CN115647450A - A milling tool, milling equipment and temperature control method based on laser refrigeration - Google Patents
A milling tool, milling equipment and temperature control method based on laser refrigeration Download PDFInfo
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- 238000003801 milling Methods 0.000 title claims abstract description 77
- 238000005057 refrigeration Methods 0.000 title claims abstract description 43
- 238000000034 method Methods 0.000 title claims abstract description 17
- 238000001816 cooling Methods 0.000 claims abstract description 81
- 230000003287 optical effect Effects 0.000 claims abstract description 7
- 238000000960 laser cooling Methods 0.000 claims description 21
- 239000013307 optical fiber Substances 0.000 claims description 20
- 239000000463 material Substances 0.000 claims description 12
- 230000007246 mechanism Effects 0.000 claims description 11
- 238000001514 detection method Methods 0.000 claims description 9
- 230000008569 process Effects 0.000 claims description 9
- WUPHOULIZUERAE-UHFFFAOYSA-N 3-(oxolan-2-yl)propanoic acid Chemical compound OC(=O)CCC1CCCO1 WUPHOULIZUERAE-UHFFFAOYSA-N 0.000 claims description 6
- 229910052980 cadmium sulfide Inorganic materials 0.000 claims description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 2
- 239000000741 silica gel Substances 0.000 claims description 2
- 229910002027 silica gel Inorganic materials 0.000 claims description 2
- 238000005520 cutting process Methods 0.000 description 17
- 230000000694 effects Effects 0.000 description 8
- 230000033001 locomotion Effects 0.000 description 8
- 239000004065 semiconductor Substances 0.000 description 6
- 239000000835 fiber Substances 0.000 description 4
- 239000002086 nanomaterial Substances 0.000 description 4
- 239000012620 biological material Substances 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 3
- 230000007423 decrease Effects 0.000 description 3
- 238000003754 machining Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000001125 extrusion Methods 0.000 description 2
- 238000000227 grinding Methods 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 229910052761 rare earth metal Inorganic materials 0.000 description 2
- FAPWRFPIFSIZLT-UHFFFAOYSA-M Sodium chloride Chemical compound [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000033228 biological regulation Effects 0.000 description 1
- 230000003139 buffering effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000002826 coolant Substances 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 239000002173 cutting fluid Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000005283 ground state Effects 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- HIQSCMNRKRMPJT-UHFFFAOYSA-J lithium;yttrium(3+);tetrafluoride Chemical compound [Li+].[F-].[F-].[F-].[F-].[Y+3] HIQSCMNRKRMPJT-UHFFFAOYSA-J 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 150000002910 rare earth metals Chemical class 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
- 229920006268 silicone film Polymers 0.000 description 1
- 239000011780 sodium chloride Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000005728 strengthening Methods 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- 239000012780 transparent material Substances 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
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Abstract
本发明公开了一种基于激光制冷的铣削刀具及铣削设备和温控方法;该铣削刀具包括盘式铣刀和激光制冷模块。所述的激光制冷模块包括制冷组件。盘式铣刀的每个刀齿上均安装有制冷组件。制冷组件包括平面反射镜、制冷元件和凹面反射镜。所述的平面反射镜与凹面反射镜的反射面相互正对且间隔设置。凹面反射镜与平面反射镜之间形成制冷内腔。制冷元件设置在制冷内腔中。平面反射镜上开设有通孔。平面反射镜上的通孔与凹面反射镜的主光轴线错开。制冷元件的侧部设置有若干个透光窗口。本发明在制冷元件的两侧分别设置平面反射镜和凹面反射镜,使得增大制冷元件在制冷元件中经过的路径长度,从而提高对铣刀的制冷效率。
The invention discloses a milling cutter based on laser refrigeration, milling equipment and a temperature control method; the milling cutter includes a disc milling cutter and a laser refrigeration module. The laser refrigeration module includes a refrigeration assembly. A cooling unit is installed on each tooth of the disc milling cutter. The cooling assembly includes a flat reflector, a cooling element and a concave reflector. The reflection surfaces of the plane reflector and the concave reflector are opposite to each other and arranged at intervals. A cooling inner cavity is formed between the concave reflector and the plane reflector. The cooling element is arranged in the cooling inner chamber. A through hole is opened on the plane reflector. The through hole on the plane reflector is staggered with the main optical axis of the concave reflector. Several light-transmitting windows are arranged on the side of the cooling element. In the present invention, plane reflection mirrors and concave reflection mirrors are respectively arranged on both sides of the refrigeration element, so that the length of the path that the refrigeration element passes through in the refrigeration element is increased, thereby improving the cooling efficiency of the milling cutter.
