CN115657831A - Power supply system and server for mainboard chip - Google Patents
Power supply system and server for mainboard chip Download PDFInfo
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- CN115657831A CN115657831A CN202211331973.4A CN202211331973A CN115657831A CN 115657831 A CN115657831 A CN 115657831A CN 202211331973 A CN202211331973 A CN 202211331973A CN 115657831 A CN115657831 A CN 115657831A
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- 238000005476 soldering Methods 0.000 claims description 3
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- 238000012360 testing method Methods 0.000 description 9
- 238000003466 welding Methods 0.000 description 7
- 238000010586 diagram Methods 0.000 description 6
- 230000009286 beneficial effect Effects 0.000 description 4
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- 238000005457 optimization Methods 0.000 description 4
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Abstract
The invention relates to the field of board card hardware design, in particular to a power supply system and a server for a mainboard chip. The system comprises: the first connector is arranged on the outer side of the mainboard, is connected with the plurality of power input terminals of the chip through internal wiring of the mainboard, and reserves a first conductive terminal corresponding to each power input terminal; the power panel is vertically arranged with the mainboard, and a power supply corresponding to each power input terminal is arranged on the power panel; the second connector is arranged on the side edge of the power panel, a second conductive terminal corresponding to each power supply is reserved on the second connector, and the second conductive terminals are communicated with the corresponding first conductive terminals. The scheme of the invention greatly reduces the requirement on the area of the board card where the chip is located, releases a certain space, obviously increases the access path of the signal line of the chip, and optimizes the power supply layout to a certain extent.
Description
Technical Field
The invention relates to the field of board card hardware design, in particular to a power supply system for a mainboard chip and a server comprising the power supply system for the mainboard chip.
Background
In the design of a hardware board, a power supply design is an indispensable part, and the current power supply design layout is mainly divided into chip periphery designs, such as a Central Processing Unit (CPU), a Complex Programmable Logic Device (CPLD), a Baseboard Management Controller (BMC), and the like, which design a power supply around a chip and are as close as possible to the chip to facilitate power supply application of the chip; another method is to connect a power supply designed on the board card to an electric device, such as a hard disk, a Graphics Processing Unit (GPU) and the like, through a cable and a connector. No matter which power supply mode, the central idea of power supply design is to ensure the orderly operation of equipment, and the requirements of the voltage drop from a power supply to a chip are as small as possible, the voltage is as stable as possible, and large fluctuation does not occur.
However, when the board card is designed, the chip and other devices have the design requirements of the signal part besides the requirement of the power supply, and if the signal processing part is not provided, the existence of the power supply also loses significance. The closer the signal and the power supply are to the chip, the better the signal and the power supply are, the competitive relationship exists between the signal and the power supply, and the switch of the switching power supply can generate real-time voltage jump and needs an inductor and a capacitor to realize filtering. The existence of the jump voltage and the inductor is disadvantageous to the signal part, and if the signal is too close to the switching power supply, the signal is interfered, so the signal needs to be routed around the power supply area, which is a competitive relationship between the two. In addition, the current power supply design is the same as the chip, and the power supply is tiled on a mainboard, so that certain board card area is occupied except for the influence of the power supply on signals. The work of the power supply and the chip can generate heat loss, so that the local temperature of the board card is increased, and the problem needs to be solved by heat dissipation.
The power supply and signal design of the chip on the board card mainly includes that an externally designed power supply flows into the chip to provide working power for the chip, signals in the chip are taken out of the chip and connected with other equipment to achieve the working purpose, and the layout of the chip on the board card can be represented by using a figure 1. As shown in fig. 1, the chip is a chip requiring four power supplies to supply power, in the conventional design, the four power supplies are named as power supply 1, power supply 2, power supply 3, and power supply 4, and are arranged at the four corners of the chip, and the voltages output by the power supplies supply power to the chip from the inner layers of the boards at the four corners. The input and output signals of the chip are respectively arranged on four sides of the chip, and the power supply part is avoided during design. Fig. 1 shows that the signal portion of the chip is squeezed by the space of the power supply, and in order to ensure the signal quality, the power supply needs to be avoided, the signal needs to go out through a far path, and the power supply needs to occupy more space around the chip, which is also a limitation in space for setting the required resistance and capacitance for placing the chip around the chip.
