CN115632631B - Film acoustic wave filter with good heat dissipation effect - Google Patents
Film acoustic wave filter with good heat dissipation effect Download PDFInfo
- Publication number
- CN115632631B CN115632631B CN202211567859.1A CN202211567859A CN115632631B CN 115632631 B CN115632631 B CN 115632631B CN 202211567859 A CN202211567859 A CN 202211567859A CN 115632631 B CN115632631 B CN 115632631B
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- film acoustic
- heat dissipation
- gear
- acoustic filter
- packaging shell
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/02007—Details of bulk acoustic wave devices
- H03H9/02015—Characteristics of piezoelectric layers, e.g. cutting angles
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/02007—Details of bulk acoustic wave devices
- H03H9/02047—Treatment of substrates
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/02007—Details of bulk acoustic wave devices
- H03H9/02086—Means for compensation or elimination of undesirable effects
- H03H9/02102—Means for compensation or elimination of undesirable effects of temperature influence
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/46—Filters
- H03H9/54—Filters comprising resonators of piezo-electric or electrostrictive material
- H03H9/56—Monolithic crystal filters
- H03H9/564—Monolithic crystal filters implemented with thin-film techniques
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/46—Filters
- H03H9/54—Filters comprising resonators of piezo-electric or electrostrictive material
- H03H9/58—Multiple crystal filters
- H03H9/582—Multiple crystal filters implemented with thin-film techniques
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20136—Forced ventilation, e.g. by fans
- H05K7/20145—Means for directing air flow, e.g. ducts, deflectors, plenum or guides
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20136—Forced ventilation, e.g. by fans
- H05K7/20172—Fan mounting or fan specifications
Abstract
The invention relates to a film acoustic filter with good heat dissipation effect, which comprises the following components: the thin film acoustic wave filter body is formed by sequentially laminating a substrate, a bottom electrode, a multi-element compound concentration doped multi-level piezoelectric layer, a top electrode and a passivation layer, wherein the multi-element compound concentration doped multi-level piezoelectric layer is made of piezoelectric materials of aluminum nitride doped with scandium element, magnesium element and titanium element, the thin film acoustic wave filter body is located in a packaging shell, one end of a binding post is connected with the thin film acoustic wave filter body, the other end of the binding post extends out of the packaging shell, the binding post is connected with the top end of the packaging shell, and a heat radiating device is arranged in the packaging shell. The second air plates and the fans form three-dimensional surrounding, and the air speed and the air direction are changed continuously to blow, so that air cooling and heat dissipation can be carried out on all directions and positions of the film acoustic filter body.
Description
Technical Field
The invention belongs to the technical field of filters, and particularly relates to a film acoustic wave filter with a good heat dissipation effect.
Background
The filter is a filter circuit composed of a capacitor, an inductor and a resistor. The filter can effectively filter the frequency points of the specific frequency or the frequencies outside the frequency points in the power line to obtain a power signal of the specific frequency or eliminate the power signal of the specific frequency. In recent years, with the continuous development of electronic technology, thin film filters have been increasingly used. When the existing film filter is used, a large amount of heat can be generated, and if the heat cannot be timely dissipated, the normal performance of the film acoustic wave filter can be influenced, and even the film acoustic wave filter is burnt.
Disclosure of Invention
Therefore, the invention aims to solve the problems that when the film filter in the prior art is used, a large amount of heat is generated, and if the heat cannot be timely dissipated, the normal performance of the film acoustic filter is affected, and even the film acoustic filter is burnt.
Therefore, the technical scheme adopted by the invention is that the film acoustic filter with good heat dissipation effect comprises: the thin film acoustic wave filter body is formed by sequentially laminating a substrate, a bottom electrode, a multi-element compound concentration doped multi-level piezoelectric layer, a top electrode and a passivation layer, wherein the multi-element compound concentration doped multi-level piezoelectric layer is made of piezoelectric materials of aluminum nitride doped with scandium element, magnesium element and titanium element, the thin film acoustic wave filter body is located in a packaging shell, one end of a binding post is connected with the thin film acoustic wave filter body, the other end of the binding post extends out of the packaging shell, the binding post is connected with the top end of the packaging shell, and a heat radiating device is arranged in the packaging shell.
