CN115625958B - Composite film for cavity filter and cavity filter - Google Patents

Composite film for cavity filter and cavity filter Download PDF

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Publication number
CN115625958B
CN115625958B CN202211409788.2A CN202211409788A CN115625958B CN 115625958 B CN115625958 B CN 115625958B CN 202211409788 A CN202211409788 A CN 202211409788A CN 115625958 B CN115625958 B CN 115625958B
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resin layer
cavity filter
composite film
cavity
filter according
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CN115625958A (en
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刘东亮
陈涛
刘潜发
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Shengyi Technology Co Ltd
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Shengyi Technology Co Ltd
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/32—Layered products comprising a layer of synthetic resin comprising polyolefins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B33/00—Layered products characterised by particular properties or particular surface features, e.g. particular surface coatings; Layered products designed for particular purposes not covered by another single class
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P1/00—Auxiliary devices
    • H01P1/20—Frequency-selective devices, e.g. filters
    • H01P1/207—Hollow waveguide filters
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2255/00—Coating on the layer surface
    • B32B2255/10—Coating on the layer surface on synthetic resin layer or on natural or synthetic rubber layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2255/00—Coating on the layer surface
    • B32B2255/26—Polymeric coating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2255/00—Coating on the layer surface
    • B32B2255/28—Multiple coating on one surface
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2363/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2461/00—Characterised by the use of condensation polymers of aldehydes or ketones; Derivatives of such polymers
    • C08J2461/04—Condensation polymers of aldehydes or ketones with phenols only
    • C08J2461/06—Condensation polymers of aldehydes or ketones with phenols only of aldehydes with phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Laminated Bodies (AREA)

Abstract

The invention provides a composite film for a cavity filter and the cavity filter, wherein the composite film comprises a first resin layer, a second resin layer and a third resin layer which are sequentially laminated, the first resin layer has a lowest melt viscosity value below 500 Pa.s at 80-120 ℃, and the elongation percentage is above 10% at 80-150 ℃ after solidification; the second resin layer has a minimum melt viscosity value of 3000 Pa.s or more at 80-120deg.C, and a tensile modulus of 9GPa or more after curing; the third resin layer has a tensile modulus of 5GPa or more and a CTE of 50 to 150 ℃ or less after curing of 40 ppm/DEG C. The invention can simultaneously meet the requirements of cavity bottom edge filling, cavity forming, flat surface of the outer layer above the cavity, fine circuit manufacturing of the outer layer by SAP technology, and high cost performance of the product.

Description

Composite film for cavity filter and cavity filter
Technical Field
The invention belongs to the technical field of filters, and relates to a composite film for a cavity filter and the cavity filter.
Background
The surface acoustic wave filter utilizes excitation, propagation and reception of surface acoustic waves on a piezoelectric material to complete its filtering characteristics. The surface acoustic wave has a wavelength in the range of 100 μm to 2 μm and is a mechanical wave very sensitive to its propagation surface. In order for the surface acoustic wave in the acoustic wave element to propagate without interference, a cavity is present above the chip surface in the package.
The development trend of broadband wireless communication requires that the base station radio frequency front end duplexer has smaller volume, larger power capacity and lower cost and can maintain the performance such as loss and the like basically unchanged. The cavity (i.e. coaxial resonant cavity filled with air) filter is a traditional technology of a base station duplexer, and has mature technology and low cost. The cavity filter generally includes a cover plate and a plurality of cavities, each of which has a plurality of resonator tubes therein. Each cavity functions as an electronic oscillating circuit that can be represented as a parallel oscillating circuit comprising an inductive part and a capacitive part, when the filter is tuned to the appropriate wavelength of the received signal, the resonant frequency of the filter being adjustable by adjusting the inductive part or the capacitive part. In general, the cavity of the cavity filter is made of metal materials, and the metal cavity filter has a height limit, which cannot meet the miniaturization requirement. Therefore, in recent years, there has been an increasing demand for manufacturing a cavity filter using an insulating resin film made of a composite of an organic compound and an inorganic substance, and the reinforcing structure layer 304 of the cavity filter in fig. 1 of the prior art CN114499433a is an insulating material, which may be an organic material such as polyimide, or a molding compound, or a mixture of an organic material and an inorganic filler. However, the insulating material can only be imported from abroad at present, and has the problems of high material cost, long supply period, easiness in occurrence of poor filling or partial sinking of the upper surface of the cavity in the use process and the like.
