CN115657831A - A power supply system and server for motherboard chip - Google Patents

Abstract

The invention relates to the field of board hardware design, in particular to a power supply system and a server for main board chips. The system includes: a first connector, the first connector is arranged on the outside of the main board, connected to multiple power input terminals of the chip through the internal wiring of the main board, and reserves a corresponding to each power input terminal The first conductive terminal; the power board, the power board is placed vertically with the main board, and the power supply board is provided with a power supply corresponding to each power input terminal; the second connector, the second connector is arranged on On the side of the power board, a second conductive terminal corresponding to each power supply is reserved on the second connector, and the second conductive terminal communicates with the corresponding first conductive terminal. The solution of the present invention greatly reduces the requirement on the board area where the chip is located, releases a certain space, significantly increases the access path of the signal line of the chip, and optimizes the layout of the power supply to a certain extent.

Description

A power supply system and server for motherboard chip

technical field

The invention relates to the field of board hardware design, in particular to a power supply system for a motherboard chip and a server including the power supply system for a motherboard chip according to the invention.

Background technique

In hardware board design, power supply design is an indispensable part. The current power supply design layout is mainly divided into designs around the chip, such as the central processing unit (Center Processing Unit, referred to as CPU), complex programmable logic chip (Complex Programmable Logic Device, referred to as CPLD), baseboard management controller (Baseboard Management Controller, referred to as BMC), etc., this category is to design the power supply around the chip, and as close as possible to the chip, so as to facilitate the power application of the chip; there is also a The power supply designed on the board is connected to electrical equipment, such as a hard disk, a Graphics Processing Unit (GPU for short), etc., through cables and connectors. Regardless of the power supply method, the central idea of power supply design is to ensure the orderly operation of the equipment, requiring the voltage drop from the power supply to the chip to be as small as possible, and the voltage to be as stable as possible without large fluctuations.

However, in the design of boards and cards, in addition to the power supply requirements, there are also design requirements for the signal part, and if there is no signal processing part, the existence of the power supply is meaningless. The closer the signal and power are to the chip, the better. There is an actual relationship between the two, and the switching of the switching power supply will generate real-time voltage jumps, which require inductors and capacitors to achieve filtering. The existence of jump voltage and inductance is not good for the signal part. If the signal is too close to the switching power supply, there is a risk of interference. Therefore, the signal needs to be routed around the power supply area. This is where the competition between the two lies. In addition, the current power supply design is the same as the chip, which is tiled on the motherboard. In addition to its impact on the signal, it will also occupy a certain board area. The work of the power supply and chip will generate heat loss, causing the local temperature of the board to rise, which needs to be solved by heat dissipation.

The power and signal design of the chip on the board is mainly that the externally designed power flows into the chip to provide working power for the chip, and the signal in the chip goes out of the chip to connect with other devices to achieve the working purpose. Its layout on the board can be seen in Figure 1. express. As shown in Figure 1, this chip is a chip that needs four power supplies. In the existing design, the four power supplies are respectively named power supply 1, power supply 2, power supply 3, and power supply 4, and they are arranged at the four corners of the chip. position, the voltage output by the power supply supplies power to the chip from the inner layer of the board at the four corners respectively. The input and output signals of the chip are respectively on the four sides of the chip, and the power supply part should be avoided during design. It can be seen from Figure 1 that the signal part of the chip is squeezed by the space of the power supply, and in order to ensure the signal quality, the power supply needs to be avoided. The signal needs to go out through a long path, and the power supply needs to occupy more space around the chip. For the chip It is also a space limitation in terms of placing the resistors and capacitors required for chip settings around.