Description
技术领域technical field
本发明属于刀具冷却技术领域,具体涉及一种基于激光制冷的铣削刀具及铣削设备和温 控方法。The invention belongs to the technical field of tool cooling, and in particular relates to a milling tool based on laser refrigeration, milling equipment and a temperature control method.
技术背景technical background
在聚合物及生物材料机械加工过程中,工件受到刀具的挤压发生形变,工件与刀具之间 发生摩擦,这个过程中会产生大量的切削热,如果切削热不及时排出,聚合物受热之后会发 生融化现象从而引发热变形,生物材料中的生物结构组织被破坏,刀具也会发生热磨损从而 降低刀具寿命,导致加工精度下降,极大限制了加工效率。目前切削加工中主要通过外部制 冷的手段对加工区域进行降温,例如向切削区域添加切削液或者喷入低温气体。但是芯片半 导体等超洁净零件的加工对环境的要求极高,往往不允许有杂质进入加工区域,而生物材料 切削中需要大量生理盐水浇注,会造成极大的浪费,而且昂贵的冷却液循环系统也会增加成 本。加工中的刀具冷却面临着严峻的挑战。During the mechanical processing of polymers and biomaterials, the workpiece is deformed by the extrusion of the tool, and there is friction between the workpiece and the tool. This process will generate a large amount of cutting heat. If the cutting heat is not discharged in time, the polymer will disintegrate after being heated. The melting phenomenon will cause thermal deformation, the biological structure in the biological material will be destroyed, and the tool will also undergo thermal wear, which will reduce the life of the tool, resulting in a decrease in machining accuracy, which greatly limits the machining efficiency. At present, in the cutting process, the temperature of the processing area is mainly cooled by means of external refrigeration, such as adding cutting fluid to the cutting area or spraying low-temperature gas. However, the processing of ultra-clean parts such as chips and semiconductors has extremely high requirements on the environment, and impurities are often not allowed to enter the processing area, and a large amount of saline is poured in the cutting of biological materials, which will cause great waste, and the expensive coolant circulation system It will also increase the cost. Tool cooling in machining is facing serious challenges.
加工时刀尖的温度控制具有极其重要的作用,激光制冷通过对特定材料的物质照射特定 波长的激光降低物质内原子热运动从而实现物质温度的降低。是一种清洁高效的冷却方式, 其应用前景十分广泛,但目前激光制冷应用在切削加工刀具上的研究较少。专利号: CN212665839U中采用激光照射氟化钇锂晶体或玻璃实现砂轮切削区域的单点冷却。此种方法 通过空气传播激光,空气中复杂的微粒会对激光产生未知的影响,从而影响冷却效果;另外 此发明只针对砂轮切削区域的单点冷却,外部制冷效果欠佳;而且对温度的控制没有较为具 体的方案。The temperature control of the tool tip plays an extremely important role during processing. Laser cooling reduces the thermal movement of atoms in the material by irradiating a specific material with a laser of a specific wavelength, thereby reducing the temperature of the material. It is a clean and efficient cooling method, and its application prospect is very broad, but there are few researches on laser cooling applied to cutting tools. Patent No.: CN212665839U uses laser to irradiate yttrium lithium fluoride crystal or glass to achieve single-point cooling of the cutting area of the grinding wheel. This method spreads the laser through the air, and the complex particles in the air will have an unknown effect on the laser, thereby affecting the cooling effect; in addition, this invention only targets the single-point cooling of the cutting area of the grinding wheel, and the external cooling effect is not good; and the temperature control There is no specific plan.
发明内容Contents of the invention
本发明的目的在于提供一种基于激光制冷的铣削刀具及铣削设备和温控方法,实现刀具 在切削过程中的自制冷及温度调控。The object of the present invention is to provide a milling tool based on laser refrigeration, milling equipment and temperature control method, so as to realize self-cooling and temperature control of the tool during cutting.