The analysis shows that the existing mainboard chip power supply system has the following defects: the power supply has the advantages that firstly, a certain board card area is needed for placing power supply parts, and the more the number of power supplies is, the larger the current is, the larger the required area is; the second disadvantage is that the power supply generates space compression on the signal, and the problem can be solved only by increasing the number of layers of the board card under the condition that the signal cannot be switched off, so that the difficulty and the cost of the production process are increased; the power supply and the chip are arranged in a centralized manner, so that the heat is concentrated, and the requirement on higher heat dissipation is met; the designed power supply needs to be tested, the load of the power supply is influenced by the existence of the chip, the test result cannot be correctly reflected, and the chip needs to be dismantled at the moment, so that waste is caused; and the power supply test needs to weld the board card, so that the board card can not be normally used after the test, and the board card is damaged.
Disclosure of Invention
In view of this, the present invention provides a power supply system for a motherboard chip and a server including the power supply system for the motherboard chip, which are provided by the present invention, in order to solve the problems of limited planar space, easy interference of high-speed signals by a power supply, and difficult wire outgoing of signal lines in the conventional motherboard design.
According to a first aspect of the present invention, there is provided a power supply system for a motherboard chip, the power supply system for the motherboard chip comprising:
the first connector is arranged on the outer side of the mainboard, is connected with the plurality of power input terminals of the chip through internal wiring of the mainboard, and reserves a first conductive terminal corresponding to each power input terminal;
the power panel is vertically arranged with the mainboard, and a power supply corresponding to each power input terminal is arranged on the power panel;
the second connector is arranged on the side edge of the power panel, a second conductive terminal corresponding to each power supply is reserved on the second connector, and the second conductive terminals are communicated with the corresponding first conductive terminals.
In some embodiments, the power panel is further provided with a control unit, and the control unit is used for controlling the on-off and working time sequence of each power supply.
In some embodiments, the first connector is connected to each power input terminal of the chip by welding or plugging.
In some embodiments, the second connector is connected with each power supply of the power panel in a welding or plugging manner.
In some embodiments, the thickness direction of the power board is perpendicular to the heat dissipation wind direction of the main board.
In some embodiments, the chip has four power input terminals.
In some embodiments, the chip has a supply current between 5 milliamps and 40 milliamps.
In some embodiments, the chip is one of a central processing unit, a complex programmable logic chip, a baseboard management controller, and a graphics processor.
In some embodiments, the plurality of power supplies and the control unit on the power panel are arranged in parallel along the length direction of the power panel, or the plurality of power supplies and the control unit on the power panel are arranged in parallel along the width direction of the power panel.
According to a second aspect of the present invention, there is also provided a server including the power supply system for a motherboard chip described above.
The power supply system and the server for the mainboard chip at least have the following beneficial technical effects: set up first connector on the mainboard, the power supply of chip concentrates on setting up on the power strip, thereby it forms the power supply system with mainboard mutual independence to be connected through second connector and first connector, greatly reduce the demand to chip place integrated circuit board area, certain space has been released, show the discrepancy route of the chip signal line that increases, the signal trend of increase, bigger line distance can be walked to the signal, the line quality of walking of the signal of improvement, the design of power is compared and is concentrated, there is not the influence of other signal lines, the power layout will obtain certain optimization.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other embodiments can be obtained by using the drawings without creative efforts.
FIG. 1 is a schematic diagram of a power supply system of a conventional motherboard chip;
fig. 2 is a schematic overall structure diagram of a power supply system for a motherboard chip according to an embodiment of the present invention;
fig. 3 is a schematic diagram of a power board structure according to an embodiment of the present invention;
FIG. 4 is a schematic diagram of a connector structure according to an embodiment of the present invention;
FIG. 5A is a schematic diagram illustrating the relationship between chip current and temperature according to one embodiment of the present invention;
fig. 5B is a schematic diagram illustrating a relationship between chip impedance and temperature according to an embodiment of the present invention.