Based on the above analysis, it can be seen that the existing motherboard chip power supply system has the following disadvantages: Disadvantage 1, a certain board area is required to place power supply components, and the greater the number of power supplies, the greater the current, and the larger the required area; Disadvantage 2, The existence of the power supply compresses the space of the signal. When the signal cannot go away, it can only be solved by increasing the number of board layers, which increases the difficulty and cost of the production process; the third disadvantage is that the power supply and chips are placed in a centralized manner , the heat is relatively concentrated, and requires higher heat dissipation requirements; the fourth disadvantage is that the designed power supply needs to be tested, and the existence of the chip affects the load of the power supply, which cannot correctly reflect the test results. At this time, the chip needs to be removed, resulting in waste; disadvantage five, the power supply The test requires soldering of the board, so that the board cannot be used normally after the test, resulting in damage to the board.

Contents of the invention

In view of this, the present invention proposes a power supply system for mainboard chips and a Servers for the power supply system of motherboard chips.

According to the first aspect of the present invention, the present invention provides a kind of power supply system for motherboard chip, described power supply system for motherboard chip comprises:

a first connector, the first connector is arranged on the outside of the main board, is connected to a plurality of power input terminals of the chip through internal wiring of the main board, and reserves a first conductive terminal corresponding to each power input terminal;

A power board, the power board is placed vertically with the main board, and the power board is provided with a power supply corresponding to each power input terminal;

The second connector, the second connector is arranged on the side of the power supply board, and the second conductive terminal corresponding to each power supply is reserved on the second connector, and the second conductive terminal The terminals communicate with corresponding first conductive terminals.

In some embodiments, a control unit is further arranged on the power board, and the control unit is used to control the on-off and working sequence of each power supply.

In some embodiments, the first connector is connected to each power input terminal of the chip by welding or plugging.

In some embodiments, the second connector is connected to each power supply of the power board by welding or plugging.

In some embodiments, the thickness direction of the power board is perpendicular to the heat dissipation wind direction of the main board.

In some embodiments, the chip has four power input terminals.

In some embodiments, the supply current of the chip is between 5 mA and 40 mA.

In some embodiments, the chip is one of a central processing unit, a complex programmable logic chip, a baseboard management controller, and a graphics processor.

In some embodiments, the multiple power supplies on the power board and the control unit are arranged side by side along the length direction of the power board, or the multiple power supplies on the power board and the control unit are arranged along the length of the power board. The plates are arranged side by side in the width direction.

According to the second aspect of the present invention, the present invention also provides a server, which includes the above-mentioned power supply system for mainboard chips.

The above-mentioned power supply system and server for motherboard chips have at least the following beneficial technical effects: a first connector is arranged on the motherboard, and the power supply of the chip is centrally arranged on the power supply board, and then connected to the first connector through the second connector. Connectors are connected to form a power supply system independent of the main board, which greatly reduces the demand for the area of the board where the chip is located, frees up a certain amount of space, significantly increases the entry and exit paths of the chip signal line, increases the signal direction, and the signal can go Larger line spacing, improved signal routing quality, relatively centralized design of the power supply, without the influence of other signal lines, the layout of the power supply will be optimized to a certain extent.

Description of drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings that need to be used in the description of the embodiments or the prior art. Obviously, the accompanying drawings in the following description are only These are some embodiments of the present invention, and those skilled in the art can obtain other embodiments according to these drawings without any creative effort.

FIG. 1 is a schematic diagram of a power supply system of an existing motherboard chip;

FIG. 2 is a schematic diagram of the overall structure of a power supply system for motherboard chips provided by an embodiment of the present invention;

Fig. 3 is a schematic structural diagram of a power board provided by an embodiment of the present invention;

Fig. 4 is a schematic structural diagram of a connecting machine provided by an embodiment of the present invention;

FIG. 5A is a schematic diagram of the relationship between chip current and temperature provided by an embodiment of the present invention;

FIG. 5B is a schematic diagram of the relationship between chip impedance and temperature provided by an embodiment of the present invention.

[Description of Reference Signs]

10: main board;

20: chip;

30: first connector;

40: power board; 41: power supply; 42: control unit;

50: Second connector.

Detailed ways

In order to make the object, technical solution and advantages of the present invention clearer, the embodiments of the present invention will be further described in detail below in conjunction with specific embodiments and with reference to the accompanying drawings.

