arm can be more conveniently arranged to adjust the position of the clamping device according to the position of the wafer, so that the device can adapt to different use conditions and is more convenient to use, the wafer can be conveniently taken up and put down, meanwhile, the first electric turntable can transfer the wafer to various positions, the application range is wider, and the angle of the wafer can be more conveniently adjusted due to the arrangement of the second electric turntable;

the second step is as follows: according to the invention, the shifting fixing mechanism, the height adjusting mechanism and the splicing transferring mechanism are arranged, the base is pushed to drive the roller wheels to roll, the device is moved to one side of the processing equipment, the hydraulic rod is opened to drive the fixing foot to move downwards until the fixing foot is tightly attached to the ground, so that the base is kept stable, the device can be shifted more conveniently according to the use requirement, the use is more convenient, the servo motor is opened to drive the threaded rod to rotate through the rotating block, the lifting table moves upwards or downwards along the guide rod in the rotating process of the threaded rod, the height of the device is adjusted, the height of the feeding device is matched with the height of the processing equipment, so that the wafer can be fed more accurately, the use is more convenient, when the distance between the device and the processing equipment is far away, the conveying belt is pushed to drive the conveying belt to clamp the clamp block and the clamp groove to be clamped and fixed, so that the conveying belt is fixedly arranged on one side of the lifting table, so that the wafer can be secondarily transferred, various types of equipment can be more conveniently adapted, and the application range of the device is greatly improved.

Drawings

The invention is further explained below with reference to the figures and examples:

FIG. 1 is a schematic perspective view of the present invention;

FIG. 2 is a schematic view of the height adjustment mechanism and extension mechanism of the present invention;

FIG. 3 is a schematic structural diagram of a splicing transfer mechanism of the present invention;

FIG. 4 is a schematic view of the displacement adjustment mechanism of the present invention;

FIG. 5 is a schematic structural view of a rotating mechanism and a spacing and clamping mechanism of the present invention;

fig. 6 is an enlarged schematic view of the structure at a in fig. 5 according to the present invention.

Description of reference numerals: 1. a base; 2. a displacement fixing mechanism; 21. a roller; 22. a fixing plate; 23. a hydraulic lever; 24. a fixing leg; 3. a height adjustment mechanism; 31. a chassis; 32. a servo motor; 33. a threaded rod; 34. rotating the block; 35. a top plate; 36. a guide bar; 37. a lifting platform; 4. an extension mechanism; 41. mounting grooves; 42. an electric push rod; 43. an extension plate; 5. a displacement adjustment mechanism; 51. mounting a plate; 52. a screw rod sliding table; 53. a first support plate; 54. a first electric turntable; 55. connecting blocks; 56. an electric lifting loop bar; 57. a rocker arm; 6. a rotation mechanism; 61. mounting blocks; 62. a second electric turntable; 63. a second support plate; 7. a limiting and clamping mechanism; 71. positioning a plate; 72. an electric slide rail; 73. a movable plate; 74. a telescopic sleeve; 75. a fixed block; 76. a tension spring; 77. a retractable splint; 78. a limiting groove; 79. a movable block; 710. a movable hook; 711. a protective pad; 8. a splicing and transferring mechanism; 81. a connecting plate; 82. a card slot; 83. a clamping block; 84. and (4) a conveyor belt.

Detailed Description

The present invention is described in detail below, and technical solutions in the embodiments of the present invention are clearly and completely described, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

The invention provides a feeding device for wafer regeneration and a method thereof through improvement, and the technical scheme of the invention is as follows:

the first embodiment is as follows:

as shown in fig. 1-4, a feeding device for wafer regeneration and a method thereof, including a base 1, further including a displacement fixing mechanism 2, a height adjusting mechanism 3 and a splicing transfer mechanism 8, wherein the displacement fixing mechanism 2 is fixedly installed on two sides of the bottom of the base 1, the height adjusting mechanism 3 is fixedly installed on the top of the base 1, the height adjusting mechanism 3 includes a lifting platform 37, two sides of the lifting platform 37 are provided with extension mechanisms 4, two sides of the top of the extension mechanisms 4 are fixedly installed with displacement adjusting mechanisms 5, the displacement adjusting mechanism 5 includes four mounting plates 51, four screw rod sliding tables 52 respectively fixedly installed on the tops of the four mounting plates 51, two first support plates 53 respectively fixedly installed on the tops of sliding blocks of the four screw rod sliding tables 52, two first electric rotating discs 54 respectively fixedly installed on the tops of the two first support plates 53, two connecting blocks 55 respectively fixedly installed on the tops of the two first electric rotating discs 54, two electric lifting sleeve rods 56 respectively fixedly installed on the tops of the two connecting blocks 55, and two rocker arms 57 respectively fixedly installed on the telescopic ends of the two electric lifting sleeve rods 56, the bottoms of the two rocker arms 57 are respectively fixedly installed on one side of the lifting platform 37, a clamping mechanism 7 is fixedly installed on the bottom of the splicing transfer mechanism 8.

