CN115618787A - Virtual integrated circuit platform and control method and system thereof - Google Patents
Virtual integrated circuit platform and control method and system thereof Download PDFInfo
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Abstract
A virtual integrated circuit platform and a control method and a system thereof are provided. The method comprises the following steps: when chip manufacturing demand information and chip layout information sent by a demand side are received, generating a chip manufacturing order based on the chip manufacturing demand information and the chip layout information, and sending the chip manufacturing order to a corresponding manufacturing end; and when the manufacturing response information sent by the manufacturing end corresponding to the chip manufacturing order is received, the charging and distribution of the fee of the chip manufacturing order are completed. By adopting the scheme, the chip cost can be reduced.
Description
Technical Field
The invention relates to the technical field of integrated circuits, in particular to a virtual integrated circuit platform and a control method and system thereof.
Background
The integrated circuit needs to go through three links of design, manufacture and seal test to obtain a corresponding chip. Specifically, after the integrated circuit is successfully designed, the real tape-out manufacturing is started, and after the manufacturing is completed, the package testing is performed, and the chips passing the package testing can be delivered.
In practical applications, a large amount of cost including labor cost, time cost and the like is required in any link, and particularly, in an integrated circuit design link and an integrated circuit manufacturing link, the chip cost is high.
Disclosure of Invention
The invention aims to solve the problems that: how to reduce the chip cost.
In order to solve the above problem, an embodiment of the present invention provides a method for controlling a virtual integrated circuit platform, where the method includes:
when chip manufacturing demand information and chip layout information sent by a demand side are received, generating a chip manufacturing order based on the chip manufacturing demand information and the chip layout information, and sending the chip manufacturing order to a corresponding manufacturing end;
and when the manufacturing response information sent by the manufacturing end corresponding to the chip manufacturing order is received, the charge collection and distribution of the chip manufacturing order are completed.
Optionally, the manufacturing end is a manufacturing end that is registered in the virtual integrated circuit platform and meets the manufacturing capability requirement corresponding to the chip order.
Optionally, the chip manufacturing requirement information includes: product information of the chip and chip specification information.
Optionally, the method further comprises:
based on the chip manufacturing demand information and the chip layout information, executing the simulation tape-out operation;
performing yield analysis based on the result of the simulated tape-out operation;
and calculating to obtain the actual tape-out cost based on the yield analysis result so as to be used for collecting and distributing the fee of the chip order.
Optionally, the executing a simulation tape-out operation based on the chip manufacturing demand information and the chip layout information includes:
determining a process type corresponding to the chip manufacturing order based on the chip manufacturing demand information and the chip layout information;
based on the determined process type, creating corresponding process flow information;
configuring manufacturing information required by each process flow based on the created process flow information;
based on the manufacturing information required for each process flow, a simulated tape-out operation is performed.
Optionally, the method further comprises:
generating quotation information based on the actual tape-out cost obtained by calculation, and sending the generated quotation information to a demand side;
and when receiving the quotation agreement response information of the demand side, sending the chip manufacturing orders to the corresponding manufacturing ends together, wherein the chip manufacturing orders comprise the process flows corresponding to the simulation tape-out operation.
Optionally, the method further comprises: and optimizing the received chip layout information, and forming the chip design order based on the optimized chip layout information.
An embodiment of the present invention further provides a virtual integrated circuit platform, where the virtual integrated circuit platform includes: the system comprises a demand side management module, a platform operation module and a manufacturing side management module; wherein, demand side management module includes: a demand management unit; the manufacturing end management module comprising: a first order management unit; the platform operation module comprises: a second order management unit and a third cost management unit;
the demand management unit is suitable for receiving chip manufacturing demand information and chip layout information sent by a demand side;
the second order management unit is suitable for generating a chip manufacturing order based on the chip manufacturing demand information and the chip layout information when receiving the chip manufacturing demand information and the chip layout information sent by a demand side, and sending the chip manufacturing order to the first order management unit;
the first order management unit is suitable for sending the chip manufacturing order to a corresponding manufacturing end; receiving manufacturing response information sent by a manufacturing end corresponding to the chip manufacturing order;
and the third fee management unit is suitable for completing the fee collection and distribution of the chip manufacturing order when the second order management unit receives the manufacturing response information.
Optionally, the manufacturing end is a manufacturing end that is registered in the virtual integrated circuit platform and meets the manufacturing capability requirement corresponding to the chip order.
Optionally, the chip manufacturing requirement information includes: product information of the chip and chip specification information.
Optionally, the platform operation module further includes:
the simulation tape-out unit is suitable for executing simulation tape-out operation based on the layout information matched with the chip order;
the yield analysis unit is suitable for carrying out yield analysis based on the result of the simulation tape-out operation;
and the cost calculation unit is suitable for calculating the actual tape-out cost based on the yield analysis result so as to be used for collecting and distributing the fee of the chip order.