第一方面,本发明提供一种激光制冷的铣削刀具,其包括盘式铣刀和激光制冷模块。所 述的激光制冷模块包括制冷组件。盘式铣刀的每个刀齿上均安装有制冷组件。所述的制冷组 件包括平面反射镜、制冷元件和凹面反射镜。所述的制冷元件采用激光制冷材料。所述的平 面反射镜与凹面反射镜的反射面相互正对且间隔设置。凹面反射镜与平面反射镜之间形成制 冷内腔。制冷元件设置在制冷内腔中。平面反射镜上开设有通孔。平面反射镜上的通孔与凹 面反射镜的主光轴线错开。制冷元件的侧部设置有若干个透光窗口。工作过程中,激光从平 面反射镜上的通孔输入制冷内腔,并在平面反射镜与凹面反射镜之间往复反射。In a first aspect, the present invention provides a laser cooling milling tool, which includes a disc milling cutter and a laser cooling module. The laser refrigeration module includes a refrigeration assembly. A cooling unit is installed on each tooth of the disc milling cutter. The refrigeration assembly includes a plane reflector, a refrigeration element and a concave reflector. The refrigeration element adopts laser refrigeration material. The reflective surfaces of the plane reflector and the concave reflector are opposite to each other and arranged at intervals. A cooling cavity is formed between the concave reflector and the plane reflector. The cooling element is arranged in the cooling inner chamber. A through hole is opened on the plane reflector. The through hole on the plane reflector is staggered with the main optical axis of the concave reflector. Several light-transmitting windows are arranged on the side of the cooling element. During the working process, the laser light enters the cooling inner cavity through the through hole on the plane reflector, and is reciprocally reflected between the plane reflector and the concave reflector.
作为优选,所述的激光制冷模块还包括光电滑环、光电混合缆和反射镜片。反射镜片固 定在平面反射镜远离凹面反射镜的一侧。反射镜片的反射面倾斜朝向盘式铣刀的中心轴线; 光电混合缆的一端与光电滑环连接。光电混合缆的另一端固定在盘式铣刀上,且出光孔朝向 沿盘式铣刀的径向设置。从光电混合缆的出光孔射出的激光经反射镜片反射后射入平面反射 镜上的通孔。工作过程中,外部输入的激光经电滑环、光电混合缆、反射镜片射入制冷内腔。Preferably, the laser refrigeration module further includes a photoelectric slip ring, a photoelectric hybrid cable and a reflector. The reflector is fixed on the side of the plane reflector away from the concave reflector. The reflective surface of the reflective lens is inclined towards the central axis of the disc milling cutter; one end of the photoelectric hybrid cable is connected with the photoelectric slip ring. The other end of the photoelectric hybrid cable is fixed on the disc milling cutter, and the light exit hole is oriented radially along the disc milling cutter. The laser light emitted from the light exit hole of the photoelectric hybrid cable is reflected by the reflector and then enters the through hole on the plane reflector. During the working process, the laser input from the outside is injected into the cooling inner cavity through the electric slip ring, the photoelectric hybrid cable and the reflector.
作为优选,所述的激光制冷模块还包括温度检测组件。所述的温度检测组件包括红外接 收器和红外光通道。红外光通道设置在制冷组件的侧部。红外接收器设置在红外光通道的端 部,并朝向对应的刀齿。红外接收器的信号线经光电混合缆和光电滑环引出。Preferably, the laser refrigeration module further includes a temperature detection component. The temperature detection component includes an infrared receiver and an infrared light channel. The infrared light channel is arranged on the side of the cooling assembly. The infrared receiver is arranged at the end of the infrared light channel, and faces the corresponding knife tooth. The signal line of the infrared receiver is led out through the photoelectric hybrid cable and the photoelectric slip ring.
作为优选,所述光电混合缆的中部凸向靠近盘式铣刀中心轴线的一侧。Preferably, the middle part of the photoelectric hybrid cable protrudes to a side close to the central axis of the disc milling cutter.
作为优选,所述凹面反射镜的采用球面凹面镜。Preferably, the concave reflector adopts a spherical concave mirror.
作为优选,所述的凹面反射镜与对应的刀齿之间设置有导热层。导热层采用柔性导热硅 胶片。Preferably, a heat conduction layer is arranged between the concave reflector and the corresponding knife teeth. The heat conduction layer adopts the flexible heat conduction silicone film.
作为优选,所述的激光制冷材料采用纳米硫化镉。Preferably, the laser refrigeration material adopts nanometer cadmium sulfide.