Preferably, the heat dissipating device includes: the device comprises a motor, a first rotating shaft, a first triangular plate, a second triangular plate, a first through hole, a second through hole, a first L-shaped rod, a first air plate, a second rotating shaft and a fan;
the encapsulation casing diapire is provided with the motor, the motor output shaft upwards is connected with first pivot one end, the first pivot other end is connected with the center of first set square, first set square horizontal direction sets up, the vertical direction of second set square sets up, the triangle department of first set square is provided with first through-hole respectively, the triangle department of second set square is provided with the second through-hole respectively, first L shape pole one end passes first through-hole and is connected with first aerofoil, first L shape pole other end passes the second through-hole and is connected with the second aerofoil, second pivot horizontal direction sets up, second pivot one end is connected with the center department of second set square, the second pivot other end is connected with the fan, the fan is located film acoustic wave filter body side.
Preferably, the first rotating shaft is coaxially provided with a first gear, the first gear is meshed with the second gear, one end of the third rotating shaft is coaxially connected with the second gear, the other end of the third rotating shaft penetrates through the fixed block to be coaxially connected with the third gear, the third rotating shaft is rotationally connected with the fixed block, the fixed block is connected with the inner wall of the packaging shell, the first rotating shaft is sleeved with a first sleeve, the first rotating shaft is rotationally connected with the first sleeve, the first sleeve is located above the first gear, the outer wall of the lower end of the first sleeve is coaxially provided with a fourth gear, the third gear is meshed with the fourth gear, the second rotating shaft is sleeved with a second sleeve, the second rotating shaft is rotationally connected with the second sleeve, one end of the connecting arm is connected with the outer wall of the upper end of the first sleeve, and the other end of the connecting arm is connected with the outer wall of the second sleeve.
Preferably, an opening is arranged on the outer wall of the packaging shell.
Preferably, a dust filter is arranged on the opening.
Preferably, a temperature sensor is arranged on the inner wall of the packaging shell, the temperature sensor is electrically connected with a controller, and the controller is electrically connected with the motor.
Preferably, a maintenance port is arranged on the outer wall of the packaging shell.
Preferably, the maintenance port is provided with a sealing plate, and the sealing plate is connected with the outer wall of the packaging shell through screws.
Preferably, a warning lamp is arranged on the outer wall of the packaging shell and is electrically connected with the controller.
Preferably, the controller is in wireless communication with the user terminal.
The technical scheme of the invention has the following advantages: the invention relates to a film acoustic filter with good heat dissipation effect, which comprises the following components: the thin film acoustic wave filter body is formed by sequentially laminating a substrate, a bottom electrode, a multi-element compound concentration doped multi-level piezoelectric layer, a top electrode and a passivation layer, wherein the multi-element compound concentration doped multi-level piezoelectric layer is made of piezoelectric materials of aluminum nitride doped with scandium element, magnesium element and titanium element, the thin film acoustic wave filter body is located in a packaging shell, one end of a binding post is connected with the thin film acoustic wave filter body, the other end of the binding post extends out of the packaging shell, the binding post is connected with the top end of the packaging shell, and a heat radiating device is arranged in the packaging shell. The three-dimensional surrounding is formed by the plurality of second air plates and the fans, and the air speed and the air direction are constantly changed to blow so as to cool and dissipate heat in an air way in all directions and at all positions of the film acoustic wave filter body, and ensure that the film acoustic wave filter body is in a normal working temperature range.
Additional features and advantages of the invention will be set forth in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. The objectives and other advantages of the invention may be realized and attained by the structure particularly pointed out in the written description and drawings.
The technical scheme of the invention is further described in detail through the drawings and the embodiments.
Drawings
The accompanying drawings are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate the invention and together with the embodiments of the invention, serve to explain the invention. In the drawings:
FIG. 1 is a schematic view of a structure of a thin film acoustic filter body according to the present invention
FIG. 2 is a schematic diagram of the structure of the present invention;
FIG. 3 is an enlarged view at A of FIG. 2;
FIG. 4 is a schematic view of the first triangle of the present invention;
the high-voltage power source comprises a 1-film acoustic wave filter body, a 101-substrate, a 102-bottom electrode, a 103-multi-element compound concentration doped multi-level piezoelectric layer, a 104-top electrode, a 105-passivation layer, a 2-packaging shell, a 3-binding post, a 4-motor, a 5-first rotating shaft, a 6-first triangular plate, a 7-second triangular plate, an 8-first through hole, a 9-second through hole, a 10-first L-shaped rod, an 11-first air plate, a 12-second air plate, a 13-second rotating shaft, a 14-fan, a 15-first gear, a 16-second gear, a 17-third rotating shaft, an 18-fixed block, a 19-third gear, a 20-first sleeve, a 21-fourth gear, a 22-second sleeve, a 23-connecting arm, a 24-opening, a 25-dust filter net, a 26-temperature sensor, a 27-controller, a 28-maintenance opening, a 29-sealing plate and a 30-warning lamp.