Therefore, in the art, it is desired to develop a glue film which satisfies the bottom edge filling of the cavity filter, solves the problem of the recess of the upper surface of the cavity, and ensures the performance of the filter.
Disclosure of Invention
Aiming at the defects of the prior art, the invention aims to provide a composite film for a cavity filter and the cavity filter.
In order to achieve the aim of the invention, the invention adopts the following technical scheme:
In one aspect, the present invention provides a composite film for a cavity filter, the composite film comprising a first resin layer, a second resin layer, and a third resin layer laminated in this order, the first resin layer exhibiting a minimum melt viscosity value of between 80 and 120 ℃, the minimum melt viscosity value being 500pa·s or less, and having an elongation of 10% or more between 80 and 150 ℃ after curing; the second resin layer has a lowest melt viscosity value between 80 and 120 ℃, the lowest melt viscosity value is more than 3000 Pa.s, and the tensile modulus after solidification is more than 9 GPa; the tensile modulus of the third resin layer after curing is 5GPa or more and the CTE of 50-150 ℃ is 40 ppm/DEG C or less.
In the present invention, the first resin layer is a high-fluidity, high-adhesion and flexible resin layer, the second resin layer is a low-fluidity and high-modulus resin layer, and the third resin layer is a high-adhesion and low-CTE resin layer. Through using first resin layer, second resin layer and third resin layer to cooperate, can satisfy cavity filter's cavity bottom edge packing, cavity formation and cavity top skin surface are leveled simultaneously, and the skin can be through SAP technology preparation fine line, and is more convenient in the production operation in-process, realizes the localization substitution of special glued membrane that cavity filter used to have better price/performance ratio.
In the present invention, the first resin layer exhibits a minimum melt viscosity value of 500pa·s or less (e.g., 500pa·s, 450pa·s, 400pa·s, 350pa·s, 300pa·s, 200pa·s, 100pa·s, etc.) between 80 to 120 ℃ (e.g., 80 ℃, 85 ℃, 90 ℃, 100 ℃, 110 ℃, or 120 ℃) and an elongation of 10% or more (e.g., 10%, 15%, 20%, 25%, 30%, 35%, 40%, etc.) between 80 to 150 ℃ after curing.
In the present invention, the second resin layer exhibits a minimum melt viscosity value of 3000pa·s or more (for example, 3000pa·s, 3500pa·s, 4000pa·s, 4500pa·s, 5000pa·s, etc.) between 80 to 120 ℃, and has a tensile modulus of 9GPa or more (for example, 9GPa, 10GPa, 11GPa, 12GPa, 13GPa, 14GPa, 15GPa, etc.) after curing.
In the present invention, the third resin layer has a tensile modulus of 5GPa or more (for example, 5GPa, 10GPa, 11GPa, 12GPa, 13GPa, 14GPa, 15GPa, etc.), and a CTE of 50 to 150 ℃ of 40 ppm/DEG C or less (for example, 40 ppm/DEG C, 35 ppm/DEG C, 30 ppm/DEG C, 25 ppm/DEG C, 20 ppm/DEG C, 10 ppm/DEG C, etc.).
In the present invention, the composite film includes a first resin layer, a second resin layer and a third resin layer laminated in this order, the three resin layers are all in a semi-cured state, the lowest melt viscosity value of which can be measured by a rheometer, and the resin layer in the semi-cured state cannot be directly tested for elongation, tensile modulus or CTE, which are measured after the resin layer is required to be cured, and the curing conditions may be 170 to 190 ℃ for 60 to 120 minutes. For example, the curing temperature may be 170 ℃, 172 ℃, 175 ℃, 178 ℃, 180 ℃, 182 ℃, 185 ℃, 188 ℃, or 190 ℃ and the curing time may be 60min, 70min, 80min, 90min, 100min, 110min, or 120min.