Optionally, the analog tape-out unit is adapted to determine a process type corresponding to the chip manufacturing order based on the chip manufacturing demand information and the chip layout information; creating corresponding process flow information based on the determined process type; configuring manufacturing information required by each process flow based on the created process flow information; and executing the simulation tape-out operation based on the manufacturing information required by each process flow.
Optionally, the third cost management unit is further adapted to generate quotation information based on the calculated actual tape-out cost, and send the generated quotation information to the demand side management module;
the demand management unit is also suitable for receiving the quotation agreement response information of the demand party;
the second order management unit is suitable for sending the chip manufacturing order to the manufacturing end management module when receiving the quotation agreement response information of the demand side, wherein the chip manufacturing order comprises the process flow corresponding to the simulation tape-out operation.
Optionally, the platform operation module further includes:
and the design optimization unit is suitable for optimizing the received chip layout information so as to form the chip manufacturing order based on the optimized chip layout information.
An embodiment of the present invention further provides a virtual integrated circuit system, where the system includes: the virtual integrated circuit platform of any of the above.
Optionally, the system further comprises: and the manufacturing end is used for receiving the chip manufacturing order sent by the virtual integrated circuit platform and sending manufacturing response information to the virtual integrated circuit platform after the chip is manufactured.
Compared with the prior art, the technical scheme of the embodiment of the invention has the following advantages:
by applying the scheme of the invention, the virtual integrated circuit platform can receive the chip manufacturing demand information and the chip layout information sent by a demand party, can generate a chip manufacturing order based on the information, sends the chip manufacturing order to the corresponding manufacturing end, and finishes the charge collection and distribution of the chip manufacturing order when receiving the manufacturing response information sent by the manufacturing end corresponding to the chip manufacturing order. That is to say, the scheme of the invention can manufacture tape-out for a demand side based on the chip manufacturing demand of the demand side and the provided chip layout, and further can save the manpower cost and the time cost required by the demand side in the process of searching a chip manufacturing factory, thereby reducing the chip cost.
Drawings
Fig. 1 is a flowchart of a control method for a virtual integrated circuit platform according to an embodiment of the present invention;
FIG. 2 is a flowchart of another control method for a virtual integrated circuit platform according to an embodiment of the present invention;
FIG. 3 is a flowchart of another control method for a virtual integrated circuit platform according to an embodiment of the present invention;
FIG. 4 is a block diagram of a virtual integrated circuit platform according to an embodiment of the present invention;
FIG. 5 is a functional diagram of modules of a virtual integrated circuit platform according to an embodiment of the present invention;
fig. 6 is a schematic diagram of information interaction among functional units of a virtual integrated circuit platform according to an embodiment of the present invention.
Detailed Description
With the continuous expansion of the global chip market, china, the first major market, is continuously increasing the productivity, and the number of domestic chip manufacturers is increasing, and most domestic chip manufacturers are performing chip manufacturing for large-scale chip-demanding enterprises.
In the prior art, for chips designed by some small and medium-sized enterprises and laboratories, the demand is very small, the process is unstable, and a chip substitute factory helps to manufacture the flow sheet rarely. Therefore, these small and medium sized enterprises and laboratories need to spend a lot of labor cost and time cost to find a suitable foundry for tape-out manufacturing, resulting in a high final cost of the chip.
Aiming at the problem, the invention provides a control method of a virtual integrated circuit platform, by adopting the scheme, a demand party can send chip manufacturing demand information and chip layout information to the virtual integrated circuit platform, the virtual integrated circuit platform can generate a chip manufacturing order based on the information and search a proper manufacturing end for the demand party to manufacture chips, and after the manufacture is finished, the charge collection and distribution are finished, so that the demand party does not need to search the manufacturing end by itself, the labor cost and the time cost required in the process of searching the chip manufacturing factory by the demand party can be further saved, and the chip cost is finally reduced.
In order to make the aforementioned objects, features and advantages of the present invention comprehensible, embodiments accompanied with figures are described in detail below.
Referring to fig. 1, an embodiment of the present invention provides a method for controlling a virtual integrated circuit platform, where the method may include the following steps:
and 11, when chip manufacturing demand information and chip layout information sent by a demand side are received, generating a chip manufacturing order based on the chip manufacturing demand information and the chip layout information, and sending the chip manufacturing order to a corresponding manufacturing end.
In a specific implementation, the chip manufacturing requirement information and the chip layout information may be received in various ways, which are not limited herein. For example, the virtual integrated circuit platform may provide a demander access interface, and a demander may input chip manufacturing requirement information and chip layout information on the demander access interface. In some embodiments, the demander may also input the chip manufacturing requirement information and the chip layout information in a remote wireless access manner.
In particular implementations, the chip manufacturing requirement information can indicate that the current requirement type is a chip manufacturing requirement and can contain information required by the chip manufacturing requirement.