Detailed Description
In order to make the technical problems, technical schemes and beneficial effects to be solved more clear, the invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the scope of the invention.
It will be understood that when an element is referred to as being "mounted" or "disposed" on another element, it can be directly on the other element or be indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly or indirectly connected to the other element.
It is to be understood that the terms "length," "width," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like are merely for convenience in describing and simplifying the description based on the orientation or positional relationship shown in the drawings, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus are not to be construed as limiting the invention.
Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature. In the description of the present invention, the meaning of "a plurality" is two or more, unless explicitly defined otherwise.
The invention provides a film acoustic filter with good heat dissipation effect, as shown in figures 1-4, comprising: the thin film acoustic filter body 1, the thin film acoustic filter body 1 is formed by sequentially stacking a substrate 101, a bottom electrode 102, a multi-element compound concentration doped multi-level piezoelectric layer 103, a top electrode 104 and a passivation layer 105, wherein the multi-element compound concentration doped multi-level piezoelectric layer 103 is made of piezoelectric materials doped with scandium element, magnesium element and titanium element and aluminum nitride, the thin film acoustic filter body 1 is located in a packaging shell 2, one end of a binding post 3 is connected with the thin film acoustic filter body 1, the other end of the binding post 3 extends out of the packaging shell 2, the binding post 3 is connected with the top end of the packaging shell 2, and a heat radiating device is arranged in the packaging shell 2.
The heat dissipating device includes: the motor 4, the first rotating shaft 5, the first triangular plate 6, the second triangular plate 7, the first through hole 8, the second through hole 9, the first L-shaped rod 10, the first air plate 11, the second air plate 12, the second rotating shaft 13 and the fan 14;
the encapsulation casing 2 diapire is provided with motor 4, motor 4 output shaft upwards is connected with first pivot 5 one end, the center connection of first pivot 5 other end and first set square 6, first set square 6 horizontal direction sets up, the vertical direction of second set square 7 sets up, the triangle department of first set square 6 is provided with first through-hole 8 respectively, the triangle department of second set square 7 is provided with second through-hole 9 respectively, first L shape pole 10 one end passes first through-hole 8 and is connected with first aerofoil 11, the first L shape pole 10 other end passes second through-hole 9 and is connected with second aerofoil 12, second pivot 13 horizontal direction sets up, second pivot 13 one end is connected with the center department of second set square 7, the second pivot 13 other end is connected with fan 14, fan 14 is located film acoustic wave filter body 1 side.
The first rotating shaft 5 is coaxially provided with a first gear 15, the first gear 15 is meshed with a second gear 16, one end of a third rotating shaft 17 is coaxially connected with the second gear 16, the other end of the third rotating shaft 17 penetrates through a fixed block 18 to be coaxially connected with a third gear 19, the third rotating shaft 17 is rotationally connected with the fixed block 18, the fixed block 18 is connected with the inner wall of the packaging shell 2, the first rotating shaft 5 is sleeved with a first sleeve 20, the first rotating shaft 5 is rotationally connected with the first sleeve 20, the first sleeve 20 is positioned above the first gear 15, the outer wall of the lower end of the first sleeve 20 is coaxially provided with a fourth gear 21, the third gear 19 is meshed with the fourth gear 21, the second rotating shaft 13 is sleeved with a second sleeve 22, the second rotating shaft 13 is rotationally connected with the second sleeve 22, one end of a connecting arm 23 is connected with the outer wall of the upper end of the first sleeve 20, and the other end of the connecting arm 23 is connected with the outer wall of the second sleeve 22.
