CN115625809A - Crystal bar cutting system - Google Patents
Crystal bar cutting system Download PDFInfo
- Publication number
- CN115625809A CN115625809A CN202211348299.0A CN202211348299A CN115625809A CN 115625809 A CN115625809 A CN 115625809A CN 202211348299 A CN202211348299 A CN 202211348299A CN 115625809 A CN115625809 A CN 115625809A
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- cutting
- crystal bar
- driving shaft
- distance
- tension
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- 238000005520 cutting process Methods 0.000 title claims abstract description 139
- 239000013078 crystal Substances 0.000 title claims abstract description 64
- 239000002173 cutting fluid Substances 0.000 claims abstract description 25
- 239000007788 liquid Substances 0.000 claims abstract description 11
- 230000002572 peristaltic effect Effects 0.000 claims description 6
- 238000012544 monitoring process Methods 0.000 claims description 2
- 229910010271 silicon carbide Inorganic materials 0.000 abstract description 10
- 239000000758 substrate Substances 0.000 abstract description 7
- 239000000463 material Substances 0.000 abstract description 4
- 238000012545 processing Methods 0.000 abstract description 4
- 239000004065 semiconductor Substances 0.000 abstract description 4
- 235000012431 wafers Nutrition 0.000 description 11
- 238000000034 method Methods 0.000 description 8
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 8
- 230000005540 biological transmission Effects 0.000 description 6
- 229910000831 Steel Inorganic materials 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000007373 indentation Methods 0.000 description 3
- 239000010959 steel Substances 0.000 description 3
- 101100008047 Caenorhabditis elegans cut-3 gene Proteins 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000002699 waste material Substances 0.000 description 2
- 238000002679 ablation Methods 0.000 description 1
- 230000005856 abnormality Effects 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- 238000013019 agitation Methods 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000007123 defense Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000000608 laser ablation Methods 0.000 description 1
- 230000001050 lubricating effect Effects 0.000 description 1
- 238000005461 lubrication Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 238000013082 photovoltaic technology Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
The application relates to a crystal bar cutting system in the field of semiconductor material processing, comprising: a cutting fluid pool; the support frame is arranged above the cutting liquid pool and used for fixing a crystal bar; the driving shaft is erected in the cutting liquid pool, and the axis of the driving shaft is parallel to the axis of the crystal bar; the cutting lines are of an annular structure and are provided with a plurality of cutting lines, and the cutting lines are wound on the driving shaft and the crystal bar and are arranged at intervals along the length direction of the driving shaft; and the first distance adjusting device adjusts the distance between the crystal bar and the driving shaft in real time along with the increase of the cutting depth of the crystal bar. This application has improved the cutting efficiency of crystal bar, can obtain the planar carborundum substrate piece of high quality.
Description
Technical Field
The application relates to the field of semiconductor material processing, in particular to a crystal bar cutting system.
Background
With the rapid development of semiconductor technology and photovoltaic technology, the demand for wafers has increased year by year; the third generation of wide band gap semiconductor material represented by SiC is the core for developing the technologies of high power, high frequency, high temperature, strong radiation resistant blue laser, ultraviolet detector and the like; the SiC crystal has the characteristics of large forbidden bandwidth, high thermal conductivity, large electron saturation drift rate, high critical breakdown electric field, low dielectric constant, good chemical stability and the like, is a preferred substitute of Si in the field of power electronics, and has wide application prospects in the aspects of communication, automobiles, aviation, aerospace, oil exploitation, national defense and the like.