In the invention, three different semi-cured resin layers can be prepared by coating respectively, and then compounded by a rolling or pressure transmitting device, or a mode of coating three sections of coating heads simultaneously or coating in a sectional manner can be adopted to obtain a first resin layer, a second resin layer and a third resin layer which are sequentially laminated, and the compounding and coating belong to the prior art in the field and are not repeated here.
Specifically, the preparation method of the composite film for the cavity filter in the invention may be that, for example, glue solution of a third resin layer is coated on a release base film, and then dried, glue solution of a second resin layer is continuously coated on the surface of the third resin layer, and then dried, glue solution of a first resin layer is continuously coated on the surface of the second resin layer, and then dried, and then the composite film is obtained by rolling the composite protective film on the surface of the first resin layer. The drying temperature may be 50 to 120 ℃, for example 50 ℃,60 ℃, 70 ℃, 80 ℃,90 ℃, 100 ℃, 110 ℃ or 120 ℃.
Preferably, the composite film for a cavity filter has a CTE of 30 ppm/DEG C or less (e.g., 30 ppm/DEG C, 28 ppm/DEG C, 25 ppm/DEG C, 22 ppm/DEG C, 20 ppm/DEG C, 15 ppm/DEG C, 10 ppm/DEG C, 5 ppm/DEG C, etc.) at 50 to 150 ℃ after curing, and a tensile modulus of 8GPa or more (e.g., 8GPa, 10GPa, 12GPa, 15GPa, 18GPa, 20GPa, etc.).
Preferably, the copper layer copper-deposited and electroplated on the surface of the third resin layer has a bonding force with the resin layer of 4N/cm or more, for example, 4N/cm, 5N/cm, 8N/cm, 10N/cm, 12N/cm, 15N/cm, 18N/cm or 20N/cm; the third resin layer has high adhesion, preferably 6N/cm or more.
Preferably, the surface of the third resin layer is surface-treated so that the surface roughness Ra is 300nm or less, for example 300nm, 250nm, 200nm, 100nm, 50nm, 30nm, 20nm, 10nm, or the like. In the present invention, the surface treatment is permanganate bath etching treatment.
In the invention, the first resin layer has certain fluidity and cohesiveness, and can be locally adhered around the device to play a role in fixing the device; meanwhile, the first resin layer has good flexibility, a thin film layer is formed, and the first resin layer cannot be extruded and broken in the surrounding local bonding process, so that the second resin layer cannot overflow to the cavity position of the device in the bonding process. The second resin layer has lower fluidity and higher modulus, can play a supporting role, can not collapse above the cavity of the filter, and ensures the integrity of the cavity. The third resin layer has higher cohesiveness and lower CTE, and is suitable for SAP technology to manufacture fine lines on the surface; the composite film is used as a strengthening structure layer of the middle cap layer of the cavity filter, so that the performance of the cavity filter can be improved.
Preferably, the thickness of the first resin layer is 1 to 10 μm, for example 1 μm, 2 μm, 4 μm, 6 μm, 8 μm or 10 μm. If the thickness of the first resin layer is thicker, the first resin layer overflows into the cavity of the device in the bonding process, so that the efficacy of the cavity is affected; if the thickness of the first resin layer is thin, the adhesion during the surrounding partial bonding is poor and there is a risk of crush rupture.
Preferably, the thickness of the second resin layer is 10 to 100 μm, for example, 10 μm, 30 μm, 50 μm, 70 μm, 90 μm or 100 μm. If the thickness of the second resin layer is thicker, it is difficult to realize a slim design of the cavity filter; if the thickness of the second resin layer is thinner, it is difficult to perform a supporting function, which may cause collapse of the cavity.
Preferably, the thickness of the third resin layer is 1 to 10 μm, for example 1 μm, 2 μm, 4 μm, 6 μm, 8 μm or 10 μm. If the thickness of the third resin layer is too thick, the cavity is easily deformed and depressed; if the thickness of the third resin layer is thinner, the copper layer of the surface copper plating is less bonded with it.