第二方面,本发明提供一种激光制冷的铣削设备,其包括机架、工作台、铣削驱动机构、 前述的铣削刀具、夹具、激光发射器和控制模块。工作台和铣削驱动机构均安装在机架上。 夹具安装在工作台上。盘式铣刀安装在铣削驱动机构的主轴上。铣削驱动机构上设置有用于 安装主轴的主轴支座。光电滑环安装在主轴支座与主轴之间。红外接收器的信号线经光电滑 环连接至控制模块;激光发射器输出的激光经输入光纤和光电滑环传输至各制冷组件。激光 发射器由控制模块控制。In a second aspect, the present invention provides a laser cooling milling device, which includes a frame, a workbench, a milling drive mechanism, the aforementioned milling tool, a fixture, a laser emitter and a control module. Both the table and the milling drive mechanism are mounted on the frame. The jig is installed on the table. The disc milling cutter is mounted on the spindle of the milling drive. The milling drive is provided with a spindle support for mounting the spindle. The photoelectric slip ring is installed between the main shaft support and the main shaft. The signal line of the infrared receiver is connected to the control module through the photoelectric slip ring; the laser output from the laser transmitter is transmitted to each refrigeration component through the input optical fiber and the photoelectric slip ring. The laser transmitter is controlled by the control module.
作为优选,所述的输入光纤采用掺铒光纤。Preferably, the input optical fiber is an erbium-doped optical fiber.
第三方面,本发明提供一种激光制冷的铣削刀具在铣削过程中的温控方法,其具体如下:In a third aspect, the present invention provides a temperature control method for a laser-cooled milling tool during milling, which is specifically as follows:
使用盘式铣刀对工件进行铣削,盘式铣刀的刀齿温度升高;激光射入凹面反射镜与平面 反射镜之间的制冷内腔,并在平面反射镜与凹面反射镜之间往复反射。制冷元件受激光照射 产生的反斯托克斯荧光通过透光窗口射出带走热量,刀齿的温度降低。红外接收器检测刀齿 辐射出的红外线强度,获得刀齿的温度;当测得的温度大于预设范围的上限时,提高激光功 率和/或减小激光波长。当测得的温度小于预设范围的下限时,降低激光功率和/或增大激光波 长。The workpiece is milled with a disc milling cutter, and the temperature of the teeth of the disc milling cutter rises; the laser is injected into the cooling cavity between the concave reflector and the plane reflector, and reciprocates between the plane reflector and the concave reflector reflection. The anti-Stokes fluorescence produced by the cooling element irradiated by the laser emits through the light-transmitting window to take away heat, and the temperature of the cutter tooth decreases. The infrared receiver detects the infrared intensity radiated by the blade teeth to obtain the temperature of the blade teeth; when the measured temperature is greater than the upper limit of the preset range, the laser power is increased and/or the laser wavelength is reduced. When the measured temperature is less than the lower limit of the preset range, reduce the laser power and/or increase the laser wavelength.
本发明具有的有益效果为:The beneficial effects that the present invention has are:
1、本发明通过特定波长的激光照射半导体纳米材料激发反斯托克斯荧光降低刀头温度; 并且,本发明在制冷元件的两侧分别设置平面反射镜和凹面反射镜,使得增大制冷元件在制 冷元件中经过的路径长度,提高了对铣刀的制冷效率;从而提供了一种高效、无振动、清洁 无污染的刀具冷却方式。1. The present invention irradiates semiconductor nanomaterials with specific wavelengths of laser light to excite anti-Stokes fluorescence to reduce the temperature of the cutter head; and, the present invention sets plane reflectors and concave reflectors on both sides of the cooling element, so that the size of the cooling element increases. The length of the path passed in the refrigeration element improves the cooling efficiency of the milling cutter; thereby providing an efficient, vibration-free, clean and pollution-free tool cooling method.
2、本发明在制冷内腔的侧面开设有透光窗口,在不影响刀具切割强度的情况下可以将带 有热量的反斯托克斯荧光从刀具内部带走。2. The present invention has a light-transmitting window on the side of the cooling inner cavity, which can take away the anti-Stokes fluorescence with heat from the inside of the cutter without affecting the cutting strength of the cutter.
3、本发明通过红外接收器分别检测每个刀齿辐射出的红外光线,实现对刀齿温度的检测, 并通过调节激光功率和波长的方式调节制冷效果的强弱,实现对铣刀加工温度的低延迟控制, 并能够及时发现和排除某刀齿上的制冷系统发生的故障,防止刀具因温度不均衡而产生过度 磨损。3. The present invention respectively detects the infrared rays radiated by each tooth through an infrared receiver to detect the temperature of the tooth, and adjusts the strength of the cooling effect by adjusting the laser power and wavelength to realize the processing temperature of the milling cutter. The low-latency control can detect and eliminate the failure of the refrigeration system on a certain cutter tooth in time to prevent excessive wear of the cutter due to temperature imbalance.