The cutting is the first procedure in the processing process of the silicon carbide wafer, and aims to process and cut the crystal bar into pieces with specific thickness; with the shift to new substrates of silicon carbide, as well as thinner wafers, smaller feature sizes, and larger size substrates, wafer dicing has evolved as a key process step that can increase the yield of silicon carbide devices. However, because of the high hardness of silicon carbide, the currently used cutting blade has not only low cutting efficiency but also high abrasion of the cutting blade, and at the same time, the cutting blade is easy to crack and delaminate at the edge of the chip, and for the wafer with a large size exceeding 4 inches, such as 6 inches, 8 inches, etc., the cutting capability of the standard blade is even exceeded; the laser ablation method, which is an alternative method to mechanical wafer dicing, is prone to cause significant heat affected zones and microcracks, and the ablation rate is very low, and needs to be performed many times to separate chips.
Disclosure of Invention
In order to improve the cutting efficiency of crystal bar, obtain the carborundum substrate piece of high quality plane, this application provides a crystal bar cutting system.
According to an aspect of the present invention, there is provided a crystal bar cutting system including: a cutting fluid pool; the support frame is arranged above the cutting liquid pool and used for fixing a crystal bar; the driving shaft is erected in the cutting liquid pool, and the axis of the driving shaft is parallel to the axis of the crystal bar; the cutting lines are of an annular structure and are provided with a plurality of cutting lines, and the cutting lines are wound on the driving shaft and the crystal bar and are arranged at intervals along the length direction of the driving shaft; the first distance adjusting device adjusts the distance between the crystal bar and the driving shaft in real time along with the increase of the cutting depth of the crystal bar.
By using the crystal bar cutting system in the technical scheme, the crystal bar penetrates through a plurality of cutting lines with the length matched with the crystal bar, the crystal bar is fixed on the support frame, then the first distance adjusting device is used for adjusting the distance between the crystal bar and the driving shaft, the distance between the cutting lines is adjusted according to the thickness of a preset cutting slice, the upper end of each cutting line is wound on the periphery of the crystal bar, the lower end of each cutting line is wound on the periphery of the driving shaft, the bottom end of each cutting line is immersed in the cutting liquid pool, then the driving shaft is rotated to drive the cutting lines with cutting liquid to rotate, the tops of the cutting lines are in contact with the crystal bar for cutting, and along with the increase of the cutting depth of the crystal bar, the first distance adjusting device increases the distance between the crystal bar and the driving shaft in real time until the cutting work of the crystal bar is completed, so that the cutting efficiency of wafers with different sizes, particularly wafers with the sizes of 6 inches, 8 inches and the like is improved, and a silicon carbide substrate slice with a high-quality plane is obtained.
In addition, the crystal bar cutting system according to the application can also have the following additional technical characteristics:
in some embodiments of the present invention, the driving shaft is formed with annular dents in one-to-one correspondence with the cutting lines.
In some embodiments of the present invention, the driving shaft is sleeved with a number of collars which is the same as the number of the indentations, the indentations are arranged on each collar one by one, and the distance between the collars can be adjusted.
In some embodiments of the present invention, the ingot cutting system further comprises: and the angle deviation alarm is used for monitoring the included angle between the plane where each cutting line is located and the axis of the driving shaft in real time, and giving an early warning to the corresponding cutting line to the periphery when the plane where the cutting line is located and the axis of the driving shaft deviate from a vertical state.
In some embodiments of the present invention, the boule cutting system further comprises: a stirrer disposed within the cutting fluid bath.
In some embodiments of the invention, the agitator is a peristaltic pump.
In some embodiments of the present invention, the ingot cutting system further comprises: the tension detector is used for detecting the cutting tension of the cutting line in real time; and the controller is connected with the tension detector and the first distance adjusting device, and controls the first distance adjusting device to increase the distance between the crystal bar and the driving shaft by a set distance when the tension detector detects that the cutting tension of the cutting wire is smaller than the set cutting tension.
In some embodiments of the present invention, the support frame comprises two opposite annular supports, each of which comprises at least two fan-shaped hoop sheets.
In some embodiments of the present invention, the ingot cutting system further comprises: a second distance adjustment device for adjusting the spacing of the two support members.