In describing the present invention, it is to be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", " Back", "Left", "Right", "Vertical", "Horizontal", "Top", "Bottom", "Inner", "Outer", "Clockwise", "Counterclockwise", etc. or The positional relationship is based on the orientation or positional relationship shown in the drawings, which is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, Therefore, it should not be construed as limiting the invention.

In addition, the terms "first" and "second" are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance or implicitly specifying the quantity of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of said features. In the description of the present invention, "plurality" means two or more, unless otherwise specifically defined. In addition, the terms "installation", "connection" and "connection" should be interpreted in a broad sense, for example, it can be fixed connection, detachable connection, or integral connection; it can be mechanical connection or electrical connection; it can be It can be directly connected, or indirectly connected through an intermediary, and can be internal communication between two components. Those of ordinary skill in the art can understand the specific meanings of the above terms in the present invention in specific situations.

In some embodiments, please refer to FIG. 2 , the present invention provides a power supply system for motherboard chips, which specifically includes the following structures:

The first connector 30, the first connector 30 is arranged on the outside of the main board 10, is connected to a plurality of power input terminals of the chip 20 through the internal wiring of the main board 10, and reserves a corresponding power input terminal for each power input terminal. a first conductive terminal;

A power supply board 40, the power supply board 40 is placed perpendicular to the main board 10, and the power supply board 40 is provided with a power supply 41 corresponding to each power input terminal;

The second connecting machine 50, the second connecting machine 50 is arranged on the side of the power supply board 40, and the second connecting machine 50 is reserved on the second connecting machine 50 corresponding to the second conductive terminal connected to each power supply 41, The second conductive terminal communicates with the corresponding first conductive terminal.

The above-mentioned power supply system for motherboard chips at least has the following beneficial technical effects: the first connector is arranged on the motherboard, and the power supply 41 of the chip is centrally arranged on the power supply board, and then connected to the first connector through the second connector. The connection forms a power supply system independent of the main board, which greatly reduces the demand for the area of the board where the chip is located, frees up a certain amount of space, significantly increases the access path of the chip signal line, increases the signal direction, and the signal can go further. Large line spacing, improved signal routing quality, relatively concentrated power supply design, without the influence of other signal lines, the power supply layout will be optimized to a certain extent.

In some embodiments, please refer to FIG. 3 , the power board 40 is further provided with a control unit 42 , and the control unit 42 is used to control the on-off and working sequence of each power supply 41 .

In some embodiments, the first connector 30 is connected to each power input terminal of the chip 20 by welding or plugging.

In some embodiments, the second connector 50 is connected to each power supply 41 of the power board 40 by welding or plugging.

In some embodiments, the thickness direction of the power board 40 is perpendicular to the heat dissipation wind direction of the motherboard 10 .

In some embodiments, the chip 20 has four power input terminals.

In some embodiments, the supply current of the chip 20 is between 5 mA and 40 mA.

In some embodiments, the chip 20 is one of a central processing unit, a complex programmable logic chip 20, a baseboard management controller, and a graphics processor.

In some embodiments, please continue to refer to the multiple power supply sources 41 and the control unit 42 on the power board 40 shown in FIG. A power supply 41 and the control unit 42 are arranged side by side along the width direction of the power board 40 .

In yet another embodiment, in order to facilitate the understanding of the solution of the present invention, the chip can be used as an example of the central processing unit on the motherboard of the server. It may be assumed that the central processing unit needs four power supply currents, and each power supply current is 5 milliseconds. An, the specific structure of the power supply system for the central processing unit of the mainboard of the present invention will be described in detail below:

The required power supply 1, power supply 2, power supply 3, and power supply 4 of the central processing unit work will be designed on another board (i.e. the power supply board), because only the power supply part, its design and layout will become very easy. The power supply can be designed in parallel, leaving a certain space on one side of the board for enabling, and the power supply completion signal and other control parts are used.