In one embodiment, the chip manufacturing requirement information may include: product information of the chip and chip specification information. The product of the chip can be a memory, a charger, a CPU, a camera, a sensor and the like. The chip specification may be the operating temperature, operating voltage, area, power consumption, etc. of the chip. Based on the chip-related information, a process function (function) type corresponding to the chip can be determined, and based on the chip-corresponding process function type and the chip-related information, a process technology type corresponding to the chip can be determined. Wherein, the process function type can include: logic chips, power chips, radio frequency chips, mixed signal (Mix-signal) chips, micro-Electro-Mechanical systems (MEMS) chips, digital-analog chips, and the like. The process technology types may include: 55nm, 90nm and 40 nm.
In a specific implementation, the virtual integrated circuit platform may preset chip manufacturing order templates in various formats. The chip manufacturing order template may be categorized by process type (including process function type and process recipe technology type). After receiving the chip manufacturing requirement information and the chip layout information, extracting the corresponding information, and filling the corresponding information into the corresponding chip manufacturing order template to form a chip manufacturing order. When the chip manufacturing demand information and the chip layout information lack the content of the part of the information items of the chip manufacturing order template, the default information content can be used as the content of the part of the information items of the chip manufacturing order template.
In an implementation, a fab with manufacturing capability may provide basic information of the fab (including the number of employees, etc.), qualification information of the fab, capability information of the fab, etc. to the virtual ic platform, and complete registration on the virtual ic platform. The virtual integrated circuit platform can distinguish the manufacturing capability of different wafer factories.
In some embodiments, the virtual integrated circuit platform receives the chip layout information, and may further optimize the chip layout information, for example, adjust positions and connection relationships of some devices in the chip layout information. And generating a chip manufacturing order based on the optimized layout information.
And step 12, when the manufacturing response information sent by the manufacturing end corresponding to the chip manufacturing order is received, finishing the fee collection and distribution of the chip manufacturing order.
In an implementation, the manufacturing end starts manufacturing tape-out after receiving a chip manufacturing order, and sends manufacturing response information to the virtual integrated circuit platform after manufacturing. After receiving the manufacturing response message, the virtual integrated circuit platform may collect a fee from the requesting party according to the price quoted by the requesting party, and distribute the fee to the design end and the manufacturing end according to a predetermined fee distribution ratio among the design end, the virtual integrated circuit platform, and the manufacturing end.
In a specific implementation, after the chip order is completed and the fee is collected and distributed, the manufacturing end can directly deliver the chip to the demander.
In a specific implementation, after receiving the chip manufacturing order, the manufacturing end may directly manufacture the chip by using the manufacturing resources of the manufacturing plant, or may substitute the manufacturing resources of other manufacturing plants, which is not limited herein. For part of process types, the manufacturing end has the condition that no manufacturing license (license) exists, the virtual integrated circuit platform can authorize the related manufacturing license, and the manufacturing end pays the related authorization to the virtual integrated circuit platform.
Fig. 2 is another control method for a virtual integrated circuit platform according to an embodiment of the present invention, where the method includes the following steps:
and step 21, when chip manufacturing demand information and chip layout information sent by a demand party are received, executing simulation tape-out operation based on the tape manufacturing demand information and the chip layout information.
In specific implementation, before sending a chip manufacturing order to a corresponding manufacturing end, a tape-out simulation operation may be performed based on layout information matched with the chip order. And if the virtual integrated circuit platform optimizes the chip layout information sent by the demander, executing the simulation tape-out operation based on the optimized chip layout information, otherwise, executing the simulation tape-out operation based on the chip layout information sent by the demander.
The cost of the chip is calculated by simulating the tape-out, and compared with the actual tape-out, the economic loss of a virtual integrated circuit platform and a manufacturing end caused by too low yield in the actual tape-out process can be reduced. In some embodiments, the actual process flow may be adjusted based on the simulated tape-out results, improving the yield of actual tape-out.
In a specific implementation, when the virtual integrated circuit platform executes the simulated tape-out operation, the virtual integrated circuit platform may first determine a process type corresponding to the chip manufacturing order based on the chip manufacturing demand information and the chip layout information, then create corresponding process flow information based on the determined process type, configure manufacturing information required by each process flow based on the created process flow information, and finally execute the simulated tape-out operation based on the manufacturing information required by each process flow.
The process types include a process function type and a process recipe type. Based on the chip-related information, a corresponding process function type may be determined. Based on the chip-related information and the process function type, the process recipe technology type can be determined. Different process function types and process technology types have different process flows.
In determining the process type, corresponding process flow information may be created, such as performing a first process, then performing a second process, and so on. Based on the created process flow information, manufacturing information required by each process flow is configured, including equipment information, recipe information, carrier information, photomask information, and the like. And finally, performing the simulated tape-out operation according to the determined process flows and the manufacturing information required by the process flows.