Compared with the prior art, the invention achieves the following technical effects:
the method mainly improves the cutting entry angle of the designed cutting line, and carries out efficient cutting by the cutting angle attached to the outer diameter of the crystal bar, the process optimization greatly improves the cutting work efficiency, and the steel wire part with the cutting fluid adhered to the bottom end can be transferred to the top end to cut the wafer in the next step, so that the method does not waste the cutting fluid compared with the traditional cutting fluid spraying mode, and greatly saves the expensive cutting fluid purchasing cost.
Drawings
Various additional advantages and benefits will become apparent to those of ordinary skill in the art upon reading the following detailed description of the preferred embodiments. The drawings are only for purposes of illustrating the preferred embodiments and are not to be construed as limiting the application. Also, like reference numerals are used to refer to like parts throughout the drawings. In the drawings:
FIG. 1 is a schematic view of the overall structure of an ingot cutting system according to an embodiment of the present disclosure;
fig. 2 is a front view of an ingot cutting system according to an embodiment of the present application.
The reference numerals in the drawings denote the following: 1. a cutting fluid pool; 2. a support frame; 3. cutting a line; 4. a drive shaft; 41. an angular deviation alarm; 5. crystal bar; 6. a peristaltic pump.
Detailed Description
It should be understood that the embodiments described are only a few embodiments of the present application, and not all embodiments. All other embodiments obtained by a person of ordinary skill in the art based on the embodiments in the present application without making any creative effort belong to the protection scope of the present application.
When the following description refers to the accompanying drawings, like numbers in different drawings represent the same or similar elements unless otherwise indicated. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with the present application. Rather, they are merely examples of apparatus and methods consistent with certain aspects of the application, as detailed in the appended claims.
In the description of the present application, it is to be understood that the terms "first," "second," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance. The specific meaning of the above terms in the present application can be understood in a specific case by those of ordinary skill in the art. Further, in the description of the present application, "a plurality" means two or more unless otherwise specified. "and/or" describes the association relationship of the associated objects, meaning that there may be three relationships, e.g., a and/or B, which may mean: a exists alone, A and B exist simultaneously, and B exists alone. The character "/" generally indicates that the former and latter associated objects are in an "or" relationship.
The following describes an ingot cutting system provided in an embodiment of the present application with reference to the drawings.
The embodiment of the application discloses crystal bar cutting system. As shown in fig. 1 and 2, the crystal bar cutting system comprises a cutting liquid pool 1, a support frame 2, a driving shaft 4 and a cutting line 3; the support frame 2 is arranged above the cutting fluid pool 1 and used for fixing the crystal bar 5; the driving shaft 4 is erected in the cutting fluid pool 1, and the axis of the driving shaft 4 is parallel to the axis of the crystal bar 5; the cutting lines 3 are of a ring structure and provided with a plurality of cutting lines 3 which are wound around the drive shaft 4 and the ingot 5 and are arranged at intervals in the length direction of the drive shaft 4.
Specifically, the cutting line 3 in this embodiment is a steel wire, and the ingot cutting system further includes a driving device (not shown) and a first distance adjusting device (not shown), where the driving device is connected to the driving shaft 4 for driving the driving shaft 4 to rotate, such as a gear transmission, a belt transmission, a chain transmission, a worm transmission, a screw transmission, or a transmission mode in which an output shaft of a motor is directly coaxially connected to the driving shaft 4; the first distance adjusting device can be arranged between the bottom of the support frame 2 and the cutting liquid pool 1 or the working table surface, or the first distance adjusting device is arranged between the driving shaft 4 and the inner bottom of the cutting liquid pool 1, the first distance adjusting device adjusts the distance between the crystal bar 5 and the driving shaft 4 in real time along with the increase of the cutting depth of the crystal bar 5, and the stable cutting of the crystal bar 5 by the cutting line 3 is ensured, for example, the matching mode of an air cylinder, a hydraulic cylinder or a screw and a sliding block is adopted; and the driving device and the first distance adjusting device are subjected to necessary waterproof treatment according to different conditions arranged inside and outside the cutting fluid pool 1.