[ description of reference ]
10: a main board;
20: a chip;
30: a first connector;
40: a power panel; 41: a power supply; 42: a control unit;
50: a second connector.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the following embodiments of the present invention are described in further detail with reference to the accompanying drawings.
In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", and the like, indicate orientations and positional relationships based on those shown in the drawings, and are used only for convenience of description and simplicity of description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be considered as limiting the present invention.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, features defined as "first", "second", may explicitly or implicitly include one or more of the described features. In the description of the present invention, "a plurality" means two or more unless specifically defined otherwise. Furthermore, the terms "mounted," "connected," and "coupled" are to be construed broadly and may include, for example, fixed connections, removable connections, or integral connections; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
In some embodiments, referring to fig. 2, the present invention provides a power supply system for a motherboard chip, which includes the following structures:
the first connector 30 is arranged on the outer side of the motherboard 10, connected with the plurality of power input terminals of the chip 20 through internal wiring of the motherboard 10, and provided with first conductive terminals corresponding to each power input terminal;
the power panel 40 is vertically arranged with the main board 10, and a power supply 41 corresponding to each power input terminal is arranged on the power panel 40;
and the second connecting machine 50 is arranged on the side edge of the power panel 40, a second conductive terminal corresponding to each power supply 41 is reserved on the second connecting machine 50, and the second conductive terminal is communicated with the corresponding first conductive terminal.
The power supply system for the mainboard chip at least has the following beneficial technical effects: set up first connector on the mainboard, the power supply 41 of chip concentrates on setting up on the power strip, thereby it forms the power supply system with mainboard mutual independence to be connected through second connector and first connector, greatly reduce the demand to chip place integrated circuit board area, certain space has been released, show the discrepancy route of the chip signal line that increases, the signal trend of increase, bigger line spacing can be walked to the signal, the line quality of walking of the signal of improvement, the design of power is compared and is concentrated, there is not the influence of other signal lines, the power layout will obtain certain optimization.
In some embodiments, referring to fig. 3, a control unit 42 is further disposed on the power board 40, and the control unit 42 is configured to control on/off and a working timing of each power supply 41.
In some embodiments, the first connector 30 is connected to each power input terminal of the chip 20 by soldering or plugging.
In some embodiments, the second connecting device 50 is connected to each power supply 41 of the power board 40 by welding or plugging.
In some embodiments, the thickness direction of the power board 40 is perpendicular to the heat dissipation wind direction of the motherboard 10.
In some embodiments, the chip 20 has four power input terminals.
In some embodiments, the supply current for the chip 20 is between 5 milliamps and 40 milliamps.
In some embodiments, the chip 20 is one of a central processing unit, a complex programmable logic chip 20, a baseboard management controller, and a graphics processor.
In some embodiments, please refer to fig. 3, wherein the plurality of power supplies 41 and the control unit 42 on the power board 40 are arranged in parallel along the length direction of the power board 40, or the plurality of power supplies 41 and the control unit 42 on the power board 40 are arranged in parallel along the width direction of the power board 40.
In another embodiment, to facilitate understanding of the solution of the present invention, a central processing unit on a motherboard of a server may be taken as an example, without assuming that the central processing unit needs four paths of power supply currents, and no path of power supply current is 5 milliamperes, and the specific structure of the power supply system for the motherboard central processing unit of the present invention will be described in detail below:
the power supply 1, the power supply 2, the power supply 3 and the power supply 4 required by the operation of the central processing unit are designed on another board card (namely a power supply board), and the design layout is easy because only the power supply part is provided. The power supplies can be designed in parallel, a certain space is reserved on one side of the board card for enabling, and the power supplies complete the use of control parts such as signals.
The lower end of the power supply board is designed to be a plug connector or a welding connector, and the upper surface of the connector can connect the electricity on the power supply board to a mainboard where the central processing unit is located through the connector through an independent conductive terminal and a grounding terminal. The power panel is connected with the mainboard where the chip is located by using the plug-in or welding connector corresponding to the power panel on the mainboard where the central processing unit is located.