And step 22, performing yield analysis based on the result of the simulation tape-out operation.
In specific implementation, after the tape flow is simulated, a simulation test can be performed on the result of the simulation tape flow, yield analysis is performed, and the yield of the simulation tape flow is calculated.
In some embodiments, after obtaining the yield analysis result, if the yield is low, the process flow may be improved based on the yield analysis result, and the tape-out may be re-simulated, such that the yield after re-simulating the tape-out is greater than the predetermined yield threshold.
And step 23, calculating to obtain the actual tape-out cost based on the yield analysis result, so as to be used for collecting and distributing the fee of the chip order.
In specific implementation, the big data is utilized to analyze data such as process flow, equipment and the like, and the simulated slide cost is calculated, so that the actual slide cost is estimated based on the simulated slide cost, and the actual slide cost is finally obtained.
And analyzing the data of the process flow, equipment and the like by utilizing the big data, and finally calculating the cost of the tape-out.
In specific implementation, the analog tape-out process flow with the yield greater than the preset yield threshold value can be added to the chip manufacturing order and sent to the corresponding manufacturing end, so that the manufacturing end can refer to the analog tape-out process flow in the chip manufacturing order to manufacture the chip, and the yield of the actual tape-out is ensured.
And 24, generating quotation information based on the calculated actual tape-out cost, and sending the generated quotation information to the demand side.
In a specific implementation, before the chip manufacturing order is sent to the manufacturing end, quotation information can be generated based on the actual calculated tape-out cost, and the generated quotation information is sent to the demand side. Namely, the expected quotation is provided for the demander, and after the demander agrees to the quotation, the actual flow is carried out to ensure the reliable transaction.
And 25, generating a chip manufacturing order based on the chip manufacturing demand information and the chip layout information, and sending the chip manufacturing order to a corresponding manufacturing end together when receiving quotation agreement response information of a demand side, wherein the chip manufacturing order comprises a process flow corresponding to the simulation tape-out operation.
In specific implementation, when receiving the quotation approval response information of the demand side, the chip manufacturing order is sent to the corresponding manufacturing end. The chip manufacturing order may include a process flow corresponding to the simulated tape-out operation.
In specific implementation, the analog tape-out process flow with the yield greater than the preset yield threshold value can be added to the chip manufacturing order and sent to the corresponding manufacturing end, so that the manufacturing end can refer to the analog tape-out process flow in the chip manufacturing order to manufacture the chip, and the yield of the actual tape-out is ensured.
In particular implementations, the generation time of the chip manufacturing order is not limited as long as it is generated at the sending end. For example, the chip manufacturing order may be generated immediately when the chip manufacturing demand information and the chip layout information sent by the demand side are received, or the chip manufacturing order may be generated after the quotation agreement response information of the demand side is received.
In a specific implementation, after the tape-out is completed, the manufacturing terminal with the encapsulation testing capability can perform encapsulation testing on the manufactured chip.
In an embodiment of the invention, for some manufacturing terminals without package testing capability, after the virtual integrated circuit platform generates the chip manufacturing order, the method may further include: and sending sealing and testing indication information to the manufacturing end corresponding to the chip manufacturing order, wherein the sealing and testing indication information is suitable for indicating the identification information of the sealing and testing end, so that the manufactured chip is transported to the indicated sealing and testing end for sealing and testing after the manufacturing of the chip is finished by the manufacturing end corresponding to the chip manufacturing order.
That is, for some manufacturing terminals without encapsulation capability, the manufactured chips can be transported to the indicated encapsulation terminals for encapsulation under the indication of the virtual integrated circuit platform.
In specific implementation, a seal terminal with seal capability can be registered on a virtual integrated circuit platform to obtain a corresponding seal terminal registration account. Each seal terminal registration account corresponds to one seal terminal. The seal terminal completing registration should provide basic information, qualification, seal case and the like of an enterprise or a team to the virtual integrated circuit platform, so that the virtual integrated circuit platform can evaluate the design capability of the seal terminal. The virtual integrated circuit platform can have a plurality of associated sealed terminals, and the sealed terminals are classified according to the sealed test capability of the sealed terminals.
In the specific implementation, the manufacturing side directly sends the manufactured chip to the encapsulation side, and may also send the manufactured chip to the encapsulation side through the virtual integrated circuit platform, which is not limited herein.
And step 26, when the manufacturing response information sent by the manufacturing end corresponding to the chip manufacturing order is received, completing the fee collection and distribution of the chip manufacturing order.
In an implementation, the manufacturing end starts to manufacture the tape-out after receiving the chip manufacturing order, and sends manufacturing response information to the virtual integrated circuit platform after the manufacturing is finished. After receiving the manufacturing response message, the virtual integrated circuit platform may collect a fee from the requesting party according to a price quoted by the requesting party, and distribute the fee to the design end and the manufacturing end according to a predetermined fee distribution ratio among the design end, the virtual integrated circuit platform, and the manufacturing end.