Through using crystal bar cutting system among this technical scheme, pass crystal bar 5 with its length assorted a plurality of line of cut 3, and fix crystal bar 5 on support frame 2, then use first distance adjusting device to adjust the interval between crystal bar 5 and the drive shaft 4, adjust the interval between each line of cut 3 according to predetermineeing the cutting piece thickness, make 3 upper ends of line of cut around 5 peripheries of crystal bar, the lower extreme twines in 4 peripheries of drive shaft, later open drive arrangement, 3 tops of line of cut contact crystal bar 5 are cut, and along with the increase of 5 cutting depth of crystal bar, the real-time interval between 5 and the drive shaft 4 of increase of first distance adjusting device, until accomplishing the cutting work of crystal bar 5.
When the cutting fluid tank 1 is in an operation state, the cutting fluid is filled in the cutting fluid tank 1, the bottom end of the cutting wire 3 is immersed in the cutting fluid tank 1, along with the rotation of the cutting wire 3, the cutting wire 3 with the rotated bottom end can enter a cutting working state of the top of the crystal bar 5, the cutting fluid plays a certain role in lubrication and cooling, the friction force between the cutting wire 3 and the crystal bar 5 can be reduced in the cutting process, and a partial lubricating film is formed on the contact surface of the cutting wire 3 and the crystal bar 5, so that the cutting force, the friction and the power consumption are reduced, and the cutting processing performance of the cutting wire 3 is improved; the waste of cutting fluid can be greatly reduced, the material cost for purchasing the cutting fluid is saved, and a large part of time and labor are saved in the aspect of sanitary cleaning and maintenance of later stage machine equipment; thereby improving the cutting efficiency of wafers with different sizes, particularly wafers with large sizes of 6 inches, 8 inches and the like, and obtaining a high-quality planar silicon carbide substrate slice.
In some embodiments of the present invention, the driving shaft 4 is formed with a circular indentation in one-to-one correspondence with the cutting line 3. The lower end of the cutting line 3 is wound and indented, so that the stability of the axial limiting of the cutting line 3 on the driving shaft 4 is ensured, and the cutting line 3 can be better kept in a stable plane state to cut the crystal bar 5.
Specifically, the cover is equipped with the lantern ring the same with the quantity of indenture on the drive shaft 4 among this embodiment, and the indenture is seted up on each lantern ring one by one, and the interval between each lantern ring can be adjusted, specifically can use the tight screw in top to fix each lantern ring in 4 length direction's of drive shaft optional position in the position department of staggering indenture, makes 4 indenture of drive shaft can carry out the equidistance according to predetermineeing cutting piece thickness and arrange or draw in to realize the cutting of the substrate piece of different thickness.
In some embodiments of the present invention, as shown in fig. 1 and 2, the ingot cutting system further includes an angle deviation alarm 41, where the angle deviation alarm 41 is configured to monitor an included angle between a plane where each cutting line 3 is located and an axis of the driving shaft 4 in real time, and when the plane where the cutting line 3 is located and the axis of the driving shaft 4 deviate from a perpendicular state, send an early warning to the surrounding corresponding cutting line 3.
Specifically, the angle deviation alarm 41 may be a pair of infrared light sensing emitting and receiving devices, one cutting line 3 should appear on each distance through a preset distance, the emitter emits infrared light, so that the infrared light can be equally received by the receiving device, if there is a deviation in a section distance, the section distance corresponding to the infrared light is received by the receiving device, namely, an abnormality occurs, and the infrared light is fed back to the system, namely, the condition that the angle of the cutting line 3 deviates is the fourth cutting line, and at this time, a worker is guided to perform angle fine adjustment; in other embodiments, it is also possible to provide a plurality of sets of emitters and receivers, one emitter and one receiver being arranged on each side of each cutting line 3, the emitters continuously emitting and being rebounded by the cutting lines 3 when the plane of the cutting lines 3 is perpendicular to the axis of the drive shaft 4, the alarm not giving an alarm, and the receivers receiving the light emitted by the emitters and giving an alarm when the cutting lines 3 are deflected.