Preferably, the composite film for a cavity filter further includes a protective film laminated on a surface of the first resin layer and a release base film laminated on a surface of the third resin layer.
Preferably, the release base film is selected from any one of PET, PEN, PI, PTFE, PES, PPS or Polybenzimidazole (PBI) film.
Preferably, the thickness of the release base film is 10 to 100 μm, for example 10 μm, 30 μm, 50 μm, 70 μm, 90 μm or 100 μm.
Preferably, the Ra of the release base film is in the range of 100 to 300nm (e.g., 100nm, 130nm, 150nm, 200nm, 250nm, 280nm, or 300 nm), and the adhesion to the first resin layer is 4N/cm or more (e.g., 4N/cm, 5N/cm, 8N/cm, 10N/cm, 12N/cm, 15N/cm, 18N/cm, or 20N/cm).
Preferably, the protective film is selected from PE, PP, PET or BOPP film.
Preferably, the thickness of the protective film is 10 to 30 μm, for example 10 μm, 15 μm, 18 μm, 20 μm, 25 μm, 28 μm or 30 μm.
In another aspect, the present invention provides a cavity filter, the preparation material of which comprises the composite film for a cavity filter as described above.
In the composite film for a cavity filter of the present invention, the structure of the first resin layer, the second resin layer, and the third resin layer, which are sequentially laminated, is used as a reinforcing structure layer of a cap layer in the cavity filter, wherein the first resin layer is disposed toward a cavity of the cavity filter.
On the other hand, the invention provides a preparation method of the cavity filter, which comprises the steps of firstly attaching chips on the surface of a carrier plate, keeping a certain gap between the chips, tearing off a protective film in a composite film for the cavity filter, pressing the protective film on a core plate with components attached in advance, removing a release base film after heating and curing, and taking a structure of a first resin layer, a second resin layer and a third resin layer which are sequentially stacked in the composite film as a reinforced structure layer of a cover cap layer in the cavity filter to obtain the cavity filter.
In the invention, the reinforced structure layer can be subjected to relevant working procedures such as laser drilling, line manufacturing and the like.
Compared with the prior art, the invention has the following beneficial effects:
The composite film for the cavity filter can simultaneously meet the requirements of cavity bottom edge filling and cavity forming of the cavity filter, the surface of the outer layer above the cavity is smooth, the outer layer can be used for manufacturing thin lines through an SAP (super-absorbent polymer) process, the production operation process is more convenient, the localization substitution of special adhesive films applied to the cavity filter is realized, and the composite film provided by the invention is used as a strengthening structure layer of a middle cover layer of the cavity filter, can improve the performance of the cavity filter, and has better cost performance.
Drawings
Fig. 1 is a schematic structural diagram of three resin layers in the composite film of the present invention, wherein 1 is a first resin layer, 2 is a second resin layer, and 3 is a third resin layer.
Fig. 2 is a schematic structural diagram of a composite film according to the present invention, wherein 1 is a first resin layer, 2 is a second resin layer, 3 is a third resin layer, 4 is a protective film, and 5 is a release film.
Fig. 3 is a schematic structural diagram of a package structure of a cavity filter according to a first embodiment of the prior art CN114499433a, in which 301 is a cap layer, 303 is a cavity, 304 is a reinforced structural layer made of an insulating material, and 401 is a filter chip.
Detailed Description
The technical scheme of the invention is further described by the following specific embodiments. It will be apparent to those skilled in the art that the examples are merely to aid in understanding the invention and are not to be construed as a specific limitation thereof.
Example 1
The embodiment provides a composite film for a cavity filter, the composite film comprises a protective film, a first resin layer, a second resin layer, a third resin layer and a release base film which are sequentially laminated, the structure of the resin layer is shown in fig. 1, and the structure of the composite film is shown in fig. 2.
The composite film for the cavity filter is prepared by the following preparation method:
step 1: and respectively mixing the first resin layer, the second resin layer and the third resin layer glue solution.