4、本发明采用II-VI族半导体纳米材料硫化镉作为激光制冷材料,其在-173℃的低温条 件下仍然可以通过532nm的激光照射继续降低温度,能够有效进行铣刀的制冷。此外,本发 明通过掺稀土元素铒Er3+的增益光纤将激光传输到激光制冷模块,该增益光纤具有稳定的传 输效率以及激光增益效果,可以增加制冷效率。4. The present invention adopts cadmium sulfide, a II-VI group semiconductor nanomaterial, as the laser refrigeration material, which can still continue to reduce the temperature by 532nm laser irradiation under the low temperature condition of -173°C, and can effectively cool the milling cutter. In addition, the present invention transmits the laser light to the laser cooling module through the gain fiber doped with rare earth element Er3+, the gain fiber has stable transmission efficiency and laser gain effect, and can increase the cooling efficiency.
附图说明Description of drawings
图1为本发明的结构示意图。Fig. 1 is a structural schematic diagram of the present invention.
图2为本发明中制冷组件和温度检测组件的安装示意图。Fig. 2 is a schematic diagram of the installation of the refrigeration assembly and the temperature detection assembly in the present invention.
图3为本发明的温度控制流程图。Fig. 3 is a temperature control flow chart of the present invention.
具体实施方式Detailed ways
下面结合附图对本发明作进一步描述。The present invention will be further described below in conjunction with the accompanying drawings.
如图1所示,一种基于激光制冷的铣削设备,包括机架、工作台、铣削驱动机构、盘式铣刀5、夹具6、激光制冷模块和控制模块10。工作台和铣削驱动机构均安装在机架上。夹具6安装在工作台上,用于装夹工件。盘式铣刀5安装在铣削驱动机构的主轴上,其能够在铣削驱动机构的驱动下进行旋转和移动。铣削驱动机构上设置有用于安装主轴的主轴支座7。As shown in FIG. 1 , a milling device based on laser cooling includes a frame, a workbench, a milling drive mechanism, a
激光制冷模块包括光纤接头1、光电滑环2、输入光纤3、光电混合缆4、激光发射器9、 制冷组件和温度检测组件。输入光纤3采用掺铒光纤。光纤接头1固定在主轴支座7上。光电滑环2的固定部与主轴支座7固定。光电滑环2的转动部与主轴固定。光电滑环2的固定 部设有一个进光口,转动部设有n个出光口。n为盘式铣刀5的刀齿19数量;光电滑环2上 的所有出光口均与进光口导通。光电滑环2的进光口与激光发射器9的激光输出接口通过光 纤接头1和输入光纤3连接。控制模块10包括控制器和激光信号发生器。激光信号发生器的 信号输出接口与激光发射器9的控制接口连接。控制器通过激光信号发生器调节激光发射器9输出的激光强度和波长。The laser cooling module includes an
如图2所示,盘式铣刀5的每个刀齿19的顶部均安装有制冷组件和温度检测组件。n个制冷组件与光电滑环2的n个出光口通过n根光电混合缆4的光传输芯线分别连接。制冷组件包括激光发射孔11、反射镜片13、平面反射镜15、制冷元件16、透光窗口17、导热层18、刀齿19和凹面反射镜20。As shown in FIG. 2 , a refrigeration component and a temperature detection component are installed on the top of each
制冷元件16采用激光制冷材料,其在特定的发射波长的激光照射下能够释放荧光并降低 温度。导热层18采用柔性导热硅胶片。激光制冷材料为半导体纳米材料硫化镉。本实施例中, 半导体纳米材料硫化镉具体为II-VI族半导体纳米硫化镉材料,其发射波长为500~550nm。The