In a specific implementation, after the chip order is completed and the fee is collected and distributed, the manufacturing end can directly deliver the chip to the demander.
Fig. 3 is a flowchart of another virtual integrated circuit platform control method according to an embodiment of the present invention. Referring to fig. 3, the method may include the steps of:
step 301, a demand direction virtual integrated circuit platform puts forward chip manufacturing demands.
In specific implementation, a demand side puts forward chip manufacturing demands to a virtual integrated circuit platform by providing chip manufacturing demand information, and meanwhile, the demand side sends chip layout information to the virtual integrated circuit platform, wherein the chip layout information is a chip design scheme provided by the demand side.
In some embodiments, the virtual integrated circuit platform may perform chip optimization on the chip layout information provided by the demander first, and perform subsequent operations based on the optimized chip layout information.
Step 302, the virtual integrated circuit platform performs process function classification according to chip requirements.
Specifically, the virtual integrated circuit platform can classify the process functions according to chip manufacturing requirement information such as product information where the chip is located and chip specification information, and determine the function type of the chip.
Step 303, process technology classification is performed according to the process function type.
In the specific implementation, the process technology can be classified according to the process function type and the chip manufacturing requirement information, and the process node to which the chip to be produced belongs is determined.
And step 304, simulating the stream slice.
In an implementation, after the process recipe type is determined, the simulated tape-out operation may be performed according to the complexity of the process flow.
And 305, calculating the cost required by the whole flow sheet, calculating the profit according to the cost, and generating quotation information.
In specific implementation, yield analysis can be performed on the result of the simulation tape-out operation, and then the result of the yield analysis is calculated to obtain the actual tape-out cost. And calculating corresponding profits based on the actual tape-out cost, and generating quotation information according to the actual tape-out cost and the profits.
Step 306, offer is provided to the requesting party.
In a specific implementation, the quotation information can be sent to the demand side, and after the demand side agrees to quotation, the subsequent chip manufacturing is started, that is, after the demand side agrees to quotation, a chip manufacturing order is generated to the manufacturing end.
In some implementations, the chip requirement information provided by the demander may include expected quote information. The virtual integrated circuit platform may generate the offer information in combination with the desired offer information of the requesting party.
And 307, after the tape-out is finished, giving the process flow to a manufacturing end.
In specific implementation, after the demander agrees to quote, the virtual integrated circuit platform may generate a chip manufacturing order and send the chip manufacturing order to the manufacturing end, where the chip manufacturing order includes a process flow, thereby shortening the chip manufacturing period.
In step 308, a cost is allocated to the manufacturing site.
In the specific implementation, after the chip is manufactured, the manufacturing end can directly deliver the chip to a demand side and then perform cost distribution with the virtual integrated circuit platform.
In this embodiment, the manufacturing end has a sealing and testing capability, and can deliver the manufactured chip to a demander after sealing and testing the manufactured chip.
By adopting the scheme, a demander can realize chip manufacturing through the virtual integrated circuit platform only by proposing chip manufacturing requirements to obtain a final chip, so that the virtual integrated circuit platform is convenient to use, can effectively save labor cost and time cost required by the demander to find a manufacturing end by himself, and reduces the cost of the chip as much as possible.
In order to make the present invention more understood and realized by those skilled in the art, the following detailed description is provided for the virtual integrated circuit platform and the virtual integrated circuit system corresponding to the above method.
Referring to fig. 4, an embodiment of the present invention provides a virtual integrated circuit platform 40, where the virtual integrated circuit platform 40 may include: a demand side management module 41, a platform operation module 42, and a manufacturing side management module 43.
Wherein, the demander management module 41 includes: a demand management unit 411. The manufacturing-side management module 43 includes: the first order management unit 431. The platform operation module 42 includes: a second order management unit 421 and a third fee management unit 422.
The demand management unit 411 is adapted to receive chip manufacturing demand information and chip layout information sent by a demand party;
the second order management unit 421 is adapted to generate a chip manufacturing order based on the chip manufacturing demand information and the chip layout information when receiving the chip manufacturing demand information and the chip layout information sent by the demander, and send the chip manufacturing order to the first order management unit 431;
the first order management unit 431 is adapted to send the chip manufacturing order to a corresponding manufacturing end; receiving manufacturing response information sent by a manufacturing end corresponding to the chip manufacturing order;
the third fee management unit 422 is adapted to complete the fee collection and distribution of the chip manufacturing order when the second order management unit 421 receives the manufacturing response information.
In an implementation, the manufacturing end is a manufacturing end that is registered in the virtual integrated circuit platform and meets a manufacturing capability requirement corresponding to the chip order.
In a specific implementation, the chip manufacturing requirement information includes: product information of the chip and chip specification information.