On the connector of the power strip, it will be arranged according to the structure shown in fig. 4, i.e. there are a control unit, a power input part, a power input can be shared, and an output part of a four-way power supply. The power input and each power output part is divided into a positive part and a negative part to realize a power loop. The control unit can make the number of required terminals according to implementation requirements.
The embodiment can be implemented by adopting the structure shown in fig. 2, and the connector part shown in fig. 2 is a matching connector which is connected with the power board card in fig. 3 and is connected with the connector on the main board, and the power board card and the connector can be reliably butted to realize effective connection of power and signals of the main board where the power board and the central processing unit are located.
As can be seen from fig. 2, the area occupied by the power supply portion of the cpu on the motherboard is significantly reduced, the space for signals to enter and exit the cpu is significantly improved, the routing directions of the signals are increased, and the routing distance can be shortened. This plays a desirable role for the optimization of the signal. The power panel is arranged perpendicular to the main board in the system, the direction of the power panel can be adjusted according to actual conditions, the power panel is arranged along the direction of the heat dissipation wind during installation, and the mode also improves the heat dissipation condition of the power supply to a certain extent and improves the working efficiency of the power supply.
Referring to fig. 5A and 5B, when the operating Temperature (Ambient Temperature) rises to a certain degree, the current (Iout) that the power supply can supply will be de-rated; when the Temperature (Temperature) rises, the internal resistance (Rdson) of the power supply gradually rises, and the rise of the internal resistance of the power supply causes the increase of the working loss of the power supply, thereby reducing the conversion efficiency of the power supply and causing the waste of electric energy.
The power supply system for the mainboard central processing unit of the embodiment has the following beneficial technical effects:
firstly, the requirement on the area of the board card where the chip is located is greatly reduced, and a certain space is released;
secondly, the input and output paths of the chip signal line are increased, the signal trend is increased, the signal can move at a larger line distance, and the wiring quality of the signal is improved;
thirdly, the signal wire of the chip has no level conversion influence caused by a power switch, so that the risk of interference of the signal is reduced;
fourthly, parts such as resistors, capacitors and the like designed on the periphery of the chip are placed more sufficiently and reasonably, and the design of the chip is facilitated;
fifthly, the requirement of the plate required by the power panel can be lower than that of the plate of the board card where the chip is located, so that certain cost advantage is brought;
sixthly, the design of the power supply is relatively concentrated, the influence of other signal wiring is avoided, and the power supply layout is optimized to a certain extent;
seventhly, the power supply can be closer to the chip end within a possible range through the connector, so that the voltage loss from the power supply to the chip is reduced;
eighthly, the power panel is vertically arranged, so that the heat dissipation of the power supply is facilitated, and the conversion efficiency of the power supply can be improved;
ninth, the heat dissipation condition becomes good, and better current output can be provided;
when testing the power supply, only the power supply board needs to be produced, the power supply test is completed on the power supply board, and a mainboard with high cost does not need to be used, so that the cost is saved in the test stage;
eleven, the power supply test can be completed on the power supply board, and compared with the original design, the power supply test device occupies smaller test space and is more convenient to operate;
twelfth, when the system cannot work normally due to the fact that the power supply part has a problem, only the power supply board needs to be replaced, and the system has a higher cost advantage compared with a mainboard; and the replacement of the power panel is more convenient and faster than the replacement of the main board.
According to another aspect of the present invention, there is also provided a server, where the server includes the power supply system for a motherboard chip described in the above embodiment, the power supply system for a motherboard chip includes:
the first connector is arranged on the outer side of the mainboard, is connected with the plurality of power input terminals of the chip through internal wiring of the mainboard, and reserves a first conductive terminal corresponding to each power input terminal;
the power panel is vertically arranged with the mainboard, and a power supply corresponding to each power input terminal is arranged on the power panel;
the second connector is arranged on the side edge of the power panel, a second conductive terminal corresponding to each power supply is reserved on the second connector, and the second conductive terminals are communicated with the corresponding first conductive terminals.