In some embodiments of the present invention, as shown in fig. 1 and 2, the boule cutting system further includes a stirrer installed in the cutting fluid bath 1. Specifically, the stirrer in the embodiment is a peristaltic pump 6, and in a working state, the peristaltic pump 6 stirs the cutting fluid in the cutting fluid pool 1, so that the cutting fluid is uniformly mixed and is not layered, the best cutting effect is achieved, and the peristaltic pump 6 can reduce the possibility that the cutting fluid is contacted with external impurities; in other embodiments, the agitator may also use mechanical agitation.
In some embodiments of the present invention, the ingot cutting system further comprises a tension detector and a controller, wherein the tension detector is configured to detect the cutting tension of the cutting line 3 in real time; the controller is in signal connection with the tension detector and the first distance adjusting device, and when the tension detector detects that the cutting tension of the cutting line 3 is smaller than the set cutting tension, the controller controls the first distance adjusting device to increase the distance between the crystal bar 5 and the driving shaft 4 by the set distance, and specifically, the tension detector can measure the pressure of the driving shaft 4 through the cutting line 3. Although the cutting line 3 is cut into the ingot 5 along with the progress of the cutting operation, the line becomes looser and looser, and the tension is insufficient, the driving shaft 4 can move downwards according to a preset fixed tension value, so that the steel wire is in a tensioned state from beginning to end, and the fixed tension value can be kept constant, so that the optimal cutting effect is achieved.
In some embodiments of the present invention, as shown in fig. 2, the supporting frame 2 includes two opposite annular supporting members, each of which includes at least two fan-shaped hoop sheets; in addition, the crystal bar cutting system further comprises a second distance adjusting device (not shown) for adjusting the distance between the two supporting pieces. During preparation, the distance between the two supporting pieces is adjusted according to the length of the crystal bar 5 to be cut, and the crystal bar 5 is fixed by splicing the fan-shaped hoop pieces.
Specifically, the second distance adjusting device in this embodiment may be a cylinder, a hydraulic cylinder, or a structure in which a screw rod is engaged with a slider, etc. connected to at least one of the supporting members, and any structure that can adjust the distance between the two supporting members is within the scope of the present invention.
While the invention has been described with reference to specific preferred embodiments, it will be understood by those skilled in the art that various changes and modifications may be made without departing from the spirit and scope of the invention as defined in the following claims. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.
Claims (9)
1. A crystal bar cutting system, comprising:
a cutting fluid pool;
the support frame is arranged above the cutting liquid pool and used for fixing a crystal bar;
the driving shaft is erected in the cutting liquid pool, and the axis of the driving shaft is parallel to the axis of the crystal bar;
the cutting lines are of an annular structure and are provided with a plurality of cutting lines, and the cutting lines are wound on the driving shaft and the crystal bar and are arranged at intervals along the length direction of the driving shaft;
the first distance adjusting device adjusts the distance between the crystal bar and the driving shaft in real time along with the increase of the cutting depth of the crystal bar.
2. The system of claim 1, wherein the driving shaft has annular indents formed thereon in one-to-one correspondence with the cutting lines.
3. The system as claimed in claim 2, wherein the driving shaft is sleeved with a number of collars equal to the number of the dents, the dents are arranged on the collars one by one, and the distance between the collars can be adjusted.
4. The system of claim 1, further comprising:
the angle deviation alarm is used for monitoring the included angle between the plane where the cutting lines are located and the axis of the driving shaft in real time, and giving out early warning to the corresponding cutting lines to the periphery when the plane where the cutting lines are located and the axis of the driving shaft deviate from a vertical state.
5. The system of claim 1, further comprising:
a stirrer installed in the cutting fluid tank.