The technical scheme has the working principle and beneficial technical effects that: the motor 4 is started to drive the first triangular plate 6 to rotate, the second triangular plate 7 is driven to rotate through the three first L-shaped rods 10, meanwhile, the three first L-shaped rods 10 alternately move along the horizontal direction and the vertical direction, the second air plates 12 at the vertical end of the first L-shaped rods 10 are driven to move up and down in a staggered mode and rotate at the same time, the second air plates 12 at the horizontal end of the first L-shaped rods 10 rotate and reciprocate along the horizontal direction, in addition, the second rotating shaft 13 drives the fan 14 to rotate, in addition, the first sleeve 20 is driven to rotate through the meshing of the first gear 15, the second gear 16 and the third gear 19 with the fourth gear 21, the first sleeve 20 drives the connecting arm 23 to rotate around the first rotating shaft 5, the fan 14 is driven to rotate continuously, three-dimensional surrounding air flows are formed through the plurality of second air plates 12 and the fan 14, and air blowing with the air speed and the air direction changing continuously can be carried out on all directions and positions of the film acoustic wave filter body 1, and the film acoustic wave filter body 1 can be ensured to be cooled normally within the working temperature range of the film acoustic wave filter body 1.
In one embodiment, the outer wall of the package housing 2 is provided with an opening 24, and the opening 24 is provided with a dust filtering net 25, so as to reduce dust entering the package housing 2.
In one embodiment, a temperature sensor 26 is disposed on the inner wall of the package housing 2, the temperature sensor 26 is electrically connected to a controller 27, and the controller 27 is electrically connected to the motor 4. The temperature sensor 26 can detect the temperature value in the package 2, and when the temperature value exceeds the warning value, the motor 4 is started to perform air cooling and heat dissipation.
In one embodiment, a maintenance opening 28 is formed in the outer wall of the packaging shell 2, a sealing plate 29 is arranged on the maintenance opening 28, and the sealing plate 29 is connected with the outer wall of the packaging shell 2 through screws, so that the sealing plate 29 is convenient to open, and components in the packaging shell 2 are maintained.
In one embodiment, a warning light 30 is provided on the outer wall of the package housing 2, and the warning light 30 is electrically connected to the controller 27, so as to remind a person to take measures in time when the temperature is too high.
In one embodiment, the controller 27 communicates wirelessly with a user terminal, such as a control center or smart phone, so that a person can remotely learn the temperature within the enclosure 2.
It will be apparent to those skilled in the art that various modifications and variations can be made to the present invention without departing from the spirit or scope of the invention. Thus, it is intended that the present invention also include such modifications and alterations insofar as they come within the scope of the appended claims or the equivalents thereof.
Claims (8)
1. A film acoustic filter with good heat dissipation effect is characterized by comprising: the thin film acoustic filter body (1), the thin film acoustic filter body (1) is formed by sequentially laminating a substrate (101), a bottom electrode (102), a multi-element compound concentration doped type multi-level piezoelectric layer (103), a top electrode (104) and a passivation layer (105), wherein the multi-element compound concentration doped type multi-level piezoelectric layer (103) is made of piezoelectric materials doped with scandium element, magnesium element and titanium element, the thin film acoustic filter body (1) is positioned in a packaging shell (2), one end of a binding post (3) is connected with the thin film acoustic filter body (1), the other end of the binding post (3) extends out of the packaging shell (2), the binding post (3) is connected with the top end of the packaging shell (2), and a heat dissipation device is arranged in the packaging shell (2);
the heat dissipating device includes: the motor (4), the first rotating shaft (5), the first triangular plate (6), the second triangular plate (7), the first through hole (8), the second through hole (9), the first L-shaped rod (10), the first air plate (11), the second air plate (12), the second rotating shaft (13) and the fan (14);
the packaging shell (2) bottom wall is provided with a motor (4), an output shaft of the motor (4) is upwards connected with one end of a first rotating shaft (5), the other end of the first rotating shaft (5) is connected with the center of a first triangular plate (6), the first triangular plate (6) is horizontally arranged, a second triangular plate (7) is vertically arranged, first through holes (8) are respectively formed in the triangular position of the first triangular plate (6), second through holes (9) are respectively formed in the triangular position of the second triangular plate (7), one end of a first L-shaped rod (10) penetrates through the first through holes (8) to be connected with a first air plate (11), the other end of the first L-shaped rod (10) penetrates through the second through holes (9) to be connected with a second air plate (12), the second rotating shaft (13) is horizontally arranged, one end of the second rotating shaft (13) is connected with the center of the second triangular plate (7), the other end of the second rotating shaft (13) is connected with a fan (14), and the fan (14) is located on the side face of the film acoustic wave filter body (1);
first gear (15) is coaxially arranged on first pivot (5), first gear (15) and second gear (16) meshing, third pivot (17) one end and second gear (16) coaxial coupling, third pivot (17) other end pass fixed block (18) and third gear (19) coaxial coupling, third pivot (17) and fixed block (18) rotate to be connected, fixed block (18) and encapsulation casing (2) inner wall connection, first pivot (5) are gone up the cover and are equipped with first sleeve pipe (20), first pivot (5) and first sleeve pipe (20) rotate to be connected, first sleeve pipe (20) are located first gear (15) top, coaxial fourth gear (21) are provided with on first sleeve pipe (20) lower extreme outer wall, third gear (19) and fourth gear (21) meshing, the cover is equipped with second sleeve pipe (22) on second pivot (13), second pivot (13) and second sleeve pipe (22) rotate to be connected, link arm (23) one end and first sleeve pipe (20) upper end outer wall connection arm (23) and second sleeve pipe (22) are connected.