The server at least has the following beneficial technical effects: set up first connector on the mainboard, the power supply of chip concentrates the setting on the power strip, thereby it forms the power supply system with mainboard mutual independence with first connector to be connected through the second connector, greatly reduce the demand to chip place integrated circuit board area, certain space has been released, show the discrepancy route of the chip signal line that increases, the signal trend of increase, bigger line distance can be walked to the signal, the line quality of walking of the signal of improvement, the design of power is compared and is concentrated, there is not the influence of other signal lines, power layout will obtain certain optimization.
In some embodiments, the power panel is further provided with a control unit, and the control unit is used for controlling the on-off and working time sequence of each power supply.
In some embodiments, the first connector is connected to each power input terminal of the chip by welding or plugging.
In some embodiments, the second connector is connected with each power supply of the power panel in a welding or plugging manner.
In some embodiments, the thickness direction of the power board is perpendicular to the heat dissipation wind direction of the main board.
In some embodiments, the chip has four power input terminals.
In some embodiments, the chip has a supply current between 5 milliamps and 40 milliamps.
In some embodiments, the chip is one of a central processing unit, a complex programmable logic chip, a baseboard management controller, and a graphics processor.
In some embodiments, the plurality of power supplies and the control unit on the power panel are arranged in parallel along the length direction of the power panel, or the plurality of power supplies and the control unit on the power panel are arranged in parallel along the width direction of the power panel.
The technical features of the above embodiments can be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the above embodiments are not described, but should be considered as the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only express several embodiments of the present application, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the concept of the present application, which falls within the scope of protection of the present application. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (10)
1. A power supply system for a motherboard chip, the power supply system comprising:
the first connector is arranged on the outer side of the mainboard, is connected with the plurality of power input terminals of the chip through internal wiring of the mainboard, and reserves a first conductive terminal corresponding to each power input terminal;
the power panel is vertically arranged with the mainboard, and a power supply corresponding to each power input terminal is arranged on the power panel;
the second connector is arranged on the side edge of the power panel, a second conductive terminal corresponding to each power supply is reserved on the second connector, and the second conductive terminals are communicated with the corresponding first conductive terminals.
2. The power supply system for the motherboard chip as recited in claim 1, wherein the power board is further provided with a control unit, and the control unit is used for controlling on/off and working timing of each power supply.
3. The power supply system for motherboard chips as recited in claim 1, wherein said first connector is connected to each power input terminal of the chip by soldering or plugging.
4. The power supply system for motherboard chips as recited in claim 1, wherein said second connector is connected to each power supply of said power board by soldering or plugging.
5. The power supply system for motherboard chips as recited in claim 1, wherein a thickness direction of said power board is perpendicular to a heat dissipation wind direction of said motherboard.
6. The power supply system for a motherboard chip as recited in claim 1 wherein said chip has four power input terminals.
7. The power supply system for motherboard chips as recited in claim 1 wherein said chip supply current is between 5 milliamps and 40 milliamps.
8. The power supply system for motherboard chips of claim 1 wherein said chip is one of a central processing unit, a complex programmable logic chip, a baseboard management controller, and a graphics processor.
9. The power supply system for motherboard chips as recited in claim 2, wherein said plurality of power supplies and said control unit on said power board are arranged side by side along a length direction of said power board, or said plurality of power supplies and said control unit on said power board are arranged side by side along a width direction of said power board.
10. A server comprising the power supply system for a motherboard chip of any one of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211331973.4A CN115657831A (en) | 2022-10-28 | 2022-10-28 | Power supply system and server for mainboard chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211331973.4A CN115657831A (en) | 2022-10-28 | 2022-10-28 | Power supply system and server for mainboard chip |
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| Publication Number | Publication Date |
|---|---|
| CN115657831A true CN115657831A (en) | 2023-01-31 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202211331973.4A Pending CN115657831A (en) | 2022-10-28 | 2022-10-28 | Power supply system and server for mainboard chip |
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| Country | Link |
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| CN (1) | CN115657831A (en) |
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- 2022-10-28 CN CN202211331973.4A patent/CN115657831A/en active Pending
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