凹面反射镜20的采用球面凹面镜;凹面反射镜20的背面与盘式铣刀5上对应的刀齿19 的顶面通过导热层18固定。凹面反射镜20的内凹反射面朝向正上方。反射面朝下设置的平 面反射镜15固定在盘式铣刀5上,且位于凹面反射镜20的正上方。凹面反射镜20与平面反 射镜15之间形成制冷内腔。制冷元件16设置在制冷内腔中。平面反射镜15的中部开设有通 孔。平面反射镜15上的通孔与凹面反射镜20的主光轴线错开,使得从平面反射镜15上的通 孔射入的激光不会在凹面反射镜20经一次反射后直接从平面反射镜15上的通孔射出。制冷 元件16的侧部设置有一个或多个透光窗口17,同时不会影响刀齿的切割强度。透光窗口17 用于释放制冷元件16在激光照射下产生的荧光,从而释放热量。The
采用透明材料的光纤连接块固定在平面反射镜的顶面。反射镜片13设置在光纤连接块的 内部。反射镜片13的反射面倾斜朝向盘式铣刀5,且与水平面呈45°夹角;光电混合缆4与 对应的光纤连接块固定,且出光孔10朝向沿盘式铣刀5的径向设置,并朝向反射镜片13的 反射面。从光电混合缆4的出光孔10射出的激光经反射镜片13反射后射入平面反射镜15上 的通孔。反射镜片13反射出的激光平行于凹面反射镜20的主光轴线。An optical fiber connection block of transparent material is fixed on the top surface of the flat reflector. The
光电混合缆4的输入端竖直朝上设置,输出端沿盘式铣刀的径向朝外设置,中部凸向靠 近盘式铣刀中心轴线的一侧。在盘式铣刀高速转动的过程中,凸向内侧的光电混合缆4能够 利用自身弹性抵消离心作用的影响,提高激光制冷模块的稳定性。The input end of the
工作过程中,激光发射头9射出的激光经输入光纤3、光纤接头1、光电滑环2、光电混 合缆4和反射镜片将进入到制冷内腔。进入制冷内腔的入射激光(实线部分)穿过制冷元件。 制冷元件受到激光照射后会产生制冷效果;激光在制冷腔内的平/凹面镜组合之间会多次反射 (虚线部分)激光以增强制冷效率。制冷元件受激光照射产生的反斯托克斯荧光通过透光窗 口17射出带走热量,从而实现对刀齿的制冷作用。During the working process, the laser emitted by the laser emitting head 9 will enter the cooling inner cavity through the input
温度检测组件包括红外接收器12和红外光通道14。红外光通道14设置在制冷组件的侧 部。红外接收器12固定在光电混合缆4侧部,并与红外光通道14的端部对齐。红外接收器 12通过红外光通道14朝向刀齿19,采集刀齿19辐射出的红外线,从而实现对刀齿19的温度检测。各红外接收器12的信号输出接口分别通过对应的光电混合缆4中的电芯线、光电滑环2的电传输接口和温度信号传输线缆8连接至控制模块10的控制器。控制器根据红外接收器12输出的电信号获得各刀齿的温度,从而调节激光发射器发出的激光波长。The temperature detection component includes an
本发明的具体实施过程如下:Concrete implementation process of the present invention is as follows:
控制模块10激发出500~550nm波长的激光;该激光由激光发射器9射出,激光通过输 入光纤3照射到光纤接头1;输入光纤3可以稳定地传输激光,同时激光在传输的过程中由于 输入光纤3中稀土介质的吸收,入射光所携带的能量将介质中的电子激发到较高的能级,会 发生弛豫现象。电子从高能级跃迁到基态而释放能量,发射出光子,使光子流得到增强,制 冷效率得到提升。激光从光电混合缆的出光孔射出后照射到反射镜片13,入射激光被反射到 制冷元件16。制冷元件16受到特定波长的激光照射之后,其中的原子的热运动会受到激光中 的光子阻碍作用,其温度会下降。入射激光照射到制冷元件底部的凹透镜17时会反射至其上 方的平面镜13,如此多次反射增加激光照射距离,激光制冷效率得到增强。同时制冷元件16 会激发出小于入射激光波长的反斯托克斯荧光,荧光经由透光窗口17射出从而带走热量。制 冷元件产生的冷量通过导热层18传递到刀齿19,从而实现对刀齿19的制冷。同时,柔性材 质的导热层18在刀齿19进行切削作业时能够对制冷元件16起到缓冲保护作用。The
制冷元件16产生制冷效果的过程和条件如下:The process and conditions for
1、制冷元件吸收光子以及热弛豫(吸收热量):激光光子与制冷元件中的热运动波长相 同的原子会结合在一起。1. The cooling element absorbs photons and thermally relaxes (absorbs heat): the atoms with the same wavelength as the laser photon and the thermal motion in the cooling element will combine together.