The above-described specific embodiment: open lead screw slip table 52 and make lead screw slip table 52 drive first backup pad 53 and remove to the wafer top, open electric lift loop bar 56 again and make electric lift loop bar 56 drive rocking arm 57 and move down, move respectively to the wafer both sides until two flexible splint 77, can be more convenient adjust clamping device's position according to the position of wafer to make the device can adapt to different in service behavior, use more convenient, be convenient for take up the wafer and put down.

Specifically, the shifting fixing mechanism 2 comprises four rollers 21 which are respectively fixedly arranged on two sides of the bottom of the base 1, two fixing plates 22 which are respectively fixedly arranged on two sides of the base 1, four hydraulic rods 23 which are respectively fixedly arranged on the bottoms of the two fixing plates 22 and four fixing feet 24 which are respectively fixedly arranged at the bottom ends of the four hydraulic rods 23, the base 1 is kept stable through the rollers 21, the fixing plates 22, the hydraulic rods 23 and the fixing feet 24, the shifting can be carried out on the device more conveniently according to the use requirement, and the shifting fixing mechanism is more convenient to use.

Specifically, height adjustment mechanism 3 includes quick-witted case 31, servo motor 32, threaded rod 33, rotatory piece 34, roof 35, elevating platform 37 and two guide arms 36 of fixed connection respectively between quick-witted case 31 and roof 35, quick-witted case 31 fixed mounting is at the 1 top of base, servo motor 32 fixed mounting is inside quick-witted case 31, threaded rod 33 fixed mounting is at servo motor 32 output in the morning, rotatory piece 34 fixed mounting is at the threaded rod 33 top, roof 35 fixed mounting is at rotatory piece 34 top, elevating platform 37 cooperation is installed outside threaded rod 33, through being provided with quick-witted case 31, servo motor 32, threaded rod 33, rotatory piece 34, roof 35, guide arm 36 and elevating platform 37, can adjust the height of device, make the height of loading attachment and the high of processing equipment to match, so that the wafer can more accurately carry out the material loading, it is more convenient to use.

Specifically, extension mechanism 4 includes two mounting grooves 41 of seting up respectively in elevating platform 37 both sides, a plurality of respectively fixed mounting are at the inside electric putter 42 of two mounting grooves 41 and two extension plates 43 of fixed mounting respectively at the flexible end of a plurality of electric putter 42, through being provided with mounting groove 41, electric putter 42 and extension plate 43, can be more convenient adjust the width of device according to the demand of using, so that carry out the material loading simultaneously to the wafer of both sides, the effectual availability factor who promotes the device.

Specifically, the rotating mechanism 6 includes two mounting blocks 61 respectively fixedly mounted at the bottoms of the two swing arms 57, two second electric rotary tables 62 respectively fixedly mounted at the bottoms of the two mounting blocks 61, and two second support plates 63 respectively fixedly mounted at the bottoms of the two second electric rotary tables 62, and the angle of the wafer can be adjusted more conveniently by providing the mounting blocks 61, the second electric rotary tables 62, and the second support plates 63.

Specifically, the limiting clamping mechanism 7 includes two positioning plates 71 respectively fixedly mounted on one side of the bottoms of the two second supporting plates 63, two electric slide rails 72 respectively fixedly mounted on the bottoms of the two second supporting plates 63, two movable plates 73 respectively fixedly mounted on the bottoms of the sliding blocks of the two electric slide rails 72, four telescopic sleeves 74 respectively fixedly mounted on the inner sides of the two movable plates 73 and the two positioning plates 71, a plurality of fixed blocks 75 respectively fixedly mounted on the inner sides of the four telescopic sleeves 74 and four telescopic clamping plates 77 respectively mounted on the inner sides of the four telescopic sleeves 74 in a matched manner, an extension spring 76 is connected between each fixed block 75 and the telescopic clamping plate 77, by being provided with the positioning plates 71, the electric slide rails 72, the movable plates 73, the telescopic sleeves 74, the fixed blocks 75, the extension springs 76 and the telescopic clamping plates 77, the extension springs 77 drive the extension springs 76 to retract inwards, and the extension springs 76 generate resilience, thereby better playing a role of stabilizing clamping on wafers, avoiding shaking in the feeding process, leading to falling off and influencing subsequent use.