A first resin layer glue solution: consists of 100 parts by weight of an epoxy resin (bisphenol A epoxy resin, trade name NPES-901, nanya electronic materials Co., ltd.), 30 parts by weight of a phenol resin (biphenyl type phenol resin, trade name MEH-7851H, japanese Ming dynasty chemical Co., ltd.), 20 parts by weight of a thermoplastic resin (core-shell rubber, trade name M-521, japanese Sellouin chemical Co., ltd.), 0.5 part by weight of 2-methylimidazole and a proper amount of MEK solvent, and is sufficiently dissolved and uniformly stirred.
The second resin layer glue solution: consists of 100 parts by weight of epoxy resin (bisphenol A epoxy resin, trade name NPES-901, nanya electronic materials Co., ltd.), 30 parts by weight of phenolic resin (biphenyl type phenolic resin, trade name MEH-7851H, japanese Ming dynasty chemical Co., ltd.), 300 parts by weight of inorganic filler (silica, SC2050, japanese admateches), 0.5 parts by weight of 2-methylimidazole and a proper amount of MEK solvent, and is sufficiently dissolved and uniformly stirred.
Third resin layer glue solution: consists of 100 parts by weight of epoxy resin (bisphenol A epoxy resin, trade name NPES-901, nanya electronic materials Co., ltd.), 30 parts by weight of phenolic resin (biphenyl type phenolic resin, trade name MEH-7851H, japanese Ming dynasty chemical Co., ltd.), 150 parts by weight of inorganic filler (silica, SC2050, japanese admateches), 0.5 parts by weight of 2-methylimidazole and a proper amount of MEK solvent, and is sufficiently dissolved and uniformly stirred.
Step 2: coating the third resin layer glue solution on the surface of the PET release base film, drying at the temperature of 80 ℃, controlling the thickness of the dried PET release base film to be 10 mu m, then continuously coating the second resin layer glue solution on the surface of the third resin layer, drying at the temperature of 80 ℃, controlling the thickness of the dried PET release base film to be 10 mu m, continuously coating the first resin layer glue solution on the surface of the second resin layer, drying at the temperature of 80 ℃, and controlling the thickness of the dried PET release base film to be 10 mu m; and then compounding a BOPP protective film on the outer surface of the first resin layer through a rolling device to obtain the composite film for the cavity filter.
Wherein, after preparing the third resin layer, the third resin layer is solidified to have a tensile modulus of 6GPa and a CTE of 30 ppm/DEG C between 50 and 150 ℃; continuously coating a second resin layer glue solution on the surface of the third resin layer, drying to prepare a second resin layer, peeling the second resin layer, carrying out a melt viscosity test on the second resin layer, wherein the lowest melt viscosity value is 3300 Pa.s at 103 ℃, and measuring the tensile modulus to be 10GPa after curing; and then continuously coating the first resin layer glue solution on the surface of the second resin layer, drying to prepare a first resin layer, peeling off the first resin layer, carrying out a melt viscosity test on the first resin layer, wherein the lowest melt viscosity value at 90 ℃ is 400 Pa.s, and curing the first resin layer to obtain the first resin layer with the elongation of 12% at 80-150 ℃ under the curing condition of 180 ℃ for 100min.
After the composite film is cured, the CTE of the composite film is tested to be 20 ppm/DEG C between 50 ℃ and 150 ℃; the tensile modulus was 9GPa.
The composite film for the cavity filter is used for preparing the cavity filter, and the preparation method is as follows:
The BOPP protective film is firstly torn off by the composite resin film, the reinforced structure layer 304 in the embodiment 1 in the prior art CN114499433A is replaced, the PET release base film is removed after heating and curing (180 ℃ for 100 min), a cavity can be formed together with the chip and the core plate, and then related working procedures such as laser drilling, line manufacturing and the like are carried out on the composite resin film according to the design requirement of the filter, so that the cavity filter is finally obtained.