In an embodiment of the present invention, the platform operating module 42 may include: an analog tape out unit 423, a yield analysis unit 424, and a cost calculation unit 425. Wherein:
the flow simulation unit 423 is suitable for executing flow simulation operation based on layout information matched with the chip order;
the yield analysis unit 424 is adapted to perform yield analysis based on the result of the simulated tape-out operation;
the cost calculating unit 425 is adapted to calculate an actual tape-out cost based on the yield analysis result, so as to be used for the fee collection and distribution of the chip order.
In an embodiment of the present invention, the analog tape-out unit 423 is adapted to determine a process type corresponding to the chip manufacturing order based on the chip manufacturing demand information and the chip layout information; creating corresponding process flow information based on the determined process type; configuring manufacturing information required by each process flow based on the created process flow information; and executing the simulation tape-out operation based on the manufacturing information required by each process flow.
In an embodiment of the present invention, the third cost management unit 422 is further adapted to generate price quote information based on the calculated actual cost of the tape-out, and send the generated price quote information to the demand side management module.
The demand management unit 411 is further adapted to receive an offer agreement response message of the demand party;
the second order management unit 421 is adapted to send the chip manufacturing order to the manufacturing end management module when receiving a quotation agreement response message of the demand party, where the chip manufacturing order includes a process flow corresponding to the analog tape-out operation.
In an embodiment of the present invention, the platform operating module 42 may further include: the optimization unit 426 is designed. The design optimization unit 426 is adapted to optimize the received chip layout information to form the chip manufacturing order based on the optimized chip layout information.
Fig. 5 is a functional diagram of modules of the virtual integrated circuit platform. The functions of the modules of the virtual integrated circuit platform are described as follows:
referring to fig. 5, the demander side management module is mainly responsible for interaction with the demander, which may mainly include:
a. a first information management unit including management demander registration information;
b. a demand management unit;
specifically, the demand management function includes: the method comprises the steps of receiving chip manufacturing demand information and chip layout information sent by a demand side, generating a chip manufacturing order based on the information, receiving quotation agreement response information of the demand side and the like.
c. A first fee management unit;
specifically, the wallet function includes: a payment function and a collection function. The payment function can be providing a payment two-dimensional code for the demand party. After receiving the payment amount of the demand party, the payment function may transfer the received payment amount to the platform operation module.
The manufacturing end management module is mainly responsible for interaction with the manufacturing end and mainly comprises:
a. the second information management unit comprises registration information for managing the manufacturing end, wherein the registration information of the manufacturing end can comprise basic information of a manufacturing factory, manufacturing resources, manufacturing capability information and the like; the manufacturing capacity of the manufacturing end is divided according to the registration information of the manufacturing end, so that a proper manufacturing end flow sheet can be selected for manufacturing when a chip manufacturing order is received;
b. a first order management unit for receiving a chip manufacturing order;
c. a second fee management unit comprising: a payment function and a collection function; the payment function may be to receive a chip design amount allocated by the platform operation module, and the payment function may be to pay the chip design amount to the design end.
The platform operation module is mainly responsible for the operation of the virtual integrated circuit platform, and mainly comprises:
a. the second order management unit is used for receiving a chip manufacturing order, sending the chip manufacturing order to a manufacturing end management module, and sending the chip manufacturing order containing a process flow corresponding to the simulation tape-out operation to the manufacturing end management module when receiving quotation approval response information of the demand side;
b. and designing an optimization unit.
In some embodiments, the design optimization unit may optimize the chip layout information after the second order management unit receives the chip layout information, and then send the optimized chip layout information to the second order management unit, so that the second order management unit generates the chip manufacturing order based on the optimized chip layout information.
c. The analog stream slice unit is mainly used for:
c1, classifying process functions based on chip manufacturing demand information in a chip manufacturing order and the chip layout information;
c2, establishing process flow information and manufacturing information required by each process flow;
c3, simulating a flow sheet;
d. a yield analysis unit, comprising: simulating a test after the flow sheet simulation, and calculating the yield;
e. a cost calculation unit comprising: analyzing the process flow of the simulated tape-out, the used equipment and the like, and calculating the tape-out cost and the like;
f. the third expense management unit comprises a payment function and a collection function; the payment function can be to receive the payment amount of the demander forwarded by the demander management module, and the payment function is to pay the payment amount of the demander to the manufacturing end through the manufacturing end management module.
FIG. 6 is a schematic diagram of information interaction among functional units of the virtual integrated circuit platform. Referring to fig. 6, after the first information management unit 611 of the demand management module 61 completes registration, the demand manager a puts the chip manufacturing demand on the virtual integrated circuit platform, and the demand management module 61 may send the chip manufacturing demand information and the chip layout information to the second order management unit 621.
The second order management unit 621 may send the chip layout information to the design optimization unit 622, and after the design optimization unit 622 optimizes the chip layout information, the second order management unit 621 generates a chip manufacturing order based on the optimized layout information.