It is specific, spacing fixture 7 still includes four spacing grooves 78 of seting up respectively in four flexible splint 77 one sides, a plurality of respectively fixed mounting are at the movable block 79 of four spacing grooves 78 one side, four cooperate respectively to install at the inboard movable hook 710 of four movable blocks 79 and four respectively fixed mounting at the protection pad 711 of a plurality of movable hooks 710 one side, through being provided with spacing groove 78, movable block 79, movable hook 710 and protection pad 711, can carry out better protection to the wafer in to the wafer centre gripping process, avoid causing the injury to the wafer when using, the setting up of spacing groove 78 can be better simultaneously prescribes a limit to the position of wafer, produce when avoiding the material loading and rock.

Specifically, concatenation transport mechanism 8 includes connecting plate 81, draw-in groove 82, fixture block 83 and conveyer belt 84, and connecting plate 81 fixed mounting is in elevating platform 37 one side, and draw-in groove 82 is seted up in connecting plate 81 one side, and the cooperation of fixture block 83 is installed in draw-in groove 82 inboard, and conveyer belt 84 fixed connection is in fixture block 83 one side, through being provided with connecting plate 81, draw-in groove 82, fixture block 83 and conveyer belt 84 to carry out the secondary to the wafer and transport, all kinds of equipment of adaptation that can be more convenient, the application scope of device has been promoted greatly.

The working principle is as follows: firstly, an external power supply is switched on, the base 1 is pushed to drive the roller 21 to roll, the device is moved to one side of processing equipment, then the hydraulic rod 23 is switched on to drive the fixing pin 24 to move downwards until the fixing pin 24 is tightly adhered and fixed with the ground, so that the base 1 is kept stable, then the servo motor 32 is switched on to drive the threaded rod 33 to rotate through the rotating block 34 by driving the servo motor 32, the lifting table 37 moves upwards or downwards along the guide rod 36 in the rotating process of the threaded rod 33, the height of the device is adjusted, then when the distance between the device and the processing equipment is far, the conveyor belt 84 is pushed to drive the conveyor belt 84 to drive the clamping block 83 to be clamped and fixed with the clamping groove 82, so that the conveyor belt 84 is fixedly arranged at one side of the lifting table 37, then the electric push rod 42 is switched on to drive the extension plate 43 to extend to a required position by driving the electric push rod 42, then, the protection pad 711 is pushed to enable the protection pad 711 to drive the movable hook 710 to contact with the movable block 79, the protection pad 710 is continuously pushed to be folded inwards at two sides until the movable hook 710 rebounds through the movable block 79, so that the movable hook 710 is fixedly connected with the movable block 79, the protection pad 711 is fixedly installed at the inner side of the limiting groove 78, the screw rod sliding table 52 is opened to enable the screw rod sliding table 52 to drive the first supporting plate 53 to move to the upper side of the wafer, the electric lifting sleeve rod 56 is opened to enable the electric lifting sleeve rod 56 to drive the rocker arm 57 to move downwards until the two telescopic clamp plates 77 respectively move to two sides of the wafer, the electric sliding rail 72 is opened to enable the sliding block of the electric sliding rail 72 to drive one telescopic clamp plate 77 to move inwards until the protection pad 711 contacts with two sides of the wafer, the telescopic clamp plate 77 drives the telescopic spring 76 to contract inwards, and the telescopic spring 76 generates resilience force, so that the wafer can be clamped stably, and finally, after the wafer is clamped, opening the first electric turntable 54 to enable the first electric turntable 54 to drive the rocker arm 57 to rotate, enabling the rocker arm 57 to drive the wafer to rotate to a required position, and slowly placing the wafer, wherein the hydraulic rod 23 is of the type: CDM2B25, the type of servo motor 32 is: YE2-132S-4, the model of electric putter 42 is: YS-NZ100-12A, the model of lead screw slip table 52 is: PKH40, model number of first motorized turntable 54 is: DG60-5, the model of electric lift loop bar 56 is: XYDA 24-800, the model number of the electric slide rail 72 is: PKH40.