2、制冷元件自发辐射出荧光光子以及热弛豫(释放热量):原子从而发生能级跃迁,自 身运动速度下降,随后光子向原子运动的反方向射出,同时作用到原子一个反方向的冲量, 原子的运动速度进一步下降,制冷元件内部的原子热运动速度下降。2. The refrigeration element spontaneously radiates fluorescent photons and thermal relaxation (release heat): the atoms undergo energy level transitions, their own motion speed decreases, and then the photons are emitted to the opposite direction of the atomic motion, and at the same time act on an impulse in the opposite direction of the atom. The movement speed of the atoms is further reduced, and the heat movement speed of the atoms inside the cooling element is reduced.
3、制冷元件吸收一个能量为hν的激光光子,放出平均能量为hνf的荧光光子,带走了hνf-hν的热能,其中,hνf为荧光辐射的平均能量,每次制冷循环过程的制冷功率Pcool为:3. The cooling element absorbs a laser photon with energy hν, emits a fluorescent photon with an average energy of hν f , and takes away the heat energy of hν f -hν, where hν f is the average energy of fluorescent radiation, and each refrigeration cycle process The cooling power P cool is:
其中,Pabs为共振吸收功率密度。λ为入射光波长,λf为反射的荧光波长,而当入射光波 长大于荧光平均波长,即λ>λf时,才能实现激光制冷。Among them, P abs is the resonant absorbed power density. λ is the wavelength of the incident light, λ f is the wavelength of the reflected fluorescence, and when the wavelength of the incident light is greater than the average wavelength of the fluorescence, that is, λ>λ f , laser cooling can be realized.
反射出的反斯托克斯荧光通过刀具的透光窗口射出从而带走制冷元件中的热量。The reflected anti-Stokes fluorescence is emitted through the light-transmitting window of the cutter to remove heat from the cooling element.
如图3所示,该基于激光制冷的铣削设备在铣削过程中进行温度控制的方法,具体如下:As shown in Figure 3, the method for controlling the temperature of the milling equipment based on laser cooling during the milling process is as follows:
温度控制过程:随着切削作业的进行,刀齿19因与工件摩擦挤压而发热,刀齿19会辐 射出热红外线,红外线的能量与刀齿19的温度相关,不同温度下红外光线的能量会发生变化。Temperature control process: As the cutting operation progresses, the
输入预设温度T0,将预设温度T0作为刀齿19的温度基准,然后开始切削加工作业。Input the preset temperature T0, use the preset temperature T0 as the temperature reference of the
随着切削作业的进行,刀齿19会产生切削热温度升高,其产生的红外光线通过透光孔14 照射至安装在光电混合缆4下部的红外接收器12(点画线部分),红外接收器12接收到由刀 齿19辐射出的红外光线后会将光信号转换为电信号。Along with the carrying out of cutting operation,
随后光电混合缆将电信号传输至集成在控制模块10中的信号处理模块,经过对信号的处 理之后得出刀齿19当前的温度。当刀齿19的温度超过预设值一定范围时,控制模块开始进 行温度调节。Then the photoelectric hybrid cable transmits the electric signal to the signal processing module integrated in the
当温度过高时,首先提高激光功率,加强激光制冷的效率,同时降低激光波长。加强激 光功率能够显著地降低温度,同时由于制冷元件的温度上升,其内部原子热运动速度增加, 其波长相比之前较短,此时需要降低激光波长来激发更多的荧光以降低温度。When the temperature is too high, first increase the laser power to enhance the efficiency of laser cooling, while reducing the laser wavelength. Strengthening the laser power can significantly reduce the temperature. At the same time, due to the temperature rise of the cooling element, the thermal motion speed of the internal atoms increases, and its wavelength is shorter than before. At this time, it is necessary to reduce the laser wavelength to excite more fluorescence to reduce the temperature.
若刀齿的温度过低,较低温度的刀齿在切削过程中容易发生应力损伤,故此时通过调节 控制模块使刀齿温度升高,此时只降低入射激光的功率,制冷元件的温度缓慢回升。If the temperature of the cutter teeth is too low, the lower temperature cutter teeth are prone to stress damage during the cutting process. Therefore, at this time, the temperature of the cutter teeth is increased by adjusting the control module. At this time, only the power of the incident laser is reduced, and the temperature of the cooling element slows down. pick up.
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