The second order management unit 621 sends the chip manufacturing order to the analog tape-out unit 623, and the analog tape-out unit 623 executes the analog tape-out operation based on the chip manufacturing demand information and the chip layout information of the chip manufacturing order. After the tape-out is simulated, the yield analysis unit 624 performs testing and yield analysis on the tape-out result, and the cost calculation unit 625 calculates the tape-out cost by using data analysis.
After calculating the tape-out cost, the second order management unit 621 issues a chip manufacturing order to the manufacturing end management module 63, the third order management unit 631 of the manufacturing end management module 63 receives the chip manufacturing order, and the third information management unit 632 of the manufacturing end management module 64 selects an appropriate manufacturing end for chip manufacturing, for example, the manufacturing factory B can be selected for chip manufacturing. After the manufacturing factory B completes the chip manufacturing, the product is delivered to the customer a.
Then, the first fee management unit 613 of the demand side management module 61 collects a fee and forwards the fee to the third fee management unit 626 of the platform operation module 62. The third fee management unit 626 interacts with the second fee management unit 633 of the manufacturing-side management module 63, respectively, to complete the fee allocation.
In some implementations, when the manufacturing end does not have a manufacturing license for a partial process, the platform operation module 62 may authorize the manufacturing end with the relevant manufacturing license, and the second fee management unit 633 of the manufacturing end management module 63 pays a certain authorization fee to the third fee management unit 626.
In some embodiments, the virtual integrated circuit platform may further comprise: and the sealing and measuring end management module is mainly responsible for interaction with the sealing and measuring end. Specifically, the end-to-end management module may send end-to-end indication information to the manufacturing end management module after the chip manufacturing order is generated, where the end-to-end indication information is suitable for indicating identification information of an end to be tested.
Correspondingly, the manufacturing end management module is further adapted to send the sealing and testing indication information to the manufacturing end corresponding to the chip manufacturing order, so that the manufactured chip is transported to the indicated sealing and testing end for sealing and testing after the manufacturing of the chip is completed by the manufacturing end corresponding to the chip combination manufacturing order.
An embodiment of the present invention further provides a virtual integrated circuit system, where the virtual integrated circuit system may include: the virtual integrated circuit platform of any of the above embodiments.
In an embodiment of the present invention, the virtual integrated circuit system may further include: and the manufacturing end is used for receiving the chip manufacturing order sent by the virtual integrated circuit platform and sending manufacturing response information to the virtual integrated circuit platform after the chip is manufactured.
In an embodiment of the present invention, the virtual integrated circuit system may further include: and the sealing and testing end is used for sealing and testing the chip manufactured by the manufacturing end.
The scheme of the invention can provide the manufacture of various processes, such as 55nm, 90nm and the like, for a demand party through the virtual integrated circuit platform, so that the tape-out manufacture can be realized for various chip designs. In addition, the invention has wide object and integrates manufacturing resources, so that the specific requirements of numerous small and medium-sized enterprises or laboratories can be met. After the demand side puts forward the demand, the subsequent process can be started according to the demand without waiting for the fixed unified streaming time.
Each module/unit included in each apparatus and product described in the above embodiments may be a software module/unit, or may also be a hardware module/unit, or may also be a part of a software module/unit and a part of a hardware module/unit. For example, for each device or product applied to or integrated into a chip, each module/unit included in the device or product may be implemented by hardware such as a circuit, or at least a part of the module/unit may be implemented by a software program running on a processor integrated within the chip, and the rest (if any) part of the module/unit may be implemented by hardware such as a circuit; for each device or product applied to or integrated with the chip module, each module/unit included in the device or product may be implemented by using hardware such as a circuit, and different modules/units may be located in the same component (e.g., a chip, a circuit module, etc.) or different components of the chip module, or at least some of the modules/units may be implemented by using a software program running on a processor integrated within the chip module, and the rest (if any) of the modules/units may be implemented by using hardware such as a circuit; for each device and product applied to or integrated in the terminal, each module/unit included in the device and product may be implemented by using hardware such as a circuit, and different modules/units may be located in the same component (e.g., a chip, a circuit module, etc.) or different components in the terminal, or at least part of the modules/units may be implemented by using a software program running on a processor integrated in the terminal, and the rest (if any) part of the modules/units may be implemented by using hardware such as a circuit.
Although the present invention is disclosed above, the present invention is not limited thereto. Various changes and modifications may be effected therein by one skilled in the art without departing from the spirit and scope of the invention as defined in the appended claims.
Claims (16)
1. A method for controlling a virtual integrated circuit platform, comprising:
when chip manufacturing demand information and chip layout information sent by a demand side are received, generating a chip manufacturing order based on the chip manufacturing demand information and the chip layout information, and sending the chip manufacturing order to a corresponding manufacturing end;
and when the manufacturing response information sent by the manufacturing end corresponding to the chip manufacturing order is received, the charging and distribution of the fee of the chip manufacturing order are completed.