The previous description is provided to enable any person skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A feeding device and a method for wafer regeneration comprise a base (1), and are characterized in that: still include aversion fixed establishment (2), height adjusting mechanism (3) and concatenation transport mechanism (8), aversion fixed establishment (2) fixed mounting is in base (1) bottom both sides, height adjusting mechanism (3) fixed mounting is at base (1) top, height adjusting mechanism (3) include elevating platform (37), elevating platform (37) both sides are provided with extension mechanism (4), extension mechanism (4) top both sides fixed mounting has aversion adjusting mechanism (5), aversion adjusting mechanism (5) include four mounting panels (51), four respectively fixed mounting at the lead screw slip table (52) at four mounting panels (51) top, two respectively fixed mounting at the first backup pad (53) at the sliding block top of four lead screw slip tables (52), two respectively fixed mounting at the first electric turntable (54) at two first backup pad (53) tops, two respectively fixed mounting at the electric lifting loop bar (56) at two connecting block (55) tops and two respectively fixed mounting at the telescopic rocker arm (57) of two electric lifting loop bars (56), two respectively fixed mounting at the telescopic rocker arm (57) of two electric lifting loop bar (56), spacing rotary mechanism (6) bottom fixed mounting respectively (7), splicing transfer mechanism (8) is fixedly installed on one side of lifting platform (37).

2. The wafer recycling feeding device and method as claimed in claim 1, wherein: the shifting fixing mechanism (2) comprises four rollers (21) which are fixedly installed on two sides of the bottom of the base (1) respectively, two fixing plates (22) which are fixedly installed on two sides of the base (1) respectively, four hydraulic rods (23) which are fixedly installed on the bottoms of the two fixing plates (22) respectively, and four fixing feet (24) which are fixedly installed at the bottom ends of the four hydraulic rods (23) respectively.

3. The wafer recycling feeding device and the method thereof as claimed in claim 1, wherein: height adjusting mechanism (3) are including quick-witted case (31), servo motor (32), threaded rod (33), rotatory piece (34), roof (35), elevating platform (37) and two guide arm (36) of difference fixed connection between quick-witted case (31) and roof (35), quick-witted case (31) fixed mounting is at base (1) top, servo motor (32) fixed mounting is inside quick-witted case (31), threaded rod (33) fixed mounting is at servo motor (32) morning output, rotatory piece (34) fixed mounting is at threaded rod (33) top, roof (35) fixed mounting is at rotatory piece (34) top, elevating platform (37) cooperation is installed in threaded rod (33) outside.

4. The wafer recycling feeding device and the method thereof as claimed in claim 3, wherein: the extension mechanism (4) comprises two installation grooves (41) which are respectively arranged on two sides of the lifting platform (37), a plurality of electric push rods (42) which are respectively and fixedly installed in the two installation grooves (41) and two extension plates (43) which are respectively and fixedly installed at the telescopic ends of the electric push rods (42).

5. The wafer recycling feeding device and the method thereof as claimed in claim 1, wherein: the rotating mechanism (6) comprises two mounting blocks (61) which are fixedly mounted at the bottoms of the two rocker arms (57) respectively, two second electric rotating discs (62) which are fixedly mounted at the bottoms of the two mounting blocks (61) respectively, and two second supporting plates (63) which are fixedly mounted at the bottoms of the two second electric rotating discs (62) respectively.

6. The wafer recycling feeding device and the method thereof as claimed in claim 5, wherein: spacing fixture (7) include two locating plate (71) of fixed mounting respectively in two second backup pad (63) bottom one side, two respectively electric slide rail (72) of fixed mounting in two second backup pad (63) bottoms, two respectively movable plate (73) of fixed mounting in the sliding block bottom of two electric slide rail (72), four respectively fixed mounting in two movable plate (73) and two inboard telescope tube (74) of locating plate (71), a plurality of respectively fixed mounting fixed block (75) of four inside telescope tube (74) and four respectively the cooperation install in four inboard telescope tube (74) telescopic splint (77), every all be connected with a expanding spring (76) between fixed block (75) and telescopic splint (77).

7. The wafer recycling feeding device and the method thereof as claimed in claim 6, wherein: the limiting and clamping mechanism (7) further comprises four limiting grooves (78) which are respectively formed in one side of the four telescopic clamping plates (77), a plurality of movable blocks (79) which are respectively fixedly installed on one side of the four limiting grooves (78), four movable hooks (710) which are respectively installed on the inner sides of the four movable blocks (79) in a matched mode, and four protective pads (711) which are respectively fixedly installed on one sides of the movable hooks (710).

8. The wafer recycling feeding device and the method thereof as claimed in claim 1, wherein: splicing transfer mechanism (8) includes connecting plate (81), draw-in groove (82), fixture block (83) and conveyer belt (84), connecting plate (81) fixed mounting is in elevating platform (37) one side, draw-in groove (82) are seted up in connecting plate (81) one side, fixture block (83) cooperation is installed in draw-in groove (82) inboard, conveyer belt (84) fixed connection is in fixture block (83) one side.