The lower end of the power board will be designed as a plug-in connector or a soldering connector. The connector can connect the power on the power board to the motherboard where the central processing unit is located through the connector through independent conductive terminals and grounding terminals. . On the main board where the central processing unit is located, the plugging or welding connector corresponding to the power board will be used to realize the connection between the power board and the main board where the chip is located.

On the connector of the power board, it will be set according to the structure shown in Figure 4, that is, there is a control unit, a power input part, and the power input can be shared, and the output part of the four-way power supply. Among them, the power input and each power output part are divided into a positive part and a negative part to realize a power circuit. The control unit can formulate the required number of terminals according to the realization requirements.

This embodiment can be realized by using the structure shown in Figure 2. The connector part shown in Figure 2 is the matching connector connected to the power board in Figure 3 and the connector on the main board, and the two can be reliably connected to realize The effective connection of the power supply and signal of the power supply board and the motherboard where the CPU is located.

It can be seen from Figure 2 that the area occupied by the power supply part of the central processing unit on the motherboard is significantly reduced, the space for signals entering and exiting the central processing unit is significantly improved, the routing direction of the signal is increased, and the routing distance can be shortened. This worked as expected for the optimization of the signal. The power supply board will be installed perpendicular to the main board in the system, and its direction can be adjusted according to the actual situation. When installing, it will be placed along the direction of the heat dissipation wind. This method will also improve the heat dissipation of the power supply to a certain extent, and improve the working efficiency of the power supply. .

Please combine Figure 5A and Figure 5B, when the operating temperature (Ambient Temperature) rises to a certain level, the current (Iout) that the power supply can provide will derate; when the temperature (Temperature) rises, the internal resistance of the power supply (Rdson ) will gradually increase, and the increase in the internal resistance of the power supply will increase its operating loss, thereby reducing the power conversion efficiency and resulting in waste of electric energy.

The beneficial technical effects brought by the power supply system for the central processing unit of the mainboard of the present embodiment are as follows:

First, it will greatly reduce the demand for the board area where the chip is located, freeing up a certain amount of space;

Second, the increased access path of the chip signal line, the increased signal direction, the signal can take a larger line distance, and the quality of the signal line is improved;

Three, the signal line of the chip will not be affected by the level conversion caused by the power switch, reducing the risk of signal interference;

Fourth, make the parts such as resistors and capacitors designed around the chip have a more adequate and reasonable placement, which is helpful to the design of the chip;

Fifth, the board material required for the power board can be lower than that of the board where the chip is located, thus bringing a certain cost advantage;

Sixth, the design of the power supply is relatively concentrated, without the influence of other signal routing, the layout of the power supply will be optimized to a certain extent;

Seventh, the power supply can be brought closer to the chip end through the connector to reduce the voltage loss from the power supply to the chip;

Eight, the power board is placed vertically, which is more conducive to the heat dissipation of the power supply and can improve the conversion efficiency of the power supply;

Nine, better heat dissipation can provide better current output;

10. When testing the power supply, only the power supply board needs to be produced, and the power supply test is completed on the power supply board, without using a high-cost main board, thus saving costs during the testing phase;

Eleven, the power supply test can be completed on the power supply board, which takes up less test space than the original design and is more convenient to operate;

Twelve, when there is a problem with the power supply and the system cannot work normally, you only need to replace the power board, which has a greater cost advantage than replacing the main board; and replacing the power board is more convenient and quick than replacing the main board.

According to yet another aspect of the present invention, a server is also provided, the server includes the power supply system for the motherboard chip described in the above embodiments, and the power supply system for the motherboard chip includes:

a first connector, the first connector is arranged on the outside of the main board, is connected to a plurality of power input terminals of the chip through internal wiring of the main board, and reserves a first conductive terminal corresponding to each power input terminal;

A power board, the power board is placed vertically with the main board, and the power board is provided with a power supply corresponding to each power input terminal;

The second connector, the second connector is arranged on the side of the power supply board, and the second conductive terminal corresponding to each power supply is reserved on the second connector, and the second conductive terminal The terminals communicate with corresponding first conductive terminals.