2. The method of claim 1, wherein the manufacturing site is a manufacturing site that is registered in the virtual integrated circuit platform and that satisfies the manufacturing capability requirement corresponding to the chip order.
3. The control method of claim 1, wherein the chip manufacturing requirement information includes: product information of the chip and chip specification information.
4. The control method according to claim 1, further comprising:
executing the simulation tape-out operation based on the chip manufacturing demand information and the chip layout information;
performing yield analysis based on the result of the simulated tape-out operation;
and calculating to obtain the actual tape-out cost based on the yield analysis result so as to be used for collecting and distributing the fee of the chip order.
5. The control method according to claim 4, wherein said performing an analog tape-out operation based on said chip manufacturing requirement information and said chip layout information comprises:
determining a process type corresponding to the chip manufacturing order based on the chip manufacturing demand information and the chip layout information;
creating corresponding process flow information based on the determined process type;
configuring manufacturing information required by each process flow based on the created process flow information;
based on the manufacturing information required for each process flow, a simulated tape-out operation is performed.
6. The control method according to claim 4, further comprising:
generating quotation information based on the actual tape-out cost obtained by calculation, and sending the generated quotation information to a demand side;
and when receiving a quotation agreement response message of a demand side, sending the chip manufacturing orders to corresponding manufacturing ends together, wherein the chip manufacturing orders comprise the process flow corresponding to the simulation tape-out operation.
7. The control method according to claim 1, characterized by further comprising: and optimizing the received chip layout information, and forming the chip design order based on the optimized chip layout information.
8. A virtual integrated circuit platform, the virtual integrated circuit platform comprising: the system comprises a demand side management module, a platform operation module and a manufacturing side management module; wherein, demand side management module includes: a demand management unit; the manufacturing-side management module includes: a first order management unit; the platform operation module includes: a second order management unit and a third cost management unit;
the demand management unit is suitable for receiving chip manufacturing demand information and chip layout information sent by a demand party;
the second order management unit is suitable for generating a chip manufacturing order based on the chip manufacturing demand information and the chip layout information when receiving the chip manufacturing demand information and the chip layout information sent by a demand side, and sending the chip manufacturing order to the first order management unit;
the first order management unit is suitable for sending the chip manufacturing order to a corresponding manufacturing end; receiving manufacturing response information sent by a manufacturing end corresponding to the chip manufacturing order;
and the third fee management unit is suitable for completing the fee collection and distribution of the chip manufacturing order when the second order management unit receives the manufacturing response information.
9. The virtual integrated circuit platform of claim 8, wherein the manufacturing site is a manufacturing site that is registered in the virtual integrated circuit platform and that satisfies the manufacturing capability requirements corresponding to the chip order.
10. The virtual integrated circuit platform of claim 8, wherein the chip manufacturing requirement information comprises: product information of the chip and chip specification information.
11. The virtual integrated circuit platform of claim 8, wherein the platform operations module further comprises:
the simulation tape-out unit is suitable for executing simulation tape-out operation based on the layout information matched with the chip order;
the yield analysis unit is suitable for carrying out yield analysis based on the result of the simulation tape-out operation;
and the cost calculation unit is suitable for calculating the actual tape-out cost based on the yield analysis result so as to be used for collecting and distributing the fee of the chip order.
12. The virtual integrated circuit platform of claim 11, wherein the analog tape-out unit is adapted to determine a process type corresponding to the chip manufacturing order based on the chip manufacturing demand information and the chip layout information; creating corresponding process flow information based on the determined process type; configuring manufacturing information required by each process flow based on the created process flow information; and executing the simulation tape-out operation based on the manufacturing information required by each process flow.
13. The virtual integrated circuit platform of claim 8, wherein the third cost management unit is further adapted to generate quotation information based on the calculated actual tape-out cost, and send the generated quotation information to the demand side management module;
the demand management unit is also suitable for receiving the quotation agreement response information of the demand party;
the second order management unit is suitable for sending the chip manufacturing order to the manufacturing end management module when receiving the quotation agreement response information of the demand side, wherein the chip manufacturing order comprises a process flow corresponding to the simulation tape-out operation.
14. The virtual integrated circuit platform of claim 11, wherein the platform operations module further comprises:
and the design optimization unit is suitable for optimizing the received chip layout information so as to form the chip manufacturing order based on the optimized chip layout information.
15. A virtual integrated circuit system, comprising: the virtual integrated circuit platform of any of claims 8 to 14.
16. The virtual integrated circuit system of claim 15, further comprising: and the manufacturing end is used for receiving the chip manufacturing order sent by the virtual integrated circuit platform and sending manufacturing response information to the virtual integrated circuit platform after the chip is manufactured.
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