Examples 2 to 3 and comparative examples 1 to 6
A composite film for a cavity filter and a cavity filter produced using the composite film for a cavity filter are described, wherein the glue compositions of the first resin layer, the second resin layer and the third resin layer and the lowest melt viscosity value, elongation, tensile modulus and CTE of each resin layer are shown in tables 1 to 3, and the amounts of each component in tables 1 to 3 are in parts by weight, referring to the production method of example 1.
TABLE 1
TABLE 2
TABLE 3 Table 3
The composite films and cavity filters of examples 1-3 and comparative examples 1-6 were tested for performance as follows:
(1) Minimum melt viscosity value: testing the rheological curve of the semi-cured bonding layer sample by using An Dongpa MCR302 rheometer, setting the testing temperature range to be 20-160 ℃ and the heating rate to be 3 ℃/min; after the test is completed, the lowest melt viscosity values occurring between 50 and 130 ℃ are read from the corresponding rheology curves.
(2) CTE: the measurement was performed by referring to the TMA test method specified in IPC-TM-650.2.4.24.5.
(3) Tensile modulus: the determination was carried out according to the DMA test method specified in IPC-TM-650.2.4.24.4.
(4) The cavity upper cover depression value method comprises the following steps: a pressure of 3N/cm 2 was applied at the middle position above the cavity, and the distance between the lowest point and the highest point of the recess was tested.
(5) SAP fine line percent of pass: the test line has no percent of shorts.
(6) Number of reflow soldering: 135s at 217 ℃ and 25s at 260 ℃ each time the temperature of the reflow board surface meets the temperature of 217 ℃; cooling to room temperature after each test, then carrying out the next test, observing that the surface is free from abnormal phenomena such as layering and foaming after each test is passed, if the abnormal phenomena are failed, recording the passing times.
(7) Copper layer peel strength: the peel strength of copper layers plated with surface copper deposition was tested with reference to the peel strength test method specified in IPC-TM-650.4.8.
The test items and results are shown in table 4:
TABLE 4 Table 4
As can be seen from table 4, the composite films for cavity filters according to embodiments 1 to 3 of the present invention can simultaneously satisfy the cavity bottom edge filling of the cavity filter, the cavity formation with the flat surface of the outer layer above the cavity, and the fine line formation of the outer layer by the SAP process.
The composite films in comparative examples 1-3 have only a two-layer structure, and the efficacy of each resin layer cannot be fully exerted, so that the prepared cavity filter has the problems that the upper cavity cover is sunken, the pass rate of SAP fine lines is reduced, or the reflow soldering times is reduced.
The composite films of comparative examples 4 to 6 were three-layer, but the first resin layer of comparative example 4 did not satisfy the occurrence of the lowest melt viscosity value between 80 and 120 ℃, the lowest melt viscosity value was 500pa·s or less, and the elongation after curing was 10% or more between 80 and 150 ℃; the second resin layer in comparative example 5 did not satisfy the occurrence of the lowest melt viscosity value between 80 and 120 ℃, the lowest melt viscosity value was 3000pa·s or more, and the tensile modulus after curing was 9GPa or more; the third resin layer in comparative example 6 does not satisfy the tensile modulus of 5GPa or more and the CTE of 50 to 150 ℃ or less than 40 ppm/DEG C after curing, so that the cavity filters produced in comparative examples 4 to 6 may have a cavity upper cap dent or reduce the pass rate of SAP fine lines or reduce the number of reflow soldering.
The applicant states that the present invention is described with reference to the above embodiments as a composite film for a cavity filter and a cavity filter according to the present invention, but the present invention is not limited to the above embodiments, i.e., it does not mean that the present invention must be implemented by the above embodiments. It should be apparent to those skilled in the art that any modification of the present invention, equivalent substitution of selected raw materials, addition of auxiliary components, selection of specific modes, etc. fall within the scope of the present invention and the scope of disclosure.