The above-mentioned server has at least the following beneficial technical effects: the first connector is arranged on the main board, the power supply of the chip is concentrated on the power board, and then connected to the first connector through the second connector so as to form an independent connection with the main board. The advanced power supply system greatly reduces the demand for the area of the board where the chip is located, frees up a certain amount of space, significantly increases the entry and exit paths of the chip signal line, increases the signal direction, and the signal can go to a larger line distance, improving the signal The quality of the wiring, the design of the power supply is relatively concentrated, without the influence of other signal lines, the layout of the power supply will be optimized to a certain extent.

In some embodiments, a control unit is further arranged on the power board, and the control unit is used to control the on-off and working sequence of each power supply.

In some embodiments, the first connector is connected to each power input terminal of the chip by welding or plugging.

In some embodiments, the second connector is connected to each power supply of the power board by welding or plugging.

In some embodiments, the thickness direction of the power board is perpendicular to the heat dissipation wind direction of the main board.

In some embodiments, the chip has four power input terminals.

In some embodiments, the supply current of the chip is between 5 mA and 40 mA.

In some embodiments, the chip is one of a central processing unit, a complex programmable logic chip, a baseboard management controller, and a graphics processor.

In some embodiments, the multiple power supplies on the power board and the control unit are arranged side by side along the length direction of the power board, or the multiple power supplies on the power board and the control unit are arranged along the length of the power board. The plates are arranged side by side in the width direction.

The technical features of the above embodiments can be combined arbitrarily. To make the description concise, all possible combinations of the technical features in the above embodiments are not described. However, as long as there is no contradiction in the combination of these technical features, they should be It is considered to be within the range described in this specification.

The above-mentioned embodiments only represent several implementation modes of the present application, and the description thereof is relatively specific and detailed, but it should not be construed as limiting the scope of the patent for the invention. It should be noted that those skilled in the art can make several modifications and improvements without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the scope of protection of the patent application should be based on the appended claims.

Claims (10)

1. A power supply system for a motherboard chip, the power supply system comprising:

the first connector is arranged on the outer side of the mainboard, is connected with the plurality of power input terminals of the chip through internal wiring of the mainboard, and reserves a first conductive terminal corresponding to each power input terminal;

the power panel is vertically arranged with the mainboard, and a power supply corresponding to each power input terminal is arranged on the power panel;

the second connector is arranged on the side edge of the power panel, a second conductive terminal corresponding to each power supply is reserved on the second connector, and the second conductive terminals are communicated with the corresponding first conductive terminals.

2. The power supply system for the motherboard chip as recited in claim 1, wherein the power board is further provided with a control unit, and the control unit is used for controlling on/off and working timing of each power supply.

3. The power supply system for motherboard chips as recited in claim 1, wherein said first connector is connected to each power input terminal of the chip by soldering or plugging.

4. The power supply system for motherboard chips as recited in claim 1, wherein said second connector is connected to each power supply of said power board by soldering or plugging.

5. The power supply system for motherboard chips as recited in claim 1, wherein a thickness direction of said power board is perpendicular to a heat dissipation wind direction of said motherboard.

6. The power supply system for a motherboard chip as recited in claim 1 wherein said chip has four power input terminals.

7. The power supply system for motherboard chips as recited in claim 1 wherein said chip supply current is between 5 milliamps and 40 milliamps.

8. The power supply system for motherboard chips of claim 1 wherein said chip is one of a central processing unit, a complex programmable logic chip, a baseboard management controller, and a graphics processor.

9. The power supply system for motherboard chips as recited in claim 2, wherein said plurality of power supplies and said control unit on said power board are arranged side by side along a length direction of said power board, or said plurality of power supplies and said control unit on said power board are arranged side by side along a width direction of said power board.

10. A server comprising the power supply system for a motherboard chip of any one of claims 1 to 9.

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