2. The film acoustic filter with good heat dissipation effect as claimed in claim 1, wherein the outer wall of the package housing (2) is provided with an opening (24).
3. A thin film acoustic filter with good heat dissipation effect as claimed in claim 2, characterized in that the openings (24) are provided with dust filtering net (25).
4. The film acoustic filter with good heat dissipation effect as defined in claim 1, wherein a temperature sensor (26) is disposed on an inner wall of the package housing (2), the temperature sensor (26) is electrically connected to a controller (27), and the controller (27) is electrically connected to the motor (4).
5. The film acoustic filter with good heat dissipation effect as claimed in claim 1, wherein a maintenance port (28) is provided on the outer wall of the package housing (2).
6. The film acoustic filter with good heat dissipation effect as defined in claim 5, wherein the maintenance port (28) is provided with a sealing plate (29), and the sealing plate (29) is connected with the outer wall of the package housing (2) through screws.
7. The film acoustic filter with good heat dissipation effect as defined in claim 4, wherein the warning lamp (30) is disposed on the outer wall of the package housing (2), and the warning lamp (30) is electrically connected with the controller (27).
8. A thin film acoustic filter with good heat dissipation as defined in claim 4, wherein the controller (27) is in wireless communication with the user terminal.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211567859.1A CN115632631B (en) | 2022-12-08 | 2022-12-08 | Film acoustic wave filter with good heat dissipation effect |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211567859.1A CN115632631B (en) | 2022-12-08 | 2022-12-08 | Film acoustic wave filter with good heat dissipation effect |
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| CN115632631A CN115632631A (en) | 2023-01-20 |
| CN115632631B true CN115632631B (en) | 2023-04-25 |
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| CN202211567859.1A Active CN115632631B (en) | 2022-12-08 | 2022-12-08 | Film acoustic wave filter with good heat dissipation effect |
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Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114884484A (en) * | 2022-07-12 | 2022-08-09 | 深圳新声半导体有限公司 | Film acoustic wave filter based on composite concentration |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008258882A (en) * | 2007-04-04 | 2008-10-23 | Toshiba Corp | Resonator filter, and duplexer |
| US9444428B2 (en) * | 2014-08-28 | 2016-09-13 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Film bulk acoustic resonators comprising backside vias |
| CN114257198A (en) * | 2020-09-22 | 2022-03-29 | 诺思(天津)微系统有限责任公司 | Bulk acoustic wave resonator having a void layer, assembly and method of manufacturing the same, filter and electronic apparatus |
| CN114157266B (en) * | 2022-02-07 | 2022-05-10 | 深圳新声半导体有限公司 | High-shielding surface acoustic wave filter |
| CN114157262B (en) * | 2022-02-09 | 2022-05-10 | 深圳新声半导体有限公司 | Packaging structure of surface acoustic wave filter |
| CN114866058B (en) * | 2022-07-06 | 2023-02-17 | 深圳新声半导体有限公司 | Bulk acoustic wave filter based on Sc doping concentration change |
| CN115378395A (en) * | 2022-08-17 | 2022-11-22 | 北京航天微电科技有限公司 | Film bulk acoustic resonator with good heat dissipation, preparation method and filter |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114884484A (en) * | 2022-07-12 | 2022-08-09 | 深圳新声半导体有限公司 | Film acoustic wave filter based on composite concentration |
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