Claims (16)

1. The composite film for the cavity filter is characterized by comprising a first resin layer, a second resin layer and a third resin layer which are sequentially stacked, wherein the first resin layer has a lowest melt viscosity value between 80 and 120 ℃, the lowest melt viscosity value is below 500 Pa & s, and the elongation after solidification is above 10 percent between 80 and 150 ℃; the second resin layer has a lowest melt viscosity value of more than 3000 Pa s at 80-120 ℃ and a tensile modulus of more than 9 GPa after solidification; the tensile modulus of the third resin layer after curing is more than 5 GPa, and the CTE of the third resin layer at 50-150 ℃ is less than 40 ppm/DEGC.
2. The composite film for a cavity filter according to claim 1, wherein the CTE of the composite film for a cavity filter after curing is 30 ppm/°c or less at 50 to 150 ℃ and the tensile modulus is 8 GPa or more.
3. The composite film for a cavity filter according to claim 1, wherein a bonding force between a copper layer copper-deposited and plated on the surface of the third resin layer and the resin layer is 4N/cm or more.
4. The composite film for a cavity filter according to claim 3, wherein a bonding force between the copper layer copper-deposited and plated on the surface of the third resin layer and the resin layer is 6N/cm or more.
5. The composite film for a cavity filter according to claim 1, wherein the surface of the third resin layer is surface-treated so that the surface roughness Ra is 300nm or less.
6. The composite film for a cavity filter according to claim 1, wherein the thickness of the first resin layer is 1 to 10 μm.
7. The composite film for a cavity filter according to claim 1, wherein the thickness of the second resin layer is 10 to 100 μm.
8. The composite film for a cavity filter according to claim 1, wherein the thickness of the third resin layer is 1 to 10 μm.
9. The composite film for a cavity filter according to claim 1, further comprising a protective film laminated on a surface of the first resin layer and a release base film laminated on a surface of the third resin layer.
10. The composite film for a cavity filter according to claim 9, wherein the release base film is selected from any one of PET, PEN, PI, PTFE, PES, PPS and polybenzimidazole films.
11. The composite film for a cavity filter according to claim 9, wherein the thickness of the release base film is 10 to 100 μm.
12. The composite film for a cavity filter according to claim 9, wherein Ra of the release base film is 100 to 300nm and adhesion to the first resin layer is 4N/cm or more.
13. The composite film for a cavity filter according to claim 9, wherein the protective film is selected from any one of PE, PP, PET and BOPP films.
14. The composite film for a cavity filter according to claim 9, wherein the protective film has a thickness of 10 to 30 μm.
15. A cavity filter, characterized in that the material for producing the cavity filter comprises the composite film for a cavity filter according to any one of claims 1 to 14.
16. The cavity filter according to claim 15, wherein the cavity filter uses a structure of a first resin layer, a second resin layer, and a third resin layer, which are laminated in this order, in a composite film as a reinforcing structure layer of a cap layer in the cavity filter, wherein the first resin layer is disposed toward a cavity of the cavity filter.
CN202211409788.2A 2022-11-10 2022-11-10 Composite film for cavity filter and cavity filter Active CN115625958B (en)

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Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109427694A (en) * 2017-08-31 2019-03-05 日东电工株式会社 Sealing sheet
CN113054942A (en) * 2021-03-11 2021-06-29 展讯通信（上海）有限公司 Surface acoustic wave filter and packaging method

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Publication number Priority date Publication date Assignee Title
JP4385145B2 (en) * 2004-03-26 2009-12-16 京セラ株式会社 Device equipment
JP4872587B2 (en) * 2006-10-12 2012-02-08 日立化成工業株式会社 Sealing film and semiconductor device using the same
EP2230764B1 (en) * 2007-12-14 2016-11-02 Murata Manufacturing Co. Ltd. Surface wave device and method of manufacturing the same
WO2020241505A1 (en) * 2019-05-31 2020-12-03 パナソニックＩｐマネジメント株式会社 Sheet-like sealing material, sheet for sealing and semiconductor device

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109427694A (en) * 2017-08-31 2019-03-05 日东电工株式会社 Sealing sheet
CN113054942A (en) * 2021-03-11 2021-06-29 展讯通信（上海）有限公司 Surface acoustic wave filter and packaging method

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