6. The boule cutting system of claim 5, wherein the agitator is a peristaltic pump.
7. The system of claim 1, further comprising:
the tension detector is used for detecting the cutting tension of the cutting line in real time;
and the controller is connected with the tension detector and the first distance adjusting device, and controls the first distance adjusting device to increase the distance between the crystal bar and the driving shaft by a set distance when the tension detector detects that the cutting tension of the cutting wire is smaller than the set cutting tension.
8. The system of claim 1, wherein the support frame comprises two annular supports disposed opposite to each other, each of the supports comprising at least two fan-shaped hoop sheets.
9. The system of claim 8, further comprising:
a second distance adjustment device for adjusting the spacing of the two support members.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211348299.0A CN115625809A (en) | 2022-10-31 | 2022-10-31 | Crystal bar cutting system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211348299.0A CN115625809A (en) | 2022-10-31 | 2022-10-31 | Crystal bar cutting system |
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| Publication Number | Publication Date |
|---|---|
| CN115625809A true CN115625809A (en) | 2023-01-20 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202211348299.0A Pending CN115625809A (en) | 2022-10-31 | 2022-10-31 | Crystal bar cutting system |
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| Country | Link |
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| CN (1) | CN115625809A (en) |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2010071873A2 (en) * | 2008-12-20 | 2010-06-24 | Cabot Microelectronics Corporation | Wiresaw cutting method |
| CN102544240A (en) * | 2012-03-09 | 2012-07-04 | 润峰电力有限公司 | Method and device for integrating slicing and flocking of crystalline silicon wafer |
| CN103437295A (en) * | 2013-08-20 | 2013-12-11 | 江苏恩纳斯重工机械有限公司 | Bridge erecting machine |
| WO2014000003A1 (en) * | 2012-06-28 | 2014-01-03 | Hatzer Markus | Cable saw |
| CN204773076U (en) * | 2015-06-17 | 2015-11-18 | 海润光伏科技股份有限公司 | Crystal bar cutting device |
| CN112060376A (en) * | 2019-06-11 | 2020-12-11 | 扬州晶樱光电科技有限公司 | Silicon chip wire cut electrical discharge machining convenient to adjust |
| CN112936627A (en) * | 2021-02-01 | 2021-06-11 | 西安奕斯伟硅片技术有限公司 | Method and device for multi-wire cutting of crystal bar |
| CN215150682U (en) * | 2020-12-25 | 2021-12-14 | 唐山晶玉科技股份有限公司 | Multi-wire saw of adjustable section thickness |
-
2022
- 2022-10-31 CN CN202211348299.0A patent/CN115625809A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2010071873A2 (en) * | 2008-12-20 | 2010-06-24 | Cabot Microelectronics Corporation | Wiresaw cutting method |
| CN102544240A (en) * | 2012-03-09 | 2012-07-04 | 润峰电力有限公司 | Method and device for integrating slicing and flocking of crystalline silicon wafer |
| WO2014000003A1 (en) * | 2012-06-28 | 2014-01-03 | Hatzer Markus | Cable saw |
| CN103437295A (en) * | 2013-08-20 | 2013-12-11 | 江苏恩纳斯重工机械有限公司 | Bridge erecting machine |
| CN204773076U (en) * | 2015-06-17 | 2015-11-18 | 海润光伏科技股份有限公司 | Crystal bar cutting device |
| CN112060376A (en) * | 2019-06-11 | 2020-12-11 | 扬州晶樱光电科技有限公司 | Silicon chip wire cut electrical discharge machining convenient to adjust |
| CN215150682U (en) * | 2020-12-25 | 2021-12-14 | 唐山晶玉科技股份有限公司 | Multi-wire saw of adjustable section thickness |
| CN112936627A (en) * | 2021-02-01 | 2021-06-11 | 西安奕斯伟硅片技术有限公司 | Method and device for multi-wire cutting of crystal bar |
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